Binding device and component to be bound

Abstract

The present application relates to a binding device for binding connection between two electronic components, each of which comprises a binding area, the binding area comprising a bonding area and a non-bonding area, the binding device comprising: an optical structure for emitting interference light with a preset interference pattern, the interference pattern comprising alternating light areas and dark areas; a stage for carrying two electronic components to be bound; a moving structure for controlling the movement of the stage and / or the optical structure, so that the light areas are irradiated to the bonding area, so that the bonding area of the two electronic components is conductive, and the dark areas cover the non-bonding area. The present application also relates to a component to be bound.

Description

Technical Field

[0001] This invention relates to the field of bonding technology, and more particularly to a bonding device and a component to be bonded. Background Technology

[0002] Most current bonding equipment uses high-temperature, high-pressure extrusion to break down conductive particles in the bonding area, creating electrical connections, while non-bonded areas remain insulated. Because the size of conductive particles is limited, the design width of the bonding area cannot be further reduced, affecting the wiring density and thus hindering the resolution improvement of small-sized OLEDs. The high-temperature, high-pressure extrusion of conductive particles causes significant deformation in the bonding area, making it prone to cracking and affecting product lifespan. Furthermore, the high temperature causes material expansion, limiting bonding tolerances and affecting bonding stability. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a bonding device and a component to be bonded, resolving the issues of limited bonding area size and easy damage to the bonding area in the bonding process between electronic components.

[0004] To achieve the above objectives, the technical solution adopted in this embodiment of the invention is: a bonding device for bonding connections between two electronic components, each of the electronic components including a bonding area, the bonding area including a bonding region and a non-bonding region, the bonding device comprising:

[0005] An optical structure for emitting interference light with a preset interference pattern, the interference pattern including alternating bright and dark areas;

[0006] The stage is used to support two electronic components to be bound together.

[0007] A movable structure is used to control the movement of the stage and / or the optical structure so that the bright area illuminates the bonding area, so that the bonding areas of the two electronic components are connected, and so that the dark area covers the non-bonded area.

[0008] Optionally, the optical structure includes a light source, a beam splitter, a reflector, and an interferometer;

[0009] The beam splitting component splits the light emitted by the light source into at least two coherent beams;

[0010] The reflective component is used to reflect the at least two beams of coherent light to the interferometer;

[0011] The interferometer is used to form a preset interference pattern.

[0012] Optionally, the reflecting component includes at least two reflecting units corresponding one-to-one with the at least two coherent beams, and the at least two reflecting units emit the corresponding coherent beams to the input end of the interferometer at the same exit angle.

[0013] Optionally, the reflecting unit is a reflector, and at least two reflectors are arranged in parallel.

[0014] Optionally, a beam expander is provided between the light source and the beam splitter.

[0015] Optionally, the light source is a laser capable of emitting laser beams in pulse form.

[0016] Optionally, under the control of the moving structure, the optical structure moves relative to the stage in a first direction, and the projection areas of two adjacent interference beams emitted are adjacent or at least partially overlap on the stage.

[0017] Optionally, the moving structure includes:

[0018] The first moving unit is used to control the stage and / or the optical structure to move in the X direction, and / or;

[0019] The second moving unit is used to control the stage and / or the optical structure to move in the Y direction, wherein the Y direction is perpendicular to the X direction, and / or;

[0020] The third moving unit is used to control the stage and / or the optical structure to move in the Z direction, which is perpendicular to the X direction and perpendicular to the Y direction, and / or;

[0021] The fourth moving unit is used to control the stage and / or the optical structure to rotate in a plane perpendicular to the Z direction.

[0022] Optionally, a shielding grating is provided between the optical structure and the stage to shield part of the bright area.

[0023] Optionally, the bonding device further includes an alignment detection structure, which includes an eyepiece and an alignment mark on the eyepiece that aligns with the bright area or the bonding area.

[0024] This invention also provides a component to be bonded, including a first electronic component and a second electronic component. The bonding is performed using the aforementioned bonding device. The first bonding region of the first electronic component includes a first bonding region and a first non-bonding region. The second bonding region of the second electronic component includes a second bonding region and a second non-bonding region. The first bonding region and the second bonding region are stacked, and the first non-bonding region and the second non-bonding region are stacked. The conductive material of the first bonding region melts under the irradiation of the bright region of the interference light to achieve conductivity with the conductive material of the second bonding region.

[0025] Optionally, the first bonding region has a first surface facing the second bonding region, and the second bonding region has a second surface facing the first bonding region; the first surface and / or the second surface has an uneven structure.

