A porous microreactor catalyst carrier based on composite ceramics

Abstract

The application discloses a kind of porous microreactor catalyst carriers based on composite ceramic.The catalyst carrier is mainly composed of several main heat transfer plates and main load plates coaxially bonded, the main heat transfer plates and the main load plates are uniformly spaced along the axis of itself, and the main heat transfer plates and the main load plates are alternately arranged, the carrier is placed in the external microreactor, the first heat transfer array is mainly formed by several first heat transfer modules arranged in a rectangular array, two adjacent first heat transfer modules are connected by a first load module, the second heat transfer array is mainly formed by several second heat transfer modules arranged in a rectangular array, and two adjacent second heat transfer modules are connected by a second load module.The application can simplify the loading process of the catalyst carrier, improve the service life of the microreactor, and at the same time has good heat transfer performance and heat transfer uniformity, so as to improve the performance of the catalytic reaction.

Description

Technical Field

[0001] This invention relates to a catalyst support in the field of microreactor catalyst support structure design, and in particular to a porous microreactor catalyst support based on composite ceramics. Background Technology

[0002] In recent years, with the advancement of the "dual carbon policy," the industrial and intelligent manufacturing sectors have begun to pay widespread attention to technologies with sustainable development. Compared with traditional reactors, microreactors have the advantages of compact structure, high power density, and low material cost, which well meet the requirements of green energy conservation and have been widely used in chemical engineering, pharmaceutical engineering, and material synthesis.

[0003] Catalyst supports are the core components of microreactors. Compared to traditional microchannel catalyst supports, porous microreactor supports have a larger specific area and higher catalyst loading. Currently, most commonly used porous microreactor supports are porous metals, which suffer from unstable chemical properties, difficulty in fabricating microstructures, and low surface catalyst adhesion strength. This makes it difficult to improve the performance of microreactors using porous metal catalyst supports, and their application environments are harsh. Ceramic materials, on the other hand, have advantages such as stable chemical properties and high hardness, and have been used in microreactor catalyst supports in recent years. However, they suffer from disadvantages such as low surface catalyst adhesion strength and uneven distribution.

[0004] Regardless of whether the catalyst support is made of metal or ceramic, to improve the adhesion strength and uniformity of the catalyst on its surface, a catalyst coating needs to be pre-loaded onto the surface of the support before activation. Materials include rare earth composite oxides, modified alumina, etc. This increases the complexity of the catalyst loading process. Furthermore, the adhesion of the catalyst coating to the structured support is difficult to guarantee, easily leading to the detachment of active materials, thereby reducing the support's lifespan and stability.

[0005] Chinese invention patent (application number CN201711289741.6) discloses a honeycomb ceramic support catalyst suitable for VOCs catalytic combustion and its preparation method. The method improves the loading consistency and stability of the catalyst by preloading a coating with a large specific surface area, including rare earth composite oxides, modified alumina, binders, and pH adjusters, onto the surface of the honeycomb ceramic support catalyst. This method uses a binder to attach the coating to the surface of the support and then activates it. This method improves the problem of catalyst coating detachment to some extent. However, the process requires two loadings, which is relatively complicated, and the stability of the binder is difficult to guarantee.

[0006] Chinese invention patent (application number CN202211020078.0) discloses a method for preparing ultrathin coated foam ceramics and the palladium catalyst prepared therefrom. This invention obtains a foam alumina ceramic with no clogging, ultra-high porosity, sufficiently rough surface, and easy coating accommodation through an alternating airflow process during the removal of residual slurry. An ultrathin porous particle coating is obtained without the need for a binder. The carrier prepared by this process only requires one activation before direct use. However, the ultrathin porous particle coating is prone to detachment, has a short service life, and the substrate of this ultrathin porous particle coating is alumina, which has poor heat transfer performance, making it difficult to use the prepared catalyst carrier in high-temperature environments.

