Method for manufacturing wafer-bonded die-bonded tape and method for manufacturing semiconductor device

Abstract

Disclosed is a method for manufacturing a wafer-bonding integrated tape and a method for manufacturing a semiconductor device. The method for manufacturing a pressure-sensitive adhesive sheet includes a step of preparing a pressure-sensitive adhesive sheet precursor having a base material and a pressure-sensitive adhesive layer provided on the base material, and a step of performing plasma treatment on a surface of the pressure-sensitive adhesive layer on the opposite side of the base material in the pressure-sensitive adhesive sheet precursor.

Description

[0001] This application is a divisional application of Chinese Application No. 201980038462.3, filed on June 6, 2019, entitled "Method for Manufacturing Pressure-Sensitive Adhesive Sheet, Method for Manufacturing Pressure-Sensitive Adhesive Tape, Method for Manufacturing Semiconductor Device, Method for Treating Pressure-Sensitive Adhesive, Method for Fixing Adherend, and Method for Peeling Adherend". TECHNICAL FIELD

[0002] The present application relates to a method for manufacturing a pressure-sensitive adhesive sheet, a method for manufacturing a pressure-sensitive adhesive tape, a method for manufacturing a semiconductor device, a method for treating a pressure-sensitive adhesive, a method for fixing an adherend, and a method for peeling an adherend. BACKGROUND

[0003] Pressure-sensitive adhesives are used in various applications in the industrial field. In industry, the adhesive force (bulk properties of the pressure-sensitive adhesive itself due to the crosslinking density, etc.) is generally controlled by adjusting the crosslinking density.

[0004] On the other hand, methods for improving the adhesion of an adherend to a pressure-sensitive adhesive by surface-treating the adherend are known. For example, in Patent Literature 1, it is described that the adhesion of a synthetic resin product (adherend) to a coating film is improved by surface-treating the synthetic resin product with plasma. Also, in Patent Literature 2, it is described that in a pressure-sensitive adhesive sheet, the adhesion of a plastic film substrate (adherend) to a pressure-sensitive adhesive layer is improved by surface-treating the plastic film substrate with plasma or the like. From the viewpoint of improving the adhesion, surface-treating the adherend is disclosed in these patent literatures.

[0005] PRIOR ART DOCUMENTS

[0006] PATENT LITERATURE

[0007] Patent Literature 1: Japanese Patent Application Laid-Open No. 59-100143

[0008] Patent Literature 2: Japanese Patent Application Laid-Open No. 2011-068718 SUMMARY

[0009] PROBLEMS TO BE SOLVED BY THE INVENTION

[0010] However, the conventional pressure-sensitive adhesives have room for improvement in terms of the adhesive force. Therefore, the main object of the present application is to provide a method for manufacturing a pressure-sensitive adhesive sheet, which can manufacture a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer with excellent adhesive force.

[0011] MEANS FOR SOLVING THE PROBLEMS

[0012] As a factor that affects the adhesiveness of the adherend to the pressure-sensitive adhesive, in addition to the adhesive force of the pressure-sensitive adhesive (the physical properties of the pressure-sensitive adhesive itself), there is the affinity easiness (wettability) of the pressure-sensitive adhesive to the adherend. However, according to the research and judgment of the inventor of the present application, in a method of adjusting the crosslinking density of the pressure-sensitive adhesive to control the adhesive force of the pressure-sensitive adhesive, the adhesive force and the wettability have a so-called trade-off relationship. For example, if the crosslinking density is adjusted in a manner to increase the adhesive force, the pressure-sensitive adhesive shows a tendency to decrease the wettability to the adherend. And, as a result of further research based on this insight, it was found that by performing plasma treatment on the pressure-sensitive adhesive layer instead of the adherend, the contact angle of the treated surface can be reduced and the adhesive force can be increased, thereby completing the present application.

[0013] One aspect of the present application provides a method of manufacturing a pressure-sensitive adhesive sheet, including: a step of preparing a pressure-sensitive adhesive sheet precursor having a substrate and a pressure-sensitive adhesive layer provided on the substrate; and a step of performing plasma treatment on a surface of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet precursor, the surface being opposite to the substrate.

[0014] The plasma treatment can be plasma treatment using an atmospheric pressure plasma. The treatment temperature of the plasma treatment can be lower than the temperature of the lower one of the melting point of the substrate or the melting point of the pressure-sensitive adhesive layer.

[0015] The method of manufacturing a pressure-sensitive adhesive sheet can further include a step of attaching a protective material to the surface of the pressure-sensitive adhesive layer opposite to the substrate, on which the plasma treatment has been performed. The protective material can be a material that has been treated by plasma treatment on the surface of the pressure-sensitive adhesive layer side, on which the plasma treatment has been performed.

[0016] In another aspect, the present application provides a pressure-sensitive adhesive sheet obtained by the above manufacturing method.

[0017] In another aspect, the present application provides a method of manufacturing a cut-and-stick integrated tape, including a step of forming an adhesive layer on the surface of the pressure-sensitive adhesive layer opposite to the substrate, on which the plasma treatment has been performed, of the pressure-sensitive adhesive sheet obtained by the above manufacturing method.

[0018] In another aspect, the present application provides a cut-and-stick integrated tape obtained by the above manufacturing method.

[0019] In another aspect, the present application provides a method for manufacturing a semiconductor device, including: a step of adhering the adhesive layer of the dicing die-bonding integrated tape obtained by the above manufacturing method to a semiconductor wafer; a step of singulating the semiconductor wafer, the adhesive layer, and the pressure-sensitive adhesive layer subjected to the plasma treatment; a step of picking up the semiconductor element to which the adhesive layer is attached from the pressure-sensitive adhesive layer subjected to the plasma treatment; and a step of bonding the semiconductor element to a semiconductor element mounting support substrate via the adhesive layer.

[0020] In another aspect, the present application provides a method for treating a pressure-sensitive adhesive, including a step of subjecting the pressure-sensitive adhesive to plasma treatment. The plasma treatment can be plasma treatment using atmospheric pressure plasma. The treatment temperature of the plasma treatment can be lower than the melting point of the pressure-sensitive adhesive.

