A MiniLED repair device

Abstract

This invention discloses a MiniLED rework equipment, relating to the field of MiniLED chip rework technology. It includes a chip tray, a chip position and angle adjustment component, a rework platform, and rework components. The chip tray has at least one chip placement slot. The chip position and angle adjustment component is located on one side of the chip tray and includes a chip stage for transferring chips and a three-axis chip adjustment component for adjusting the R, X, and Y axis positions of the chip stage. This invention eliminates the need for manual operation, significantly improving rework efficiency. Because it is performed before the die bonding process, the rework process is simpler when the product has not yet passed through the reflow oven than after it has. The rework yield is also higher, greatly improving the overall production yield and single-stage yield. It is applicable to both direct-view and backlighting of MiniLEDs and can be widely used in the MiniLED industry.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of MiniLED lamp bead chip and MiniIC repair, in particular to a MiniLED repair equipment. BACKGROUND

[0002] In the MiniLED lamp bead production industry, various factors such as complex process affect the yield of products in the production process, and the complex process program determines that the low yield repair is difficult. Controlling in multiple link manufacturing processes helps to improve the final yield. The yield is controlled in the front end, and the repair difficulty of the rear end process is greatly reduced. Therefore, a yield detection is carried out after tin brushing and die bonding, and the defective points are repaired at this time. The product has not been through the reflow oven, the solder paste has not been melted, and the product and the chip have not been combined. At this time, the repair of the defective point is relatively simple and fast.

[0003] However, there is a lack of automatic equipment for repairing MiniLED lamp bead products before passing through the reflow oven on the market. Generally, manual repair or repair after die bonding is adopted. The manual repair method is labor-intensive and low in efficiency. After passing through the reflow oven, the repair is difficult due to the solidification of the solder paste, and the product is prone to scrap, with a high defective rate. The above two repair methods cannot meet the needs of the manufacturing industry. SUMMARY

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a MiniLED repair equipment, comprising a chip tray, a chip position angle adjusting assembly, a repair platform and a repair assembly, the inside of the chip tray is provided with not less than one chip placing groove;

[0005] The chip position angle adjusting assembly is located on one side of the chip tray, and the chip position angle adjusting assembly comprises a chip stage for transferring the chip and a chip three-axis adjusting assembly for adjusting the R, X and Y axis positions of the chip stage;

[0006] The repair platform is used for carrying the product to be repaired, and the repair platform comprises a platform conveying line located on one side of the chip stage and a platform double-axis adjusting assembly for driving the platform conveying line to adjust the X and Y axis positions;

[0007] The repair assembly comprises a linear module, a point tin support and a product alignment linear module, the point tin support is provided with a point tin head for supplementing tin on the product, the product alignment linear module is provided with a product defective point alignment camera for identifying the defective point position on the product, and the linear module is provided with a chip alignment camera, a chip position angle alignment camera, a chip transfer suction nozzle for transferring the chip and a product cleaning suction nozzle for cleaning the defective point of the product, which correspond to the chip tray and the chip stage respectively.

[0008] As a preferred embodiment of the present invention, the chip tray is rotatably mounted on a base plate, and a tray rotation motor is provided on one side of the base plate and is connected to the chip tray via a belt. A tray X-axis adjustment platform is provided at the bottom of the base plate, and a tray Y-axis adjustment platform is provided at the bottom of the tray X-axis adjustment platform.

[0009] As a preferred embodiment of the present invention, the chip three-axis adjustment assembly includes a chip R-axis direct drive turntable for mounting a chip stage, a chip X-axis linear module disposed at the bottom of the chip R-axis direct drive turntable, and a chip Y-axis linear module disposed at the bottom of the chip X-axis linear module.

[0010] As a preferred embodiment of the present invention, the platform dual-axis adjustment assembly includes a platform X-axis linear module disposed at the bottom of the platform conveyor line and a platform Y-axis linear module disposed at the bottom of the platform X-axis linear module.

[0011] As a preferred embodiment of the present invention, product lifting cylinders are provided on both sides of the inner wall of the platform conveyor line, and product positioning pressure plates are provided on both sides of the top of the platform conveyor line. The platform conveyor line carries products to be reworked, and a product coarse positioning cylinder is provided on one side of the platform conveyor line.

