Processing device, display panel and manufacturing method of display panel

Abstract

A processing device, a display panel and a manufacturing method of the display panel are provided. The processing device comprises a moving member, a platform and a buffer pad. The moving member is configured to move a first substrate. The platform is configured to fix a second substrate. The buffer pad is arranged on the moving member or the platform. An elastic modulus of the buffer pad is less than 8.54 MPa. When the moving member moves the first substrate, the buffer pad is arranged between the moving member and the first substrate. When the platform fixes the second substrate, the buffer pad is arranged between the platform and the second substrate.

Description

Technical Field

[0001] This invention relates to a processing apparatus, a display panel, and a method for manufacturing the display panel. Background Technology

[0002] Micro LED displays (LED displays) represent a next-generation display technology. A key technology lies in bonding a large number of micro LEDs onto a pixel array substrate. In many LED displays, the micro LEDs are bonded to the pixel array substrate using a soldering method. Specifically, multiple micro LEDs are formed on a growth substrate, then mass-transferred onto the pixel array substrate, and finally, the electrodes of the micro LEDs are soldered to the pixel array substrate by heating. However, during the soldering process, if the surface of the equipment or the pixel array substrate is uneven, some micro LEDs may not make contact with the pixel array substrate, leading to soldering failure. Summary of the Invention

[0003] The present invention provides a processing apparatus that can improve the problem of insufficient component bonding yield caused by surface unevenness of the first substrate and / or the second substrate.

[0004] The present invention provides a display panel and a method for manufacturing the same, which can improve the problem of insufficient light-emitting diode bonding yield caused by uneven surfaces of the first substrate and / or the second substrate.

[0005] At least one embodiment of the present invention provides a processing apparatus. The processing apparatus includes a moving member, a platform, and a buffer pad. The moving member is used to move a first substrate. The platform is used to fix a second substrate. The buffer pad is disposed on the moving member or the platform. The elastic modulus of the buffer pad is less than 8.54 MPa. When the moving member moves the first substrate, the buffer pad is disposed between the moving member and the first substrate; or when the platform fixes the second substrate, the buffer pad is disposed between the platform and the second substrate.

[0006] At least one embodiment of the present invention provides a method for manufacturing a display panel, comprising the following steps: providing a plurality of light-emitting diodes (LEDs) on a first substrate; pressing the LEDs on the first substrate onto a second substrate, wherein a buffer pad is disposed on the outer side of the first substrate or the second substrate, and the elastic modulus of the buffer pad is less than 8.54 MPa; and transferring at least a portion of the LEDs on the first substrate to the second substrate.

[0007] At least one embodiment of the present invention provides a display panel. The display panel includes a substrate, a plurality of light-emitting diodes (LEDs), and a buffer pad. The substrate has a first surface and a second surface opposite to the first surface. The LEDs are disposed on the first surface of the substrate. The buffer pad is disposed on the second surface of the substrate. The elastic modulus of the buffer pad is less than 8.54 MPa. Attached Figure Description

[0008] Figures 1A to 1F This is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention.

[0009] Figures 2A to 2E This is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention.

[0010] Figures 3A to 3D This is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention.

[0011] Figures 4A to 4D This is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention.

[0012] Explanation of reference numerals in the attached figures:

[0013] 10, 20, 30, 40: Display panel

[0014] 100: First substrate

[0015] 102,310: Adhesive layer

[0016] 110: Light Emitting Diode

[0017] 112: Electrode

[0018] 114: Semiconductor stacked layer

[0019] 200: Second substrate

[0020] 200a: First page

[0021] 200b: Second page

[0022] 210: Carrier board

[0023] 220: Circuit Structure

[0024] 230: Connecting pad

[0025] 240: Anisotropic conductive adhesive

[0026] 300: Cushioning Pad

[0027] 302: First Hole

[0028] 410: Moving Components

[0029] 410b: Lower surface

[0030] 412, 422: Holes

[0031] 412a, 412b, 422a, 422b: Second hole

[0032] 414, 424: Connection Channels

[0033] 420: Platform

[0034] 420t: Upper surface

[0035] LS: Laser

[0036] X1, X2: Distance Detailed Implementation

[0037] Figures 1A to 1F This is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention. Please refer to... Figure 1A The cushioning pad 300 is placed on the platform 420. In this embodiment, the cushioning pad 300 includes a plurality of first holes 302, and the platform 420 includes a plurality of second holes 422a, 422b. The second holes 422a overlap and connect to the first holes 302, and the second holes 422b do not overlap with the first holes 302. In this embodiment, the second holes 422b are located below the bottom surface of the cushioning pad 300, and the platform 420 adsorbs the cushioning pad 300 onto the platform 420 by vacuum adsorption through the second holes 422b.

[0038] In this embodiment, the platform 420 further includes a connection channel 424. The connection channel 424 connects to a plurality of second holes 422a, 422b.

[0039] The cushioning pad 300 comprises an elastic material with an elastic modulus greater than 0.5 MPa and less than 8.54 MPa. In some embodiments, the material of the cushioning pad 300 includes elastomeric polymers such as silicone, rubber, Teflon, and polyethylene. In some embodiments, other materials may also be incorporated into the cushioning pad 300.

[0040] After prolonged use, the cushioning pad 300 may wear out. To avoid the wear and tear of the cushioning pad 300 affecting subsequent processes, the worn-out cushioning pad 300 can be removed and replaced with a new cushioning pad 300.

[0041] Please refer to Figure 1BA plurality of light-emitting diodes 110 are provided on a first substrate 100. The light-emitting diodes 110 are attached to the first substrate 100 by an adhesive layer 102. For example, a plurality of light-emitting diodes 110 are first formed on a growth substrate (not shown), and then the light-emitting diodes 110 are attached to the first substrate 100 by one or more transfer processes.

[0042] The first substrate 100 is, for example, a rigid substrate, and its material may be glass, quartz, organic polymer, or other suitable materials. However, the invention is not limited thereto, and in other embodiments, the first substrate 100 may also be a flexible substrate. For example, the materials of the flexible substrate include polyimide (PI), polydimethylsiloxane (PDMS), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyester (PES), polymethylmethacrylate (PMMA), polycarbonate (PC), polyurethane (PU), or other suitable materials.

[0043] The light-emitting diode 110 is, for example, a miniature light-emitting diode, a micro light-emitting diode, or other types of light-emitting diode. In this embodiment, each light-emitting diode 110 includes a semiconductor stack layer 114 and an electrode 112. The semiconductor stack layer 114 includes, for example, a stack of N-type semiconductors and P-type semiconductors. In some embodiments, a light-emitting layer is also provided between the N-type semiconductors and the P-type semiconductors. Two electrodes 112 are formed on the aforementioned N-type semiconductors and the aforementioned P-type semiconductors, respectively. In this embodiment, the two electrodes 112 are located on the same side of the semiconductor stack layer 114, and the light-emitting diode 110 is a horizontal light-emitting diode, but the present invention is not limited thereto. In other embodiments, the two electrodes 112 are located on opposite sides of the semiconductor stack layer 114, and the light-emitting diode 110 is a vertical light-emitting diode.

[0044] In this embodiment, electrode 112 is located on the side of light-emitting diode 110 facing away from the first substrate 100, but the present invention is not limited thereto. In other embodiments, electrode 112 is located on the side of light-emitting diode 110 facing the first substrate 100.

[0045] In this embodiment, the movable member 410 is used to move the first substrate 100 and the light-emitting diode 110 located thereon. In this embodiment, the movable member 410 includes a plurality of holes 412, and the first substrate 100 is adsorbed onto the movable member 410 by vacuum adsorption through the holes 412, but the present invention is not limited thereto. In other embodiments, the first substrate 100 is fixed onto the movable member 410 by clamping or other means.

[0046] In this embodiment, the movable component 410 further includes a connecting channel 414. The connecting channel 414 connects to a plurality of holes 412.

[0047] exist Figure 1B In this embodiment, the lower surface 410b of the movable member 410 faces the first substrate 100, and the lower surface 410b is flat except for the area where the hole 412 is provided. In other embodiments, the lower surface 410b of the movable member 410 may become uneven due to poor grinding or wear and tear from long-term use.

