Micro-electromechanical structure, method of manufacturing and sensor

Abstract

The application discloses a micro-electro-mechanical structure, a manufacturing method thereof and a sensor. The micro-electro-mechanical structure comprises a first vibrating diaphragm, a second vibrating diaphragm, a back electrode plate, a first connecting column and a second connecting column. The first vibrating diaphragm is arranged opposite to the second vibrating diaphragm. The back electrode plate is arranged between the first vibrating diaphragm and the second vibrating diaphragm and can form a first capacitor and a second capacitor with the first vibrating diaphragm and the second vibrating diaphragm respectively. The back electrode plate has a first through hole and a movable area. The movable area can be close to or away from the first vibrating diaphragm. The first vibrating diaphragm is connected to one side of the movable area through the first connecting column, and the second vibrating diaphragm is connected to the other side of the movable area through the second connecting column, so that the first vibrating diaphragm and the second vibrating diaphragm can be linked. The micro-electro-mechanical structure provided by the application can ensure the acoustic-electric performance of the micro-electro-mechanical structure, improve the manufacturing efficiency and reduce the manufacturing cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of micro-electro-mechanical devices, and more particularly, to a micro-electro-mechanical structure, a manufacturing method thereof, and a sensor. BACKGROUND

[0002] Micro-electro-mechanical structures manufactured based on micro-electro-mechanical systems (MEMS) are widely used in fields such as microphones, pressure sensors, sound sensors, and the like. Taking a MEMS microphone as an example, the working principle thereof is that there is a gap between a diaphragm and a back plate. Changes in air pressure will cause the diaphragm to deform, and the capacitance value between the diaphragm and the back plate will change, thereby being converted into an electrical signal output.

[0003] In actual applications, micro-electro-mechanical systems with a double-diaphragm structure are widely used due to their superior electro-acoustic performance, and the vibration consistency of the double-diaphragm structure is particularly important for the electro-acoustic performance. In the prior art, in order to make the vibration consistency of the double-diaphragm structure better, a connecting piece is usually used to directly connect the two diaphragms together through the back plate, but such a structure has a relatively complex process in the manufacturing process, resulting in a relatively high manufacturing cost and being not suitable for mass production. SUMMARY

[0004] An object of the present application is to provide a new technical solution for a micro-electro-mechanical structure, a manufacturing method thereof, and a sensor.

[0005] According to a first aspect of the present application, a micro-electro-mechanical structure is provided, comprising:

[0006] a first diaphragm and a second diaphragm, the first diaphragm and the second diaphragm being arranged opposite to each other;

[0007] a back plate, the back plate being arranged between the first diaphragm and the second diaphragm and being capable of forming a first capacitance and a second capacitance with the first diaphragm and the second diaphragm, respectively; the back plate having a first through hole and a movable region, the movable region being capable of moving closer to or farther away from the first diaphragm;

[0008] a first connecting column and a second connecting column, the first diaphragm being connected to one side of the movable region through the first connecting column, and the second diaphragm being connected to the other side of the movable region through the second connecting column, so that the first diaphragm and the second diaphragm are capable of moving together.

[0009] Optionally, the distance between the connections of the first connecting column and the second connecting column on the movable region is ≤10 μm.

[0010] Optionally, the movable area is provided in plurality, and the first connecting column and the second connecting column are also provided in plurality, and the first connecting column and the second connecting column are one-to-one corresponding.

[0011] Optionally, the movable area is provided in a cantilever beam structure, and the first connecting column and the second connecting column are provided at the free end of the cantilever beam structure.

[0012] Optionally, the first connecting column and the second connecting column are made of insulating material.

[0013] Optionally, the first diaphragm and the second diaphragm are respectively provided with a plurality of second through holes.

[0014] Optionally, the back plate includes a first back electrode and a second back electrode, the first back electrode and the second back electrode are oppositely arranged, and the first back electrode and the second back electrode are fixedly connected through a third connecting column.

[0015] Optionally, the back plate has a first conductive layer and a second conductive layer, the first conductive layer and the first diaphragm form the first capacitor, and the second conductive layer and the second diaphragm form the second capacitor.

[0016] Optionally, the micro-electro-mechanical structure further includes a support column and a substrate.

[0017] The back plate is arranged between the first diaphragm and the second diaphragm through the support column, and the back plate is located on the upper side of the first diaphragm, and the substrate is located on the lower side of the first diaphragm.

