Substrate processing apparatus and method

Abstract

The present invention provides a substrate processing apparatus and method capable of minimizing the effects of height differences between multiple heads. The substrate processing method includes: providing an inkjet head module having a first head and a second head; calculating a first height difference between the first head and the second head; and controlling, based on the first height difference, a first ejection velocity of a first chemical liquid ejected from the first head and a second ejection velocity of a second chemical liquid ejected from the second head so as to differ.

Description

Technical Field

[0001] The present invention relates to a substrate processing device and method. Background Art

[0002] To manufacture display devices such as LCD panels, PDP panels, and LED panels, a printing process (eg, RGB patterning) is performed on a substrate using a printing device equipped with an inkjet head module.

[0003] An inkjet head module contains multiple heads, and the height differences between the heads must be minimized (i.e., high flatness is required). Large height differences between the heads increase the likelihood of ink dripping accidentally. However, achieving perfect flatness across multiple heads is difficult, and adjusting the flatness of the heads is time-consuming. Summary of the Invention

[0004] Problems to be solved by the invention

[0005] An object of the present invention is to provide a substrate processing method capable of minimizing the influence of height differences between a plurality of heads.

[0006] Another problem to be solved by the present invention is to provide a substrate processing apparatus capable of minimizing the influence of height differences between a plurality of heads.

[0007] The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

[0008] Technical solutions to problems

[0009] According to one embodiment of the substrate processing method of the present invention for achieving the above-mentioned problem, the method includes: providing an inkjet head module provided with a first head and a second head; calculating a first height difference between the first head and the second head; and controlling based on the first height difference so that a first ejection speed of a first liquid ejected from the first head and a second ejection speed of a second liquid ejected from the second head are different.

[0010] According to another embodiment of the substrate processing method of the present invention for achieving the above-mentioned problem, the method includes: providing an inkjet head module provided with a first head and a second head; measuring a first distance from the sensor to the first head and a second distance from the sensor to the second head using a sensor; calculating a first height difference which is the difference between the first distance and the second distance; controlling based on the first height difference so that a first voltage supplied to a first piezoelectric element connected to the first head and a second voltage supplied to a second piezoelectric element connected to the second head are different, thereby controlling a first ejection speed of the first liquid ejected from the first head and a second ejection speed of the second liquid ejected from the second head to be different; and confirming the first ejection speed of the first liquid ejected from the first head and the second ejection speed of the second liquid ejected from the second head.

[0011] According to one embodiment of the present invention for achieving the other problem, the substrate processing device includes: a first station; a second station separated from the first station; a frame configured on the first station and the second station to span the first station and the second station; an inkjet head module moving along the frame, including a first head and a second head; a sensor provided in an intermediate space between the first station and the second station below the frame; and a controller, which uses the sensor to measure a first distance to the first head and a second distance to the second head when the inkjet head module is located at the upper part of the intermediate space, calculates a first height difference between the first distance and the second distance, and performs control based on the first height difference so that a first ejection speed of the first liquid ejected from the first head and a second ejection speed of the second liquid ejected from the second head are different.

[0012] Specific matters regarding other embodiments are included in the detailed description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a flowchart for explaining a substrate processing method according to an embodiment of the present invention.

[0014] Figure 2 This is a diagram for explaining the structure of a head module.

[0015] Figure 3 It is along Figure 2 Figure 1. AA cutoff diagram.

[0016] Figure 4 It is used to explain Figure 1 FIG. 1 is a diagram illustrating an example of a substrate processing method.

[0017] Figure 5 It is used to illustrate Figure 1Another example of the substrate processing method is described in FIG.

[0018] Figure 6 It is used to illustrate Figure 1 FIG. 1 is a diagram illustrating a comparative example of a substrate processing method.

[0019] Figure 7 This is a block diagram for explaining a method for controlling the ejection speed of the chemical liquid from the head module.

[0020] Figure 8 It is a diagram for explaining a substrate processing method according to another embodiment of the present invention.

[0021] Figure 9 It is a diagram for explaining a substrate processing apparatus according to one embodiment of the present invention.

