Electronic device with array of conductive vias substrate

Abstract

An electronic device with a conductive via array substrate includes a substrate, an outer layer, a conductive line layer, and a switchable circuit chip. The substrate has a plurality of first conductive vias. The outer layer is disposed on one side of the substrate and has a plurality of second conductive vias. The first conductive vias have a distribution density or a number greater than that of the second conductive vias, so that some of the first conductive vias are electrically connected to the second conductive vias, and some of the first conductive vias are electrically floating. The conductive line layer is disposed on the outer layer and has a plurality of conductive lines. The conductive lines are electrically connected to the second conductive vias. The switchable circuit chip is electrically connected to the first conductive vias. The conductive lines are electrically connected to the switchable circuit chip. The switchable circuit chip is used to control the electrical connection relationship between the conductive lines and the first conductive vias and the electrical connection relationship between the conductive lines.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device having a conductive via array substrate comprising an array of conductive vias. Background Technology

[0002] Traditionally, external electrical components are typically mounted on conductive via substrates. The external electrical components operate by applying a specified potential to the conductive via substrate. Conductive via substrates have multiple conductive vias. Developers of conductive via substrates typically design the number and location of these conductive vias based on the electrical configuration of the external electrical components to be mounted.

[0003] Therefore, for different external electrical components, developers of conductive via substrates will design different conductive via configurations to match the different external electrical components. However, to match different external electrical components, a lot of additional manpower and resources are usually spent on the design of the structure and manufacturing process of conductive via substrates with different specifications. Summary of the Invention

[0004] One object of the present invention is to provide an electronic device with a conductive via array substrate, which can be flexibly applied to most types of external electrical components.

[0005] An embodiment of the present invention provides an electronic device with a conductive via array substrate, comprising: a conductive via array substrate, an outer layer, a conductive circuit layer, and a switchable circuit chip. The conductive via array substrate has a plurality of first conductive vias. The outer layer has a plurality of second conductive vias. The outer layer is disposed on one side of the conductive via array substrate. The distribution density or number of the first conductive vias is greater than the distribution density or number of the second conductive vias, such that some of the first conductive vias are electrically connected to the second conductive vias, and some of the first conductive vias are electrically floating. The conductive circuit layer is disposed on the outer layer. The conductive circuit layer has a plurality of conductive lines. At least one conductive line is electrically connected to at least one second conductive via. The switchable circuit chip is electrically connected to at least one first conductive via. The plurality of conductive lines of the conductive circuit layer are electrically connected to the switchable circuit chip. The switchable circuit chip is used to control the electrical connection relationship between the plurality of conductive lines and at least one first conductive via.

[0006] According to an embodiment of the present invention, an electronic device with a conductive via array substrate has a distribution density or number of multiple first conductive vias that is greater than the distribution density or number of multiple second conductive vias. This allows most types of external electrical components, when mounted on a conductive line layer, to be disposed on the conductive via array substrate through the second conductive vias, thereby causing some of the first conductive vias to be electrically floating. Furthermore, the electrical connection between the conductive lines and the first conductive vias can be flexibly controlled through the switching operation of switchable circuit chips. Therefore, most types of external electrical components can be disposed on electronic devices with conductive via array substrates of uniform specifications, thus saving manpower and resources in the design of the structure and manufacturing process of electronic devices with conductive via array substrates.

[0007] The above description of the content of this invention and the following description of the embodiments are intended to demonstrate and explain the spirit and principles of this invention, and to provide a further explanation of the scope of this patent application. Attached Figure Description

[0008] Figure 1 This is a side cross-sectional view of an electronic device with a conductive via array substrate according to an embodiment of the present invention.

[0009] Figure 2 for Figure 1 A block diagram of the operating chip and switchable circuit chip of an electronic device with a conductive via array substrate.

[0010] Figure 3 for Figure 2 A schematic diagram of the switch array architecture of a switchable circuit chip in the XY plane.

[0011] Figure 4 for Figure 2 A schematic diagram of the switch array architecture of a switchable circuit chip on the ZX plane.

[0012] Figure 5 for Figure 1 A block diagram of another operating chip and another switchable circuit chip of an electronic device with a conductive via array substrate.

[0013] Figure 6 This is a side cross-sectional view of an electronic device with a conductive via array substrate according to another embodiment of the present invention;

[0014] Figure 7 This is a side cross-sectional view of an electronic device with a conductive via array substrate according to another embodiment of the present invention;

[0015] Figure 8 This is a side cross-sectional view of an electronic device with a conductive via array substrate according to another embodiment of the present invention;

[0016] Figure 9 This is a side cross-sectional view of an electronic device with a conductive via array substrate according to another embodiment of the present invention;

[0017] Figure 10 This is a side cross-sectional view of an electronic device with a conductive via array substrate according to another embodiment of the present invention.