[0026] The orthographic projection of the first bonding area onto the second electronic component coincides with the second bonding area, and the shape of the first bonding area is rectangular or parallelogram.

[0027] The beneficial effects of this invention are: by using interference light to melt and weld the bonding area, compared with the high temperature and high pressure bonding method, the damage to the bonding area and the non-bonding area is reduced. Moreover, the interference pattern generated by the interference light corresponds to the bonding area and the non-bonding area, which can achieve the bonding area width from hundreds of nanometers to hundreds of micrometers. The same area can increase the wiring density, making it easier to achieve high resolution in small-sized displays. Attached Figure Description

[0028] Figure 1 A schematic diagram showing the binding device in an embodiment of the present invention;

[0029] Figure 2 A schematic diagram illustrating the interference pattern in an embodiment of the present invention;

[0030] Figure 3 A schematic diagram illustrating the intensity of interference light with superimposed diffraction effects in an embodiment of the present invention;

[0031] Figure 4 A schematic diagram illustrating the component to be bound in an embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram showing two electronic components bonded together in an embodiment of the present invention. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0034] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0035] Traditional bonding technology refers to the process in display manufacturing where a flexible printed circuit board (FPC) and a panel, or an FPC and a printed circuit board (PCB), are bonded together using anisotropic conductive film (ACF) according to a specific workflow, achieving electrical conductivity. However, the bonding process uses high temperature and pressure to compress the bonding area, causing the conductive particles in the bonding area to break and become conductive, while the conductive particles in the non-bonded areas remain insulating. Because the size of the conductive particles is limited, the design width of the bonding area cannot be further reduced, affecting the wiring density and thus impacting the resolution improvement of small-sized OLEDs. Furthermore, the high temperature and pressure compression of the conductive particles causes significant deformation in the bonding area, making it prone to cracking and affecting product lifespan. High temperatures also cause material expansion, limiting bonding tolerances and affecting bonding stability.

[0036] refer to Figures 1-5 To address the aforementioned problems, this embodiment provides a bonding device for bonding connections between two electronic components. Each electronic component includes a bonding area, which includes a bonding region and a non-bonding region. The bonding device includes:

[0037] An optical structure for emitting interference light with a preset interference pattern, the interference pattern including alternating bright areas 10 and dark areas 20;

[0038] Stage 16 is used to support two electronic components to be bound.

[0039] A movable structure is used to control the movement of the stage 16 and / or the optical structure so that the bright area 10 illuminates the bonding area, so that the bonding areas of the two electronic components are connected, and so that the dark area 20 covers the non-bonded area.

[0040] In this embodiment, interference light is used to melt and weld the bonding area. The interference pattern of the light has a bright area 10 and a dark area 20. The bright area 10 illuminates the bonding area to achieve conductivity, while the dark area 20 covers the non-bonded area. Compared with the traditional bonding process that uses high temperature and high pressure on the entire bonding area, this method eliminates the need to compress the bonding area, reducing residual stress and preventing cracks. Furthermore, it eliminates the need for high temperature and high pressure on the non-bonded areas, resulting in less damage. No thermal expansion protection design is required, improving bonding accuracy and stability. Laser bonding technology can also reduce the bonding area, increase the number of lines per unit area, and improve the resolution of small-sized OLEDs, showing broad application prospects.

[0041] It should be noted that the stage 16 carries two electronic components to be bonded. At this time, the bonding areas of the two electronic components are superimposed. The optical structure emits interference light to irradiate the bonding area of ​​one of the electronic components, and the bright area 10 in the interference pattern corresponds to the bonding area, thereby melting the conductive material of the bonding area irradiated by the interference light to conduct with the conductive material of the bonding area of ​​the other electronic component. The dark area 20 in the interference pattern corresponds to the non-bonded area, so that the non-bonded areas of the two electronic components remain insulated.

[0042] It should be noted that the two electronic components mentioned can be a flexible circuit board and a display panel, or a flexible circuit board and a circuit board, but are not limited thereto.

[0043] In an exemplary embodiment, the optical structure includes a light source 11, a beam splitter 13, a reflector, and an interferometer 15;

[0044] The beam splitting component 13 splits the light emitted by the light source 11 into at least two coherent beams;

[0045] The reflective component is used to reflect the at least two beams of coherent light to the interferometer 15;

[0046] The interferometer 15 is used to form a preset interference pattern.

[0047] For example, the interferometer 15 can be a reflection interferometer, a prism interferometer, a pyramid interferometer, a liquid crystal molecule interferometer, a grating interferometer, or a lens interferometer.

