Fabrication apparatus and method for elliptical vibration flying cut of complex optical surfaces

Abstract

This application discloses a processing apparatus and method for elliptical vibration flying cutter of complex optical surfaces. The processing apparatus includes an elliptical vibration mechanism and a flying cutter. The elliptical vibration mechanism is configured to be mounted on the spindle of a machining lathe, and the flying cutter is mounted on the elliptical vibration mechanism, with the flying cutter located outside the rotation axis of the spindle. The above-described processing apparatus and method can solve the problem of low processing efficiency in the current processing of complex surfaces such as free-form surfaces on brittle materials, where a small feed rate and depth of cut are required to obtain a crack-free surface.

Description

Technical Field

[0001] This application belongs to the field of machining technology, specifically relating to a machining apparatus and method for elliptical vibration flying cut of optically complex curved surfaces. Background Technology

[0002] Complex optical surfaces are non-rotationally symmetric optical surfaces with freely varying surfaces, such as freeform surfaces and microstructure array surfaces. Compared to simple planes and spheres, optical elements with complex surfaces offer superior performance. For example, they can reduce the number of components in an optical system, decrease the weight and size of optical elements, and improve the imaging quality of the optical system, thus finding wide application in many fields.

[0003] In practical applications, many materials with excellent optical properties exhibit relatively low fracture toughness, high brittleness, and anisotropy. Given the high brittleness of these materials, in order to ensure ductile cutting and obtain a crack-free surface during machining, smaller feed rates and depths of cut are typically required, resulting in lower machining efficiency. Summary of the Invention

[0004] The purpose of this application is to provide a processing apparatus and method for elliptical vibration flying cut of complex optical surfaces, which can solve the problem that in the current processing of complex surfaces such as free-form surfaces on brittle materials, a small feed rate and cutting depth are required to obtain a crack-free surface, resulting in low processing efficiency.

[0005] In a first aspect, embodiments of this application disclose a processing apparatus for elliptical vibration flying cutter of optical complex surfaces, which includes an elliptical vibration mechanism and a flying cutter. The elliptical vibration mechanism is configured to be mounted on the spindle of a processing lathe, and the flying cutter includes a single-crystal diamond cutter. The flying cutter is mounted on the elliptical vibration mechanism and is located outside the rotation axis of the spindle.

[0006] Secondly, embodiments of this application disclose a method for processing elliptical vibration-cut optical complex surfaces, comprising:

[0007] The elliptical vibration mechanism in the processing device is installed on the spindle of the processing lathe, and the flying cutting tool of the processing device is located outside the rotation axis of the spindle;

[0008] A workpiece fixture for mounting the workpiece to be processed onto the machining lathe;

[0009] Control the processing device to process the workpiece.

[0010] This application discloses a processing apparatus for elliptical vibration flying cutter of optically complex curved surfaces. The elliptical vibration mechanism of the processing apparatus can be mounted on the spindle of a machining lathe. The flying cutter includes a single-crystal diamond tool to ensure good cutting performance. The flying cutter can be mounted on the elliptical vibration mechanism. By positioning the flying cutter outside the rotation axis of the spindle, the spindle can drive the flying cutter to perform circular motion around the rotation axis during rotation, ensuring that the flying cutter can perform circular feed motion. At the same time, under the action of the elliptical vibration mechanism, the flying cutter can generate elliptical vibration, thereby ensuring that the instantaneous undeformed chip thickness in each elliptical vibration cycle is relatively small. Therefore, when using the above-mentioned processing equipment to cut brittle materials and other workpieces, the critical cutting depth of brittle materials can be increased, thereby improving the processing efficiency of the workpiece. Attached Figure Description

[0011] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0012] Figure 1 This is a schematic diagram of the structure of the processing device for elliptical vibration flying cut optical complex curved surfaces disclosed in the embodiments of this application;

[0013] Figure 2 This is a cross-sectional schematic diagram of the processing apparatus for elliptical vibration flying cut optical complex surfaces disclosed in the embodiments of this application;

[0014] Figure 3 This is a schematic flowchart of the processing method for elliptical vibration flying cut optical complex surfaces disclosed in the embodiments of this application.

