Load lock module

By setting a gas barrier in the loading locking module, the pressure conversion gas is prevented from being directly sprayed onto the substrate, thus solving the problems of substrate vibration and low productivity, and achieving faster pressure conversion and higher productivity.

CN116230600BActive Publication Date: 2026-05-29WONIK IPS CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
WONIK IPS CO LTD
Filing Date
2022-09-14
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

In the existing technology, the slow pressure conversion speed during substrate processing leads to substrate vibration and damage, affecting productivity, especially when processing large-scale substrates and multiple substrates.

Method used

A gas barrier is provided in the loading locking module to prevent the pressure conversion gas from being directly injected onto the substrate. The pressure conversion speed is accelerated by increasing the gas injection pressure. A combination structure of a gas injection section and a gas barrier is used.

Benefits of technology

It effectively prevents substrate vibration and damage, shortens pressure conversion time, and improves substrate processing speed and productivity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present specification relates to an invention of substrate processing, and more particularly, to a load lock module for temporarily loading a substrate, including: a chamber (100) forming at least one sealed internal space (S); a substrate support portion (150) disposed in the internal space (S) and supporting a substrate (10); a gas injection portion (140) disposed in the chamber (100) and injecting a pressure conversion gas into the internal space (S); and a gas blocking portion (200) preventing the pressure conversion gas injected from the gas injection portion (140) from being directly injected into the substrate (10) mounted on the substrate support portion (150).
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Description

Technical Field

[0001] This invention relates to a substrate processing method, and more specifically, to a load lock module for temporary loading of a substrate. Background Technology

[0002] Semiconductors such as memory devices and non-memory devices, liquid crystal displays, OLED panels, and solar cell panels are all manufactured through substrate processing processes such as etching and deposition.

[0003] Furthermore, the substrate processing process is performed by a substrate processing system including a process module for performing the substrate processing process, a loading and locking module for introducing and removing the substrate to the process module, and an unloading and locking module.

[0004] Here, the loading locking module and the unloading locking module can be composed of a single module or a separate independent module depending on the substrate's insertion and removal positions. The loading locking module and the unloading locking module are essentially the same or similar in their configuration, so for convenience, they are collectively referred to as the loading locking module.

[0005] Furthermore, the substrate processing system, depending on whether it has a transfer module for transferring substrates to the process module, and the number and settings of the process module, can be either an inner-line type or a cluster type. The process module, transfer module, and loading locking module include cavities, which form a preset pressure environment.

[0006] In addition, the loading / unloading locking module is a module that is used to import or remove the substrate between process modules or transfer modules at a pressure lower than the external atmospheric pressure, i.e., at the process pressure. It requires a corresponding pressure conversion between atmospheric pressure and process pressure.

[0007] At this point, the pressure is typically converted from process pressure to atmospheric pressure by injecting gases such as nitrogen into the cavity. Furthermore, minimizing the pressure conversion time is crucial to increasing the process speed.

[0008] However, when gas is injected into the cavity at high pressure to increase the pressure switching speed, the flow of gas will cause the substrate to vibrate, which in turn will damage the substrate.

[0009] Therefore, the pressure switching speed is limited, that is, the gas injection pressure is limited, which in turn increases the pressure switching time, resulting in a decrease in substrate processing speed and ultimately a decrease in productivity.

[0010] In particular, the trend towards larger substrate sizes, such as those used in LCD and OLED displays, and the increasing size of individual modules' cavities to process multiple substrates within a single chamber, exacerbates these problems. This leads to an increase in the volume of the pressure conversion chamber, which in turn increases the pressure conversion time.

[0011] (Patent Document 1) KR 10-1703767B1

[0012] (Patent Document 2) KR 10-1713630B1 Summary of the Invention

[0013] Technical issues

[0014] The purpose of this invention is to provide a loading locking module to solve the above-mentioned technical problems. By providing a gas blocking part, the pressure conversion gas is not directly sprayed onto the substrate. By increasing the injection pressure of the pressure conversion gas, the pressure conversion speed is accelerated, thereby enhancing the substrate processing speed.

[0015] Problem-solving methods

[0016] The purpose of this invention is to solve the aforementioned problems. This invention discloses a loading locking module, characterized in that it includes: a cavity 100 forming at least one sealed internal space S; a substrate support portion 150 disposed in the internal space S and supporting a substrate 10; a gas injection portion 140 disposed in the cavity 100 and injecting pressure conversion gas into the internal space S; and a gas blocking portion 200 to prevent the pressure conversion gas injected by the gas injection portion 140 from being directly injected onto the substrate 10 mounted on the substrate support portion 150.

[0017] The gas injection unit 140 can be disposed on the side wall of the cavity 100.

[0018] The gas injection section 140 may include: a gas supply pipe 141, which is disposed through the cavity 100; and a diffuser section 142, which is parallel to the inner wall of the cavity 100 and connected to the gas supply pipe 141.

