Housing and electronic device comprising the housing

Abstract

A housing of an electronic device and an electronic device are provided. The housing of the electronic device including at least one plate includes a first surface coupled to at least a portion of a plate of the at least one plate and facing a rear surface of the plate, and a member including a second surface substantially perpendicular to the first surface and facing a side surface of the plate, and wherein the first surface includes a protrusion protruding from the first surface toward the plate by a predetermined height, a first recess formed from the first surface by a predetermined depth, and a second recess formed from the first surface deeper than the first recess.

Description

TECHNICAL FIELD

[0001] The disclosure relates to a housing of an electronic device and an electronic device including the same. BACKGROUND

[0002] An electronic device (for example, a mobile phone) can output stored information as a sound or an image. As the degree of integration increases and high-speed high-capacity wireless communication becomes widespread, a single mobile communication terminal has multiple functions. For example, an entertainment function such as a game, a multimedia function such as reproduction of a music / video file, a communication and security function for mobile banking, etc., a dispatch function, an electronic wallet function, etc., as well as a communication function have been integrated in a single electronic device. Since the electronic device can perform various functions, a plurality of different electronic components can be included in the inside of the electronic device.

[0003] In addition, in order to protect electronic elements from external impact, a housing that defines the appearance of the electronic device needs high durability. When manufacturing the housing of the electronic device, at least one plate and a member are coupled to each other to complete the appearance of the electronic device. Various coupling methods can be used to connect the at least one plate and the member.

[0004] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the present disclosure. SUMMARY

[0005] TECHNICAL PROBLEM

[0006] Various components included in the housing of the electronic device can be coupled to each other by using an adhesive material. For example, when a plate and a member supporting the plate are coupled to each other, a method of applying an adhesive material to one side (for example, an upper surface) of the member and assembling the plate on the member to which the adhesive material is applied can be used.

[0007] In the case of using a liquid adhesive material, an object to be adhered can be deformed due to extrusion, and in some cases, a part of the adhesive material can deviate from an adhering area of the object and overflow to the outside. When manufacturing the housing of the electronic device, the adhesive material overflowing to the outside of the housing can become a cause of reducing the attractive aspect of the appearance of the electronic device.

[0008] In recent years, in an electronic device including a display, due to miniaturization of a bezel (or a black matrix (BM) area), an area for performing a seating engagement for a plate including the display is gradually reduced. Meanwhile, in order to satisfy the adhesion force required for the electronic device, a predetermined amount or more of adhesive material must be used. According to some cases, because a predetermined amount or more of adhesive material needs to be used while the bonding area of the electronic device is reduced, it can be difficult to prevent the adhesive material from leaking to the outside of the electronic device.

[0009] Aspects of the present disclosure are to address at least the above-mentioned problems and / or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the present disclosure is to provide a housing of an electronic device that fixes an appropriate amount of an adhesive material applied to a coupling source and maintains adhesion and prevents the adhesive material from overflowing to the outside of the electronic device housing.

[0010] Additional aspects will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the description and / or the examples provided herein.

[0011] Solution to the problem

[0012] According to an aspect of the present disclosure, an electronic device is provided. The electronic device includes a first plate, a second plate facing an opposite direction of the first plate, and a side member attached to or integrally formed with the second plate, surrounding a space including at least one electronic element between the first plate and the second plate, and coupled to the first plate, wherein the side member includes a first surface facing a rear surface of the first plate and a second surface substantially perpendicular to the first surface and facing a side surface of the first plate, and wherein the first surface includes a protrusion protruding upward from the first surface such that the first plate is substantially seated on the first surface, a first recess provided between the protrusion and the second surface and recessed from the first surface by a first depth along a length direction of the side member, and a second recess recessed from the first surface by a second depth along the length direction of the side member.

[0013] According to another aspect of the present disclosure, an electronic device housing including at least one plate is provided. The housing of the electronic device includes a member connected to a rear surface of a plate of the at least one plate, wherein the member includes a first surface facing a rear surface of the plate and a second surface arranged substantially perpendicular to the first surface and facing a side surface of the plate, and wherein the first surface includes a protrusion protruding upward from the first surface such that the plate is substantially seated on the first surface, a first recess recessed from the first surface by a first depth along a length direction of the member, and a second recess recessed from the first surface by a second depth along the length direction of the member.

[0014] According to another aspect of the present disclosure, an electronic device housing including at least one plate is provided. The housing of the electronic device includes a first surface coupled to at least a portion of a plate of the at least one plate and facing a rear surface of the plate, and a member including a second surface substantially perpendicular to the first surface and facing a side surface of the plate, and wherein the first surface includes a protrusion protruding a predetermined height from the first surface toward the plate, a first recess recessed by a predetermined depth from the first surface, and a second recess recessed deeper than the first recess from the first surface.

[0015] Advantages of the Invention

[0016] The electronic device and the housing of the electronic device according to various embodiments of the disclosure can prevent the adhesive material applied to the housing from overflowing, while not reducing the amount of the adhesive material.

[0017] The electronic device and the housing of the electronic device according to various embodiments of the disclosure can prevent the adhesive material from overflowing by a structural method. Accordingly, the disclosure can prevent the attractive aspect of the appearance of the electronic device from deteriorating in the process of manufacturing the housing of the electronic device.

[0018] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the disclosure;

[0021] Figure 2A is a front perspective view of an electronic device according to an embodiment of the disclosure;

[0022] Figure 2B is a rear perspective view of an electronic device according to an embodiment of the disclosure;

[0023] Figure 3 is an exploded perspective view illustrating an electronic device according to an embodiment of the disclosure;

[0024] Figure 4 is a view illustrating an enlarged perspective view of a housing of an electronic device and a portion thereof according to an embodiment of the disclosure;

[0025] Figure 5 is a view illustrating a state in which an adhesive material is applied to a side member according to an embodiment of the disclosure;

[0026] Figure 6 is a view illustrating a state in which an adhesive material is inserted between a first plate and a side member according to an embodiment of the disclosure;

[0027] Figure 7 is a view illustrating a state in which an adhesive material is inserted between a first plate and a side member according to an embodiment of the disclosure;

[0028] Figure 8 is a view illustrating a cross section of a housing according to an embodiment of the disclosure;

[0029] Figure 9 is a view illustrating a side member of an electronic device housing according to various embodiments of the present disclosure; Figure 8 is a view illustrating a side member of an electronic device housing according to various embodiments of the present disclosure;

[0030] Figure 10 is a view illustrating a cross section of an electronic device housing according to various embodiments of the present disclosure;

[0031] Figure 11A , Figure 11B and Figure 11C are views illustrating arrangement forms of protrusions according to various embodiments of the present disclosure; and

[0032] Figure 12A and Figure 12B are views illustrating a cross section of an electronic device housing according to various embodiments of the present disclosure.