[0015] Explanation of reference numerals in the attached figures:

[0016] 1-Base, 2-Conductive slip ring, 31-Pack, 32-Containing body, 33-End cap, 5-Balancing mass block, 6-Nut, 7-Double-ended stud, 8-Elliptical vibration mechanism, 9-Fasting screw, 10-Flying cutter, 11-Fasting screw, 12-Fasting screw, 13-Flat key, 14-Fasting screw, 15-Fasting screw, 16-Shaft end retaining ring. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0019] like Figure 1 and Figure 2 As shown in the illustration, this application discloses a processing apparatus (hereinafter referred to as the processing apparatus) for elliptical vibration flying cut of optically complex curved surfaces. This processing apparatus can be used to process optically complex curved surfaces such as free-form surfaces and microstructure array surfaces. Of course, to ensure the processing apparatus can function properly, it needs to be equipped with corresponding basic equipment such as a machining lathe. The processing apparatus includes an elliptical vibration mechanism 8 and a flying cutter 10. The structure and dimensions of the flying cutter 10 can be selected based on the specific structure and parameters of the complex surface to be processed, and are not limited here. Furthermore, to ensure good cutting performance, the flying cutter 10 includes a single-crystal diamond tool; simply put, the flying cutter 10 can be formed from a material with relatively high hardness, such as diamond.

[0020] In the use of the processing apparatus disclosed in this application embodiment, the elliptical vibration mechanism 8 can be mounted on the spindle of the machining lathe using a vacuum chuck or threaded connector, so that the elliptical vibration mechanism 8 can rotate together with the spindle as it rotates around its own axis of rotation. Specifically, the elliptical vibration mechanism 8 is used to provide elliptical vibration, that is, it can provide a driving action with a high frequency of motion (the aforementioned frequency can be no less than 18KHz) to the driven component, causing the driven component to generate a high-frequency elliptical motion. More specifically, the elliptical vibration mechanism 8 can be a resonant elliptical motion trajectory generating device or a non-resonant elliptical motion trajectory generating device, and the elliptical vibration mechanism 8 can also be a single-excitation elliptical motion trajectory generating device or a dual-excitation elliptical motion trajectory generating device, etc., which are not limited herein.

[0021] Based on this, by mounting the flying cutter 10 on the elliptical vibration mechanism 8, the elliptical vibration mechanism 8 can drive the flying cutter 10 to generate elliptical vibration. Compared with ordinary cutting, since the elliptical vibration cutting process is an intermittent cutting action, and the instantaneous cutting thickness varies in each vibration cycle, and is much smaller than that of ordinary cutting, it can effectively increase the critical cutting depth for ductile cutting of brittle materials, thereby improving the processing efficiency of brittle materials and other workpieces. In addition, during the cutting process using elliptical vibration, it is also possible to significantly reduce the cutting force and reduce the wear of the flying cutter 10, thereby improving the machining accuracy and surface quality, extending the life of diamond tools, and suppressing burrs.

[0022] Of course, to ensure that the flying cutter 10 can perform normal circumferential feed motion, when the flying cutter 10 is mounted on the spindle via the elliptical vibration mechanism 8, the flying cutter 10 is located outside the rotation axis of the spindle. That is, the flying cutter 10 is offset relative to the rotation axis of the spindle, thereby ensuring that the flying cutter 10 can perform circumferential motion around the rotation axis of the spindle during the spindle's rotation. More specifically, the distance between the flying cutter 10 and the rotation axis of the spindle, i.e., the flying radius, can be flexibly determined according to the specific processing requirements of the workpiece, and is not limited here.