[0019] The diffuser section 142 described above has a shape of an air cylinder formed by a plurality of gas injection holes 143 on its side.

[0020] One end of the aforementioned air cylinder is connected to the aforementioned gas supply pipe 141, and the other end of the aforementioned air cylinder has a sealed structure, which can spray the aforementioned pressure conversion gas only onto the side formed by the aforementioned gas injection hole 143.

[0021] The height of the diffuser section 142 is set lower than the height of the substrate 10 mounted on the substrate support section 150.

[0022] The gas barrier portion 200 can be arranged parallel to the inner wall of the cavity 100, and the length of the gas barrier portion 200 in the horizontal direction is longer than the length of the diffuser portion 142 in the horizontal direction.

[0023] The gas barrier portion 200 may be composed of a flat plate component and includes: a fixed connection portion 210 for directly or indirectly fixing the cavity 100; and barrier portions 220 and 230 extending from the fixed connection portion 210 to prevent the pressure conversion gas from being directly sprayed onto the substrate 10 mounted on the substrate support portion 150.

[0024] The aforementioned barrier portions 220 and 230 may include: a first barrier portion 230 extending upward from the aforementioned fixed connection portion 210 to the height of the substrate 10 mounted on the aforementioned substrate support portion 150; and a second barrier portion 220 extending from the aforementioned first barrier portion 230, allowing the aforementioned pressure conversion gas to flow upward with reference to the surface of the substrate 10 mounted on the aforementioned substrate support portion 150.

[0025] The second blocking portion 220 may extend from the first blocking portion 230 and form a structure inclined toward the gas injection portion 140.

[0026] The aforementioned fixed coupling portion 210 is fixedly coupled to the bottom surface of the aforementioned internal space (S), or coupled to the side surface of the aforementioned substrate support portion 150.

[0027] The cavity 100 may include a pair of internal spaces S arranged vertically.

[0028] The cavity 100 may include: a cavity body 110, forming a pair of internal spaces S in the vertical direction, and forming at least one gate 113 on its side; and an upper lead 120 and a lower lead 130, which are detachably connected to the upper opening and the lower opening of the cavity body 110, respectively, and can seal the pair of internal spaces S.

[0029] The cavity body 110 may include: a partition plate 114 that separates the pair of internal spaces S; and at least one side wall portion that is attached to the partition plate 114 and forms a side wall of the internal space S; and the upper lead wire 120 and the lower lead wire 130 that are detachably attached to the upper opening and the lower opening formed by the attachment of the partition plate 114 and the side wall portion.

[0030] The aforementioned sidewall portion may be coupled to a protruding detachable joint portion 118 on its inner side, which can respectively support the edge positions of the upper lead wire 120 and the lower lead wire 130.

[0031] The substrate support portion 150 may include a plurality of support pins that protrude upward from the bottom surface of the internal space S.

[0032] The aforementioned substrate support portion 150 may include: a pin base portion 152 disposed on the bottom surface of the internal space S; and at least one support column 151 having a relatively small support surface and disposed on the aforementioned pin base portion 152.

[0033] Invention Effects

[0034] The loading and locking module of the present invention has a gas barrier to prevent pressure conversion gas from being directly sprayed onto the substrate. Furthermore, by injecting pressure conversion gas to increase pressure, the pressure conversion speed within the internal space is accelerated, thereby increasing the substrate processing speed, offering this advantage.

[0035] In particular, the loading locking module of the present invention provides a gas barrier to prevent the pressure conversion gas from being directly sprayed onto the substrate. In order to ensure that the substrate can be processed over a large area, even if the internal space is increased, the injection pressure of the pressure conversion gas is increased, thereby preventing the pressure conversion time from increasing and thus reducing the processing time. Ultimately, the productivity of substrate processing can be greatly improved.

[0036] Specifically, to minimize the gas injection time, it is necessary to increase the injection pressure of the pressure conversion gas. The loading locking module according to the present invention prevents the pressure conversion gas from being directly sprayed onto the substrate by providing a gas barrier. Even with the increased injection pressure of the pressure conversion gas, substrate vibration or damage can be prevented, thereby improving the process yield. Simultaneously, by minimizing the pressure conversion time, process time is reduced, and substrate processing productivity is significantly improved. Attached Figure Description

[0037] Figure 1 This is a cross-sectional view showing an embodiment of the cavity of the present invention.

[0038] Figure 2a yes Figure 1 The enlarged cross-sectional view of part A is shown in the image.

[0039] Figure 2b It is shown Figure 2a A cross-sectional view of the diffuser section of the gas jet section shown.

[0040] Figure 3 It is along Figure 1 Cross-sectional view in the middle III-III direction.

