Method for testing the wetting intensity of a tinplate surface and related apparatus

Abstract

This invention provides a method and related equipment for testing the wetting strength of tin-plated board surfaces. The method includes: acquiring a tin-plated board to be tested; drawing lines on the tin-plated board using a dyne pen to obtain the drawn lines; determining the changes in the drawn lines; for cases where capillary action occurs in the drawn lines, drawing lines again on the tin-plated board using a higher-grade dyne pen to obtain new drawn lines, until the new drawn lines show no change; and determining the grade of the dyne pen corresponding to the new drawn lines as the wetting strength of the tin-plated board surface. Thus, a quantifiable wettability index is provided. By testing the surface of the tin-plated board with a dyne pen, considering the surface morphology of the substrate, the relationship between the passivation film and the coating, and observing the pen marks, an evaluable method for testing the wetting strength of tin-plated board surfaces is established.

Description

Technical Field

[0001] This invention relates to the field of metal material rating, and more specifically, to a method for testing the wetting strength of a tin-plated sheet surface, a device for testing the wetting strength of a tin-plated sheet surface, an electronic device, and a storage medium. Background Technology

[0002] Currently, tinplate, with its advantages of corrosion resistance, non-toxicity, high strength, and good ductility, is widely used in the tinplate packaging industry for food canning, beverages, oleochemicals, pharmaceuticals, stationery, and cosmetics. The tinplate printing process uses oil-based, phenolic, epoxy, polyester, ethylene, acrylic, and amino resin coatings to apply an internal coating and external printing to the tinplate. The coating thickness is typically only a few micrometers. If pinholes occur during coating, it will cause product quality problems such as aesthetics and corrosion resistance. Besides the coating formulation and process environment affecting pinhole formation, the most significant influencing factor is the wettability of the tinplate surface.

[0003] However, in the existing technology, there is still no accurate and convenient test method to evaluate its surface wettability, nor is there any relevant standard to assess the pinholes in tinplate coating. The pinhole problem after tinplate coating on tinplate relies mainly on customer application feedback. There is little research on test methods for pinholes in tinplate coating, and there is a lack of quantifiable indicators for the surface wettability of tinplate.

[0004] Therefore, a new technical solution is urgently needed to solve the above-mentioned technical problems. Summary of the Invention

[0005] The summary section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. The summary section of this invention is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] In a first aspect, the present invention proposes a method for testing the wetting strength of a tin-plated plate surface, comprising:

[0007] Obtain the tin-plated board to be tested;

[0008] Use a dyne pen to draw lines on a tin-plated board to obtain the line marks;

[0009] To determine the changes in the daemon strokes, if capillary action occurs in the daemon strokes, use a higher-grade dyne pen to draw lines again on the tinplate to obtain new daemon strokes. Continue this process until the new daemon strokes do not change. The grade of the dyne pen corresponding to the new daemon strokes is then determined as the wetting strength of the tinplate surface.

[0010] Optionally, the above methods also include:

[0011] If the strokes show signs of shrinkage, stop the test immediately.

[0012] Optionally, the above method, which uses a dyne pen to draw lines on a tin-plated board to obtain the line markings, includes:

[0013] Draw lines on the tinplate with the tip of the dyne pen perpendicular to the surface of the tinplate.

[0014] Optionally, the above method involves using a higher-grade dyne pen to draw lines again on the tin-plated board to obtain new pen marks, including:

[0015] Use a higher-grade dyne pen to draw lines at different locations on the tinplate to ensure that the different lines do not overlap.

[0016] Optionally, the above method for determining changes in the strokes may include:

[0017] Using the formula γ sg ―γ sl =γ lg • cosθ is used to calculate the contact angle between the dyne solution that produces the scribing marks and the tinplate, in order to determine the variation of the scribing marks based on the contact angle, where γ sg γ represents the interfacial tension at the solid-gas interface. lg The interfacial tension γ represents the interfacial tension at the liquid-gas interface. sl The interfacial tension at the solid-liquid interface is represented by θ, which represents the contact angle.

[0018] When θ > 90°, it is determined that the strokes shrink.

[0019] When θ = 90°, it is determined that the strokes do not change.

[0020] When θ < 90°, capillary action is confirmed in the strokes.