[0021] In another aspect, the present application provides a method for fixing an adherend, including a step of adhering a second adherend to a first adherend by the pressure-sensitive adhesive subjected to the above method. In still another aspect, the present application provides a method for peeling an adherend, including a step of peeling a first adherend from a second adherend by treating at least one of the interface between the first adherend and the pressure-sensitive adhesive or the interface between the second adherend and the pressure-sensitive adhesive of the adherend fixed by the above method with water.

[0022] Effects of Invention

[0023] According to the present application, it is possible to provide a method for manufacturing a pressure-sensitive adhesive sheet capable of manufacturing a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer with excellent adhesive strength. Furthermore, according to the present application, it is possible to provide a method for manufacturing a dicing die-bonding integrated tape using the pressure-sensitive adhesive sheet obtained by such a manufacturing method. Furthermore, according to the present application, it is possible to provide a method for manufacturing a semiconductor device using the dicing die-bonding integrated tape obtained by such a manufacturing method. Moreover, according to the present application, it is possible to provide a method for treating a pressure-sensitive adhesive, a method for fixing an adherend, and a method for peeling an adherend. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a cross-sectional view schematically showing an embodiment of a method for manufacturing a pressure-sensitive adhesive sheet. Figure 1 In this embodiment, Figure 1 (a), Figure 1 (b), Figure 1 (c), and Figure 1 (d) are cross-sectional views schematically showing each step.

[0025] Figure 2 is a cross-sectional view schematically showing an embodiment of a method for manufacturing a dicing die-bonding integrated tape. Figure 2In the present specification, the term "semiconductor device" refers to a device that utilizes semiconductor properties. Examples of the semiconductor device include a semiconductor integrated circuit (IC), a light-emitting device, a semiconductor circuit, a storage device, and an imaging device. Figure 2 (a), Figure 2 (b), and Figure 2 (c) are cross-sectional views schematically showing each step.

[0026] Figure 3 is a cross-sectional view schematically showing one embodiment of a method for manufacturing a semiconductor device. Figure 3 In the present specification, the term "semiconductor device" refers to a device that utilizes semiconductor properties. Examples of the semiconductor device include a semiconductor integrated circuit (IC), a light-emitting device, a semiconductor circuit, a storage device, and an imaging device. Figure 3 (a), Figure 3 (b), Figure 3 (c), Figure 3 (d), Figure 3 (e), and Figure 3 (f) are cross-sectional views schematically showing each step.

[0027] Figure 4 is a cross-sectional view schematically showing one embodiment of a semiconductor device. DETAILED DESCRIPTION

[0028] Hereinafter, one embodiment of the present application will be described with some steps appropriately with reference to the drawings. However, the present application is not limited to the following embodiment. In the following embodiment, components (including steps and the like) are not necessarily essential unless otherwise specified. The size of each component in each drawing is conceptual, and the relative relationship of the sizes of the components is not limited to the relationship shown in each drawing.

[0029] The numerical values and ranges thereof in the present specification are also the same, and do not limit the present application. In the present specification, a numerical range represented by "~" indicates a range including the numerical values written before and after "~" as the minimum value and the maximum value, respectively. In the numerical range written in stages in the present specification, the upper limit value or the lower limit value of one numerical range can be replaced with the upper limit value or the lower limit value of another numerical range written in stages. Furthermore, in the numerical range written in the present specification, the upper limit value or the lower limit value of the numerical range can be replaced with the value shown in the examples.

[0030] In the present specification, the term "(meth)acrylate" refers to an acrylate or a methacrylate corresponding thereto.

[0031] [Method for manufacturing pressure-sensitive adhesive sheet]

[0032] Figure 1is a cross-sectional view schematically showing an embodiment of a manufacturing method of a pressure-sensitive adhesive sheet. The manufacturing method of a pressure-sensitive adhesive sheet according to the present embodiment includes: a step of preparing a pressure-sensitive adhesive sheet precursor having a base material and a pressure-sensitive adhesive layer provided on the base material (pressure-sensitive adhesive sheet precursor preparation step); and a step of performing plasma treatment on a surface of the pressure-sensitive adhesive layer on the opposite side of the base material in the pressure-sensitive adhesive sheet precursor (plasma treatment performance step). The manufacturing method of a pressure-sensitive adhesive sheet according to the present embodiment can further include a step of attaching a protective material to the surface of the pressure-sensitive adhesive layer on the opposite side of the base material on which the plasma treatment has been performed (protective material arrangement step).

[0033] <Pressure-sensitive adhesive sheet precursor preparation step>

[0034] In the present step, a pressure-sensitive adhesive sheet precursor 100 (refer to FIG. 1) to be a target of plasma treatment is prepared. Figure 1 (a)). The pressure-sensitive adhesive sheet precursor 100 has a base material 10 and a pressure-sensitive adhesive layer 20 provided on the base material 10.

[0035] The base material 10 is not particularly limited as long as it has a higher melting point (or decomposition point or softening point) than heat generated by plasma treatment, and a base material film used in the field of pressure-sensitive adhesives can be used. The base material film is preferably expandable in a lamination process. As such a base material film, for example, a polyester film such as a polyethylene terephthalate film; a polyolefin film such as a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polymethylpentene film, and a polyvinyl acetate film; a plastic film such as a polyvinyl chloride film and a polyimide film; and the like can be exemplified. Surface treatment such as corona treatment can be performed on the surface of the base material 10 on which the pressure-sensitive adhesive layer 20 is to be formed.