[0022] Figure 10 Is used to illustrate Figure 9 Diagram showing the operation between the inkjet head module and the sensor.

[0023] Figure 11 This is a flowchart for explaining a substrate processing method according to another embodiment of the present invention.

[0024] Figure 12 This is a flowchart for explaining a substrate processing method according to another embodiment of the present invention. DETAILED DESCRIPTION

[0025] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The advantages, features, and methods for achieving the same will become clear with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments described below and can be implemented in a variety of different ways. These embodiments are only intended to complete the disclosure of the present invention and help those skilled in the art to fully understand the scope of the invention. The present invention is defined solely by the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0026] In order to facilitate the description of the relationship between one element or constituent element and another element or constituent element as shown in the figure, spatially relative terms such as "below", "beneath", "lower", "above", and "upper" may be used. Spatially relative terms should be understood to include terms that refer to different directions of elements when in use or in action in addition to the directions shown in the figure. For example, if the elements shown in the figure are turned over, an element described as "below" or "beneath" another element may be placed "above" another element. Therefore, the exemplary term "below" can include both the directions of below and above. The orientation of the elements can also be in other directions, so spatially relative terms can be interpreted based on the orientation.

[0027] Although the terms "first," "second," and so on are used to describe a variety of elements, components, and / or parts, it is self-evident that these elements, components, and / or parts are not limited by these terms. These terms are only used to distinguish one element, component, or part from other elements, components, or parts. Therefore, it is self-evident that the "first element," "first component," or "first part" mentioned below may also be the "second element," "second component," or "second part" within the technical concept of the present invention.

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, identical or corresponding components that are not related to the reference numerals are denoted by the same reference numerals, and their description will be omitted.

[0029] Figure 1 This is a flowchart for explaining a substrate processing method according to an embodiment of the present invention. Figure 2 This is a diagram for explaining the structure of a head module. Figure 3 It is along Figure 2 Figure 1. AA cutoff diagram. Figure 4 It is used to illustrate Figure 1 FIG. 1 is a diagram illustrating an example of a substrate processing method. Figure 5 It is used to illustrate Figure 1 Another example of the substrate processing method is described in FIG. Figure 6 It is used to illustrate Figure 1 FIG. 1 is a diagram illustrating a comparative example of a substrate processing method. Figure 7 This is a block diagram for explaining a method for controlling the ejection speed of the chemical liquid from the head module.

[0030] Reference Figure 1, an inkjet head module provided with a first head HD1 and a second head HD2 is provided (S10).

[0031] Specifically, if Figure 2 As shown, the inkjet head module includes a plurality of heads HD1, HD2, HD3, HD4, and HD5. Each of the plurality of heads HD1, HD2, HD3, HD4, and HD5 may have a quadrilateral cross-section including long sides and short sides. The long side of one head (for example, HD2) may be arranged to be opposite to the long sides of other adjacent heads (for example, HD1 and HD3). Figure 3 As shown, there may be height differences between the plurality of heads HD1 , HD2 , HD3 , HD4 , and HD5 .

[0032] For the sake of convenience, the substrate processing method will be described below mainly using two heads.

[0033] Next, the first height difference between the first head HD1 and the second head HD2 is calculated (refer to Figure 4 's G1)(S20).

[0034] Specifically, if Figure 3 As shown, the first distance H1 from the sensor 10 to the first head HD1 and the second distance H2 from the sensor 10 to the second head HD2 are calculated by the sensor 10. The first height difference is calculated using the difference between the first distance H1 and the second distance H2.

[0035] The sensor 10 may be a distance sensor. Examples of the distance sensor include, but are not limited to, a laser sensor, an ultrasonic sensor, an infrared sensor, or a camera sensor. If the sensor 10 is a laser sensor, the sensor 10 can move in one direction while providing laser light 11 to each of the multiple heads HD1, HD2, HD3, HD4, and HD5, thereby calculating the distance from the sensor 10 to each of the heads HD1, HD2, HD3, HD4, and HD5.

[0036] The time point for calculating the first height difference G1 may vary.