[0018] According to the second aspect of the present application, a manufacturing method of a micro-electro-mechanical structure is provided, applied to the micro-electro-mechanical structure of the first aspect, including:

[0019] The first connecting column is fixed on the first diaphragm.

[0020] The second connecting column is fixed on the second diaphragm.

[0021] The movable area of the back plate is fixedly connected with the first diaphragm and the second diaphragm through the first connecting column and the second connecting column.

[0022] According to the third aspect of the present application, a sensor is provided, characterized in that the sensor includes the micro-electro-mechanical structure of the first aspect.

[0023] According to one embodiment of the present application, the present application sets a first connecting column between the first vibrating diaphragm and the movable area of the back electrode plate, and sets a second connecting column between the second vibrating diaphragm and the movable area of the back electrode plate, on one hand, the first vibrating diaphragm and the second vibrating diaphragm can be linked in the vibration process, the vibration consistency is improved, and the sound and electric performance of the micro-electro-mechanical structure is ensured; on the other hand, the manufacturing process difficulty is lower, the manufacturing efficiency is improved, and the manufacturing cost is reduced.

[0024] Other features and advantages of the present application will become apparent from the following detailed description of illustrative embodiments thereof, which proceeds with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0025] The accompanying drawings incorporated in and forming a part of the specification illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0026] Figure 1 It is a single back electrode micro-electro-mechanical structure provided by the present application.

[0027] Figure 2 It is Figure 1 The schematic diagram of the vibrating diaphragm of the micro-electro-mechanical structure provided in the present application is provided with a second through hole.

[0028] Figure 3 It is the connecting schematic diagram of the second connecting column and the back electrode plate provided by the present application.

[0029] Figure 4 It is Figure 3 The top view of the present application.

[0030] Figure 5 It is a double back electrode micro-electro-mechanical structure provided by the present application.

[0031] Figure 6 It is Figure 5 The schematic diagram of the vibrating diaphragm of the micro-electro-mechanical structure provided in the present application is provided with a second through hole.

[0032] Figure 7 It is a micro-electro-mechanical structure provided by the present application, which has a back electrode plate with two layers of conductive layers.

[0033] Figure 8 It is Figure 7 The schematic diagram of the vibrating diaphragm of the micro-electro-mechanical structure provided in the present application is provided with a second through hole.

[0034] Explanation of reference signs:

[0035] 1, first diaphragm; 11, second through hole; 2, second diaphragm; 3, back plate; 31, first back electrode; 32, second back electrode; 33, first conductive layer; 34, second conductive layer; 35, first through hole; 36, movable area; 4, first connecting column; 5, second connecting column; 6, third connecting column; 7, supporting column; 8, substrate. DETAILED DESCRIPTION

[0036] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps, the numerical expressions, and the numerical values set forth in these embodiments are not limiting to the scope of the present application unless otherwise specifically stated.

[0037] The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the scope of the application, its application, or uses.

[0038] Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, the techniques, methods, and devices should be considered part of the specification, if appropriate.

[0039] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary, and not as a limitation. Thus, other examples of exemplary embodiments can have different values.

[0040] It should be noted that like reference numerals and letters refer to like items throughout the drawings, and once an item is defined in one drawing, it need not be discussed further in subsequent drawings.

[0041] As Figures 1 to 8 shown, according to a first aspect of the present application, a micro-electro-mechanical structure is provided, comprising: a first diaphragm 1, a second diaphragm 2, a back plate 3, a first connecting column 4, and a second connecting column 5; the first diaphragm 1 is arranged opposite to the second diaphragm 2; the back plate 3 is arranged between the first diaphragm 1 and the second diaphragm 2, and can form a first capacitance and a second capacitance with the first diaphragm 1 and the second diaphragm 2, respectively; the back plate 3 has a first through hole 35 and a movable area 36, the movable area 36 can be close to or away from the first diaphragm 1; the first diaphragm 1 is connected to one side of the movable area 36 through the first connecting column 4, and the second diaphragm 2 is connected to the other side of the movable area 36 through the second connecting column 5, so that the first diaphragm 1 and the second diaphragm 2 can be linked.

