Y-axis double stroke mechanism and wafer handling device

Abstract

The application provides a Y-axis double-stroke mechanism and a wafer conveying device, and relates to the technical field of semiconductors. The mechanism comprises a base plate, a Y-axis electric cylinder, an extension assembly, a conveying assembly and a Y-axis suction cup. The Y-axis electric cylinder is fixed on the base plate, the extension assembly is slidingly connected to the Y-axis electric cylinder, and the Y-axis electric cylinder is used to push the extension assembly forward or backward. One end of the conveying assembly is fixedly connected to the base plate, the other end of the conveying assembly is fixedly connected to the Y-axis suction cup, the conveying assembly is movably arranged on the extension assembly through a fixing element on the extension assembly, and the Y-axis suction cup is slidingly arranged on the extension assembly. The conveying assembly, the extension assembly and the Y-axis suction cup form a dynamic pulley motion model. The mechanism expands the pushing distance of the Y-axis electric cylinder by two times based on the dynamic pulley motion model formed by the conveying assembly, the extension assembly and the Y-axis suction cup, realizes double-stroke extension, and solves the problem that the existing device cannot smoothly convey wafers in a narrow space.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a Y-axis double travel mechanism and a wafer handling device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits. Its manufacturing process generally involves: adding silicon seed crystals to a high-purity polycrystalline silicon solution, then slowly pulling it out to form a cylindrical silicon ingot; the silicon ingot is then ground, polished, and sliced ​​to form a silicon wafer. In actual production, to ensure that the produced wafers meet usage standards, performance testing and wear testing are performed on the silicon wafers. These operations require the use of appropriate equipment to handle the wafers.

[0003] In practical material handling scenarios, devices often need to perform horizontal rotation, vertical lifting, and horizontal extension / retraction. Horizontal rotation and vertical lifting only require a certain height of space, with less stringent requirements on the width of the space. However, horizontal extension / retraction refers to the horizontal extension / retraction of the Y-axis slider in the device to perform operations such as gripping and placing wafers. These operations need to be performed within a space of a certain width. In a confined space, horizontal extension / retraction will be restricted. For example, in the wafer handling robot disclosed in patent CN113664854A, when a wafer needs to be moved at a distance of 31cm, the slider needs to extend 31cm before the slider can grip the wafer. If the space width is less than 31cm, the slider cannot extend smoothly and the wafer cannot be moved. Summary of the Invention

[0004] One technical problem this invention aims to solve is that existing wafer handling devices require the Y-axis sliding block to extend and retract to complete wafer clamping, which makes wafer handling difficult in confined spaces. To address this problem, this invention provides a Y-axis double-stroke mechanism and a wafer handling device. Details are as follows:

[0005] In a first aspect, embodiments of the present invention provide a Y-axis double-stroke mechanism. This mechanism includes: a base plate, a Y-axis electric cylinder, a telescopic assembly, a conveying assembly, and a Y-axis suction cup;

[0006] The Y-axis electric cylinder is fixed on the base plate, and the telescopic component is slidably connected to the Y-axis electric cylinder. The Y-axis electric cylinder is used to push the telescopic component forward or backward.

[0007] One end of the conveying component is fixedly connected to the substrate, and the other end of the conveying component is fixedly connected to the Y-axis suction cup; the telescopic component is provided with a fixed part, and the conveying component is movably sleeved on the fixed part; the Y-axis suction cup is slidably disposed on the telescopic component; wherein, the conveying component, the telescopic component and the Y-axis suction cup form a movable pulley motion model.

[0008] In some embodiments, the telescopic assembly is provided with a Y-axis linear guide rail, and the bottom of the Y-axis suction cup is provided with a first guide rail groove; the Y-axis suction cup is slidably disposed on the telescopic assembly based on the Y-axis linear guide rail and the first guide rail groove; and / or

[0009] The telescopic assembly is provided with a second guide rail groove, and the bottom of the Y-axis suction cup is provided with an upper guide rail. The Y-axis suction cup is slidably mounted on the telescopic assembly based on the second guide rail groove and the upper guide rail.

[0010] In some embodiments, the bottom of the Y-axis suction cup is provided with a first connector; one side of the first connector is fixedly connected to the other end; the other side of the first connector is slidably disposed on the telescopic assembly;

[0011] The first guide rail groove is located at the bottom of the other side of the first connector, or the upper guide rail is located at the bottom of the other side of the first connector.

[0012] In some embodiments, the telescopic assembly includes: a sliding assembly and a fixed plate; the sliding assembly is fixedly connected to the fixed plate.

