oscillator

Abstract

Oscillator. Wiring is highly flexible. The oscillator is provided with a vibration element, a circuit element, and a container having a substrate on which the circuit element is mounted. The circuit element has a first connection terminal connected to the vibration element, a second connection terminal connected to the vibration element and arranged in a first direction from the first connection terminal, and an output terminal arranged adjacent to the first connection terminal in a second direction orthogonal to the first direction. The substrate has a first surface on which the circuit element is mounted and a second surface. The substrate has a first connection electrode provided on the first surface and connected to the first connection terminal, a second connection electrode connected to the second connection terminal, an output electrode connected to the output terminal, a first connection wiring provided on the second surface and connected to the first connection electrode, a second connection wiring connected to the second connection electrode, an output wiring connected to the output electrode, and a shield wiring provided between the first connection wiring and the output wiring and to which a direct current potential is applied.

Description

Technical Field

[0001] This invention relates to oscillators. Background Technology

[0002] Conventionally, piezoelectric devices such as oscillators include a substrate with a mounting element, an integrated circuit element mounted on the substrate, and a piezoelectric element. For example, Patent Document 1 discloses a piezoelectric device in which an integrated circuit element is mounted on a mounting pad provided on the lower surface of a substrate. In order to reduce the capacitance generated between the piezoelectric element measurement pattern and the output wiring pattern, a grounding wiring pattern is provided in such a way that it surrounds the piezoelectric element measurement pattern led out from the mounting pad in three directions.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2014-11663

[0004] However, the piezoelectric device described in Patent Document 1 requires a grounding wiring pattern to be wound around the piezoelectric element measuring pattern connected to the piezoelectric element on the lower surface of the substrate. The spacing between the piezoelectric element measuring pattern and the grounding wiring pattern is relatively narrow, which reduces the degree of freedom in wiring winding. Summary of the Invention

[0005] The oscillator includes: a vibrating element; a circuit element connected to the vibrating element and outputting a clock signal; and a container housing the vibrating element and the circuit element, having a substrate on which the circuit element is mounted, the circuit element having a plurality of terminals, the plurality of terminals including: a first connection terminal connected to the vibrating element; a second connection terminal connected to the vibrating element and arranged side-by-side with the first connection terminal in a first direction; and an output terminal arranged adjacent to the first connection terminal in a second direction orthogonal to the first direction, outputting the clock signal, the substrate having: a first layer having a first surface on which the circuit element is mounted and a layer perpendicular to the first surface. The second layer is an anti-relational layer; a second layer is stacked on the first layer; a first connecting electrode is disposed on the first layer and connected to the first connecting terminal; a second connecting electrode is disposed on the first layer and connected to the second connecting terminal; an output electrode is disposed on the first layer and connected to the output terminal; a first connecting wire is disposed on the second layer and connected to the first connecting electrode; a second connecting wire is disposed on the second layer and connected to the second connecting electrode; an output wire is disposed on the second layer and connected to the output electrode; and a shielding wire is disposed on the second layer between the first connecting wire and the output wire and is subjected to a DC potential. Attached Figure Description

[0006] Figure 1 This is a top view showing the schematic structure of the oscillator according to the first embodiment.

[0007] Figure 2 yes Figure 1 A cross-sectional view along line AA in the diagram.

[0008] Figure 3 It is a top view showing the terminal patterns formed on the circuit elements.

[0009] Figure 4 This is a top view showing the electrode pattern formed on the first surface of the first layer.

[0010] Figure 5 This is a top view showing the wiring pattern formed on the second surface of the first layer.

[0011] Figure 6 This is a top view showing the electrode pattern formed on the upper surface of the second layer.

[0012] Figure 7 This is a top view showing the schematic structure of the oscillator according to the second embodiment.

[0013] Figure 8 This is a top view showing the wiring pattern formed on the upper surface of the second layer.

[0014] Figure 9 This is a top view showing the schematic structure of the oscillator according to the third embodiment.

[0015] Figure 10 This is a top view showing the wiring pattern formed on the upper surface of the second layer.

[0016] Figure 11 This is a top view showing the schematic structure of the oscillator according to the fourth embodiment.

[0017] Figure 12 This is a top view showing the wiring pattern formed on the second surface of the first layer.