[0042] Specifically, the micro-electro-mechanical structure comprises a first diaphragm 1 and a second diaphragm 2, the first diaphragm 1 and the second diaphragm 2 are oppositely arranged so that a gap is formed therebetween, and a back plate 3 is arranged between the first diaphragm 1 and the second diaphragm 2, i.e. the back plate 3 is arranged in the gap, and the back plate 3 is usually provided with a conductive layer. In actual application, when the first diaphragm 1 and / or the second diaphragm 2 senses a sound signal or a pressure signal and the like to vibrate or deform, the distance between the first diaphragm 1 and the second diaphragm 2 and the back plate 3 changes, so that the first diaphragm 1 and the second diaphragm 2 and the conductive layer on the back plate 3 form a first capacitor and a second capacitor respectively, and the sound signal or the pressure signal and the like can be converted into an electric signal through the change of the capacitance of the first capacitor and the second capacitor. In addition, the first through hole 35 provided on the back plate 3 can balance the air pressure on both sides of the back plate 3 when the first diaphragm 1 and / or the second diaphragm 2 vibrate or deform, further ensuring the acoustic-electric performance of the micro-electro-mechanical structure.

[0043] In the embodiment, with reference to Figures 1 to 4 , the back plate 3 has a movable area 36, which can be understood as having a certain activity function relative to other parts of the back plate 3, i.e. being able to approach or move away from the first diaphragm 1, when approaching the first diaphragm 1, i.e. moving away from the second diaphragm 2, when moving away from the first diaphragm 1, i.e. approaching the second diaphragm 2. The first diaphragm 1 is connected to one side of the movable area 36 through the first connecting column 4, and the second diaphragm 2 is connected to the other side of the movable area 36 through the second connecting column 5, so that the first diaphragm 1 and the second diaphragm 2 can be indirectly connected through the movable area 36 of the back plate 3, and further so that when the first diaphragm 1 and / or the second diaphragm 2 vibrate or deform, the first diaphragm 1 and the second diaphragm 2 can be linked through the connection of the first connecting column 4 and the second connecting column 5, i.e. the vibration or deformation of the first diaphragm 1 and the second diaphragm 2 can be consistent, thereby ensuring the acoustic-electric performance of the micro-electro-mechanical structure of the double-diaphragm structure.

[0044] Further, the first connecting column 4 is arranged to connect the first diaphragm 1 and the back plate 3, and the second connecting column 5 is arranged to connect the second diaphragm 2 and the back plate 3, since the first diaphragm 1 and the second diaphragm 2 usually have the same structure and material characteristics, etc., therefore in the process of manufacturing the micro-electro-mechanical structure, only a plurality of the same diaphragm plus connecting column structure parts need to be manufactured, and then the two diaphragm plus connecting column structure parts are connected to the two sides of the movable area 36 on the back plate 3, thereby avoiding the process problems caused by the need to pass through the back plate 3 to directly connect the two diaphragms in the prior art, such as too high part stacking, or the connecting column passing through the hole provided on the back plate 3 for passing through the connecting column is difficult to align, etc., thereby reducing the process difficulty of the micro-electro-mechanical structure, improving the manufacturing efficiency, and reducing the manufacturing cost.

[0045] In the above structure, the connection of the first connecting column 4 and the second connecting column 5 with the first diaphragm 1, the second diaphragm 2 and the back plate 3 respectively can be realized by a semiconductor process, or can be realized by a bonding process and the like. In addition, the number and the setting position of the two connecting columns can be designed according to actual requirements, and the number of the movable areas 36 matches the number of the connecting columns, which is not limited in the present application.

[0046] Optionally, as shown in Figures 1 to 2 , and Figures 5 to 8 , the distance between the connection positions of the first connecting column 4 and the second connecting column 5 on the movable area 36 is ≤10μm.

[0047] Specifically, in actual application, if the connection positions of the first connecting column 4 and the second connecting column 5 on the movable area 36 are misaligned with each other by too large a distance, the consistency of the first diaphragm 1 and the second diaphragm 2 when vibrating or deforming will be reduced. When the connection positions of the first connecting column 4 and the second connecting column 5 on the movable area 36 are relatively arranged, the consistency of the first diaphragm 1 and the second diaphragm 2 is best, but it will cause the process difficulty to increase in the process, which affects the manufacturing efficiency of the micro-electro-mechanical structure. In the present embodiment, the setting positions of the first connecting column 4 and the second connecting column 5 on the movable area 36 of the back plate 3 are limited to be ≤10μm, that is, the misalignment distance of the first connecting column 4 and the second connecting column 5 is not more than 10μm, which can ensure the consistency of the first diaphragm 1 and the second diaphragm 2 in linkage, and on the other hand, it can further reduce the process difficulty of the micro-electro-mechanical structure and improve the manufacturing efficiency thereof.