[0018] Symbol Explanation

[0019] 1,2,3,4,5,6: Electronic devices

[0020] 11,21,31,41,51,61:Substrate

[0021] 11a, 31a, 51a: Surface

[0022] 110: Core Layer

[0023] 111,211,311,411,511,611: First conductive via

[0024] 12,22,32,42,52,62: Outer layer

[0025] 120: First dielectric

[0026] 121, 221, 321, 421, 521, 621: Second conductive via

[0027] 13,23,33,43,53,63: Conductive circuit layers

[0028] 13a, 33a, 53a: Surface

[0029] 130: Second dielectric

[0030] 131,231,331,431,531,631: Conductive wires

[0031] 14,14′,24,34,44,54,64: Switchable circuit chips

[0032] 141,141′: Switch array

[0033] 142′: Control Unit

[0034] 15,25,35,45,55,65: First external contact point

[0035] 16,26,36,46,56,66: Second external NAT Node

[0036] 17,17′,27,37,47,57,67: Operating chip

[0037] 171,171′: Storage unit

[0038] 172: Control Unit

[0039] 18a, 18b, 28, 38, 48, 58, 68: External electronic components

[0040] 29, 49, 69: Circuit boards

[0041] 50: Groove

[0042] 501: Packing

[0043] 502: Conductive wire

[0044] 522, 622: Third conductive via

[0045] 91: First Solder

[0046] 92: Second solder

[0047] 93: Third Solder

[0048] a,b,c,d,e: Path Detailed Implementation

[0049] The following detailed description of the embodiments of the present invention outlines its features and advantages. This description is sufficient to enable anyone skilled in the art to understand the technical content of the embodiments of the present invention and to implement them accordingly. Furthermore, based on the disclosure, claims, and drawings in this specification, anyone skilled in the art can easily understand the related objectives and advantages of the present invention. The following embodiments are intended to further illustrate the viewpoints of the present invention, but are not intended to limit the scope of the invention in any way.

[0050] In the so-called schematic diagrams of this specification, dimensions, proportions, and angles may be exaggerated for illustrative purposes, but are not intended to limit the invention. Various modifications are possible without departing from the spirit of the invention. The up, down, front, and back orientations mentioned in the description of the embodiments and drawings are for illustrative purposes and are not intended to limit the invention.

[0051] Please refer to Figure 1 . Figure 1 A side cross-sectional view of an electronic device with a conductive via array substrate according to an embodiment of the present invention is shown.

[0052] like Figure 1As shown, in this embodiment, the electronic device 1 with a conductive via array substrate includes a conductive via array substrate 11, an outer layer 12, a conductive line layer 13, a switchable circuit chip 14, a plurality of first external contacts 15, a plurality of second external contacts 16, an operating chip 17, an external electronic component 18a, and an external electronic component 18b.

[0053] The conductive via array substrate 11 includes a core layer 110 and a plurality of first conductive vias 111. The core layer 110 is made of semiconductor and non-conductive materials. The core layer 110 is made of silicon, gallium, germanium, gallium nitride, and epoxy resin. The plurality of first conductive vias 111 penetrate the core layer 110 and are arranged in an array. Each first conductive via 111 is solid. The outer diameter of each first conductive via 111 is 5 to 100 micrometers. The center-to-center spacing of adjacent first conductive vias 111 is on the order of micrometers.

[0054] A switchable circuit chip 14 is disposed on a conductive via array substrate 11. The switchable circuit chip 14 is directly electrically connected to a first conductive via 111. An outer layer 12 is disposed on one side of the conductive via array substrate 11 and surrounds the switchable circuit chip 14, such that the switchable circuit chip 14 is disposed within the outer layer 12. The outer layer 12 includes a first dielectric 120 and a plurality of second conductive vias 121. The first dielectric 120 contacts each second conductive via 121. The first dielectric 120 is made of a polymer or a molding compound. The polymer is selected from polybenzoxazole and polyimide. Each second conductive via 121 is electrically connected to a plurality of first conductive vias 111 in a one-to-many manner. The distribution density or number of the first conductive vias 111 is greater than the distribution density or number of the second conductive vias 121, such that some of the first conductive vias 111 are electrically connected to the second conductive vias 121, while some of the first conductive vias 111 are not electrically connected to the second conductive vias 121.