[0018] Label Explanation

[0019] 1. 1a, 1b, 1c Oscillators; 10. Container; 11. Substrate; 11a. First layer; 11b. Second layer; 21a. First surface; 21b. Second surface; 22. Top surface; 12. First frame substrate; 13. Second frame substrate; 14. Mounting terminal; 15. Mounting part; 16. Mounting electrode; 17. Connecting component; 18. Cover; 19. Connecting component; 31a. First connecting electrode; 31b. Second connecting electrode; 31c. Output electrode; 31d. Ground electrode; 31e. Power electrode; 31f. Control electrode; 32a, 32b, 32c, 32d, 32e, 32f. Through electrode; 33a. First Connection wiring; 33b Second connection wiring; 33c Output wiring; 33d Grounding wiring; 33e Power wiring; 33f Control wiring; 33g Shielding wiring; 34a, 34b Through electrodes; 40 Circuit components; 41a First connection terminal; 41b Second connection terminal; 41c Output terminal; 41d Grounding terminal; 41e Power terminal; 41f Control terminal; 50 Vibration element; 51 Base; 52 Vibration arm; 53 Weighting part; 54 Support arm; 55 Excitation electrode; 56 Connection electrode; 60 Connecting component; 61a, 61b Through electrodes; S1, S2 Storage space. Detailed Implementation

[0020] 1. First Implementation Method

[0021] First, taking an oscillator with a tuning fork-type vibrating element 50 as an example, refer to... Figures 1-6 The oscillator 1 of the first embodiment is described.

[0022] exist Figure 1 In the diagram, to facilitate explanation of the internal structure of the oscillator 1, the state with cover 18 removed is shown. Furthermore, in... Figure 2 The wiring connecting the mounting terminal 14 on the container 10 to the electrodes 31c, 31d, 31e, and 31f on the first surface 21a of the first layer 11a, as well as the wiring connecting the excitation electrode 55 to the connection electrode 56, is omitted from the diagram.

[0023] For ease of explanation, in the following figures, the X-axis, Y-axis, and Z-axis will be shown as three mutually orthogonal axes. The direction along the X-axis will be called the "X-direction," the direction along the Y-axis will be called the "Y-direction," and the direction along the Z-axis will be called the "Z-direction." In this specification, the first direction is the X-direction, and the second direction is the Y-direction. Furthermore, the front end of the arrow for each axis direction will be called the "positive side," and the base end will be called the "negative side." The positive side of the Z-direction will be called "up," and the negative side of the Z-direction will be called "down."

[0024] like Figure 1 and Figure 2As shown, the oscillator 1 of this embodiment has a circuit element 40, a vibration element 50, a container 10 for housing the circuit element 40 and the vibration element 50, and a cover 18 for airtightly sealing the housing space S1 for housing the vibration element 50.

[0025] Circuit element 40 has an oscillation circuit that causes the vibrating element 50 to oscillate, and outputs a clock signal according to the oscillation frequency of the vibrating element 50.

[0026] like Figure 3 As shown, the circuit element 40 includes: a first connection terminal 41a connected to the vibration element 50; a second connection terminal 41b connected to the vibration element 50 and arranged side-by-side with the first connection terminal 41a in the X direction, which is a first direction; an output terminal 41c arranged adjacent to the first connection terminal 41a in the Y direction, which is a second direction orthogonal to the first direction, and outputting a clock signal; a ground terminal 41d arranged adjacent to the second connection terminal 41b in the Y direction; a power supply terminal 41e arranged adjacent to the opposite side of the output terminal 41c side of the first connection terminal 41a; and a control terminal 41f arranged adjacent to the opposite side of the ground terminal 41d side of the second connection terminal 41b.

[0027] The vibrating element 50 is a tuning fork type vibrating element that oscillates at a resonant frequency caused by its shape and size, and outputs the desired oscillation frequency.

[0028] The vibrating element 50 uses piezoelectric materials such as quartz as its base material, such as... Figure 1 As shown, the device has a base 51, a pair of vibrating arms 52 extending from the base 51 in the -Y direction, a weighting part 53 connected to the front end of the vibrating arm 52 in the -Y direction, a support arm 54 extending from the base 51 in the -Y direction and arranged parallel to the vibrating arm 52, an excitation electrode 55 made of metal or the like formed on the vibrating arm 52, and a connection electrode 56 made of metal or the like formed on the support arm 54.