[0023] Furthermore, during the sampling of surface data points, compared to the helical trajectory of the tool in traditional slow / fast tool servo technology, the flying cutter 10 of the processing device disclosed in this embodiment moves on the surface of the workpiece with a circular arc trajectory of equal radius. This ensures that the interval and angle between two points before and after the trajectory are equal simultaneously. Moreover, at a constant rotational speed, the linear velocity of the flying cutter 10 is also constant. This overcomes the shortcomings of using equal angle and equal spacing methods for data point sampling in slow / fast tool servo technology, and can improve the uniformity of the surface quality of the workpiece. At the same time, when machining anisotropic materials, traditional turning will affect the surface quality due to changes in cutting crystal orientation. However, since the processing trajectory of the flying cutter 10 of the processing device disclosed in this embodiment is a circular arc of equal radius, and by making the flying radius relatively large compared to the size of the workpiece, the processing trajectory of the flying cutter 10 on the surface of the workpiece approaches a straight line, thereby reducing or even eliminating the influence of changes in cutting crystal orientation on the surface quality.

[0024] This application discloses a processing apparatus for elliptical vibration flying cutter of optically complex curved surfaces. The elliptical vibration mechanism 8 of this processing apparatus can be mounted on the spindle of a machining lathe, and the flying cutter 10 can be mounted on the elliptical vibration mechanism 8. At the same time, by positioning the flying cutter 10 outside the rotation axis of the spindle, it is ensured that the spindle can drive the flying cutter 10 to perform circular motion around the rotation axis during rotation, ensuring that the flying cutter 10 can perform circular feed motion. Simultaneously, under the action of the elliptical vibration mechanism 8, the flying cutter 10 can generate elliptical vibration, thereby ensuring that the instantaneous undeformed chip thickness in each elliptical vibration cycle is relatively small. Therefore, when using the above-mentioned processing equipment to cut brittle materials and other workpieces, the critical cutting depth of brittle materials can be increased, thereby improving the processing efficiency of the workpiece.

[0025] In the above embodiments, to ensure that the flying cutter 10 can perform circular motion around the rotation axis of the spindle, the elliptical vibration mechanism 8 can be offsetly installed outside the rotation axis of the spindle. In this case, to improve the connection reliability between the flying cutter 10 and the elliptical vibration mechanism 8, and thus ensure the reliability and accuracy of the flying cutter 10 when performing elliptical vibration, the flying cutter 10 and the elliptical vibration mechanism 8 can optionally be coaxially arranged. That is, in the embodiments of this application, when the spindle rotates, the elliptical vibration mechanism 8 and the flying cutter 10 together perform (complete or incomplete) circular motion around the rotation axis of the spindle. In this case, the connection reliability between the flying cutter 10 and the elliptical vibration mechanism 8 is relatively high. Therefore, when the flying cutter 10 is driven by the elliptical vibration mechanism 8 to perform elliptical vibration, the driving force can be stably and accurately transmitted to the flying cutter 10, improving the processing accuracy of the processing device.

[0026] Specifically, the flying cutter 10 and the elliptical vibration mechanism 8 can be fixedly connected by a connector. More specifically, the flying cutter 10 can be fixedly mounted on the drive head of the elliptical vibration mechanism 8 by a fastening screw 9, ensuring a more stable fixed connection between the two and facilitating the replacement of the flying cutter 10.

[0027] Furthermore, in order to reduce the difficulty of installing the elliptical vibration mechanism 8 on the spindle, the machining device includes a base, one end of which is configured as a mounting frame for machining the spindle of the lathe, and the elliptical vibration mechanism 8 is installed at the other end of the base, so that the elliptical vibration mechanism 8 is indirectly installed on the spindle of the lathe through the base, thereby reducing the installation difficulty of the elliptical vibration mechanism 8.