[0055] A conductive circuit layer 13 is disposed on the outer layer plate 12 and covers the switchable circuit chip 14 and the outer layer plate 12. The conductive circuit layer 13 includes a second dielectric 130 and a plurality of conductive lines 131. The second dielectric 130 contacts each conductive line 131. The second dielectric 130 is made of a polymer or a molding compound. Some of the conductive lines 131 are electrically connected to the switchable circuit chip 14. Some of the conductive lines 131 are electrically connected to a second conductive via 121. The switchable circuit chip 14 is used to control the electrical connection between the conductive lines 131 and the first conductive via 121. Furthermore, the switchable circuit chip 14 is also used to control the electrical connection between the plurality of conductive lines 131.

[0056] Multiple first external contacts 15 are disposed on a surface 11a of the conductive via array substrate 11, away from the conductive line layer 13. The first external contacts 15 are electrically connected to the first conductive vias 111. Multiple first solder 91 are disposed on the first external contacts 15. The material of the first external contacts 15 is under bump metallurgy (UBM). Some of the first conductive vias 111 are neither electrically connected to the switchable circuit chip 14, nor to the second conductive via 121, nor to the first external contacts 15, and are therefore electrically floating.

[0057] Multiple second external contacts 16 are disposed on a surface 13a of the conductive circuit layer 13 and are located away from the conductive via array substrate 11. The second external contacts 16 are electrically connected to conductive lines 131. An operating chip 17 is disposed on the conductive circuit layer 13 and is electrically connected to the second external contacts 16 via multiple second solders 92. The operating chip 17 is electrically connected to the switchable circuit chip 14 via the second solders 92, the second external contacts 16, and the conductive lines 131. External electronic components 18a and 18b are disposed on the conductive circuit layer 13 and are electrically connected to the second external contacts 16 via the second solders 92. Each of the external electronic components 18a and 18b is electrically connected to the switchable circuit chip 14 via the second solders 92, the second external contacts 16, and the conductive lines 131.

[0058] When the electronic device 1 is in operation, the signal can be transmitted along any of the paths shown, such as path a, path b, path c, path d, and path e.

[0059] In path a, external electronic component 18a can be electrically connected to another second external contact 16 via one of the second external contacts 16, one conductive line 131, a switchable circuit chip 14, and another conductive line 131. Thus, for example, the operating chip 17 can control the switchable circuit chip 14 according to different conditions and needs to provide path a as a routing path between external electronic component 18a and other electronic devices not shown.

[0060] In path b, external electronic component 18a can be electrically connected to one of the first external contacts 15 via one of the second external contacts 16, one of the conductive lines 131, the switchable circuit chip 14, and one of the first conductive vias 111. Thus, for example, the operating chip 17 can control the switchable circuit chip 14 according to different conditions and needs to provide path b as a routing path between external electronic component 18a and other electronic devices not shown.

[0061] In path c, external electronic component 18a can be electrically connected to external electronic component 18b via one of the second external contacts 16, one conductive line 131, a switchable circuit chip 14, another conductive line 131, and another second external contact 16. In other words, external electronic components 18a and 18b can be electrically connected to each other via multiple second external contacts 16, multiple conductive lines 131, and the switchable circuit chip 14. Therefore, for example, the operating chip 17 can control the switchable circuit chip 14 according to different conditions and needs to provide path c as a routing path between external electronic components 18a and 18b.

[0062] In path d, external electronic component 18b can be electrically connected to one of the first external contacts 15 via one of the second external contacts 16, one of the conductive lines 131, one of the second conductive vias 121, and one of the first conductive vias 111. Thus, for example, path d can provide a routing path between external electronic component 18b and other unshown electronic devices, depending on different conditions and requirements.

[0063] In path e, external electronic component 18b can be electrically connected to another second external contact 16 via one of the second external contacts 16 and one of the conductive lines 131. Thus, for example, path e can provide a routing path between external electronic component 18b and other electronic devices not shown, depending on different conditions and requirements.

[0064] Please refer to Figure 2 , Figure 3 and Figure 4 . Figure 2 Draw Figure 1 A block diagram of the operating chip and switchable circuit chip of an electronic device with a conductive via array substrate. Figure 3 Draw Figure 2 A schematic diagram of the switch array of a switchable circuit chip in the XY plane. Figure 4 Draw Figure 2 A schematic diagram of the switch array of a switchable circuit chip on the ZX plane.

[0065] like Figure 2 As shown, in this embodiment, the switchable circuit chip 14 includes a switch array 141. For example... Figure 3 Viewed in the XY plane, the switch array 141 has n nodes along the X direction and n nodes along the Y direction. A switch is provided between two adjacent nodes. Figure 4 As seen in the ZX plane, the switch array 141 has n nodes along the Z direction and n nodes along the X direction. A switch is provided between two adjacent nodes.

