A light emitting panel, a repairing method of a light emitting panel, and a display device

Abstract

The embodiment of the present application discloses a light-emitting panel, a repairing method of the light-emitting panel and a display device, the light-emitting panel comprises a driving substrate, a plurality of bonding structures located on one side of the driving substrate, and a plurality of light-emitting elements located on the side of the bonding structures away from the driving substrate, the light-emitting elements are electrically connected with the driving substrate through the bonding structures, wherein the bonding structure comprises a reversible deformable material. In the repairing process of the light-emitting panel, the light-emitting element to be replaced needs to be removed, which will cause the deformation of the bonding structure. In the above technical solution, the bonding structure comprises a reversible deformable material, and the reversible deformable material in the bonding structure has the characteristic of reversible deformation in the deformation environment, so that the bonding structure is restored, the updated light-emitting element can be normally bonded with the bonding structure, the repairing difficulty of the bonding structure in the light-emitting panel is reduced, and the repairing cost is reduced.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of display, and in particular, to a light-emitting panel, a repairing method of the light-emitting panel and a display device. BACKGROUND

[0002] At present, in actual production and application, the size of the light-emitting element is small, and in order to realize high pixel density unit, the distance between the light-emitting elements is small, which leads to a large difficulty in the repairing process of the bad points of the light-emitting panel. In the repairing process, the mainstream technology is a laser repairing scheme, which removes the light-emitting element at the bad point position by laser ablation. However, the laser removal of the light-emitting element at the bad point position will cause the bonding structure to be damaged and deformed, and after laser fine tuning, the bonding structure needs to be repaired by backfilling material, which is complex and has high cost. SUMMARY

[0003] Embodiments of the present application provide a light-emitting panel, a repairing method of the light-emitting panel and a display device, by setting the bonding structure to include reversible deformation material, when the bonding structure is deformed, the reversible deformation material in the bonding structure has the characteristic of reversible deformation in the deformation environment, so that the bonding structure is restored, reducing the repairing difficulty of the bonding structure in the light-emitting panel and reducing the repairing cost.

[0004] In a first aspect, embodiments of the present application provide a light-emitting panel, which includes a driving substrate, a plurality of bonding structures located on one side of the driving substrate, and a plurality of light-emitting elements located on the side of the bonding structure away from the driving substrate, the light-emitting elements are electrically connected with the driving substrate through the bonding structure, and the bonding structure includes reversible deformation material.

[0005] In a second aspect, embodiments of the present application further provide a repairing method of a light-emitting panel, which includes determining a to-be-repaired position in the light-emitting panel, the to-be-repaired position including a to-be-replaced light-emitting element and a first bonding structure electrically connected with the to-be-replaced light-emitting element; wherein the first bonding structure is located on one side of the driving substrate, and the to-be-replaced light-emitting element is located on the side of the first bonding structure away from the driving substrate;

[0006] The to-be-replaced light-emitting element is removed to make the first bonding structure have a first deformation state, and in the first deformation state, the first bonding structure has a first deformation position;

[0007] A deformation environment is provided to make the first bonding structure have a second deformation state; in the second deformation state, the first bonding structure has a second deformation position, and along the direction of the driving substrate towards the first bonding structure, the height of the first deformation position is less than the height of the second deformation position;

[0008] transporting a first light emitting element to the position to be repaired, the first light emitting element being in contact with the first bonding structure.

[0009] In a third aspect, the embodiments of the present application further provide a display device, comprising the light emitting panel of any of the first aspect.

[0010] The light emitting panel provided by the present application comprises a plurality of bonding structures on the side of the driving substrate, and a plurality of light emitting elements are electrically connected to the driving substrate through the bonding structures. The bonding structure comprises reversible deformable material. In the repair process of the light emitting panel, after the position to be repaired in the light emitting panel is determined, the light emitting element to be replaced needs to be removed, which will cause the deformation of the bonding structure. Therefore, the reversible deformable material is arranged in the bonding structure, and the reversible deformable material has the characteristic of reversible deformation in the deformation environment, so that the bonding structure recovers in the deformation environment and is bonded with the light emitting element. Compared with the repair scheme of the bonding structure by backfilling material in the prior art, the repair difficulty of the bonding structure in the light emitting panel is reduced, and the cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some specific embodiments of the present application. For those skilled in the art, based on the basic concepts of device structure, driving method and manufacturing method disclosed and suggested by various embodiments of the present application, other structures and drawings can be expanded and extended, and it is needless to say that these should be within the scope of the claims of the present application.