[0036] The pressure-sensitive adhesive layer 20 is a layer composed of a pressure-sensitive adhesive component. The pressure-sensitive adhesive component constituting the pressure-sensitive adhesive layer 20 is not particularly limited as long as it has a higher melting point (or decomposition point or softening point) than heat generated by plasma treatment, and is preferably a pressure-sensitive adhesive component having adhesion at room temperature (25°C) and having an affinity for a layer (for example, an adhesive layer described later) laminated on the pressure-sensitive adhesive layer 20. The pressure-sensitive adhesive component constituting the pressure-sensitive adhesive layer 20 can also contain a base resin. As the base resin, for example, an acrylic resin, a synthetic rubber, a natural rubber, a polyimide resin, and the like can be exemplified. From the viewpoint of reducing residual paste of the pressure-sensitive adhesive component, the base resin preferably has a functional group such as a hydroxyl group, a carboxyl group, or the like that can react with a crosslinking agent described later or the like. The base resin can be a resin cured by high-energy rays such as ultraviolet rays and radiation rays or a resin cured by heat. The base resin is preferably a resin cured by high-energy rays, and more preferably a resin cured by ultraviolet rays (ultraviolet ray-curable base resin).

[0037] In the case of using a resin cured by high-energy rays as the base resin, a photopolymerization initiator can also be used as needed. The photopolymerization initiator can be, for example, an aromatic ketone compound, a benzoin ether compound, a benzoin ketal compound, an ester compound, an acridine compound, a 2,4,5-triarylimidazole dimer, or the like.

[0038] In order to adjust the adhesive force, the pressure-sensitive adhesive component can also contain a crosslinking agent capable of forming a crosslinked structure with the functional group of the base resin. The crosslinking agent preferably has at least one functional group selected from the group consisting of an epoxy group, an isocyanate group, an aziridine group, and a triazine group. The crosslinking agent can be used alone or in combination with two or more.

[0039] In order to maintain the effect brought about by the plasma treatment, it is effective to adjust the content of the crosslinking agent. The content of the crosslinking agent is preferably 5 parts by mass or more, more preferably 7 parts by mass or more, and further preferably 10 parts by mass or more, with respect to 100 parts by mass of the base resin. If the content of the crosslinking agent is 5 parts by mass or more with respect to 100 parts by mass of the base resin, there is a tendency to suppress the decline in the effect brought about by the plasma treatment. The content of the crosslinking agent can be 30 parts by mass or less with respect to 100 parts by mass of the base resin. If the content of the crosslinking agent is 30 parts by mass or less with respect to 100 parts by mass of the base resin, there is a tendency to easily maintain the effect brought about by the plasma treatment, and there is a tendency to suppress the decline in the adhesion of the pressure-sensitive adhesive layer to the protective material.

[0040] The pressure-sensitive adhesive component can also contain other components. As the other components, for example, there can be mentioned an amine, a tin, or the like, which is added for the purpose of promoting the crosslinking reaction of the base resin and the photopolymerization initiator; a rosin-based tackifier, a terpene resin-based tackifier, or the like, which is added for the purpose of appropriately adjusting the adhesion properties; various surfactants; and the like.

[0041] In one embodiment, the pressure-sensitive adhesive layer 20 can be a layer composed of a pressure-sensitive adhesive component containing an acrylic resin having a hydroxyl group and a crosslinking agent having an isocyanate group.

[0042] The acrylic resin having a hydroxyl group as the base resin can be obtained by polymerizing a monomer component containing a (meth)acrylate having a hydroxyl group. The polymerization method can be appropriately selected from various known polymerization methods such as radical polymerization, and can be, for example, suspension polymerization, solution polymerization, bulk polymerization, or the like.

[0043] In the case where the monomer components are polymerized in the above polymerization method, a polymerization initiator can also be used as necessary. As such a polymerization initiator, for example, ketone peroxide, ketal peroxide, hydrogen peroxide, dialkyl peroxide, diacyl peroxide, carbonate peroxide, ester peroxide, 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile), and the like can be exemplified.

[0044] The pressure-sensitive adhesive sheet precursor 100 having the pressure-sensitive adhesive layer 20 can be manufactured using a publicly known method. The pressure-sensitive adhesive sheet precursor 100 can be obtained, for example, by a manufacturing method including a step of diluting a material for a pressure-sensitive adhesive layer with a dispersion medium, a step of applying the resulting varnish to the above-mentioned substrate 10, and a step of removing the dispersion medium from the applied varnish.

[0045] The thickness of the pressure-sensitive adhesive layer 20 in the pressure-sensitive adhesive sheet precursor 100 can be 0.1 to 30 μm. If the thickness of the pressure-sensitive adhesive layer 20 is 0.1 μm or more, there is a tendency to be able to ensure sufficient adhesive force. If the thickness of the pressure-sensitive adhesive layer 20 is 30 μm or less, there is a tendency to be economically advantageous.

[0046] The thickness of the pressure-sensitive adhesive sheet precursor 100 as a whole (the total thickness of the substrate 10 and the pressure-sensitive adhesive layer 20) can be 5 to 150 μm, 50 to 150 μm, or 100 to 150 μm.

[0047] The pressure-sensitive adhesive sheet precursor 100 can have a protective material attached to the surface on the side opposite to the substrate 10 of the pressure-sensitive adhesive layer 20 before the plasma treatment is performed. The protective material can be the same as the materials exemplified in the protective material 30 described later.

[0048] <Plasma treatment implementation step>

[0049] In this step, the surface on the side opposite to the substrate 10 of the pressure-sensitive adhesive layer 20 in the pressure-sensitive adhesive sheet precursor 100 is subjected to plasma treatment (plasma treatment A) (see Figure 1 (b) of A) (see Figure 1 (b)). Thereby, the pressure-sensitive adhesive sheet 110 having a pressure-sensitive adhesive layer on which the plasma treatment A has been performed (plasma-treated pressure-sensitive adhesive layer 20A) can be manufactured (see Figure 1 (c).

[0050] The plasma is a state in which molecules of a gas constituting the gas are partially or completely ionized and move freely as cations and electrons. By treating the surface of the pressure-sensitive adhesive layer on the side opposite to the substrate using a gas in a plasma state, a chemical reaction is performed on the surface of the pressure-sensitive adhesive layer, a hydrophilic group containing oxygen is imparted, the contact angle of the treated surface is reduced, and the wettability can be improved. By this reaction, the adhesive force of the pressure-sensitive adhesive layer 20 of the pressure-sensitive adhesive sheet precursor can be improved.

