Thermally conductive structure, battery, electronic device, and method for manufacturing thermally conductive structure

Abstract

The application discloses a heat-conducting structure, a battery, an electronic device and a preparation method of the heat-conducting structure, and relates to the technical field of heat-conducting structures. The heat-conducting structure comprises a heat-conducting base layer, an isolation layer and a graphite layer. The base layer is made of an electrically-conductive metal material, the isolation layer is arranged on the heat-conducting base layer, the isolation layer is made of a nickel-chromium alloy material, and the graphite layer is arranged on the side of the isolation layer that is away from the heat-conducting base layer. The heat-conducting structure is light, simple and compact. The isolation layer made of the nickel-chromium alloy material is arranged on the heat-conducting structure, the electrically-conductive property of the nickel-chromium alloy is utilized to strengthen the battery shielding effect of the heat-conducting structure, the corrosion resistance of the nickel-chromium alloy is utilized to effectively protect the heat-conducting base layer, the heat-conducting base layer made of the electrically-conductive metal material is prevented from being oxidized or corroded, and therefore the heat-conducting and electrically-conductive properties of the heat-conducting base layer remain stable, so that the service life of the heat-conducting structure is prolonged. The graphite layer made of the graphite material with extremely high heat transfer coefficient is arranged on the isolation layer, and the heat dissipation performance of the heat-conducting structure is further improved.

Description

Technical Field

[0001] This invention relates to the field of thermally conductive materials technology, and in particular to a thermally conductive structure, a battery, an electronic device, and a method for preparing the thermally conductive structure. Background Technology

[0002] Electronic components (such as batteries) generate a significant amount of heat and a magnetic field of a certain intensity during operation. To prevent excessively high operating temperatures, thus extending the lifespan and ensuring safety of these components, and to shield the magnetic fields generated by them to reduce interference between different components, related technologies often employ a thermally conductive structure on the battery surface. This structure consists of a graphite layer with high thermal transfer efficiency and a conductive cloth with magnetic field shielding capabilities. The graphite layer is attached to the battery surface, while the conductive cloth is located on the side of the graphite layer facing away from the battery. However, the relatively large thickness of the conductive cloth hinders miniaturization of electronic devices. Furthermore, because the graphite layer adheres to the surface of the conductive cloth, it is prone to separation from the conductive cloth upon impact, affecting thermal conductivity. Summary of the Invention

[0003] This invention discloses a thermally conductive structure, a battery, an electronic device, and a method for preparing the thermally conductive structure. The structure has high heat transfer efficiency and magnetic field shielding performance, while being thin, simple in structure, and stable in performance.

[0004] To achieve the above objectives, in a first aspect, the present invention discloses a heat-conducting structure, comprising:

[0005] A thermally conductive substrate, wherein the thermally conductive substrate is a conductive metal layer;

[0006] An insulating layer, wherein the insulating layer is disposed on the thermally conductive base layer, and the insulating layer is a nickel-chromium alloy layer; and,

[0007] A graphite layer is disposed on the side of the insulating layer opposite to the thermally conductive substrate.

[0008] As an optional implementation, in an embodiment of the first aspect of the present invention, the chromium content in the isolation layer is a, where 5% ≤ a ≤ 30%.

[0009] As an optional implementation, in an embodiment of the first aspect of the present invention, the isolation layer is formed on the thermally conductive substrate by magnetron sputtering.

[0010] As an optional implementation, in an embodiment of the first aspect of the present invention, the thermally conductive structure has a total thickness t, 0.03 mm ≤ t ≤ 0.04 mm, the insulating layer has a first thickness h1, 60 nm ≤ h1 ≤ 300 nm, and the graphite layer has a second thickness h2, 20 nm ≤ h2 ≤ 100 nm.

[0011] As an optional implementation, in an embodiment of the first aspect of the present invention, the side of the graphite layer facing away from the isolation layer has a surface impedance Z, Z≤150mΩ.

[0012] As an optional implementation, in an embodiment of the first aspect of the present invention, the graphite layer is sputtered and formed on the side of the isolation layer opposite to the thermally conductive substrate, the surface of the graphite layer opposite to the isolation layer is a non-smooth surface, and the thermally conductive structure further includes an ink layer, the ink layer being screen-printed on the surface of the graphite layer opposite to the isolation layer.

[0013] As an optional implementation, in an embodiment of the first aspect of the present invention, the thermally conductive substrate has a first side and a second side opposite to each other, the insulating layer is disposed on the surface of the first side of the thermally conductive substrate, and the thermally conductive structure further includes an adhesive layer disposed on the surface of the second side of the thermally conductive substrate.

[0014] Secondly, the present invention discloses a method for preparing a thermally conductive structure, comprising:

[0015] Provide a thermally conductive substrate;

[0016] An isolation layer is formed on the thermally conductive base layer;

[0017] A graphite layer is formed on the side of the insulating layer opposite to the thermally conductive base layer;

[0018] The isolation layer is made of nickel-chromium alloy.