[0012] Figure 1 is a structural schematic diagram of a light emitting panel provided by an embodiment of the present application;

[0013] Figure 2 is Figure 1 is a sectional structure diagram along the direction of A-A' in the above-mentioned embodiment;

[0014] Figure 3 is Figure 1 is another sectional structure diagram along the direction of A-A' in the above-mentioned embodiment;

[0015] Figure 4 is a schematic diagram of a bonding structure provided by an embodiment of the present application changing from a first deformation state to a second deformation state;

[0016] Figure 5 is Figure 1 is another sectional structure diagram along the direction of AA' in the above-mentioned embodiment;

[0017] Figure 6 is a schematic diagram of a bonding structure provided by an embodiment of the present application;

[0018] Figure 7 is a schematic diagram of another bonding structure provided by an embodiment of the present application;

[0019] Figure 8 is a schematic diagram of a first part and a second part in an external environment provided by an embodiment of the present application;

[0020] Figure 9 is a schematic diagram of the bonding structure in the external environment when the reversible deformability is the same provided by an embodiment of the present application;

[0021] Figure 10 is a flowchart of a repair method of a light-emitting panel provided by an embodiment of the present application;

[0022] Figure 11 is a specific flowchart of a repair process provided by an embodiment of the present application;

[0023] Figure 12 is a flowchart of another repair method of a light-emitting panel provided by an embodiment of the present application;

[0024] Figure 13 is a flowchart of another repair method of a light-emitting panel provided by an embodiment of the present application;

[0025] Figure 14 is a structural schematic diagram of a display device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0026] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described in detail below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the basic concepts disclosed and suggested in the embodiments of the present application, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present application.

[0027] Figure 1 is a structural schematic diagram of a light-emitting panel provided by an embodiment of the present application, Figure 2 is Figure 1 is a sectional structural diagram along the direction of A-A', in combination with Figure 1 and Figure 2 As shown in the drawings, the present application provides a light-emitting panel 01 including a driving substrate 10, a plurality of bonding structures 20 located on one side of the driving substrate 10, a plurality of light-emitting elements 30 located on the side of the bonding structure 20 away from the driving substrate 10, and the light-emitting elements 30 are electrically connected to the driving substrate 10 through the bonding structure 20, wherein the bonding structure 20 includes a reversible deformable material.

[0028] As an example, Figure 2 As shown in the figure, the light emitting element 30 is arranged on the side of the driving substrate 10 and is electrically connected with the driving substrate 10 through the bonding structure 20 arranged between the light emitting element 30 and the driving substrate 10, the driving substrate 10 is used to provide a driving signal for the light emitting element 30 to emit light, the driving signal may, for example, include an anode signal, a cathode signal and a data signal, so as to ensure that the light emitting element 30 can normally emit light and display. Optionally, the driving substrate 10 is provided with a driving circuit (not shown in the figure) for driving the light emitting element 30 to emit light, the driving circuit is electrically connected with the light emitting element 30 through the bonding structure 20 and is used to drive the light emitting element 30 to emit light. According to different driving modes of the light emitting element 30, the specific arrangement mode of the driving circuit can be different. Specifically, when the driving mode of the light emitting element 30 is active driving, the driving circuit can include a plurality of thin film transistors, the light emitting element 30 is driven to emit light through the thin film transistors; when the driving mode of the light emitting element 30 is passive driving, the driving circuit can include a cathode signal line and an anode signal line, the cathode signal line and the anode signal line are used to provide the cathode signal and the anode signal required by the light emitting element 30 to emit light, and the light emitting element 30 is driven to emit light. The specific arrangement mode of the driving circuit is not described in the embodiment of the application.

[0029] The light emitting element 30 can include a light emitting diode, the light emitting diode can include a light emitting body 310 and an electrode 320 arranged between the light emitting body 310 and the bonding structure 20, the light emitting body 310 can further include a P-type semiconductor layer, a light emitting composite layer and an N-type semiconductor layer, and correspondingly, the electrode 320 can include an anode and a cathode. The anode is electrically connected with the bonding structure 20 and the P-type semiconductor layer respectively, and the P-type semiconductor layer is provided with holes through the driving substrate 10. The cathode is electrically connected with the bonding structure 20 and the N-type semiconductor layer respectively, and the N-type semiconductor layer is provided with electrons through the driving substrate 10. The electrons and the holes are combined in the light emitting composite layer to emit light, so that the light emitting element 30 can normally emit light and display.

[0030] It should be noted that the embodiment of the application can also include other structures required to ensure the normal work of the light emitting panel, which will not be described here.

[0031] The bonding structure 20 is located between the light emitting element 30 and the driving substrate 10 and is used to bond the light emitting element 30, and the bonding structure 20 includes a conductive material, so that the driving substrate 10 provides a driving signal for the light emitting element 10 through the bonding structure 20. At present, in the process of repairing the bad points of the light emitting panel, the light emitting element to be replaced needs to be removed, which will cause the bonding structure 20 bonded with the light emitting element to be replaced to deform and lose the bonding function of the light emitting element 30, so after the light emitting element to be replaced is removed, a backfilling material is needed to repair the bonding structure 20, so that the bonding structure 20 can normally bond with the replaced light emitting element, the repair process is complex and the cost is relatively high.

[0032] To this end, the bonding structure 20 provided by the embodiment of the present application includes reversible deformable material, which has the characteristic of reversible deformability under a deformation environment, that is, after the deformation of the bonding structure 20, the bonding structure 20 can be restored by providing a deformation environment for the bonding structure 20, so that the bonding structure 20 can be normally bonded with the light emitting element 30. Compared with the scheme of repairing the bonding structure 20 by backfilling material in the prior art, the repair difficulty of the bonding structure 20 in the light emitting panel 01 can be reduced, and the repair cost of the light emitting panel is reduced.