[0041] Figure 4a and Figure 4b These are perspective views and partially exploded perspective views illustrating different embodiments of the cavity of the present invention.

[0042] Figure 5a It is along Figure 4a Cross-sectional view in the V-V direction. Figure 5b yes Figure 5a The enlarged cross-sectional view of part B.

[0043] Figure 6 It is a diagram. Figure 5a A cross-sectional view of a deformed gas barrier section.

[0044] (Explanation of reference numerals in the attached diagram)

[0045] 10: Substrate 100: Cavity

[0046] S: Internal space 140: Gas injection section

[0047] 150: Substrate support portion; 200: Gas barrier portion Detailed Implementation

[0048] The loading locking module of the present invention will now be described in detail with reference to the accompanying drawings.

[0049] According to the loading locking module of the present invention, such as Figures 1 to 6 As shown, it includes: a cavity 100 forming one or more sealed internal spaces S; a substrate support portion 150 mounted on the internal space S for supporting a substrate 10; a gas injection portion 140 mounted on the cavity 100 for injecting pressure conversion gas into the internal space S; and a gas blocking portion 200 for preventing the pressure conversion gas injected from the gas injection portion 140 from being directly injected onto the substrate 10 disposed on the substrate support portion 150.

[0050] The loading and locking module of the present invention described herein, such as in Patent Document 1 and Patent Document 2, is applicable to any module that can perform pressure conversion, such as a loading and locking module, unloading and locking module, or buffer module, which is part of a substrate processing system capable of substrate processing.

[0051] The aforementioned loading and locking module introduces the substrate from the external atmospheric pressure environment to the process vacuum pressure environment. Compared with atmospheric pressure, vacuum pressure is much lower. In performing the loading and locking function, or in addition to the loading and locking function, it can also simultaneously perform the removal function of removing the substrate after the substrate has been processed to the outside - that is, the unloading and locking function.

[0052] In addition, the cavity 100 can provide a gas supply system and an exhaust system to achieve pressure conversion between atmospheric pressure and process pressure.

[0053] The aforementioned gas supply system and exhaust system can control the pressure of the internal space S of cavity 100 by injecting and discharging pressure-converting gas, thus forming the basic structure of various systems.

[0054] As an example, the gas supply system described above can be a structure for injecting pressure-converting gases such as nitrogen into the internal space S of the cavity 100, and may include the gas injection unit 140 described later.

[0055] Furthermore, the aforementioned exhaust system may be configured according to the magnitude of the process pressure, including: at least one vacuum pump; an exhaust pipe (not shown) connected to an exhaust port (not shown) formed on the cavity 100 and the vacuum pump; and an exhaust valve (not shown) combined with the exhaust pipe and performing opening and closing operations.

[0056] The aforementioned unloading lock module performs the opposite function of the loading lock function, namely, the unloading lock function, and essentially has the same or similar structure as the loading lock module. In this sense, as long as the loading lock function and the unloading lock function are essentially the same, they can be collectively referred to as the loading lock module.

[0057] Furthermore, the aforementioned loading locking module and unloading locking module can be configured as a single module structure forming two vertically arranged internal spaces, as follows: Figure 1 And the embodiment shown in Figure 2, or Figures 4a to 5a The same settings are applied as in the illustrated embodiment.

[0058] The cavity 100 described above, as a structure that forms one or more sealed internal spaces S, can have a variety of structures.

[0059] As an embodiment of forming a single internal space S, the cavity 100 includes: a cavity body 110 forming a closed internal space S and having openings on the upper and / or lower sides; and an upper lead 120 and / or a lower lead 130 detachably connected to the upper and / or lower openings of the cavity body 110.

[0060] For reference, the aforementioned cavity 100 can be understood as being in Figure 1 or Figure 4a In the structure, the internal space S on the upper or lower side is formed as a single structure.

[0061] On the other hand, the cavity 100 may include a plurality of vertically arranged internal spaces S, such as a pair of vertically arranged internal spaces S, in order to quickly perform the substrate import and / or removal functions.

[0062] In the first embodiment of a pair of internal spaces S arranged vertically, the cavity 100 is as follows: Figures 1 to 3As shown, it may include: a cavity body 110 forming a pair of internal spaces S arranged vertically, and at least one gate 113 formed on the side; and an upper lead 120 and a lower lead 130, wherein the upper opening and the lower opening of the cavity body 110 can be disassembled and joined together to seal the pair of internal spaces S.

[0063] The cavity body 110, having a structure that forms a pair of internal spaces S arranged vertically and vertically and one or more gates 113 formed on the side, can have a variety of shapes and structures.

[0064] For example, the cavity body 110 may be composed of a partition plate 114 that divides the pair of internal spaces S vertically and vertically, and a side wall portion 119 that is integrally formed by welding to the edge of the partition plate 114.