[0019] As an optional implementation, in an embodiment of the second aspect of the present invention, forming an insulating layer on the thermally conductive substrate includes:

[0020] The insulating layer is formed by magnetron sputtering of metallic nickel and chromium onto the thermally conductive substrate.

[0021] As an alternative implementation, in an embodiment of the second aspect of the invention, the graphite layer is formed by magnetron sputtering on the side of the insulating layer opposite to the thermally conductive substrate.

[0022] Thirdly, the present invention discloses a battery, including a battery body and a thermally conductive structure as described in the first aspect above, wherein the thermally conductive base layer of the thermally conductive structure is applied to the surface of the battery body.

[0023] Fourthly, the present invention discloses an electronic device, comprising:

[0024] A device housing having an accommodating space; and,

[0025] As described in the first aspect above, the heat-conducting structure is disposed within the accommodating space, or...

[0026] The electronic device includes the battery as described in the third aspect above, and the battery is disposed within the accommodating space.

[0027] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0028] The present invention provides a thermally conductive structure, a battery, an electronic device, and a method for fabricating the thermally conductive structure. The thermally conductive structure includes a thermally conductive base layer, an insulating layer, and a graphite layer stacked together, resulting in a thin, simple, and compact structure. By covering the thermally conductive structure with a nickel-chromium alloy insulating layer, the conductivity of the nickel-chromium alloy enhances the battery shielding effect of the thermally conductive structure, and the corrosion resistance of the nickel-chromium alloy effectively protects the thermally conductive base layer, preventing oxidation or corrosion of the conductive metal base layer. This ensures stable thermal and electrical conductivity of the base layer, thereby extending the service life of the thermally conductive structure. Furthermore, by covering the insulating layer with a graphite layer containing a graphite material with an extremely high heat transfer coefficient, the heat dissipation performance of the thermally conductive structure is further improved. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of a heat-conducting structure disclosed in the first aspect of the embodiments of this application;

[0031] Figure 2 This is another schematic diagram of the heat-conducting structure disclosed in the first aspect of the embodiments of this application;

[0032] Figure 3 This is a schematic flowchart of a method for preparing a thermally conductive structure disclosed in the second aspect of the embodiments of this application;

[0033] Figure 4 This is another schematic flowchart of the method for preparing the thermally conductive structure disclosed in the second aspect of the embodiments of this application;

[0034] Figure 5This is a schematic diagram of the battery structure disclosed in the third aspect of the embodiments of this application;

[0035] Figure 6 This is a schematic diagram of the structure of an electronic device disclosed in the fourth aspect of the embodiments of this application;

[0036] Figure 7 This is another structural schematic diagram of the electronic device disclosed in the fourth aspect of the embodiments of this application.

[0037] Icons: 1. Thermally conductive structure; 10. Thermally conductive base layer; 100. First side; 101. Second side; 11. Insulation layer; 12. Graphite layer; 13. Adhesive layer; 14. Ink layer; 2. Battery; 20. Battery body; 3. Electronic device; 30. Device housing; 300. Accommodation space; 31. Antenna. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing the invention and its embodiments, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation.

[0040] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in certain situations to indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0041] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0042] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0043] Electronic components (such as batteries) generate a significant amount of heat and a magnetic field of a certain intensity during operation. To prevent excessively high operating temperatures, thus extending the lifespan and ensuring safety of these components, and to shield the magnetic fields generated by them to reduce interference between different components, related technologies often employ a thermally conductive structure on the battery surface. This structure consists of a graphite layer with high thermal transfer efficiency and a conductive cloth with magnetic field shielding capabilities. The graphite layer is attached to the battery surface, while the conductive cloth is located on the side of the graphite layer facing away from the battery. However, the relatively large thickness of the conductive cloth hinders miniaturization of electronic devices. Furthermore, because the graphite layer adheres to the surface of the conductive cloth, it is prone to separation from the conductive cloth upon impact, affecting thermal conductivity.

[0044] Based on this, this application provides a thermally conductive structure with high thermal conductivity, small overall thickness, and stable structure, making it less prone to delamination. This thermally conductive structure can be applied to the surface of a battery, which can be installed in electronic devices (such as smartwatches, mobile phones, or computers), thereby rapidly dissipating heat generated by electronic components (such as control chips) during operation. This prevents overheating of the electronic device, which could damage its components and extend its lifespan. It also prevents burns to the user when the device comes into contact with their skin (e.g., when the user's wrist is in close contact with the watch case), improving the safety of the electronic device. Simultaneously, the conductive structure can also provide bidirectional shielding against the magnetic fields generated by the battery and the electronic components, ensuring the normal operation of the electronic device.

[0045] The technical solution of the present invention will be further described below with reference to the embodiments and accompanying drawings.