[0033] It should be noted that the reversible deformable material of the embodiment of the present application can also have the characteristic of not being damaged during the repair process. Thus, after the deformation of the bonding structure 20, only the deformation environment needs to be provided for the bonding structure 20, which can be reused, further reducing the repair cost of the light emitting panel.

[0034] It should also be noted that Figure 2 Only the bonding structure 20 is described as a whole structure, which is bonded with the electrode 320 of the light emitting element 30, but the present application is not limited thereto, Figure 3 is Figure 1 another cross-sectional structure diagram in the direction of A-A' in the Figure 3 bonding structure 20 can also include a first bonding structure part 20a and a second bonding structure part 20b, the first bonding structure part 20a is bonded with one of the electrodes of the light emitting element 30, and the second bonding structure part 20b is bonded with the other electrode of the light emitting element 30, so as to realize the electrical connection between the driving substrate 10 and the light emitting element 30 through the first bonding structure part 20a and the second bonding structure part 20b, and ensure the normal work of the light emitting element 30.

[0035] In summary, the embodiment of the present application sets the bonding structure to include reversible deformable material. In the repair process of the light emitting panel, the reversible deformable material is used to provide a deformation environment for the bonding structure, so that the bonding structure is restored, so that the bonding structure can be normally bonded with the light emitting element. Compared with the scheme of repairing the bonding structure by backfilling material in the prior art, the repair difficulty of the bonding structure in the light emitting panel can be reduced, and the repair cost of the light emitting panel is reduced.

[0036] Specifically, Figure 4 is a schematic diagram of the bonding structure provided by the embodiment of the present application changing from a first deformation state to a second deformation state, referring to Figure 4 The bonding structure 20 includes reversible deformable material. In the repair process of the light emitting panel, after the light emitting element to be repaired is removed, the bonding structure 20 has a first deformation state, as shown in Figure 3As shown, in the first deformation state, the bonding structure 20 is recessed downward away from the surface of the driving substrate 10 side, and has a first deformation position 201. Further, by providing a deformation environment to the bonding structure 20, the bonding structure can change from the first deformation state to the second deformation state. In this process, the first deformation position 201 recovers towards the side away from the driving substrate, so that the bonding structure 20 has a second deformation position 202 in the second deformation state. The second deformation position 202 can restore the viscosity of the bonding structure 20, i.e., the bonding structure 20 can normally bond with the light emitting element.

[0037] It should be noted that, Figure 4 The second deformation position 202 is only one example of the second deformation position 202, and the present application does not limit the specific position of the second deformation position 202 in the second deformation state. That is, the second deformation position 202 can be the position of the bonding structure 20 without deformation (no recess), can be the position that is not completely restored to the position without deformation (with a recess), or can be the position that is completely restored and protrudes towards the side away from the driving substrate 10. As long as the bonding structure 20 can restore the viscosity, i.e., the bonding structure 20 can normally bond with the light emitting element 30.

[0038] Continuing to refer to Figure 4 The specific materials of the reversible material will be described below in different deformation environments.

[0039] For example, the bonding structure 20 includes a thermally reversible material.

[0040] Specifically, the thermally reversible material can have the characteristic of reversibility under heating conditions. For example, in the repair process of the light emitting panel, after removing the light emitting element 30 to be repaired, the bonding structure 20 deforms to have the first deformation state. The first deformation state can be that the bonding structure 20 is recessed towards the side of the driving substrate 10 and has a first deformation position 201. After heating the driving substrate 10 to a set temperature (the set temperature can be 80-90°C), the bonding structure 20 recovers towards the side away from the driving substrate 10, so that the bonding structure 20 has a second deformation state. Without heating the bonding structure 20, the bonding structure 20 stabilizes in the second deformation state. In the second deformation state, the bonding structure 20 has a second deformation position 202, which can restore the viscosity of the bonding structure 20, i.e., the bonding structure 20 can normally bond with the light emitting element 30. Further, the repair difficulty of the bonding structure in the light emitting panel is reduced, and the repair cost of the light emitting panel is reduced.

[0041] Exemplarily, the thermally reversible deformable material can include a thermally reversible shape memory polymer material. For example, a shape memory polyurethane material, a copolymer of PEO-PET, a shape memory material P(AA-co_MMA)-C16TAB complex of supramolecular structure, a P(AA-co_MMA)-PEG shape memory material, etc. By setting the thermally reversible deformable material to include the thermally reversible shape memory polymer material, it is beneficial to reduce the repair difficulty of the bonding structure in the light emitting panel.

[0042] Exemplarily, the bonding structure 20 includes a photo-reversible deformable material.

[0043] Specifically, the photo-reversible deformable material can have the characteristic of reversible deformation under light conditions. For example, in the repair process of the light emitting panel, after removing the light emitting element 30 to be repaired, the bonding structure 20 deforms to have a first deformation state. The first deformation state can be that the bonding structure 20 is concave toward the side of the driving substrate 10 and has a first deformation position 201. The photo-reversible deformable material is placed under light conditions, the bonding structure 20 is repaired toward the side away from the driving substrate 10, so that the bonding structure 20 has a second deformation state. After removing the light conditions, the bonding structure 20 is stable in the second deformation state. In the second deformation state, the bonding structure 20 has a second deformation position 202, which can make the bonding structure 20 restore the viscosity, that is, the bonding structure 20 can normally bond with the light emitting element 30, thereby reducing the repair difficulty of the bonding structure in the light emitting panel and reducing the repair cost of the light emitting panel.