[0029] The container 10 is made of ceramic or the like and is constructed by stacking a substrate 11 on which a flat circuit element 40 is mounted, a first frame substrate 12 with a central portion removed, and a second frame substrate 13 with a central portion removed and disposed on the opposite side of the first frame substrate 12 across the substrate 11.

[0030] The substrate 11 includes: a first layer 11a having a first surface 21a on which a circuit element 40 is mounted and a second surface 21b opposite to the first surface 21a; and a second layer 11b stacked on the first layer 11a. A vibration element 50 is mounted on one side of the substrate 11, i.e., the second surface 21b side, and a circuit element 40 is mounted on the other side of the substrate 11, i.e., the first surface 21a side.

[0031] like Figure 4 As shown, on the first surface 21a of the first layer 11a, there are a first connection electrode 31a connected to the first connection terminal 41a, a second connection electrode 31b connected to the second connection terminal 41b, and an output electrode 31c connected to the output terminal 41c. In addition, there are a ground electrode 31d connected to the ground terminal 41d, a power electrode 31e connected to the power supply terminal 41e, and a control electrode 31f connected to the control terminal 41f.

[0032] Furthermore, a circuit element 40 is mounted on the first surface 21a of the storage space S2 formed by the substrate 11 and the second frame substrate 13, such as... Figure 2 As shown, the electrodes 31a, 31b, 31c, 31d, 31e, and 31f on the first surface 21a and the terminals 41a, 41b, 41c, 41d, 41e, and 41f provided on the circuit element 40 are electrically and mechanically connected via bonding components 19 such as conductive adhesives or gold bumps.

[0033] like Figure 5 As shown, on the second surface 21b of the first layer 11a, there are a first connection wire 33a connected to the first connection electrode 31a via a through electrode 32a, a second connection wire 33b connected to the second connection electrode 31b via a through electrode 32b, and an output wire 33c connected to the output electrode 31c via a through electrode 32c. Additionally, there are a ground wire 33d connected to the ground electrode 31d via a through electrode 32d, a power wire 33e connected to the power supply electrode 31e via a through electrode 32e, and a control wire 33f connected to the control electrode 31f via a through electrode 32f. Furthermore, in top view, a shielding wire 33g connected to the power supply wire 33e and subjected to a DC potential is provided between the first connection wire 33a and the output wire 33c. The shielding wire 33g extends along the Y direction between the first connection wire 33a and the second connection wire 33b.

[0034] By setting a shielding wire 33g between the first connecting wire 33a and the output wire 33c, the parasitic capacitance generated between the first connecting wire 33a and the output wire 33c can be reduced, and the difference between the parasitic capacitance generated between the first connecting wire 33a and the output wire 33c can be reduced. Therefore, the degradation of the output signal characteristics can be reduced. The shielding wire 33g is connected to the power supply wire 33e, which allows for a high degree of freedom in wire winding and a simple wiring pattern.

[0035] like Figure 6As shown, on the second layer 11b, through electrodes 34a and 34b are respectively provided at positions that overlap with the through electrodes 32a and 32b of the first layer 11a when viewed from above. The through electrodes 34a and 34b are electrically connected to the through electrodes 32a and 32b provided on the first layer 11a.

[0036] like Figure 1 and Figure 2 As shown, two mounting portions 15 for fixing the vibration element 50 are stacked on the upper surface 22 of the second layer 11b.

[0037] Viewed from above, the mounting portion 15 has through electrodes 61a and 61b at positions overlapping with the through electrodes 34a and 34b of the second layer 11b. Through electrode 61a is electrically connected to mounting electrode 16 disposed on the mounting portion 15 on the X-direction + side, and through electrode 61b is electrically connected to mounting electrode 16 disposed on the mounting portion 15 on the X-direction - side. Therefore, mounting electrode 16 is electrically connected to the first connection terminal 41a and the second connection terminal 41b disposed on the circuit element 40.

[0038] Furthermore, a support arm 54 for the vibration element 50 is disposed above the mounting portion 15. The support arm 54 is connected to and fixed to the mounting portion 15 provided on the substrate 11 in the Y direction, between the two ends of the vibration arm 52. More specifically, the connecting electrode 56 formed on the support arm 54 and the mounting electrode 16 formed on the mounting portion 15 are electrically and mechanically connected via a bonding member 60 such as a gold bump.