[0046] Please see Figure 1 , Figure 1This is a schematic diagram of a heat-conducting structure disclosed in the first aspect of the present application. The first aspect of the present application discloses a heat-conducting structure 1, including: a heat-conducting base layer 10, an isolation layer 11, and a graphite layer 12. The base layer is made of a conductive metal material, the isolation layer 11 is covered on the heat-conducting base layer 10, and the isolation layer 11 is made of a nickel-chromium alloy. The graphite layer 12 is covered on the side of the isolation layer 11 opposite to the heat-conducting base layer 10. The heat-conducting structure 1 is thin, simple, and compact.

[0047] It is understandable that by using a heat-conducting base layer 10 made of conductive metal, the heat-conducting structure 1 can generate a large induced current under the action of electromagnetic waves by utilizing the conductivity of the conductive metal. According to Lenz's law, this induced current can resist the electromagnetic waves to achieve the electromagnetic wave shielding function. Furthermore, since the conductive metal has a high thermal conductivity, it can improve the heat transfer efficiency of the heat-conducting structure 1. At the same time, by utilizing the ductility and toughness of the conductive metal, the heat-conducting base layer 10 can meet the strength requirements even when it is thin, that is, the heat-conducting structure 1 is not easily damaged by being pulled.

[0048] Furthermore, by covering the heat-conducting structure 1 with a nickel-chromium alloy insulating layer 11, the conductivity of the nickel-chromium alloy can enhance the battery shielding effect of the heat-conducting structure 1, and the corrosion resistance of the nickel-chromium alloy can effectively protect the heat-conducting base layer 10, preventing oxidation of the conductive metal heat-conducting base layer 10. This ensures the stability of the thermal and electrical conductivity of the heat-conducting base layer 10, thereby extending the service life of the heat-conducting structure 1. Simultaneously, this application further enhances the heat dissipation performance of the heat-conducting structure 1 by covering the insulating layer 11 with a graphite layer 12, which has an extremely high thermal transfer coefficient. The extremely high stability of the graphite layer 12 also provides chemical protection, improving the salt spray resistance of the conductive structure.

[0049] For ease of description, the direction from the thermally conductive base layer 10 to the isolation layer 11 is defined as the thickness direction X, as follows: Figure 1 As shown, Figure 1 The arrow in the figure indicates the thickness direction X.

[0050] Optionally, such as Figure 1 As shown, along the thickness direction X, the thermally conductive structure 1 has a total thickness t. Since the thermally conductive structure 1 is used in batteries and electronic devices, it should be as thin and light as possible within the technically feasible range. Therefore, the total thickness t of the thermally conductive structure 1 can satisfy: 0.03mm ≤ t ≤ 0.04mm. For example, the total thickness t of the thermally conductive structure 1 can be 0.030mm, 0.031mm, 0.032mm, 0.033mm, 0.034mm, 0.035mm, 0.036mm, 0.037mm, 0.038mm, 0.039mm, or 0.040mm, etc.

[0051] As can be seen, the heat-conducting structure 1 in this embodiment is an ultra-thin heat-conducting structure. When applied to batteries and electronic devices, it can reduce the space occupied by electronic devices and meet the requirements of thin and light design of electronic devices.

[0052] Preferably, considering the structure, manufacturing process, and strength requirements of the heat-conducting structure 1, the total thickness t of the heat-conducting structure 1 can satisfy: 0.033mm≤t≤0.034mm. For example, the total thickness t of the heat-conducting structure 1 can be 0.0330mm, 0.0331mm, 0.0332mm, 0.0333mm, 0.0334mm, 0.0335mm, 0.0336mm, 0.0337mm, 0.0338mm, 0.0339mm, or 0.0340mm, etc.

[0053] Next, the structure of each layer of the heat-conducting structure 1 will be described in detail with reference to the attached drawings.

[0054] Please continue reading. Figure 1 In some embodiments, the thermally conductive base layer 10 may be a thin film made of conductive metal, thereby enabling an ultra-thin design of the thermally conductive structure 1.

[0055] Optionally, the thermally conductive base layer 10 can be made of copper, which has good electrical conductivity, thermal conductivity, toughness, and ductility, and is also low in cost. This results in good electromagnetic wave shielding and thermal conductivity performance of the thermally conductive base layer 10, allowing it to be thinner and less prone to breakage. This achieves a lightweight design for the thermally conductive structure 1 while maintaining structural stability and reducing manufacturing costs. It is understood that in other embodiments, the thermally conductive base layer 10 can also be made of other metals such as silver or aluminum.

[0056] In some embodiments, the isolation layer 11 can be formed on the thermally conductive base layer 10 by magnetron sputtering, thereby enabling the nickel-chromium alloy to be uniformly covered on the thermally conductive base layer 10 and forming a nano-scale thin film. At the same time, the isolation layer 11 has strong adhesion to the surface of the thermally conductive base layer 10, so that the isolation layer 11 is not easy to detach from the thermally conductive base layer 10, and the structure of the thermally conductive structure 1 is stable.