[0037] For example, the inkjet head module may be assembled in the jig system 99 , and then the sensor 10 may measure the first distance H1 and the second distance H2 while moving below the jig system while the inkjet head module is positioned in the jig system 99 .

[0038] Alternatively, the inkjet device may be provided with a sensor 10 so that the first distance H1 and the second distance H2 are measured by the sensor 10 while the substrate G moves around the sensor 10 in the inkjet device (see FIG. Figure 9 as well as Figure 10 ).

[0039] Alternatively, the first distance H1 and the second distance H2 may be measured by the sensor 10 during the maintenance period (see Figure 12 ).

[0040] Next, based on the first height difference G1, control is performed such that the first ejection velocity v1 of the first chemical liquid 61 ejected from the first head HD1 and the second ejection velocity v2 of the second chemical liquid 62 ejected from the second head HD2 become different (S30).

[0041] Specifically, if Figure 4 As shown, the first head HD1 can be positioned higher than the second head HD2. In this case, the first ejection velocity v1 of the first chemical liquid 61 ejected from the first head HD1 is faster than the second ejection velocity v2 of the second chemical liquid 62 ejected from the second head HD2 (i.e., v1 > v2). Only by controlling the ejection velocities v1 and v2 to be different in this way can the first chemical liquid 61 stably land in the first pixel area PX1 and the second chemical liquid 62 stably land in the second pixel area PX2.

[0042] Or, as Figure 5 As shown, the position of the first head HD1 can also be lower than the third head HD3. The height of the third head HD3 (see Figure 3 H3) and the height of the first head HD1 (refer to Figure 3 The height difference G2 can be different. In this case, the first ejection velocity v1 of the first chemical liquid 61 ejected from the first head HD1 is slower than the third ejection velocity v3 of the third chemical liquid 63 ejected from the third head HD3 (i.e., v1 < v3). Only by controlling the ejection velocities v1 and v3 to be different in this way can the first chemical liquid 61 stably land in the first pixel area PX1 and the third chemical liquid 63 stably land in the third pixel area PX3.

[0043] The reason why the ejection speeds of the chemical solutions 61 , 62 , and 63 are adjusted according to the heights of the heads HD1 , HD2 , and HD3 is as follows.

[0044] Here, refer to Figure 6 While the substrate G is moving in the one direction D1 , if the first head HD1 ejects the first chemical solution 61 at the first ejection velocity v1 , the chemical solution 61 can stably fall into the first pixel region PX1 .

[0045] On the other hand, head HD11 is located higher than first head HD1 (see height difference G3). If head HD11 ejects liquid 61a at first ejection velocity v1, liquid 61a may drip outside first pixel region PX1. In other words, liquid 61a may drip by mistake.

[0046] This is because, if head HD11 is positioned higher than first head HD1, chemical liquid 61a will continue dripping longer than first chemical liquid 61. Specifically, if first chemical liquid 61 drips for 0.2 seconds, chemical liquid 61a may continue dripping for 0.22 seconds. The distance the substrate G moves during the 0.22-second dripping period of chemical liquid 61a is greater than the distance the substrate G moves during the 0.2-second dripping period of first chemical liquid 61. Therefore, while the first chemical liquid 61 ejected from first head HD1 at the first ejection velocity v1 will stably land in the first pixel area PX1, the chemical liquid 61a ejected from head HD11 at the first ejection velocity v1 will escape from the first pixel area PX1. For chemical liquid 61a ejected from head HD11 to stably land in the first pixel area PX1, it must be ejected at a velocity faster than the first ejection velocity v1.

[0047] Refer again Figure 5 The first chemical liquid 61 ejected from the first head HD1 at the first ejection velocity v1 stably lands in the first pixel area PX1. If the third head HD3 is positioned higher than the first head HD1, the third chemical liquid 63 can only stably land in the third pixel area PX3 if the third head HD3 ejects the third chemical liquid 63 at a third ejection velocity v3 greater than the first ejection velocity v1.