[0012] As a preferred embodiment of the present invention, the number of linear modules is at least two, the soldering bracket is located between the two linear modules, and the soldering bracket is provided with a soldering linear module for driving the soldering head to adjust the Y-axis position and a soldering lifting module for driving the soldering linear module to adjust the Z-axis position.

[0013] As a preferred embodiment of the present invention, the product alignment linear module is jointly disposed on two linear modules, and the product alignment linear module is provided with a product alignment lifting module for installing a product defect point alignment camera.

[0014] As a preferred embodiment of the present invention, the product cleaning nozzle is mounted on a nozzle lifting linear motor, the nozzle lifting linear motor is mounted on one of the linear modules, and the chip alignment camera, the chip position angle alignment camera, and the chip transfer nozzle are all mounted on another linear module.

[0015] As a preferred embodiment of the present invention, it also includes product loading and unloading conveyor lines located on both sides of the rework platform.

[0016] As a preferred embodiment of the present invention, it also includes a marble base for mounting the product loading and unloading conveyor line, chip tray, chip position and angle adjustment component, rework platform, and rework component.

[0017] Compared with the prior art, the present invention provides a MiniLED repair device, which has the following beneficial effects:

[0018] This MiniLED rework equipment, equipped with a chip tray, chip position and angle adjustment components, a rework platform, rework components, and a product loading and unloading conveyor line, can perform defective part rework before die bonding. This eliminates the need for manual operation, significantly improving rework efficiency. Because it's done before die bonding, the rework process is simpler when the product hasn't passed through the reflow oven compared to after it has. This results in a higher rework yield, substantially improving both the overall production yield and the yield per stage. It is suitable for both direct-view and backlighting MiniLEDs and can be widely used in the MiniLED industry. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a MiniLED repair device proposed in this invention;

[0020] Figure 2 for Figure 1 Enlarged view of the structure at point A in the middle;

[0021] Figure 3 for Figure 1 Enlarged view of the structure at point B;

[0022] Figure 4 This is a side view of the structure of a MiniLED repair device proposed in this invention;

[0023] Figure 5 for Figure 4 Enlarged view of the structure at point A in the middle;

[0024] Figure 6 This is a rear view of the structure of a MiniLED repair device proposed in this invention;

[0025] Figure 7 for Figure 6 Enlarged view of the structure at point A in the middle;

[0026] Figure 8 for Figure 6 Enlarged view of the structure at point B in the middle.

[0027] In the diagram: 1. Chip tray; 11. Chip placement slot; 12. Base plate; 13. Tray rotary motor; 14. Tray X-axis adjustment stage; 15. Tray Y-axis adjustment stage; 2. Chip position and angle adjustment assembly; 21. Chip stage; 22. Chip R-axis direct drive turntable; 23. Chip X-axis linear module; 24. Chip Y-axis linear module; 3. Rework platform; 31. Platform conveyor line; 32. Platform X-axis linear module; 33. Platform Y-axis linear module; 34. Product positioning pressure plate; 4. 41. Reworked components; 42. Linear module; 43. Soldering bracket; 44. Soldering tip; 45. Soldering linear module; 46. Soldering lifting module; 47. Product alignment linear module; 48. Product alignment lifting module; 49. Product defect point alignment camera; 40. Chip alignment camera; 41. Chip position and angle alignment camera; 42. Chip transfer nozzle; 43. Product cleaning nozzle; 44. Nozzle lifting linear motor; 5. Product loading and unloading conveyor line; 6. Marble base. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Please see Figures 1-8 A MiniLED rework device includes a chip tray 1, a chip position and angle adjustment component 2, a rework platform 3, and a rework component 4. The chip tray 1 has at least one chip placement slot 11 inside.

[0030] The chip position angle adjustment component 2 is located on one side of the chip tray 1. The chip position angle adjustment component 2 includes a chip stage 21 for transferring chips and a chip three-axis adjustment component for adjusting the R, X, and Y axis positions of the chip stage 21.