[0066] like Figure 2 As shown, through selective switching Figure 3 and Figure 4 The switch array 141 can provide multiple connection path configurations by specifying which switches are on and which are off among the multiple switches. The operating chip 17 includes a storage unit 171 and a control unit 172 electrically connected to the storage unit 171. The storage unit 171 stores a configuration instruction. The control unit 172 can turn one or more selected switches of the switch array 141 on or off according to the configuration instruction received from the storage unit 171, thereby forming the desired connection path configuration. In other words, the control unit 172 is configured to actuate one of the multiple connection path configurations according to the configuration instruction. When the switch array 141 needs to provide different connection path configurations, one method is to use another operating chip 17 whose storage unit 171 stores a different configuration instruction; or another method is to rewrite the configuration instruction of the storage unit 171 of the original operating chip 17.

[0067] Furthermore, if the configuration instructions stored in the storage unit 171 of the operating chip 17 are the manufacturer's secrets, a partial electronic device 1 other than the operating chip 17 can be assembled and transported separately from the operating chip 17. When it arrives at the preset position, the operating chip 17 can be installed into the electronic device 1, thereby preventing the configuration instructions from leaking out.

[0068] Please refer to Figure 5 . Figure 5 Draw Figure 1 A block diagram of another operating chip and another switchable circuit chip of an electronic device with a conductive via array substrate.

[0069] like Figure 5 As shown, in this embodiment, the switchable circuit chip 14' includes a switch array 141' and a control unit 142' interconnected with each other. The switch array 141' provides multiple connection path configurations. The operating chip 17' includes a storage unit 171'. The storage unit 171' stores a configuration instruction. The control unit 142' can set one or more selected switches of the switch array 141' to be on or off according to the configuration instruction received from the storage unit 171', thereby actuating one of the connection path configurations.

[0070] In other embodiments, the operating chip 17 may be omitted, and the switchable circuit chip 14 may include a switch array, a storage unit, and a control unit electrically connecting the switch array and the storage unit. In the switchable circuit chip 14, the control unit can turn one or more selected switches of the switch array on or off according to configuration instructions received from the storage unit, thereby forming the required connection path configuration.

[0071] Please refer toFigure 6 . Figure 6 A side cross-sectional view of an electronic device with a conductive via array substrate according to another embodiment of the present invention is shown.

[0072] like Figure 6 As shown, in this embodiment, the electronic device 2 with a conductive via array substrate includes a conductive via array substrate 21, an outer layer 22, a conductive line layer 23, a switchable circuit chip 24, a plurality of first external contacts 25, a plurality of second external contacts 26, an operating chip 27, an external electronic component 28, and a circuit board 29. In this embodiment, the conductive via array substrate 21 and its first conductive vias 211, the outer layer 22 and its second conductive vias 221, the conductive line layer 23 and its conductive lines 231, the switchable circuit chip 24, the plurality of first external contacts 25, and the plurality of second external contacts 26 are respectively connected to... Figure 1 The conductive via array substrate 11 and its first conductive via 111, outer layer 12 and its second conductive via 121, conductive line layer 13 and its conductive line 131, switchable circuit chip 14, multiple first external contact points 15 and multiple second external contact points 16 shown are similar, so they will not be described in detail here.

[0073] The operating chip 27 and the conductive via array substrate 21 are both disposed on the circuit board 29. The operating chip 27 is electrically connected to the switchable circuit chip 24 via a plurality of third solders 93, the circuit board 29, a plurality of first solders 91, a first external contact 25, and the conductive via array substrate 21. The external electronic component 28 is disposed on the conductive line layer 23 and electrically connected to the second external contact 26 via a second solder 92. The external electronic component 28 is electrically connected to the switchable circuit chip 24 via the second solder 92, the second external contact 26, and conductive lines 231.

[0074] In this embodiment, the operation mode of the switchable circuit chip 24 and the operating chip 27 is the same as... Figure 2 The switchable circuit chip 14 and the operating chip 17 shown are similar, so they will not be described in detail here. In other embodiments, the operation of the switchable circuit chip 24 and the operating chip 27 may also be similar. Figure 5 The switchable circuit chip 14' and the operating chip 17' shown are similar, so they will not be described in detail here.

[0075] Please refer to Figure 7 . Figure 7 A side cross-sectional view of an electronic device with a conductive via array substrate according to another embodiment of the present invention is shown.

[0076] like Figure 7As shown, in this embodiment, the electronic device 3 with a conductive via array substrate includes a conductive via array substrate 31, an outer layer 32, a conductive line layer 33, a switchable circuit chip 34, a plurality of first external contacts 35, a plurality of second external contacts 36, an operating chip 37, and an external electronic component 38.