[0021] Optionally, the above method may include:

[0022] Obtain the surface wetting strength of the tin-plated sheet as determined by the method for testing the surface wetting strength of the tin-plated sheet according to any one of claims 1 to 5;

[0023] Based on the wetting strength of the tinplate surface, determine whether pinholes occur after using the tinplate for printing.

[0024] Secondly, a device for testing the surface wetting strength of tin-plated plates is also proposed, comprising:

[0025] The first acquisition module is used to acquire the tin-plated board to be tested;

[0026] The line drawing module is used to draw lines on a tin-plated board using a dyne pen to obtain line marks.

[0027] The strength testing module is used to determine the changes in the daemon strokes. If the daemon strokes show capillary action, a higher-grade dyne pen is used to draw lines again on the tin-plated board to obtain new daemon strokes. This process continues until the new daemon strokes do not change. The dyne pen grade corresponding to the new daemon strokes is then determined as the wetting strength of the tin-plated board surface.

[0028] Thirdly, an electronic device is also proposed, including a processor and a memory, wherein the memory stores computer program instructions, which are executed by the processor to perform the above-mentioned method for testing the wetting strength of tin-plated sheet surfaces.

[0029] Fourthly, a storage medium is also proposed, on which program instructions are stored. When the program instructions are run, they are used to execute the above-mentioned method for testing the wetting strength of tin-plated board surfaces.

[0030] According to the above technical solution, a tin-plated board to be tested is obtained; lines are drawn on the tin-plated board using a dyne pen to obtain the line marks; the changes in the line marks are determined, and if capillary action occurs in the line marks, lines are drawn again on the tin-plated board using a higher-grade dyne pen to obtain new line marks, until the new line marks do not change. The grade of the dyne pen corresponding to the new line marks is determined as the wetting strength of the tin-plated board surface. Therefore, a quantifiable wettability index is provided. By testing the surface of the tin-plated board with a dyne pen, considering the surface morphology of the substrate, the relationship between the passivation film and the coating, and observing the pen marks, an evaluable method for testing the wetting strength of the tin-plated board surface is established.

[0031] The method for testing the wetting strength of tin-plated sheet surfaces according to the present invention, and other advantages, objectives and features of the present invention will be apparent in part from the following description, and in part from the understanding of those skilled in the art through study and practice of the present invention. Attached Figure Description

[0032] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit this specification. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0033] Figure 1 A schematic flowchart of a method for testing the wetting strength of a tin-plated sheet surface according to an embodiment of the present invention is shown;

[0034] Figure 2A schematic block diagram of a tinplate surface wetting strength testing apparatus according to an embodiment of the present invention is shown;

[0035] Figure 3 A schematic block diagram of a hole detection device according to an embodiment of the present invention is shown;

[0036] Figure 4 A schematic block diagram of an electronic device according to an embodiment of the present invention is shown;

[0037] Figure 5 A schematic diagram illustrating the effect of dyne pen strokes according to an embodiment of the present invention is shown. Detailed Implementation

[0038] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus. The technical solutions of the embodiments of this application will now be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them.

[0039] According to a first aspect of the present invention, a method for testing the wetting strength of a tin-plated plate surface is provided, such as... Figure 1 As shown, the method includes:

[0040] S110. Obtain the tin-plated board to be tested.

[0041] It should be noted that tin-plated steel sheet refers to cold-rolled thin steel sheet coated with an extremely thin layer of metallic tin on both sides. It combines the hardness and strength of steel with the solderability, corrosion resistance, and bright appearance of tin. Tin-plated steel sheet has advantages such as being odorless and non-toxic, lightweight, and easy to process and shape. Different patterns can be printed on it to beautify products, thus it is widely used in industries such as food canning, electronics, and chemical paints. Specifically, this method achieves a tin plating amount of 2.8 g / m². 2Three different tin-plated sheets were generated by changing the substrate surface morphology and passivation conditions: tin-plated sheet A (good surface wettability), tin-plated sheet B (moderate surface wettability), and tin-plated sheet C (poor surface wettability). These three tin-plated sheets were used for subsequent testing. A 10×10cm sample of each of the three tin-plated sheets was taken. 2 ~15×15cm 2 As the effective test area for testing.

[0042] S120. Use a dyne pen to draw lines on the tin-plated board to obtain the line marks.