[0007] Among the published invention patents, no structure has been found that directly uses composite ceramics as a catalyst support for porous microreactors. Directly using composite ceramics avoids the need for coating the support surface before activation, thus solving the problems of complex coating loading processes and easy coating detachment in structured supports, improving the service life of the catalyst support, and enhancing the performance of the catalytic reaction. The existing technology lacks a catalyst support that can overcome the defects of complex coating loading processes and easy coating detachment in structured supports. Summary of the Invention

[0008] To address the problems of complex coating loading processes and easy coating detachment in existing structured supports for microreactors, which affect microreactor performance, this invention aims to provide a porous microreactor catalyst support based on composite ceramics. By assembling ceramic materials with different functions into basic units and arraying these units to form a porous catalyst support, the coating structure in structured supports can be replaced, thereby improving the support's lifespan and catalytic reaction performance.

[0009] The technical solution adopted in this invention is:

[0010] It is mainly composed of several main heat transfer plates and several main load plates coaxially bonded together. The main heat transfer plates and main load plates are evenly spaced along their own axial direction, and the main heat transfer plates and main load plates are alternately arranged along the axial direction of the main heat transfer plates. The carrier is placed in an external microreactor.

[0011] The main heat transfer plate includes a heat transfer outer frame, a first load module, and a first heat transfer array. The first load module and the first heat transfer array are both disposed inside the heat transfer outer frame. The first heat transfer array is fixedly connected to the heat transfer outer frame through the first load module. The first heat transfer array is mainly formed by a number of first heat transfer modules arranged in a rectangular array, with a gap between adjacent first heat transfer modules. Adjacent first heat transfer modules are connected through the first load module. Each first heat transfer module on the outer periphery of the first heat transfer array is connected to the inner sidewall of the heat transfer outer frame through the first load module. The first square through hole of the main heat transfer plate is located where there are no first load modules or first heat transfer modules inside the heat transfer outer frame. The outer sidewall of the heat transfer outer frame is fixedly connected to the inner sidewall of the microreactor.

[0012] The main load plate includes a second load module and a second heat transfer array. The second heat transfer array is mainly formed by a number of second heat transfer modules arranged in a rectangular array, with a gap between adjacent second heat transfer modules. Adjacent second heat transfer modules are connected through a second load module. The frame formed by the second heat transfer modules around the outer periphery of the second heat transfer array is used as the load frame. The second square through hole of the main load plate is located where no second load module or second heat transfer module is provided inside the load frame. The second load module and second heat transfer module on the outer periphery of the main load plate are fixedly connected to the inner wall of the microreactor.

[0013] The first heat transfer module has a first circular through hole in the middle, the diameter of which is 1~8mm. The second heat transfer module has a second circular through hole in the middle, the diameter of which is 1~4mm.

[0014] Both the first heat transfer module and the first load module are cuboid structures. The first load module is bonded to the outer wall of the first heat transfer module. The thickness of the first heat transfer module is greater than that of the first load module, and the thickness difference between the first heat transfer module and the first load module is 1~3mm. The lengths of the first heat transfer module and the first load module are equal.

[0015] Both the second heat transfer module and the second load module are cuboid structures. The second load module is bonded to the outer wall of the second heat transfer module. The thickness of the second heat transfer module is greater than that of the second load module, and the thickness difference between the second heat transfer module and the second load module is 1~3mm. The lengths of the second heat transfer module and the second load module are equal.

[0016] The first circular through-hole and the second square through-hole of the first heat transfer module have the same number and arrangement position and are aligned. The second circular through-hole and the first square through-hole of the second heat transfer module have the same number and arrangement position and are aligned.

[0017] The heat transfer frame, the first heat transfer module, and the second heat transfer module are all made of silicon carbide ceramic material, while the first load module and the second load module are both made of alumina ceramic material.

