A layered packaged full-spectrum light-emitting device and its packaging process

Abstract

The present invention discloses a layered package full-spectrum light-emitting device and its packaging process, which belongs to the field of LED light-emitting technology. The layered package full-spectrum light-emitting device includes an excitation light source and a fluorescent layer, the fluorescent layer is composed of a fluorescent body and an encapsulation glue, and the fluorescent body includes a first fluorescent body, a second fluorescent body, a third fluorescent body and a fourth fluorescent body; the mass ratio of the first fluorescent body, the second fluorescent body, the third fluorescent body and the fourth fluorescent body is: (5%-40%): (30%-90%): (1%-10%): (10%-30%); the fluorescent layer includes a lower fluorescent layer and an upper fluorescent layer, and the upper fluorescent layer is arranged above the lower fluorescent layer; the fluorescent body in the lower fluorescent layer includes a third fluorescent body and a fourth fluorescent body, and the fluorescent body in the upper fluorescent layer includes a first fluorescent body and a second fluorescent body. The layered package full-spectrum light-emitting device can significantly improve the luminous efficiency and stability of the light-emitting device, thereby meeting the application requirements of the full spectrum.

Description

Technical Field

[0001] The present invention belongs to the technical field of LED lighting, and in particular relates to a layered packaged full-spectrum lighting device and a packaging process thereof. Background Art

[0002] In recent years, the development of GaN-based white light-emitting diodes (LEDs) has garnered significant attention. Due to their high energy efficiency, environmental friendliness, compact size, and long lifespan, they are hailed as the fourth generation of lighting sources, following incandescent lamps, fluorescent lamps, and gas discharge lamps. Recently, significant progress has been made in white LEDs' luminous efficiency, lifespan, and brightness.

[0003] The preparation method of white light LED mainly uses blue light LED chips with Ga-YAG yellow-green powder and nitride red powder to supplement the missing yellow-green and red parts of the spectrum. The color rendering index is greatly improved, but this solution does not improve the deep blue part of R12 much, and cannot meet the application requirements of the full spectrum.

[0004] BaSi2O2N2:Eu 2+ The combination of Ga-YAG yellow-green powder and nitride red powder has a significant effect on improving the color rendering index, especially the R12 value. Although this solution can meet the requirements of R1-R15 being greater than 90, the luminous efficiency is low and the aging performance needs to be improved. Summary of the Invention

[0005] In order to solve the problems of low luminous efficiency and poor aging performance in existing full-spectrum application solutions, the present invention provides a layered packaged full-spectrum light-emitting device and its packaging process. The light-emitting device can significantly improve the luminous efficiency and stability of the light-emitting device, thereby meeting the application requirements of the full spectrum.

[0006] The layered packaged full-spectrum light-emitting device of the present invention comprises an excitation light source and a fluorescent layer, wherein the fluorescent layer is arranged above the excitation light source; the laser light source is a commercially available light-emitting chip.

[0007] The fluorescent layer is composed of a fluorescent body and an encapsulating glue, and the fluorescent body includes a first fluorescent body, a second fluorescent body, a third fluorescent body and a fourth fluorescent body. The mass ratio of the first fluorescent body, the second fluorescent body, the third fluorescent body and the fourth fluorescent body is: (5%-40%): (30%-90%): (1%-10%): (10%-30%).

[0008] The first phosphor has the chemical formula M1 1-x1 Si2O2N2:x1Eu, whose luminescence peak wavelength range is 470-500nm, wherein M1 is at least one of Ca, Sr and Ba, 0.001≤x1≤0.05.

[0009] The second phosphor has the chemical formula M2 3-x2 Al5O 12 :x2Ce, whose luminescence peak wavelength range is 500-590nm, wherein M2 is at least one of Y and Lu, M3 is at least one of Al and Ga, 0.001≤x2≤0.1.

[0010] The third phosphor has the chemical formula M3 1-x3 AlSiN3:x3Eu, whose luminescence peak wavelength range is 590-670nm, where M3 is at least one of Ca, Sr and Ba, and 0.001≤x3≤0.1.

[0011] The fourth phosphor has a chemical formula of K 2-x4 SiF6:x4Eu, its luminescence peak wavelength range is 590-650nm, 0.001≤x4≤0.05.