[0048] Or, refer to Figure 4 The first chemical liquid 61 ejected from the first head HD1 at the first ejection velocity v1 stably lands in the first pixel area PX1. If the second head HD2 is positioned lower than the first head HD1, the second chemical liquid 62 can only stably land in the second pixel area PX2 if the second head HD2 ejects the second chemical liquid 62 at a second ejection velocity v2 that is lower than the first ejection velocity v1.

[0049] Here, refer to Figure 7 Next, a method of controlling the first ejection velocity v1 in the first head HD1 will be described.

[0050] The first head HD1 is connected to a pressure regulating unit 460 , and the pressure regulating unit 460 is connected to a power supply unit 470 . The controller 450 controls the pressure regulating unit 460 and the power supply unit 470 .

[0051] Specifically, the first head HD1 ejects liquid medicine (ink) through the nozzles. The pressure regulating unit 460 includes a piezoelectric element, which is a member for applying pressure to the nozzles. The power supply unit 470 supplies a voltage having a predetermined waveform to the piezoelectric element.

[0052] The first head HD1 can be connected to a storage device (not shown) that receives and stores liquid chemicals (ink) from an external source. Furthermore, the first head HD1 can include multiple nozzles. Specifically, a single first head HD1 can include 128 or 256 nozzles, but this is not limited to these. The nozzles can be arranged in a row at regular intervals and can eject droplets in picoliters (pl). Furthermore, the nozzles eject the liquid chemicals by varying the pressure.

[0053] The piezoelectric element is configured to pressurize the nozzle to achieve a change in the nozzle pressure. The power supply unit 470 is configured to supply a voltage having a predetermined waveform to the piezoelectric element so that the piezoelectric element can pressurize the nozzle.

[0054] The controller 450 controls the piezoelectric element and the power supply unit 470. If the controller 450 causes the power supply unit 470 to supply a relatively high voltage to the pressure regulating unit 460, the pressure regulating unit 460 controls the first head HD1 at a relatively high pressure. As a result, the first head HD1 ejects the liquid medicine at a relatively high speed. Conversely, if the controller 450 causes the power supply unit 470 to supply a relatively low voltage to the pressure regulating unit 460, the pressure regulating unit 460 controls the first head HD1 at a relatively low pressure. As a result, the first head HD1 ejects the liquid medicine at a relatively slow speed.

[0055] Furthermore, when multiple nozzles are provided, the piezoelectric elements and power supply units 470 can be arranged so as to correspond one-to-one with each of the nozzles. That is, the number of piezoelectric elements and power supply units 470 provided can correspond to the number of nozzles in the first head HD1. This allows the piezoelectric elements and power supply units 470 to eject droplets through each of the nozzles. If the first head HD1 has 128 nozzles, the number of piezoelectric elements and power supply units 470 can be 128. If the first head HD1 has 256 nozzles, the number of piezoelectric elements and power supply units 470 can be 256. This allows the amount of liquid ejected from each nozzle to be independently adjusted under the control of the power supplied to the piezoelectric elements by the power supply unit 470.

[0056] Although not otherwise described, the method of controlling the chemical liquid ejection velocity v2 in the second head HD2 is also the same as the above-described method.

[0057] Figure 8 It is a diagram for explaining a substrate processing method according to another embodiment of the present invention. Figure 8 This is an exemplary bottom view for explaining the structure of the first head.

[0058] Reference Figure 8 , the first head HD1 includes a plurality of first columns R1, R2, R3, R4, and R5. Figure 8 5 first rows R1 , R2 , R3 , R4 , and R5 are shown in the figure for illustrative purposes, but the present invention is not limited thereto. Each of the plurality of first rows R1 , R2 , R3 , R4 , and R5 includes a plurality of first nozzles 881 , 882 , and 883 .

[0059] The sensor 10 can be used to calculate the distance from the sensor 10 to the plurality of first columns R1, R2, R3, R4, and R5. Furthermore, a second height difference between the plurality of first columns R1, R2, R3, R4, and R5 can be calculated. If the second height difference is greater than a predetermined value, the ejection speed of the first chemical liquid can be adjusted differently for each of the plurality of first columns R1, R2, R3, R4, and R5. For example, if the leftmost first column R1 is positioned higher than the rightmost first column R5, the ejection speed of the first chemical liquid ejected from the first column R1 is adjusted to be faster than the ejection speed of the first chemical liquid ejected from the first column R5. If the leftmost first column R1 is positioned lower than another first column R3, the ejection speed of the first chemical liquid ejected from the first column R1 is adjusted to be slower than the ejection speed of the first chemical liquid ejected from the first column R3.