[0028] Furthermore, the processing device may also include a balancing mass block 5, with both the balancing mass block 5 and the elliptical vibration mechanism 8 mounted on the end of the base away from the main shaft. Simultaneously, by positioning the elliptical vibration mechanism 8 and the balancing mass block 5 on opposite sides of a straight line perpendicular to the rotation axis of the main shaft, the dynamic balance during processing is improved using the balancing mass block 5 and the elliptical vibration mechanism 8, further enhancing processing quality. Moreover, the line containing the center of gravity of the elliptical vibration mechanism 8 and the line containing the center of the balancing mass block 5 can be symmetrically arranged relative to the straight line perpendicular to the rotation axis of the main shaft, ensuring that the counterweight provided by both to the base is substantially equivalent, further improving the dynamic balance effect.

[0029] Specifically, the balancing mass 5 can be formed of a relatively dense material such as metal to make its volume relatively small. Furthermore, the balancing mass can be fixedly mounted on the base using threaded connections. More specifically, the base can have a through hole, allowing the balancing mass 5 to be embedded within it, and a double-ended stud 7 and a nut 6 are used to secure the balancing mass 5 to the base. Additionally, by making the through hole on the base larger than the balancing mass 5 in the direction perpendicular to the axis of rotation, the position of the balancing mass 5 on the base can be adaptively adjusted according to the specific installation position of the elliptical vibration mechanism 8, further enhancing the balancing mass 5's effect on improving the dynamic balance of the machining process.

[0030] As described above, the elliptical vibration mechanism 8 can drive the flying cutting tool 10 to perform elliptical vibration. Therefore, during the operation of the processing apparatus disclosed in this application embodiment, a power supply needs to be provided for the elliptical vibration mechanism 8 to supply power to it. Specifically, the elliptical vibration mechanism 8 and the power supply can be electrically connected through wires.

[0031] Considering that the elliptical vibration mechanism 8 is also mounted on the spindle of the machining lathe and rotates with the spindle, in order to prevent power transmission devices such as wires from interfering with the rotation of the elliptical vibration mechanism 8 and / or the flying cutter 10, in another embodiment of this application, the machining device may further include an ultrasonic power transmission mechanism. The elliptical vibration mechanism 8 is electrically connected to the ultrasonic power transmission mechanism, thereby using the ultrasonic power transmission mechanism to supply power to the elliptical vibration mechanism 8, thus eliminating the need to use wires to supply power to the elliptical vibration mechanism 8, thereby preventing wires from hindering the normal movement of the elliptical vibration mechanism 8 and / or the flying cutter 10.

[0032] Specifically, the ultrasonic power transmission mechanism can supply power to the elliptical vibration mechanism 8 using either contact or non-contact power transmission methods. In the case of non-contact power transmission, principles such as electromagnetic induction or magnetic resonance can be employed, along with appropriate devices, to ensure that the ultrasonic power transmission mechanism can supply power to the elliptical vibration mechanism 8. In the case of contact power transmission, devices such as brushes can be used to supply power to the elliptical vibration mechanism 8.

[0033] In another embodiment of this application, the ultrasonic power transmission device can employ a contact-type power transmission method, which can improve the reliability of power transmission and reduce losses and costs. More specifically, the processing device disclosed in this application includes a base, one end of which is configured as the spindle of a machining lathe, and the elliptical vibration mechanism 8 is mounted on the other end of the base, so that the elliptical vibration mechanism 8 is indirectly mounted on the spindle of the machining lathe through the base, reducing the installation difficulty of the elliptical vibration mechanism 8. In this case, the ultrasonic power transmission device includes a conductive slip ring 2, and the conductive slip ring 2 can be sleeved on the base, thereby ensuring that the assembly stability between the ultrasonic transmission device and other components in the processing device remains relatively high during the rotation of the base with the spindle, and basically does not occupy a relatively large additional space.

[0034] More specifically, the conductive slip ring 2 may include a rotor and a stator. The stator is sleeved outside the rotor and can be fixed on the lathe body of the machining lathe. The rotor can be sleeved outside the base and can form a relatively stable relative fixed relationship with the base through fastening screws 14 and other connecting parts, so that the rotor can rotate relative to the stator during the rotation of the spindle.