[0048] For example, the specific shape of the interference pattern can be various, such as rectangular stripes, dot matrix stripes, or concentric ring stripes. Figure 2 The diagram shows that the interference pattern is a rectangular stripe, but it is not limited to this.

[0049] For example, the interference pattern can be an equal-inclination interference fringe or an equal-thickness interference fringe.

[0050] It should be noted that the bonding region and non-bonding region in the bonding area of ​​the two electronic components have the same structure, and the minimum period of the arrangement of the bonding region and non-bonding region in the bonding area is the same as that of the interference pattern, so that after the interference light irradiates the bonding area, the bright area 10 corresponds to the bonding area and the dark area 20 corresponds to the non-bonding area, so as to ensure bonding accuracy.

[0051] In an exemplary embodiment, the reflecting component includes at least two reflecting units 14 corresponding one-to-one with the at least two coherent beams, and the at least two reflecting units 14 emit the corresponding coherent beams to the input end of the interferometer 15 at the same emission angle.

[0052] It should be noted that the coherent light corresponding to at least two of the reflection units 14 has the same exit angle, and the coherent light corresponding to at least two of the reflection units 14 is incident on the interferometer 15 at the same incident angle. Furthermore, the direction of the incident angle of the coherent light corresponding to at least two of the reflection units 14 to the interferometer 15 can be the same or mirror image of each other with respect to the normal, so as to ensure that the coherent light incident on the interferometer 15 satisfies the coherence condition.

[0053] In an exemplary embodiment, the reflecting unit 14 is a reflector, and at least two reflectors are arranged in parallel to ensure that corresponding light beams reflected from the reflectors enter the interferometer 15 at the same angle of incidence.

[0054] In an exemplary embodiment, a beam expander 12 is disposed between the light source 11 and the beam splitter 13. The beam expander 12 can increase the area of ​​the interference light coverage on the stage 16, thereby improving the bonding efficiency.

[0055] In an exemplary embodiment, the light source 11 is a laser capable of emitting laser beams in pulse form. The high energy of the laser is used to achieve bonding between two electronic components, ensuring bonding stability.

[0056] In an exemplary embodiment, under the control of the moving structure, the optical structure moves relative to the stage 16 in a first direction, and the projection areas of two adjacent interference beams emitted are adjacent or at least partially overlap on the stage 16.

[0057] In the first direction, if the length of the projection area of ​​the interference light on the stage 16 is less than the length of the binding area, then the stage 16 or the optical structure needs to be moved and cooperated with the pulsed laser to complete the binding connection of a rectangular binding area with a larger length in the first direction.

[0058] Due to the diffraction effect in double-slit interference, the energy of the edge fringes in the interference pattern is weaker than that of the central fringes. Secondary bonding can be performed on the bonding regions corresponding to the edge fringes (here referring to the bright area 10 at the edge of the interference pattern) to reduce the intensity attenuation caused by diffraction, ensuring that the intensity, conductive area, and other indices of each bonding region remain consistent. That is, the projection areas of adjacent outgoing interference beams on the stage 16 partially overlap. Simulation results show that after the stage moves an appropriate distance, the uniformity of the fringe light intensity is controlled within ±5% after the peak energy is superimposed. (Reference) Figure 3 , Figure 3 The dashed lines in the diagram represent the intensity of the diffracted light, and the solid lines represent the intensity of the interference fringes at different locations. Figure 3 The vertical axis represents light intensity, and the horizontal axis represents location information. From Figure 3 The difference in the intensity of the interference fringes is relatively small.

[0059] In an exemplary embodiment, the moving structure includes:

[0060] The first moving unit is used to control the stage 16 and / or the optical structure to move in the X direction, and / or;

[0061] The second moving unit is used to control the stage 16 and / or the optical structure to move in the Y direction, the Y direction being perpendicular to the X direction, and / or;

[0062] The third moving unit is used to control the stage 16 and / or the optical structure to move in the Z direction, the Z direction being perpendicular to the X direction and the Z direction being perpendicular to the Y direction, and / or;

[0063] The fourth moving unit is used to control the stage 16 and / or the optical structure to rotate in a plane perpendicular to the Z direction.

[0064] The arrangement of the first, second, third, and / or fourth moving units allows for flexible movement of the stage 16 and / or the optical structure to bond bonding areas of different shapes. For example, if the bonding area is a rectangular region with a preset length in the X direction, it can be coordinated with a pulsed laser to control the stage 16 to move along the X direction at a preset speed to complete the bonding of two electronic components. Alternatively, if the bonding area is a parallelogram with its long side extending parallel to the X direction, the fourth moving unit controls the stage 16 to rotate by a preset angle in a plane perpendicular to the Z direction, making the extension direction of the bright area 10 of the interference pattern parallel to the short side of the parallelogram (the interference pattern is a rectangular stripe). Then, the stage 16 is controlled to move at a preset speed in the X direction to complete the bonding of two electronic components.