[0077] The conductive via array substrate 31 includes a plurality of first conductive vias 311. An outer layer 32 is disposed on one side of the conductive via array substrate 31. The outer layer 32 includes a plurality of second conductive vias 321. The second conductive vias 321 are electrically connected to the plurality of first conductive vias 311 in a pairwise manner. The distribution density or number of the first conductive vias 311 is greater than the distribution density or number of the second conductive vias 321, such that some of the first conductive vias 311 are electrically connected to the second conductive vias 321, while some of the first conductive vias 311 are not electrically connected to the second conductive vias 321.

[0078] A switchable circuit chip 34 is disposed on the outer layer plate 32. The switchable circuit chip 34 is electrically connected to the first conductive via 311 via the second conductive via 321. A conductive circuit layer 33 covers the switchable circuit chip 34 and the outer layer plate 32. The conductive circuit layer 33 includes a plurality of conductive lines 331. Some of the conductive lines 331 are electrically connected to the switchable circuit chip 34. Some of the conductive lines 331 are electrically connected to the second conductive via 321. The switchable circuit chip 34 is used to control the electrical connection relationship between the conductive lines 331 and the first conductive via 311. Moreover, the switchable circuit chip 34 is also used to control the electrical connection relationship of the plurality of conductive lines 331.

[0079] Multiple first external contacts 35 are disposed on a surface 31a of the conductive via array substrate 31 and away from the conductive line layer 33. The first external contacts 35 are electrically connected to the first conductive vias 311. Some of the first conductive vias 311 are neither electrically connected to the switchable circuit chip 34, nor to the second conductive via 321, nor to the first external contacts 35, and are therefore electrically floating.

[0080] Multiple second external contacts 36 are disposed on a surface 33a of the conductive line layer 33 and away from the conductive via array substrate 31. The second external contacts 36 are electrically connected to conductive lines 331. A portion of the conductive lines 331 are electrically connected to the switchable circuit chip 34 and a portion of the second external contacts 36. A portion of the conductive lines 331 are electrically connected to the second conductive via 321 and a portion of the second external contacts 36.

[0081] An operational chip 37 is disposed on the conductive circuit layer 33 and electrically connected to the second external contact 36 via the second solder 92. The operational chip 37 is electrically connected to the switchable circuit chip 34 via the second solder 92, the second external contact 36, and the conductive line 331. An external electronic component 38 is disposed on the conductive circuit layer 33 and electrically connected to the second external contact 36 via the second solder 92. The external electronic component 38 is electrically connected to the switchable circuit chip 34 via the second solder 92, the second external contact 36, and the conductive line 331.

[0082] In this embodiment, the operation mode of the switchable circuit chip 34 and the operating chip 37 is the same as... Figure 2 The switchable circuit chip 14 and the operating chip 17 shown are similar, so they will not be described in detail here. In other embodiments, the operation of the switchable circuit chip 34 and the operating chip 37 may also be similar. Figure 5 The switchable circuit chip 14' and the operating chip 17' shown are similar, so they will not be described in detail here.

[0083] Please refer to Figure 8 . Figure 8 A side cross-sectional view of an electronic device with a conductive via array substrate according to another embodiment of the present invention is shown.

[0084] like Figure 8 As shown, in this embodiment, the electronic device 4 with a conductive via array substrate includes a conductive via array substrate 41, an outer layer 42, a conductive line layer 43, a switchable circuit chip 44, a plurality of first external contacts 45, a plurality of second external contacts 46, an operating chip 47, an external electronic component 48, and a circuit board 49. In this embodiment, the conductive via array substrate 41 and its first conductive vias 411, the outer layer 42 and its second conductive vias 421, the conductive line layer 43 and its conductive lines 431, the switchable circuit chip 44, the plurality of first external contacts 45, and the plurality of second external contacts 46 are respectively connected to... Figure 7 The conductive via array substrate 31 and its first conductive via 311, outer layer 32 and its second conductive via 321, conductive line layer 33 and its conductive line 331, switchable circuit chip 34, multiple first external contact points 35 and multiple second external contact points 36 shown are similar, so they will not be described in detail here.

[0085] The operating chip 47 and the conductive via array substrate 41 are both disposed on the circuit board 49. The operating chip 47 is electrically connected to the switchable circuit chip 44 via the third solder 93, the circuit board 49, the first solder 91, the first external contact 45, and the conductive via array substrate 41. The external electronic component 48 is disposed on the conductive line layer 43 and electrically connected to the second external contact 46 via the second solder 92. The external electronic component 48 is electrically connected to the switchable circuit chip 44 via the second solder 92, the second external contact 46, and the conductive line 431.