[0060] Furthermore, the distance from the sensor 10 to the plurality of first nozzles 881, 882, and 883 can be calculated using the sensor 10. Furthermore, a third height difference can be calculated between the plurality of first nozzles 881, 882, and 883. If the third height difference is greater than a predetermined value, the ejection speed of the first chemical solution can be adjusted to be different for each of the plurality of first nozzles 881, 882, and 883.

[0061] Depending on the type of the first head HD1 , the voltage level can be adjusted in units of columns or in units of nozzles.

[0062] When the voltage level can be adjusted on a column-by-column basis, the voltage level can be controlled to be different for each of the first columns R1, R2, R3, R4, and R5 based on the second height difference between the plurality of first columns R1, R2, R3, R4, and R5. When the voltage level can be adjusted on a nozzle-by-nozzle basis, the voltage level can be controlled to be different for each of the plurality of first nozzles 881, 882, and 883 based on the third height difference between the plurality of first nozzles 881, 882, and 883.

[0063] Figure 9 It is a diagram for explaining a substrate processing apparatus according to one embodiment of the present invention. Figure 10 Is used to illustrate Figure 9 Diagram showing the operation between the inkjet head module and the sensor.

[0064] Reference Figure 9 as well as Figure 10A substrate processing apparatus according to an embodiment of the present invention includes a first PT, a second MT, a frame 410, an inkjet head module 420, a sensor 510, a controller 450, and the like.

[0065] The first PT is an area for supporting and moving substrate G. The method for moving substrate G in the first PT is not limited to a specific method. For example, substrate G can be moved by holding it with a gripper, or by air flotation. Substrate G can be moved along the second direction Y. Substrate G can include, for example, a glass substrate.

[0066] The second MT can be positioned adjacent to the first PT in the first direction X. At least one test substrate can be positioned on the second MT. The test substrate can be positioned to extend long along the second direction Y. Each test substrate is flexible and can be provided, for example, in a roll-to-roll manner.

[0067] The gantry 410 is arranged on the first PT and the second MT so as to straddle the first PT and the second MT. The gantry 410 can be extended long along the first direction X.

[0068] The inkjet head module 420 is mounted on the frame 410 and is movable along the frame 410 (see reference numeral W). As shown, the inkjet head module 420 is movable in a first direction X, but is not limited to this. The inkjet head module 420 may include multiple heads that eject liquid medicine (or ink), each head including multiple nozzles. The ink may be, for example, QD (Quantum Dot) ink, but is not limited to this.

[0069] During normal operation, the inkjet head module 420 ejects liquid chemicals onto a substrate G positioned above the first PT. Normal operation refers to the process of ejecting liquid chemicals (ink) onto a substrate during the display device manufacturing process. For example, the inkjet head module 420 ejects liquid chemicals while the substrate G is performing a sweeping motion S along the second direction Y.

[0070] Furthermore, during the test operation, the inkjet head module 420 ejects a chemical solution from the upper portion of the second MT onto a test substrate located on the second MT. This test operation is used to inspect the operation of the inkjet head module 420. This test operation can be used to verify, for example, whether ink ejected from the inkjet head module 420 lands at a predetermined location or to inspect the volume and density of the ink ejected from the inkjet head module 420.

[0071] On the other hand, an intermediate space IS is located between the first PT and the second MT. As shown in the figure, the frame 410 is formed to span the first PT, the intermediate space IS, and the second MT.

[0072] The sensor 10 is installed in the intermediate space IS below the frame 410. The sensor 10 provides laser light 511 toward the inkjet head module 420 located above the frame 410 (i.e., in the third direction Z). This allows the distance from the sensor 10 to each head (e.g., HD1, HD2) to be calculated.