[0018] This invention mainly consists of several main heat transfer plates and several main load plates coaxially bonded together. Both the main heat transfer plates and the main load plates contain heat transfer modules and load modules. The gas path designed in this invention allows for split airflow in different directions on the surface of the load modules, while the surface of the load modules is impregnated with a catalyst. The increased length of the reaction pathway leads to a longer contact time between the reactant gas and the active material, thereby improving the reaction performance of the microreactor. This invention simplifies the catalyst support loading process, improves the service life of the microreactor, and simultaneously possesses good heat transfer performance and heat transfer uniformity, thus enhancing the performance of the catalytic reaction.

[0019] The beneficial effects of this invention are:

[0020] 1) The catalyst loading process is simplified. Since the first and second loading modules used for impregnating the catalyst are directly embedded in the structured support in an array, compared with the process of pre-loading a coating on the surface of the support and then activating it, it can be directly activated after the support is made, thus obtaining the structured support and simplifying the catalyst support loading process.

[0021] 2) Improved service life of microreactors. Compared with the process of preparing coatings on the surface, since the first and second load modules are embedded in the structured carrier in an array, the active material is less likely to fall off and the load strength is higher, which is conducive to improving service life. At the same time, the alumina ceramic material selected for the first and second load modules has high specific surface area characteristics, and the distribution of the surface-loaded catalyst is more uniform, which is conducive to improving the catalytic reaction performance.

[0022] 3) Balancing the heat transfer performance and thermal uniformity of the catalyst support. The silicon carbide ceramic material selected for the first and second heat transfer modules has strong thermal stability and heat transfer performance. Using silicon carbide ceramic material can improve the heat transfer performance and thermal uniformity of the support. Structurally, all heat transfer modules in the support are bonded to each other, and the heat transfer mode is heat conduction, which can improve the heat transfer performance of the support. At the same time, the first and second heat transfer modules are evenly distributed around the first and second loading modules impregnated with catalyst, which is conducive to improving the thermal uniformity of the catalyst surface.

[0023] 4) Increased contact time of reactant gases on the catalyst surface. The gas path design in this porous catalyst support structure allows for split gas flows in different directions on the surface of the support module, while the surface of the support module is impregnated with catalyst. The increased length of the reaction pathway leads to a longer contact time between the reactant gases and the active material, which is beneficial to improving the reaction performance of the microreactor. Attached Figure Description

[0024] Figure 1 This is a cross-sectional view of the assembled version of the present invention;

[0025] Figure 2 These are the upper and lower isometric views of the main heat transfer plate of this invention;

[0026] Figure 3 These are the upper and lower isometric views of the main load board of this invention;

[0027] Figure 4 These are the upper and lower isometric projections of the first and second basic units of this invention;

[0028] Figure 5 This is a schematic diagram of the internal gas flow of the present invention.

[0029] In the figure: 1. Microreactor; 2. Main heat transfer plate; 3. Main load plate; 4. Heat transfer frame; 5. First basic unit; 5-1. First load module; 5-2. First heat transfer module; 6. Second basic unit; 6-1. Second load module; 6-2. Second heat transfer module; 7. First circular through hole; 8. Second circular through hole; 9. Second square through hole; 10. First square through hole. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0031] like Figure 1 As shown, the carrier in this invention is a spatial porous structure mainly composed of several rectangular main heat transfer plates 2 and several rectangular main load plates 3 coaxially bonded together. The main heat transfer plates 2 and the main load plates 3 are evenly spaced along their own axial direction, and the main heat transfer plates 2 and the main load plates 3 are alternately arranged along the axial direction of the main heat transfer plates 2. A main load plate 3 is provided between every two adjacent main heat transfer plates 2, and every two adjacent main load plates 3 are connected by the main load plates 3. The carrier is placed in the external microreactor 1, serving as a flow channel for the gas inside the microreactor 1. The number of main heat transfer plates 2 and main load plates 3 bonded together is mainly determined by the length of the microreactor 1.