[0086] In this embodiment, the operation mode of the switchable circuit chip 44 and the operating chip 47 is the same as... Figure 2 The switchable circuit chip 14 and the operating chip 17 shown are similar, so they will not be described in detail here. In other embodiments, the operation mode of the switchable circuit chip 44 and the operating chip 47 may also be similar. Figure 5 The switchable circuit chip 14' and the operating chip 17' shown are similar, so they will not be described in detail here.

[0087] Please refer to Figure 9 . Figure 9 A side cross-sectional view of an electronic device with a conductive via array substrate according to another embodiment of the present invention is shown.

[0088] like Figure 9 As shown, in this embodiment, the electronic device 5 with a conductive via array substrate includes a conductive via array substrate 51, an outer layer 52, a conductive line layer 53, a switchable circuit chip 54, a plurality of first external contacts 55, a plurality of second external contacts 56, an operating chip 57, and an external electronic component 58.

[0089] The conductive via array substrate 51 includes a plurality of first conductive vias 511 and has a recess 50. A switchable circuit chip 54 is disposed in the recess 50 and is directly electrically connected to the first conductive vias 511. Filler 501 fills the recess 50 and surrounds the switchable circuit chip 54. An outer layer 52 is disposed on one side of the conductive via array substrate 51 and covers the switchable circuit chip 54 and the conductive via array substrate 51. The outer layer 52 includes a plurality of second conductive vias 521 and a plurality of third conductive vias 522. The second conductive vias 521 are electrically connected to the plurality of first conductive vias 511 in a pairwise manner. The distribution density or number of the first conductive vias 511 is greater than the distribution density or number of the second conductive vias 521, such that some of the first conductive vias 511 are electrically connected to the second conductive vias 521, while some of the first conductive vias 511 are not electrically connected to the second conductive vias 521. Multiple conductive lines 502 are electrically connected to a switchable circuit chip 54 and multiple third conductive vias 522. The multiple third conductive vias 522 are electrically connected to the multiple conductive lines 502 in a one-to-one manner.

[0090] A conductive circuit layer 53 is disposed on the outer layer plate 52. The conductive circuit layer 53 includes a plurality of conductive lines 531. Some of the conductive lines 531 are electrically connected to a switchable circuit chip 54 via a third conductive via 522. Some of the conductive lines 531 are electrically connected to a second conductive via 521. The switchable circuit chip 54 is used to control the electrical connection relationship between the conductive lines 531 and the first conductive via 511. Moreover, the switchable circuit chip 54 is also used to control the electrical connection relationship of the plurality of conductive lines 531.

[0091] Multiple first external contacts 55 are disposed on a surface 51a of the conductive via array substrate 51 away from the conductive line layer 53 and electrically connected to the first conductive via 511. Some of the first conductive vias 511 are neither electrically connected to the second conductive via 521 nor to the first external contacts 55, and are therefore electrically floating.

[0092] Multiple second external contacts 56 are disposed on a surface 53a of the conductive line layer 53, away from the conductive via array substrate 51, and electrically connected to conductive lines 531. A switchable circuit chip 54 is electrically connected to some of the second external contacts 56 via conductive lines 502, a third conductive via 522, and a portion of the conductive lines 531. A portion of the conductive lines 531 are electrically connected to the second conductive via 521 and a portion of the second external contacts 56.

[0093] An operational chip 57 is disposed on the conductive circuit layer 53 and electrically connected to the second external contact 56 via the second solder 92. The operational chip 57 is electrically connected to the switchable circuit chip 54 via the second solder 92, the second external contact 56, the conductive line 531, the third conductive via 522, and the conductive line 502. An external electronic component 58 is disposed on the conductive circuit layer 53 and electrically connected to the second external contact 56 via the second solder 92. The external electronic component 58 is electrically connected to the switchable circuit chip 54 via the second solder 92, the second external contact 56, the conductive line 531, the third conductive via 522, and the conductive line 502.

[0094] In this embodiment, the operation mode of the switchable circuit chip 54 and the operating chip 57 is the same as... Figure 2 The switchable circuit chip 14 and the operating chip 17 shown are similar, so they will not be described in detail here. In other embodiments, the operation mode of the switchable circuit chip 54 and the operating chip 57 may also be similar. Figure 5 The switchable circuit chip 14' and the operating chip 17' shown are similar, so they will not be described in detail here.

[0095] Please refer to Figure 10 . Figure 10 A side cross-sectional view of an electronic device with a conductive via array substrate according to another embodiment of the present invention is shown.