[0033] In all the drawings, it should be noted that the same reference numerals are used to describe the same or similar elements, features, and structures. DETAILED DESCRIPTION

[0034] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and constructions can be omitted for clarity and conciseness.

[0035] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but are merely used to enable a clear and consistent understanding of the present disclosure. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustration purpose only and not for the purpose of limiting the present disclosure as defined by the appended claims and their equivalents.

[0036] It should be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of such surfaces.

[0037] Figure 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to Figure 1The electronic device 101 in the network environment 100 can communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 can include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one (e.g., the display device 160 or the camera module 180) of the components can be omitted from the electronic device 101, or one or more other components can be added in the electronic device 101. In some embodiments, the components in the electronic device 101 can be implemented as one or more integrated circuits. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) can be implemented as embedded in the display device 160 (e.g., a display).

[0038] The processor 120 can execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120 and can perform various data processing or computation. According to an embodiment, as at least part of the data processing or computation, the processor 120 can load a command or data received from another component (e.g., the sensor module 176 or the communication module 190) to a volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in a non-volatile memory 134. According to an embodiment, the processor 120 can include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. Additionally or alternatively, the auxiliary processor 123 can be adapted to consume less power than the main processor 121, or to be specific to a particular function. The auxiliary processor 123 can be implemented as a separate processor, or as part of the main processor 121.

[0039] The auxiliary processor 123 can control at least some of functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121, when the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121, when the main processor 121 is in an active state (e.g., executing an application), according to an embodiment. The auxiliary processor 123 (e.g., an image signal processor or a communication processor) can be implemented as a part of another component functionally related to the auxiliary processor 123 (e.g., the camera module 180 or the communication module 190), according to an embodiment.

[0040] The memory 130 can store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data can include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 can include the volatile memory 132 or the non-volatile memory 134.

[0041] The program 140 can be stored in the memory 130 as software, and can include, for example, the operating system (OS) 142, the middleware 144, or the applications 146.

[0042] The input device 150 can receive a command or data, which is used for at least one component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input device 150 can include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

[0043] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing record, and the receiver can be used for incoming calls. According to an embodiment, the receiver can be implemented as separate from the speaker, or can be implemented as a part of the speaker.

[0044] The display device 160 can visually provide information to the outside (e.g., a user) of the electronic device 101. The display device 160 can include, for example, a display, a hologram device, or a projector, and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an embodiment, the display device 160 can include a touch circuit adapted to detect a touch, or a sensor circuit (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch.

[0045] The audio module 170 can convert sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 can obtain sound through the input device 150 or output sound through the sound output device 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.

[0046] The sensor module 176 can detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 can include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0047] The interface 177 can support one or more designated protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 can include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0048] The connection terminal 178 can include a connector through which the electronic device 101 can be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connection terminal 178 can include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

[0049] The haptic module 179 can convert an electrical signal into a mechanical stimulus (e.g., a vibration or movement) or electrical stimulus that can be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 can include, for example, a motor, a piezoelectric element, or an electrical stimuluser.

[0050] The camera module 180 can capture still images or moving images. According to an embodiment, the camera module 180 can include one or more lenses, image sensors, image signal processors, or flashes.

[0051] The power management module 188 can manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0052] The battery 189 can supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 can include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0053] The communication module 190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 can include one or more communication processors that are operable independently from the processor 120 (e.g., an application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 can include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules can be implemented as a single component (e.g., a single chip) or multiple components (e.g., multiple chips) separate from each other. The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.

[0054] The antenna module 197 can transmit or receive a signal or power to or from an external device (e.g., an external electronic device) connected to the electronic device 101. According to an embodiment, the antenna module 197 can include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 can include a plurality of antennas. In this case, at least one antenna appropriate for a communication scheme used in a communication network, such as the first network 198 or the second network 199, can be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Then, the signal or the power can be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element can be additionally formed as part of the antenna module 197.

[0055] At least some of the above-described components can be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), MIPI, or a serial peripheral interface (SPI)).

[0056] According to an embodiment, commands or data can be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 and 104 can be a device of a same type as, or a different type from, the electronic device 101. According to an embodiment, all or some of the operations to be executed at the electronic device 101 can be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, can request one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request can perform the requested at least part of the function or the service, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 can provide the outcome, with or without further processing of the outcome, as a reply to the request. To that end, a cloud computing, distributed computing, or client-server computing technology can be used, for example.

[0057] Figure 2A This is a front perspective view of an electronic device according to an embodiment of the present disclosure. Figure 2B This is a rear perspective view of an electronic device according to an embodiment of the present disclosure.

[0058] Reference Figure 2A and Figure 2B The electronic device 200 according to the embodiment (e.g., Figure 1 101) may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing may refer to defining Figure 2A The structure comprises some of the first surface 210A, the second surface 210B, and the side surface 210C. According to an embodiment, the first surface 210A may be defined by a front panel 202 (e.g., a glass or polymer panel including various coatings), at least a portion of which is substantially transparent. The second surface 210B may be defined by a substantially opaque rear panel 211. The rear panel 211 may be formed, for example, of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these. The side surface 210C may be coupled to the front panel 202 and the rear panel 211 and may be defined by a side frame structure (or “side member”) 218 ​​comprising metal and / or polymer. In some embodiments, the rear panel 211 and the side frame structure 218 may be integrally formed and may comprise the same material (e.g., a metallic material such as aluminum).

[0059] In the illustrated embodiment, the front panel 202 may include two first regions 210D that deflect from the first surface 210A toward the rear panel 211 at opposite ends of the long side of the front panel 202 and extend seamlessly. (See illustrated embodiment) Figure 2A In this embodiment, the rear panel 211 may include two second regions 210E that deflect from the second surface 210B toward the front panel 202 at opposite ends of the long side of the rear panel 211 and extend seamlessly. In some embodiments, the front panel 202 (or the rear panel 211) may include only one of the first region 210D (or the second region 210E). In other embodiments, some of the first region 210D or the second region 210E may not be included. In an embodiment, when viewed from one side of the electronic device 200, the side bezel structure 218 may have a first thickness (width) on the side surface that does not include either the first region 210D or the second region 210E, and may have a second thickness less than the first thickness on the side surface that includes either the first region 210D or the second region 210E.

[0060] According to an embodiment, the electronic device 200 can include at least one of a display 201, audio modules 203, 207, 214, sensor modules 204, 216, and 219, camera modules 205, 212, and 213, a key input device 217, a light emitting element 206, and connector holes 208 and 209. In some embodiments, at least one (e.g., the key input device 217 or the light emitting element 206) of the elements can be omitted from the electronic device 200, or another component can be additionally included in the electronic device 200.

