Display module injection molding mold and method for offsetting glue filling pressure change

Abstract

The application provides a display module injection molding mold, comprising an upper mold and a lower mold, the upper mold comprises a film frame and a mold core, the mold core is made by rubber coating on the film frame, wherein the mold core is in interference fit with the glass cover plate of the display module, and the edge of the glass cover plate of the display module is recessed in the mold core. The display module injection molding mold of the application uses a glue pouring mold to limit the boundary and shape of the glue, the mold core and the glass cover plate are in interference fit, and the edge of the glass cover plate of the display module is recessed in the boundary of the mold core after interference assembly. The recessed design can produce interference fit with the product glass cover plate to ensure the sealing of glue pouring, and can balance the extrusion deformation of the mold core caused by glue pouring pressure. The application also provides a method for offsetting the change of glue pouring pressure during the forming process of the display module.

Description

Technical Field

[0001] This invention relates to the field of display module molding, and more particularly to a display module injection molding die and a method for counteracting changes in potting pressure during the molding process. Background Technology

[0002] In existing technologies, the injection molding of display modules typically uses upper and lower molds that are closed together. These molds are generally made of metal, with the inner cavity of the upper mold being the same size as the outer contour of the glass cover. The upper mold's inner surface is fitted and positioned against the edge of the glass cover. After mold closing, glue is poured in through the injection port. However, this approach suffers from drawbacks. Due to dimensional tolerances in the glass cover, different products may have varying dimensions, and some products may have interference fits or gaps with the mold, potentially leading to extrusion deformation or glue overflow during injection. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a method for counteracting changes in potting pressure during the molding process of a display module, thereby ensuring that the product frame size is consistent after potting and avoiding extrusion deformation or potting overflow.

[0004] The present invention provides a method for offsetting changes in potting pressure during the molding process of a display module. The changes in potting pressure are offset by adjusting the distance 'a' between the other layers of the display module (excluding the glass cover plate) and the edge of the glass cover plate to adjust the potting cross-sectional area.

[0005] In one embodiment, the method further includes adjusting the position a1 closest to the dispensing port to be the smallest, and the position a1 furthest from the dispensing port to be the smallest. n maximum.

[0006] In one embodiment, the maximum and minimum values ​​of the distance 'a' from the other layers to the edge of the glass cover plate satisfy 0.1 mm. max -a min <0.4mm.

[0007] In one embodiment, the maximum and minimum values ​​of the distance 'a' from the other stacked layers to the edge of the glass cover plate satisfy 'a'. max -a min =0.3mm.

[0008] In one embodiment, adjusting the distance 'a' of the display module's other stacked layers (excluding the glass cover) to the edge of the glass cover includes adjusting the distance 'a' of all other stacked layers (excluding the glass cover) to the edge of the glass cover before integrally cutting all film layers.

[0009] The above-mentioned technical features can be combined in various technically feasible ways to produce new implementation schemes, as long as the purpose of the present invention can be achieved. Attached Figure Description

[0010] ​The invention will now be described in more detail based on embodiments that are merely non-limiting and with reference to the accompanying drawings. Wherein:

[0011] Figure 1 A cross-sectional structural schematic diagram of the injection molding die for the display module according to the present invention is shown;

[0012] Figure 2 A schematic diagram showing the positions of the filling port and the outlet of the injection molding die for the display module according to the present invention is shown.

[0013] Figure 3 Showing Figure 2 AA cross-section view of the second dispensing port in the middle;

[0014] Figure 4 Showing Figure 2 BB cross-section at the second glue outlet;

[0015] Figure 5 Showing Figure 2 Cross-sectional view of AA after glue application;

[0016] Figure 6 Showing Figure 2 Schematic diagram of the gradient glue channel in the middle;

[0017] Figure 7 A schematic diagram showing the variation of the glue dispensing channel in another embodiment is shown;

[0018] Figure 8 This shows the distance a1 between the edge of the panel near the glue outlet and the edge of the glass cover.

[0019] Figure 9 The distance a2 between the edge of the panel near the glue inlet and the edge of the glass cover is shown.

[0020] Figures 10-11 This diagram illustrates the change in SCF dimensions by adjusting the SCF width to control the potting cross-sectional area.

[0021] In the figures, identical components are labeled with the same reference numerals. The figures are not drawn to scale. Detailed Implementation

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, as long as there is no conflict, the various embodiments and features in each embodiment of the present invention can be combined with each other, and the resulting technical solutions are all within the protection scope of the present invention.

[0023] For any parts not mentioned in this invention, existing technologies can be used or referenced.

[0024] The present invention provides a method for offsetting the change in dispensing pressure during the molding process of a display module. The change in dispensing pressure is offset by adjusting the distance a (mm) from other laminates except the glass cover plate to the edge of the glass cover plate of the display module to adjust the dispensing cross-sectional area.

[0025] As Figure 8 and Figure 9 shown, the distance a from other laminates except the glass cover plate (such as OCA, POL, Panel, BP, SCF, etc.) to the edge of the glass cover plate can be adjusted to adjust the dispensing cross-sectional area to offset the inconsistent width after injection molding caused by the decrease in dispensing pressure. This method requires that the interference amount between the mold core and the glass cover plate of the mold does not need to be very large or can be almost unchanged.

[0026] Among them, at the position a1 near the dispensing port, it is the smallest, and at the position a2 far from the dispensing port, it is the largest. And among them, the maximum value and the minimum value of the distance a from other laminates except the glass cover plate to the edge of the glass cover plate satisfy 0.1mm < a max -a min < 0.4mm, that is, the overall dimension change amount of the display module is 0.1mm < amax - amin < 0.4mm. More preferably, the maximum value and the minimum value of the distance a from other laminates except the glass cover plate to the edge of the glass cover plate satisfy a max -a min = 0.3mm.

[0027] After adjustment, the gradient cutting trajectory can be set according to the size, and the film layer can be cut integrally along the gradient cutting trajectory.

[0028] Unless otherwise defined, the technical terms or scientific terms used in the present invention should have the ordinary meanings understood by those with ordinary skills in the field to which the present invention belongs. The terms "first", "second" and similar words used in the present invention do not represent any order, quantity or importance, but are only used to distinguish different components. Words such as "comprising" or "including" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. In the description of the present invention, the terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. When the absolute position of the described object changes, the relative position relationship may also change accordingly. Therefore, it should not be construed as a limitation to the present invention.

[0029] Therefore, those skilled in the art should recognize that although the present invention has been described with reference to preferred embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for counteracting changes in potting pressure during the molding process of a display module, characterized in that, The change in the potting pressure is offset by adjusting the distance 'a' between the other layers of the display module (excluding the glass cover) and the edge of the glass cover to adjust the potting cross-sectional area, thereby offsetting the inconsistent width after injection molding caused by the decrease in potting pressure. The method also includes adjusting the distance near the dispensing port to a minimum, denoted as a. min The maximum distance from the glue outlet is denoted as a. max After adjusting the distance 'a' from the edge of the glass cover to all other layers of the display module except the glass cover, adjust the gradient cutting trajectory according to the dimensions, and then cut the other layers as a whole along the gradient cutting trajectory; among them, The maximum and minimum values ​​of the distance 'a' from the other layers to the edge of the glass cover plate satisfy 0.1 mm. max -a min <0.4mm.​ 2. The method for offsetting changes in potting pressure during the display module assembly process according to claim 1, characterized in that, The maximum and minimum values ​​of the distance 'a' from the other layers to the edge of the glass cover plate satisfy 'a'. max -a min =0.3mm.

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