[0051] The plasma treatment is not particularly limited, and from the viewpoint of cost, processing capacity, and reduction of damage, it can be a plasma treatment using an atmospheric pressure plasma. The plasma treatment using an atmospheric pressure plasma can be performed, for example, using an ultrahigh-density atmospheric pressure plasma unit (manufactured by Fuji Machine Mfg. Co., Ltd., product name: FPB-20 Model II).

[0052] The treatment temperature of the plasma treatment is preferably a temperature lower than the lower one of the melting point of the substrate 10 or the melting point of the pressure-sensitive adhesive layer 20, from the viewpoint of avoiding damage to the substrate 10 and the pressure-sensitive adhesive layer 20 caused by the plasma treatment. The plasma treatment is preferably performed while adjusting the treatment temperature, the treatment speed, and the like, in a manner that does not cause wrinkles, flexing, or the like in the pressure-sensitive adhesive sheet precursor 100 (the substrate 10 and the pressure-sensitive adhesive layer 20) during the treatment, that is, in a manner that does not cause thermal deformation of the pressure-sensitive adhesive sheet. If wrinkles, flexing, or the like occur, there is a possibility that the operation of the device during the plasma treatment will be hindered. The temperature condition of the plasma treatment can be, for example, 300°C or lower, 250°C or lower, or 200°C or lower.

[0053] The plasma treatment can adjust the treatment area. Therefore, the plasma treatment can be performed on a part or the entire of the surface of the pressure-sensitive adhesive layer 20 on the side opposite to the substrate 10 in the pressure-sensitive adhesive sheet precursor 100. If the plasma treatment is performed on a part of the surface of the pressure-sensitive adhesive layer 20, the contact angle of the treated surface can be adjusted, and therefore, on the same surface, a part with a low contact angle (that is, a part of the pressure-sensitive adhesive layer with a high adhesive force) and a part with a high contact angle (that is, a part of the pressure-sensitive adhesive layer with a low adhesive force) can be easily formed separately.

[0054] <Protection material attaching step>

[0055] In this step, the protection material 30 (see FIG. 2(d)) is attached to the surface of the pressure-sensitive adhesive layer on the side opposite to the substrate 10 of the pressure-sensitive adhesive sheet precursor 100 on which the plasma treatment has been performed (the pressure-sensitive adhesive layer 20A after the plasma treatment). Figure 1 (d)). Thereby, the pressure-sensitive adhesive sheet 120 with the protection material can be obtained. The method of attaching the protection material 30 can be performed using a publicly known method.

[0056] The protective material 30 is not particularly limited, and a protective film used in the field of pressure-sensitive adhesives can be used. As the protective film, for example, a polyester film such as a polyethylene terephthalate film; a polyolefin film such as a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polymethylpentene film, a polyvinyl acetate film; a plastic film such as a polyvinyl chloride film, a polyimide film, and the like can be listed. Also, paper, nonwoven fabric, metal foil, and the like can be used. The surface of the protective material 30 on the pressure-sensitive adhesive layer 20A side after plasma treatment can also be treated with a mold release agent such as a silicone-based release agent, a fluorine-based release agent, a long-chain alkyl acrylate-based release agent, and the like.

[0057] The protective material 30 can be a material in which the surface of the pressure-sensitive adhesive layer 20A side after plasma treatment has been treated by plasma treatment. By using a material treated by plasma treatment as the protective material 30, there is a tendency to be able to maintain the state in which the wettability of the pressure-sensitive adhesive layer 20A after plasma treatment is improved for a long period of time.

[0058] The thickness of the protective material 30 is not particularly limited, and can be 5 to 500 μm, 10 to 200 μm, or 15 to 100 μm.

[0059] [Method for manufacturing a cutting-crystal and adhering-crystal integrated tape]

[0060] Figure 2 is a cross-sectional view schematically showing an embodiment of a method for manufacturing a cutting-crystal and adhering-crystal integrated tape. The method for manufacturing a cutting-crystal and adhering-crystal integrated tape 130 according to the present embodiment includes a step of forming an adhesive layer 40 on the surface of the pressure-sensitive adhesive sheet 110 obtained by the above manufacturing method on the side opposite to the substrate 10 of the pressure-sensitive adhesive layer 20A after plasma treatment (the surface on which plasma treatment has been performed) (see Figure 2 (a), Figure 2 (b) ).

[0061] The adhesive layer 40 is a layer composed of an adhesive component. As the adhesive component constituting the adhesive layer 40, for example, a thermosetting adhesive component, a photocurable adhesive component, a thermoplastic adhesive component, an oxygen-reactive adhesive component, and the like can be listed. From the viewpoint of adhesion, the adhesive layer preferably contains a thermosetting adhesive component.

[0062] From the viewpoint of adhesion, the thermosetting adhesive component preferably contains an epoxy resin and a phenol resin that can be a curing agent for the epoxy resin.

[0063] The epoxy resin can be used without particular limitation as long as it is a resin having an epoxy group in the molecule. As the epoxy resin, for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a bisphenol A novolac type epoxy resin, a bisphenol F novolac type epoxy resin, an epoxy resin containing a dicyclopentadiene skeleton, a stilbene type epoxy resin, an epoxy resin containing a triazine skeleton, an epoxy resin containing a fluorene skeleton, a triphenol methane type epoxy resin, a biphenyl type epoxy resin, a paraxylene type epoxy resin, a biphenyl aralkyl type epoxy resin, a naphthalene type epoxy resin, a di-glycidyl ether compound of a polyfunctional phenol, a polycyclic aromatic compound such as anthracene, or the like can be exemplified. These can be used alone or in combination of two or more. The content of the epoxy resin can be 2 to 50% by mass based on the total amount of the adhesive layer.