[0048] In some embodiments, poor grinding of the first substrate 100 itself, uneven surface of the moving member 410, or uneven distribution of the holes 412 of the moving member 410 may cause an uneven surface of the first substrate 100, thereby preventing the light-emitting diodes 110 from being fully aligned on the same horizontal plane.

[0049] The second substrate 200 is disposed on the buffer pad 300. The platform 420 is used to fix the second substrate 200. The platform 420 adsorbs the second substrate 200 onto the buffer pad 300 by vacuum adsorption through the first hole 302 of the buffer pad 300. In this embodiment, when the platform 420 fixes the second substrate 200, the buffer pad 300 is disposed on the outside of the second substrate 200 and between the platform 420 and the second substrate 200.

[0050] The second substrate 200 includes a carrier plate 210 and a circuit structure 220, wherein the circuit structure 220 is located on the carrier plate 210. The carrier plate 210 is, for example, a rigid substrate, and its material can be glass, quartz, organic polymer, metal, wafer, ceramic, or other suitable materials. However, the invention is not limited thereto; in other embodiments, the carrier plate 210 can also be a flexible substrate or a stretchable substrate. For example, the materials of flexible and stretchable substrates include polyimide, polydimethylsiloxane, polyethylene terephthalate, polyethylene glycol dicarboxylate, polyester, polymethyl methacrylate, polycarbonate, polyurethane, or other suitable materials. The circuit structure 220 includes, for example, multiple conductive layers (not shown) and multiple insulating layers (not shown). In some embodiments, the circuit structure 220 also includes multiple active elements (not shown) and / or multiple passive elements (not shown), where the active elements (not shown) can be thin-film transistors. The surface of the circuit structure 220 has multiple pads 230.

[0051] exist Figure 1B In this embodiment, the upper surface 420t of platform 420 faces the buffer pad 300, and the upper surface 420t is flat except for the areas where the second holes 422a and 422b are provided. In other embodiments, the upper surface 420t of platform 420 may become uneven due to poor grinding or wear and tear from prolonged use. The buffer pad 300 can reduce the problem of process deviations caused by the unevenness of the upper surface 420t of platform 420.

[0052] In some embodiments, poor grinding of the carrier plate 220 in the second substrate 200, uneven surface of the platform 420, or uneven distribution of the second holes 422a, 422b of the platform 420 may cause an uneven surface of the second substrate 200.

[0053] In this embodiment, the first substrate 100 is moved above the second substrate 200 by the moving member 410, wherein the distance X1 between at least one of the light-emitting diodes 110 and the second substrate 200 is greater than the distance X2 between at least another of the light-emitting diodes 110 and the second substrate 200. Uneven surfaces of the first substrate 100 and / or the second substrate 200 may cause the distance X1 to be greater than the distance X2. In some embodiments, the difference between distance X1 and distance X2 is between 0 micrometers and 70 micrometers, wherein the difference between distance X1 and distance X2 is 0 only when the light-emitting diode 110 is in contact with the second substrate 200.

[0054] Please refer to Figure 1CThe light-emitting diodes 110 on the first substrate 100 are pressed onto the second substrate 200. The electrodes 112 of the light-emitting diodes 110 contact the pads 230 of the second substrate 200. In this embodiment, when the light-emitting diodes 110 are pressed onto the second substrate 200, the buffer pad 300 undergoes elastic deformation. In some embodiments, at least a portion of the buffer pad 300 has an elastic deformation of less than 100 micrometers and greater than 0 micrometers, or less than 10 micrometers and greater than 0 micrometers. The buffer pad 300 can utilize its elasticity to buffer the discontinuities caused by unevenness of the platform 420, the moving member 410, the first substrate 100, and / or the second substrate 200, ensuring that each light-emitting diode 110 can contact the pads 230 of the second substrate 200, thus avoiding the problem that some light-emitting diodes 110 cannot contact the second substrate 200 due to discontinuities.

