Molded article and method for manufacturing a molded article

Abstract

A molded product in which a circuit sheet is embedded is provided inexpensively. In a first step, a circuit sheet (20) is disposed so that a first region (AR1) of a second main face (22) of the circuit sheet (20) is in contact with a terrace portion (110) of a first mold (101) and a second region (AR2) is not in contact with the first mold (101). In the first step, a first fixed site of the circuit sheet (20) is disposed at a first portion (Pa1) of the first mold (101), and a second fixed site is disposed at a second portion (Pa2) of the first mold (101). The first portion (Pa1) is a portion along at least one of a first protruding portion (121) and a second protruding portion (122) that is higher than the terrace portion (110) and is disposed along the terrace portion (110), and the second portion (Pa2) is a portion along the terrace portion (110) at which the first protruding portion (121) and the second protruding portion (122) are not disposed.

Description

TECHNICAL FIELD

[0001] The present application relates to a molded product and a method for manufacturing a molded product, and particularly relates to a molded product in which a circuit sheet is embedded in a molded body at the time of molding and a method for manufacturing a molded product. BACKGROUND

[0002] Conventionally, a technology has been known in which a circuit sheet is integrated with a molded product that is a part of a frame body by molding. For example, a display panel is disclosed in Patent Literature 1 (Patent No. 5917354). The display panel described in Patent Literature 1 is a molded product used as a part of a frame body of an electronic device. In the display panel, a substrate film in which a detection electrode layer is formed, an outer side molded body, and an inner side molded body are integrally formed. The circuit sheet of Patent Literature 1 is the substrate film in which the detection electrode layer is formed. The substrate film of Patent Literature 1 is sandwiched by the outer side molded body and the inner side molded body.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent No. 5917354 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] In the display panel described in Patent Literature 1, the substrate film is sandwiched by the outer side molded body and the inner side molded body, and the entire of the outer side molded body, the substrate film, and the inner side molded body are covered by a surface protective layer. With such a structure, the display panel described in Patent Literature 1 can effectively prevent moisture from invading along the outer surface or the inner surface of the substrate film or prevent corrosion gas from invading.

[0008] Further, the display panel described in Patent Literature 1 is molded using a primary molding mold for molding the inner side molded body and a secondary molding mold for molding the outer side molded body. Therefore, in order to obtain the molded product described in Patent Literature 1, two sets of molding molds are required, two-shot molding is required, and manufacturing costs increase.

[0009] The present application has an object to provide a molded product in which a circuit sheet is embedded at a low cost.

[0010] MEANS FOR SOLVING THE PROBLEMS

[0011] Hereinafter, as means for solving the problems, a plurality of modes will be described. These modes can be arbitrarily combined as needed.

[0012] The molding product manufacturing method according to one embodiment of the present application includes: a first step of disposing a circuit sheet having a first main surface, a second main surface opposite to the first main surface, and a conductive pattern in a first mold such that a first region of the second main surface is in contact with a land portion of the first mold and a second region of the second main surface is not in contact with the first mold; a second step of closing a second mold on the first mold such that the circuit sheet is not in contact with the second mold, and forming a mold cavity in which the first main surface of the circuit sheet and the second region of the second main surface are exposed; a third step of introducing a molten material into the mold cavity such that the molten material is in contact with the first main surface of the circuit sheet and the second region of the second main surface; a fourth step of cooling and solidifying the molten material, and forming a molded product made of resin having an outer surface opposite to the first main surface of the circuit sheet and an inner surface opposite to the second region of the second main surface; and a fifth step of opening the first mold and the second mold, and taking out the molded product. In the first step, a first fixed portion of the circuit sheet is disposed in a first portion of the first mold, and a second fixed portion of the circuit sheet including the second region is disposed in a second portion of the first mold. The first portion is a portion of at least one of a first protruding portion higher than the land portion and disposed along the land portion of the first mold and a second protruding portion, and the second portion is a portion along the land portion in which the first protruding portion and the second protruding portion are not disposed.

[0013] In the molding product manufacturing method thus configured, the molded product having the circuit sheet embedded in the resin can be manufactured with one set of the first mold and the second mold. In addition, the molded product having the circuit sheet embedded in the resin can be manufactured by the introduction of the molten material by one injection from when the first mold and the second mold are closed to when the molds are opened.

[0014] In the molding product manufacturing method described above, the second portion of the first mold is a portion in which the width of the land portion is narrower than the width of the circuit sheet. In the molding product manufacturing method thus configured, the structure of the first mold becomes simple, the structure of the molded product becomes simple, and the molded product is easily manufactured.

[0015] In the molding product manufacturing method described above, the second portion of the first mold is a portion in which the land portion is divided, and in the first step, the circuit sheet is supported on two divided portions of the divided land portion in the second portion. In the molding product manufacturing method thus configured, the support portion resin portion supporting the circuit sheet can be increased in the second portion, and the circuit sheet can be firmly fixed.

[0016] Also, in the method for manufacturing a molded product described above, a groove portion can be formed between the first protruding portion and the land portion and between the second protruding portion and the land portion in the first portion of the first mold. In the method for manufacturing a molded product thus configured, the thickness of the resin that contacts the second region of the circuit sheet on both sides of the land portion can be increased by causing the molten material to enter the groove portion. The strength of the resin that fixes the circuit sheet can be increased by the resin whose thickness is increased in this way.

[0017] Also, in the method for manufacturing a molded product described above, the first mold can be configured so that a gap is generated between at least one of the first protruding portion and the first end edge of the circuit sheet and between the second protruding portion and the second end edge of the circuit sheet. In the method for manufacturing a molded product thus configured, the molten material enters at least one of the gap between the first protruding portion and the first end edge and the gap between the second protruding portion and the second end edge. The amount of resin in at least one of the periphery of the first end edge and the periphery of the second end edge of the circuit sheet is increased by the resin that enters in this way, and the support of the resin in the periphery of at least one of the first end edge and the second end edge of the circuit sheet can be strengthened.

[0018] Also, in the method for manufacturing a molded product described above, the connecting portion of the circuit sheet can be inserted into the first mold slit in the first step. In the method for manufacturing a molded product thus configured, the connecting portion can be led to the inner surface side of the molded product.

[0019] Also, in the method for manufacturing a molded product described above, a plurality of sets of the first protruding portion and the second protruding portion can be provided on the first mold, and the circuit sheet can be disposed between the plurality of sets of the first protruding portion and the second protruding portion in the first step. In the method for manufacturing a molded product thus configured, the circuit sheet is difficult to shift with respect to the first mold when the molten material is introduced by the plurality of sets of the first protruding portion and the second protruding portion. By providing the plurality of sets of the first protruding portion and the second protruding portion in this way, the circuit sheet is embedded between the first protruding portion and the second protruding portion of the first mold, the circuit sheet is not shifted by the flow of the molten resin, and can be fixed at a prescribed position of the molded product with high precision.

[0020] Also, in the method for manufacturing a molded product described above, the first protruding portion, the second protruding portion, and the land portion of the first mold can be formed on a sliding block, and the sliding block can be moved in the third step. The mold cavity can be formed at the portion where the first protruding portion, the second protruding portion, and the land portion are located before the sliding block is moved, and the molten material can be introduced. In the method for manufacturing a molded product thus configured, the shift of the circuit sheet when the circuit sheet is molded can be suppressed by the first protruding portion, the second protruding portion, and the land portion in the state where the sliding block is pressed against the second mold. In addition, after the sliding block is retracted, the mold cavity is expanded at the portion where the first protruding portion, the second protruding portion, and the land portion are located before the sliding, and the molten material enters. The fixation of the circuit sheet in the molded product can be strengthened by the resin that enters in this way.

[0021] The molded article according to one embodiment of the present application includes a circuit sheet having a first main surface, a second main surface opposite to the first main surface, and a conductive pattern, and a molded body covering the entire first main surface of the circuit sheet. The molded body has, in the entire periphery of the circuit sheet, a plurality of support resin portions extending from the periphery of the circuit sheet while contacting the second main surface, and has, in the entire periphery of the circuit sheet, a plurality of recessed portions arranged in the periphery of the circuit sheet. The plurality of support resin portions and the plurality of recessed portions are arranged alternately along the periphery.

[0022] In the molded article thus configured, at the time of production, the protrusion portion formed in the mold for forming the recessed portion, the force applied to the circuit sheet from the molten material is moderated, and the force applied to the circuit sheet from the molten resin for forming the support resin portion is applied to the entire periphery of the circuit sheet. Therefore, a molded article in which the displacement of the circuit sheet is reduced and the accuracy of the arrangement position of the circuit sheet is high can be provided.

[0023] Effects of Invention

[0024] According to the production method of the molded article according to the present application, a molded article in which a circuit sheet is embedded can be provided at low cost. BRIEF DESCRIPTION OF DRAWINGS

[0025] FIG. 1 is a perspective view showing an example of a molded article produced by the production method of the molded article according to the first embodiment.

[0026] FIG. 2 is a cross-sectional view showing the cross-sectional shape of the molded article cut along the plane PL1 of FIG. 1

[0027] FIG. 3 (a) of FIG. 6 is a cross-sectional view showing the cross-sectional shape of the molded article cut along the I-I line of FIG. 2 FIG. 3 (b) of FIG. 6 is a partially enlarged cross-sectional view enlarging a part of the cross section of the molded article shown in (a) of FIG. 6. FIG. 3

[0028] FIG. 4 is a perspective view of a first mold and a second mold for producing the molded article of FIG. 1

[0029] FIG. 5 is a plan view of a circuit sheet.

[0030] FIG. 6 is a plan view showing another example of a molded article produced by the production method of the molded article according to the first embodiment.

[0031] FIG. 7 ​​​​of (a) is a sectional view showing a cross-sectional shape of a molded article cut along FIG. 6 of (b) is a sectional view showing a cross-sectional shape of a molded article cut along FIG. 7 of (b) is a sectional view showing a cross-sectional shape of a molded article cut along FIG. 6 of (b) is a sectional view showing a cross-sectional shape of a molded article cut along

[0032] FIG. 8 of (a) is a sectional view showing a cross-sectional shape of a molded article cut along of (b) is a sectional view showing a cross-sectional shape of a molded article cut along

[0033] of (b) is a sectional view showing a cross-sectional shape of a molded article cut along FIG. 9 of (b) is a sectional view showing a cross-sectional shape of a molded article cut along FIG. 8 of (b) is a sectional view showing a cross-sectional shape of a molded article cut along FIG. 9 of (b) is a sectional view showing a cross-sectional shape of a molded article cut along FIG. 8 of (b) is a sectional view showing a cross-sectional shape of a molded article cut along

[0034] FIG. 10 is a schematic view showing a first mold and a second mold before clamping.