[0048] Optionally, as shown in Figures 1 to 2 , and Figures 5 to 8 , a plurality of movable areas are provided, and the number of the first connecting column 4 and the second connecting column 5 respectively matched with the number of the movable areas is also provided, and the setting positions of the plurality of first connecting columns 4 and the plurality of second connecting columns 5 correspond one by one.

[0049] Specifically, in the present embodiment, a plurality of movable areas 36 are provided, and the number of the first connecting column 4 and the second connecting column 5 can be provided in multiple groups, and the setting positions of each group of connecting columns on one movable area 36 correspond, that is, each group of connecting columns is respectively connected on both sides of one movable area 36 of the back plate 3. The setting of multiple groups of connecting columns makes the connection points of the first diaphragm 1 and the second diaphragm 2 through the back plate 3 more, and the consistency of the linkage of the two is better, which further improves the acoustoelectric performance of the micro-electro-mechanical structure. In addition, the plurality of movable areas 36 are usually designed to be uniformly distributed on the back plate 3, and in special cases, more can be designed on the edge or the center position of the back plate 3, which can be designed according to actual requirements, and the present application does not limit this.

[0050] Optionally, as shown in Figures 3 to 4 The first connecting column 4 and the second connecting column 5 are arranged at the free end of the cantilever beam structure.

[0051] Specifically, in the embodiment, the first connecting column 4 and the second connecting column 5 are both connected at the end of the cantilever beam structure on the back plate 3. Since the back plate 3 has less restriction on the movement of the free end of the cantilever beam, the back plate 3 has less influence on the two diaphragms in the process of linkage, avoiding the restriction or influence of the back plate 3 on the vibration or deformation of the first diaphragm 1 and the second diaphragm 2, improving the accuracy of the micro-electro-mechanical structure in converting the vibration or deformation of the first diaphragm 1 and the second diaphragm 2 into electrical signals, and improving the acoustoelectric performance.

[0052] In the above structure, the cantilever beam structure can be part of the structure of the back plate 3 itself, or a connecting piece connected at one end to the back plate 3. The specific design can be made according to actual needs. This structure design makes the movable area 36 have a partially movable function relative to the back plate 3, compared with the movable form completely separated from the back plate 3, which improves the mechanical strength of the double diaphragm and the reliability of the entire micro-electro-mechanical structure on the basis of the existing diaphragm structure.

[0053] In one embodiment, the cantilever beam is part of the structure of the back plate 3 itself, which can be formed by cutting a line on the back plate 3, for example, cutting a U-shaped through hole on the back plate 3 to form a cantilever beam structure, as shown in Figure 3 On the one hand, it can meet the connection position requirements of the first connecting column 4 and the second connecting column 5, and on the other hand, it can also serve as the first through hole 35 for balancing the air pressure on both sides of the back plate 3, which not only simplifies the manufacturing process of the back plate 3, but also lightens the weight of the back plate 3.

[0054] Optionally, the first connecting column 4 and the second connecting column 5 are made of insulating material.

[0055] Specifically, the first connecting column 4 and the second connecting column 5 can be made of conductive material or insulating material. In the embodiment, the first connecting column 4 and the second connecting column 5 are both made of insulating material, which can avoid short circuit or adverse effects on other conductive components in the micro-electro-mechanical structure. The insulating material can be oxide, nitride, etc., which is not limited in the present application.

[0056] Optionally, as shown in Figure 2 , Figure 6 and Figure 8 The first diaphragm 1 and the second diaphragm 2 are respectively provided with a plurality of second through holes 11.

[0057] Specifically, in the embodiment, a plurality of second through holes 11 are arranged on the first diaphragm 1 and the second diaphragm 2 respectively, so that the air resistance of the first diaphragm 1 and the second diaphragm 2 during linkage vibration is small, the air pressure on both sides of the first diaphragm 1 and the second diaphragm 2 can be balanced, the sensing of the first diaphragm 1 and the second diaphragm 2 to signals such as sound or air pressure is avoided, and the electroacoustic performance of the micro-electro-mechanical structure is further improved.

[0058] Optionally, as shown in Figures 5 to 6 , the back electrode plate 3 includes a first back electrode 31 and a second back electrode 32, the first back electrode 31 and the second back electrode 32 are oppositely arranged, and the first back electrode 31 and the second back electrode 32 are fixedly connected through the third connecting column 6.