[0044] Exemplarily, the light-induced reversible deformable material can include a light-sensitive reversible deformable glue material, a light-induced shape memory polymer material, or a polymer gel. The light-sensitive reversible deformable glue material is a composite film composed of a liquid crystal polymer containing a cross-linked liquid crystal elastomer with a light-sensitive azobenzene liquid crystal unit and a highly ordered carbon nanotube film. The light-induced shape memory polymer material can be a shape memory polymer (SMP) or a thermosensitive shape memory polymer (TSMP), which has the characteristics of large deformation, easy shaping, adjustable shape recovery temperature, and convenient processing, and is rich in variety. According to the difference of the fixed phase structure, it can be divided into thermoplastic TSMP and thermosetting TSMP. In addition, the addition of carbon black and carbon nanotubes in polyurethane can form an infrared light-induced shape memory material. The polymer gel is a three-dimensional network or interpenetrating network formed by cross-linking polymerization of molecular chains and a solvent (usually water). The cross-linked structure makes it insoluble and maintains a certain shape. The presence of osmotic pressure makes it swell to reach volume balance. Such polymer gels can change in volume due to differences in solvent type, salt concentration, pH, temperature, and different electrical stimulation and light radiation. Further, by providing the thermally reversible deformable material including the light-sensitive reversible deformable glue material, the light-induced shape memory polymer material, or the polymer gel, it is beneficial to reduce the repair difficulty of the bonding structure in the light-emitting panel.

[0045] Exemplarily, the bonding structure 20 includes a magnetically reversible deformable material.

[0046] Specifically, the magnetically reversible deformable material can have the characteristic of reversible deformation in a magnetic environment. For example, during the repair process of the light-emitting panel, after removing the light-emitting element 30 to be repaired, the bonding structure 20 deforms to have a first deformation state. The first deformation state can be that the bonding structure 20 is recessed toward the side of the driving substrate 10 and has a first deformation position 201. Further, a magnetic structure is provided on the side of the driving substrate 10 away from the bonding structure 20, wherein the polarity of the magnetic structure is the same as that of the magnetically reversible deformable material. Under the action of the magnetic force, the bonding structure 20 is repaired toward the side away from the driving substrate 10, so that the bonding structure 20 has a second deformation state. In the second deformation state, the bonding structure 20 has a second deformation position 202, which can restore the adhesion of the bonding structure 20, i.e., the bonding structure 20 can normally bond with the light-emitting element 30, thereby reducing the repair difficulty of the bonding structure in the light-emitting panel and reducing the repair cost of the light-emitting panel.

[0047] Optionally, the magnetically reversible deformable material comprises a magnetic material. The magnetic material can be iron, cobalt, nickel or the like, and the magnetic material can react to a magnetic field in some way. According to the strength of the magnetism exhibited by a substance in an external magnetic field, the substance can be classified as diamagnetic, paramagnetic, ferromagnetic, antiferromagnetic, and ferrimagnetic. By providing the magnetically reversible deformable material to comprise a magnetic material, it is beneficial to reduce the difficulty of repairing the bonding structure in the light-emitting panel.

[0048] Figure 5 is Figure 1 is another cross-sectional structure diagram of the light-emitting panel along the AA' direction, as shown in Figure 5 The bonding structure 20 comprises conductive particles 210. Specifically, the bonding structure 20 is doped with the conductive particles 210, and the conductive particles 210 can be anisotropic conductive particles. Thus, the electrode 320 of the light-emitting element 30 is electrically connected to the driving substrate 10 through the conductive particles 210. Since the anisotropic conductive particles have obvious difference in the resistance characteristics between the Z-axis electrical conduction direction and the XY insulating plane, the electrode 320 and the driving substrate 10 are connected through the conductive particles 210 in the bonding structure 20, so that the conduction between the anode and the cathode in the electrode 320 is avoided, and the normal connection of the light-emitting element 30 and the driving substrate 10 is ensured.

[0049] It should be noted that Figure 5 is a straight line, and those skilled in the art can know that the XY insulating plane should be a plane and parallel to the plane where the driving substrate 10 is located.

[0050] Optionally, Figure 6 is a schematic diagram of a bonding structure provided by an embodiment of the present application, Figure 7 is a schematic diagram of another bonding structure provided by an embodiment of the present application, as shown in Figure 6 and Figure 7 The bonding structure 20 comprises a first surface 220 away from the driving substrate 10, and at least part of the first surface 220 is recessed toward the side close to the driving substrate 10; or the first surface 220 is convex toward the side away from the driving substrate 10.