[0055] Please refer to Figure 1D At least a portion of the light-emitting diodes 110 on the first substrate 100 are transferred to the second substrate 200. In this embodiment, the light-emitting diodes 110 are welded to the second substrate 200 by laser LS, and the light-emitting diodes 110 are electrically connected to the second substrate 200.

[0056] In this embodiment, the moving member 410 is made of a transparent material, and the laser LS can penetrate the moving member 410. It should be noted that... Figure 1D The laser LS will pass through the position where the moving member 410 is provided with holes 412 or connecting channels 414, but the present invention is not limited thereto. Figure 1D The holes 412 and connecting channels 414 are only for illustration. The holes 412 and connecting channels 414 of the moving component 410 will actually be set in a position where the laser LS will not pass through, thereby reducing the impact of the holes 412 and connecting channels 414 on the laser LS.

[0057] In some embodiments, the cushioning pad 300 includes a material that is permeable to the laser LS, thereby preventing the cushioning pad 300 from absorbing the laser LS and causing damage to the cushioning pad 300.

[0058] Please take the exam. Figure 1E After the light-emitting diode 110 is soldered to the second substrate 200, the first substrate 100 is removed. In this embodiment, since the buffer pad 300 undergoes elastic deformation after being compressed, the buffer pad 300 will spring back to its original size after the first substrate 100 is removed.

[0059] Finally, please refer to... Figure 1F The second substrate 200 and the light-emitting diodes 110 located thereon are removed from the buffer pad 300, thus completing the display panel 10.

[0060] Figures 2A to 2EThis is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention. It must be noted that... Figures 2A to 2E The embodiments follow Figures 1A to 1F The component reference numerals and partial contents of the embodiments are described below, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and will not be repeated here.

[0061] Please refer to Figure 2A A buffer pad 300 is disposed on a movable member 410. The buffer pad 300 includes a plurality of first holes 302. The movable member 410 includes a plurality of second holes 412a, 412b. The second holes 412a overlap and connect to the first holes 302, and the second holes 412b do not overlap with the first holes 302. In this embodiment, the second holes 412b are located above the top surface of the buffer pad 300, and the movable member 410 adsorbs the buffer pad 300 onto the movable member 410 by vacuum adsorption through the second holes 412b. A connecting channel 414 connects the second holes 412a, 412b.

[0062] The moving member 410 adsorbs the first substrate 100 onto the buffer pad 300 via the first hole 302 of the buffer pad 300 using vacuum adsorption. In this embodiment, when the moving member 410 moves the first substrate 100, the buffer pad 300 is disposed on the outside of the first substrate 100 and between the moving member 410 and the first substrate 100.

[0063] exist Figure 2A In this embodiment, the lower surface 410b of the moving member 410 contacts the buffer pad 300, and the lower surface 410b is flat except where the second holes 412a and 412b are provided. In other embodiments, the lower surface 410b of the moving member 410 may become uneven due to poor grinding or wear from prolonged use. The buffer pad 300 can reduce the problem of process deviations caused by unevenness of the lower surface 410b of the moving member 410.

[0064] Platform 420 is used to fix the second substrate 200. The second substrate 200 is adsorbed onto platform 420 by vacuum adsorption through holes 422. Connecting channel 424 connects multiple holes 422.

[0065] In this embodiment, the first substrate 100 is moved above the second substrate 200 by the moving member 410, wherein the distance X1 between at least one of the light-emitting diodes 410 and the second substrate 200 is greater than the distance X2 between at least another of the light-emitting diodes 410 and the second substrate 200. Uneven surfaces of the first substrate 100 and / or the second substrate 200 may cause the distance X1 to be greater than the distance X2.

[0066] Please refer to Figure 2B A light-emitting diode (LED) 110 on the first substrate 100 is pressed onto the second substrate 200. The electrode 112 of the LED 110 contacts the pad 230 of the second substrate 200. In this embodiment, when the LED 110 is pressed onto the second substrate 200, the buffer pad 300 undergoes elastic deformation. In some embodiments, at least a portion of the buffer pad 300 undergoes elastic deformation of less than 100 micrometers. The buffer pad 300 can utilize its elasticity to buffer the discontinuities caused by unevenness in the platform 420, the moving member 410, the first substrate 100, and / or the second substrate 200, ensuring that each LED 110 can contact the pad 230 of the second substrate 200, thus avoiding the problem of some LEDs 110 failing to contact the second substrate 200 due to discontinuities.