[0073] The controller 450 controls the first PT, the second MT, the inkjet head module 420 , the sensor 510 , and the like.

[0074] Specifically, the controller 450 positions the inkjet head module 420 in the upper portion of the intermediate space IS. Here, the controller 450 causes the sensor 10 to measure a first distance H1 to the first head HD1 and a second distance H2 to the second head HD2. The controller 450 calculates a first height difference G1 between the first distance H1 and the second distance H2. Based on the first height difference G1, the controller 450 controls the inkjet head module 420 so that a first ejection velocity v1 of the first chemical liquid ejected from the first head HD1 and a second ejection velocity v2 of the second chemical liquid ejected from the second head HD2 are different.

[0075] For example, if the first distance H1 is greater than the second distance H2, the controller 450 controls so that the first ejection velocity v1 of the first chemical liquid is greater than the second ejection velocity v2 of the second chemical liquid. Conversely, if the first distance H1 is less than the second distance H2, the controller 450 controls so that the first ejection velocity v1 of the first chemical liquid is less than the second ejection velocity v2 of the second chemical liquid.

[0076] Figure 11 This is a flow chart for illustrating a substrate processing method according to another embodiment of the present invention. Figures 1 to 10 The following description will be mainly based on the differences.

[0077] Reference Figures 9 to 11 , an inkjet head module provided with a first head HD1 and a second head HD2 is provided (S10).

[0078] Specifically, the substrate processing device includes a first PT mainly used in routine operations, a second MT mainly used in test operations, a frame 410 spanning the first PT and the second MT, an inkjet head module 420 moving along the frame 410, and a sensor 510 arranged in the intermediate space IS between the first PT and the second MT.

[0079] Next, the first height difference between the first head HD1 and the second head HD2 is calculated (refer to Figure 4 For example, when the inkjet head module 420 is located at the upper portion of the intermediate space IS, the controller 450 may use the sensor 10 to measure a first distance H1 to the first head HD1 and a second distance H2 to the second head HD2, and calculate a first height difference G1 that is the difference between the first distance H1 and the second distance H2.

[0080] Next, based on the first height difference G1, control is performed so that the first ejection velocity v1 of the first chemical liquid ejected from the first head HD1 and the second ejection velocity v2 of the second chemical liquid ejected from the second head HD2 differ (S30). For example, the controller 450 may control the voltage supplied to the first piezoelectric element electrically connected to the first head HD1 and the voltage supplied to the second piezoelectric element electrically connected to the second head HD2 to differ. The first piezoelectric element controls whether the first chemical liquid is ejected, while the second piezoelectric element controls whether the second chemical liquid is ejected.

[0081] Next, the first ejection speed v1 and the second ejection speed v2 are checked ( S40 ).

[0082] Specifically, in step S30 , the voltages supplied to the piezoelectric elements connected to the first head HD1 and the second head HD2 are made different, and it is checked whether the first ejection velocity v1 and the second ejection velocity v2 are changed by amounts corresponding to target values ​​due to the voltages.

[0083] The first ejection velocity v1 and the second ejection velocity v2 can be measured using a drop watcher, but are not limited thereto.

[0084] In addition, like using Figure 8 As described, the first head HD1 includes a plurality of first columns R1, R2, R3, R4, and R5. The ejection velocity of the first chemical liquid ejected from the first nozzles 881, 882, and 883 at several locations within the first column R1 can be measured using an ink droplet scope. The average of the measured ejection velocities is then calculated and used as the ejection velocity of the first chemical liquid ejected from the first column R1. This method can be used to calculate the ejection velocities of the remaining first columns R2, R3, R4, and R5. The average of the calculated ejection velocities of the plurality of first columns R1, R2, R3, R4, and R5 is then used as the first ejection velocity v1 of the first chemical liquid ejected from the first head HD1.

[0085] The second ejection velocity v2 of the second chemical liquid 62 ejected from the second head HD2 can also be calculated by the above-described method.

[0086] It is checked whether the first ejection velocity v1 and the second ejection velocity v2 calculated in this manner have changed by an amount corresponding to the target value.