[0032] like Figures 2-4As shown, the main heat transfer plate 2 includes a heat transfer frame 4, a first load module 5-1, and a first heat transfer array. Both the first load module 5-1 and the first heat transfer array are disposed inside the heat transfer frame 4. The first heat transfer array is fixedly connected to the heat transfer frame 4 via the first load module 5-1. The first heat transfer array is mainly formed by several first heat transfer modules 5-2 arranged in a rectangular array at intervals, with gaps between adjacent first heat transfer modules 5-2. Adjacent first heat transfer modules 5-2 are connected to each other via the first load module 5-1. Each first heat transfer module 5-2 on the outer periphery of the first heat transfer array is connected to the inner wall of the heat transfer frame 4 via the first load module 5-1. Specifically, each of the first heat transfer modules 5-2 on the outer periphery of the first heat transfer array is connected to the inner wall of the heat transfer frame 4 through its corresponding first load module 5-1. The first square through hole 10 of the main heat transfer plate 2 is not provided in the inner part of the heat transfer frame 4 where the first load module 5-1 and the first heat transfer module 5-2 are located. That is, the first load module 5-1 and the first heat transfer array are projected onto the plane where the heat transfer frame 4 is located to form a rectangular intersecting grid. Each grid of the rectangular intersecting grid is a first square through hole 10. All the first square through holes 10 constitute the void area of ​​the main heat transfer plate 2. The outer wall of the heat transfer frame 4 is fixedly connected to the inner wall of the microreactor 1.

[0033] The main load plate 3 includes a second load module 6-1 and a second heat transfer array. The second heat transfer array is mainly formed by several second heat transfer modules 6-2 arranged in a rectangular array at intervals, and there is a gap between two adjacent second heat transfer modules 6-2. Two adjacent second heat transfer modules 6-2 are connected through the second load module 6-1. The frame formed by the second heat transfer modules 6-2 around the outer periphery of the second heat transfer array is used as the load frame. The second square through hole 9 of the main load plate 3 is not provided in the load frame where there are no second load modules 6-1 and second heat transfer modules 6-2. The second load modules 6-1 and second heat transfer modules 6-2 on the outer periphery of the main load plate 3 are fixedly connected to the inner sidewall of the microreactor 1. That is, the second load modules 6-1 and second heat transfer modules 6-2 located at the edge of the load frame are fixedly connected to the inner sidewall of the microreactor 1.

[0034] The first heat transfer module 5-2 has a first circular through hole 7 in the middle, the diameter of which is 1~8mm. The second heat transfer module 6-2 has a second circular through hole 8 in the middle, the diameter of which is 1~4mm.

[0035] Both the first heat transfer module 5-2 and the first load module 5-1 are cuboid structures. The first load module 5-1 is bonded to the outer wall of the first heat transfer module 5-2. The thickness of the first heat transfer module 5-2 is greater than the thickness of the first load module 5-1, and the thickness difference between the first heat transfer module 5-2 and the first load module 5-1 is 1~3mm. The lengths of the first heat transfer module 5-2 and the first load module 5-1 are equal.

[0036] The second heat transfer module 6-2 and the second load module 6-1 are both cuboid structures. The second load module 6-1 is bonded to the outer wall of the second heat transfer module 6-2. The thickness of the second heat transfer module 6-2 is greater than the thickness of the second load module 6-1, and the thickness difference between the second heat transfer module 6-2 and the second load module 6-1 is 1~3mm. The lengths of the second heat transfer module 6-2 and the second load module 6-1 are equal.

[0037] The first circular through hole 7 and the second square through hole 9 of the first heat transfer module 5-2 have the same number and arrangement, and their arrangement positions are aligned one-to-one along the axial direction of the catalyst carrier. The second circular through hole 8 and the first square through hole 10 of the second heat transfer module 6-2 have the same number and arrangement, and their arrangement positions are aligned one-to-one along the axial direction of the catalyst carrier.