[0051] Specifically, the bonding structure 20 can be patterned through an exposure process, so that the bonding structure 20 has a groove shape or a convex shape. As shown in Figure 6 The bonding structure 20 comprises a first surface 220 away from the driving substrate 10, and at least part of the first surface 220 is recessed to form a groove toward the side close to the driving substrate 10, so that the groove formed by the first surface 220 is bonded with the light-emitting element 30; or as shown in Figure 7As shown, the bonding structure 20 includes a first surface 220 away from the driving substrate 10, and at least part of the first surface 220 is convex toward the side away from the driving substrate 10, and then the bonding structure 20 is bonded to the light emitting element 30 through the convex of the first surface 220. In the embodiment of the present application, the first surface 220 is provided with a groove through patterning of the bonding structure 20, or the first surface 220 is convex toward the side away from the driving substrate 10, which is conducive to bonding of the bonding structure 20 to the light emitting element 30, and is conducive to removal of the light emitting element to be replaced in the repair process of the light emitting panel.

[0052] Figure 8 is a schematic diagram of the first part and the second part in the external environment provided by the embodiment of the present application, Figure 9 is a schematic diagram of the bonding structure in the external environment when the reversible deformability is the same, see Figure 8 , the light emitting element 30 includes an electrode 320, the bonding structure 20 includes a first part 230 and a second part 240, and along the thickness direction of the light emitting panel, the first part 230 at least partially overlaps the electrode 320, and the second part 240 is staggered with the electrode 320. Among them, the reversible deformability of the first part 230 is greater than that of the second part 240.

[0053] Specifically, as shown in Figure 8 , the light emitting element 30 includes an electrode 320, the bonding structure 20 includes a first part 230 and a second part 240, and along the thickness direction of the light emitting panel, the electrode 320 at least partially overlaps the first part 230, and the projection of the electrode 320 on the plane where the driving substrate 10 is located is staggered with the projection of the second part 240 on the plane where the driving substrate 10 is located, and the projection of the first part 230 on the plane where the driving substrate 10 is located is staggered with the projection of the second part 240 on the plane where the driving substrate 10 is located, and then by setting the reversible deformability of the first part 230 greater than that of the second part 240, when the bonding structure 20 deforms, the deformation amount of the first part 230 overlapping the electrode 320 is greater than that of the second part 240 staggered with the electrode 320, the first part 230 with a larger deformation amount is separated from the electrode 320, and the second part 240 with a smaller deformation amount or without deformation supports the light emitting element 30, preventing the deformation amount of the whole bonding structure 20 as shown in Figure 9 is the same, the whole light emitting element 30 sinks to the bonding structure 20 under external conditions, resulting in poor separation effect of the electrode 320 from the bonding structure 20, and then reducing the difficulty of removing the light emitting element to be replaced.

[0054] It should be noted that the reversible deformation mentioned above can refer to the deformation degree of the bonding structure 20 under the external environment, and the reversible deformation of the first part 230 is greater than that of the second part 240, that is, the deformation degree of the first part 230 is greater than that of the second part 240 under the action of the external environment. Optionally, the light emitting element 30 includes a micro light emitting diode. Specifically, the light emitting element 30 can be a light emitting diode, and the light emitting diode can include a micro light emitting diode. The micro diode can be a Micro-LED and a Mini-LED. The Micro LED is a high-density micro-size LED array integrated on a chip, which inherits the characteristics of inorganic LED such as high efficiency, high brightness, high reliability, and fast response time, and has the characteristics of self-luminous and no need for a backlight source. Compared with LCD and OLED, it has greater advantages in brightness, resolution, contrast, energy consumption, service life, response speed, and thermal stability. Mini-LED, also known as "sub-millimeter light emitting diode", uses 100-200 micrometer LED crystals, which is an improved version of traditional LED backlight. Using Mini-LED can produce a display screen with 0.5-1.2 millimeter pixel particles, which is much better than traditional LED screens.

[0055] Based on the above-mentioned inventive concept, the present embodiment further provides a repairing method of a light emitting panel. Figure 10 FIG. 1 is a flow diagram of a repairing method of a light emitting panel provided by an embodiment of the present application, Figure 11 FIG. 2 is a specific flow diagram of a repairing process provided by an embodiment of the present application. Referring to Figure 10 and Figure 11 The repairing method of the light emitting panel provided by the present embodiment includes:

[0056] S110, determining a to-be-repaired position in the light emitting panel.

[0057] Exemplarily, the light emitting panel includes a driving substrate 10, a plurality of bonding structures 20 located on one side of the driving substrate 10, and a plurality of light emitting elements 30 located on the side of the bonding structure 20 away from the driving substrate 10. The light emitting elements 30 are electrically connected to the driving substrate 10 through the bonding structures 20, so that the driving substrate 10 provides driving signals for the light emitting elements 30 through the bonding structures 20, and ensures the normal work of the light emitting elements 30.

[0058] Specifically, the light emitting elements 30 in the light emitting panel are detected through a specific detection process. When a display abnormal light emitting element 30 is detected, the display abnormal light emitting element 30 is determined as a to-be-replaced light emitting element 330. The to-be-repaired position includes the to-be-replaced light emitting element 330 and a first bonding structure 250 electrically connected to the to-be-replaced light emitting element 330.

[0059] S120, removing the to-be-replaced light emitting element, and the first bonding structure has a first deformation state.