[0065] In an exemplary embodiment, a shielding grating is provided between the optical structure and the stage 16 to shield a portion of the bright area 10.

[0066] When the bonding region is a circle or other geometric shape besides a rectangle, the application range of the bonding device can be expanded by setting the blocking grating, so that the interference pattern forms a pattern consistent with the structural form of the bonding region and the non-bonding region. For example, by adjusting the beam splitting ratio of the beam splitter, equal-intensity four-beam interference can be used. The same laser is split twice to form four coherent beams, and by adjusting the reflector, dot-shaped interference fringes can be formed. By blocking the beams with the blocking grating, interference patterns of arbitrary shapes can be achieved for bonding non-rectangular bonding regions (e.g., circles, triangles, etc.).

[0067] refer to Figure 1 In an exemplary embodiment, the bonding device further includes an alignment detection structure, which includes an eyepiece 17 and an alignment mark on the eyepiece 17 that aligns with the bright area 10 or the bonding area.

[0068] During initial bonding, the electronic component to be bonded is not mounted on the stage 16 (or the bonding area of ​​the electronic component to be bonded is on the stage 16 excluding the projection area of ​​the interference light). First, the alignment mark on the eyepiece 17 is aligned with the interference pattern formed by the optical structure (the alignment mark may correspond only to the bright area 10 or the dark area 20 in the interference pattern). Then, the light output is stopped, and the stage 16 is moved so that the bonding area or non-bonding area is aligned with the alignment mark. Then, the light source 11 is turned on to perform bonding. Since the light source 11 uses a pulsed laser, the moving speed of the stage 16 can be controlled so that the bonding area on the bonding area is aligned with the alignment mark on the eyepiece 17 before the next laser energy is provided.

[0069] It should be noted that the alignment detection structure is not limited to the above-described scheme. For example, the alignment detection structure may also include:

[0070] An image acquisition unit is used to acquire an image of the projection area of ​​the interference pattern on the stage 16 when the interference light illuminates the stage 16;

[0071] A position information determining component is used to determine the position information of the interference pattern on the stage 16;

[0072] An actuating component is used to control the stage 16 to move according to the position information, so that the bonding areas of the two electronic components carried on the stage 16 correspond to the bright area 10 in the interference pattern.

[0073] In an exemplary embodiment, the laser beam generated by the laser has a wavelength of 100nm to 1000nm, a pulse width of less than 20ns, a maximum single pulse energy of more than 10mJ, and a pulse repetition frequency of 1 to 200KHz.

[0074] It should be noted that the light source 11 is a laser capable of emitting pulsed laser beams. In the first direction, when the length of the bonding region is greater than the length of the projection area of ​​the interference pattern on the stage 16, the stage 16 or the optical structure is in a continuous motion state during the bonding process. Under the control of the moving structure, in conjunction with the pulsed laser, bonding of the bonding regions of two electronic components can be achieved. Furthermore, based on the fixed pulse of the laser beam, the bonding requirements of metals with different melting points can be met by controlling the moving speed of the stage or the optical structure. For example, if the melting point of the conductive material in the bonding region is high, the speed of the stage or the optical structure can be reduced, thereby allowing the same bonding region to be irradiated by interference light multiple times, enhancing the light intensity received by the bonding region.

[0075] refer to Figure 4 and Figure 5 , Figure 4 For the first and second electronic components that are not bonded together, Figure 5 This indicates the first and second electronic components after being bound together. Figure 5 In the middle, the first bonding region 101 and the second bonding region 201 are connected to form a conductive region 300.

[0076] This invention also provides a component to be bonded, including a first electronic component and a second electronic component. The bonding is performed using the aforementioned bonding device. The first bonding region 100 of the first electronic component includes a first bonding region 101 and a first non-bonding region 102. The second bonding region 200 of the second electronic component includes a second bonding region 201 and a second non-bonding region 202. The first bonding region 101 and the second bonding region 201 are stacked, and the first non-bonding region 102 and the second non-bonding region 202 are stacked. The conductive material of the first bonding region 101 melts under the irradiation of the bright region 10 of the interference light to conduct electricity with the conductive material of the second bonding region 201.