[0061] For example, the display 201 can be exposed through a corresponding portion of the front plate 202. In some embodiments, at least a portion of the display 201 can be exposed through the front plate 202 defining the first area 210D of the first surface 210A and the side surface 210C. In some embodiments, a corner of the display 201 can have substantially the same shape as an adjacent outer shape of the front plate 202. In other embodiments (not shown), in order to expand the area in which the display 201 is exposed, a gap between the outer edge of the display 201 and the outer edge of the front plate 202 can be substantially the same.

[0062] In other embodiments (not shown), a portion of a screen display area of the display 201 can have a recess or an opening, and can include at least one of the audio module 214, the sensor module 204, the camera module 205, and the light emitting element 206 aligned with the recess or the opening. In other embodiments (not shown), at least one of the audio module 214, the sensor module 204, the camera module 205, the fingerprint sensor 216, and the light emitting element 206 can be included on the rear surface of the screen display area of the display 201. In other embodiments (not shown), the display 201 can be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor that can measure the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus. In some embodiments, at least a portion of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 can be disposed in the first area 210D and / or the second area 210E.

[0063] The audio modules 203, 207, 214 can include a microphone hole 203 and speaker holes 207 and 214. A microphone for obtaining external sounds can be disposed in the microphone hole 203, and in some embodiments, a plurality of microphones can be disposed to detect the direction of sound. The speaker holes 207 and 214 can include an external speaker hole 207 and a communication receiver hole 214. In some embodiments, the speaker holes 207 and 214 and the microphone hole 203 can be implemented through one hole, or can include a speaker without using the speaker holes 207 and 214 (e.g., a piezoelectric speaker).

[0064] The sensor modules 204, 216, and 219 can generate electric signals or data values corresponding to an operational state inside the electronic device 200 or an environmental state outside. The sensor modules 204, 216, and 219, for example, can include a first sensor module 204 (e.g., a proximity sensor) and a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 210A of the housing 210 and / or a third sensor module 219 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module 216 (e.g., a fingerprint sensor) disposed on the second surface 210B of the housing 210. The fingerprint sensor can be disposed not only on the first surface 210A (e.g., the display 201) but also on the second surface 210B of the housing 210. The electronic device 200 can further include a sensor module (not shown), such as at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] The camera modules 205, 212, and 213 can include a first camera device 205 disposed on the first surface 210A of the electronic device 200 and a second camera device 212 and / or a flash 213 disposed on the second surface 210B. The camera devices 205 and 212 can include one or more lenses, image sensors, and / or image signal processors. The flash 213, for example, can include a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera and wide / telephoto lens) and image sensors can be disposed on one surface of the electronic device 200.

[0066] The key input device 217 can be disposed on the side surface 210C of the housing 210. In another embodiment, the electronic device 200 can not include some or all of the above-described key input devices 217, and the key input devices 217 not included can be implemented in a different form, such as a soft key, on the display 201. In some embodiments, the key input device can include the sensor module 216 disposed on the second surface 210B of the housing 210.

[0067] The light emitting device 206, for example, can be disposed on the first surface 210A of the housing 210. The light emitting element 206, for example, can provide status information in the form of light on the electronic device 200. In other embodiments, for example, the light emitting element 206 can provide a light source in cooperation with the operation of the camera module 205. The light emitting element 206, for example, can include a light-emitting diode (LED), an IR LED, and a xenon lamp.

[0068] The connector holes 208 and 209 can include a first connector hole 208 and / or a second connector hole (e.g., an earphone jack) 209, the first connector hole 208 can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data to and from an external electronic device, and the second connector hole 209 can accommodate a connector for transmitting and receiving an audio signal to and from an external electronic device.

[0069] Figure 3 FIG. 1 is an exploded perspective view illustrating an electronic device according to an embodiment of the disclosure.

[0070] Referring to Figure 3 , the electronic device 300 (e.g., the electronic device 200 of Figure 2A ) can include a side bezel structure 310 (e.g., the side bezel structure 218 of Figure 2A ), a first support member 311 (e.g., a bracket), a front plate 320 (e.g., the front plate 202 of Figure 2A ), a display 330 (e.g., the display 201 of Figure 2A ), a printed circuit board 340, a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear plate 380 (e.g., the rear plate 211 of Figure 2B ). In some embodiments, at least one of the elements (e.g., the first support member 311 or the second support member 360) can be omitted from the electronic device 300, or another component can be additionally included in the electronic device 300. At least one component of the electronic device 300 can be the same as or similar to at least one component of the wearable electronic device 200 of Figure 2A and Figure 2B , and a repetitive description thereof will be omitted.

[0071] The first support member 311 can be disposed inside the electronic device 300 to be connected to or integrally formed with the side bezel structure 310. For example, the first support member 311 can be formed of a metal material and / or a non-metal material (e.g., a polymer). The display 330 can be coupled to one surface of the first support member 311, and the printed circuit board 340 can be coupled to an opposite surface of the first support member 311. A processor, a memory, and / or an interface can be mounted on the printed circuit board 340. For example, the processor can include one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0072] For example, the memory can include a volatile and / or non-volatile memory.

[0073] For example, the interface can include a high definition multimedia interface (HDMI), a universal serial bus (USB), an SD card interface, and / or an audio interface. The interface can electrically or physically connect the electronic device 300 to an external electronic device, and can include a USB connector, an SD card / memory card (MMC) connector, and an audio connector, for example.

[0074] The battery 350 is a device for supplying power to at least one component of the electronic device 300, and can include, for example, a primary battery that cannot be recharged, a secondary battery that can be recharged, or a fuel cell. For example, at least a portion of the battery 350 can be disposed on substantially the same plane as the printed circuit board 340. The battery 350 can be integrally disposed inside the electronic device 300, and can be disposed to be detachable from the electronic device 300.

[0075] The antenna 370 can be disposed between the rear plate 380 and the battery 350. The antenna 370 can include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the antenna 370 can perform short-range communication with an external device, or can wirelessly transmit and receive power for charging. In another embodiment, an antenna structure can be formed by one or a combination of the side bezel structure 310 and / or the first support member 311.

[0076] Figure 4 FIG. 4A is a view showing an enlarged perspective view of an electronic device housing 401 and a portion thereof according to an embodiment of the disclosure.

[0077] The electronic device 400 (e.g., the electronic device 200) according to various embodiments of the disclosure can include a housing 401 of various forms. Figure 2A The electronic device 400 (e.g., the electronic device 200) according to various embodiments of the disclosure can include a housing 401 of various forms.