[0067] Please refer to Figure 2C At least a portion of the light-emitting diodes 110 on the first substrate 100 are transferred to the second substrate 200. In this embodiment, the light-emitting diodes 110 are welded to the second substrate 200 by laser LS, and the light-emitting diodes 110 are electrically connected to the second substrate 200.

[0068] In this embodiment, platform 420 comprises a transparent material, and the laser LS can penetrate platform 420. It should be noted that... Figure 2C The laser LS will pass through the position provided with the hole 422 or the connecting channel 424, but the present invention is not limited thereto. Figure 2C The holes 422 and connecting channels 424 are only for illustration. The holes 422 and connecting channels 424 of the platform 420 will actually be set in a position where the laser LS will not pass through, thereby reducing the impact of the holes 422 and connecting channels 424 on the laser LS.

[0069] In this embodiment, the buffer pad 300 includes a material that can be penetrated by the laser LS, thereby preventing the buffer pad 300 from absorbing the laser LS and causing damage to the buffer pad 300.

[0070] Please take the exam. Figure 2D After soldering the light-emitting diode 110 to the second substrate 200, the first substrate 100 is removed. In this embodiment, due to the buffer pad 300 ( Figure 2D(Not shown) undergoes elastic deformation after being compressed, therefore the first substrate 100 ( Figure 2D (Not shown) After no further pressure was applied to the second substrate 200, the buffer pad 300 ( Figure 2D (Not shown) will spring back to its original size.

[0071] Finally, please refer to... Figure 2E The second substrate 200 and the light-emitting diodes 110 located thereon are removed from the buffer pad 300, thus completing the display panel 20.

[0072] Figures 3A to 3D This is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention. It must be noted that... Figures 3A to 3D The embodiments follow Figures 1A to 1F The component reference numerals and partial contents of the embodiments are described below, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and will not be repeated here.

[0073] Please refer to Figure 3A In this embodiment, the buffer pad 300 does not have holes for vacuum suction. The buffer pad 300 is adhered to the outside of the second substrate 200 by the adhesive layer 310. Specifically, the buffer pad 300 is first adhered to the outside of the second substrate 200, and then the second substrate 200 and the buffer pad 300 are placed on the platform 200. The platform 420 uses the holes 422 to vacuum suction the buffer pad 300.

[0074] In this embodiment, an adhesive layer 310 is provided between the buffer pad 300 and the second substrate 200, but the invention is not limited thereto. In other embodiments, the buffer pad 300 is adsorbed onto the outside of the second substrate 200 by van der Waals forces, thus the adhesive layer 310 can be omitted. For example, polydimethylsiloxane can be used as the material of the buffer pad 300 to adsorb the second substrate 200 by van der Waals forces.

[0075] In this embodiment, the surface of the second substrate 200 has anisotropic conductive adhesive 240. In this embodiment, multiple anisotropic conductive adhesives 240 are respectively disposed on corresponding pads 230, but the present invention is not limited thereto. In other embodiments, only one anisotropic conductive adhesive 240 is disposed on the surface of the second substrate 200, and the aforementioned one anisotropic conductive adhesive 240 covers each pad 230.

[0076] In this embodiment, the first substrate 100 is moved above the second substrate 200 by the moving member 410, wherein the distance X1 between at least one of the light-emitting diodes 410 and the second substrate 200 is greater than the distance X2 between at least another of the light-emitting diodes 410 and the second substrate 200. Uneven surfaces of the first substrate 100 and / or the second substrate 200 may cause the distance X1 to be greater than the distance X2.