[0039] The cover 18 is made of metal, ceramic, glass, etc., and is joined to the container 10 via a sealing ring or a low-melting-point glass or other joining component 17. This forms a storage space S1 that houses the vibrating element 50 and is airtight. Furthermore, the storage space S1 is an airtight space, in a depressurized state, preferably closer to a vacuum.

[0040] In this embodiment, the oscillator 1 has a two-layer structure for the substrate 11. The mounting electrode 16 can be positioned on the second layer 11b side, increasing the spacing between the first connection wiring 33a and the output wiring 33c, which are electrically connected to the mounting electrode 16. Therefore, a shielding wiring 33g with high flexibility in wiring winding and a simple wiring pattern can be provided between the first connection wiring 33a and the output wiring 33c. Consequently, the parasitic capacitance generated between the first connection wiring 33a and the output wiring 33c can be reduced, and the difference between the parasitic capacitance generated between the second connection wiring 33b and the output wiring 33c can be decreased. Therefore, the degradation of the output signal characteristics of the oscillator 1 can be reduced.

[0041] In this embodiment, the shielding wire 33g is connected to the power supply wire 33e, but it is not limited to this; the shielding wire 33g can also be connected to the ground wire 33d. In this case, the parasitic capacitance generated between the first connection wire 33a and the output wire 33c can be reduced in the same way as when it is connected to the power supply wire 33e.

[0042] 2. Second Implementation Method

[0043] Next, refer to Figure 7 and Figure 8 The oscillator 1a of the second embodiment will be described. For ease of explanation, Figure 7 This shows the state with cover 18 removed.

[0044] Compared to the oscillator 1 of the first embodiment, the oscillator 1a of this embodiment has a through electrode 34e provided in the second layer 11ba and a shielding wiring 35g formed on the upper surface 22 of the second layer 11ba. Otherwise, it is the same as the oscillator 1 of the first embodiment. In addition, the description will focus on the differences from the first embodiment described above, and the description of the same items will be omitted.

[0045] like Figure 7 and Figure 8 As shown, when viewed from above in the second layer 11ba, the oscillator 1a has a through electrode 34e located at a position overlapping with the through electrode 32e located in the first layer 11a, and is electrically connected to the through electrode 32e in the first layer 11a. Furthermore, the through electrode 34e is electrically connected to a shielding wiring 35g, which has: width-enlarged portions 36a and 36b, located at a position overlapping with the mounting electrode 16 located in the mounting portion 15 when viewed from above; and a width-enlarged portion 36c, located at a position overlapping with the output terminal 41c of the circuit element 40 when viewed from above. The shielding wiring 35g is located between the mounting electrode 16 and the output terminal 41c, thus reducing the parasitic capacitance generated between the mounting electrode 16 and the output terminal 41c.

[0046] By adopting such a structure, the same effect as the oscillator 1 in the first embodiment can be obtained.

[0047] 3. Third Implementation Method

[0048] Next, refer to Figure 9 and Figure 10 The oscillator 1b of the third embodiment will be described. For ease of explanation, Figure 9 This shows the state with cover 18 removed.

[0049] Compared to the oscillator 1 of the first embodiment, the oscillator 1b of this embodiment has a through electrode 34e provided in the second layer 11bb and a shielding wiring 37g formed on the upper surface 22 of the second layer 11bb. Otherwise, it is the same as the oscillator 1 of the first embodiment. In addition, the description will focus on the differences from the first embodiment described above, and the description of the same items will be omitted.

[0050] like Figure 9 and Figure 10 As shown, when viewed from above the second layer 11bb, the oscillator 1b has a through electrode 34e at a position overlapping with the through electrode 32e provided in the first layer 11a, and is electrically connected to the through electrode 32e in the first layer 11a. Furthermore, the through electrode 34e is electrically connected to a shielding wiring 37g, which has a width-enlarged portion 38a, positioned when viewed from above, overlapping with the excitation electrode 55 of the vibration element 50; and a width-enlarged portion 38b, positioned when viewed from above, overlapping with the output terminal 41c of the circuit element 40. The shielding wiring 37g is positioned between the excitation electrode 55 and the output terminal 41c, thus reducing the parasitic capacitance generated between the excitation electrode 55 and the output terminal 41c.