[0065] When the planar shape of the cavity body 110 is rectangular, the aforementioned side wall portion 119 may be composed of a front side wall portion and a rear side wall portion formed by the gate 113 respectively, and the two are arranged opposite to each other; and a pair of side side wall portions connecting the front side wall portion and the rear side wall portion.

[0066] The aforementioned upper lead 120 and lower lead 130 are structures that can be detachably connected to the upper opening and lower opening of the cavity body 110, respectively, and can also seal the pair of internal spaces S, and can have various morphological structures.

[0067] As an example, the upper and lower openings of the cavity body 110 can form stepped support portions 119a corresponding to the planar shapes of the upper lead 120 and the lower lead 130, and an O-ring 119b is inserted into the stepped support portion 119a to combine with the upper lead 120 or the lower lead 130.

[0068] As a second embodiment having a pair of internal spaces S arranged vertically, the cavity 100 described above is as follows: Figures 4a to 5b As shown, unlike the structure of the first embodiment, namely the structure of the side wall portion 119 which is integrally formed with the partition plate 114, the partition plate 114 and the side wall portions 115, 116, 117 of the cavity body 110 are composed of plate-shaped structural components and are joined together by welding.

[0069] The aforementioned partition plate 114 is a structure that divides the aforementioned pair of internal spaces S, and can be composed of various structures such as single-layer plates and multi-layer plates.

[0070] The aforementioned sidewall portions 115, 116, and 117 may be composed of one or more sidewall plates that are attached to the aforementioned partition plate 114 and form the sidewall of the aforementioned internal space S.

[0071] As an example, when the planar shape of the partition plate 114 is rectangular, the sidewall portions 115, 116, and 117 can be formed by the front sidewall portion 115 and the rear sidewall portion 116 formed by the gate 113 and disposed opposite to each other; and the side sidewall portion 117 connecting the front sidewall portion 115 and the rear sidewall portion 116.

[0072] In this embodiment, the front sidewall 115, rear sidewall 116, side sidewall 117 and partition plate 114 are preferably formed into an integrated structure by welding.

[0073] In addition, the aforementioned upper lead 120 and lower lead 130 are detachably connected to the upper opening and lower opening formed by the combination of the partition plate 114 and the aforementioned side wall portions 115, 116, 117.

[0074] For this purpose, the aforementioned sidewall portions 115, 116, and 117 form a pair of protruding detachable joint portions 118 on their inner surfaces to support the edges of the upper lead 120 and the lower lead 130, respectively.

[0075] In this embodiment, the pair of detachable joints 118 form the upper and lower openings of the cavity body 110, and are welded to the side wall portions 115, 116, 117 on the upper and lower sides.

[0076] Furthermore, the aforementioned detachable joint 118 can form a stepped support 118a corresponding to the planar shape of the aforementioned upper lead 120 and lower lead 130. An O-ring 118b is inserted into the aforementioned stepped support 118a, which can be combined with the aforementioned upper lead 120 or lower lead 130.

[0077] The aforementioned multiple substrate support portions 150, as structures installed on the aforementioned internal space S for supporting the substrate 10, can have various structural forms.

[0078] For example, the aforementioned plurality of substrate support portions 150 may be provided or formed protruding upward from the bottom surface within the internal space S.

[0079] At this time, as Figure 3 As shown, when the substrate 10 is introduced and removed, the plurality of substrate support portions 150 can be arranged with appropriate spacing and corresponding positions in the internal space S by utilizing a transfer robot and / or the end effector of the transfer robot (not shown).

[0080] Furthermore, in order to minimize the support portion of the support substrate 10, the aforementioned plurality of substrate support portions 150 may include: a pin base 152 disposed on the bottom surface of the internal space S; and at least one support post 151, with a relatively small support surface disposed on the aforementioned pin base 152.

[0081] The aforementioned pin base 152, as a structure installed on the bottom surface of the internal space S and having at least one or more support columns 151, can have various structural forms.

[0082] In particular, when the aforementioned pin base 152 is integrally formed with the bottom surface of the internal space S, i.e. the upper surface of the partition plate 114 and / or the lower lead wire 130, or is joined together by welding or other means, the structural rigidity of the partition plate 114 and / or the lower lead wire 130 can be further enhanced.

[0083] Therefore, multiple pin bases 152 can be provided, and they can maintain a long parallel structure with each other.

[0084] For example, such as Figure 3 As shown in the content, when the planar shape of the mounting locking module is rectangular, the aforementioned pin base 152 can extend from the side forming the gate 113 to the opposite side to form a longer structure.

[0085] In addition, such as Figure 3 As shown in the content, the aforementioned plurality of pin bases 152 can be provided with a fixed width along the length direction, that is, in the X-axis direction perpendicular to the Y-axis direction.