[0035] In addition, when the elliptical vibration mechanism 8 is mounted on the base, the base and the spindle can be set coaxially to improve the rotational stability of the base. Furthermore, by offsetting the elliptical vibration mechanism 8 relative to the rotation axis of the base (and the spindle), it is ensured that the flying cutter 10, which is coaxially mounted on the elliptical vibration mechanism 8, can make circular motion around the rotation axis of the spindle.

[0036] As described above, the elliptical vibration mechanism 8 can be indirectly mounted on the spindle of a machining lathe via a base. Furthermore, the base includes a seat 1 and a sleeve. The seat 1 is mounted on the spindle of the machining lathe. Specifically, the base can be a stepped cylindrical structure, with its relatively large diameter portion fixed to the spindle. The sleeve can include a fitting portion 31 and a receiving portion, which are fixedly connected. These two portions can be integrally formed to improve the structural strength of the sleeve. In the sleeve, the fitting portion 31 is fitted onto the seat 1, and one end of the fitting portion 31 connected to the receiving portion is provided with a shaft end retaining ring 16. The shaft end retaining ring 16 is fixedly connected to the seat 1 to provide a limiting function for the fitting portion 31. By combining with the stepped portion with a larger diameter in the seat 1, the relative movement of the fitting portion 31 and the seat 1 along the rotation axis is restricted. Specifically, the end of the base 1 away from the main shaft can be provided with a threaded hole, and by using a fastening bolt 15 that passes through the shaft end retaining ring 16 and extends into the threaded hole, the shaft end retaining ring 16 can form a reliable fixed connection with the base 1.

[0037] Furthermore, to ensure that the sleeve can rotate together with the base 1, a flat key 13 is provided between the sleeve part 31 and the base 1, so as to reduce the difficulty of processing and assembling the parts while ensuring that the sleeve and the base 1 can form a relatively reliable limiting fit relationship. In another embodiment of this application, in order to improve the consistency and stability of the movement between the sleeve and the base 1, a spline can also be used to form a limiting fit relationship between the sleeve and the base 1.

[0038] Furthermore, the elliptical vibration mechanism 8 can be mounted on the receiving portion. Specifically, the elliptical vibration mechanism 8 and the receiving portion can be stably and fixedly connected using fastening screws 11. Additionally, at least a portion of the elliptical vibration mechanism 8 can be housed within the receiving portion, which reduces the protrusion dimension of the flying cutter 10 relative to the end face of the receiving portion away from the sleeve portion 31, thereby improving the installation stability and machining accuracy of the flying cutter 10. Specifically, an opening can be provided at the end of the receiving portion away from the sleeve portion 31, and the elliptical vibration mechanism 8 and the flying cutter 10 can be mounted into the sleeve from the end of the sleeve portion away from the receiving portion, with at least a portion of the flying cutter 10 extending out of the sleeve from the aforementioned opening. Then, the elliptical vibration mechanism 8 is fixed to the receiving portion using fastening screws 11 or other connecting components.

[0039] In another embodiment of this application, the receiving portion includes a receiving body 32 and an end cap 33, which are detachably fixedly connected by fastening screws 12. The end cap 33 has a limiting step, and the elliptical vibration mechanism 8 is mounted on the end cap 33 from the side opposite to the receiving body 32, with its upper limit in the rotational axis located at the limiting step. With this technical solution, when the flying cutter 10 contacts the workpiece, the limiting step on the end cap 33 provides support for the elliptical vibration mechanism 8, improving the cutting stability of the flying cutter 10 and thus improving machining accuracy. More specifically, the elliptical vibration mechanism 8 includes a relatively protruding outer edge, so that the aforementioned outer edge can be limited at the limiting step of the end cap 33, and the main body of the elliptical vibration mechanism 8 can be accommodated in the receiving body 32, improving space utilization and enhancing the operational stability of the flying cutter 10.