[0043] It should be noted that a dyne pen, also known as a surface tension test pen, corona treatment pen, and plastic film surface tension testing pen, is a tool for testing the corona discharge of thin film surfaces, specifically dynes. It is specifically used to determine the effect of corona treatment on thin films. Dyne pens have dozens of different dyne values, with common values ​​ranging from 28 mN / m to 72 mN / m. Using a dyne pen, one can accurately test whether the surface free energy of films, plastics, ceramics, semiconductors, glass fibers, etc., reaches the dyne value, and can also check whether the surface corona treatment results meet requirements. It can quickly and intuitively determine whether materials are suitable for printing, lamination, or vacuum metallization, thereby effectively controlling quality and reducing losses caused by substandard materials. Dyne solutions with different surface tensions are prepared using different proportions of ethylene glycol ethyl ether, formamide, methanol, and water. Because the surface tension of the dyne solution varies, the contact angle between it and the tin-plated plate affects the change in the pen marks. Before using a dyne pen, ensure that the ambient temperature, air humidity, and surface temperature of the object being measured meet the standard conditions calibrated by the dyne pen. It is understood that the greater the temperature difference, the greater the measurement error. Specifically, this method is performed at an ambient temperature of 21–25℃ and humidity of 45–55%. Apply appropriate pressure to the dyne pen and draw a line on the surface being measured. It is understood that dyne pens with smaller ranges draw straight lines more easily and therefore do not require much pressure. However, dyne pens with ranges of 40, 42, and above require more pressure when drawing lines. Generally, for the first test, to ensure measurement accuracy, at least six dyne pens with different dyne values ​​should be prepared. This method uses dyne pens with ranges of 30, 32, 34, 36, 38, 40, and 42.

[0044] S130. Determine the changes in the daemon strokes. If the daemon strokes exhibit capillary action, use a higher-grade dyne pen to draw lines again on the tinplate to obtain new daemon strokes. Continue this process until the new daemon strokes do not change. The grade of the dyne pen corresponding to the new daemon strokes is determined as the wetting strength of the tinplate surface.

[0045] According to step S120, use a set of dyne pens of consecutive models and conduct tests according to the dyne value from low to high. Hold the pen tip perpendicular to the tin-plated plate surface, press lightly and draw a straight line of 10-15cm, and observe the change of the pen mark over time. If the pen mark shows capillary action on the tin-plated plate surface, that is, the pen mark continues to thicken and expand outward, then use a higher-model dyne pen to continue the test.

[0046] If, after the above markings, the writing on the tinplate surface shows no change (i.e., the writing neither expands nor contracts), continue using a higher-grade dyne pen, holding the pen tip perpendicular to the tinplate surface, lightly pressing and drawing straight lines of 10–15 cm, and observe the changes in the writing over time. If the writing on the tinplate surface shows shrinkage (i.e., the writing becomes thinner or intermittent), stop the test. Record the dyne pen number corresponding to the point where the writing on the tinplate surface shows no change; this is the wetting strength of the tinplate surface (mN / m). It should be noted that when the wetting strength of the tinplate surface is between 22 and 32 mN / m, pinholes will occur after the tinplate is coated; when the wetting strength is between 32 and 72 mN / m, pinholes will not occur after the tinplate is coated.

[0047] Based on the above technical solution, addressing the current lack of an accurate and convenient testing method for evaluating the surface wettability of tinplate during factory inspection, and the absence of relevant standards for assessing pinholes in printed metal coatings, this method involves: obtaining the tinplate to be tested; drawing lines on the tinplate using a dyne pen to obtain the drawn lines; determining the changes in the drawn lines; and, for cases where capillary action occurs, redrawing the tinplate using a higher-grade dyne pen to obtain new drawn lines until no further changes occur. The grade of the dyne pen corresponding to the new drawn lines is then determined as the surface wettability strength of the tinplate. Therefore, this method provides a quantifiable wettability index by testing the surface of the tinplate with a dyne pen, comprehensively considering the surface morphology of the substrate, the compatibility between the passivation film and the coating, and observing the pen marks, thus establishing an evaluable testing method for the surface wettability strength of tinplate.

[0048] In some embodiments, the above method may further include:

[0049] S210. If the strokes show signs of shrinkage, stop the test immediately.

[0050] It is understandable that when the dain pen marks shrink, it means that the actual surface wetting strength of the tinplate is less than the value of the dyne pen being tested. Therefore, the test can be stopped, and the dyne value of the last time the dain pen marks the marks where the shrinkage occurred can be recorded as the current surface wetting strength of the tinplate.