[0060] After the to-be-repaired position is determined, the bad pixel is repaired by using the bad pixel rejection and the repair method of single placement at the fixed point, that is, the to-be-replaced light emitting element 330 needs to be removed, and in the process of removing the to-be-replaced light emitting element by external force, the first bonding structure 250 electrically connected with the to-be-replaced light emitting element 330 will be deformed under the action of external force and has a first deformation state. Since the external force is applied to the to-be-replaced light emitting element 330, the first deformation state can be that the bonding structure 20 is recessed towards the side of the driving substrate 10, and further in the first deformation state, the first bonding structure has a first deformation position 201, and in the first deformation position 201, the first bonding structure cannot be bonded with the light emitting element.

[0061] S130, providing a deformation environment to make the first bonding structure have a second deformation state.

[0062] Specifically, the deformation environment is provided for the first bonding structure 250, and the deformation environment can include light, heating or magnetic environment, etc. Since the first bonding structure 250 includes reversible material, the first bonding structure 250 is repaired towards the side away from the driving substrate in the deformation environment, and is repaired from the first deformation state to the second deformation state. In the second deformation state, the first bonding structure 250 has a second deformation position 202, the height of the first deformation position 201 is less than the height of the second deformation position 202 along the direction of the driving substrate 10 towards the first bonding structure 250, and the first bonding structure 250 can normally be bonded with the light emitting element 30 in the second deformation position 202, so that it is not necessary to repair by backfilling material into the first bonding structure 250, thereby reducing the repair difficulty of the bonding structure in the light emitting panel and reducing the repair cost of the light emitting panel.

[0063] It should be noted that the present embodiment does not limit the specific position of the second deformation position 202 in the second deformation state, that is, the second deformation position 202 can be the position of the first bonding structure 250 without deformation (without recess), can be the position without completely recovering to the position without deformation (with recess), or can be the position of completely recovering and protruding towards the side away from the driving substrate 10, as long as the first bonding structure 250 can recover the adhesion, that is, the bonding structure can be normally bonded with the light emitting element.

[0064] It should be further explained that the position of the deformation environment provided by the embodiment of the present application is not limited, that is, the deformation environment can be provided to the first bonding structure 250 from the side of the driving substrate 10 away from the first bonding structure 250, or the deformation environment can be provided to the first bonding structure 250 from the side of the driving substrate 10 toward the first bonding structure 250, or the deformation environment can be provided to the whole light-emitting panel, and those skilled in the art can set it according to the needs.

[0065] S140, transporting the first light-emitting element to the position to be repaired, the first light-emitting element being in contact with the first bonding structure.

[0066] After the repair of the first bonding structure 250 is completed, the first light-emitting element 340 is transported to the position to be repaired, and the first light-emitting element 340 is in contact with the first bonding structure 250 to be bonded, so that the driving substrate 10 is electrically connected to the first light-emitting element 340 through the first bonding structure 250. The first light-emitting element 340 can be a normal light-emitting element, that is, the first light-emitting element 340 can ensure normal light emission after receiving the driving signal of the driving substrate 10.

[0067] In summary, the repair method of the light-emitting panel provided by the embodiment of the present application can provide a deformation environment to the first bonding structure after removing the light-emitting element to be replaced, and use the reversible deformation characteristics of the inverse deformation material in the first bonding structure under the deformation environment to repair the first bonding structure from the first deformation state to the second deformation state, so that the first bonding structure can be normally bonded with the first light-emitting element. Compared with the prior art which needs to repair the bonding structure by backfilling material, the repair difficulty of the bonding structure in the light-emitting panel can be reduced, and the repair cost of the light-emitting panel can be reduced.

[0068] As a feasible implementation manner, the first bonding structure can include a thermally reversible deformation material, Figure 12 is another flowchart of the repair method of the light-emitting panel provided by the embodiment of the present application, referring to Figure 12 The repair method of the light-emitting panel provided by the embodiment of the present application includes:

[0069] S210, providing a driving substrate, preparing a bonding structure layer on one side of the driving substrate and patterning the bonding structure layer to obtain a plurality of independently arranged bonding structures, and transporting a plurality of light-emitting elements to the side of the bonding structure away from the driving substrate, so that the light-emitting elements are electrically connected to the driving substrate through the bonding structure.

[0070] Exemplarily, the driving substrate can include a substrate and a driving circuit, and the substrate can be a transparent substrate. The driving circuit mainly includes a driving element and a trace connected between the driving element and an electrode of the light emitting element, so as to provide a control signal for the light emitting element through the trace to control the light emitting element to emit light. According to the driving mode of the light emitting element, an active driving circuit or a passive driving circuit can be designed accordingly, which can be designed by those skilled in the art, and the embodiments of the present application are not limited thereto.

[0071] Further, a bonding structure layer including a reversible deformation material is prepared on one side of the driving substrate, and the bonding structure layer has the characteristic of reversible deformation under deformation environment. The bonding structure layer is patterned to obtain a plurality of independently arranged bonding structures. The bonding structures are transported away from the one side of the driving substrate by a transfer substrate, and the light emitting elements are electrically connected to the driving substrate through the bonding structures. The independent arrangement of the bonding structures can be understood as ensuring that the bonding structures are bonded to the corresponding light emitting elements respectively and transmit the driving signal, and the adjacent bonding structures do not affect each other. In addition, the first surface of the patterned bonding structure can be provided with a groove, or the first surface is protruded away from the one side of the driving substrate, which is beneficial to remove the light emitting element to be replaced in the repair process of the light emitting panel.