[0035] FIG. 11 is a flowchart showing a procedure of a method of manufacturing a molded article.

[0036] FIG. 12 is a partially enlarged plan view showing a part of the first mold.

[0037] FIG. 13 is a partially enlarged plan view showing a part of the first mold and a circuit sheet.

[0038] FIG. 14 of (a) is a partially enlarged sectional view of the first mold, the second mold, and the circuit sheet cut at a position along FIG. 13 of (b) is a partially enlarged sectional view of the first mold, the second mold, and the circuit sheet cut at a position along FIG. 14 of (b) is a partially enlarged sectional view of the first mold, the second mold, and the circuit sheet cut at a position along FIG. 13 of (b) is a partially enlarged sectional view of the first mold, the second mold, and the circuit sheet cut at a position along

[0039] FIG. 15 of (a) is a partially enlarged sectional view of the first mold, the second mold, and the circuit sheet cut at a position along FIG. 13 of (b) is a partially enlarged sectional view of the first mold, the second mold, and the circuit sheet cut at a position along FIG. 15 of (b) is a partially enlarged sectional view of the first mold, the second mold, and the circuit sheet cut at a position along FIG. 13 of (b) is a partially enlarged sectional view of the first mold, the second mold, and the circuit sheet cut at a position along

[0040] FIG. 16 is a partially enlarged plan view showing a part of the molded article.

[0041] FIG. 17 (a) is along FIG. 16 A partial cross-sectional view of the molded product cut along line IX-IX. FIG. 17 (b) is along FIG. 16 Partial cross-sectional view of the molded product cut along line XX.

[0042] FIG. 18 (a) means along FIG. 16 A cross-sectional view of an example of a molded product cut along line XI-XI, FIG. 18 (b) means along FIG. 16 A cross-sectional view of another example of a molded product cut along line XI-XI.

[0043] FIG. 19 This is a partially enlarged plan view showing a portion of the first mold according to the second embodiment.

[0044] FIG. 20 This is a partially enlarged plan view showing a portion of the first mold and a circuit sheet according to the second embodiment.

[0045] FIG. 21 (a) is along FIG. 20 A partially enlarged cross-sectional view of the first mold, the second mold, and the circuit chip cut along the XII-XII line. FIG. 21 (b) is along FIG. 20 A partially enlarged cross-sectional view of the first mold, the second mold, and the circuit chip cut along the XIII-XIII line.

[0046] FIG. 22 (a) is in FIG. 21 A partial cross-sectional view of the molded product cut at a portion corresponding to portion (a). FIG. 22 (b) is in FIG. 21 A partial cross-sectional view of the molded product cut at a portion corresponding to portion (b).

[0047] FIG. 23 (a) is a partially enlarged cross-sectional view showing another structure of the first mold, the second mold, and the circuit sheet of the second embodiment, FIG. 23 (b) is a partial cross-sectional view of a molded product showing another structure of the second embodiment.

[0048] FIG. 24 It is a partially enlarged top view showing a portion of the first mold.

[0049] FIG. 25 It is a partially enlarged top view showing a portion of the first mold and the circuit chip.

[0050] FIG. 26 (a) is along FIG. 25Fig. 6 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XIV-XIV of Fig. 5, FIG. 26 Fig. 7 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XV-XV of Fig. 6, FIG. 25 Fig. 8 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XVI-XVI of Fig. 7.

[0051] FIG. 27 Fig. 9 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XVII-XVII of Fig. 8. FIG. 25 Fig. 10 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XVIII-XVIII of Fig. 9.

[0052] FIG. 28 Fig. 11 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XIX-XIX of Fig. 10. Fig. 12 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XX-XX of Fig. 11.

[0053] Fig. 13 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXI-XXI of Fig. 12. FIG. 29 Fig. 14 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXII-XXII of Fig. 13. FIG. 28 Fig. 15 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXIII-XXIII of Fig. 14. FIG. 29 Fig. 16 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXIV-XXIV of Fig. 15. FIG. 29 Fig. 17 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXV-XXV of Fig. 16. FIG. 28 Fig. 18 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXVI-XXVI of Fig. 17.

[0054] FIG. 30 Fig. 19 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXVII-XXVII of Fig. 18. FIG. 28 Fig. 20 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXVIII-XXVIII of Fig. 19. Fig. 21 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXIX-XXIX of Fig. 20.

[0055] Fig. 22 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXX-XXX of Fig. 21. FIG. 31 Fig. 23 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXXI-XXXI of Fig. 22. Fig. 24 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXXII-XXXII of Fig. 23.

[0056] Fig. 25 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXXIII-XXXIII of Fig. 24. FIG. 32 Fig. 26 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXXIV-XXXIV of Fig. 25. FIG. 31 Fig. 27 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXXV-XXXV of Fig. 26. FIG. 32 Fig. 28 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXXVI-XXXVI of Fig. 27. FIG. 31 Fig. 29 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXXVII-XXXVII of Fig. 28. Fig. 30 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXXVIII-XXXVIII of Fig. 29.

[0057] Fig. 31 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XXXIX-XXXIX of Fig. 30. FIG. 33 Fig. 32 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XL- XL of Fig. 31. Fig. 33 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XLI-XLI of Fig. 32.

[0058] Fig. 34 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XLII-XLII of Fig. 33. FIG. 34 Fig. 35 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XLIII-XLIII of Fig. 34. FIG. 33 Fig. 36 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XLIV-XLIV of Fig. 35. FIG. 34 Fig. 37 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XLV-XLV of Fig. 36. FIG. 33 Fig. 38 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XLVI-XLVI of Fig. 37. Fig. 39 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XLVII-XLVII of Fig. 38.

[0059] Fig. 40 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XLVIII-XLVIII of Fig. 39. FIG. 35 Fig. 41 is a partial enlarged sectional view of the first mold, the second mold, and the circuit sheet at a portion cut along the line XLIX- XLIX of Fig. 40.FIG. 35 (b) is a partially enlarged cross-sectional view showing a portion of the molded article according to Modification C.

[0060] FIG. 36 (a) and FIG. 36 (b) is a partially enlarged cross-sectional view of the first mold, the second mold and the circuit chip of Modification D, FIG. 36 (c) is to be FIG. 8 This is a partially enlarged cross-sectional view showing a portion of the molded article according to Modification D, taken along line XXIV-XXIV.

[0061] FIG. 37 (a) is a partially enlarged cross-sectional view of the first mold, the second mold, and the circuit sheet involved in the modification E, which are cut at one location. FIG. 37 (b) is a partially enlarged cross-sectional view of the first mold, the second mold, and the circuit sheet according to Modification E, cut at another location.

[0062] FIG. 38 (a) is a cross-sectional view of a molded article according to Modification E cut at one location. FIG. 38 (b) is a cross-sectional view of the molded article according to Modification E cut at another location. DETAILED DESCRIPTION

[0063] <First embodiment>

[0064] (1) Overview of molded products

[0065] exist FIG. 1 as well as FIG. 2 An example of the molded product 1 is shown in FIG. FIG. 2 Shown in the FIG. 1 The cross-sectional shape of the molded article 1 cut by the plane PL1 indicated by the single-dot chain line. The plane PL1 is the XZ plane. FIG. 3 (a) shows the FIG. 2 The cross-sectional shape of the molded article 1 cut along the II line, in other words, shows the cross-sectional shape of the molded article 1 cut along the II line. FIG. 1 as well as FIG. 2 The cross-sectional shape of the molded product 1 when cut along a plane perpendicular to the Z direction (XY plane). FIG. 3 (b) shows the enlarged FIG. 3 The part surrounded by the single-dot chain line in (a). FIG. 4 The method for manufacturing FIG. 1 The first mold 101 and the second mold 102 of the molded product 1 are shown. FIG. 5 ] shows the circuit sheet 20 before being bent.

[0066] The molded product 1 has a hollow three-dimensional shape having a housing space HS therein. The molded product 1 includes a molded body 10 and a circuit sheet 20 . FIG. 1 as well as FIG. 2 The molded product 1 shown is a molded product in which a molded body 10 and a circuit chip 20 are integrated by insert molding in a single injection. FIG. 2 、 FIG. 3 (a) and FIG. 3 In (b), hatching indicating the cross section of the molded body 10 is omitted to avoid obscuring the drawing.

[0067] The molded body 10 has an outer surface 11 and an inner surface 12. The inner surface 12 is exposed to the receiving space HS. Resin may also be exposed on the outer surface 11 of the molded body 10. A decorative layer may also be formed on the outer surface 11 of the molded body 10 at the same time as molding. In addition, the outer surface 11 of the molded body 10 may also be painted after molding. The circuit chip 20 has a first main surface 21 and a second main surface 22. The molded body 10 is arranged in contact with the first main surface 21 of the circuit chip 20, and is arranged in contact with the second main surface 22 of the circuit chip 20. FIG. 2 In the embodiment of the present invention, the outer peripheral portion 13 is the portion that contacts the first principal surface 21 of the circuit chip 20, and the inner peripheral portion 14 is the portion that contacts the second principal surface 22 of the circuit chip 20. In other words, the circuit chip 20 is embedded in the molded body 10 in a manner that is sandwiched between the outer peripheral portion 13 and the inner peripheral portion 14. The circuit chip 20 thus embedded in the molded body 10 is fixed by being sandwiched from both sides of the first principal surface 21 and the second principal surface 22 by the constituent material constituting the molded body 10. When the circuit chip 20 is fixed by being sandwiched from both sides of the first principal surface 21 and the second principal surface 22 in this manner, an adhesive for bonding the circuit chip 20 and the molded body 10 can be omitted. If the adhesive is omitted, the adhesive application step can be omitted. Alternatively, an adhesive for bonding the circuit chip 20 and the molded body 10 can be provided.

[0068] use FIG. 4 The molded article 1 is manufactured by using the first mold 101 and the second mold 102 shown. An opening 29 is provided in the center of the circuit chip 20. The portion where the circuit chip 20 is arranged is the terraced portion 110 of the first mold 101 located around the opening 29 of the circuit chip 20. The first mold 101 has an air intake hole 106. The circuit chip 20 set on the first mold 101 is sucked and held by the air intake hole 106. A gate 105 for injecting molten resin is provided in the center of the first mold 101. The gate 105 injects resin from the opening 29. Here, the gate 105 is provided in the opening 29 of the circuit chip 20 in the center of the first mold 101. However, the position where the gate 105 is provided is not limited to the aforementioned position. The position where the gate 105 is provided can be any position where the molten resin is not directly injected into the second main surface 22 of the circuit chip 20.