[0057] It should be noted that since nickel is a magnetic material, its own magnetism can attract or repel the magnetron sputtering equipment during the magnetron sputtering process, resulting in low sputtering uniformity and low sputtering efficiency. However, by using non-magnetic chromium to form an alloy with nickel, the magnetism of nickel can be reduced, thereby improving the magnetron sputtering efficiency of the isolation layer 11 and reducing production energy consumption. At the same time, since chromium is inexpensive and readily available, the material cost of the isolation layer 11 can be reduced.

[0058] Furthermore, both chromium and nickel possess excellent corrosion resistance; however, chromium has a higher resistivity than nickel. Therefore, to reduce the resistivity of the isolation layer 11 and enhance its electromagnetic shielding function for the heat-conducting structure 1, the chromium content in the nickel-chromium alloy comprising the isolation layer 11 should not be excessive. Specifically, the chromium content percentage in the isolation layer 11 is 'a', which can satisfy the following condition: 5% ≤ a ≤ 30%. For example, the chromium content percentage 'a' in the isolation layer 11 can be 5%, 7%, 10%, 12%, 15%, 18%, 20%, 22%, 25%, 27%, or 30%, etc.

[0059] In some implementations, such as Figure 1 As shown, along the thickness direction X, the isolation layer 11 has a first thickness h1. In order to achieve the function of isolating the surface of the heat-conducting base layer 10 from the external environment and to improve the corrosion resistance of the isolation layer 11, thereby protecting the heat-conducting base layer 10, the isolation layer 11 should have a certain thickness. At the same time, in order to achieve the thinness of the heat-conducting structure 1, the thickness of the isolation layer 11 should not be too thick. Based on this, the first thickness h1 can satisfy: 60nm≤h1≤300nm. For example, the first thickness h1 can be 60nm, 70nm, 80nm, 90nm, 100nm, 150nm, 200nm, 250nm or 300nm, etc.

[0060] In some embodiments, the insulating layer 11 may be applied to any one surface of the thermally conductive base layer 10 along the thickness direction X, or it may be applied to both surfaces of the thermally conductive base layer 10. For example... Figure 1 As shown, in one optional example, the thermally conductive base layer 10 has a first side 100 and a second side 101 opposite to each other along the thickness direction X. An isolation layer 11 is disposed on the surface of the first side 100 of the thermally conductive base layer 10, so that the isolation layer 11 can be used to isolate the surface of the first side 100 of the thermally conductive base layer 10 from the external environment to prevent the surface of the first side 100 of the thermally conductive base layer 10 from oxidation or corrosion.

[0061] Furthermore, the heat-conducting structure 1 may also include an adhesive layer 13, which is applied to the surface of the second side 101 of the heat-conducting base layer 10. The adhesive layer 13 is used to bond to external components (such as batteries, electronic device housings, etc.) to fix the heat-conducting structure 1 to the external components. At the same time, applying the adhesive layer 13 to the surface of the second side 101 of the heat-conducting base layer 10 can isolate the second side 101 of the heat-conducting base layer 10 from the external environment to prevent oxidation or corrosion of the surface of the second side 101 of the heat-conducting base layer 10. The heat-conducting structure 1 has a simple and compact structure and good corrosion resistance.

[0062] Please see Figure 2In another alternative example, the isolation layer 11 is applied to both sides of the thermally conductive base layer 10 along the thickness direction X. In other words, the isolation layer 11 is provided on both opposite sides of the thermally conductive base layer 10, thereby enabling the thermally conductive base layer 10 to be more comprehensively isolated from the external environment through the isolation layer 11, so as to better protect the thermally conductive base layer 10 and prevent the surface of the thermally conductive base layer 10 from oxidation or corrosion.

[0063] At this time, the heat-conducting structure 1 may also include an adhesive layer 13. The adhesive layer 13 may be applied to any side of the heat-conducting base layer 10 along the thickness direction X. That is, the adhesive layer 13 may be applied to the first side 100 or the second side 101 of the heat-conducting base layer 10. The adhesive layer 13 is used to bond to external components (such as batteries, electronic device housings, etc.) to fix the heat-conducting structure 1 to the external components.

[0064] Please refer to the following: Figure 1 and Figure 2 In some embodiments, in order to improve the electromagnetic wave shielding effect of the heat-conducting structure 1, the surface resistance of the heat-conducting structure 1 should be relatively small. Based on this, the surface of the graphite layer 12 facing away from the isolation layer 11 has a surface resistance Z, which can satisfy: Z≤150mΩ. For example, the surface resistance Z of the graphite layer 12 can be 150mΩ, 120mΩ, 100mΩ, 80mΩ, 60mΩ, 55mΩ, 50mΩ, 45mΩ, 40mΩ, 35mΩ, 30mΩ, 25mΩ, or 20mΩ, etc.