[0013] The telescopic component is slidably connected to the Y-axis electric cylinder via a sliding component. The fixed component is set on the fixed plate, and the Y-axis linear guide and / or the second guide groove is set on the fixed plate.

[0014] In some embodiments, one end of the fixed plate is fixedly connected to the top of the sliding component.

[0015] In some embodiments, the conveying component is a conveyor belt, and the stator includes at least two stators; the conveyor belt surrounds the stators and moves relative to the stators.

[0016] In some embodiments, the mechanism further includes a second connector, one end of which is fixedly connected to one end of the transmission component, and the other end of which is fixedly connected to the substrate.

[0017] Secondly, embodiments of the present invention provide a wafer handling apparatus. This apparatus includes the Y-axis double-stroke mechanism described in the first aspect above.

[0018] In some embodiments, the device further includes: a transport drive assembly; a Y-axis double stroke mechanism is fixed to the transport drive assembly via a substrate.

[0019] In some embodiments, the conveying drive assembly includes: a Z-axis lifting mechanism for controlling the lifting height of the device, a rotary θ-axis mechanism for controlling the rotation angle of the device, and a Z-axis sensing sensor assembly for monitoring the lifting height of the Z-axis lifting mechanism; the Z-axis sensing sensor assembly is disposed on the Z-axis lifting mechanism.

[0020] The rotating θ-axis mechanism includes a rotating θ-axis fixing plate and a rotating module. The rotating θ-axis fixing plate is fixed on the Z-axis lifting mechanism, the rotating module is fixed on the rotating θ-axis fixing plate, and the base plate is fixed on the rotating module and rotates with the rotating θ-axis mechanism.

[0021] This invention provides a Y-axis double-stroke mechanism. Based on a movable pulley motion model consisting of a conveying component, a telescopic component, and a Y-axis chuck, this mechanism doubles the sliding distance of the telescopic component (i.e., achieving double the stroke extension), allowing the Y-axis chuck to smoothly complete wafer gripping with twice the sliding distance. This solves the problem in existing devices where the Y-axis sliding assembly needs to extend and retract to complete wafer gripping, making wafer handling difficult in confined spaces. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a Y-axis double stroke mechanism disclosed in an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of the transmission component in a Y-axis double-stroke mechanism disclosed in an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of a wafer handling device disclosed in an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of the transport drive component disclosed in an embodiment of the present invention.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Y-axis double stroke mechanism; 11. Base plate; 12. Y-axis electric cylinder; 13. Fixing plate; 14. Conveyor belt; 14-1. One end of the conveyor assembly; 14-2. The other end of the conveyor assembly; 15. Y-axis linear guide; 16. Y-axis suction cup; 17. First connector; 18. Sliding assembly; 19. Second connector; 20. Stator; 2. Z-axis lifting mechanism; 21. Z-axis electric cylinder assembly; 22. Z-axis lifting guide shaft; 23. Linear bearing; 3. Rotary θ-axis mechanism; 31. Rotary module; 32. Rotary θ-axis fixing plate; 4. Z-axis sensing sensor assembly. Detailed Implementation

[0029] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of the present invention by way of example, but should not be used to limit the scope of the present invention. The present invention can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0030] These embodiments are provided to make the invention thorough and complete, and to fully express the scope of the invention to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as merely exemplary and not as limiting.

[0031] It should be noted that, in the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationships, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0032] Furthermore, the terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible range of error. "Parallel" is not strictly parallel, but within the permissible range of error. Terms such as "including" or "comprising" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0033] It should also be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device.

[0034] All terms used in this invention have the same meaning as understood by one of ordinary skill in the art to which this invention pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0035] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0036] To meet the demands of lean design and manufacturing, this invention provides a Y-axis double-stroke mechanism with double-stroke telescopic adsorption capabilities, enabling wafer handling in confined spaces. Furthermore, to meet flexible manufacturing requirements and replace manual or semi-automatic wafer handling devices, this invention provides a fully automated handling device. This device not only incorporates the Y-axis double-stroke mechanism provided in this invention but also adds a Z-axis sensing sensor assembly to further improve the precision of wafer handling. Details are as follows:

[0037] This invention provides a Y-axis double-stroke mechanism and a wafer handling device. Figure 1 This is a schematic diagram of the structure of a Y-axis double stroke mechanism disclosed in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the transmission component in a Y-axis double-stroke mechanism disclosed in an embodiment of the present invention; Figure 3 This is a schematic diagram of a wafer handling device disclosed in an embodiment of the present invention. The following is in conjunction with… Figure 1-3 The Y-axis double-stroke mechanism and wafer handling device provided by the present invention will be described in detail.