[0012] The fluorescent layer includes a lower fluorescent layer and an upper fluorescent layer, and the upper fluorescent layer is arranged above the lower fluorescent layer.

[0013] The phosphors in the lower phosphor layer include a third phosphor and a fourth phosphor.

[0014] The phosphors in the upper phosphor layer include a first phosphor and a second phosphor.

[0015] The third phosphor and the fourth phosphor are placed in the lower layer, which can not only reduce the reabsorption of the phosphor and improve the conversion efficiency of the chip, but also keep it away from air and water to improve aging performance. The first phosphor and the second phosphor are placed in the upper layer, which is also beneficial to improving aging performance.

[0016] Furthermore, the upper fluorescent layer consists of a third fluorescent layer and a fourth fluorescent layer, and the fourth fluorescent layer is arranged above the third fluorescent layer.

[0017] The phosphor in the third phosphor layer is the first phosphor.

[0018] The phosphor in the fourth phosphor layer is the second phosphor.

[0019] The first phosphor is placed in the middle layer, which can keep it further away from air and water, thereby improving the aging performance of the overall solution.

[0020] Further preferably, the lower fluorescent layer consists of a first fluorescent layer and a second fluorescent layer, and the second fluorescent layer is arranged above the first fluorescent layer.

[0021] The phosphor in the first phosphor layer is a third phosphor.

[0022] The phosphor in the second phosphor layer is a fourth phosphor.

[0023] Placing the third and fourth phosphors in the first and second phosphor layers respectively can better reduce the reabsorption of the phosphors. Because the fourth phosphor is a peak-emitting phosphor, it has little effect on reabsorption. Placing it in the second layer can reduce its reflection of the light emitted by the chip, thereby effectively improving the conversion efficiency of the chip and enhancing the luminous efficiency of the overall solution.

[0024] Furthermore, the laser light source is a GaN-based LED blue light chip, and the LED peak wavelength range is 440nm-470nm.

[0025] The present invention also provides a packaging process for a layered packaging full-spectrum light-emitting device, which specifically includes the following steps:

[0026] According to the layering method of the fluorescent layers of the full-spectrum phosphor mixture light-emitting device, each fluorescent layer is encapsulated in sequence from bottom to top, that is, the full-spectrum light-emitting device is packaged in layers.

[0027] The packaging process of each fluorescent layer is as follows: the fluorescent body is mixed evenly with the packaging glue according to the mass ratio, and after centrifugation and degassing, it is loaded into the dispensing machine for dispensing glue, and after drying, the next fluorescent layer is packaged.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The present invention uses a full-spectrum phosphor mixture of four different phosphors, regulates the mass ratio of each phosphor, and sets multiple phosphor layers in the light-emitting device, matches different phosphors in different phosphor layers, and adopts a layered packaging process to effectively reduce the reabsorption of the phosphor, improve the luminous efficiency and aging performance of the light-emitting device, thereby meeting the application requirements of the full spectrum. DETAILED DESCRIPTION

[0030] To enable those skilled in the art to better understand the technical solutions of the present invention, the present invention is further described in detail below in conjunction with specific embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] In each embodiment and comparative example, the laser light source is a 2835 patch, the chip combination is 10*30mil, three crystals are connected in series, and the chip power is 1W.

[0032] Example 1

[0033] A layered packaged full-spectrum light-emitting device, wherein the fluorescent layers of the light-emitting device are arranged as a first fluorescent layer, a second fluorescent layer, a third fluorescent layer and a fourth fluorescent layer; the fluorescent body in the first fluorescent layer is the third fluorescent body, the fluorescent body in the second fluorescent layer is the fourth fluorescent body, the fluorescent body in the third fluorescent layer is the first fluorescent body, and the fluorescent body in the fourth fluorescent layer is the second fluorescent body.

[0034] The mass ratio of the first phosphor, the second phosphor, the third phosphor and the fourth phosphor is 8%:80%:1%:11%; the chemical formulas of the first, second, third and fourth phosphors are Ba 0.99 Si2O2N2:0.01Eu、Y 2.96 Al 3.8 Ga 1.2 O 12: 0.0.04Ce、Sr 0.9 Ca 0.08 AlSiN3:0.02Eu、K 1.99 SiF6:0.01Eu.