[0065] In some implementations, such as Figure 1 As shown, along the thickness direction X, the graphite layer 12 has a second thickness h2. In order to prevent the graphite layer 12 from easily breaking when it deforms along with the heat-conducting base layer 10, that is, to keep the heat dissipation effect of the graphite layer 12 stable, the graphite layer 12 should have a certain thickness. At the same time, in order to achieve the thin and light design of the heat-conducting structure 1, the thickness of the graphite layer 12 should not be too thick. Based on this, the second thickness h2 can satisfy: 20nm≤h2≤100nm. For example, the second thickness h2 can be 20nm, 25nm, 30nm, 35nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm or 100nm, etc.

[0066] In some embodiments, the graphite layer 12 can be formed by magnetron sputtering on the side of the isolation layer 11 away from the thermally conductive substrate, thereby making the graphite layer 12 and the isolation layer 11 more tightly bonded. During use, the graphite layer 12 is less likely to separate from the isolation layer 11, and the structure of the thermally conductive structure 1 is more stable.

[0067] Furthermore, since the graphite layer 12 is formed by magnetron sputtering on the side of the isolation layer 11 away from the heat-conducting base layer 10, the surface of the graphite layer 12 away from the isolation layer 11 can be formed as a non-smooth surface, thereby increasing the surface area of ​​the graphite layer 12, increasing the effective heat exchange area, and improving the heat dissipation efficiency of the heat-conducting structure 1.

[0068] In some embodiments, the heat-conducting structure 1 may further include an ink layer 14, which is screen-printed on the surface of the graphite layer 12 facing away from the isolation layer 11. The ink layer 14 is used to form at least one of text, symbols, QR codes, barcodes, and patterns to record information for user reading or machine scanning. It is understood that this information may be at least one of the parameters, performance, usage instructions, and storage instructions of the heat-conducting structure 1 itself, or at least one of the parameters, performance, usage instructions, and storage instructions of external components (such as batteries, chips, electronic devices, etc.) using the heat-conducting structure 1. It is understood that the ink layer 14 may only cover a portion of the surface of the graphite layer 12 to form text, symbols, QR codes, barcodes, or patterns; that is, the ink layer 14 may be a discontinuous structure.

[0069] As mentioned above, the side of the graphite layer 12 facing away from the isolation layer 11 can be formed as a non-smooth surface. In this case, the surface area of ​​the graphite layer 12 is large, which can improve the adhesion between the ink layer 14 and the graphite layer 12, making the ink layer 14 less likely to fall off, and the structure of the heat-conducting structure 1 is more stable.

[0070] It should be noted that, in order to ensure the electromagnetic wave shielding function of the heat-conducting structure 1, the ink layer 14 should not have a significant impact on the surface resistance of the graphite layer 12.

[0071] It should also be noted that this application conducted multiple performance tests on the heat-conducting structure 1 disclosed in this application, and the experimental results are as follows:

[0072]

[0073]

[0074] Furthermore, taking the thermally conductive structure 1 used to cover the battery surface of an electronic watch as an example, an electronic watch typically includes a device housing, a display screen, electronic components, and a battery. The display screen is located on one side of the device housing, and the surface of the device housing facing away from the display screen forms the back of the electronic watch. When the electronic watch is worn on the user's wrist, this back is in contact with the user's skin. Both the electronic components and the battery are housed within the device housing. To prevent the heat generated by the electronic components during operation from causing the back of the device housing to overheat and burn the user, the temperature of the back of the device housing should be maintained below 44°C. Based on this, the applicant placed a battery with a surface covered by the thermally conductive structure 1, nickel-plated copper foil transparent adhesive, and 77µm thick conductive graphite cloth on the side of the electronic components facing the display screen. This was to conduct the heat dissipated by the electronic components to the display screen. The temperatures of the display screen and the back of the device housing were measured during the use of the electronic watch, and the experimental results are as follows:

[0075] Test Project Thermally conductive structure 1 Nickel-plated copper foil transparent adhesive 77um thick conductive cloth graphite Duration 16.6 16.5 16.1 Temperature difference 5.6 5.2 4.5

[0076] In the table above, the duration represents the time (in minutes) from when the electronic watch is turned on until the display surface reaches 48°C or the back of the device casing reaches 43°C. The temperature difference in the table above represents the temperature difference (°C) between the temperature of the display surface and the temperature of the back of the device casing when the electronic watch has been working for a period of time and the surface temperature of the electronic watch remains relatively stable.

[0077] As can be seen from the table above, the heat conduction structure 1 of this embodiment has better heat conduction and heat dissipation effects.