[0086] For example, the plurality of pin bases 152 may include: a pair of first pin bases located at the edge and having a first width; and a pair of second pin bases located between the pair of first pin bases and having a second width greater than the first width.

[0087] At this point, it is preferable that the spacing between the first pin base and the second pin base relative to the adjacent pin base should be constant.

[0088] Furthermore, the space between the aforementioned plurality of pin bases 152 is used as a movement space for the transfer robot and / or the end effector of the transfer robot.

[0089] As described above, when the pin base 152 forms multiple strip structures in a parallel state, the pressure conversion time can be reduced by decreasing the volume of the internal space S. It can also prevent the cavity 100 from deforming during the pressure conversion of the internal space S, i.e., the pressure conversion between atmospheric pressure and process pressure, and can play a certain supplementary and auxiliary role.

[0090] In addition, the aforementioned multiple substrate support portions 150 may have a combination structure of pin base portion 152 and support column 151, and may also be provided with multiple support pins (not shown). This structure is a structure that protrudes towards the bottom surface of the internal space S.

[0091] The gas injection unit 140 described above is a structure provided on the cavity 100 and injects pressure-converting gas into the internal space S. Various structures can be provided according to different injection methods.

[0092] Here, the aforementioned pressure conversion gas is a gas injected into the internal space S of the cavity 100 to convert the pressure of the internal space S of the cavity 100 from the process pressure to atmospheric pressure. It is preferable to use inert gases such as nitrogen or argon that do not affect the substrate 10.

[0093] Furthermore, the gas injection section 140 is preferably provided on the side wall of the cavity 100.

[0094] When the gas jet 140 is installed on the upper side of the substrate support 150, the height of the internal space S increases by the same amount as the installation height of the gas jet 140. As the height of the internal space S increases, the volume of the internal space S increases, and the pressure switching time also increases accordingly. This further increases the internal vacuum pressure. In order to withstand the excessive pressure, the thickness of the cavity 100 also increases, which creates new problems.

[0095] Furthermore, the gas injection unit 140 may include: a gas supply pipe 141 that penetrates the cavity 100; and a diffuser unit 142 that connects to the gas supply pipe 141 to inject pressure-converted gas into the interior space S.

[0096] The gas supply pipe 141 described above serves as a conduit through the cavity 100, particularly through the through hole 111 formed on the side wall. Considering its connection with the diffuser section 142 described later, the portion located inside the side wall is preferably made of a material with rigidity.

[0097] At this time, the gas supply pipe 141 can maintain the internal space S sealed while also penetrating the side wall of the cavity 100.

[0098] The diffuser section 142 is connected to the gas supply pipe 141 and serves as a structure for injecting pressure-converted gas into the internal space S. Depending on the gas injection structure, it can have various structural forms.

[0099] For example, such as Figure 3 The diffuser section 142 shown above can be provided with a structure in the shape of an air cylinder with a plurality of gas injection holes 143 formed on its side.

[0100] At this time, the diffuser section 142 preferably forms gas injection holes 143 only on the side, and its end is a sealed air cylinder-shaped structure.

[0101] That is, the blocked structure of the aforementioned air cylinder is mainly used to prevent gas from being ejected from the end.

[0102] In particular, one end of the aforementioned air cylinder is connected to the aforementioned gas supply pipe 141, and the other end of the aforementioned air cylinder has a blocked structure, and the aforementioned pressure conversion gas is only injected into the side formed by the aforementioned gas injection hole 143.

[0103] This is mainly to prevent the injection pressure of the pressure conversion gas ejected by the diffuser section 142 from falling out of the range that the gas barrier section can control.

[0104] Furthermore, the installation height of the diffuser portion 142 is preferably lower than the height of the substrate 10 provided in the substrate support portion 150.

[0105] In particular, the upper height of the diffuser portion 142 is preferably lower than the height of the substrate 10 provided in the substrate support portion 150.

[0106] Furthermore, the through hole 111 formed on the side wall of the cavity body 110 is used to seal the internal space S by means of a sealing component 112.

[0107] The aforementioned sealing component 112, which is a component that closes the through hole 111 formed on the side wall and is penetrated by the gas supply pipe 141, can have various structural forms.

[0108] Furthermore, to ensure the smooth injection of the pressure-converting gas into the internal space S, the diffuser section 142 is preferably positioned at the midpoint of the vertical height reference of the internal space S. However, in existing loading and locking modules, when the substrate 10 experiences vibration, it is typically positioned at a relatively higher position.

[0109] In this regard, the present invention can prevent direct spraying onto the substrate 10 by installing a gas barrier 200, thereby preventing the substrate 10 from shaking. At the same time, its installation height is relatively lower than that of the substrate 10 installed on the substrate support 150, so that the spray pressure conversion gas can be smoothly sprayed into the internal space S.