[0051] In some embodiments, the above method, which uses a dyne pen to draw lines on a tin-plated board to obtain the line marks, may include:

[0052] S121. Draw lines on the tinplate with the tip of the dyne pen perpendicular to the surface of the tinplate.

[0053] It should be noted that the surface tension of dyne solution varies, and the contact angle between it and the tinplate affects the change in the pen strokes. θ represents the contact angle between the dyne solution and the tinplate. When θ = 90°, cosθ = 0, the solid-gas interfacial tension equals the solid-liquid interfacial tension, the forces are balanced, and the pen strokes do not shrink or produce capillary action. By drawing lines on the tinplate with the tip of a dyne pen perpendicular to the surface of the tinplate, the wetting strength of the tinplate can be accurately tested.

[0054] In some embodiments, the above method, which involves drawing lines again on the tin-plated board using a higher-grade dyne pen to obtain new pen marks, may include:

[0055] S121A. Using a higher-grade dyne pen, lines are drawn at different locations on the tin-plated board so that the different line strokes do not overlap.

[0056] It is understandable that dyne solution may expand to a certain extent on tin-plated boards with different humidity levels. Therefore, when using a dyne pen to draw lines on tin-plated boards and obtain the line marks, it is necessary to draw lines in different positions so that the different line marks do not overlap, so as to facilitate subsequent observation of the phenomenon of the marks changing over time.

[0057] In some embodiments, determining the changes in the strokes of the line drawing may include:

[0058] S131, Using formula γ sg ―γ sl =γ lg • cosθ is used to calculate the contact angle between the dyne solution that produces the scribing marks and the tinplate, in order to determine the variation of the scribing marks based on the contact angle, where γ sg γ represents the interfacial tension at the solid-gas interface. lg The interfacial tension γ represents the interfacial tension at the liquid-gas interface. sl θ represents the interfacial tension at the solid-liquid interface, and θ represents the contact angle.

[0059] It should be noted that the solid-gas interfacial tension γ sg The surface morphology of the tin-plated sheet is related to the R of the substrate. a R sk R Pc The smoothing effect of the tin layer determines the surface energy of the tin-plated plate. The solid-liquid interfacial tension γ... slThe hydrophilicity and oleophilicity of the passivation film are related to the polarity and ratio of Cr2O3 and Cr(OH)3, which determines the compatibility between the passivation film and the coating.

[0060] S132. When θ > 90°, it is determined that the strokes shrink.

[0061] It should be noted that when θ > 90°, cosθ < 0, the solid-gas interfacial tension γ sg Solid-liquid interfacial tension γ sl The combined force points towards the center of the droplet, causing the dyne solution to contract and shrink into a thin line on the tin-plated surface. This indicates that the tin-plated plate does not have the ability to retain the dyne solution, meaning that the surface wettability is poor.

[0062] S133. When θ = 90°, it is determined that the strokes do not change.

[0063] It should be noted that when θ = 90°, cosθ = 0, the solid-gas interfacial tension γ sg =Solid-liquid interfacial tension γ sl The forces are balanced, so the ink does not shrink or produce capillary action.

[0064] S134. When θ < 90°, it is determined that capillary action occurs in the stroke.

[0065] It should be noted that when θ < 90°, cosθ > 0, the solid-gas interfacial tension γ sg Solid-liquid interfacial tension γ sl The combined force is directed away from the center of the droplet, causing the dyne solution to expand and exhibit capillary action on the tinplate surface, indicating that the tinplate has a good adsorption effect on the dyne solution, i.e., strong surface wettability.

[0066] According to a second aspect of the present invention, a method for detecting shrinkage cavities is also provided. The shrinkage cavities detection method may include the following steps.

[0067] S510. Obtain the surface wetting strength of the tinplate as determined by the surface wetting strength test method described above.

[0068] It is understandable that the surface wetting strength of the tinplate being tested can be inferred from the surface wetting strength test method described above.

[0069] For example, using dyne pens with numbers 30, 32, 34, 36, 38, 40, and 42, tests are conducted according to the dyne values ​​from low to high. The pen tip is perpendicular to the surfaces of tin-plated plates A, B, and C obtained in step S110, and a straight line of 10-15 cm is lightly pressed and drawn. The change in the pen marks over time is observed to determine the wetting strength of the tin-plated plate surface. Figure 5 As shown, where, Figure 5A schematic diagram of the strokes drawn with a dyne pen.