[0078] In summary, compared with other heat-conducting structures in related technologies (such as nickel-plated copper foil transparent adhesive and 77um thick conductive cloth graphite), the heat-conducting structure 1 disclosed in this application has a significant improvement in heat conduction performance, while maintaining a low surface resistivity, a thin overall structure thickness, good structural stability, is not prone to delamination, and has good corrosion resistance. In other words, the overall performance of the heat-conducting structure 1 has been comprehensively improved.

[0079] The first aspect of this application discloses a heat-conducting structure 1, comprising an adhesive layer 13, a heat-conducting base layer 10, an insulating layer 11, a graphite layer 12, and an ink layer 14 stacked sequentially. It offers diverse and integrated functions, and features a simple and compact structure. By using the heat-conducting base layer 10 made of conductive metal, electromagnetic wave shielding can be achieved. Furthermore, due to the high thermal conductivity of conductive metal, the heat transfer efficiency of the heat-conducting structure 1 can be improved. Simultaneously, the ductility and toughness of conductive metal allow the heat-conducting base layer 10 to maintain sufficient strength even with a relatively thin thickness, preventing damage from pulling.

[0080] Furthermore, by covering the heat-conducting structure 1 with an insulating layer 11 made of nickel-chromium alloy, the battery shielding effect of the heat-conducting structure 1 can be enhanced by utilizing the conductivity of nickel-chromium alloy, and the corrosion resistance of nickel-chromium alloy can effectively protect the heat-conducting base layer 10, preventing the oxidation of the conductive metal heat-conducting base layer 10, thereby keeping the thermal and electrical conductivity of the heat-conducting base layer 10 stable and extending the service life of the heat-conducting structure 1.

[0081] Furthermore, by covering the isolation layer 11 with a graphite layer 12 of graphite material with an extremely high thermal transfer coefficient, the heat dissipation performance of the heat-conducting structure 1 can be further improved. Moreover, the extremely high stability of the graphite layer 12 can also play a role in chemical protection, improving the salt spray resistance of the conductive structure. Furthermore, by forming the graphite layer 12 on the isolation layer 11 through magnetron sputtering, the graphite layer 12 and the isolation layer 11 are more tightly bonded, making the structure of the heat-conducting structure 1 more stable.

[0082] Please refer to the following: Figure 3 and Figure 4 , Figure 3 This is a textual flowchart illustrating the method for preparing the thermally conductive structure disclosed in the second aspect of the embodiments of this application. Figure 4 This is a schematic diagram of the fabrication method of the thermally conductive structure disclosed in the second aspect of this application. The second aspect of this application discloses a method for fabricating a thermally conductive structure 1, including the following steps:

[0083] S1. Provide a thermally conductive base layer 10.

[0084] The thermally conductive base layer 10 is a thin film made of conductive metal. This base layer 10 serves to provide a shaped substrate for other structures included in the thermally conductive structure 1, thereby forming the thermally conductive structure 1, such as... Figure 4 As shown in a, Figure 4 The 'a' in the figure shows the thermally conductive base layer 10.

[0085] S2. An isolation layer 11 is formed on the heat-conducting base layer 10, wherein the isolation layer 11 is made of nickel-chromium alloy.

[0086] The purpose of forming an isolation layer 11 on the thermally conductive substrate 10 is to isolate the thermally conductive substrate 10 from the external environment, thereby preventing oxidation or corrosion of the thermally conductive substrate 10 and ensuring the stability of the thermal conductivity and electromagnetic wave shielding performance of the thermally conductive structure 1. Figure 4 As shown in b, Figure 4 b in the figure shows the formation of an insulating layer 11 on the thermally conductive base layer 10.

[0087] Optionally, step S2 may include the following steps:

[0088] S20. Metallic nickel and chromium are magnetron sputtered onto the thermally conductive substrate 10 to form an isolation layer 11.

[0089] By magnetron sputtering nickel and chromium metals onto the thermally conductive substrate 10 to form an isolation layer 11, a uniform ultra-thin coating of the isolation layer 11 can be formed on the surface of the thermally conductive substrate 10. At the same time, the bond between the isolation layer 11 and the thermally conductive substrate 10 is made tighter, so that the isolation layer 11 is not easy to detach from the thermally conductive substrate 10, thus maintaining the isolation and protection effect of the isolation layer 11 on the thermally conductive substrate 10, and making the performance and structure of the thermally conductive structure 1 more stable and its service life longer.

[0090] It should be noted that since nickel is a magnetic material, its own magnetism can attract or repel the magnetron sputtering equipment during the magnetron sputtering process, resulting in low sputtering uniformity and low sputtering efficiency. However, by using non-magnetic chromium to form an alloy with nickel, the magnetism of nickel can be reduced, thereby improving the magnetron sputtering efficiency of the isolation layer 11 and reducing production energy consumption. At the same time, since chromium is inexpensive and readily available, the material cost of the isolation layer 11 can be reduced.