[0031] The rework platform 3 is used to carry the product to be repaired. The rework platform 3 includes a platform conveyor line 31 located on one side of the chip stage 21 and a platform dual-axis adjustment component for driving the platform conveyor line 31 to adjust the X and Y axis positions.

[0032] The rework assembly 4 includes a linear module 41, a soldering bracket 42, and a product alignment linear module 43. The soldering bracket 42 is equipped with a soldering tip 421 for resoldering the product. The product alignment linear module 43 is equipped with a product defect alignment camera 432 for identifying the location of defects on the product. The linear module 41 is equipped with a chip alignment camera 44, a chip position angle alignment camera 45, a chip transfer nozzle 46 for adsorbing and transferring chips, and a product cleaning nozzle 47 for cleaning product defects, all corresponding to the chip tray 1 and the chip stage 21, respectively. This product allows for multiple reworks of the same location without affecting the rework effect and yield. Moreover, under simple processes, the rework yield is significantly higher than that of the reworked finished product after soldering. The yield rate is about 40% higher, and the reworked products are unaffected, with no difference in brightness or appearance. It has a significant improvement effect on both direct display and backlighting in the MiniLED industry. By setting up a chip tray 1, chip position and angle adjustment component 2, rework platform 3, rework component 4, and product loading and unloading conveyor line 5, this product can rework defects before die bonding without manual operation, greatly improving rework efficiency. Since it is done before the die bonding process, the rework process is simpler when the product has not gone through the reflow oven than when it has. The rework yield is higher, significantly improving the overall yield and single-stage yield of product production. It is applicable to both direct display and backlighting of MiniLED and can be widely used in the MiniLED industry.

[0033] As a specific technical solution in this embodiment, the chip tray 1 is rotatably mounted on the base plate 12. A tray rotation motor 13 is provided on one side of the base plate 12 and is connected to the chip tray 1 via a belt. A tray X-axis adjustment platform 14 is provided at the bottom of the base plate 12, and a tray Y-axis adjustment platform 15 is provided at the bottom of the tray X-axis adjustment platform 14. The chip placement slots 11 are used to place different types of MiniLED lamp bead chips. The tray rotation motor 13 is started to drive the chip tray 1 to rotate, so that the different chip placement slots 11 are oriented toward the chip alignment camera 44. The tray X-axis adjustment platform 14 and the tray Y-axis adjustment platform 15 can be manually adjusted, locked, or driven by a linear module. Since the size of the chip placement slots 11 is fixed, it is generally only necessary to switch them through the tray rotation motor 13. The tray X-axis adjustment and the tray Y-axis adjustment platform 15 are only needed to be adjusted during initial debugging. Both adjustment methods can be selected according to the usage requirements.

[0034] As a specific technical solution in this embodiment, the chip three-axis adjustment assembly includes a chip R-axis direct drive turntable 22 for mounting the chip stage 21, a chip X-axis linear module 23 disposed at the bottom of the chip R-axis direct drive turntable 22, and a chip Y-axis linear module 24 disposed at the bottom of the chip X-axis linear module 23. The chip transfer nozzle 46 removes the chip from the chip placement slot 11 and places it on the chip stage 21. With the help of the chip position and angle alignment camera 45, the chip R-axis direct drive turntable 22, the chip X-axis linear module 23, and the chip Y-axis linear module 24 are activated to adjust the chip angle to a suitable angle for mounting on the product. The linear module 41 has a linear module installed inside. The linear module 41 drives the chip transfer nozzle 46 to pick up the chip after the position and angle are adjusted and install it on the product coated with solder paste.

[0035] As a specific technical solution in this embodiment, the platform dual-axis adjustment assembly includes a platform X-axis linear module 32 disposed at the bottom of the platform conveyor line 31 and a platform Y-axis linear module 33 disposed at the bottom of the platform X-axis linear module 32. The platform X-axis linear module 32 and the platform Y-axis linear module 33 are activated to adjust the platform conveyor line 31 so that the platform conveyor line 31 can receive products for repair from the product loading and unloading conveyor line 5, or transport the repaired products to the product loading and unloading conveyor line 5.