[0096] like Figure 10 As shown, in this embodiment, the electronic device 6 with a conductive via array substrate includes a conductive via array substrate 61, an outer layer 62, a conductive line layer 63, a switchable circuit chip 64, a plurality of first external contacts 65, a plurality of second external contacts 66, an operating chip 67, an external electronic component 68, and a circuit board 69. In this embodiment, the conductive via array substrate 61 and its first conductive vias 611, the outer layer 62 and its second conductive vias 621 and third conductive vias 622, the conductive line layer 63 and its conductive lines 631, the switchable circuit chip 64, the plurality of first external contacts 65 and the plurality of second external contacts 66 are respectively connected to... Figure 9 The conductive via array substrate 51 and its first conductive via 511, outer layer 52 and its second conductive via 521 and third conductive via 522, conductive line layer 53 and its conductive line 531, switchable circuit chip 54, multiple first external contact points 55 and multiple second external contact points 56 shown are similar, so they will not be described in detail here.

[0097] The operating chip 67 and the conductive via array substrate 61 are both disposed on the circuit board 69. The operating chip 67 is electrically connected to the switchable circuit chip 64 via the third solder 93, the circuit board 69, the first solder 91, the first external contact 65, and the conductive via array substrate 61. The external electronic component 68 is disposed on the conductive line layer 63 and electrically connected to the second external contact 66 via the second solder 92. The external electronic component 68 is electrically connected to the switchable circuit chip 64 via the second solder 92, the second external contact 66, and the conductive line 631.

[0098] In this embodiment, the operation mode of the switchable circuit chip 64 and the operating chip 67 is the same as... Figure 2 The switchable circuit chip 14 and the operating chip 17 shown are similar, so they will not be described in detail here. In other embodiments, the operation of the switchable circuit chip 64 and the operating chip 67 may also be similar. Figure 5 The switchable circuit chip 14' and the operating chip 17' shown are similar, so they will not be described in detail here.

[0099] In summary, an electronic device with a conductive via array substrate according to an embodiment of the present invention, by having a greater distribution density or number of first conductive vias than a greater distribution density or number of second conductive vias, allows most types of external electrical components, when mounted on the conductive line layer, to be disposed on the conductive via array substrate through the second conductive vias, thereby causing some of the first conductive vias to be electrically floating. Furthermore, by switching the operation of the switchable circuit chip, the electrical connection relationships between the conductive lines, first conductive vias, second conductive vias, and second external contacts can be flexibly controlled. Therefore, most types of external electrical components can be disposed on electronic devices with conductive via array substrates of uniform specifications, thus saving manpower and resources in the design of the structure and manufacturing process of electronic devices with conductive via array substrates.

Claims

1. An electronic device having a conductive via array substrate, comprising: A conductive via array substrate having multiple first conductive vias; The outer layer plate has a plurality of second conductive vias. The outer layer plate is disposed on one side of the conductive via array substrate. The distribution density or number of the first conductive vias is greater than the distribution density or number of the second conductive vias, so that some of the first conductive vias are electrically connected to the second conductive vias. A conductive circuit layer is disposed on the outer layer plate. The conductive circuit layer has a plurality of conductive lines, and at least one of the conductive lines is electrically connected to at least one of the second conductive vias. as well as A switchable circuit chip is electrically connected to at least one of the first conductive vias. A plurality of conductive lines of the conductive line layer are electrically connected to the switchable circuit chip. The switchable circuit chip is used to control the electrical connection relationship between the plurality of conductive lines and the at least one of the first conductive vias. Some of these first conductive vias are neither electrically connected to the switchable circuit chip nor to the second conductive vias, thus exhibiting electrical floating behavior.

2. The electronic device of claim 1, wherein the switchable circuit chip is disposed on the conductive via array substrate, the switchable circuit chip is disposed in the outer layer plate, the conductive line layer covers the switchable circuit chip and the outer layer plate, and the switchable circuit chip is directly electrically connected to at least one of the first conductive vias.

3. The electronic device of claim 1, wherein the switchable circuit chip is disposed on the outer layer, the conductive circuit layer covers the switchable circuit chip and the outer layer, and the switchable circuit chip is electrically connected to at least one of the first conductive vias via at least one of the second conductive vias.

4. The electronic device of claim 1, wherein the conductive via array substrate has a groove, the switchable circuit chip is disposed in the groove, the outer layer covers the switchable circuit chip and the conductive via array substrate, the switchable circuit chip is directly electrically connected to at least one of the first conductive vias, the outer layer further has a plurality of third conductive vias, the third conductive vias are electrically connected to the switchable circuit chip, and a plurality of conductive lines of the conductive line layer are electrically connected to the switchable circuit chip via the third conductive vias.