[0069] (1-1) Circuit sheet 20

[0070] The circuit sheet 20 is, for example, a metal sheet, a sheet material in which a metal sheet and an insulating film are laminated, a printed circuit film, or a flexible wiring substrate (hereinafter, sometimes referred to as FPC), or a combination thereof. The metal sheet is, for example, a punched copper foil having a prescribed shape. The metal sheet can be processed to have a three-dimensional shape. For example, the punched copper foil can be bent by press working. The printed circuit film is a film in which a wiring pattern is formed by thick film printing of a conductive ink on an insulating film. In the printed circuit film, for example, a portion in which a conductive ink containing a conductive substance such as silver particles is applied functions as a wiring pattern after drying. The insulating film used in the printed circuit film and the FPC is formed of, for example, an organic material. The organic material constituting the insulating film is, for example, a resin. The resin constituting the insulating film is, for example, a polyimide resin, a polycarbonate resin, or a polyester resin. The printed circuit film and the FPC can also be a thin film in which an insulating film in which a wiring pattern is formed is processed to have a three-dimensional shape.

[0071] (1-1-1) Case where the circuit sheet 20 is a printed circuit film

[0072] FIG. 1 to FIG. 3 The circuit sheet 20 shown in FIG. 1 (b) and FIG. 1 (c) is a printed circuit film. FIG. 5 The circuit sheet 20 shown in FIG. 1 (b) and FIG. 1 (c) is a printed circuit film. FIG. 1 The circuit sheet 20 shown in FIG. 1 (b) and FIG. 1 (c) is a printed circuit film.

[0073] The circuit sheet 20 is divided into a main portion 20a in which the antenna 32 and the touch switch 33 are formed, and a lead portion 20b in which the wiring pattern 31 that is mainly drawn out to the outside of the molded article 1 is formed. A connection portion 20c that is connected to a wiring outside the circuit sheet 20 is provided at the front end of the lead portion. This circuit sheet 20 is bent so that the main portion 20a and the lead portion 20b are orthogonal to each other by a simple bending device before being integrated with the molded body 10. Note that, in this example, the case where the main portion 20a and the lead portion 20b are orthogonal to each other is described, but the main portion 20a and the lead portion 20b can not be orthogonal to each other. A reinforcing plate 34 is attached to the back surface of the connection portion 20c. The back surface of the connection portion 20c becomes the surface on the opposite side to the surface on which the wiring is formed. The reinforcing plate 34 can also be attached after the molded body 10 is molded.

[0074] (1-1-2) Case where the circuit sheet 20 is a metal sheet

[0075] In FIG. 6 , FIG. 7 (a) of FIG. 10 and FIG. 7 (b) of FIG. 11 show the molded article 1 in which the circuit sheet 20 is a metal sheet. In FIG. 6 , a state in which the molded article 1 is viewed from above (a state viewed in the Z-axis direction) is shown. In FIG. 7 (a), a shape of a cross section of the molded article 1 cut along the II-II line of FIG. 10 is shown. In FIG. 6 (b), a shape of a cross section of the molded article 1 cut along the III-III line of FIG. 10 is shown. FIG. 7 FIG. 6

[0076] FIG. 6 The circuit sheet 20 shown in FIGS. 10 and 11 is an antenna 41 and a touch switch 42 formed of a metal sheet. The metal sheet is, for example, a sheet of copper or a copper alloy. The circuit sheet 20 uses, for example, a phosphor bronze plate excellent in spring characteristics in the case where a terminal portion connected to a device is provided. The circuit sheet 20 is shaped into a three-dimensional shape as needed, is blanked into a prescribed shape, is processed into a shape suitable for embedding, and, in order to prevent corrosion, a plating treatment of nickel, gold is generally performed. The plate thickness of the phosphor bronze plate is 0.05 mm to 0.5 mm, and the plate thickness suitable for press working is 0.07 mm to 0.3 mm. A portion extending along the outer surface 11 of the molded body 10 is a main portion 20a of the antenna 41 and the touch switch 42. A portion of the phosphor bronze plate extending in the Z-axis direction is a lead portion 20b of the antenna 41 and the touch switch 42. A connection portion 20c is connected to a device housed on the inner surface 12 side of the molded body 10. In the circuit sheet 20 shown in (a) of FIG. 10 and (b) of FIG. 11, the outer peripheral portion 13 of the molded body 10 is in contact with the first main surface 21 of the circuit sheet 20, and the inner peripheral portion 14 is in contact with the second main surface 22 of the circuit sheet 20. FIG. 7 FIG. 7 In the circuit sheet 20 shown in (a) of FIG. 10 and (b) of FIG. 11, the outer peripheral portion 13 of the molded body 10 is in contact with the first main surface 21 of the circuit sheet 20, and the inner peripheral portion 14 is in contact with the second main surface 22 of the circuit sheet 20.

[0077] (1-1-3) Case where the circuit sheet 20 is an FPC

[0078] In FIG. 8 , FIG. 9 (a) of FIG. 12 and FIG. 9 (b) of FIG. 13 show the molded article 1 in which the circuit sheet 20 is an FPC. In FIG. 8 , a state in which the molded article 1 is viewed from the back (a state viewed in the Z-axis direction) is shown. In FIG. 9 (a), a shape of a cross section of the molded article 1 cut along the IV-IV line of FIG. 12 is shown. In FIG. 8 (b), a shape of a cross section of the molded article 1 cut along the V-V line of FIG. 12 is shown. FIG. 9 FIG. 8 ​​​​of the V-V line cut molded article 1. Note that, in FIG. 8 the part shown by the hatching of the dot is a part in which the molded body 10 covers the circuit sheet 20.

[0079] FIG. 8 The circuit sheet 20 shown in the drawing has a wiring pattern 51 formed by etching or plating, an LED 52, and a high-function electronic component 53 such as an integrated circuit. The wiring pattern 51 is covered with a cover film. These wiring patterns 51 are examples of conductive patterns. The aforementioned LED is an abbreviation of light emitting diode. The LED 52 and the high-function electronic component 53 are connected to, for example, a device other than the molded article 1 through the wiring pattern 51. The LED 52 is a functional component for notifying information to the outside of the molded article 1 with light. The high-function electronic component 53 is, for example, a functional component that exerts a complex function in accordance with an input from a device connected to the circuit sheet 20. The circuit sheet 20 is divided into a main part 20a in which the LED 52 and the high-function electronic component 53 are formed, and a lead part 20b in which the wiring pattern 51 is formed that is mainly drawn to the outside of the molded article 1. This circuit sheet 20 is bent so that the main part 20a and the lead part 20b are orthogonal, with a simple bending device, before being integrally molded with the molded body 10. As shown in (a) of FIG. 9 (b) of the drawing, a reinforcing plate 54 is attached to the connecting part 20c of the circuit sheet 20. The shape of the reinforcing plate 54 before being bent is a rectangular shape. A part of the reinforcing plate 54 extends to a part of the main part 20a. The reinforcing plate 54 is, for example, composed of a thin plate of a thermoplastic resin or stainless steel. The cross-sectional shape of the reinforcing plate 54 after being bent becomes an L-shaped cross section.

[0080] (1-2) MOLDED BODY 10

[0081] The molded body 10 is formed by solidification of a molten material injected at the time of insert molding. The thickness (the distance LI of the outer surface 11 from the inner surface 12) of the molded body 10 is, for example, 2.5 mm (refer to FIG. 2 , FIG. 7 (b) of the drawing, and FIG. 9(b)). The distance L1 between the outer surface 11 and the inner surface 12 is set, for example, in the range of 0.6 mm to 5 mm. The molded body 10 may be colored or not. The molded body 10 is molded using at least one of a transparent, translucent or opaque thermoplastic resin and a thermoplastic elastomer. The molten material referred to here is, for example, a material in which at least one of a thermoplastic resin and a thermoplastic elastomer melts due to heat. As the material of the molded body 10, there are general-purpose thermoplastic resins such as polystyrene resins, polyolefin resins, ABS resins or AS resins. In addition, polycarbonate resins, polyacetal resins, acrylic resins, polybutylene terephthalate resins, engineering resins (polysulfone resins, polyphenylene sulfide resins, polyphenylene ether resins, polyarylate resins, etc.), polyamide resins, or urethane, polyester or styrene elastomers are used as the material of the molded body 10. In addition, natural rubber or synthetic rubber is used as the material of the molded body 10. The molded body 10 may also be composed of a material other than the solidified molten material. In addition, resin reinforcement materials such as glass fiber or inorganic fillers such as barium titanate that increase the dielectric constant may also be added to the molded body 10. Furthermore, before introducing silicone resin, phenolic resin, epoxy resin, etc., they are heated to a fluid state, but thermosetting resins of the type that solidify by chemical reaction in the mold or polyurethane resins obtained by mixing two liquids may also be used. Even when the molded body 10 is formed from polyacetal resins and engineering resins that are difficult to bond to the circuit chip 20, or thermosetting resins that do not bond to general adhesives, the circuit chip 20 can still be physically fixed to the molded body 10. The molding method is not limited to injection molding, and molding methods suitable for the materials of various molded bodies, such as transfer molding, foam molding, blow molding, and RIM molding, may also be selected.

[0082] (2) Manufacturing method of molded products

[0083] For example, the molded article 1 is used FIG. 10 The first mold 101 and the second mold 102 are shown in FIG. FIG. 11 2 shows an overview of the manufacturing process of the molded article 1 .

[0084] exist FIG. 11 In the transfer sheet arrangement process (step S1) shown in FIG. FIG. 10 As shown, a transfer sheet 200 is arranged between the molds (the first mold 101 and the second mold 102) after the molds are opened.

[0085] The transfer sheet 200 is fixed to the second mold 102 by a clamp (not shown), for example. The transfer sheet 200 is a transfer sheet having a transfer layer and an adhesive layer formed on a base film. FIG. 10 as well as FIG. 11In the manufacturing method of the molded product 1 shown, the transfer layer is adhered to the outer surface 11 of the molded body 10 via the adhesive layer. The base film constituting the transfer sheet 200 is formed in most cases from a polyolefin-based resin, a polycarbonate-based resin, a polyethylene terephthalate-based resin.

[0086] While the transfer sheet 200 is being arranged, or before and after the transfer sheet 200 is arranged, the circuit sheet 20 is arranged on the first mold 101 (step S1).