[0051] By adopting such a structure, the same effect as the oscillator 1 in the first embodiment can be obtained.

[0052] 4. Fourth Implementation Method

[0053] Next, refer to Figure 11 and Figure 12 The oscillator 1c of the fourth embodiment will be described. For ease of explanation, Figure 11 This shows the state with cover 18 removed.

[0054] The oscillator 1c of this embodiment differs from the oscillator 1 of the first embodiment in that the shielding wiring 39g formed on the second surface 21b of the first layer 11ac is different; otherwise, it is the same as the oscillator 1 of the first embodiment. Furthermore, the description will focus on the differences from the first embodiment described above, and descriptions of identical items will be omitted.

[0055] like Figure 11 and Figure 12As shown, the oscillator 1c has a shielding wiring 39g on the second surface 21b of the first layer 11ac. The shielding wiring 39g has: a wiring pattern 39ga, which extends in the X direction between the through electrode 32c and the output wiring 33c electrically connected to the output terminal 41c of the circuit element 40, and between the through electrode 32a and the first connection wiring 33a electrically connected to the first connection terminal 41a of the circuit element 40; and a wiring pattern 39gb, which extends in the Y direction between the through electrode 32c and the output wiring 33c, and between the through electrode 32d and the ground wiring 33d electrically connected to the ground terminal 41d of the circuit element 40. That is, the shielding wiring 39g is configured to surround the output wiring 33c from both the X and Y directions. Therefore, the parasitic capacitance generated between the output wiring 33c and the second connection wiring 33b can also be reduced.

[0056] By adopting such a structure, the same effect as the oscillator 1 in the first embodiment can be obtained.

Claims

1. An oscillator having: Vibrating elements; A circuit element, connected to the vibrating element, outputs a clock signal; and A container that houses the vibrating element and the circuit element, having a substrate on which the circuit element is mounted. The circuit element has multiple terminals, including: The first connection terminal is connected to the vibrating element; A second connecting terminal, which is connected to the vibrating element, is arranged side-by-side with the first connecting terminal in the first direction; and An output terminal, which is arranged adjacent to the first connection terminal in a second direction orthogonal to the first direction, outputs the clock signal. The substrate has: The first layer has a first surface on which the circuit element is mounted and a second surface opposite to the first surface; The second layer is stacked on top of the first layer; A first connecting electrode is disposed on the first surface and connected to the first connecting terminal; The second connecting electrode is disposed on the first surface and connected to the second connecting terminal; An output electrode is disposed on the first surface and connected to the output terminal; A first connecting wire is disposed on the second surface and connected to the first connecting electrode; The second connecting wire is disposed on the second surface and connected to the second connecting electrode; An output wiring is provided on the second surface and connected to the output electrode; as well as A shielded wiring, disposed on the second surface between the first connecting wiring and the output wiring, is subjected to a DC potential.

2. The oscillator according to claim 1, wherein, The vibration element is mounted on one side of the substrate, and the circuit element is mounted on the other side of the substrate. The substrate has mounting electrodes connected to the vibrating element. The shielding wiring is disposed between the mounting electrode and the output terminal of the circuit element.

3. The oscillator according to claim 1, wherein, The vibration element is mounted on one side of the substrate, and the circuit element is mounted on the other side of the substrate. The shielding wiring is disposed between the excitation electrode and the output terminal of the circuit element, wherein the excitation electrode is disposed on the vibration element.

4. The oscillator according to any one of claims 1 to 3, wherein, The shielding wiring is arranged between the first connection wiring and the second connection wiring and the output wiring in a manner that surrounds the output wiring from two directions.

5. The oscillator according to any one of claims 1 to 3, wherein, The shielding wiring is positioned between the first connecting electrode and the output electrode when viewed from above.

6. The oscillator according to any one of claims 1 to 3, wherein, The shielding wiring extends between the first connecting wiring and the second connecting wiring.

7. The oscillator according to any one of claims 1 to 3, wherein, The vibrating element is a tuning fork type vibrating element, with a support arm arranged parallel to the vibrating arm. The support arm is connected to the substrate at a position between the two ends of the vibrating arm in the second direction.

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