[0064] The phenol resin can be used without particular limitation as long as it is a resin having a phenolic hydroxyl group in the molecule. As the phenol resin, for example, a phenol novolac type phenol resin obtained by condensation or co-condensation of a phenol such as phenol, cresol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and / or a naphthol such as α-naphthol, β-naphthol, dihydroxynaphthalene, and a compound having an aldehyde group such as formaldehyde, under an acidic catalyst; a phenol aralkyl resin such as a phenol aralkyl resin synthesized from an allylated bisphenol A, an allylated bisphenol F, an allylated naphthalene diol, a phenol novolac, a phenol, and / or a naphthol, and dimethoxy-p-xylene or bis(methoxymethyl) biphenyl; or the like can be exemplified. These can be used alone or in combination of two or more. The content of the phenol resin can be 2 to 50% by mass based on the total amount of the adhesive layer.

[0065] As the other component, the adhesive layer 40 can also contain a tertiary amine, an imidazole, a quaternary ammonium salt, or the like as a curing accelerator; an inorganic filler such as aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, amorphous silica, or the like. The content of the other component can be 0 to 20% by mass based on the total amount of the adhesive layer.

[0066] In the pressure-sensitive adhesive sheet 110, a portion or the entire portion of the surface of the side of the pressure-sensitive adhesive layer 20 opposite to the substrate 10 is subjected to plasma treatment. In the case where a portion of the surface of the side of the pressure-sensitive adhesive layer 20 opposite to the substrate 10 is subjected to plasma treatment, the adhesive layer 40 can be formed so as to cover a portion or the entire portion of the surface of the side of the pressure-sensitive adhesive layer 20 subjected to plasma treatment, or can be formed so as to cover a portion or the entire portion of the surface of the side of the pressure-sensitive adhesive layer 20 not subjected to plasma treatment. Also, the adhesive layer 40 can be formed so as to cover a portion or the entire portion of both the surface of the side of the pressure-sensitive adhesive layer 20 subjected to plasma treatment and the surface of the side of the pressure-sensitive adhesive layer 20 not subjected to plasma treatment. In the case where the entire portion of the pressure-sensitive adhesive layer 20 is subjected to plasma treatment, the adhesive layer 40 can be formed so as to cover a portion or the entire portion of the surface of the side of the pressure-sensitive adhesive layer 20 subjected to plasma treatment.

[0067] As a method of forming the adhesive layer 40 on the surface of the side of the pressure-sensitive adhesive layer 20A opposite to the substrate 10 after plasma treatment, for example, a method of using a publicly known method, shaping an adhesive component into a film shape, and adhering the obtained film-shaped adhesive to the surface of the side of the pressure-sensitive adhesive layer 20A opposite to the substrate 10 after plasma treatment can be exemplified. Thus, a cut-and-stick integrated tape 130 (refer to Figure 2 (b)).

[0068] The cut-and-stick integrated tape 130 can have a protective material 50 on the surface of the side of the adhesive layer 40 opposite to the pressure-sensitive adhesive layer 20A. The protective material 50 is not particularly limited, and a protective film used in the cut-and-stick integrated tape can be used. As the protective film, for example, a polyester film such as a polyethylene terephthalate film; a polyolefin film such as a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polymethylpentene film, and a polyvinyl acetate film; a plastic film such as a polyvinyl chloride film and a polyimide film; and the like can be exemplified. Thus, a tape with protective material 140 (refer to Figure 2 (c)).

[0069] [Method for manufacturing semiconductor device (semiconductor package)]

[0070] Figure 3 is a cross-sectional view schematically showing an embodiment of a method for manufacturing a semiconductor device. The method for manufacturing a semiconductor device according to the present embodiment includes a step of adhering the adhesive layer 40 of the cut-and-stick integrated tape 130 obtained by the above-described method for manufacturing to a semiconductor wafer W (wafer lamination step, refer to Figure 3 (a), Figure 3(b)); a process of singulating the semiconductor wafer W, the adhesive layer 40, and the pressure-sensitive adhesive layer subjected to the plasma treatment (pressure-sensitive adhesive layer 20A after plasma treatment) (dicing process, refer to Figure 3 (c)); a process of irradiating the pressure-sensitive adhesive layer subjected to the plasma treatment (pressure-sensitive adhesive layer 20A after plasma treatment) (via the substrate 10) with ultraviolet rays as necessary (ultraviolet ray irradiation process, refer to Figure 3 (d)); a process of picking up the semiconductor element Wa (semiconductor element 60 with adhesive layer) to which the adhesive layer 40a is attached from the pressure-sensitive adhesive layer subjected to the plasma treatment (pressure-sensitive adhesive layer 20Aa) (picking-up process, refer to Figure 3 (e)); and a process of bonding the semiconductor element 60 with adhesive layer to the support substrate 80 for semiconductor element mounting via the adhesive layer 40a (semiconductor element bonding process, refer to Figure 3 (f)).

[0071] <Wafer Laminating Process>

[0072] First, the dicing-adhering integrated tape 130 is arranged in a prescribed device. Next, the dicing-adhering integrated tape 130 is adhered to the main surface Ws of the semiconductor wafer W via the adhesive layer 40 (refer to Figure 3 (a), Figure 3 (b)). The circuit surface of the semiconductor wafer W is preferably provided on the side opposite to the main surface Ws.

[0073] <Dicing Process>

[0074] Next, the semiconductor wafer W, the adhesive layer 40, and the pressure-sensitive adhesive layer 20A after plasma treatment are diced (refer to Figure 3 (c)). At this time, a part of the substrate 10 can also be diced. In this way, the dicing-adhering integrated tape 130 also functions as a dicing sheet.