[0070] S520. Based on the wetting strength of the tinplate surface, determine whether pinholes occur after using the tinplate for printing.

[0071] Understandably, based on the value of the wetting strength of the tinplate surface determined in step S510, it is determined whether pinholes will occur after the tinplate is coated with printing plates. When the wetting strength of the tinplate surface is between 22 and 32 mN / m, pinholes will occur after the printing plates are coated; when the wetting strength of the tinplate surface is between 32 and 72 mN / m, pinholes will not occur after the printing plates are coated.

[0072] According to a third aspect of the present invention, a device for testing the wetting strength of a tin-plated plate surface is also provided.

[0073] Figure 2 A schematic block diagram of a tinplate surface wetting strength testing apparatus 200 according to an embodiment of the present invention is shown. Figure 2 As shown, the device may include:

[0074] The first acquisition module 210 is used to acquire the tin-plated board to be tested;

[0075] The line drawing module 220 is used to draw lines on a tin-plated board using a dyne pen to obtain line marks.

[0076] The strength testing module 230 is used to determine the changes in the daemon strokes. If the daemon strokes show capillary action, a higher-grade dyne pen is used to draw lines again on the tin-plated board to obtain new daemon strokes. This process continues until the new daemon strokes do not change. The dyne pen grade corresponding to the new daemon strokes is determined as the wetting strength of the tin-plated board surface.

[0077] According to a fourth aspect of the present invention, a hole detection device is also provided. Figure 3 A schematic block diagram of a cavity detection device 300 according to an embodiment of the present invention is shown. Figure 3 As shown, the shrinkage cavity detection device 300 may include the tinplate surface wetting strength testing device 200 as described above, used to obtain the surface wetting strength of the tinplate.

[0078] The cavity determination module 310 is used to determine whether a cavity phenomenon occurs after the tin-plated board is used for printing iron coating based on the wetting strength of the tin-plated board surface.

[0079] According to a fifth aspect of the invention, an electronic device is also provided. Figure 4 A schematic block diagram of an electronic device 40 according to an embodiment of the present invention is shown. Figure 4As shown, the device includes at least one processor 41, and at least one memory 42 and bus 43 connected to the processor 41; wherein the processor 41 and the memory 42 communicate with each other through the bus 43; the processor 41 is used to call program instructions in the memory 42 to execute the above-mentioned tinplate surface wetting strength test method.

[0080] The devices mentioned in this article can be servers, PCs, tablets, mobile phones, etc.

[0081] According to a fourth aspect of the present invention, a computer program product is also provided, which, when executed on a data processing device, is adapted to execute an initialization program having the following method steps:

[0082] Obtain the tin-plated board to be tested;

[0083] Use a dyne pen to draw lines on a tin-plated board to obtain the line marks;

[0084] To determine the changes in the daemon strokes, if capillary action occurs in the daemon strokes, use a higher-grade dyne pen to draw lines again on the tinplate to obtain new daemon strokes. Continue this process until the new daemon strokes do not change. The grade of the dyne pen corresponding to the new daemon strokes is then determined as the wetting strength of the tinplate surface.

[0085] Furthermore, the above methods also include:

[0086] If the strokes show signs of shrinkage, stop the test immediately.

[0087] Furthermore, the above method, which uses a dyne pen to draw lines on a tin-plated board to obtain the line markings, includes:

[0088] Draw lines on the tinplate with the tip of the dyne pen perpendicular to the surface of the tinplate.

[0089] Furthermore, the above method involves using a higher-grade dyne pen to draw lines again on the tin-plated board to obtain new line markings, including:

[0090] Use a higher-grade dyne pen to draw lines at different locations on the tinplate to ensure that the different lines do not overlap.

[0091] Furthermore, the above method for determining changes in the strokes can include:

[0092] Using the formula γ sg ―γ sl =γ lg • cosθ is used to calculate the contact angle between the dyne solution that produces the scribing marks and the tinplate, in order to determine the variation of the scribing marks based on the contact angle, where γ sg γ represents the interfacial tension at the solid-gas interface.lg The interfacial tension γ represents the interfacial tension at the liquid-gas interface. sl The interfacial tension at the solid-liquid interface is represented by θ, which represents the contact angle.