[0087] Next, printing is performed using the first head HD1 and the second head HD2, and the drop position is checked (S50).

[0088] Specifically, the inkjet head module 420 is moved toward the top of the second MT. The inkjet head module 420 ejects a chemical solution onto at least one test substrate positioned on the second MT (i.e., prints). The appropriate drop position of the chemical solution ejected onto the test substrate is checked. Specifically, the drop position is compared with the desired position.

[0089] Next, it is checked whether the height of the head has changed (S60).

[0090] Specifically, when the inkjet head module 420 passes through the intermediate space IS where the sensor 10 is located, the sensor 10 can constantly check whether the height of the inkjet head module 420 has changed. The sensor 10 can check whether the height of the inkjet head module 420 has changed each time the inkjet head module 420 passes through the intermediate space IS, or it can check whether the height of the inkjet head has changed at a predetermined period.

[0091] If the head height has changed (yes), the first ejection speed and the second ejection speed are revised (S70). If the head height has not changed (no), the first ejection speed and the second ejection speed are not revised.

[0092] Figure 12 This is a flowchart for explaining a substrate processing method according to another embodiment of the present invention.

[0093] Reference Figure 12 , enters maintenance mode (S91). Next, the sensor 10 is used to check whether the height of the inkjet head module 420 has changed (S93). If the height of the head has changed (yes), the ejection speed of the head is adjusted (S95). If the height of the head has not changed (no), the ejection speed of the head is not adjusted. In this way, the height change of the inkjet head module 420 can be checked only when entering maintenance mode instead of being checked at all times.

[0094] While the embodiments of the present invention have been described above with reference to the accompanying drawings, it should be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, it should be understood that the embodiments described above are illustrative in all respects and are not restrictive.

Claims

1. A substrate processing method, comprising: Providing an inkjet head module provided with a first head and a second head; measuring a first distance from the sensor to the first head and a second distance from the sensor to the second head using a sensor, and calculating a first height difference which is the difference between the first distance and the second distance; and Based on the first height difference, control is performed such that a first ejection velocity of the first chemical liquid ejected from the first head and a second ejection velocity of the second chemical liquid ejected from the second head become different from each other.

2. The substrate processing method according to claim 1, wherein: The sensor is provided in a substrate processing device, The substrate processing device comprises: Channel 1; a second station, separated from said first station; a rack, arranged on the first and second platforms to span the first and second platforms; and The inkjet head module moves along the frame and sprays liquid medicine.

3. The substrate processing method according to claim 2, wherein: The sensor is arranged below the rack in the intermediate space between the first stage and the second stage. Measuring the first distance and the second distance using the sensor includes: When the inkjet head module is located at an upper portion of the intermediate space, the sensor measures the first distance and the second distance.

4. The substrate processing method according to claim 1, wherein: Measuring the first distance and the second distance using the sensor includes: The inkjet head module is assembled in a jig system, and then, with the inkjet head module positioned in the jig system, the sensor measures the first distance and the second distance while moving below the jig system.

5. The substrate processing method according to claim 1, wherein: If the first head is positioned higher than the second head, the first ejection speed of the first chemical liquid is faster than the second ejection speed of the second chemical liquid.

6. The substrate processing method according to claim 1, wherein: The first head includes a plurality of columns, each of which includes a plurality of nozzles. The substrate processing method further comprises: calculating, using the sensor, a second height difference between the plurality of columns from the sensor; and Based on the second height difference, control is performed such that the ejection speed of the first chemical liquid varies for each of the columns.

7. The substrate processing method according to claim 1, wherein: The first head includes a plurality of columns, each of which includes a plurality of nozzles. The substrate processing method further comprises: calculating, using the sensor, a third height difference between the plurality of nozzles from the sensor; and Based on the third height difference, control is performed such that the ejection speed of the first chemical liquid varies for each of the nozzles.

8. The substrate processing method according to claim 1, wherein: The first head is connected to a pressure regulating unit, and the pressure regulating unit includes a piezoelectric element for controlling whether to eject the first chemical liquid. Controlling the first ejection velocity includes: The magnitude of the voltage supplied to the piezoelectric element is controlled.