[0038] The heat transfer outer frame 4, the first heat transfer module 5-2 and the second heat transfer module 6-2 are all made of silicon carbide ceramic material, and the first load module 5-1 and the second load module 6-1 are both made of alumina ceramic material.

[0039] like Figure 4 As shown, a first heat transfer module 5-2 and four first load modules 5-1 connected to the first heat transfer module 5-2 are collectively considered as a first basic unit 5. In a specific implementation, the thickness of both the first basic unit 5 and the heat transfer outer frame 4 is 3~15mm. The main body of the first basic unit 5 is a cuboid first heat transfer module 5-2 with a side length of 5~10mm and a thickness of 2~12mm. The first heat transfer module 5-2 has a first circular through hole 7 with a diameter of 1~8mm in the center of its square face. The first load module 5-1 is bonded to the four rectangular sides of the first heat transfer module 5-2. The length of the first load module 5-1 is the same as the side length of the first heat transfer module 5-2, the width is 2~5mm, and the thickness is slightly smaller than that of the first heat transfer module 5-2, with a difference of 1~3mm. The bonding position of the first load module 5-1 is such that its length direction is aligned with the length direction of the first heat transfer module 5-2, and the distance from the upper surface of the first load module 5-1 to the upper surface of the first heat transfer module 5-2 is the same as the distance from the lower surface of the first load module 5-1 to the lower surface of the first heat transfer module 5-2.

[0040] Four adjacent second heat transfer modules 6-2 arranged in a rectangular array are used as a basic heat transfer array, and a basic heat transfer array and four second load modules 6-1 that connect the four second heat transfer modules 6-2 in the basic heat transfer array are used as a second basic unit 6. The second basic unit 6 is a cuboid with a side length of 8-20mm and a thickness of 2-12mm. The main body of the second basic unit 6 consists of cuboid second heat transfer modules 6-2, each with a side length of 3-8mm and a thickness of 2-12mm, distributed at its four corners. Each square face of the second heat transfer module 6-2 has a second circular through-hole 8 with a diameter of 1-4mm in the center. A second load module 6-1 is bonded between two second heat transfer modules 6-2. The length of the second load module 6-1 is the same as the side length of the second heat transfer modules 6-2, but its thickness is slightly less, with a difference of 1-3mm. The bonding position of the second load module 6-1 is such that its length direction is aligned with the length direction of the second heat transfer modules 6-2, and the distance from the upper surface of the second load module 6-1 to the upper surface of the second heat transfer module 6-2 is the same as the distance from the lower surface of the second load module 6-1 to the lower surface of the second heat transfer module 6-2. The thickness of the second basic unit 6 is the same as the thickness of the first basic unit 5.

[0041] The first circular through-hole 7 in the first basic unit 5 and the square through-hole 10 formed by the combination of the first load module 5-1 in the width direction constitute a gas path in the first basic unit 5 parallel to the gas flow direction; the thickness difference between the first load module 5-1 and the first heat transfer module 5-2 constitutes a gas path in the first basic unit 5 perpendicular to the gas flow direction. The second circular through-hole 8 in the second basic unit 6 and the second square through-hole 9 formed by the second load module 6-1 in the width direction constitute a gas path in the second basic unit 6 parallel to the gas flow direction; the thickness difference between the second load module 6-1 and the second heat transfer module 6-2 constitutes a gas path in the second basic unit 6 perpendicular to the gas flow direction. When the basic units 5 and 6 are bonded, the center positions between the first circular through hole 7 and the second square through hole 9, and between the first square through hole 10 and the second circular through hole 8 are kept consistent, ensuring that the entire catalyst support forms a complex porous pathway in space; the distance between the circular through holes 7 and 8 and the distance between the square through holes 9 and 10 in the main heat transfer plate 2 and the main load plate 3 are 6~11mm, ensuring that heat can be transferred to the reaction gas through the catalyst support.