[0036] As a specific technical solution in this embodiment, product lifting cylinders are provided on both sides of the inner wall of the platform conveyor line 31, and product positioning pressure plates 34 are provided on both sides of the top of the platform conveyor line 31. The platform conveyor line 31 carries the products to be repaired. The product lifting cylinders are activated to drive the products to contact the product positioning pressure plates 34, thereby achieving product positioning. A product coarse positioning cylinder 35 is provided on one side of the platform conveyor line 31. After the product moves onto the platform conveyor line 31, it first reaches the product coarse positioning cylinder 35, and then the product is lifted up to achieve coarse positioning. Fine positioning relies on visual positioning of the product's mark.

[0037] As a specific technical solution in this embodiment, the number of linear modules 41 is at least two, and the soldering bracket 42 is located between the two linear modules 41. The soldering bracket 42 is internally provided with a soldering linear module 422 for driving the soldering head 421 to adjust the Y-axis position and a soldering lifting module 423 for driving the soldering linear module 422 to adjust the Z-axis position. The soldering bracket 42 is located between the two linear modules 41, so that the rework position of the rework platform 3 is located between the two linear modules 41, the structural layout is more reasonable, and the loading and unloading are more convenient and faster. After the product defect is cleaned by the product cleaning nozzle 47, the soldering linear module 422 is activated to move the soldering head 421 above the product defect position, and the soldering lifting module 423 is activated to drive the soldering head 421 down to apply solder paste to the product defect position, so that the subsequent placement work can be carried out.

[0038] As a specific technical solution in this embodiment, the product alignment linear module 43 is jointly disposed on two linear modules 41. The product alignment linear module 43 is provided with a product alignment lifting module 431 for mounting a product defect point alignment camera 432. When the product alignment linear module 43 is started, the product alignment lifting module 431 moves in the X-axis direction. The alignment lifting module drives the product defect point alignment camera 432 to find and mark defect points on the product. After the mark alignment is completed, the defect point cleaning work can be performed.

[0039] As a specific technical solution in this embodiment, the product cleaning nozzle 47 is mounted on the nozzle lifting linear motor 471, which is mounted on one of the linear modules 41. The chip alignment camera 44, the chip position angle alignment camera 45, and the chip transfer nozzle 46 are all mounted on another linear module 41. The linear module 41 is started to drive the nozzle lifting linear motor 471 to move in the X-axis direction. At the same time, the nozzle lifting linear motor 471 is started to move the product cleaning nozzle 47 to above the defective point of the product. The product cleaning nozzle 47 is connected to a high-pressure air source in advance, and the defective point can be cleaned by controlling the air source valve to open.

[0040] As a specific technical solution of this embodiment, it also includes product loading and unloading conveyor lines 5 located on both sides of the rework platform 3. The two product loading and unloading conveyor lines 5 can be interchanged, with one used for product loading and the other used for product unloading.

[0041] As a specific technical solution of this embodiment, it also includes a marble base 6 for installing the product loading and unloading conveyor line 5, chip tray 1, chip position angle adjustment component 2, rework platform 3, and rework component 4. The rework component 4 and the rework platform 3 are arranged in a T-shape, and the rework component 4, the rework platform 3, and the product loading and unloading conveyor line 5 are arranged in an I-shape. The product cleaning structure and the chip loading and alignment structure are installed on both sides of the I-shape, respectively. The structure is concise and simple, the layout is reasonable, the operation is simple and quick, it is economical, and has broad application prospects. The marble base 6 has no thermal expansion and contraction characteristics, has high stability in use, and meets the needs of the manufacturing industry.

[0042] In summary, this MiniLED rework equipment, by setting up a chip tray 1, a chip position and angle adjustment component 2, a rework platform 3, a rework component 4, and a product loading and unloading conveyor line 5, can perform defective point rework before die bonding, eliminating the need for manual operation by staff and greatly improving rework efficiency. Because it is performed before the die bonding process, the rework process is simpler when the product has not yet entered the reflow oven than when it has. The rework yield is also higher, significantly improving the overall yield and single-stage yield of product production. It is applicable to both direct display and backlighting of MiniLEDs and can be widely used in the MiniLED industry.