5. The electronic device of claim 1, further comprising an operating chip disposed on the conductive line layer, the operating chip being electrically connected to the switchable circuit chip via at least one conductive line of the conductive line layer, the switchable circuit chip including a switch array providing a plurality of connection path configurations, the operating chip including a storage unit and a control unit electrically connected to the storage unit, the storage unit storing configuration instructions, the control unit being configured to actuate one of the connection path configurations according to the configuration instructions.

6. The electronic device of claim 1, further comprising an operating chip electrically connected to the conductive via array substrate, the operating chip being electrically connected to the switchable circuit chip via the conductive via array substrate, the switchable circuit chip including a switch array providing a plurality of connection path configurations, the operating chip including a storage unit and a control unit electrically connected to the storage unit, the storage unit storing configuration instructions, the control unit being configured to actuate one of the connection path configurations according to the configuration instructions.

7. The electronic device of claim 1, further comprising an operating chip disposed on the conductive line layer, the operating chip being electrically connected to the switchable circuit chip via at least one conductive line of the conductive line layer, the switchable circuit chip including a switch array and a control unit electrically connected to the switch array, the switch array providing a plurality of connection path configurations, the operating chip including a storage unit storing configuration instructions, the control unit being configured to actuate one of the connection path configurations according to the configuration instructions.

8. The electronic device of claim 1, further comprising an operating chip electrically connected to the conductive via array substrate, the operating chip being electrically connected to the switchable circuit chip via the conductive via array substrate, the switchable circuit chip including a switch array and a control unit electrically connected to the switch array, the switch array providing a plurality of connection path configurations, the operating chip including a storage unit storing configuration instructions, the control unit being configured to actuate one of the connection path configurations according to the configuration instructions.

9. The electronic device of claim 1, wherein the outer layer includes a first dielectric material that contacts the second conductive via, the first dielectric material being a polymer or a molding compound, the conductive line layer includes a second dielectric material that contacts the conductive line, the second dielectric material being the polymer or the molding compound.

10. The electronic device of claim 9, wherein the polymer is selected from polybenzoxazole and polyimide.

11. The electronic device of claim 1, further comprising a plurality of first external contacts and a plurality of second external contacts, the first external contacts being disposed on the surface of the conductive via array substrate away from the conductive line layer and electrically connected to the first conductive vias, and the second external contacts being disposed on the surface of the conductive line layer away from the conductive via array substrate and electrically connected to the conductive lines.

12. The electronic device of claim 11, further comprising at least one external electronic component, the at least one external electronic component being disposed on the conductive line layer, and the at least one external electronic component being electrically connected to at least another second external contact point via at least one second external contact point, at least one conductive line of the conductive line layer, the switchable circuit chip, and at least another conductive line.

13. The electronic device of claim 11, further comprising at least one external electronic component, the at least one external electronic component being disposed on the conductive line layer, and the at least one external electronic component being electrically connected to the at least one first external contact point via at least one second external contact point, at least one conductive line of the conductive line layer, the switchable circuit chip and at least one first conductive via.

14. The electronic device of claim 11 further includes a plurality of external electronic components disposed on the conductive line layer and electrically connected to each other via a plurality of second external contacts, a plurality of conductive lines of the conductive line layer and the switchable circuit chip.

15. The electronic device of claim 11, further comprising at least one external electronic component, the at least one external electronic component being disposed on the conductive circuit layer, the at least one external electronic component being electrically connected to the at least one first external contact via at least one second external contact, at least one conductive line of the conductive circuit layer and at least one first conductive via.

16. The electronic device of claim 11, further comprising at least one external electronic component, the at least one external electronic component being disposed on the conductive line layer, and the at least one external electronic component being electrically connected to at least another second external contact point via at least one second external contact point and at least one conductive line of the conductive line layer.

17. The electronic device of claim 1, wherein the first conductive vias are solid.

18. The electronic device of claim 1, wherein the distribution of the first conductive vias is an array distribution.

19. The electronic device of claim 1, wherein the second conductive vias are electrically connected to the first conductive vias in a one-to-one manner.

20. The electronic device of claim 1, wherein the outer diameter of each of the first conductive vias is 5 to 100 micrometers.

21. The electronic device of claim 1, wherein the center-to-center spacing of the first conductive vias is on the order of micrometers.

22. The electronic device of claim 1, wherein the core layer of the conductive via array substrate is made of semiconductor and non-conductive materials.

23. The electronic device of claim 1, wherein the core layer of the conductive via array substrate is made of silicon, gallium, germanium, gallium nitride, and epoxy resin.

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