[0072] S220, determining the position to be repaired in the light emitting panel.

[0073] S230, removing the light emitting element to be replaced by laser burning, and the first bonding structure has a first deformation state.

[0074] Specifically, the light emitting element to be replaced can be removed by laser burning. Under the action of laser, the first bonding structure will be extruded to deform and have a first deformation state. The first deformation state is that the first bonding structure is recessed toward the one side of the driving substrate. Further, in the first deformation state, the first bonding structure has a first deformation position, and in the first deformation position, the first bonding structure cannot be bonded to the light emitting element.

[0075] S240, heating the first bonding structure from the one side of the driving substrate away from the first bonding structure to adjust the first bonding structure to have a second deformation position.

[0076] Specifically, the first bonding structure can include a thermally reversible deformable material, which has the characteristic of reversible deformation under heating, and the first bonding structure is heated from the side of the driving substrate away from the first bonding structure. After being heated to a set temperature (which can be 80-100 DEG C), the first bonding structure is repaired towards the side away from the driving substrate, so that the first bonding structure changes from the first deformed state to the second deformed state. After the first bonding structure is not heated, the first bonding structure is stable in the second deformed state. In the second deformed state, the first bonding structure has a second deformed position, which can restore the adhesion of the first bonding structure, i.e. the first bonding structure can normally bond with the light emitting element, thereby reducing the repair difficulty of the bonding structure in the light emitting panel and reducing the repair cost of the light emitting panel.

[0077] S250, transporting the first light emitting element to the to-be-repaired position, and the first light emitting element is in contact with the first bonding structure.

[0078] In summary, the first bonding structure in the embodiment of the present application includes a thermally reversible deformable material. After removing the to-be-replaced light emitting element, the first bonding structure is heated from the side of the driving substrate away from the first bonding structure. The thermally reversible deformable material has the characteristic of reversible deformation under heating, so that the first bonding structure is repaired towards the side away from the driving substrate, from the first deformed state to the second deformed state. The first deformed state includes a first deformed position, and the second deformed state includes a second deformed position. In the direction of the driving substrate towards the first bonding structure, the height of the first deformed position is less than the height of the second deformed position. The second deformed position can restore the adhesion of the first bonding structure, i.e. the first bonding structure can normally bond with the light emitting element, thereby reducing the repair difficulty of the bonding structure in the light emitting panel and reducing the repair cost of the light emitting panel.

[0079] On the basis of the above embodiment, the first bonding structure can include a magnetically reversible deformable material, wherein the magnetically reversible deformable material includes a magnetic material. Based on this, Figure 13 is a flowchart of another repair method of a light emitting panel provided by the embodiment of the present application, as Figure 13 shown, the repair method of the light emitting panel provided by the embodiment of the present application includes:

[0080] S310, providing a driving substrate, preparing a bonding structure layer on one side of the driving substrate and patterning the bonding structure layer to obtain a plurality of independently arranged bonding structures, and transporting a plurality of light emitting elements away from the driving substrate side of the bonding structure. The light emitting element is electrically connected to the driving substrate through the bonding structure.

[0081] S320, determining the to-be-repaired position in the light emitting panel.

[0082] S330, remove the to-be-replaced light emitting element by laser ablation, and the first bonding structure has a first deformation state.

[0083] S340, a magnetic structure is arranged on the side of the driving substrate away from the first bonding structure, and the polarity of the magnetic structure is the same as that of the magnetic material, so as to adjust the first bonding structure to have a second deformation position.

[0084] Specifically, the first bonding structure can include a magnetically reversible material, and the magnetically reversible material includes a magnetic material. The magnetic material has the characteristic of reversible deformation under a magnetic condition. Then, the magnetic structure is arranged on the side of the driving substrate away from the first bonding structure, and the polarity of the magnetic structure is the same as that of the magnetic material. Under the action of the magnetic force, the first bonding structure is repaired toward the side away from the driving substrate, so that the first bonding structure changes from the first deformation state to the second deformation state. In the second deformation state, the first bonding structure has a second deformation position, which can restore the adhesion of the first bonding structure, i.e., the first bonding structure can normally bond with the light emitting element. Thus, the repair difficulty of the bonding structure in the light emitting panel is reduced, and the repair cost of the light emitting panel is reduced.

[0085] S350, transport the first light emitting element to the to-be-repaired position, and the first light emitting element is in contact with the first bonding structure.

[0086] It should be noted that only when the magnetic structure is arranged on the side of the driving substrate away from the first bonding structure, can a magnetic field environment be provided for the first bonding structure. Based on the characteristics of the magnetic material, after the magnetic structure is removed, the first bonding structure can change from the second deformation state to the first deformation state. Then, after the first light emitting element is transported to the to-be-repaired position and is in contact with the first bonding structure, the magnetic structure on the driving substrate is removed. In this way, the first bonding structure can be kept in the second deformation state, and the first bonding structure changing to the first deformation state after the magnet is removed can be avoided, so that the repair is not successful.