[0087] After the circuit sheet 20 is arranged, the first mold 101 and the second mold 102 are clamped (step S2). By the clamping of the first mold 101 and the second mold 102, a mold cavity Cv (refer to FIG. 14 (a) of FIG. 1 and FIG. 14 (b) of FIG. 1) surrounded by the first mold 101 and the second mold 102 is formed.

[0088] Melted resin is injected into the mold cavity Cv of the first mold 101 and the second mold 102 (step S3). A prescribed pressure is continuously applied so that the resin injected into the mold cavity Cv becomes an appropriate density. Note that, in this first embodiment, as the melted material, a melted resin is exemplified. However, the melted material can also be a material other than a melted resin. For example, as a melted material instead of a melted resin, a melted thermoplastic elastomer can be used, or a thermosetting resin that becomes a flow state by heating and is cured by a chemical reaction by heat in a mold, or a polyurethane resin that mixes two liquids, a main agent and a reaction agent, and performs a chemical reaction in a mold.

[0089] Next, the melted resin in the mold cavity Cv is cooled (step S4). The resin that is cooled and cured in the mold cavity Cv becomes the molded body 10.

[0090] Finally, the first mold 101 and the second mold 102 are opened, and the molded product 1 is taken out (step S5).

[0091] The arrangement of the circuit sheet 20 in step S1 (first step) described above into the first mold 101 is described in more detail. In FIG. 12 and FIG. 13 , a portion of the first mold 101 shown in FIG. 10 is enlarged. Enlarged in FIG. 13 is the core face CF of the first mold 101 and the circuit sheet 20 constituting the antenna 41 arranged on the core face CF. In FIG. 14 (a), the cross-sectional shape of the first mold 101, the second mold 102, and the circuit sheet 20 in a clamped state is shown enlarged at a portion along the VI-VI line of FIG. 13 . In FIG. 14(b) is an enlarged view showing a cross-sectional shape of the first mold 101, the second mold 102, and the circuit sheet 20 at a position along FIG. 13 VII-VII line in FIG. 8. In addition, in (a) of FIG. 8 and (b) of FIG. 8, the cross-sectional shape of the first mold 101, the second mold 102, and the circuit sheet 20 in a mold clamped state is shown. FIG. 15 (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing. FIG. 15 (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing. FIG. 13 (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing. FIG. 15 (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing. FIG. 15 (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing.

[0092] (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing. FIG. 14 (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing. FIG. 14 (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing. FIG. 14 (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing. FIG. 14 (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing.

[0093] (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing. FIG. 13 (a) of FIG. 8 and (b) of FIG. 8, the first mold 101 has a terrace portion 110 on the core face CF. In (a) of FIG. 8 and (b) of FIG. 8, hatching lines showing a cross section of the first mold 101 are omitted in order to avoid difficulty in viewing the drawing.FIG. 13 Among the three groups of the first protruding portions 121 and the second protruding portions 122, the portion indicated by hatching with oblique lines between the first protruding portions 121 and the second protruding portions 122 is a first portion Pa1. In addition, a second portion Pa2 is a portion indicated by hatching with dots in FIG. 13 In addition, it is noted that, in order to avoid difficulty in observing the drawing, the first portion Pa1 and a part of the second portion Pa2 are indicated by hatching. FIG. 13 In addition, it is noted that, in order to avoid difficulty in observing the drawing, the first portion Pa1 and a part of the second portion Pa2 are indicated by hatching. FIG. 13 In addition, it is noted that, in order to avoid difficulty in observing the drawing, the first portion Pa1 and a part of the second portion Pa2 are indicated by hatching. FIG. 13 In addition, it is noted that, in order to avoid difficulty in observing the drawing, the first portion Pa1 and a part of the second portion Pa2 are indicated by hatching. Thus, in

[0094] As shown in FIG. 12 and FIG. 13 , the second portion Pa2 is a portion in which the width of the terrace portion 110 is narrower than the width of the circuit sheet 20. Thus, the circuit sheet 20 protrudes from the terrace portion 110 by the difference between the width of the terrace portion 110 and the width of the circuit sheet 20. The portion of the circuit sheet 20 protruding from the terrace portion 110 becomes the second region AR2 which does not contact the terrace portion 110.

[0095] In addition, in the first portion Pa1, the groove portions 131, 132 are formed between the first protruding portions 121 and the terrace portion 110 and between the second protruding portions 122 and the terrace portion 110.

[0096] It is noted that the third protruding portion 123 is provided at one end portion of the terrace portion 110. The third protruding portion 123 is higher than the terrace portion 110 as viewed from the core face CF. By providing such a third protruding portion 123, the force applied to the circuit sheet 20 from the molten resin when the molten resin is injected is weakened by the third protruding portion 123. By the action of such a third protruding portion 123, it is possible to suppress the displacement of one end portion of the circuit sheet 20 due to the force applied to the circuit sheet 20 from the molten resin.

[0097] As shown in FIG. 15 (a) and FIG. 15As shown in (b), when the circuit chip 20 is set in the first mold 101, the lead portion 20b of the circuit chip 20 is accommodated in the opening portion 141, the slit 143 and the accommodation portion 140. The width and thickness of the opening portion 141 are both larger than the lead portion 20b. During molding, molten resin enters the opening portion 141. The molten resin that enters the opening portion 141 becomes the support portion 17 at the root of the bent portion of the lead portion 20b after molding. The width and thickness of the slit 143 are only slightly larger than the width and thickness of the lead portion 20b of the circuit chip 20. By inserting the lead portion 20b into such a slit 143, the molten resin cannot enter the slit 143, and the resin will not enter the accommodation portion 140. Therefore, since the connecting portion 20c is exposed even after molding, it is possible to use the connecting portion 20c for electrical connection. It should be noted that in order to facilitate the guidance of the lead portion 20b to the slit 143, the first mold 101 is provided with a tapered portion 142 connected from the opening 141 to the slit 143. In addition, the molten resin enters the opening 141, which is wider and thicker than the slit 143, and reinforces the rising portion of the connecting portion 20c.

[0098] In the above step S2 (second step), if FIG. 14 (a) and FIG. 14 As shown in (b), the first mold 101 and the second mold 102 are clamped in such a manner that the circuit chip 20 is not in contact with the second mold 102. In the above-mentioned step S3 (third step), molten resin is injected into the mold cavity Cv, and the molten resin contacts the first main surface 21 of the circuit chip 20 and the second area AR2 of the second main surface 22. In addition, in step S4 (fourth step), the molten resin is cooled and solidified to form a resin molded product 1 having an outer surface 11 opposite to the first main surface 21 of the circuit chip 20 and an inner surface 12 opposite to the second area AR2 of the second main surface 22. In step S5 (fifth step), the first mold 101 and the second mold 102 are opened, and the molded product 1 is taken out. A decorative layer 19 is transferred to the outer surface 11 of the molded body 10.

[0099] like FIG. 13 to FIG. 15 As shown in (b), the molded article 1 is molded using the antenna 42 provided in the first mold 101 and the second mold 102. FIG. 16 、 FIG. 17 (a) FIG. 17 (b) FIG. 18 (a) and FIG. 18 (b) is shown in FIG. FIG. 17 (a) shows the magnified image along FIG. 16 The cross-sectional shape of the molded product 1 cut along the line IX-IX. FIG. 17 (b) shows the magnified image along FIG. 16 The cross-sectional shape of the molded product 1 cut along the XX line.FIG. 18 (a) and FIG. 18 (b) shows the magnified image along FIG. 16 The cross-sectional shape of the molded article 1 cut along the XI-XI line. In the second portion Pa2 of the first mold 101, neither the first protrusion 121 nor the second protrusion 122 is provided along the terrace 110. In the second portion Pa2 where neither the first protrusion 121 nor the second protrusion 122 is provided along the terrace 110, as shown in FIG. FIG. 17 As shown in (b), the supporting resin portion 10b of the molded body 10 is in contact with the second area AR2 of the second main surface 22 of the circuit chip 20. The circuit chip 20 is clamped by the supporting resin portion 10b in contact with the second area AR2 of the second main surface 22 and the resin 10a in contact with the first main surface 21 opposite to the second area AR2. Thus, the circuit chip 20 is clamped by the resin 10a on the first main surface 21 side and the supporting resin portion 10b on the second main surface 22 side, thereby firmly fixing the circuit chip 20.

[0100] FIG. 17 The recesses 15a and 15b of (a) are formed by FIG. 14 The first protrusion 121 and the second protrusion 122 shown in (a) are separated to form a depression. The ribs 16a and 16b adjacent to the recesses 15a and 15b are formed by allowing the molten resin to enter. FIG. 14 The circuit chip 20 is formed by the grooves 131 and 132 shown in (a). The ribs 16a and 16b and the resin 10a on the first main surface 21 side facing the ribs 16a and 16b sandwich the circuit chip 20. The resin (ribs 16a and 16b) that has entered the grooves 131 and 132 strengthens the fixation of the circuit chip 20 in the molded article 1.

[0101] like FIG. 14As shown in (a), a gap In1 is provided between the circuit chip 20 and the first protrusion 121. Similarly, a gap In2 is provided between the circuit chip 20 and the second protrusion 122. These gaps In1 and In2 serve as a margin when the circuit chip 20 is provided between the first protrusion 121 and the second protrusion 122. Therefore, the narrower the gaps In1 and In2, the higher the positional accuracy of the circuit chip 20 in the molded body 10. Conversely, high precision is required in all parts of the shape of the circuit chip 20. It should be noted that in order to prevent the provided circuit chip 20 from falling off from the first mold 101, one or more air intake holes may be provided at any part of the terrace 110. With regard to the fixation of the circuit chip 20, the molten resin also enters the gaps In1 and In2, and resin side walls 10c and 10d are also formed on the outside of the first end 20m and the second end 20n of the circuit chip 20. These side walls 10c and 10d can strengthen the fixation of the circuit chip 20. The total width of the gap In1 and the width of the gap In2 is, for example, 0.01 mm to 0.2 mm.

[0102] like FIG. 18 (a) and FIG. 18 As shown in (b), the resin does not adhere to the connection portion 20c of the circuit sheet 20. Therefore, the circuit sheet 20 can use the connection portion 20c to make a good electrical connection with the device outside the molded product 1. FIG. 15 (a) and FIG. 15 The resin in the opening 141 of (b) serves as the support portion 17 for reinforcing the base of the bent portion of the lead portion 20b. FIG. 18 (a) and FIG. 18 The circuit sheet 20 of (b) is made of a thin plate of phosphor bronze, which is a metal sheet with excellent spring properties. FIG. 18 As shown in (a), the connecting portion 20c may be straight without being bent. FIG. 18 As shown in (b), before or after insert molding of the molded product 1, the connection portion 20c made of a metal sheet may be deformed into a shape suitable for electrical connection by press working or the like.