[0059] Specifically, in the embodiment, the back electrode plate 3 can also be designed as two oppositely arranged plates, wherein the first back electrode 31 can form a first capacitor with the first diaphragm 1, and the second back electrode 32 can form a second capacitor with the second diaphragm 2. In actual production, a plurality of diaphragms can be directly manufactured in a structure connected with the back electrode plate 3 through connecting columns, and two such structures can be connected through the third connecting column 6. In this structure, since the third connecting column 6 can directly connect the movable areas 36 of the two back electrode plates 3, the process difficulty of the entire micro-electro-mechanical structure is smaller, the manufacturing efficiency is further improved, the manufacturing cost is reduced, and it is suitable for batch production.

[0060] In the above structure, the number and position of the third connecting column 6 can also be designed according to actual needs, which is not limited in the present application. In addition, the third connecting column 6 can usually be made of insulating material to avoid short circuit of the conductive layers on the two back electrode plates 3, and improve the reliability of the micro-electro-mechanical structure.

[0061] Optionally, as shown in Figures 7 to 8 , the back electrode plate 3 has a first conductive layer 33 and a second conductive layer 34, the first conductive layer 33 forms the first capacitor with the first diaphragm 1, and the second conductive layer 34 forms the second capacitor with the second diaphragm 2.

[0062] Specifically, in the embodiment, the back electrode plate 3 can include two conductive layers, that is, in actual production, two conductive layers can be directly arranged in the back electrode plate 3, so that the structure of the double back electrode is simpler, and the structure of the back electrode plate 3 is more integrated, so as to facilitate production and assembly.

[0063] Optionally, as shown in Figures 1 to 2 , and Figures 5 to 8 , the micro-electro-mechanical structure further includes a supporting column 7 and a base 8; the back electrode plate 3 is arranged between the first diaphragm 1 and the second diaphragm 2 through the supporting column 7, and the back electrode plate 3 is located on the upper side of the first diaphragm 1, and the base 8 is located on the lower side of the first diaphragm 1.

[0064] Specifically, in the present embodiment, a certain gap is required between the back plate 3 and the first diaphragm 1 and the second diaphragm 2 to ensure the vibration or deformation space of the first diaphragm 1 and the second diaphragm 2. By sandwiching the support column 7 between the first diaphragm 1 and the back plate 3 and between the second diaphragm 2 and the back plate 3, the back plate 3 can be supported between the first diaphragm 1 and the second diaphragm 2. Generally, the middle region of the first diaphragm 1 and the second diaphragm 2 is the working area, therefore, the support column 7 is usually arranged at the edge of the back plate 3 to avoid affecting the vibration of the first diaphragm 1 and the second diaphragm 2. The support column 7 is usually made of insulating material to avoid affecting the capacitance value of the first capacitor and the second capacitor.

[0065] Further, in an embodiment, a substrate 8 is arranged at the bottom of the micro-electro-mechanical structure for supporting the entire micro-electro-mechanical structure to facilitate its assembly in a PCB board or other circuit structure. The substrate 8 is also usually made of insulating material, while the conductive layer on the back plate 3 is usually made of conductor or semiconductor.

[0066] According to a second aspect of the present application, referring to Figures 1 to 8 , a manufacturing method of a micro-electro-mechanical structure is provided, applied to the micro-electro-mechanical structure of the first aspect, comprising:

[0067] First, the first connecting column 4 is fixed on the first diaphragm 1, that is, one end of the first connecting column 4 is connected to one side of the first diaphragm 1.

[0068] Second, the second connecting column 5 is fixed on the second diaphragm 2, that is, one end of the first connecting column 4 is connected to one side of the second diaphragm 2.

[0069] In the above operation, the first connecting column 4 and the second connecting column 5, the first diaphragm 1 and the second diaphragm 2 can respectively adopt the same structure and material, that is, only a structure of multiple connecting columns connected to one side of the diaphragm is needed, and two of the above structures can be taken as the first diaphragm 1 and the first connecting column 4, and the second diaphragm 2 and the second connecting column 5, respectively.

[0070] Finally, the back plate 3 is fixedly connected with the first diaphragm 1 and the second diaphragm 2 through the movable area 36 thereof through the first connecting column 4 and the second connecting column 5. That is, taking one back plate 3, connecting the first diaphragm 1 with one side of the movable area 36 of the back plate 3 through the first connecting column 4, and connecting the second diaphragm 2 with the other side of the movable area 36 of the back plate 3 through the second connecting column, the manufacturing of the micro-electro-mechanical structure can be completed.