[0078] As described above, Figure 2A to Figure 3 the housing 401 can include a front plate (hereinafter referred to as a "first plate (or plate)"), a rear plate (hereinafter referred to as a "second plate (or plate)"), and a side bezel structure (hereinafter referred to as a "side member or member").

[0079] The housing 401 according to various embodiments of the disclosure can be formed of a single material, or can be formed of a combination of at least two or more materials. Furthermore, according to various embodiments, the housing 401 can be formed of a single part, but can be formed of at least two or more parts.

[0080] Referring to Figure 4 , Figure 4 A side member 420, which is an example of the housing 401, is shown. According to Figure 4The side member 420 of the illustrated embodiment can be formed by joining two or more materials. For example, the side member 420 can be a part formed of ceramic, polymer, metal, or a combination of at least two materials.

[0081] According to various embodiments, the side member 420 can include a first member 420a constituting an outer appearance of the case and a second member 420b and / or a third member 420c positioned inside the first member 420a. According to an embodiment, the first member 420a can be an insert injection molded part in the electronic device case. The second member 420b can be a substantially identical part to the first member 420a or the third member 420c, or can be a part formed separately from the first member 420a or the third member 420c. According to an embodiment, the first member 420a, the second member 420b, and the third member 420c can be substantially identical parts.

[0082] Various forms according to various embodiments can be used as the side member 420 of the present disclosure. The variety of embodiments can be similarly applied to other configurations (e.g., first and second plates) of the case 401 not shown in Figure 4 Although, for convenience of description, the side member 420 formed of a single material will be exemplified in the following description, it should be noted that the present disclosure is not limited thereto.

[0083] According to various embodiments, the side member (or member) 420 of the electronic device case 401 can include a coupling surface for coupling to (disposed on) another part of the case 401. For example, referring again to Figure 4 , the side member 420 can include a first surface 421 and a second surface 422. The first surface 421 can be a surface (e.g., a first plate) of another structure of the case 401, e.g., a surface facing one surface (e.g., a rear surface) of a plate, and the second surface 422 can be a surface (e.g., a first plate) of another structure of the case, e.g., a surface facing an opposite surface (e.g., a side surface) of a plate.

[0084] According to various embodiments, the first surface 421 and the second surface 422 can be extended longer along a length direction (e.g., a direction parallel to the y-axis) of the side member 420.

[0085] According to various embodiments, a first recess 423 of a first depth formed from the first surface 421 of the side member 420 along a length direction (e.g., a direction parallel to the y-axis) of the side member 420 can be disposed on the first surface 421 of the side member 420.

[0086] As in Figure 4In the embodiments shown, according to various embodiments of the present disclosure, similar to a first surface 421 that extends elongated along the length direction of the side member 420 (e.g., a direction parallel to the y-axis), the first recess 423 also extends elongated along the length direction of the side member 420 (e.g., a direction parallel to the y-axis). According to one embodiment, the first recess 423 may have a shape that is partially broken on the first surface 421, but according to another embodiment, it may extend elongated integrally on the first surface 421.

[0087] According to various embodiments, a protrusion 425 projecting upward from the first surface 421 may be provided on the first surface 421 of the side member 420. The protrusion 425 may be a portion of a plate (e.g., a first plate) substantially located thereon.

[0088] According to various embodiments of the present disclosure, a second recess 426 forming a second depth from the first surface 421 of the side member 420 along the length direction of the side member 420 (e.g., a direction parallel to the y-axis) can be provided on the first surface 421 of the side member 420.

[0089] According to various embodiments, at least a portion of the second recess 426 may overlap with the first recess 423. According to embodiments, such as... Figure 4 As shown, with the entire portion of the second recess 426 overlapping the first recess 423, the second recess 426 can have a shape that is deeper than that formed from the first recess 423.

[0090] According to various embodiments, a plurality of protrusions 425 may be provided on the first surface 421. Here, the plurality of protrusions 425 may be configured to be spaced apart from each other by a predetermined distance.

[0091] According to various embodiments, a plurality of second recesses 426 may also be provided on the first surface 421. Here, the plurality of second recesses 426 may be arranged to be spaced apart from each other by a predetermined distance. According to various embodiments, the second recesses 426 may be arranged to correspond to the positions of the protrusions 425.

[0092] Figure 5 This is a view showing the state in which adhesive material 430 is applied to the side member 420 according to an embodiment of the present disclosure. (Refer to...) Figure 5 , Figure 5 It can be in Figure 4 A partial magnified view of the portion where the protrusion 425 and the second recess 426 are disposed in the embodiment.

[0093] Figure 5 The state of the adhesive material 430 after it has been applied to the first surface 421 and the protrusion 425 and before it flows into the first recess 423 and the second recess 426 can be shown.

[0094] According to various embodiments, an acryl adhesive or a silicon adhesive can be used as the adhesive material 430 of the present disclosure. However, the present disclosure is not limited thereto, but the kind and composition of the adhesive material 430 can be variously determined.

[0095] According to an embodiment, the adhesive material 430 can be applied long along the length direction (e.g., a direction parallel to the y-axis of the housing 400) of the side member 420, for example, from the upper end to the lower end of the side member 420. Figure 4

[0096] The adhesive material 430 can be applied to at least one of the first surface 421 and the protrusion 425. The adhesive material 430 applied to at least one of the first surface 421 and the protrusion 425 can flow into the first recess 423 and the second recess 426 and solidify.

[0097] Additional descriptions of the first recess 423 will be described in detail with reference to an embodiment starting from FIG. 10. Figure 6 Additional descriptions of the protrusion 425 and the second recess 426 will be described in detail with reference to an embodiment starting from FIG. 11. Figure 7

[0098] Figure 6 is a view showing a state in which the adhesive material 430 according to an embodiment of the present disclosure is inserted between the first plate 410 and the side member 420. Figure 6 shows a cross-sectional view of a structure of the housing in an embodiment of Figure 4 .

[0099] Referring to Figure 6 , the electronic device 400 (e.g., the electronic device 200) according to various embodiments of the present disclosure can include a housing 401 (e.g., the housing 210) defining a space inside thereof and at least one or more components (e.g., the components 440) disposed in the space. Figure 2A Figure 2A The housing 401 can include a first plate 410, a second plate, and a side member 420.

[0100] According to various embodiments, the first plate 410 can be a front plate (e.g., the front plate 202 of FIG. 2) whose at least a portion is substantially transparent (e.g., a glass plate, a polymer plate, or a ceramic plate including various coating layers) or a back plate (e.g., the back plate 211 of FIG. 2) whose at least a portion is substantially opaque (e.g., a plate disposed by coating or coloring of at least two of glass, ceramic, polymer, metal, or a combination of materials).