9. The substrate processing method according to claim 1, wherein: After performing control so that the first ejection speed and the second ejection speed are different from each other, the method further includes: A first ejection velocity of the first chemical liquid ejected from the first head and a second ejection velocity of the second chemical liquid ejected from the second head are confirmed.

10. The substrate processing method according to claim 9, wherein: The first head includes a plurality of nozzles, Confirm that the first ejection velocity of the first chemical liquid includes: The ejection speeds of the first chemical liquid ejected from several nozzles selected from the plurality of nozzles are calculated, and an average value of the calculated ejection speeds is determined as a first ejection speed of the first chemical liquid.

11. The substrate processing method according to claim 1, wherein: After performing control so that the first ejection speed and the second ejection speed are different from each other, the method further includes: using the first head to eject the first chemical solution onto the test substrate, and using the second head to eject the second chemical solution onto the test substrate; as well as The dropping positions of the first chemical solution and the second chemical solution formed on the test substrate are compared with theoretical positions.

12. A substrate processing method, comprising: Providing an inkjet head module provided with a first head and a second head; measuring a first distance from the sensor to the first head and a second distance from the sensor to the second head using a sensor; calculating a first height difference as a difference between the first distance and the second distance; Based on the first height difference, controlling the first voltage supplied to the first piezoelectric element connected to the first head and the second voltage supplied to the second piezoelectric element connected to the second head to be different, thereby controlling a first ejection velocity of the first chemical liquid ejected from the first head and a second ejection velocity of the second chemical liquid ejected from the second head to be different; and A first ejection velocity of the first chemical liquid ejected from the first head and a second ejection velocity of the second chemical liquid ejected from the second head are confirmed.

13. The substrate processing method according to claim 12, wherein: If the first head is positioned higher than the second head, the first ejection speed of the first chemical liquid is faster than the second ejection speed of the second chemical liquid.

14. The substrate processing method according to claim 12, wherein: The first head includes a plurality of nozzles, Confirm that the first ejection velocity of the first chemical liquid includes: The ejection speeds of the first chemical liquid ejected from several nozzles selected from the plurality of nozzles are calculated, and an average value of the calculated ejection speeds is determined as a first ejection speed of the first chemical liquid.

15. A substrate processing apparatus, comprising: Channel 1; a second station, separated from said first station; a rack, arranged on the first and second platforms to span the first and second platforms; an inkjet head module, moving along the frame, comprising a first head and a second head; a sensor disposed below the rack in an intermediate space between the first stage and the second stage; and The controller uses the sensor to measure the first distance from the sensor to the first head and the second distance from the sensor to the second head when the inkjet head module is located at the upper part of the intermediate space, calculates the first height difference between the first distance and the second distance, and controls based on the first height difference so that the first ejection speed of the first liquid ejected from the first head and the second ejection speed of the second liquid ejected from the second head are different.

16. The substrate processing apparatus according to claim 15, wherein: If the first distance is greater than the second distance, the controller controls so that the first ejection speed of the first chemical liquid is faster than the second ejection speed of the second chemical liquid.

17. The substrate processing apparatus according to claim 15, wherein: The first head is connected to a pressure regulating unit including a piezoelectric element for controlling whether to eject the first chemical liquid. The controller controls the voltage supplied to the piezoelectric element to control a first ejection speed of the first chemical liquid.

18. The substrate processing apparatus according to claim 15, wherein: After controlling so that the first ejection speed and the second ejection speed are different from each other, The controller checks a first ejection speed of the first chemical liquid ejected from the first head and a second ejection speed of the second chemical liquid ejected from the second head.

19. The substrate processing apparatus according to claim 15, wherein: After controlling the first ejection speed and the second ejection speed to be different from each other, The controller controls the first head to eject the first chemical liquid onto the test substrate and the second head to eject the second chemical liquid onto the test substrate, and compares the drop positions of the first chemical liquid and the second chemical liquid formed on the test substrate with theoretical positions.

Images