[0110] Furthermore, the gas injection unit 140 can be configured in different ways according to the structure and size of the cavity 100, so as to inject pressure-converting gas in the shortest possible time within the internal space S.

[0111] For example, such as Figure 3 As shown, if the internal space S has a rectangular planar shape, the gas injection section 140 can be provided in the central part of a pair of opposite sides.

[0112] In addition, multiple gas injection units 140 can be provided to form a point-symmetric and line-symmetric layout with the center of the rectangle as the reference.

[0113] Furthermore, the gas injection unit 140 described above can be configured such that the numbers set on each side are the same or different from each other, depending on the pressure conversion conditions of the internal space S.

[0114] The gas barrier 200 is a structure designed to prevent the pressure-converted gas ejected from the gas injection section 140 from being directly sprayed onto the substrate 10 mounted on the substrate support section 150, and can have various structural forms.

[0115] In particular, the gas barrier 200 can be configured to prevent pressure-converting gas from being directly injected onto the substrate 10 mounted on the substrate support 150, provided that it has a structure that prevents the gas from being directly injected onto the substrate 10. Figures 1 to 6 The publicly disclosed structure can also be configured into various other structures.

[0116] For example, such as Figures 1 to 6 As shown, the gas barrier 200 is composed of a plate-like structure and includes: a fixed connection 210, which is directly or indirectly fixedly connected to the loading locking module; and barrier portions 220 and 230, which extend from the fixed connection 210 and are used to prevent pressure conversion gas from being directly sprayed onto the substrate 10 mounted on the substrate support 150.

[0117] The aforementioned fixed joint 210 is a structure that directly or indirectly fixes the aforementioned loading locking module, and can have various structural forms.

[0118] The aforementioned fixed connection portion 210 is as follows Figures 5a to 6 As shown, it can be fixedly attached to the bottom surface of the aforementioned internal space S, or as... Figures 1 to 3 As shown, it can be attached to the side of the substrate support portion 150.

[0119] In addition, when the aforementioned fixed joint portion 210 is fixedly joined to the bottom surface of the internal space S, the upper internal space S can be installed on the top of the partition plate 114, for example, while the lower internal space S can be installed on the top of the detachable joint portion 118, or disposed in other suitable locations.

[0120] The aforementioned blocking portions 220 and 230 extend from the aforementioned fixed coupling portion 210 and serve as structures to prevent the aforementioned pressure conversion gas from being directly sprayed onto the substrate 10 mounted on the aforementioned substrate support portion 150. Any other structure is also feasible as long as it can prevent direct spraying onto the substrate 10.

[0121] In particular, the aforementioned blocking portions 220 and 230 do not form holes through which gas can pass, such as perforations. Because they do not have such hole structures, they can prevent gas from being directly injected onto the substrate 10.

[0122] For example, the aforementioned barrier portions 220 and 230 may include: a first barrier portion 230 extending upward from the aforementioned fixed connection portion 210 to the height of the substrate 10 mounted on the aforementioned substrate support portion 150; and a second barrier portion 220 extending from the aforementioned first barrier portion 230, such that the aforementioned pressure conversion gas flows upward with reference to the surface of the substrate 10 mounted on the aforementioned substrate support portion 150.

[0123] The first barrier portion 230, which extends upward from the fixed joint portion 210 to the height of the substrate 10 mounted on the substrate support portion 150, can have various structural forms.

[0124] For example, the first barrier portion 230 extends from the fixed connection portion 210 as an integral or separate component, and is a structure that extends upward to the height of the substrate 10 mounted on the substrate support portion 150, mainly for preventing direct spraying onto the substrate 10 mounted on the substrate support portion 150.

[0125] In this embodiment, the first barrier portion 230 extends upward from the fixed connection portion 210. Its structure can be extended by a stepped structure or a curved structure, and it can have a variety of other structural forms.

[0126] For example, the first barrier portion 230, starting from the bottom surface of the internal space S, extends to the second barrier portion 220, which will be described later, forming a vertical relationship, i.e., forming a 90-degree vertical structure.

[0127] The second barrier portion 220 is a structure that extends from the first cut-off portion 230 and allows the pressure conversion gas to flow upward with reference to the surface of the substrate 10 mounted on the substrate support portion 150. It can have various structural forms.

[0128] In particular, the second barrier portion 220 can be any structure that can extend upward and prevent vibration when the pressure conversion gas is not directly injected into the substrate 10.

[0129] Furthermore, the second barrier portion 220 extends from the first barrier portion 230 and forms a structure that is inclined toward the gas injection portion 140, and can have various structural forms.

[0130] Here, the second barrier portion 220 can be formed into various structures such as planar structure, curved surface structure, and bent structure.

[0131] For example, the second barrier portion 220 described above can be formed into a planar structure that forms a 145° angle with the bottom surface of the internal space S.