[0101] According to various embodiments, the first plate 410 can be a front plate (e.g., the front plate 202 of FIG. 2) whose at least a portion is substantially transparent (e.g., a glass plate, a polymer plate, or a ceramic plate including various coating layers) or a back plate (e.g., the back plate 211 of FIG. 2) whose at least a portion is substantially opaque (e.g., a plate disposed by coating or coloring of at least two of glass, ceramic, polymer, metal, or a combination of materials). Figure 2A Figure 2B

[0102] ​​​​​According to various embodiments, the second plate can be a plate facing in a direction opposite to (or away from) the first plate 410. According to embodiments, in the case where the first plate 410 is a front plate 202 of the electronic device (e.g., Figure 2A ), the second plate can be a rear plate 211 of the electronic device (e.g., Figure 2B ). According to another embodiment, the first plate 410 can be a rear plate 211 of the electronic device 400 (e.g., Figure 2B ), and the second plate can be a front plate 202 of the electronic device 400 (e.g., Figure 2A ).

[0103] According to various embodiments, the side member 420 can correspond to a structure coupled to the first plate 410 and / or the second plate. According to embodiments, the side member 420 can be connected as a separate structure of the second plate. According to another embodiment, the side member 420 can be a portion extending from the periphery of the second plate as an integral configuration with the second plate.

[0104] According to various embodiments, the side member 420 can include a first surface 421 facing a rear surface 411 of the first plate 410 and a second surface 422 facing a side surface of the first plate 410. The first surface 421 can face at least a portion of the rear surface 411 of the first plate 410, and the second surface 422 can face at least a portion of the side surface 412 of the first plate 410. According to embodiments, the first surface 421 can face in the same direction as a first surface (e.g., Figure 2A ) of a housing (e.g., Figure 2A ) of the electronic device (e.g., ).

[0105] According to embodiments, an adhesive material 430 can be interposed between the first plate 410 and the side member 420. Figure 6 A state in which the adhesive material 430 is extruded can be shown. According to embodiments, the adhesive material 430 can be extruded in the process of connecting the first plate 410 and the side member 420, and can be cured in a state in which at least a portion of the extruded adhesive material 430 is introduced into a gap (e.g., the gap g and the first recess 423) between the first plate 410 and the side member 420. Figure 6

[0106] The first recess 423 can be disposed on the first surface 421 of the side member 420. The first recess 423 can be a portion formed with a first depth from the first surface 421, and can be disposed at a portion where the first surface 421 is connected to the second surface 422. The adhesive material 430, which is pressed when the first plate 410 and the side member 420 are coupled to each other in a state where the adhesive material 430 is interposed between the first plate 410 and the side member 420, can be introduced into the first recess 423. The adhesive material 430 introduced into the first recess 423 can be cured. When a physical impact is applied to the electronic device by the cured adhesive material 430 or the electronic device falls, the first plate 410 and the side member 420 can maintain a firm appearance without being separated.

[0107] Referring to Figure 5 and Figure 6 , according to various embodiments, the first recess 423 is disposed along a portion to which the adhesive material 430 is applied to the first surface 421 of the side member 420, and when the first plate 410 is located on the first surface 421 of the side member 420, it is possible to prevent the adhesive material 430 from overflowing to the outside of the electronic device 400 as a portion of the adhesive material 430 pressed flows into the first recess 423.

[0108] According to an embodiment, when the first recess 423 is disposed on the first surface 421 of the side member 420, the visible state prevention structure 424 can be disposed between the first recess 423 and the second surface 422. The visible state prevention structure 424 will be described in detail below with reference to Figure 12A .

[0109] Figure 7 is a view showing a state in which the adhesive material 430 is interposed between the first plate 410 and the side member 420 according to an embodiment of the disclosure. Figure 7 shows a cross section of a structure of a housing in an embodiment of Figure 4 .

[0110] Figure 7 may show a state in which the adhesive material 430 flows into the first recess 423 and the second recess 426 after the adhesive material 430 is applied to the first surface 421 and the protrusion 425. According to an embodiment, Figure 7 may show a state in which the adhesive material 430 is pressed similarly to the embodiment of Figure 6 .

[0111] Referring to Figure 7 , according to various embodiments, the side member 420 can include the first surface 421 and the second surface 422, and the first recess 423 can be disposed on the first surface 421. With reference to Figure 6The protrusion 425 and the second recess 426 can be provided on the first surface 421 of the side member 420 of the present disclosure, differently from the embodiment.

[0112] The protrusion 425 can be a portion on which the rear surface 411 of the first plate 410 is substantially located, and can protrude a predetermined height from the first surface 621 while having a predetermined length and a predetermined width. According to some embodiments, because the adhesive material 430 is formed of a liquid material, the distance between the objects to be bonded can not be constant according to the degree to which the objects are pressed. If the side member 420 includes the protrusion 425, the distance between the first plate 410 and the side member 420 can remain constant even if the distance between the first plate 410 and the side member 420 becomes shorter.

[0113] According to embodiments, the protrusion 425 can be integrally formed with the first surface 421, or can be formed of a material separate from that of the first surface 421, and can be a component attached to the first surface 421 by a separate process.

[0114] According to embodiments, the protrusion 425 can be positioned farther from the second surface 422 than the first recess 423.

[0115] As described with reference to Figure 5 the protrusion 425, the adhesive material 430 applied to the upper portion of the protrusion 425 can be pressed earlier than the adhesive material 430 applied to the first surface 421 and can be pressed farther than the adhesive material 430 applied to the first surface 421 as the first plate and the side member 420 become closer.

[0116] The second recess 426 can be a portion that extends long in the length direction of the side member 420. Like the feature that the first recess 423 extends long in the length direction of the side member 420, the second recess 426 can also extend long in the length direction of the side member 420.

[0117] According to various embodiments, at least a portion of the second recess 426 can overlap the first recess 423 on the first surface 421. The feature that the second recess 426 overlaps the first recess 423 can mean that the second recess 426 is formed at a deeper position from the first recess 423 in the height direction of the side member (e.g., a direction parallel to the z-axis of Figure 4 For example, the first recess 423 can form a first depth (e.g., P1 of the present disclosure, which will be described below) from the first surface 421, and the second recess 426 can form a second depth (e.g., P1+P2 of the present disclosure, which will be described below) from the first surface 421. Figure 8 For example, the first recess 423 can form a first depth (e.g., P1 of the present disclosure, which will be described below) from the first surface 421, and the second recess 426 can form a second depth (e.g., P1+P2 of the present disclosure, which will be described below) from the first surface 421. Figure 8 For example, the first recess 423 can form a first depth (e.g., P1 of the present disclosure, which will be described below) from the first surface 421, and the second recess 426 can form a second depth (e.g., P1+P2 of the present disclosure, which will be described below) from the first surface 421.