[0077] The bonding device is used to bond the first electronic component and the second electronic component. The conductive material of the first bonding region 101 melts under the irradiation of the bright region 10 of the interference light to conduct with the conductive material of the second bonding region 201. The first unbonded region 102 corresponds to the second unbonded region 202 and the first unbonded region 102 corresponds to the dark region 20, maintaining an insulating state.

[0078] For example, the conductive material of the first bonding region 101 is a low-melting-point, high-strength, low-resistance metal or alloy, so as to melt under the irradiation of the interference light to conduct with the second bonding region 201.

[0079] In an exemplary embodiment, the first bonding region 101 has a first surface disposed toward the second bonding region 201, the second bonding region 201 has a second surface disposed toward the first bonding region 101, and the first surface and / or the second surface has an uneven structure.

[0080] The concave-convex structure can enhance the bonding strength, and the concave-convex structure can be serrated, wavy, etc.

[0081] In an exemplary embodiment, the orthographic projection of the first bonding area 100 onto the second electronic component coincides with the second bonding area 200, and the shape of the first bonding area 100 is rectangular or parallelogram.

[0082] With the movable structure configured, the binding device can complete the binding connection between the first binding area 100 and the second binding area 200 of any shape.

[0083] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A bonding device for bonding two electronic components, each of the electronic components including a bonding area, the bonding area including a bonding region and a non-bonding region, characterized in that, The binding device includes: An optical structure for emitting interference light with a preset interference pattern, the interference pattern including alternating bright and dark areas; The stage is used to support two electronic components to be bound together. A movable structure is used to control the movement of the stage and / or the optical structure so that the bright area illuminates the bonding region, so that the conductive material on the bonding region melts under the irradiation of the interference light pair so that the bonding regions of the two electronic components are connected, and so that the dark area covers the non-bonded region.

2. The binding device according to claim 1, characterized in that, The optical structure includes a light source, a beam splitter, a reflector, and an interferometer; The beam splitting component splits the light emitted by the light source into at least two coherent beams; The reflective component is used to reflect the at least two beams of coherent light to the interferometer; The interferometer is used to form a preset interference pattern.

3. The binding device according to claim 2, characterized in that, The reflecting component includes at least two reflecting units that correspond one-to-one with the at least two coherent beams, and the at least two reflecting units emit the corresponding coherent beams to the input end of the interferometer at the same emission angle.

4. The binding device according to claim 3, characterized in that, The reflecting unit is a reflector, and at least two reflectors are arranged in parallel.

5. The binding device according to claim 2, characterized in that, A beam expander is provided between the light source and the beam splitter.

6. The binding device according to claim 2, characterized in that, The light source is a laser capable of emitting laser beams in pulse form; Under the control of the moving structure, in a first direction, the optical structure moves relative to the stage, and the projection areas of two adjacent interference beams emitted are adjacent or at least partially overlap on the stage.

7. The binding device according to claim 2, characterized in that, The movable structure includes: The first moving unit is used to control the stage and / or the optical structure to move in the X direction, and / or; The second moving unit is used to control the stage and / or the optical structure to move in the Y direction, wherein the Y direction is perpendicular to the X direction, and / or; The third moving unit is used to control the stage and / or the optical structure to move in the Z direction, which is perpendicular to the X direction and perpendicular to the Y direction, and / or; The fourth moving unit is used to control the stage and / or the optical structure to rotate in a plane perpendicular to the Z direction.

8. The binding device according to claim 2, characterized in that, A shielding grating is provided between the optical structure and the stage to shield part of the bright area.

9. The binding device according to claim 2, characterized in that, It also includes an alignment detection structure, which includes an eyepiece and an alignment mark that aligns with the bright area or the bonding area.

10. A component to be bound, comprising a first electronic component and a second electronic component, characterized in that, The bonding device according to any one of claims 1-9 is used for bonding, wherein the first bonding area of ​​the first electronic component includes a first bonding area and a first non-bonding area, the second bonding area of ​​the second electronic component includes a second bonding area and a second non-bonding area, the first bonding area and the second bonding area are stacked, the first non-bonding area and the second non-bonding area are stacked, and the conductive material of the first bonding area melts under the irradiation of the bright area of ​​the interference light to conduct with the conductive material of the second bonding area.

11. The component to be bound according to claim 10, characterized in that, The first bonding region has a first surface facing the second bonding region, and the second bonding region has a second surface facing the first bonding region; the first surface and / or the second surface has an uneven structure; or... The orthographic projection of the first bonding area onto the second electronic component coincides with the second bonding area, and the shape of the first bonding area is rectangular or parallelogram.

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