[0103] <Second embodiment>

[0104] In the first embodiment described above, FIG. 14 As shown in (a), the case where the molded article 1 is manufactured using the first mold 101 having grooves 131 and 132 formed between the terrace 110 and the first and second protrusions 121 and 122 is described. However, the molded article 1 may also be manufactured using the first mold 101 without the grooves 131 and 132 formed therein.

[0105] In the second embodiment, a method of manufacturing the molded product 1 using the first mold 101 in which the grooves 131 and 132 are not formed, and a molded product manufactured by such a method will be described.

[0106] (3) Manufacturing method of molded products

[0107] For example, the molded article 1 is used FIG. 19 The manufacturing process of the molded article 1 of the second embodiment can be similar to that of the first embodiment. FIG. 11 The manufacturing process shown. In addition to using FIG. 19 The manufacturing method of the second embodiment is the same as the manufacturing method of the first embodiment except for the first mold 101 shown, and therefore an outline of the manufacturing process of the second embodiment will be omitted.

[0108] The placement of the circuit sheet 20 on the first mold 101 in step S1 (first step) will be described in more detail. FIG. 19 as well as FIG. 20 In the figure, the enlarged FIG. 10 A portion of the first mold 101 is shown. FIG. 20 The enlarged figure shows the core surface CF of the first mold 101 and the circuit sheet 20 constituting the antenna 41 provided on the core surface CF. FIG. 21 (a) shows the magnified image along FIG. 20 The cross-sectional shape of the first mold 101, the second mold 102 and the circuit sheet 20 in the mold-clamped state is cut at the XII-XII line. FIG. 21 (b) shows the magnified image along FIG. 20 The cross-sectional shape of the first mold 101, the second mold 102 and the circuit sheet 20 in the mold clamping state is cut along the XIII-XIII line. FIG. 21 (a) and FIG. 21 In (b), hatching indicating the cross section of the first mold 101 is omitted to avoid difficulty in seeing the figure. It should be noted that the same components of the first mold 101 of the second embodiment as those of the first mold 101 of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

[0109] like FIG. 19 as well as FIG. 20 As shown, the second portion Pa2 is a portion where the width of the terrace 110 is narrower than the width of the circuit chip 20. Therefore, the circuit chip 20 protrudes from the terrace 110 by the difference between the widths of the terrace 110 and the circuit chip 20. The portion of the circuit chip 20 that protrudes from the terrace 110 forms a second region AR2 that is not in contact with the terrace 110.

[0110] The first portion Pa1 is a portion of the plateau portion 110 whose width is wider than the width of the circuit sheet 20 with respect to the second portion Pa2. Therefore, the plateau portion 110 protrudes from the circuit sheet 20 by the difference between the width of the plateau portion 110 and the width of the circuit sheet 20.

[0111] Note that, in the second embodiment, as FIG. 19 and FIG. 20 indicated, in the first portion Pa1, no groove portion is formed between the first protruding portion 121 and the plateau portion 110 and between the second protruding portion 122 and the plateau portion 110. A third protruding portion 123 is provided at one end portion of the plateau portion 110. No groove is also formed between the third protruding portion 123 and the plateau portion 110.

[0112] In the above-described step S2 (second step), as FIG. 21 (a) and FIG. 21 (b), the first mold 101 and the second mold 102 are closed in such a manner that the circuit sheet 20 does not come into contact with the second mold 102. In the above-described step S3 (third step), molten resin is injected into the cavity Cv. Further, in step S4 (fourth step), the molten resin is cooled and solidified, and the molded product 1 having the outer surface 11 opposed to the first main surface 21 of the circuit sheet 20 and the inner surface 12 opposed to the second region AR2 of the second main surface 22 is formed. In step S5 (fifth step), the first mold 101 and the second mold 102 are opened, and the molded product 1 is taken out. The decorative layer 19 is transferred on the outer surface 11 of the molded product 10.

[0113] As FIG. 20 to FIG. 21 (b), the molded product 1 molded using the antenna 41 provided on the first mold 101 and the second mold 102 is shown in FIG. 22 (a), FIG. 22 (b). In FIG. 22 (a), the cross-sectional shape of the molded product 1 corresponding to FIG. 21 (a) is shown in enlargement. In FIG. 22 (b), the cross-sectional shape of the molded product 1 corresponding to FIG. 21 (b) is shown in enlargement. On the second portion Pa2 of the first mold 101, neither the first protruding portion 121 nor the second protruding portion 122 is provided along the plateau portion 110. In the second portion Pa2 in which neither the first protruding portion 121 nor the second protruding portion 122 is provided along the plateau portion 110, the width of the plateau portion 110 is narrower than the width of the circuit sheet 20. Therefore, as FIG. 22In the second portion Pa2, the supporting resin portion 10b of the molded body 10 is in contact with the second region AR2 of the second main surface 22 of the circuit sheet 20, as shown in (b) of FIG. 10. The circuit sheet 20 is sandwiched by the supporting resin portion 10b in contact with the second region AR2 of the second main surface 22 and the resin 10a in contact with the first main surface 21 opposite to the second region AR2, whereby the circuit sheet 20 is sandwiched by the resin 10a on the first main surface 21 side and the supporting resin portion 10b on the second main surface 22 side, and thus the circuit sheet 20 is firmly fixed.

[0114] FIG. 22 The recesses 15a, 15b of (a) are formed by FIG. 21 The recesses 15a, 15b of (a) are formed by FIG. 21 As shown in (a) of FIG. 10, a gap Inl is provided between the circuit sheet 20 and the first protruding portion 121, and a gap In2 is provided between the circuit sheet 20 and the second protruding portion 122. In order to prevent the provided circuit sheet 20 from falling off from the first mold 101, one or more air suction holes can be provided at any portion of the terrace portion 110. If the gaps Inl, In2 are also filled with the molten resin to form side walls 10c, 10d on the outer sides of the first end edge 20m and the second end edge 20n of the circuit sheet 20, the fixation of the circuit sheet 20 can be strengthened by the side walls 10c, 10d.

[0115] As shown in (a) of FIG. 10, a gap Inl is provided between the circuit sheet 20 and the first protruding portion 121, and a gap In2 is provided between the circuit sheet 20 and the second protruding portion 122. In order to prevent the provided circuit sheet 20 from falling off from the first mold 101, one or more air suction holes can be provided at any portion of the terrace portion 110. If the gaps Inl, In2 are also filled with the molten resin to form side walls 10c, 10d on the outer sides of the first end edge 20m and the second end edge 20n of the circuit sheet 20, the fixation of the circuit sheet 20 can be strengthened by the side walls 10c, 10d. FIG. 21 As shown in (a) of FIG. 10, a gap Inl is provided between the circuit sheet 20 and the first protruding portion 121, and a gap In2 is provided between the circuit sheet 20 and the second protruding portion 122. In order to prevent the provided circuit sheet 20 from falling off from the first mold 101, one or more air suction holes can be provided at any portion of the terrace portion 110. If the gaps Inl, In2 are also filled with the molten resin to form side walls 10c, 10d on the outer sides of the first end edge 20m and the second end edge 20n of the circuit sheet 20, the fixation of the circuit sheet 20 can be strengthened by the side walls 10c, 10d. FIG. 23 As shown in (a) of FIG. 10, a gap Inl is provided between the circuit sheet 20 and the first protruding portion 121, and a gap In2 is provided between the circuit sheet 20 and the second protruding portion 122. In order to prevent the provided circuit sheet 20 from falling off from the first mold 101, one or more air suction holes can be provided at any portion of the terrace portion 110. If the gaps Inl, In2 are also filled with the molten resin to form side walls 10c, 10d on the outer sides of the first end edge 20m and the second end edge 20n of the circuit sheet 20, the fixation of the circuit sheet 20 can be strengthened by the side walls 10c, 10d. FIG. 23 As shown in (a) of FIG. 10, a gap Inl is provided between the circuit sheet 20 and the first protruding portion 121, and a gap In2 is provided between the circuit sheet 20 and the second protruding portion 122. In order to prevent the provided circuit sheet 20 from falling off from the first mold 101, one or more air suction holes can be provided at any portion of the terrace portion 110. If the gaps Inl, In2 are also filled with the molten resin to form side walls 10c, 10d on the outer sides of the first end edge 20m and the second end edge 20n of the circuit sheet 20, the fixation of the circuit sheet 20 can be strengthened by the side walls 10c, 10d. FIG. 23 The cross-sectional shape of the molded product 1 corresponding to the portion shown in (a) is shown in (b) of FIG. 10. FIG. 23

[0116] (4) Modification

[0117] (4-1) Modification A

[0118] As in the first embodiment described above, FIG. 17 ​As shown in (b), in the second portion Pa2 of the first mold 101, the first area AR1 of the second main surface 22 of the circuit chip 20 is supported by the terrace portion 110 of the first mold 101. However, in the second portion Pa2 of the first mold 101, the first mold 101 may be configured so that the terrace portion 110 does not support the circuit chip 20.

[0119] use FIG. 24 、 FIG. 25 、 FIG. 26 (a) FIG. 26 (b) and FIG. 27 , the structure of the first mold 101 formed so that the terraced portion 110 does not support the circuit sheet 20 will be described. FIG. 28 、 FIG. 29 (a) FIG. 29 (b) FIG. 29 (c) and FIG. 30 , for FIG. 24 to FIG. 27 The molded article 1 molded by the first mold 101 and the second mold 102 shown will be described.

[0120] Further details FIG. 11 In step S1 (first step), the circuit sheet 20 is placed on the first mold 101. FIG. 24 as well as FIG. 25 In the figure, the enlarged FIG. 10 A portion of the first mold 101 is shown. FIG. 25 The enlarged figure shows the core surface CF of the first mold 101 and the circuit sheet 20 constituting the antenna 41 provided on the core surface CF. FIG. 26 (a) shows the magnified image along FIG. 25 The cross-sectional shape of the first mold 101, the second mold 102 and the circuit sheet 20 in the mold clamping state is cut along the XIV-XIV line. FIG. 26 (b) shows the magnified image along FIG. 25 The XV-XV line cuts the cross-sectional shape of the first mold 101, the second mold 102 and the circuit sheet 20 in the mold clamping state. FIG. 27 The enlarged view shows the FIG. 25 The cross-sectional shape of the first mold 101, the second mold 102, and the circuit sheet 20 in the mold-clamped state is shown along the line XVI-XVI.