[0118] In Figure 4 , Figure 5 and Figure 7 , the entire portion of the second recess 426 overlaps the first recess 423, and can be formed at a position away from the first recess 423. However, although not shown in the drawings, it should be noted that not the entire portion but only a portion of the second recess 426 can overlap the first recess 423.

[0119] Referring to Figure 5 and Figure 7 , the second recess 426 can be disposed to be parallel to the protrusion 425 in correspondence to a position of the protrusion 425. Because the second recess 426 is disposed at a position corresponding to the position of the protrusion 425, the adhesive material 430 applied to the protrusion 425 can be introduced into the second recess 426. Because the second recess 426 is disposed parallel to the protrusion 425, the adhesive material 430 applied to the protrusion 425 can be uniformly introduced into a space defined by the second recess 426 in the process of extruding the adhesive material 430. According to various embodiments, the second recess 426 can include at least one inclined surface 427. The at least one inclined surface 427 can guide the adhesive material 430 applied to the first surface 421 and the protrusion 425 so that the adhesive material 430 is uniformly introduced into a space defined by the second recess 426 in the process of extruding the adhesive material 430.

[0120] Referring to Figure 6 and Figure 7 together, for example, when there is only the first recess 423 on the first surface 421 (e.g., the embodiment of Figure 6 ), the adhesive material 430 applied to the first surface 421 can flow into the recess 423 and solidify. In addition, if the protrusion 425 is further provided, the adhesive material 430 corresponding to the volume of the protrusion 425 can overflow between the gaps G, and when the adhesive material 430 overflows to the outside of the electronic device, it can impede the attractive aspect of the appearance of the electronic device, as compared to the embodiment in which the protrusion 425 is not present (e.g., the embodiment of Figure 6 ).

[0121] According to various embodiments of the disclosure, because the adhesive material 430 located on the protrusion 425 is caused to flow into the second recess 426 by additionally disposing the second recess 426 at a position adjacent to the protrusion 425 (e.g., the embodiment of Figure 7 ), it is possible to prevent the adhesive material 430 from overflowing to the outside of the electronic device according to the adhesive area without limiting the amount of the adhesive material 430 applied to the area (or space) to which the adhesive material 430 is adhered.

[0122] Figure 8is a view showing a cross section of the housing 401 according to an embodiment of the disclosure.

[0123] Figure 9 is a view showing a side member 420 according to an embodiment of the disclosure, viewed from the top according to an embodiment of the disclosure. Figure 8

[0124] Referring to Figure 8 and Figure 9 the size of the protrusion 425 and the second recess 426 of the present disclosure will be discussed.

[0125] According to various embodiments, the depth P2 of the space defined by the second recess 426 is greater than the height H of the protrusion 425. The depth of the space defined by the second recess 426 can be a depth obtained by subtracting the depth P1 of the space defined by the first recess 423 from the depth P1+P2 by which the second recess 426 is formed from the first surface.

[0126] According to various embodiments, the length L1 of the second recess 426 can be greater than the length L2 of the protrusion 425 when viewed from the top of the side member 420. Because the length L1 of the second recess 426 is longer than the length L2 of the protrusion 425, air pockets generated around the inclined surface 427 of the second recess 426 can be prevented when the adhesive material present on the first surface 421 of the protrusion 425 and / or around them flows into the second recess 426 and solidifies. For example, when the length L2 of the protrusion 425 is about 0.5 mm to 0.8 mm, the length L1 of the second recess is about 0.8 mm to 1.2 mm.

[0127] According to various embodiments, the end of the second recess 426 can be longer than the end of the protrusion 425 by a first distance d1 and the opposite end of the second recess 426 can be longer than the opposite end of the protrusion 425 by a second distance d2 when viewed from the top of the side member 420. Because the end of the second recess 426 is located at least outside the end of the protrusion 425 starting from the center of an imaginary line (for example, Figure 10 A-A' of FIG. 4A, which will be described below) passing through the protrusion 425 and the second recess 426, the squeezed adhesive material can be guided to flow into the second recess 426 while being prevented from flowing in another direction. According to embodiments, the first distance d1 and the second distance d2 can be the same length. For example, the first distance d1 and the second distance d2 can be 0.2 mm.

[0128] According to various embodiments, the width W1 of the second recess 426 can be greater than the width W2 of the protrusion 425.

[0129] ​In summary, the volume of the second recess 426 according to the width W1 and the length L1 of the second recess 426 and the depth P2 of the space defined by the second recess 426 can be greater than the volume of the protrusion 425 according to the width W2, the length L2, and the height of the protrusion 425.

[0130] According to an embodiment, the volume of the space defined by the second recess 426 can be designed to be proportional to the volume of the protrusion 425.

[0131] According to various embodiments of the disclosure, since the second recess 426, which is at least greater than the protrusion 425, is additionally provided while taking advantage of the protrusion 425, the protrusion 425 can prevent the adhesive material 430 from overflowing to the outside of the electronic device.

[0132] Figure 10 FIG. 1 is a view illustrating a cross section of an electronic device housing 501 according to an embodiment of the disclosure.

[0133] According to various embodiments, the portion to which the adhesive material 530 is applied to the side member 520 can not necessarily be the first surface.

[0134] As described above, by the embodiment of FIG. 1, Figure 4 According to various embodiments, the side member 520 can not only be a single material or a single part, but also a configuration in which different materials or different parts are coupled.

[0135] According to various embodiments of the disclosure, the adhesive material 530 can not only be applied to the surface of a single material or a single part, but also to the surface of different materials or different parts. According to an embodiment, the adhesive material 530 can also be applied to the boundary between different materials or different parts.

[0136] Referring to Figure 10 , the adhesive material 530 can also be applied to the decorative member 502 provided on the side member 520. The adhesive material 530 can overlap at least a portion of the decorative member 502. In this way, unlike the above-described embodiment, the position of the adhesive material 530 can be different. As Figure 10 indicated, the adhesive material 530 can not necessarily be provided in parallel to the length direction of the side member 520, but at least a portion of the adhesive material 530 can have a curved shape.

[0137] According to various embodiments, the protrusion (for example, Figure 4 the protrusion 425 of FIG. 1), the first recess (for example, Figure 4 the first recess 423 of FIG. 1), and the second recess (for example, Figure 4 the recess 426 of FIG. 1) can be provided along the area in which the adhesive material 530 is applied.