[0087] In summary, the first bonding structure in the embodiment of the present application includes a magnetically reversible material. After the to-be-replaced light emitting element is removed, a magnetic structure is arranged on the side of the driving substrate away from the first bonding structure, and the polarity of the magnetic structure is the same as that of the magnetic material. Under the action of the magnetic force, the first bonding structure is repaired toward the side away from the driving substrate, from the first deformation state to the second deformation state. The first deformation state includes a first deformation position, and the second deformation state includes a second deformation position. In the direction of the driving substrate toward the first bonding structure, the height of the first deformation position is less than that of the second deformation position. The second deformation position can restore the adhesion of the first bonding structure, i.e., the first bonding structure can normally bond with the light emitting element. Thus, the repair difficulty of the bonding structure in the light emitting panel is reduced, and the repair cost of the light emitting panel is reduced.

[0088] Based on the above inventive concept, the embodiments of the present application further provide a display device. Figure 14 is a structural schematic diagram of a display device provided by the embodiments of the present application. As shown in Figure 14 The display device includes the light-emitting panel 01 in the above embodiments. The display device includes the light-emitting panel 01 of any of the embodiments of the present application, and therefore, the display device provided by the embodiments of the present application has the beneficial effects of the light-emitting panel 01 provided by the embodiments of the present application, which will not be described herein. Exemplarily, the display device can be an electronic device such as a mobile phone, a computer, a smart wearable device (for example, a smart watch), and a vehicle-mounted display device, and the embodiments of the present application are not limited thereto.

[0089] Note that the above are only the preferred embodiments of the present application and the technical principles applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments herein, and those skilled in the art can make various obvious changes, re-adjustments, mutual combinations and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the inventive concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A light-emitting panel, characterized in that, include; Drive substrate; Multiple bonding structures located on one side of the driving substrate; A plurality of light-emitting elements are located on the side of the bonding structure away from the driving substrate, and the light-emitting elements are electrically connected to the driving substrate through the bonding structure; The bonding structure includes a reversibly variable material; The light-emitting element includes an electrode; the bonding structure includes a first portion and a second portion, wherein along the thickness direction of the light-emitting panel, the first portion at least partially overlaps with the electrode, and the second portion is offset from the electrode; wherein the reversibility of the first portion is greater than that of the second portion.

2. The light-emitting panel according to claim 1, characterized in that, The bonding structure includes a thermo-reversibly modifiable material.

3. The light-emitting panel according to claim 1, characterized in that, The bonding structure includes a photo-induced reversible modifiable material.

4. The light-emitting panel according to claim 1, characterized in that, The bonding structure includes a magneto-reversible variable material.

5. The light-emitting panel according to claim 4, characterized in that, The magneto-reversible variable material includes magnetic materials.

6. The light-emitting panel according to claim 1, characterized in that, The bonding structure includes conductive particles.

7. The light-emitting panel according to claim 1, characterized in that, The bonding structure includes a first surface on the side away from the driving substrate; At least a portion of the first surface is recessed toward the side closer to the drive substrate; or at least a portion of the first surface is protruding toward the side farther from the drive substrate.

8. The light-emitting panel according to claim 1, characterized in that, The light-emitting element includes a miniature light-emitting diode.

9. A method for repairing a light-emitting panel, characterized in that, include: The repair location in the light-emitting panel is determined, and the repair location includes a light-emitting element to be replaced and a first bonding structure electrically connected to the light-emitting element to be replaced; wherein, the first bonding structure is located on one side of the driving substrate, and the light-emitting element to be replaced is located on the side of the first bonding structure away from the driving substrate. When the light-emitting element to be replaced is removed, the first bonding structure has a first deformation state, and in the first deformation state, the first bonding structure has a first deformation position. A deformation environment is provided so that the first bonding structure has a second deformation state; in the second deformation state, the first bonding structure has a second deformation position, and along the direction of the driving substrate toward the first bonding structure, the height of the first deformation position is less than the height of the second deformation position. The first light-emitting element is transferred to the location to be repaired, and the first light-emitting element contacts the first bonding structure, the first bonding structure comprising a reversible variable material.

10. The repair method according to claim 9, characterized in that, The removal of the light-emitting element to be replaced includes: The light-emitting element to be replaced is removed by laser ablation.

11. The repair method according to claim 9, characterized in that, Providing a deformation environment to enable the first bonded structure to have a second deformation state includes: The first bonding structure is heated from the side of the driving substrate away from the first bonding structure to adjust the first bonding structure to have a second deformation position.

12. The repair method according to claim 9, characterized in that, The first bonding structure includes a magnetic material; providing a deformation environment to enable the first bonding structure to have a second deformation state includes: A magnetic structure is provided on the side of the driving substrate away from the first bonding structure. The polarity of the magnetic structure is the same as that of the magnetic material, so as to adjust the first bonding structure to have a second deformation position.

13. The repair method according to claim 9, characterized in that, Before determining the location to be repaired in the light-emitting panel, the following steps are included: Provide driving substrate; A bonding structure layer is prepared on one side of the driving substrate and the bonding structure layer is patterned to obtain multiple independently arranged bonding structures; Multiple light-emitting elements are transferred on the side of the bonding structure away from the driving substrate, and the light-emitting elements are electrically connected to the driving substrate through the bonding structure.

14. A display device, characterized in that, Includes the light-emitting panel as described in any one of claims 1-8.

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