[0121] like FIG. 26 As shown in (a), the first mold 101 has a terraced portion 110 on the core surface CF. FIG. 26As shown in (b), the first mold 101 does not have the terrace 110 in the second portion Pa2 and therefore does not support the circuit sheet 20. The second portion Pa2 is a portion that divides the terrace 110. In other words, the terrace 110 is divided by the second portion Pa2. Alternatively, it can be said that the terrace 110 has two divided portions of the terrace 110 on both sides of the second portion Pa.

[0122] exist FIG. 26 (a) and FIG. 26 In (b), the hatching representing the cross section of the first mold 101 is omitted to avoid making the figure difficult to see. In the first portion Pa1 of the first mold 101, a portion of the second main surface 22 of the circuit chip 20 is in contact with the terrace-shaped portion 110. The portion of the second main surface 22 in contact with the terrace-shaped portion 110 is the first area AR1. In addition, in the second portion Pa2 of the first mold 101, a portion of the second main surface 22 of the circuit chip 20 is not in contact with the terrace-shaped portion 110. The portion of the second main surface 22 not in contact with the terrace-shaped portion 110 is the second area AR2. FIG. 26 As can be seen from (b), the circuit chip 20 is placed on the divided portions of the adjacent terraces 110 so that the second portion Pa2 does not contact the first mold 101. In other words, the circuit chip 20 is suspended in the second portion Pa2 in the cavity Cv.

[0123] A first protrusion 121 and a second protrusion 122 are provided along the terrace portion 110. FIG. 25 As shown in (a), in the first portion Pa1, no groove is formed between the first protrusion 121 and the terrace portion 110 and between the second protrusion 122 and the terrace portion 110. FIG. 27 As shown, a third protrusion 123 is provided at one end of the terrace portion 110. FIG. 11 As shown, when the circuit chip 20 is placed in the first mold 101, the lead portion 20b of the circuit chip 20 is inserted into the opening 141, the slit 143, and the receiving portion 140. In addition, in order to easily guide the lead portion 20b to the slit 143, a tapered portion 142 is provided connecting the opening 141 and the slit 143.

[0124] exist FIG. 26 In step S2 (second step), as FIG. 26 (a) and FIG. 11 As shown in (b), the first mold 101 and the second mold 102 are clamped together in such a manner that the circuit chip 20 does not contact the second mold 102. FIG. 29In step S3 (third step), molten resin is injected into the cavity Cv, and the molten resin comes into contact with the first main surface 21 and the second region AR2 of the second main surface 22 of the circuit sheet 20. Further, in step S4 (fourth step), the molten resin is allowed to cool and solidify, and a molded product 1 of resin having an outer surface 11 opposite to the first main surface 21 of the circuit sheet 20 and an inner surface 12 opposite to the second region AR2 of the second main surface 22 is formed (refer to FIG. 29 (a) to (c) of FIG. 10. In step S5 (fifth step), the first mold 101 and the second mold 102 are opened, and the molded product 1 is taken out. FIG. 25 to FIG. 27 As shown in

[0125] , the molded product 1 molded using the antenna 41 provided on the first mold 101 and the second mold 102 is shown in FIG. 28 (a) of FIG. 11, FIG. 29 (b) of FIG. 12, FIG. 29 (c) of FIG. 13, and FIG. 29 . In (a) of FIG. 11, the cross-sectional shape of the molded product 1 cut along the XVII-XVII line of FIG. 10 is shown in enlargement. In (b) of FIG. 12 and (c) of FIG. 13, the cross-sectional shape of the molded product 1 cut along the XVIII-XVIII line of FIG. 10 is shown in enlargement. In addition, in FIG. 14, the cross-sectional shape of the molded product 1 cut along the XIX-XIX line of FIG. 10 is shown in enlargement. FIG. 30 FIG. 29 On the second portion Pa2 of the first mold 101, neither the first protruding portion 121 nor the second protruding portion 122 is provided along the terrace portion 110. Further, in the second portion Pa2, the terrace portion 110 is not provided either. Therefore, in the second portion Pa2 in which neither the terrace portion 110, the first protruding portion 121, nor the second protruding portion 122 is provided, the resin 10a of the molded body 10 and the support resin portion 10b are arranged in a manner of winding the first main surface 21 and the second main surface 22 of the circuit sheet 20 as shown in (b) of FIG. 15 or (c) of FIG. 16. In (b) of FIG. 15 and (c) of FIG. 16, the cross-sectional shape of the molded product 1 cut along the XVII-XVII line of FIG. 10 is shown in enlargement. FIG. 28 FIG. 29 FIG. 29 FIG. 28 FIG. 30 FIG. 28 FIG. 29

[0126] FIG. 29 FIG. 29 FIG. 29 FIG. 29 ​​​​​​​​​​​​In (c), the shape of the supporting resin portion 10b in contact with the second main surface 22 of the circuit chip 20 is different. Such a difference in the state of the supporting resin portion 10b is caused, for example, by the difference in the timing and flow rate of the molten resin of the injection molding entering from both sides of the second area AR2. If the molten resin flowing from one side of the circuit chip 20 is combined with the molten resin flowing from the other side, a supporting resin portion 10b connected from one side of the circuit chip 20 to the other side on the second main surface 22 side is formed (see FIG. 29 (b)). In addition, in the case where the injection is completed before the molten resin flowing from both sides of the circuit sheet 20 is combined, as shown in FIG. FIG. 29 As shown in (c), no resin is filled near the center. The circuit chip 20 is sandwiched between the supporting resin portion 10b in contact with the second area AR2 of the second main surface 22 and the resin 10a in contact with the first main surface 21 opposite to the second area AR2. Thus, the circuit chip 20 is sandwiched between the resin 10a on the first main surface 21 side and the supporting resin portion 10b on the second main surface 22 side, thereby firmly fixing the circuit chip 20.

[0127] FIG. 26 The recesses 15a and 15b of (a) are formed by FIG. 26 The depression is caused by the separation of the first protrusion 121 and the second protrusion 122 shown in (a). FIG. 30 As shown in (a), a gap In1 is provided between the circuit sheet 20 and the first protrusion 121. Similarly, a gap In2 is provided between the circuit sheet 20 and the second protrusion 122. Molten resin enters these gaps In1 and In2, and resin side walls 10c and 10d are also provided on the outside of the first end 20m and the second end 20n of the circuit sheet 20. By providing these side walls 10c and 10d on both sides of the circuit sheet 20, the fixation of the circuit sheet 20 can be strengthened. FIG. 18 As shown, the resin does not adhere to the connection portion 20c of the circuit sheet 20. FIG. 18 (a) and FIG. 18 The parts denoted by the same reference numerals as those shown in (b) are the same as those in FIG. 18 (a) and FIG. 13 The parts with the same reference numerals in (b) have the same structure, so their description is omitted here. After the molded product 1 is formed, the connecting portion 20c made of the metal sheet can also be deformed into a shape suitable for electrical connection by stamping or the like.

[0128] (4-2) Modification B

[0129] In the above-mentioned embodiment FIG. 16 And the modification A FIG. 31In the first portion Pa1 of the first mold 101 shown, the first protrusion 121 and the second protrusion 122 are provided along the terrace portion 110. However, the first mold 101 can be configured such that the first protrusion 121 or the second protrusion 122 is provided on one side of the terrace portion 110 in the first portion Pa1. The first protrusion 121 or the second protrusion 122 can be provided at any position, and the first protrusion 121 and the second protrusion 122 can not be regularly arranged.

[0130] In FIG. 32 , FIG. 32 (a) of FIG. 33 (b) of FIG. 34 , FIG. 34 (a) of FIG. 31 to FIG. 32 (b) of FIG. 31 The molded product 1 molded by the first mold 101 and the second mold 102 shown in (b) of

[0131] In FIG. 32 , the core face CF of the first mold 101 and the circuit sheet 20 constituting the antenna 41 provided on the core face CF are enlarged. In FIG. 31 (a), the cross-sectional shape of the first mold 101, the second mold 102, and the circuit sheet 20 in the mold clamped state is shown by cutting along the XX-XX line of FIG. 32 In FIG. 31 (b), the cross-sectional shape of the first mold 101, the second mold 102, and the circuit sheet 20 in the mold clamped state is shown by cutting along the XXI-XXI line of FIG. 31 to FIG. 32 As for the structure shown in (b) of

[0132] (b) of FIG. 13 to FIG. 15 , the same reference numerals are attached to the same structures as those shown in (b) of FIG. 31 (b) and the description is omitted. As shown in FIG. 32 , the first protrusion 121 and the second protrusion 122 are alternately arranged in a non-opposing manner. Comparing FIG. 14 (a) and FIG. 32 (a) shows that in the first portion Pa1, the first protrusion 121 is arranged on one side of the terrace portion 110 of the deformation example B, and the second protrusion 122 is not arranged on the opposite side. In the second portion Pa2, FIG. 14 (b) has the same structure as that of FIG. 33 (b).

[0133] In FIG. 34 , FIG. 34 (a) of FIG. 31 to FIG. 32(b) shown in FIG. 1. In FIG. 34 FIG. 1 shows a molded product 1 molded using the antenna 41 provided on the first mold 101 and the second mold 102 shown in FIG. 33 (b) of FIG. 1. In FIG. 33 to FIG. 34 (b) of FIG. 1 shows a cross-sectional shape of the molded product 1 cut along the line XXII-XXII of FIG. 16 to FIG. 18 (b) of FIG. 1 shows a cross-sectional shape of the molded product 1 cut along the line XXIII-XXIII of FIG. 33 (b) of FIG. 1.

[0134] As for the structure shown in FIG. 34 (b) of FIG. 1, the same reference numerals are assigned to the same structures as those shown in FIG. 14 (b) of FIG. 1 and the explanation is omitted. As shown in FIG. 34 (b) of FIG. 1, the recess 15a and the recess 15b are alternately arranged in a non-opposite manner. Also, in the modified example B, the rib 16a and the rib 16b are alternately arranged in a non-opposite manner. Comparing FIG. 14 (a) of FIG. 1 and FIG. 35 (a) of FIG. 1, in the first portion Pa1, the rib 16a is arranged on one side of the circuit sheet 20 of the modified example B, and the rib 16b is not arranged in a portion corresponding to the rib 16a on the opposite side of the circuit sheet 20. In the second portion Pa2, FIG. 35 (b) of FIG. 1 is the same as that of FIG. 35 (b) of FIG. 1.