[0075] <Ultraviolet Ray Irradiation Process>

[0076] The pressure-sensitive adhesive layer 20A after plasma treatment can be irradiated with ultraviolet rays (via the substrate 10) as necessary (refer to Figure 3 (d)). In the case where the base resin in the pressure-sensitive adhesive component is a resin that is cured by ultraviolet rays (ultraviolet ray-curable base resin), the pressure-sensitive adhesive layer 20A is cured, and thus the bond force between the pressure-sensitive adhesive layer 20A and the adhesive layer 40 can be reduced. In the ultraviolet ray irradiation, ultraviolet rays having a wavelength of 200 to 400 nm are preferably used. As for the ultraviolet ray irradiation conditions, the irradiance and the irradiation amount are preferably adjusted to 30 to 240 mW / cm 2in the range of 200 to 500 mJ / cm 2 in the range of 200 to 500 mJ / cm

[0077] <Picking-up process>

[0078] Next, the cut adhesive-layer-attached semiconductor elements 60 are separated from each other by expanding the substrate 10, and the adhesive-layer-attached semiconductor elements 60 lifted by the rollers 72 from the substrate 10 side are picked up from the pressure-sensitive adhesive layer 20Aa by suction using the suction collets 74 (refer to Figure 3 (e)). In the case where a part of the surface of the side opposite to the substrate 10 of the pressure-sensitive adhesive layer 20 is subjected to the plasma treatment, the surface of the side of the adhesive layer 40a of the pressure-sensitive adhesive layer 20Aa can be the surface subjected to the plasma treatment, can be the surface not subjected to the plasma treatment, or can be the surface including both the surface subjected to the plasma treatment and the surface not subjected to the plasma treatment. In addition, the adhesive-layer-attached semiconductor element 60 has the semiconductor element Wa and the adhesive layer 40a. The semiconductor element Wa is an element obtained by dividing the semiconductor wafer W by cutting, and the adhesive layer 40a is a layer obtained by dividing the adhesive layer 40 by cutting. The pressure-sensitive adhesive layer 20Aa is a layer obtained by dividing the pressure-sensitive adhesive layer 20A subjected to the plasma treatment by cutting. The pressure-sensitive adhesive layer 20Aa can remain on the substrate 10 when the adhesive-layer-attached semiconductor element 60 is picked up. In the picking-up process, it is not necessarily required to expand the substrate 10, but by expanding the substrate 10, the pickability can be further improved.

[0079] The lift amount by the rollers 72 can be appropriately set. Also, from the viewpoint of ensuring sufficient pickability even for an extremely thin wafer, for example, two-stage or three-stage lifting can be performed. Also, the adhesive-layer-attached semiconductor element 60 can be picked up by a method other than the method using the suction collets 74.

[0080] <Semiconductor element bonding process>

[0081] After the adhesive-layer-attached semiconductor elements 60 are picked up, the adhesive-layer-attached semiconductor elements 60 are bonded to the semiconductor element mounting support substrate 80 via the adhesive layers 40a by thermocompression bonding (refer to Figure 4 (f)). A plurality of adhesive-layer-attached semiconductor elements 60 can be bonded to the semiconductor element mounting support substrate 80.

[0082] The manufacturing method of the semiconductor device according to the present embodiment can further include, as necessary, a step of electrically connecting the semiconductor element Wa and the semiconductor element mounting support substrate 80 by wire bonding 70, and a step of resin-sealing the semiconductor element Wa on the surface 80a of the semiconductor element mounting support substrate 80 using a resin sealing material 92.

[0083] Figure 4 FIG. 1 is a cross-sectional view schematically showing an embodiment of a semiconductor device. ​ The semiconductor device 200 shown in the drawing can be manufactured by implementing the above-described steps. The semiconductor device 200 can also be formed with solder balls 94 on the side of the semiconductor element mounting support substrate 80 opposite the surface 80a, for electrical connection with an external substrate (motherboard).

[0084] [Method for treating pressure-sensitive adhesive]

[0085] The method for treating a pressure-sensitive adhesive according to an embodiment includes a step of subjecting a pressure-sensitive adhesive to plasma treatment. The pressure-sensitive adhesive can be the same as the pressure-sensitive adhesive exemplified in the above-described manufacturing method of a pressure-sensitive adhesive sheet. The plasma treatment can be the same as the plasma treatment exemplified in the above-described manufacturing method of a pressure-sensitive adhesive sheet. The plasma treatment can be plasma treatment using atmospheric pressure plasma. The treatment temperature of the plasma treatment can be lower than the melting point of the pressure-sensitive adhesive.

[0086] [Method for fixing adherends]

[0087] The method for fixing adherends according to an embodiment includes a step of adhering a second adherend to a first adherend using a pressure-sensitive adhesive that has been treated by the above-described method. There is no particular limitation on the first adherend and the second adherend, and examples include metal adherends (stainless steel (SUS), aluminum, etc.), non-metal adherends (polycarbonate, glass, etc.), and the like. The fixing conditions of the adherends can be appropriately set according to the type of the pressure-sensitive adhesive, and the types of the first adherend and the second adherend.

[0088] [Method for peeling adherends]

[0089] The peeling method of the adherend according to an embodiment includes a step of peeling the first adherend and the second adherend from each other by bringing at least one of the interface between the first adherend and the pressure-sensitive adhesive or the interface between the second adherend and the pressure-sensitive adhesive, which has been treated by the above method, into contact with water. The pressure-sensitive adhesive subjected to the plasma treatment has a greater hydrophilicity than the pressure-sensitive adhesive not subjected to the plasma treatment, and thus the pressure-sensitive adhesive subjected to the plasma treatment is easily peeled by being treated with water. In addition, the pressure-sensitive adhesive can be attached to either the first adherend or the second adherend or detached from both the first adherend and the second adherend when the first adherend and the second adherend are peeled.

[0090] Examples

[0091] Hereinafter, the present application will be specifically described according to examples, but the present application is not limited to these examples.

[0092] (Example 1)

[0093] [Manufacture of pressure-sensitive adhesive sheet]

[0094] <Preparation of pressure-sensitive adhesive sheet precursor>

[0095] An acrylic resin having a hydroxyl group was obtained by polymerizing 2-ethylhexyl acrylate and methyl methacrylate as monomers and hydroxyethyl acrylate and acrylic acid as functional group-containing monomers according to a solution polymerization method. The acrylic resin having a hydroxyl group had a weight average molecular weight of 400,000 and a glass transition point of -38°C.

[0096] The weight average molecular weight was measured as a polystyrene conversion weight average molecular weight (Mw) using SD-8022 / DP-8020 / RI-8020 manufactured by Tosoh Corporation as a GPC device, a gel pack (Gel pack) GL-A150-S / GL-A160-S manufactured by Hitachi Chemical Co., Ltd. as a column, and tetrahydrofuran as an eluent.