[0138] As described above, the positions and forms of the protrusions (e.g., Figure 4 the protrusions 425 of FIG. 4), the first recesses (e.g., Figure 4 the first recesses 723 of FIG. 7), and the second recesses (e.g., Figure 8 the recesses 426 of FIG. 4) corresponding to various application positions and forms on the side member 520 can be variously designated. In addition, the various embodiments described above with reference to Figure 4 to Figure 9 may be similarly applied to Figure 10 .

[0139] Figure 11A to Figure 11C is a view illustrating an arrangement form of the protrusions 625 according to various embodiments of the disclosure.

[0140] According to various embodiments, the positions and forms of the protrusions 625 can be various according to embodiments. In Figure 11A to Figure 11C , an electronic device housing 601 having a first plate 610 (e.g., Figure 7 the first plate 410 of FIG. 4) and a side member 620 (e.g., Figure 7 the side member 420 of FIG. 4) is illustrated.

[0141] Figure 11A An embodiment in which the protrusions 625 are located at a periphery of a first surface (e.g., Figure 7 the first surface 421 of FIG. 4) can be illustrated, Figure 11B An embodiment in which the protrusions 625 are located at an opposite periphery of a first surface (e.g., Figure 7 the first surface 421 of FIG. 4) can be illustrated, Figure 11C An embodiment in which the protrusions 625 are located at a center of a first surface (e.g., Figure 7 the first surface 421 of FIG. 4) can be illustrated. Although not separately illustrated, various embodiments can be applied to a cross-sectional shape of the protrusions 625, which are different from those illustrated in the drawings.

[0142] Referring to Figure 11A to Figure 11C , the protrusions 625 can be disposed (e.g., Figure 7 ) close to an electronic element (e.g., Figure 7 the electronic element 440 of FIG. 4) on a first surface (e.g., Figure 11A the first surface 421 of FIG. 4), and can be disposed close to a second surface (e.g., Figure 7 the second surface 422 of FIG. 4). Otherwise, the protrusions 625 can be disposed at a center of the first surface (e.g., Figure 7 the first surface 421 of FIG. 4) exactly.

[0143] The positions of the protrusions 625 can be variously determined according to the volumes and shapes formed of the first recesses 623 and the second recesses 626.

[0144] Figure 12Aand Figure 12B is a view showing a cross section of an electronic device case 701 according to various embodiments of the disclosure.

[0145] In Figure 12A and Figure 12B , the protrusion 725 can be disposed on the first surface (e.g., the first surface 421 of the electronic device case 700), and can be disposed near the second surface (e.g., the second surface 422 of the electronic device case 700). Figure 7 Figure 7 Referring to ,

[0146] , an electronic device case 701 having a first plate 710 (e.g., the first plate 410 of the electronic device case 700) and a side member 720 (e.g., the side member 420 of the electronic device case 700) can be shown, the side member 720 being provided with a visible state prevention structure 724 in the absence of a second recess. Figure 12A Figure 12A Referring to Figure 7 , Figure 7 , an electronic device case 701 from which the visible state prevention structure is removed when the second recess 726 is present can be shown.

[0147] Referring to Figure 12B , Figure 12B , an electronic device case 701 from which the visible state prevention structure is removed when the second recess 726 is present can be shown.

[0148] For example, the visible state prevention structure 724 can be a structure for preventing an adhesive material introduced into the first recess 723 from being visible from the outside without being uniformly adhered to the first recess 723. After the first plate 710 and the side member 720 are coupled to each other, a gap (e.g., the gap g of the electronic device case 700) can be formed between one side (e.g., the side 412 of the electronic device case 700) of the first plate 710 and one side (e.g., the side 422 of the electronic device case 700) of the side member 720, and the visible state prevention structure 724 can be provided to prevent the adhesive material introduced into the inside of the first recess without being uniform from being visible from the outside. According to an embodiment, the visible state prevention structure 724 can prevent the adhesive material introduced into the inside of the first recess without being uniform from being visible by making an area of the visible state prevention structure 724 greater than an area of the gap g. Figure 7 Figure 7 According to an embodiment, by additionally providing the second recess 726, it is possible to reduce the possibility that the adhesive material introduced into the recess is cured without being uniform. Accordingly, the embodiment in which the second recess 726 is added can have the advantage of removing the visible state prevention structure 724 or reducing the size of the visible state prevention structure 724. Figure 7

[0149]

[0150] ​​​​An electronic device according to various embodiments disclosed herein can be one of various types of devices. The electronic devices can include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment, the electronic devices are not limited to those described above.

[0151] It should be understood that various embodiments of the present disclosure and the terms used therein are not intended to limit the technological features set forth herein to the related embodiments and should be interpreted as including all varieties derived from the concepts of the related embodiments as well as their equivalents. With regard to the description of the drawings, like reference numerals can be used to refer to like or similar elements. It is to be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. As used herein, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include all possible combinations of the items listed in the corresponding one of the phrases. As used herein, terms such as "first" and "second" can be used to simply distinguish a corresponding component from another, and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (for example, a first element) is referred to as being "operatively or communicatively connected" to or with another element (for example, a second element), it means that the element can be directly connected to the other element (for example, wiredly connected), wirelessly connected to the other element, or connected to the other element via a third element, whether or not the term "operatively or communicatively" is used.

[0152] As used herein, the term "module" can include a unit implemented in, for example, hardware, software, or firmware, and can interchangeably be used with other terms, for example, "logic," "logic block," "part," or "circuitry." The module can be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module can be implemented in a form of an application-specific integrated circuit (ASIC).

[0153] Various embodiments as set forth herein can be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that are readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using hardware such as processor 120. This allows the machine to be operated in accordance with the at least one instruction executed by the processor. The one or more instructions can include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is tangible, but does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.

[0154] According to an embodiment, a method according to various embodiments of the disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore®), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product can be temporarily generated or at least temporarily stored in the memory of the manufacturer's server, an application store, or a relay server. TM ) online, or can be directly distributed (e.g., downloaded or uploaded) between two user devices (e.g., smart phones). If distributed online, at least part of the computer program product can be temporarily generated or at least temporarily stored in a server of a manufacturer, an application store, or a relay server.

[0155] According to various embodiments, each component (e.g., a module or a program) of the above-described components can include a single entity or multiple entities. According to various embodiments, one or more of the above-described components or operations can be omitted, or other components or operations can be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) can be integrated into a single component. In such a case, according to various embodiments, the integrated component can still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component can be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations can be executed in a different order or omitted, or one or more other operations can be added.