[0077] Please refer to Figure 3B The light-emitting diodes 110 on the first substrate 100 are pressed onto the second substrate 200. The electrodes 112 of the light-emitting diodes 110 contact the anisotropic conductive adhesive 240 of the second substrate 200. In this embodiment, when the light-emitting diodes 110 are pressed onto the second substrate 200, the buffer pad 300 undergoes elastic deformation. The buffer pad 300 can use its elasticity to buffer the gaps caused by unevenness of the platform 420, the moving member 410, the first substrate 100, and / or the second substrate 200, so that each light-emitting diode 110 can contact the anisotropic conductive adhesive 240 of the second substrate 200, avoiding the problem that some light-emitting diodes 110 cannot contact the second substrate 200 due to gaps.

[0078] At least a portion of the light-emitting diodes 110 on the first substrate 100 are transferred to the second substrate 200. In this embodiment, the light-emitting diodes 110 are bonded to the second substrate 200 using anisotropic conductive adhesive 240, and the light-emitting diodes 110 are electrically connected to the second substrate 200.

[0079] In this embodiment, since laser welding of the light-emitting diode 110 is not required, the moving component 410 and the platform 420 can be made of transparent or opaque materials.

[0080] Please take the exam. Figure 3C After the light-emitting diode 110 is bonded to the second substrate 200, the first substrate 100 is removed. In this embodiment, since the buffer pad 300 undergoes elastic deformation after being compressed, the buffer pad 300 will spring back to its original size after the first substrate 100 is removed.

[0081] Finally, please refer to... Figure 3DThe second substrate 200, the light-emitting diodes 110 located on the second substrate 200, and the buffer pad 300 are removed from the platform 420, thus completing the display panel 30. In this embodiment, the display panel 30 includes a second substrate 200, a plurality of light-emitting diodes 110, and a buffer pad 300. The second substrate 200 has a first surface 200a and a second surface 200b opposite to the first surface 200a. The light-emitting diodes are disposed on the first surface 200a of the second substrate 200. The buffer pad 300 is disposed on the second surface 200b of the second substrate 200. The elastic modulus of the buffer pad 300 is less than 8.54 MPa. In some embodiments, the elastic modulus of the buffer pad 300 is greater than 0.5 MPa and less than 8.54 MPa.

[0082] Figures 4A to 4D This is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention. It must be noted that... Figures 4A to 4D The embodiments follow Figures 3A to 3D The component reference numerals and partial contents of the embodiments are described below, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and will not be repeated here.

[0083] Please refer to Figure 4A The buffer pad 300 is attached to the outside of the first substrate 100 by the adhesive layer 310. Specifically, the buffer pad 300 is first attached to the outside of the first substrate 200, and then the moving member 410 adsorbs the buffer pad 300 by vacuum adsorption through the hole 412.

[0084] Please refer to Figure 4B The light-emitting diodes 110 on the first substrate 100 are pressed onto the second substrate 200. The electrodes 112 of the light-emitting diodes 110 contact the anisotropic conductive adhesive 240 of the second substrate 200. In this embodiment, when the light-emitting diodes 110 are pressed onto the second substrate 200, the buffer pad 300 undergoes elastic deformation. The buffer pad 300 can use its elasticity to buffer the gaps caused by unevenness of the platform 420, the moving member 410, the first substrate 100, and / or the second substrate 200, so that each light-emitting diode 110 can contact the anisotropic conductive adhesive 240 of the second substrate 200, avoiding the problem that some light-emitting diodes 110 cannot contact the second substrate 200 due to gaps.

[0085] At least a portion of the light-emitting diodes 110 on the first substrate 100 are transferred to the second substrate 200. In this embodiment, the light-emitting diodes 110 are bonded to the second substrate 200 using anisotropic conductive adhesive 240, and the light-emitting diodes 110 are electrically connected to the second substrate 200.

[0086] Please take the exam. Figure 4C After the light-emitting diode 110 is bonded to the second substrate 200, the first substrate 100 is removed. In this embodiment, due to the buffer pad 300 ( Figure 4C (Not shown) undergoes elastic deformation after being compressed, therefore the first substrate 100 ( Figure 4C (Not shown) After no further pressure was applied to the second substrate 200, the buffer pad 300 ( Figure 4C (Not shown) It will spring back to its original size.

[0087] Finally, please refer to... Figure 4D The second substrate 200 and the light-emitting diodes 110 located thereon are then removed from the platform 420, thus completing the display panel 40.