[0093] When θ > 90°, it is determined that the strokes shrink.

[0094] When θ = 90°, it is determined that the strokes do not change.

[0095] When θ < 90°, capillary action is confirmed in the strokes.

[0096] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and / or device can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0097] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0098] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0099] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0100] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A method for testing the wetting strength of a tin-plated sheet surface, characterized in that, include: Obtain the tin-plated board to be tested; Use a dyne pen to draw lines on the tin-plated plate to obtain the line marks; The changes in the daemon strokes are determined. If the daemon strokes exhibit capillary action, a higher-grade dyne pen is used to draw lines again on the tinplate to obtain new daemon strokes. This process continues until the new daemon strokes do not change. The dyne pen grade corresponding to the new daemon strokes is determined as the wetting strength of the tinplate surface. If the strokes show signs of shrinkage, stop the test immediately. Determining the changes in the strokes includes: Using formula The contact angle between the dyne solution that produces the strokes and the tinplate is calculated to determine the variation in the strokes based on the contact angle. This represents the interfacial tension at the solid-gas interface. The interfacial tension at the liquid-gas interface. It represents the interfacial tension at the solid-liquid interface. Indicates the contact angle; when At that time, it was determined that the strokes showed signs of shrinkage; when At that time, it was determined that the strokes of the line did not change. when At that time, it was determined that the strokes exhibited capillary action.

2. The method for testing the wetting strength of tin-plated sheet surface as described in claim 1, characterized in that, The method of using a dyne pen to draw lines on the tin-plated board to obtain the line marks includes: Draw a line on the tinplate with the tip of the dyne pen perpendicular to the surface of the tinplate.

3. The method for testing the wetting strength of tin-plated sheet surface as described in claim 2, characterized in that, The method of using a higher-grade dyne pen to draw lines again on the tin-plated plate to obtain new line marks includes: The dyne pen of a higher grade is used to draw lines at different locations on the tin plate so that the different lines do not overlap.

4. A method for detecting shrinkage cavities, characterized in that, include: Obtain the surface wetting strength of the tin-plated sheet as determined by the method for testing surface wetting strength of tin-plated sheet according to any one of claims 1 to 3; Based on the wetting strength of the tinplate surface, determine whether pinholes occur after applying the tinplate to the printed circuit board.

5. A device for testing the wetting strength of a tin-plated sheet surface, characterized in that, include: The first acquisition module is used to acquire the tin-plated board to be tested; A line drawing module is used to draw lines on the tin-plated plate using a dyne pen to obtain line strokes. The strength testing module is used to determine the changes in the daemon strokes. If the daemon strokes exhibit capillary behavior, a higher-grade dyne pen is used to draw lines again on the tin-plated plate to obtain new daemon strokes until the new daemon strokes do not change. The dyne pen model corresponding to the new daemon strokes is determined as the wetting strength of the tin-plated plate surface. If the strokes show signs of shrinkage, stop the test immediately. Determining the changes in the strokes includes: using a formula The contact angle between the dyne solution that produces the strokes and the tinplate is calculated to determine the variation in the strokes based on the contact angle. This represents the interfacial tension at the solid-gas interface. The interfacial tension at the liquid-gas interface. It represents the interfacial tension at the solid-liquid interface. Indicates the contact angle; when When, it is determined that the strokes show signs of shrinkage; when When, it is determined that the strokes of the line do not change; when At that time, it was determined that the strokes exhibited capillary action.

6. A hole shrinkage detection device, characterized in that, include: The tin-plated plate surface wetting strength testing device as described in claim 5 is used to obtain the surface wetting strength of the tin-plated plate. The cavity determination module is used to determine whether a cavity phenomenon occurs after the tin-plated board is used for printing on iron based on the wetting strength of the tin-plated board surface.

7. An electronic device, characterized in that, It includes a processor and a memory, wherein the memory stores computer program instructions, which, when executed by the processor, are used to perform the tinplate surface wetting strength test method as described in any one of claims 1 to 3 and / or the pinhole detection method as described in claim 4.

8. A storage medium storing program instructions that, when executed, perform the tinplate surface wetting strength test method as described in any one of claims 1 to 3 and / or the pinhole detection method as described in claim 4.

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