[0071] In the prior art, it is usually required to stack the first diaphragm 1, the back plate 3 and the second diaphragm 2, which requires continuous stacking of multi-layer structural members in the manufacturing process, resulting in a relatively high manufacturing process difficulty. In the manufacturing process of the micro-electro-mechanical structure provided in the present application, the integrated structural member only includes at most two layers of the back plate 3 and the diaphragm, and the other diaphragm can be connected to the integrated structural member through the connecting column, thereby reducing the process difficulty, improving the manufacturing efficiency of the micro-electro-mechanical structure, and further reducing the manufacturing cost, so that the micro-electro-mechanical structure can be applied to batch production. Moreover, the micro-electro-mechanical structure manufactured by the manufacturing method of the micro-electro-mechanical structure provided in the present application can ensure the linkage of the first diaphragm 1 and the second diaphragm 2, improve the consistency of vibration or deformation of the two diaphragms, and ensure the electroacoustic performance.

[0072] According to a third aspect of the present application, referring to Figures 1 to 8 , a sensor is provided, characterized in that the sensor comprises the micro-electro-mechanical structure according to the first aspect.

[0073] Specifically, in the present application, the micro-electro-mechanical structure provided in the first aspect can be applied to various application scenarios, such as sensors for pressure sensing or sound sensing (microphone), which has good electroacoustic conversion performance and simple manufacturing process, and is suitable for various electronic products.

[0074] In the above embodiments, the differences between the various embodiments are mainly described, and the optimization features different between the various embodiments can be combined to form a more optimal embodiment as long as they are not contradictory. Considering the brevity of the writing, the details are not repeated here.

[0075] Although some specific embodiments of the present application have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, but not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A microelectromechanical structure, characterized in that, include: A first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm are disposed opposite to each other; A back electrode plate is disposed between the first diaphragm and the second diaphragm, and can form a first capacitor and a second capacitor with the first diaphragm and the second diaphragm respectively; the back electrode plate has a first through hole and a movable area, the movable area can be close to or far from the first diaphragm, and has partial movable function relative to the back electrode plate; A first connecting post and a second connecting post are used. The first diaphragm is connected to one side of the movable area through the first connecting post, and the second diaphragm is connected to the other side of the movable area through the second connecting post, so that the first diaphragm and the second diaphragm can move together.

2. The microelectromechanical structure according to claim 1, characterized in that, The distance between the connection points of the first connecting post and the second connecting post in the movable area is ≤10μm.

3. A microelectromechanical structure according to claim 1, characterized in that, The movable area is provided in multiple ways, and the number of first connecting posts and second connecting posts that match the movable area is also provided in multiple ways, with the positions of the multiple first connecting posts and the multiple second connecting posts corresponding one-to-one.

4. A microelectromechanical structure according to claim 1, characterized in that, The movable area is configured as a cantilever beam structure, with the first connecting column and the second connecting column respectively located at the free end of the cantilever beam structure.

5. A microelectromechanical structure according to claim 1, characterized in that, The first connecting post and the second connecting post are made of insulating material.

6. A microelectromechanical structure according to claim 1, characterized in that, The first diaphragm and the second diaphragm are respectively provided with a plurality of second through holes.

7. A microelectromechanical structure according to claim 1, characterized in that, The back electrode plate includes a first back electrode and a second back electrode, which are arranged opposite to each other and are fixedly connected by a third connecting post.

8. A microelectromechanical structure according to claim 1, characterized in that, The back electrode plate has a first conductive layer and a second conductive layer. The first conductive layer and the first diaphragm form the first capacitor, and the second conductive layer and the second diaphragm form the second capacitor.

9. A microelectromechanical structure according to claim 1, characterized in that, The microelectromechanical structure also includes support columns and a base; The back electrode plate is disposed between the first diaphragm and the second diaphragm via the support column, with the back electrode plate located on the upper side of the first diaphragm and the substrate located on the lower side of the first diaphragm.

10. A method for manufacturing a microelectromechanical structure (MEMS), applied to the MEMS structure according to any one of claims 1-9, characterized in that, include: The first connecting post is fixed on the first diaphragm; The second connecting post is fixed on the second diaphragm; The movable area of ​​the back electrode plate is fixedly connected to the first diaphragm and the second diaphragm respectively through the first connecting post and the second connecting post.

11. A sensor, characterized in that, Includes the microelectromechanical structure as described in any one of claims 1-9.

Images