[0043] It should be noted that, in this document, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0044] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A Mini LED repair equipment, comprising a chip tray (1), a chip position angle adjusting assembly (2), a repair platform (3) and a repair assembly (4), characterized in that: The inside of the chip tray (1) is provided with not less than one chip placing groove (11); the chip position angle adjusting assembly (2) is located on one side of the chip tray (1), the chip position angle adjusting assembly (2) comprises a chip loading platform (21) for transferring the chip and a chip three-axis adjusting assembly for adjusting the R, X and Y axis positions of the chip loading platform (21); the repair platform (3) is used for carrying the product to be repaired, and the repair platform (3) comprises a platform conveying line (31) located on one side of the chip loading platform (21) and a platform two-axis adjusting assembly for driving the platform conveying line (31) to adjust the X and Y axis positions. The repair assembly (4) comprises a linear module (41), a point tin support (42) and a product alignment linear module (43), the point tin support (42) is provided with a point tin head (421) for supplementing tin on the product, the product alignment linear module (43) is provided with a product defect alignment camera (432) for identifying the position of the defect on the product, and the linear module (41) is provided with a chip alignment camera (44), a chip position angle alignment camera (45), a chip transfer suction nozzle (46) for adsorbing and transferring the chip and a product cleaning suction nozzle (47) for cleaning the product defect, which correspond to the chip tray (1) and the chip loading platform (21) respectively. The number of the linear module (41) is at least two, the point tin support (42) is located between the two linear modules (41), and the inside of the point tin support (42) is provided with a point tin linear module (422) for driving the point tin head (421) to adjust the Y axis position and a point tin lifting module (423) for driving the point tin linear module (422) to adjust the Z axis position.

2. The Mini LED repair device of claim 1, wherein: The chip tray (1) is rotatably arranged on a bottom plate (12), one side of the bottom plate (12) is provided with a tray rotating motor (13) in transmission connection with the chip tray (1) through a belt, the bottom of the bottom plate (12) is provided with a tray X axis adjusting table (14), and the bottom of the tray X axis adjusting table (14) is provided with a tray Y axis adjusting table (15). The chip three-axis adjusting assembly comprises a chip R axis direct drive rotary table (22) for mounting the chip loading platform (21), a chip X axis linear module (23) arranged at the bottom of the chip R axis direct drive rotary table (22) and a chip Y axis linear module (24) arranged at the bottom of the chip X axis linear module (23).

3. The Mini LED repair device of claim 1, wherein: The platform two-axis adjusting assembly comprises a platform X axis linear module (32) arranged at the bottom of the platform conveying line (31) and a platform Y axis linear module (33) arranged at the bottom of the platform X axis linear module (32).

4. The Mini LED repair device of claim 1, wherein: The middle of the platform conveying line (31) is provided with a product lifting cylinder, the top of the platform conveying line (31) is provided with product positioning pressing plates (34) on both sides, the platform conveying line (31) carries the product to be repaired, and one side of the platform conveying line (31) is provided with a product rough positioning cylinder (35).

5. The Mini LED repair device of claim 4, wherein: ​ 6. The Mini LED repair device of claim 1, wherein: The product alignment linear module (43) is arranged on the two linear modules (41), and the product alignment linear module (43) is provided with a product alignment lifting module (431) for mounting a product defect alignment camera (432).

7. The Mini LED repair device of claim 1, wherein: The product cleaning suction nozzle (47) is mounted on a suction nozzle lifting linear motor (471), the suction nozzle lifting linear motor (471) is mounted on one of the linear modules (41), and the chip alignment camera (44), the chip position angle alignment camera (45) and the chip transfer suction nozzle (46) are mounted on the other linear module (41).

8. The Mini LED repair device of claim 1, wherein: The product loading and unloading conveying lines (5) are arranged on both sides of the repair platform (3).

9. The Mini LED repair device of claim 8, wherein: The marble base (6) is arranged for mounting the product loading and unloading conveying lines (5), the chip tray (1), the chip position angle adjusting assembly (2), the repair platform (3) and the repair assembly (4).

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