[0132] Furthermore, the aforementioned barrier portions 220 and 230 can be any structure capable of preventing direct spraying onto the substrate 10. For example... Figure 6 As shown, at least one cutout 242 can be provided, and the slit opening 241 formed therein allows the gas to flow upward.

[0133] The aforementioned cutout 242, which forms a slit opening 241 and allows the gas to flow upward, can be manufactured by means of stamping or the like.

[0134] In order to prevent gas from being directly sprayed onto the substrate 10 through the slit opening 241, it is preferable that the upper end of the cut portion 242 is higher than the height of the substrate 10 mounted on the substrate support portion 150.

[0135] Furthermore, the installation position of the gas barrier 200 can be set in the position most conducive to pressure conversion within the internal space S of the cavity 100, and the installation position of the gas barrier 200 can also be selected from a suitable position.

[0136] For example, the gas barrier portion 200 is preferably provided on a side wall that can connect the front side wall and the rear side wall formed by the gate 113.

[0137] Furthermore, the aforementioned gas barrier parts 200 are positioned opposite each other.

[0138] Furthermore, the diffuser section 142 of the aforementioned gas injection section 140 is parallel to the side wall of the cavity 100. Taking this into consideration, as... Figure 3 The gas barrier 200 shown above can be installed on the central part C1 of the side wall.

[0139] Furthermore, when the aforementioned gas barrier portions 200 are positioned opposite each other, they can be located at the central portion C1 of the sidewall, or as... Figure 3 As shown, from the top, the cavity 100 can be set up in a point-symmetric manner with the center of the cavity 100 as the reference.

[0140] Furthermore, the horizontal length L of the gas blocking section 200 is preferably longer than the length L3 of the diffuser section 142, so as to effectively block the gas flow ejected from the gas injection section 140, especially the diffuser section 142.

[0141] That is, the length of the gas barrier portion 200 in the horizontal direction is preferably longer than the length of the diffuser portion 142 in the horizontal direction.

[0142] That is, the gas barrier 200 is arranged parallel to the inner wall of the cavity 100, so that the length of the gas barrier 200 in the horizontal direction is longer than that of the diffuser 142 in the horizontal direction.

[0143] For example, the length L of the gas barrier section 200 in the horizontal direction can be about three times the length of the diffuser section 142 in the horizontal direction.

[0144] Regarding the relative positions of the diffuser section 142 and the gas barrier section 200, the distance L2 from the end of the diffuser section 142 to the horizontal end of the gas barrier section 200 is greater than the distance L3 near the gate 113. Figure 3 The distances between L1 and L2 are the same.

[0145] As described above, the gas barrier section 200 has a horizontal length L that is longer than the diffuser section 142 in the horizontal direction. Its purpose is to guide the pressure-converted gas ejected from the high pressure to diffuse along the inner wall of the cavity 100 into the internal space S.

[0146] In addition, when the pressure-converted gas ejected under high pressure diffuses along the inner wall of the cavity 100 into the internal space S, the airflow toward the substrate 10 is reduced as much as possible, thereby minimizing the impact of the gas on the substrate 10.

[0147] In addition, Figure 1 The loading locking module with the above structure shown in Figure 4, including the loading locking part for introducing the substrate and the unloading locking part for removing the substrate, can of course implement the above technical solution in one structure.

[0148] Furthermore, in order to complete the predetermined substrate processing, the cavity based on the present invention can be equipped with all modules that constitute the following structure: a loading locking module or unloading locking module that is isolated from the outside and needs to be able to switch smoothly between atmospheric pressure and process pressure, a transport module that maintains a preset pressure, and a process module that performs a preset process under a predetermined process pressure.

[0149] In addition, Figures 1 to 3 In the structure shown, the gas injection experiment confirmed that even at an injection pressure of 0.5 MPa, the substrate 10 did not exhibit any vibration.

[0150] For reference, in existing technologies, to inject pressure conversion gas without substrate vibration, the injection pressure must be maintained below 0.3 MPa. When the injection pressure reaches 0.3 MPa, it takes 26.7 seconds to reach the preset pressure.

[0151] In response, Figures 1 to 3 In the structure shown, the results of the gas injection experiment are as follows: an injection pressure of 0.5 MPa is feasible until the same pressure is reached, and the time is reduced to 21.1 seconds. The operating time of the cavity is reduced, which can significantly improve productivity.

[0152] In addition, as mentioned above, the aforementioned load locking module may consist of a load locking module that performs either the load locking function or the unload locking function, or all of the load locking modules that can perform the load locking function and the unload locking function.

[0153] The above description only illustrates the preferred embodiments that can be implemented in this invention. Therefore, the scope of the core technology of this invention is not limited to the above embodiments, and all technical ideas of this invention involved in the above description, as well as all technical ideas combined with its core technology, should be understood to be included within the scope of this invention.