[0135] Note that, in the modified example B, the case where the groove portions 131 and 132 are provided is explained. However, in the first mold 101 of the modified example B, the first mold 101 can be configured in a manner that the groove portions 131 and 132 are not formed.

[0136] (4-3) Modified Example C

[0137] In the above-described embodiment, the modified example A, and the modified example B, the case where the lead portion 20b of the circuit sheet 20 is bent toward the inner surface 12 side of the molded body 10 and the connecting portion 20c is drawn out to the outside of the molded body 10 is explained. However, the connecting portion 20c of the circuit sheet 20 can be arranged in the molded body 10. In FIG. 8 (a) of FIG. 1 shows cross sections of the first mold 101 and the second mold 102 in the case where the connecting portion 20c is arranged in the molded body 10. In the modified example C, the connecting portion 20c is arranged in contact with the terrace-shaped portion 110. By injecting a molten resin into the mold cavity Cv of the first mold 101 and the second mold 102 like that of FIG. 36 (a) of FIG. 1, a molded product 1 shown in FIG. 36As shown in (b), the inner surface exposure portion 24 can be formed at any position of the connecting portion 20c arranged on the inner surface 12 side of the molded body 10. In order to perform electrical connection with the circuit sheet 20 having such an inner surface exposure portion 24, for example, electrical connection can be performed by bringing a spring needle or a leaf spring-shaped terminal provided on the counterpart substrate into contact with the inner surface exposure portion 24, and in addition, a flexible terminal member can be connected with a conductive adhesive or solder as needed.

[0138] (4-4) Modification D

[0139] In the above-described embodiment and Modifications A to C, no movable portion is provided on either the first mold 101 or the second mold 102, but a movable portion can be provided on at least one of the first mold 101 and the second mold 102. For example, a slide block that is linked to a hydraulic or pneumatic cylinder and can be driven at any timing during clamping can be provided at a position where the high-function electronic component 53 is arranged. ​

[0140] In the above-described embodiment and Modifications A to C, no movable portion is provided on either the first mold 101 or the second mold 102, but a movable portion can be provided on at least one of the first mold 101 and the second mold 102. For example, a slide block that is linked to a hydraulic or pneumatic cylinder and can be driven at any timing during clamping can be provided at a position where the high-function electronic component 53 is arranged. ​ ​ In (a) of FIG. 17 and (b) of FIG. 18, the cross-sectional shape taken along the line XXIV-XXIV of FIG. 16 is enlarged and shown for the first mold 101, the second mold 102, and the circuit sheet 20 in the clamped state. In (a) of FIG. 17, the state in which the slide block 150 is pressed against the second mold 102 is shown. In (b) of FIG. 18, the state in which the slide block 150 is separated from the second mold 102 is shown. In (c) of FIG. 19, the cross-sectional shape of the molded product 1 taken along the line XXIV-XXIV of FIG. 16 is enlarged and shown. Figure 8 Figure 36 Figure 36 Figure 36 Figure 8

[0141] As shown in (a) of FIG. 17 and (b) of FIG. 18, the first protruding portion 121 and the second protruding portion 122 of the first mold 101 and the terrace-shaped portion 110 are formed on the slide block 150. In step S3 (third step) of FIG. 20 after clamping, as shown in (a) of FIG. 17, the molten resin MR is injected before the slide block 150 is retracted. At this time, the second main surface 22 of the circuit sheet 20 is in contact with the terrace-shaped portion 110 of the first mold 101. In the first portion Pa1 of the first mold 101, the circuit sheet 20 is positioned between the first protruding portion 121 and the second protruding portion 122, so it is difficult to be displaced even by the force from the molten resin MR at the time of injection in (a) of FIG. 17. Figure 36 Figure 36 Figure 11 Figure 36 Figure 36

[0142] Figure 36 ​​​​​​​​​​​​​When the injected molten resin MR becomes solidified in the state shown in (a), the slide block 150 moves. Figure 36 At the position shown in (b), before the sliding block 150 moves, a cavity Cv is formed at the location where the first protrusion 121, the second protrusion 122, and the terrace 110 are located. Figure 36 (b) shows a state where molten resin is injected into the cavity Cv formed by the movement of the slide block 150 .

[0143] Before the sliding block 150 slides, the first protrusions 121, second protrusions 122, and terrace 110 suppress the circuit chip 20 from shifting during injection molding. Furthermore, after the sliding block 150 slides, but before it slides, the molten resin enters the areas where the first protrusions 121, second protrusions 122, and terrace 110 are located. As a result, the high-function electronic component 53 is encapsulated and embedded in the molded article 10.

[0144] It should be noted that in Figure 36 (a) and Figure 36 (b) shows only one set of the first protrusion 121 and the second protrusion 122, but the sliding block 150 may also include multiple first protrusions 121 and multiple second protrusions 122. In addition, the terrace 110 formed on the sliding block 150 is not limited to the terrace 110 between the first protrusion 121 and the second protrusion 122. For example, the sliding block 150 may include multiple sets of terraces 110 between the first protrusion 121 and the second protrusion 122. In addition, the terrace 110 of the second portion Pa2 of the first mold 101 may also be formed on the sliding block 150.

[0145] (4-5) Modification E

[0146] like Figure 37 (a) and Figure 37 As shown in (b), the circuit sheet 20 may be embedded in a position lower than the core surface CF. Figure 38 (a) and Figure 38 (b) shows a molded article 1 in which a circuit sheet 20 is embedded at a position lower than the core surface CF. Components of Modification E corresponding to those of the above embodiment are denoted by the same reference numerals and their descriptions are omitted. Figure 37 (a) and Figure 37 The height of the first protrusion 121 and the second protrusion 122 shown in (b) is the same as the height of the core surface CF. Figure 38 As shown in FIG. 2( b ), the circuit sheet 20 is mainly supported by the ribs 16 a and 16 b (supporting the resin portion 10 b ).

[0147] (4-6) Modification F

[0148] In the above embodiment, the decorative layer 19 is provided by transfer, but the decorative layer may be provided by insert molding of a decorative film.

[0149] (5) Characteristics

[0150] (5-1)

[0151] In the method for manufacturing the molded article 1 according to the above-mentioned embodiment and the modified example, Figure 11 In step S1 (first step) shown in FIG. Figure 14 As shown in (a), the first fixed portion of the circuit sheet 20 is arranged on the first portion Pa1 of the first mold 101. Figure 11 In step S1, for example, Figure 14 As shown in (b), the second fixed portion of the circuit sheet 20 including the second area AR2 of the circuit sheet 20 is arranged in the second portion Pa2 of the first mold 101. The first fixed portion of the circuit sheet 20 is mainly the portion where the first main surface 21 is fixed, for example Figure 17 As shown in (a), it is a portion along at least one of the recesses 15a and 15b. In contrast, the second fixed portion of the circuit sheet 20 is a portion where the first main surface 21 and the second main surface 22 are fixed by being clamped by the resin, for example, Figure 17 (b) is a portion that is not along the concave portions 15a and 15b. Figure 21 (a) Figure 26 (a) or Figure 32 As shown in (a), the second fixed portion of the circuit sheet 20 is Figure 21 (b) Figure 26 (b) or Figure 32 At least a portion of the first fixed portion of the circuit sheet 20 is arranged so as to be in contact with the terrace portion 110 .

[0152] In this manner, by injecting molten resin from the moment the first mold 101 and the second mold 102 are closed until the mold is opened, a molded article 1 having a circuit chip 20 embedded in the resin can be manufactured. A molded article 1 having a circuit chip 20 can be manufactured using a single set of first molds 101 and second molds 102, eliminating the need for multiple sets of molds as previously required, thereby reducing mold costs. Furthermore, since there is no need to replace molds and inject molten resin multiple times as previously required, the time required to manufacture each molded article 1 can be shortened, thereby reducing manufacturing costs.

[0153] In other words, instead of two-color molding, the molded product 1 in which the circuit sheet 20 is fixed inside the molded body 10 can be manufactured by one-time molding, and cost advantage is large. In addition, even in the case where the molded body 10 has a curved surface shape, the circuit sheet 20 can be fixed inside the molded body 10 by one-time molding.

[0154] Note that even if the adhesive layer having the adhesion to the molding resin is not provided on the circuit sheet 20, the circuit sheet 20 can be fixed in the molded body 10 by partially sandwiching the first main surface 21 and the second main surface 22 of the circuit sheet 20 between the molding resin. Therefore, a material having extremely poor adhesion can be used as the base material 28 of the circuit sheet 20 or the molding resin.

[0155] In the case where the injection-molded resin shrinks in volume during the cooling process and the circuit sheet 20 hardly changes, if the adhesion is firmly adhered using an adhesive, the molded body 10 can be deformed such as warping, twisting, and the like. At this time, since internal stress against the shrinkage of the molding resin is generated on the circuit sheet 20, peeling can occur due to environmental changes such as temperature and humidity or impacts from the outside, but in the case where the adhesive is not used, such a disadvantage can be suppressed.

[0156] In addition, the first protrusion 121, the second protrusion 122, and the third protrusion 123 that coincide with the planar shape of the circuit sheet 20 are provided on the first mold 101 so that the circuit sheet 20 can be disposed at a prescribed position. Therefore, the circuit sheet 20 can be embedded and fixed at a prescribed position of the molded body 10 with high precision. Further, in the case where the air suction hole is provided, the circuit sheet 20 can be fixed at a prescribed position of the molded body 10 after molding with higher precision by the effect of air suction. Note that, here, the case where the circuit sheet 20 is a planar shape is described, but the circuit sheet 20 can also be a three-dimensional shape other than a planar shape. For example, the circuit sheet 20 can also be curved. In this case, in order to be able to dispose the circuit sheet 20 at a prescribed position, the first protrusion 121, the second protrusion 122, and the third protrusion 123 can be provided on the first mold 101 so as to coincide with the surface shape of the circuit sheet 20.