[0035] The packaging process for preparing the layered packaged full-spectrum light-emitting device is to package the first, second, third, and fourth fluorescent layers in sequence. The packaging method for each fluorescent layer is: the phosphor is evenly mixed with the packaging glue according to the mass ratio, and after centrifugation and degassing, it is loaded into the dispensing machine for dispensing, and after drying, the next fluorescent layer is packaged.

[0036] Example 2

[0037] A layered packaged full-spectrum light-emitting device, wherein the fluorescent layers of the light-emitting device are arranged as a first fluorescent layer, a second fluorescent layer, a third fluorescent layer and a fourth fluorescent layer; the fluorescent body in the first fluorescent layer is the third fluorescent body, the fluorescent body in the second fluorescent layer is the fourth fluorescent body, the fluorescent body in the third fluorescent layer is the first fluorescent body, and the fluorescent body in the fourth fluorescent layer is the second fluorescent body.

[0038] The mass ratio of the first phosphor, the second phosphor, the third phosphor and the fourth phosphor is 5%:75%:2%:18%; the chemical formulas of the first, second, third and fourth phosphors are Ba 0.96 Sr 0.02 Si2O2N2:0.02Eu、Y 0.01 Lu 2.95 Al5O 12 :0.04Ce、Sr 0.88 Ca 0.1 AlSiN3:0.02Eu、K 1.98 SiF6:0.02Eu.

[0039] The packaging process for preparing the layered packaged full-spectrum light-emitting device is to package the first, second, third, and fourth fluorescent layers in sequence. The packaging method for each fluorescent layer is: the phosphor is evenly mixed with the packaging glue according to the mass ratio, and after centrifugation and degassing, it is loaded into the dispensing machine for dispensing, and after drying, the next fluorescent layer is packaged.

[0040] Example 3

[0041] A layered packaged full-spectrum light-emitting device, wherein the fluorescent layers of the light-emitting device are arranged as an upper fluorescent layer and a lower fluorescent layer; the fluorescent bodies in the lower fluorescent layer are a third fluorescent body and a fourth fluorescent body, and the fluorescent bodies in the upper fluorescent layer are a first fluorescent body and a second fluorescent body.

[0042] The mass ratio of the first phosphor, the second phosphor, the third phosphor and the fourth phosphor is 30%:32%:10%:28%; the chemical formulas of the first, second, third and fourth phosphors are Ba 0.99 Si2O2N2:0.01Eu、Y 0.01 Lu 2.94 Al 3.5 Ga 1.5 O 12 :0.05Ce、Ca 0.98 AlSiN3:0.02Eu、K 1.996 SiF6:0.004Eu.

[0043] The packaging process for preparing the layered packaged full-spectrum light-emitting device is to package the lower fluorescent layer and the upper fluorescent layer in sequence. The packaging method for each fluorescent layer is: the phosphor is mixed evenly with the packaging glue according to the mass ratio, and after centrifugation and degassing, it is loaded into the dispensing machine for dispensing, and after drying, the next fluorescent layer is packaged.

[0044] Example 4

[0045] A layered packaged full-spectrum light-emitting device, wherein the fluorescent layers of the light-emitting device are arranged as a first fluorescent layer, a second fluorescent layer, and an upper fluorescent layer; the fluorescent body in the first fluorescent layer is a third fluorescent body, the fluorescent body in the second fluorescent layer is a fourth fluorescent body, and the fluorescent body in the upper fluorescent layer is a first fluorescent body and a second fluorescent body.

[0046] The mass ratio of the first phosphor, the second phosphor, the third phosphor and the fourth phosphor is 11%:72%:4%:13%; the chemical formulas of the first, second, third and fourth phosphors are Ba 0.95 Sr 0.04 Si2O2N2:0.01Eu、Y 2.97 Al 3.3 Ga 1.7 O 12 :0.03Ce、Ca 0.99 AlSiN3:0.01Eu、K1.995 SiF6:0.005Eu.

[0047] The packaging process for preparing the layered packaged full-spectrum light-emitting device is to package the lower fluorescent layer and the upper fluorescent layer in sequence. The packaging method for each fluorescent layer is: the phosphor is mixed evenly with the packaging glue according to the mass ratio, and after centrifugation and degassing, it is loaded into the dispensing machine for dispensing, and after drying, the next fluorescent layer is packaged.