[0091] S3. A graphite layer 12 is formed on the side of the isolation layer 11 that is away from the heat-conducting base layer 10.

[0092] The graphite layer 12 is formed on the isolation layer 11 to utilize the high heat transfer efficiency and high chemical stability of graphite, thereby further enhancing the heat dissipation performance of the heat-conducting structure 1 and further improving its corrosion resistance. Figure 4 As shown in c, Figure 4 c in the figure shows the formation of a graphite layer 12 on the isolation layer 11.

[0093] Optionally, step S30 may include the following steps:

[0094] S30, the graphite layer 12 is formed by magnetron sputtering on the side of the isolation layer 11 away from the thermally conductive base layer 10.

[0095] By forming a graphite layer 12 on the heat-conducting base layer 10 through magnetron sputtering, a uniform ultra-thin coating of graphite layer 12 can be formed on the surface of the isolation layer 11. At the same time, the bonding between graphite layer 12 and isolation layer 11 is tighter, so that graphite layer 12 is less likely to separate from isolation layer 11 during use, and the structure of heat-conducting structure 1 is more stable.

[0096] Thirdly, please refer to Figure 5 , Figure 5 This is a schematic diagram of the battery structure disclosed in the third aspect of the embodiments of this application. This application also discloses a battery 2, including a battery body 20 and a heat-conducting structure 1 as described in the first aspect above. The heat-conducting base layer 10 of the heat-conducting structure 1 is covered on the surface of the battery body 20. Optionally, the battery body 20 may be a lithium battery 2, a dry cell battery 2, or a lead-acid battery 2.

[0097] Optionally, an adhesive layer 13 may be provided on the side of the thermal conductive base layer 10 facing the battery body 20. The adhesive layer 13 is used to bond to the surface of the battery body 20 so as to bond and fix the thermal conductive structure 1 to the surface of the battery body 20 as a whole, so that there is no gap between the thermal conductive structure 1 and the battery body 20, thereby enabling the thermal conductive structure 1 to directly dissipate heat to the surface of the battery body 20, resulting in good heat dissipation effect.

[0098] Understandably, at this time, an insulating layer 11 may be provided on the side of the thermally conductive base layer 10 facing away from the battery body 20 to isolate the thermally conductive base layer 10 from the external environment and prevent oxidation or corrosion. Furthermore, a graphite layer 12 may be provided on the side of the thermally conductive base layer 10 facing away from the battery body 20, thereby enabling high-rate heat exchange between the external environment and the graphite layer 12, thus improving the heat dissipation effect of the thermally conductive structure 1 on the battery body 20. Moreover, an ink layer 14 may be provided on the side of the graphite layer 12 facing away from the battery body 20. This ink layer 14 can be used to record at least one of the following information about the battery body 20: parameters, performance, usage instructions, storage instructions, etc., so that users can distinguish between different battery bodies 20.

[0099] The battery 2 disclosed in the third aspect of this application, by covering the surface of the battery body 20 with a heat-conducting structure 1, can accelerate the heat dissipation efficiency of the battery 2 during operation, thereby preventing the battery body 20 from overheating and causing damage or even explosion of the battery 2. This extends the service life of the battery 2 and improves its safety. Simultaneously, it can shield the electromagnetic waves generated by the battery body 20 during operation, blocking the propagation of these electromagnetic waves to the outside of the battery 2, thus preventing interference with the operation of other electronic components (such as antennas) outside the battery 2. Furthermore, because the heat-conducting structure 1 has a stable structure and stable performance, the structure and performance of the battery 2 are also easier to maintain, resulting in a longer service life. Additionally, because the heat-conducting structure 1 is simple, compact, and thin, the overall volume of the battery 2 can be reduced, enabling a thinner and lighter design.

[0100] Fourthly, please refer to the following: Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of the structure of an electronic device disclosed in the fourth aspect of the embodiments of this application. Figure 7This is another structural schematic diagram of the electronic device disclosed in the fourth aspect of the present application. The present application also discloses an electronic device 3, including: a device housing 30, and a heat-conducting structure 1 as described in the first aspect or a battery 2 as described in the third aspect. The device housing 30 has an accommodating space 300. Specifically, the electronic device 3 may include, but is not limited to, wearable devices (such as electronic watches, electronic armbands, electronic legbands, etc.), mobile phones, tablet computers, digital cameras, etc.

[0101] like Figure 6 As shown, in one optional embodiment, the electronic device 3 includes a heat-conducting structure 1 disposed within the accommodating space 300. The heat-conducting structure 1 is used to improve the heat dissipation efficiency of other electronic components (such as batteries, chips, etc.) disposed within the accommodating space 300.