[0157] For example, as shown in (a) of FIG. 10 and (a) of FIG. 11, Figure 16 , Figure 17 Figure 17 ​As shown in (b), the molded article 1 has a plurality of support resin portions 10b extending from the side of the periphery of the circuit sheet 20 in contact with the second main surface 22 to the side of the periphery of the circuit sheet 20 in the entire periphery of the circuit sheet 20. In addition, the molded article 1 has a plurality of recesses 15a, 15b, 15c arranged in the periphery of the circuit sheet 20 in the entire periphery of the circuit sheet 20. The plurality of support resin portions 10b and the plurality of recesses 15a, 15b, 15c are arranged in a manner that the support resin portions and the recesses are alternately arranged along the periphery of the circuit sheet 20. In such a molded article 1, at the time of production, the first, second, and third protrusions 121, 122, 123 formed on the first mold 101 in order to form the recesses 15a, 15b, 15c become breakwaters that prevent the molten resin from directly contacting the end surface of the circuit sheet 20, and the molten resin flows into the groove portions 131, 132 in a state in which the pressure is dispersed / relaxed to form the support resin portions 10b, so the displacement of the circuit sheet 20 in the molded article 10 is reduced, and a molded article in which the arrangement position of the circuit sheet 20 is highly accurate can be provided.

[0158] (5-2)

[0159] For example, the first mold 101 is used Figure 12 and Figure 13 The second portion Pa2 of the first mold 101 described in (b) is a portion in which the width of the terrace portion 110 is narrower than the width of the circuit sheet 20. As can be seen from Figure 12 , the structure of the terrace portion 110 in this case is such that the central portion of the terrace portion 110 is not divided, and thus there is no portion that is deformed toward the second main surface 22 side due to the pressure of the molten resin applied to the first main surface 21 of the circuit sheet 20. Therefore, the structure of the molded article 1 also becomes simple using the production method using such a first mold 101, and the molded article 1 is easily produced.

[0160] (5-3)

[0161] For example, the first mold 101 is used Figure 26 The second portion Pa2 of the first mold 101 described in (b) is a portion in which the terrace portion 110 is divided. In addition, in step S1 of Figure 11 , the circuit sheet 20 is placed on the divided portions of the terrace portions 110 that do not contact the first mold 101 in the second portion Pa2. In other words, the circuit sheet 20 is in a state of being suspended in the second portion Pa2. Therefore, in the second portion Pa2 of the first mold 101, the molten resin enters between the first mold 101 and the circuit sheet 20. As a result, as shown in (a) of Figure 29 or (b) of Figure 29 , the support resin portion 10b is enlarged, and the circuit sheet 20 is firmly fixed in the molded article 1 by the larger support resin portion 10b.

[0162] (5-4)

[0163] For example, when using Figure 14 In the first part Pa1 of the first mold 101 described in (a), grooves 131 and 132 are formed between the first protrusion 121 and the second protrusion 122 and the terrace 110. The molten resin enters the grooves 131 and 132 of the first mold 101. Figure 17 As described in (a), the formation of ribs 16a and 16b can increase the thickness of the supporting resin portion 10b that contacts the second region AR2 of the circuit sheet 20 on both sides of the terrace 110. The increased thickness of the resin (e.g., ribs 16a and 16b) can enhance the strength of the resin securing the circuit sheet 20.

[0164] (5-5)

[0165] For example, use Figure 14 The first mold 101 described in (a) creates gaps In1 and In2 between the first protrusion 121 and the first end 20m of the circuit chip 20, and between the second protrusion 122 and the second end 20n of the circuit chip 20. Therefore, molten resin may enter the gaps In1 and In2. In this case, the end of the circuit chip 20 can be used to strengthen the support of the resin.

[0166] (5-6)

[0167] For example, when using Figure 15 (a) and Figure 15 The first mold 101 described in (b) is formed with a receiving portion 140 for inserting the lead portion 20b of the circuit chip 20. Figure 11 In step S1 (first step), the lead portion 20b of the circuit chip 20 is received in the receiving portion 140 of the first mold 101. In the molded article 1 manufactured in this way, Figure 18 As shown in (b), the lead portion 20b of the circuit chip 20 is led out to the inner surface 12 side of the molded article 1. As a result, a molded article 1 can be obtained in which the circuit chip 20 is embedded in the molded article 10 and the electrical connection between the circuit chip 20 and the device located outside the molded article 10 is easy.

[0168] (5-7)

[0169] For example, in Figure 13 The first mold 101 shown is provided with a plurality of groups of first protrusions 121 and second protrusions 122. Figure 11In step S1 (the first step), the circuit chips 20 are all arranged between the multiple sets of first protrusions 121 and second protrusions 122. These multiple sets of first protrusions 121 and second protrusions 122 make it difficult for the circuit chips 20 to shift relative to the first mold 101 during injection of the molten resin. By providing multiple sets of first protrusions 121 and second protrusions 122 in this manner, it is possible to prevent the circuit chips 20 from shifting significantly relative to the first mold 101, which could result in the molded article 1 becoming defective.

[0170] Especially when being held by suction, the embedded circuit chip 20 can be reliably prevented from peeling off from the first mold 101, thereby reducing the offset of the sheet of circuit chip 20 and fixing the circuit chip 20 at a specified position of the molded body 10 with high precision.

[0171] Furthermore, when the volume of the injection-molded resin shrinks during cooling and the circuit sheet 20 remains substantially unchanged, deflection corresponding to the amount of resin shrinkage occurs in the circuit sheet 20. In the above-described method for manufacturing the molded article 1, the fixing portion of the circuit sheet 20 is divided into multiple locations, each of which is minimized in area, thereby evenly distributing the deformation of the circuit sheet 20 caused by this deflection.

[0172] (5-8)

[0173] In use Figure 36 (a) and Figure 36 In the first mold 101 described in (b), the first protrusion 121, the second protrusion 122, and the terrace 110 are formed on the sliding block 150. By using the first mold 101 constructed in this way, the first protrusion 121, the second protrusion 122, and the terrace 110 can suppress the deviation of the circuit chip 20 during injection molding before the sliding block 150 slides. In addition, after the sliding block 150 slides, before sliding, the mold cavity Cv expands at the location where the first protrusion 121, the second protrusion 122, and the terrace 110 are located, and the molten resin enters. For example, as Figure 36 As shown in (c), the resin that has entered the first protrusion 121, the second protrusion 122, and the terrace 110 can strengthen the fixation of the circuit chip 20 in the molded article 1.

[0174] (5-9)

[0175] For example, using Figure 17The second part Pa2 of the first mold 101 described in (b) is a structure in which neither the first protruding part 121 nor the second protruding part 122 is provided along the terrace part 110. If manufacturing is performed using the first mold 101 in which neither the first protruding part 121 nor the second protruding part 122 is provided along the terrace part 110, in the second part Pa2, a recess originating from the first protruding part 121 and the second protruding part 122 is not formed outside the second region AR2 of the circuit sheet 20. Therefore, the strength of the portion of the circuit sheet 20 sandwiched by the support resin part 10b in contact with the second region AR2 and the resin 10a in contact with the first main face 21, which opposes the second region AR2, is higher than that of the portion in which the recess is formed. As a result, the circuit sheet 20 is firmly fixed by the resin 10a on the first main face 21 side and the support resin part 10b on the second main face 22 side, which sandwich the circuit sheet 20.

[0176] The above describes embodiments of the present application, but the present application is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the application. In particular, the plurality of embodiments and modified examples described in the present specification can be arbitrarily combined as needed.

[0177] Explanation of Reference Numerals

[0178] 1: molded product; 10: molded body; 20: circuit sheet; 21: first main face; 22: second main face; 101: first mold; 102: second mold; 110: terrace part; 121: first protruding part; 122: second protruding part; 131, 132: groove part; 140: receiving part; 150: sliding block; AR1: first region; AR2: second region; Cv: mold cavity; In1, In2: gap; MR: molten resin; Pa1: first part; Pa2: second part.

Claims

1. A method for manufacturing a molded article, comprising: In a first step, a circuit sheet having a first main surface, a second main surface opposite to the first main surface, and a conductive pattern is placed in the first mold in such a manner that a first region of the second main surface contacts the terrace portion of the first mold and a second region of the second main surface does not contact the first mold; The second step is to close the second mold on the first mold in a manner that the circuit chip is not in contact with the second mold, thereby forming a mold cavity in which the first main surface and the second area of ​​the second main surface of the circuit chip are exposed; The third step is to introduce molten material into the mold cavity so that the molten material contacts the first main surface of the circuit sheet and the second area of ​​the second main surface; A fourth step is to cool the molten material and solidify it to form a resin molded body having an outer surface facing the first main surface of the circuit sheet and an inner surface facing the second region of the second main surface; as well as The fifth step is to open the first mold and the second mold and take out the molded product. In the first step, a first fixed portion of the circuit sheet is arranged in a first portion of the first mold, and a second fixed portion of the circuit sheet including the second region is arranged in a second portion of the first mold. The first portion is a portion higher than the terrace portion and at least one of the first protrusion and the second protrusion provided along the terrace portion of the first mold, and the second portion is a portion along the terrace portion where the first protrusion and the second protrusion are not provided.

2. The method for producing a molded article according to claim 1, wherein The second portion of the first mold is a portion where the width of the terrace portion is narrower than the width of the circuit sheet.

3. The method for producing a molded article according to claim 1, wherein The second portion of the first mold is a portion that divides the terrace portion. In the first step, in the second portion, the circuit sheet is mounted on two divided portions of the divided terrace-shaped portion.

4. The method for producing a molded article according to any one of claims 1 to 3, wherein In the first portion of the first mold, a groove is formed between the first protrusion and the second protrusion and the terrace portion.

5. The method for producing a molded article according to any one of claims 1 to 4, wherein The first mold is configured to generate a gap between at least one of the first protrusion and the first end side of the circuit sheet and the second protrusion and the second end side of the circuit sheet.

6. The method for producing a molded article according to any one of claims 1 to 3, wherein: In the first step, the connection portion of the circuit sheet is inserted into the slit of the first mold.

7. The method for producing a molded article according to any one of claims 1 to 4, wherein: The first mold is provided with a plurality of groups of the first protrusions and the second protrusions. In the first step, the second region of the second main surface of the circuit sheet is entirely arranged between the plurality of sets of the first protrusions and the second protrusions.

8. The method for producing a molded article according to any one of claims 1 to 7, wherein The first protrusion, the second protrusion, and the terrace portion of the first mold are formed on a sliding block. In the third step, the sliding block moves. Before the sliding block moves, a cavity is formed at the location where the first protrusion, the second protrusion, and the terrace are located, and the molten material is introduced.

9. A molded article, characterized in that The molded product has: a circuit sheet having a first main surface, a second main surface opposite to the first main surface, and a conductive pattern; and a molded body covering the entire first main surface of the circuit sheet, The molded body has a plurality of supporting resin portions extending from the periphery of the circuit sheet while in contact with the second main surface, and has a plurality of recessed portions arranged around the periphery of the circuit sheet. The plurality of supporting resin portions and the plurality of recessed portions are arranged so as to be alternately arranged along the periphery.

Images