[0088] In summary, by setting a buffer pad, the bonding yield of the light-emitting diode to the second substrate can be improved.

Claims

1. A processing apparatus, comprising: A movable component for moving a first substrate; A platform for fixing a second substrate, wherein the platform, the moving member, the first substrate and / or the second substrate are uneven, resulting in a gap; as well as A buffer pad is disposed on the moving component or the platform, wherein the elastic modulus of the buffer pad is less than 8.54 MPa, and the elastic deformation of the buffer pad is less than 10 micrometers and greater than 0 micrometers. When the moving member moves the first substrate, the buffer pad is disposed between the moving member and the first substrate; or When the platform is used to fix the second substrate, the buffer pad is disposed between the platform and the second substrate. The cushioning pad includes multiple first holes, and the platform includes multiple second holes, wherein some of the second holes overlap and connect with the first holes, and other portions of the second holes do not overlap with the first holes. The platform also includes a connection channel that connects the plurality of second holes. or, The cushioning pad includes a plurality of first holes, and the moving member includes a plurality of second holes, wherein some of the second holes overlap and connect with the first holes, and other portions of the second holes do not overlap with the first holes. The movable component also includes a connecting channel that connects to the plurality of second holes.

2. A method for manufacturing a display panel, comprising: A plurality of light-emitting diodes are provided on a first substrate; The light-emitting diodes on the first substrate are pressed onto a second substrate, wherein a buffer pad is disposed on the outer side of the first substrate or the second substrate, and the elastic modulus of the buffer pad is less than 8.54 MPa, wherein the elastic deformation of the buffer pad is less than 10 micrometers and greater than 0 micrometers. as well as At least a portion of the light-emitting diodes on the first substrate are transferred to the second substrate. Also includes: The cushioning pad is placed on a platform, wherein the cushioning pad includes a plurality of first holes, and the platform includes a plurality of second holes, wherein some of the second holes overlap and connect with the first holes, and other portions of the second holes do not overlap with the first holes, wherein the cushioning pad is adsorbed onto the platform by vacuum adsorption through the other portions of the second holes; and The second substrate is disposed on the buffer pad, wherein the second substrate is adsorbed onto the buffer pad by vacuum adsorption through the first holes. The platform also includes a connection channel that connects the plurality of second holes. Or may also include: The buffer pad is disposed on a movable member, wherein the buffer pad includes a plurality of first holes, and the movable member includes a plurality of second holes, wherein some of the second holes overlap and connect with the first holes, and other portions of the second holes do not overlap with the first holes, wherein the buffer pad is adsorbed onto the movable member by vacuum adsorption through the other portions of the second holes; and The first substrate is disposed on the buffer pad, wherein the first substrate is adsorbed onto the buffer pad by vacuum adsorption through the first holes. The movable component also includes a connecting channel that connects to the plurality of second holes. The platform, the moving component, the first substrate, and / or the second substrate are uneven, causing a gap.

3. The method of manufacturing a display panel as claimed in claim 2, wherein the method of transferring at least a portion of the light-emitting diodes on the first substrate to the second substrate comprises: The light-emitting diodes are welded to the second substrate by laser or bonded to the second substrate by anisotropic conductive adhesive, and the light-emitting diodes are electrically connected to the second substrate.

4. The method of manufacturing a display panel as claimed in claim 2, wherein when the light-emitting diodes are pressed onto the second substrate, the buffer pad undergoes elastic deformation, wherein at least a portion of the elastic deformation of the buffer pad is less than 100 micrometers.

5. The method for manufacturing a display panel as claimed in claim 2, wherein the method of pressing the light-emitting diodes on the first substrate onto the second substrate comprises: The first substrate is moved above the second substrate by a moving member, wherein the distance between at least one of the light-emitting diodes and the second substrate is greater than the distance between at least another of the light-emitting diodes and the second substrate; and The moving member presses the light-emitting diodes on the first substrate onto the second substrate, wherein at least one of the light-emitting diodes and at least another of the light-emitting diodes are in contact with the second substrate.

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