[0042] In this embodiment, the length L of the microreactor 1 is preferably 100 mm, and the length and width of its cross-section are preferably both 33 mm. The thickness a of the designed main heat transfer and main load plates is preferably 5 mm; the length and width of the first basic unit 5 are preferably both 10 mm, wherein the length and width of the first load module 5-1 are preferably 1 mm and 8 mm, and the length and width of the first heat transfer module 5-2 are preferably both 8 mm; the length and width of the second basic unit 6 are preferably both 15 mm, wherein the length and width of the second load module 6-1 are preferably 6 mm and 3 mm, and the length and width of the second heat transfer module 6-2 are preferably both 6 mm. The total number of bonded main heat transfer plates and main load plates is preferably 20. The number of heat transfer modules 5-2 in the length and width directions of the first basic unit 5 is preferably 3, and the number of heat transfer modules 6-2 in the length and width directions of the second basic unit is preferably 4. The center distance between adjacent first circular through holes 7 in the main heat transfer plate 2 is preferably 9mm. The external dimensions of the main heat transfer plate 2 are preferably 33×33mm, the internal dimensions are preferably 28×28mm, and the thickness is preferably 5mm. The diameters of the circular through holes 7 and 8 in the heat transfer modules 5-2 and 6-2 in the first and second basic units 5 and 6 are preferably designed to be 3mm and 1mm, respectively.

[0043] In this embodiment, silicon carbide (SiC) ceramic material is selected for heat transfer modules 5-2 and 6-2 and heat transfer frame 4, and alumina (Al2O3) ceramic material is selected for load modules 5-1 and 6-1. The specific preparation process of the structured carrier is as follows: SiC ceramic powder, binder, and solvent are thoroughly mixed in a certain proportion; the mixed SiC ceramic slurry is ball-milled to obtain SiC ceramic printing ink with shear-thinning properties; Al2O3 ceramic printing ink is prepared in the same manner; the designed carrier dimensions are converted into G-codes for the ink direct-write printer movement; the inks of SiC and Al2O3 are loaded into different printing cylinders and printed simultaneously to produce ceramic green bodies of the main heat transfer plate 2 and the main load plate 3. The obtained main heat transfer plate 2 and main load plate 3 ceramic green bodies are bonded together; the bonded catalyst carrier green bodies are then hot-pressed and sintered at 1800℃ to ensure that the various structures are tightly bonded. The support is activated by impregnation. The catalyst used includes, but is not limited to, copper (Cu) based catalysts. The supported modules 5-1 and 6-1, which are impregnated in the catalyst solution, can fully contact the catalyst. Finally, the activated structured support is assembled into the microreactor 1.

[0044] like Figure 5 As shown, the internal reaction gas pathway of this invention is as follows:

[0045] The reactant gas reaches the upper surface of the main load plate 3 through the first circular through-hole 7 in the main heat transfer plate 2, and is diverted to the surfaces of the four second load modules 6-1 before flowing out through the second square through-hole 9 in the main load plate 3. Similarly, the reactant gas passing through the first square through-hole 10 in the main heat transfer plate 2 is diverted to the surfaces of the four second load modules 6-1 before flowing to the upper surface of the main load plate 3. Since the catalyst is coated on the surfaces of the load modules 6-1 and 5-1, the length of this gas passage can be effectively increased, thereby prolonging the contact time between the reactant gas and the catalyst and improving the performance of the catalytic reaction.

[0046] The above specific embodiments are used to explain and illustrate the present invention, but not to limit the present invention. All equivalent changes and modifications made within the spirit and scope of the claims of the present invention, that is, within the scope of protection of the present invention and the content of the specification, should fall within the scope of protection of the present invention.