[0102] Optionally, the heat-conducting structure 1 can be bonded to the device housing 30, thereby facilitating the direct transfer of heat from the heat-conducting structure 1 to the device housing 30 for heat exchange between the device housing 30 and the external environment of the electronic device 3, thus achieving heat dissipation of the electronic device 3. It is understood that, in this case, the graphite layer 12 should be located on the side of the heat-conducting base layer 10 facing the device housing 30, so that the heat from the heat-conducting structure 1 can be transferred to the device housing 30 more quickly.

[0103] like Figure 7 As shown, in another optional embodiment, the electronic device 3 includes a battery 2, which is disposed within the accommodating space 300. By using the battery 2, which includes a heat-conducting structure 1, the battery 2 can achieve rapid heat dissipation while also preventing the electromagnetic waves emitted by the battery 2 during operation from affecting the normal operation of other electronic components (such as antenna 31, chips, etc.) disposed in the electronic device 3.

[0104] Furthermore, the electronic device 3 may include an antenna 31, which is used to receive or transmit electromagnetic wave signals to realize the communication function of the electronic device 3. Since the surface of the graphite layer 12 is arranged facing the outside of the battery body 20 (i.e., facing the antenna 31 located outside the battery 2), the surface resistance of the graphite layer 12 is small, and the heat-conducting structure 1 is not electrically connected to the circuit of the battery 2. Therefore, the heat-conducting structure 1 can be electrically connected to the antenna 31 as a ground terminal to enable the antenna 31 to be grounded. In other words, when the heat-conducting structure 1 is applied to the electronic device 3, the heat-conducting structure 1 can be used as the antenna ground terminal of the electronic device 3. That is, the heat-conducting structure 1 can achieve multiple functions and is thin and light, occupies little space, and can reduce the number of components used in the electronic device 3, so that the structure of the electronic device 3 is simpler and more compact, which facilitates the miniaturization and lightweight design of the electronic device 3.

[0105] The electronic device 3 disclosed in the fourth aspect of this application improves the heat dissipation efficiency of electronic components (such as batteries, chips, etc.) disposed within the accommodating space 300 by providing a heat-conducting structure 1 or a battery 2. This prevents overheating within the accommodating space 300, which could damage the electronic components and extend the lifespan of the electronic device 3. Furthermore, the thinness and lightness of the heat-conducting structure 1 or the battery 2 facilitates miniaturization of the electronic device 3. Moreover, when the electronic device 3 includes a battery 2 and an antenna 31, the battery 2 can also be used as a grounding terminal for the antenna 31. The battery 2's diverse functions result in a simpler, more compact structure for the electronic device 3, making miniaturization easier.

[0106] The foregoing has provided a detailed description of the thermally conductive structure, battery, electronic device, and preparation method of the thermally conductive structure disclosed in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the thermally conductive structure, battery, electronic device, and preparation method of the thermally conductive structure of the present invention and its core ideas. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A thermally conductive structure, characterized in that, include: A thermally conductive substrate, wherein the thermally conductive substrate is a conductive metal layer; An isolation layer is applied to the thermally conductive base layer, and the isolation layer is a nickel-chromium alloy layer. as well as, A graphite layer is disposed on the side of the insulating layer opposite to the thermally conductive base layer; The thermally conductive structure has a total thickness t, 0.03mm≤t≤0.039mm, the isolation layer has a first thickness h1, 60nm≤h1≤300nm, and the graphite layer has a second thickness h2, 20nm≤h2≤100nm. In the isolation layer, the chromium content is 'a', where 5% ≤ a ≤ 30%.

2. The thermally conductive structure according to claim 1, characterized in that, The isolation layer is formed on the thermally conductive substrate by magnetron sputtering.

3. The thermally conductive structure according to claim 1, characterized in that, The surface of the graphite layer opposite to the isolation layer has a surface impedance Z, Z≤150mΩ.

4. The thermally conductive structure according to any one of claims 1-3, characterized in that, The graphite layer is sputtered and formed on the side of the isolation layer away from the thermally conductive substrate. The surface of the graphite layer away from the isolation layer is a non-smooth surface. The thermally conductive structure also includes an ink layer, which is screen-printed on the surface of the graphite layer away from the isolation layer.

5. The thermally conductive structure according to any one of claims 1-3, characterized in that, The thermally conductive base layer has a first side and a second side opposite to each other. The insulating layer is applied to the surface of the first side of the thermally conductive base layer. The thermally conductive structure also includes an adhesive layer applied to the surface of the second side of the thermally conductive base layer.

6. A battery, characterized in that, It includes a battery body and a thermally conductive structure as described in any one of claims 1-5, wherein the thermally conductive base layer of the thermally conductive structure is applied to the surface of the battery body.

7. An electronic device, characterized in that, include: Equipment housing, the equipment housing having an accommodating space; as well as, The thermally conductive structure as described in any one of claims 1-5, wherein the thermally conductive structure is disposed within the accommodating space, or, The electronic device includes the battery as described in claim 6, the battery being disposed within the accommodating space.

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