[0097] The glass transition point was calculated by the following relational expression (FOX formula).

[0098] 1 / Tg = Σ (X i / Tg i )

[0099] [In the above expression, Tg represents the glass transition point (K) of the copolymer. X i represents the mass fraction of each monomer, X1+X2+…+X i +…+X n = 1. Tg iGlass transition point (K) of each homopolymer of the monomers

[0100] A three-in-one motor and stirring blade were used to prepare 12 parts by mass of a multifunctional isocyanate crosslinking agent (manufactured by Mitsubishi Chemical Co., Ltd., product name "MITEC NY 730A-T") with respect to 100 parts by mass of the acrylic resin having a hydroxyl group, and stirring was performed, whereby a pressure-sensitive adhesive layer-forming varnish was obtained.

[0101] The obtained pressure-sensitive adhesive layer-forming varnish was applied to a substrate film A (polyethylene terephthalate film having a thickness of 38 μm) using an applicator in such a manner that the thickness of the pressure-sensitive adhesive layer became 10 μm while adjusting the gap. After the applied pressure-sensitive adhesive layer-forming varnish was dried at 80°C for 5 minutes, a substrate film B (polyolefin-based film having a thickness of 80 μm) on which a corona treatment had been performed on the surface was laminated to the pressure-sensitive adhesive layer, and was left to stand at room temperature (25°C) for 2 weeks to sufficiently perform aging treatment, whereby a pressure-sensitive adhesive sheet precursor having a structure of substrate film A / pressure-sensitive adhesive layer / substrate film B was obtained.

[0102] <Plasma treatment>

[0103] The substrate film A of the pressure-sensitive adhesive sheet precursor was peeled off, and a super-high-density atmospheric pressure plasma unit (manufactured by Fuji Machine Mfg. Co., Ltd., product name: FPB-20 TYPE II) was used to perform plasma treatment on the surface of the pressure-sensitive adhesive layer in the pressure-sensitive adhesive sheet precursor on the side opposite to the substrate film B, whereby a pressure-sensitive adhesive sheet was produced. Then, a protective material (polyethylene terephthalate (PET) film) was disposed on the surface of the pressure-sensitive adhesive layer on which the plasma treatment had been performed, whereby a pressure-sensitive adhesive sheet with a protective material of Example 1 was obtained.

[0104] (Conditions of plasma treatment)

[0105] Use of a heater: not used

[0106] Irradiation speed: 500 mm / sec

[0107] Irradiation distance: 5 mm

[0108] Slit nozzle: 20 mm wide

[0109] Gas used: nitrogen and air

[0110] Gas flow rate: nitrogen 60 L / min, air 21 L / min

[0111] Number of repetitions: once (irradiation method: 20 mm wide x 8 lines)

[0112] Sample size: 150 mm x 150 mm

[0113] In addition, the irradiation distance, the irradiation speed, the heater setting, and the like were adjusted, and the processing temperature was set to be 100°C or lower in a manner so as to avoid generation of wrinkles, flexure, and the like in the pressure-sensitive adhesive sheet precursor 100 (the base material 10 and the pressure-sensitive adhesive layer 20) during processing.

[0114] (Example 2)

[0115] The surface of the pressure-sensitive adhesive layer side of the protective material was subjected to the same plasma treatment as that performed on the pressure-sensitive adhesive layer (number of repetitions: 1 time), and otherwise, in the same manner as in Example 1, a pressure-sensitive adhesive sheet with a protective material of Example 2 was obtained.

[0116] (Example 3)

[0117] The number of repetitions of the plasma treatment of the protective material was changed from 1 time to 4 times, and otherwise, in the same manner as in Example 2, a pressure-sensitive adhesive sheet with a protective material of Example 3 was obtained.

[0118] (Example 4)

[0119] The number of repetitions of the plasma treatment of the pressure-sensitive adhesive layer was changed from 1 time to 4 times, and otherwise, in the same manner as in Example 1, a pressure-sensitive adhesive sheet with a protective material of Example 2 was obtained.

[0120] (Example 5)

[0121] The surface of the pressure-sensitive adhesive layer side of the protective material was subjected to the same plasma treatment as that performed on the pressure-sensitive adhesive layer (number of repetitions: 1 time), and otherwise, in the same manner as in Example 4, a pressure-sensitive adhesive sheet with a protective material of Example 5 was obtained.

[0122] (Example 6)

[0123] The number of repetitions of the plasma treatment of the protective material was changed from 1 time to 4 times, and otherwise, in the same manner as in Example 5, a pressure-sensitive adhesive sheet with a protective material of Example 6 was obtained.

[0124] (Comparative Example 1)

[0125] The pressure-sensitive adhesive layer was not subjected to plasma treatment, and otherwise, in the same manner as in Example 1, a pressure-sensitive adhesive sheet with a protective material of Comparative Example 1 was obtained.

[0126] [Evaluation]

[0127] Measurement of the contact angle of water with respect to the surface of the pressure-sensitive adhesive layer on which plasma treatment has been performed

[0128] The contact angle of water with respect to the plasma-treated surface of the pressure-sensitive adhesive sheet with a protective material of Examples 1 to 6 and Comparative Example 1 was measured. In the measurement, a contact angle meter (manufactured by KOSÉ INTERFACE SCIENCE Co., Ltd., product name: Drop Master 300) was used. The measurement was performed by peeling the protective material of the pressure-sensitive adhesive sheet with a protective material and dropping water as a probe liquid on the plasma-treated surface of the pressure-sensitive adhesive layer. As to the measurement conditions, the temperature was set to 23 to 28°C, the amount of the droplet of the probe liquid was set to 1.5 μL, and the timing of measurement was set to 5 seconds after the dropping of the probe liquid. The number of trials in the measurement was set to 10, and the median of the values obtained was taken as the contact angle θ. The results are shown in Table 1.