[0048] Example 5

[0049] A layered packaged full-spectrum light-emitting device, wherein the fluorescent layers of the light-emitting device are arranged as a lower fluorescent layer, a third fluorescent layer and a fourth fluorescent layer; the fluorescent bodies in the lower fluorescent layer are the third fluorescent body and the fourth fluorescent body, the fluorescent body in the third fluorescent layer is the first fluorescent body, and the fluorescent body in the fourth fluorescent layer is the second fluorescent body.

[0050] The mass ratio of the first phosphor, the second phosphor, the third phosphor and the fourth phosphor is 13%:70%:6%:11%; the chemical formulas of the first, second, third and fourth phosphors are Ba 0.995 Si2O2N2:0.005Eu、Y 2.95 Al 3.5 Ga 1.5 O 12 :0.05Ce、Ca 0.985 AlSiN3:0.0015Eu、K 1.99 SiF6:0.01Eu.

[0051] The packaging process for preparing the layered packaged full-spectrum light-emitting device is to package the lower fluorescent layer, the third fluorescent layer and the fourth fluorescent layer in sequence. The packaging method for each fluorescent layer is: the phosphor is mixed evenly with the packaging glue according to the mass ratio, and after centrifugation and degassing, it is loaded into the dispensing machine for dispensing, and after drying, the next fluorescent layer is packaged.

[0052] Comparative Example 1

[0053] This comparative example is set based on Example 1, with the difference being that the fluorescent layer is not layered and packaged, and other conditions are consistent with Example 1.

[0054] Comparative Example 2

[0055] This comparative example is set based on Example 1, the difference being that the powders of the first phosphor layer and the second phosphor layer are swapped, and other conditions are the same as those of Example 1.

[0056] Comparative Example 3

[0057] This comparative example is set based on Example 3, the difference being that the phosphors of the upper phosphor layer and the lower phosphor layer are swapped, and other conditions are the same as those of Example 3.

[0058] Performance Testing

[0059] The full-spectrum phosphor mixture light-emitting devices prepared in Examples 1-6 and Comparative Examples 1-3 were respectively tested for light efficiency, color purity, color rendering index and other light-emitting properties.

[0060] Table 1 Luminous performance test results of various embodiments and comparative examples

[0061] Color temperature Light Effect Color rendering index Ra Example 1 5000 102.7％ 96.7 Example 2 4000 102.5％ 97.2 Example 3 5000 101.5％ 96.9 Example 4 4000 101.9％ 97.4 Example 5 4000 102.0％ 97.2 Comparative Example 1 5000 100.0％ 95.5 Comparative Example 2 5000 102.5％ 96.5 Comparative Example 3 5000 101.0％ 96.3

[0062] The test results in Table 1 show that the color rendering index Ra of Examples 1-5 and Comparative Examples 1-3 all reached above 96. Comparative Example 1 employed a non-layered packaging method, and the luminous efficiency of Comparative Example 1 was lower than that of Examples 1-5 and Comparative Examples 2-3. This is because the layered packaging of the fluorescent layer of the light-emitting device improves the luminous efficiency of the light-emitting device.

[0063] Aging performance tests were conducted on the full-spectrum phosphor mixture light-emitting devices produced in Examples 1-5 and Comparative Examples 1-3. Luminous efficacy and color coordinate differences were measured at 250 hours, 500 hours, 750 hours, and 1000 hours, respectively. The results are shown in Tables 2 and 3. Aging tests were conducted using a programmable constant temperature and humidity test chamber from Dongguan Weihuang Testing Equipment Co., Ltd. at an aging temperature of 85°C, an aging humidity of 85%, and a chip current of 100 mA.

[0064] Table 2 Aging light efficiency test results of various embodiments and comparative examples

[0065] 0 hours 250 hours 750 hours 1000 hours Example 1 100％ 99.5％ 98.6％ 97.6％ Example 2 100％ 99.6％ 98.8％ 97.8％ Example 3 100％ 99.4％ 98.2％ 97.0％ Example 4 100％ 99.5％ 98.5％ 97.3％ Example 5 100％ 99.5％ 98.5％ 97.4％ Comparative Example 1 100％ 98.5％ 96.0％ 94.3％ Comparative Example 2 100％ 99.0％ 97.4％ 95.9％ Comparative Example 3 100％ 98.9％ 97.0％ 95.5％