Claims

1. A porous microreactor catalyst support based on composite ceramics, characterized in that: It is mainly composed of several main heat transfer plates (2) and several main load plates (3) coaxially bonded together. The main heat transfer plates (2) and the main load plates (3) are evenly spaced along their own axial direction, and the main heat transfer plates (2) and the main load plates (3) are alternately arranged along the axial direction of the main heat transfer plates (2). The carrier is placed in the external microreactor (1). The main heat transfer plate (2) includes a heat transfer outer frame (4), a first load module (5-1), and a first heat transfer array. Both the first load module (5-1) and the first heat transfer array are located inside the heat transfer outer frame (4). The first heat transfer array is fixedly connected to the heat transfer outer frame (4) via the first load module (5-1). The first heat transfer array is mainly formed by a rectangular array of several first heat transfer modules (5-2), with a gap between adjacent first heat transfer modules (5-2). Each of the first heat transfer modules (5-2) is connected to the first load module (5-1). Each of the first heat transfer modules (5-2) on the outer periphery of the first heat transfer array and the inner wall of the heat transfer frame (4) are connected to the first load module (5-1). The first square through hole (10) of the main heat transfer plate (2) is not provided in the heat transfer frame (4) where the first load module (5-1) and the first heat transfer module (5-2) are located. The outer wall of the heat transfer frame (4) is fixedly connected to the inner wall of the microreactor (1). The main load plate (3) includes a second load module (6-1) and a second heat transfer array. The second heat transfer array is mainly formed by a number of second heat transfer modules (6-2) arranged in a rectangular array, and there is a gap between two adjacent second heat transfer modules (6-2). Two adjacent second heat transfer modules (6-2) are connected through the second load module (6-1). The frame formed by the second heat transfer modules (6-2) around the outer periphery of the second heat transfer array is used as the load frame. The second square through hole (9) of the main load plate (3) is not provided inside the load frame where there are no second load modules (6-1) and second heat transfer modules (6-2). The second load modules (6-1) and second heat transfer modules (6-2) on the outer periphery of the main load plate (3) are fixedly connected to the inner wall of the microreactor (1). The thickness of the first heat transfer module (5-2) is greater than the thickness of the first load module (5-1), and the thickness of the second heat transfer module (6-2) is greater than the thickness of the second load module (6-1). The first heat transfer module (5-2) has a first circular through hole (7) in the middle, and the second heat transfer module (6-2) has a second circular through hole (8) in the middle. The number and arrangement of the first circular through hole (7) and the second square through hole (9) of the first heat transfer module (5-2) are the same and aligned. The number and arrangement of the second circular through hole (8) and the first square through hole (10) of the second heat transfer module (6-2) are the same and aligned. The center positions between the first circular through hole (7) and the second square through hole (9) and between the first square through hole (10) and the second circular through hole (8) are consistent, ensuring that the entire catalyst carrier forms a complex porous channel in space. The heat transfer outer frame (4), the first heat transfer module (5-2) and the second heat transfer module (6-2) are all made of silicon carbide ceramic material, and the first load module (5-1) and the second load module (6-1) are both made of alumina ceramic material.

2. The porous microreactor catalyst support based on composite ceramics according to claim 1, characterized in that: The diameter of the first circular through hole (7) is 1~8mm, and the diameter of the second circular through hole (8) is 1~4mm.

3. The porous microreactor catalyst support based on composite ceramics according to claim 1, characterized in that: The first heat transfer module (5-2) and the first load module (5-1) are both cuboid structures. The first load module (5-1) is bonded to the outer wall of the first heat transfer module (5-2), and the thickness difference between the first heat transfer module (5-2) and the first load module (5-1) is 1~3mm. The lengths of the first heat transfer module (5-2) and the first load module (5-1) are equal.

4. The porous microreactor catalyst support based on composite ceramics according to claim 1, characterized in that: The second heat transfer module (6-2) and the second load module (6-1) are both cuboid structures. The second load module (6-1) is bonded to the outer wall of the second heat transfer module (6-2). The thickness difference between the second heat transfer module (6-2) and the second load module (6-1) is 1~3mm. The lengths of the second heat transfer module (6-2) and the second load module (6-1) are equal.

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