[0129] [Table 1]

[0130]

[0131] Measurement of the peel strength of the pressure-sensitive adhesive layer from the SUS substrate

[0132] The pressure-sensitive adhesive sheet with a protective material of Example 1, Example 2, and Comparative Example 1 was cut into a width of 10 mm and a length of 70 mm or more, and the protective material was peeled from the pressure-sensitive adhesive sheet with a protective material and attached to a SUS plate (SUS430BA) as an initial measurement sample. At the time of attachment to the SUS plate, a 3-kg hammer roller was passed over the sample back and forth three times. A release guide tape (manufactured by OJITAC CO., LTD., EC tape) was cut into a width of 10 mm and attached to the front end of the sample by about 10 mm, and fixed to the front end of a load cell. The position of the load cell was finely adjusted so that the progress of peeling was parallel to the tape width. Further, the initial measurement sample was stored in a refrigerator (5°C) for 3 months, and used as a measurement sample after 3 months. The peel strength of the SUS substrate from the pressure-sensitive adhesive layer was measured at a peel angle of 30 degrees and a peel speed of 50 mm / minute, and the peel strength was calculated. In addition, the SUS substrate was cleaned with acetone before use. The results are shown in Table 2. In addition, the values in Table 2 are relative values with the peel strength of Comparative Example 1 as a reference.

[0133] [Table 2]

[0134]

[0135] It is presumed that the same effects can be obtained when, instead of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet with a protective material of Examples 1 to 6, a pressure-sensitive adhesive layer using, for example, another acrylic resin, a synthetic rubber, a natural rubber, a polyimide resin, or the like as a base resin is used.

[0136] In the pressure-sensitive adhesive sheet with a protective material of Examples 1 to 6, the contact angle of the surface of the pressure-sensitive adhesive layer to which plasma treatment was performed was reduced, and the wettability of the pressure-sensitive adhesive layer was improved, as compared with the pressure-sensitive adhesive sheet with a protective material of Comparative Example 1. Also, the peel strength and the adhesive force of the pressure-sensitive adhesive sheet with a protective material of Examples 1 and 2 were improved, as compared with the pressure-sensitive adhesive sheet with a protective material of Comparative Example 1. Also, it was found from the comparison between Example 1 and Example 2 that the effect of plasma treatment was maintained for a long period of time by performing plasma treatment on the protective material. From these results, it was confirmed that the manufacturing method of the present application can manufacture a pressure-sensitive adhesive sheet having excellent adhesive force.

[0137] Explanation of symbols

[0138] 10 - substrate, 20 - pressure-sensitive adhesive layer, 20A - pressure-sensitive adhesive layer after plasma treatment, 30 - protective material, 40 - adhesive layer, 50 - protective material, 60 - semiconductor element with adhesive layer, 70 - wire bonding, 72 - roll pin, 74 - suction collet, 80 - support substrate for semiconductor element mounting, 92 - resin sealing material, 94 - solder ball, W - semiconductor wafer, 100 - pressure-sensitive adhesive sheet precursor, 110 - pressure-sensitive adhesive sheet, 120 - pressure-sensitive adhesive sheet with protective material, 130 - dicing and die bonding integrated tape, 140 - dicing and die bonding integrated tape with protective material.

Claims

1. A manufacturing method of a dicing-bonding integrated tape, comprising: a first step of preparing a pressure-sensitive adhesive sheet precursor having a substrate and a pressure-sensitive adhesive layer provided on the substrate; a second step of performing plasma treatment on a part or the entire of a surface on the side opposite to the substrate of the pressure-sensitive adhesive layer in the pressure-sensitive adhesive sheet precursor, and obtaining a pressure-sensitive adhesive sheet; and a third step of forming an adhesive layer so as to cover a part or the entire of a treated surface on which the plasma treatment has been performed on the surface on the side opposite to the substrate of the pressure-sensitive adhesive layer in the pressure-sensitive adhesive sheet.

2. The manufacturing method of a dicing-bonding integrated tape according to claim 1, wherein the plasma treatment is plasma treatment using an atmospheric pressure plasma.

3. The manufacturing method of a dicing-bonding integrated tape according to claim 1 or 2, wherein a treatment temperature of the plasma treatment is lower than a temperature of the lower one of a melting point of the substrate or a melting point of the pressure-sensitive adhesive layer.

4. The manufacturing method of a dicing-bonding integrated tape according to claim 1 or 2, further comprising, between the second step and the third step: a step of attaching a protective material on the surface on the side opposite to the substrate of the pressure-sensitive adhesive layer on which the plasma treatment has been performed; and a step of peeling the protective material from the pressure-sensitive adhesive layer on which the plasma treatment has been performed.

5. The manufacturing method of a dicing-bonding integrated tape according to claim 4, wherein a surface of the protective material attached to the side of the pressure-sensitive adhesive layer on which the plasma treatment has been performed has been treated by plasma treatment. the pressure-sensitive adhesive layer is a layer composed of a pressure-sensitive adhesive component containing an acrylic resin having a hydroxyl group and a crosslinking agent having an isocyanate group.

7. A manufacturing method of a semiconductor device, comprising: a step of attaching the adhesive layer of the dicing-bonding integrated tape obtained by the manufacturing method according to any one of claims 1 to 6 to a semiconductor wafer; a step of singulating the semiconductor wafer, the adhesive layer, and the pressure-sensitive adhesive layer on which the plasma treatment has been performed; a step of picking up a semiconductor element to which the adhesive layer is attached from the pressure-sensitive adhesive layer on which the plasma treatment has been performed; and a step of bonding the semiconductor element to a support substrate for mounting a semiconductor element via the adhesive layer.

8. The manufacturing method of a semiconductor device according to claim 7, wherein the semiconductor element is a semiconductor element having a plurality of semiconductor chips, and the semiconductor element is picked up from the pressure-sensitive adhesive layer on which the plasma treatment has been performed by separating the semiconductor element from the pressure-sensitive adhesive layer on which the plasma treatment has been performed. ​ ​ ​ ​ ​ ​ 6. The manufacturing method of a wafer-bonded die-tape according to claim 1 or 2, wherein ​ ​ ​ ​ ​ ​

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