[0066] Table 3 Aging color coordinate difference test results of each embodiment and comparative example

[0067]

[0068]

[0069] Combining the data in Tables 2 and 3, it can be seen that the luminous efficacy of the light-emitting devices of Examples 1-5 only decreased by less than 3% after 1000 hours of aging, and the color coordinate deviations ΔX and ΔY were only within 0.007. However, the luminous efficacy of the light-emitting devices of Comparative Examples 1-3 decreased by more than 4% after 1000 hours of aging, and the luminous efficacy of Comparative Example 1 decreased by 5.7%. The color coordinate deviations ΔX and ΔY of Comparative Examples 1-3 all exceeded 0.01. This is because the special layered packaging of the phosphor layer helps improve the aging performance of the light-emitting device.

Claims

1. A layered packaged full-spectrum light-emitting device, comprising an excitation light source and a fluorescent layer, wherein the fluorescent layer is composed of a phosphor and an encapsulating adhesive, characterized in that: The phosphors include a first phosphor, a second phosphor, a third phosphor and a fourth phosphor; The first phosphor has the chemical formula M1 1-x1 Si2O2N2:x1Eu, wherein M1 is at least one of Ca, Sr and Ba, 0.001≤x1≤0.05; The second phosphor has the chemical formula M2 3-x2 M35O 12 :x2Ce, wherein M2 is at least one of Y and Lu, M3 is at least one of Al and Ga, 0.001≤x2≤0.1; The third phosphor has the chemical formula M4 1-x3 AlSiN3:x3Eu, wherein M4 is at least one of Ca, Sr and Ba, and 0.001≤x3≤0.1; The fourth phosphor has a chemical formula of K 2-x4 SiF6:x4Eu, 0.001≤x4≤0.05; The mass ratio of the first phosphor, the second phosphor, the third phosphor and the fourth phosphor is: (5%-40%): (30%-90%): (1%-10%): (10%-30%); The fluorescent layer includes a lower fluorescent layer and an upper fluorescent layer, and the upper fluorescent layer is arranged above the lower fluorescent layer; the fluorescent bodies in the lower fluorescent layer include a third fluorescent body and a fourth fluorescent body, and the fluorescent bodies in the upper fluorescent layer include a first fluorescent body and a second fluorescent body.

2. The layered packaged full-spectrum light-emitting device according to claim 1, characterized in that: The upper fluorescent layer consists of a third fluorescent layer and a fourth fluorescent layer, and the fourth fluorescent layer is arranged above the third fluorescent layer; the fluorescent body in the third fluorescent layer is a first fluorescent body, and the fluorescent body in the fourth fluorescent layer is a second fluorescent body.

3. The layered packaged full-spectrum light-emitting device according to claim 1, characterized in that: The lower fluorescent layer consists of a first fluorescent layer and a second fluorescent layer, and the second fluorescent layer is arranged above the first fluorescent layer; the fluorescent body in the first fluorescent layer is a third fluorescent body, and the fluorescent body in the second fluorescent layer is a fourth fluorescent body.

4. The layered packaged full-spectrum light-emitting device according to claim 1, characterized in that: The excitation light source is a GaN-based LED blue light chip, and the LED peak wavelength range is 440nm-470nm.

5. The layered packaged full-spectrum light-emitting device according to claim 1, characterized in that: The peak emission wavelength range of the first phosphor is 470-500 nm; the peak emission wavelength range of the second phosphor is 500-590 nm; the peak emission wavelength range of the third phosphor is 590-670 nm; and the peak emission wavelength range of the fourth phosphor is 590-650 nm.

6. The packaging process of the layered packaged full-spectrum light-emitting device according to any one of claims 1 to 5, characterized in that: The specific steps include: According to the layering method of the fluorescent layers of the full-spectrum fluorescent mixture light-emitting device, each fluorescent layer is encapsulated in sequence from bottom to top to obtain the full-spectrum fluorescent mixture light-emitting device.

7. The packaging process of the full-spectrum phosphor mixture light-emitting device according to claim 6, characterized in that: The packaging process of each fluorescent layer is as follows: the fluorescent body is mixed evenly with the packaging glue according to the mass ratio, and after centrifugation and degassing, it is loaded into the dispensing machine for dispensing glue, and after drying, the next fluorescent layer is packaged.

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