[0040] Based on the processing apparatus for elliptical vibration flying-cutting of optical complex surfaces disclosed in any of the above embodiments, this application also discloses a processing method for elliptical vibration flying-cutting of optical complex surfaces (hereinafter referred to as the processing method), so as to process optical complex surfaces such as free-form surfaces and microstructure array surfaces using the processing method.

[0041] like Figure 3 As shown, the processing method disclosed in this application includes:

[0042] S1. The elliptical vibration mechanism in any of the above embodiments of the processing apparatus is installed on the spindle of a machining lathe, and the flying cutter of the processing apparatus is located outside the rotation axis of the spindle. Specifically, using a vacuum chuck or threaded connector, the elliptical vibration mechanism can be installed on the spindle of the machining lathe, so that the elliptical vibration mechanism can be driven to rotate together as the spindle rotates around its own rotation axis; and by offsetting the elliptical vibration mechanism relative to the rotation axis of the spindle, or by offsetting the flying cutter relative to the elliptical vibration mechanism, a certain distance can be maintained between the flying cutter and the rotation axis of the spindle, so that the flying cutter can make a circular feed motion around the rotation axis of the spindle during the rotation of the spindle.

[0043] S2. A workpiece fixture for mounting the workpiece to be processed on a machining lathe. Specifically, the workpiece fixture for the machining lathe may include a slide. The workpiece to be processed may be mounted on the slide and perform linear reciprocating feed motion relative to the lathe body of the machining lathe.

[0044] S3. Control the processing device to process the workpiece. Specifically, based on the actual needs such as the specific parameters of the surface shape to be formed on the workpiece, determine the motion trajectory and other parameters of the flying cutting tool and other devices so that the processing device can form the required surface structure on the workpiece.

[0045] In addition, in the above processing method, step S3 is performed after steps S1 and S2 are completed. However, there is no temporal order between steps S1 and S2.

[0046] Of course, when the above technical solution is adopted, the flying cutting tool can be driven by the elliptical vibration mechanism and generate elliptical vibration. Compared with ordinary cutting, since the elliptical vibration cutting process is a discontinuous cutting action, and the instantaneous cutting thickness varies in each vibration cycle, and is much smaller than that of ordinary cutting, it can effectively increase the critical cutting depth for ductile cutting of brittle materials, thereby improving the processing efficiency of brittle materials and other workpieces.

[0047] Furthermore, considering that the materials of the workpieces being processed may differ, their physical properties may also differ. Therefore, in the processing method disclosed in this application, the flying cut direction can be determined according to the specific physical properties of the workpiece.

[0048] In detail, step S3 above may include:

[0049] When the workpiece is made of anisotropic material, the flying cut direction of the machining apparatus is aligned with the predetermined crystal orientation of the workpiece to process it. That is, before machining the workpiece, the physical properties of the material forming the workpiece are determined. If the material is anisotropic, a trial cut can be performed on the workpiece before machining. This involves cutting a bevel at predetermined angles (e.g., 15°, 30°) on a certain crystal plane to determine the one or more crystal orientations with relatively large critical cutting depths on that surface. Based on this, during the subsequent formal flying cut machining of the workpiece to form a complex curved surface, the flying cut direction can be made parallel to the crystal orientation corresponding to the one or more crystal orientations with relatively large critical cutting depths obtained earlier. More intuitively, the predetermined crystal orientation can be one or more of the crystal orientations in the workpiece whose critical cutting depth is greater than the average cutting depth of the multiple crystal orientations. This can reduce the adverse effects on the quality of the machined surface caused by changes in the cutting direction relative to the crystal orientation during the cutting process, and further improve the surface quality of the workpiece.

[0050] Of course, in practical applications, the crystal orientation with the largest obtained critical cutting depth can be selected as the predetermined crystal orientation.