Claims

1. A loading locking module, characterized in that, include: The cavity (100) forms at least one sealed internal space (S); A substrate support (150) is disposed in the aforementioned internal space (S) and supports the substrate (10); A gas injection unit (140) is provided in the cavity (100) to inject pressure-converting gas into the internal space (S); and A gas barrier (200) prevents the pressure-converted gas ejected from the gas injection section (140) from being directly ejected onto the substrate (10) mounted on the substrate support section (150). The aforementioned gas barrier (200) is composed of a flat plate component and includes: The fixed connection portion (210) directly or indirectly fixes the cavity (100); and The blocking portions (220, 230) extend from the aforementioned fixed coupling portion (210) to prevent the aforementioned pressure conversion gas from being directly sprayed onto the substrate (10) mounted on the aforementioned substrate support portion (150). The aforementioned blocking portions (220, 230) include: The first barrier portion (230) extends upward from the fixed connection portion (210) to the height of the substrate (10) mounted on the substrate support portion (150). The second barrier portion (220) extends from the first barrier portion (230) and causes the pressure conversion gas to flow upward relative to the surface of the substrate (10) mounted on the substrate support portion (150).

2. The loading locking module according to claim 1, characterized in that, include: The aforementioned gas barrier (200) is provided on the side wall of the gate (113) on which the aforementioned cavity (100) is formed, connecting the front side wall and the rear side wall. The gas barrier (200) is provided in a manner corresponding to the gas injection section (140).

3. The loading locking module according to claim 1, characterized in that, The gas injection section (140) is provided on the side wall of the cavity (100).

4. The loading locking module according to claim 1, characterized in that, The aforementioned gas injection unit (140) includes: A gas supply pipe (141) is provided, penetrating the aforementioned cavity (100); and The diffuser section (142) is parallel to the inner wall of the cavity (100) and connected to the gas supply pipe (141).

5. The loading locking module according to claim 4, characterized in that, The diffuser section (142) described above has a shape of an air cylinder formed by a plurality of gas injection holes (143) on its side.

6. The loading locking module according to claim 5, characterized in that, One end of the aforementioned air cylinder is connected to the aforementioned gas supply pipe (141), and the other end of the aforementioned air cylinder has a sealed structure, which sprays the aforementioned pressure conversion gas only onto the side formed by the aforementioned gas injection hole (143).

7. The loading locking module according to claim 5, characterized in that, The height of the diffuser section (142) is set to be lower than the height of the substrate (10) mounted on the substrate support section (150).

8. The loading locking module according to claim 5, characterized in that, The gas barrier section (200) is arranged parallel to the inner wall of the cavity (100), and the length of the gas barrier section (200) in the horizontal direction is longer than the length of the diffuser section (142) in the horizontal direction.

9. The loading locking module according to claim 1, characterized in that, The second blocking portion (220) extends from the first blocking portion (230) and forms a structure that is inclined toward the gas injection portion (140).

10. The loading locking module according to claim 1, characterized in that, The aforementioned fixed coupling portion (210) is fixedly coupled to the bottom surface of the aforementioned internal space (S) or to the side surface of the aforementioned substrate support portion (150).

11. The loading locking module according to claim 1, characterized in that, The aforementioned cavity (100) includes a pair of internal spaces (S) arranged vertically.

12. The loading locking module according to claim 11, characterized in that, The aforementioned cavity (100) includes: The cavity body (110) forms a pair of internal spaces (S) along the vertical direction, and at least one gate (113) is formed on its side; and The upper lead wire (120) and the lower lead wire (130) are detachably connected to the upper opening and the lower opening of the cavity body (110), respectively, and can seal the pair of internal spaces (S).

13. The loading locking module according to claim 12, characterized in that, The aforementioned cavity body (110) includes: A partition (114) separates the aforementioned pair of internal spaces (S); and At least one sidewall portion is attached to the partition plate (114) and forms the sidewall of the interior space (S); The aforementioned upper lead (120) and lower lead (130) are detachably connected to the upper opening and lower opening formed by the connection between the aforementioned partition plate (114) and the aforementioned side wall portion.

14. The loading locking module according to claim 13, characterized in that, The aforementioned sidewall portion has a protruding detachable joint portion (118) on its inner side surface, which can support the edge positions of the aforementioned upper lead (120) and lower lead (130) respectively.

15. The loading locking module according to claim 1, characterized in that, The aforementioned substrate support portion (150) includes a plurality of support pins that protrude upward from the bottom surface of the aforementioned internal space (S).

16. The loading locking module according to claim 1, characterized in that, The aforementioned substrate support portion (150) includes: The pin base (152) is located on the bottom surface of the internal space (S); At least one support post (151) is disposed on the pin base (152), the support surface of the support post (151) being smaller than the upper surface of the pin base (152).