[0156] According to various embodiments of the present disclosure, an electronic device (e.g., the electronic device 400) can include a first plate (e.g., the first plate 410), a second plate facing an opposite direction of the first plate, and a side member (e.g., the side member 420) attached to or integrally formed with the second plate, surrounding a space between the first plate and the second plate including at least one electronic element, and coupled to the first plate, the side member including a first surface (e.g., the first surface 421) facing a rear surface of the first plate and a second surface (e.g., the second surface 422) substantially perpendicular to the first surface and facing a side surface of the first plate, the first surface having a protrusion (e.g., the protrusion 425), a first recess (e.g., the first recess 423), and a second recess (e.g., the second recess 426), the protrusion protruding upward from the first surface such that the first plate is substantially located on the first surface, the first recess (e.g., the first recess 423) being disposed between the protrusion and the second surface and forming a first depth from the first surface in a length direction of the side member, the second recess (e.g., the second recess 426) forming a second depth from the first surface in the length direction of the side member. Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7

[0157] According to various embodiments, at least a portion of the second recess can overlap the first recess when viewed from a top of the side member.

[0158] According to various embodiments, the second recess can be disposed in parallel with the protrusion corresponding to a position where the protrusion is disposed.

[0159] According to various embodiments, a length of the second recess can be longer than a length of the protrusion when viewed from a top of the side member.

[0160] According to various embodiments, one end of the second recess can be longer than one end of the protrusion by a first distance and an opposite end of the second recess can be longer than an opposite end of the protrusion by a second distance when viewed from a top of the side member.

[0161] According to various embodiments, a depth of the second recess can be greater than a height of the protrusion.

[0162] According to various embodiments, an adhesive material can be applied to at least one of the first surface or the protrusion, and the adhesive material applied to at least one of the first surface or the protrusion can flow to the first recess and the second recess and solidify.

[0163] ​​​​​​​​​​According to various embodiments, a volume of the space defined by the second recess can be designed to be proportional to an amount of adhesive material applied onto the protrusion.

[0164] According to various embodiments, a plurality of second recesses can be disposed in the first recess, and the plurality of second recesses can be spaced apart from each other by a predetermined distance.

[0165] According to various embodiments, at least some of the protrusions can overlap with a separate component disposed on the first surface.

[0166] According to various embodiments of the disclosure, a housing of an electronic device including at least one plate (e.g., the housing 401 of FIG. 1A) can include a member (e.g., the member 420 of FIG. 1A) coupled to a rear surface of the plate of the at least one plate, wherein the member includes a first surface facing the rear surface of the plate and a second surface (e.g., the second surface 422 of FIG. 1A) disposed substantially perpendicular to the first surface and facing a side surface of the plate (e.g., the first surface 421 of FIG. 1A), the first surface having a protrusion (e.g., the protrusion 425 of FIG. 1A) protruding upward from the first surface such that the plate is substantially located on the surface, a first recess (e.g., the first recess 423 of FIG. 1A) formed from the first surface in a first depth along a length direction of the member, and a second recess (e.g., the second recess 426 of FIG. 1A) formed from the first surface in a second depth along the length direction of the member. Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7

[0167] According to various embodiments of the disclosure, a housing of an electronic device including at least one plate (e.g., the housing 401 of FIG. 1A) can include a first surface (e.g., the first plate 421 of FIG. 1A) coupled to at least a portion of the plate of the at least one plate and facing a rear surface of the plate and a member (e.g., the member 420 of FIG. 1A) including a second surface (e.g., the second surface 422 of FIG. 1A) substantially perpendicular to the first surface and facing a side surface of the plate, and a first surface of the member having a protrusion (e.g., the protrusion 425 of FIG. 1A) protruding upward from the first surface by a predetermined height, a first recess (e.g., the first recess 423 of FIG. 1A) formed from the first surface in a predetermined depth, and a second recess (e.g., the second recess 426 of FIG. 1A) formed at a position farther from the first surface than the first recess. Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 Figure 7 ​​​​​​​​​​​​​​​​

[0168] According to various embodiments, the member (e.g., the member 420 of FIG. 4 Figure 7 ) can be a side member, and can be a component integrally formed with or separately formed from a second plate (e.g., the second plate 211 of FIG. 2 Figure 7 ).

[0169] According to various embodiments, the member (e.g., the member 420 of FIG. 4 Figure 7 ) can be coupled to at least one plate included in an electronic device. According to an embodiment, the at least one plate can correspond to a first plate (e.g., the first plate 410 of FIG. 4 Figure 7 ). According to another embodiment, a second plate (e.g., the second plate 211 of FIG. 2 Figure 7 Figure 2B Figure 7 Figure 7 Figure 2B ) can correspond to the plate, and another plate included in another electronic device can correspond to the plate.

[0170] It should be noted to those skilled in the art to which the present disclosure pertains that the wireless charging device that wirelessly transmits electric power according to various embodiments of the present disclosure as has been described above is not limited by the above-described embodiments and drawings, but can be variously substituted, modified, and changed without departing from the scope of the present disclosure.

[0171] While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details can be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1.An electronic device comprising: a first plate; a second plate facing in a direction opposite to the first plate; and a side member attached to or integrally formed with the second plate, surrounding a space between the first plate and the second plate, and coupled to the first plate, wherein at least one electronic component is accommodated in the space, wherein the side member comprises: a first surface facing a rear surface of the first plate; and a second surface perpendicular to the first surface and facing a side surface of the first plate, wherein a protrusion protrudes from the first surface toward the rear surface of the first plate, wherein a first recess is formed adjacent to the protrusion and forms a first depth from the first surface in a length direction of the side member, and wherein a second recess is formed spaced apart from the protrusion and forms a second depth from the first surface in the length direction of the side member, wherein at least a portion of the second recess overlaps the first recess when viewed from a top of the side member. The second recess is disposed in parallel with the protrusion corresponding to a position where the protrusion is disposed. 2.The electronic device of claim 1, wherein, A length of the second recess is longer than a length of the protrusion when viewed from the top of the side member. 3.The electronic device of claim 1, wherein One end of the second recess is longer than one end of the protrusion by a first distance and an opposite end of the second recess is longer than an opposite end of the protrusion by a second distance when viewed from the top of the side member. 4.The electronic device of claim 1, wherein A volume of a space where the second recess is disposed is greater than or the same as a volume of the protrusion. 5.The electronic device of claim 1, wherein 6.The electronic device of claim 1, an adhesive material is applied to at least one of the first surface or the protrusion, and wherein wherein the adhesive material applied to the at least one of the first surface or the protrusion flows to the first recess and the second recess and is cured. A plurality of second recesses are disposed on the first surface, the plurality of second recesses being spaced apart from each other by a distance. 7.The electronic device of claim 1, wherein The plurality of second recesses are disposed in the first recess. 8.The electronic device of claim 7, wherein, The side member is formed of at least two materials and is configured by coupling of two or more parts. 9.The electronic device of claim 1, wherein A depth of the second recess is greater than a height of the protrusion. 10.The electronic device of claim 1, wherein ​

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