[0051] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0052] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A processing device for elliptical vibration flying cut of complex optical surfaces, characterized in that, The device includes a base, an elliptical vibration mechanism (8), and a flying cutter (10). The base includes a seat (1) and a sleeve. The seat (1) is configured to be mounted on the spindle of a machining lathe. The sleeve includes a fixedly connected fitting part and a receiving part. The fitting part is fitted onto the seat (1), and one end of the fitting part connected to the receiving part is provided with a shaft end retainer (16) fixedly connected to the seat (1) to restrict the relative movement of the fitting part and the seat (1) along the rotation axis. A flat key (13) is provided between the fitting part and the seat (1). The elliptical vibration mechanism (8) is mounted on the receiving part, and at least a part of the elliptical vibration mechanism (8) is accommodated within the receiving part. The flying cutter (10) includes a single-crystal diamond cutter, and the flying cutter (10) is mounted on the elliptical vibration mechanism (8), and the flying cutter (10) is located outside the rotation axis of the spindle.

2. The processing apparatus for elliptical vibration flying cut of complex optical surfaces according to claim 1, characterized in that, The flying cutter (10) is coaxially arranged with the elliptical vibration mechanism (8), and the elliptical vibration mechanism (8) is configured to be installed outside the rotation axis of the spindle.

3. The processing apparatus for elliptical vibration flying cut of complex optical surfaces according to claim 2, characterized in that, The processing device includes a base and a balancing mass block (5). One end of the base is configured to be installed on the spindle of the lathe. The elliptical vibration mechanism (8) and the balancing mass block (5) are both installed on the other end of the base. The elliptical vibration mechanism (8) and the balancing mass block (5) are located on opposite sides of a straight line perpendicular to the axis of rotation of the spindle.

4. The processing apparatus for elliptical vibration flying cut of complex optical surfaces according to claim 3, characterized in that, The line containing the center of gravity of the elliptical vibration mechanism (8) and the line containing the center of gravity of the balancing mass block (5) are symmetrically arranged relative to the rotation axis of the main shaft.

5. The processing apparatus for elliptical vibration flying cut of complex optical surfaces according to claim 1, characterized in that, The processing device further includes an ultrasonic power transmission mechanism, and the elliptical vibration mechanism (8) is electrically connected to the ultrasonic power transmission mechanism. The ultrasonic power transmission mechanism is used to supply power to the elliptical vibration mechanism (8).

6. The processing apparatus for elliptical vibration flying cut of complex optical surfaces according to claim 5, characterized in that, The processing device includes a base, one end of which is configured to be mounted on the spindle of the processing lathe, the elliptical vibration mechanism (8) is mounted on the other end of the base, and the ultrasonic power transmission mechanism includes a conductive slip ring (2), which is sleeved on the base.

7. The processing apparatus for elliptical vibration flying cut of complex optical surfaces according to claim 1, characterized in that, The receiving part includes a detachably connected receiving body and an end cap (33). The end cap (33) is provided with a limiting step. The elliptical vibration mechanism (8) is installed on the end cap (33) on the side away from the receiving body, and the upper limit of the elliptical vibration mechanism (8) is located at the limiting step in the rotation axis.

8. A method for processing complex optical surfaces by elliptical vibration flying cut, characterized in that, Using the processing apparatus for elliptical vibration-cutting of complex optical surfaces as described in any one of claims 1-7, the processing method includes: The elliptical vibration mechanism in the processing device is installed on the spindle of the processing lathe, and the flying cutting tool of the processing device is located outside the rotation axis of the spindle; A workpiece fixture for mounting the workpiece to be processed onto the machining lathe; Control the processing device to process the workpiece.

9. The method for processing elliptical vibration-cut optical complex surfaces according to claim 8, characterized in that, The process of controlling the processing device to process the workpiece includes: When the workpiece being processed is an anisotropic material, the cutting direction of the processing device is controlled to be consistent with the predetermined crystal orientation of the workpiece to process the workpiece.

Images