[0038] Firstly, such as Figure 1 and 3 As shown, this embodiment of the invention provides a Y-axis double stroke mechanism. The mechanism 1 includes: a base plate 11, a Y-axis electric cylinder 12, a telescopic assembly, a conveying assembly, and a Y-axis suction cup 16;

[0039] The Y-axis electric cylinder 12 is fixed on the base plate 11, and the telescopic component is slidably connected to the Y-axis electric cylinder 12. The Y-axis electric cylinder 12 is used to push the telescopic component forward or backward.

[0040] One end 14-1 of the transmission component is fixedly connected to the base plate 11, and the other end 14-2 of the transmission component is fixedly connected to the Y-axis suction cup 16; a fixed part is provided on the telescopic component, and the transmission component is movably sleeved on the fixed part; the Y-axis suction cup 16 is slidably disposed on the telescopic component; wherein, the transmission component, the telescopic component and the Y-axis suction cup 16 form a movable pulley motion model.

[0041] In practice, the Y-axis electric cylinder 12 is fixed to the base plate 11, the telescopic assembly is slidably connected to the Y-axis electric cylinder 12, one end 14-1 of the conveying assembly is fixedly connected to the base plate 11, and the other end 14-2 of the conveying assembly is fixedly connected to the Y-axis suction cup 16. The Y-axis suction cup 16 is slidably mounted on the telescopic assembly. With this connection method, when the telescopic assembly slides forward, the distance the Y-axis suction cup 16 slides forward is the sliding distance of the telescopic assembly plus the transfer distance of the conveying assembly, i.e., two distances. In other words, the Y-axis suction cup 16 moves twice the stroke of the telescopic assembly.

[0042] The Y-axis double-stroke mechanism provided in this invention is based on a movable pulley motion model composed of a conveying component, a telescopic component, and a Y-axis chuck. It doubles the sliding distance of the telescopic component (i.e., achieves double the stroke extension), enabling the Y-axis chuck to smoothly complete wafer clamping with twice the sliding distance. This solves the problem in existing devices where the Y-axis sliding group needs to extend and retract the actual distance to complete wafer clamping, making it impossible to smoothly complete wafer handling in a narrow telescopic space.

[0043] In some embodiments, to improve the telescopic motion rate, this embodiment employs a guide rail-slide groove telescopic motion mode. Specifically, as shown... Figure 1 As shown, the telescopic assembly is provided with a Y-axis linear guide rail 15, and the bottom of the Y-axis suction cup 16 is provided with a first guide groove; the Y-axis suction cup 16 is slidably mounted on the telescopic assembly based on the Y-axis linear guide rail 15 and the first guide groove; and / or

[0044] The telescopic assembly is provided with a second guide rail groove, and the bottom of the Y-axis suction cup 16 is provided with an upper guide rail. The Y-axis suction cup 16 is slidably mounted on the telescopic assembly based on the second guide rail groove and the upper guide rail.

[0045] In some embodiments, such as Figure 1 As shown, the bottom of the Y-axis suction cup 16 is provided with a first connector 17; one side of the first connector 17 is fixedly connected to the other end 14-2; the other side of the first connector 17 is slidably disposed on the telescopic assembly.

[0046] The first guide rail groove is located at the bottom of the other side of the first connector 17, or the upper guide rail is located at the bottom of the other side of the first connector 17.

[0047] In this embodiment, the addition of the first connecting member 17 can, on the one hand, ensure the stable operation of the Y-axis suction cup 16 during transportation, and on the other hand, protect the Y-axis suction cup 16 from wear during sliding, thereby increasing the service life of the Y-axis suction cup 16 and thus increasing the service life of the entire mechanism.

[0048] In some embodiments, such as Figure 1 As shown, the telescopic assembly includes: a sliding component 18 and a fixed plate 13; the sliding component 18 is fixedly connected to the fixed plate 13;

[0049] The telescopic assembly is slidably connected to the Y-axis electric cylinder 12 via the sliding assembly 18, the fixed part is set on the fixed plate 13, and the Y-axis linear guide rail 15 and / or the second guide rail groove are set on the fixed plate 13.

[0050] In this embodiment, the telescopic component is divided into functional modules, namely, parts with sliding telescopic functions and parts that need to be connected to the Y-axis suction cup 16 and the conveying component. This arrangement can improve the maintenance efficiency of the mechanism and reduce the maintenance difficulty.

[0051] In some embodiments, such as Figure 1 As shown, one end of the fixed plate 13 is fixedly connected to the top end of the sliding assembly 18. This connection method can, to a certain extent, simultaneously increase the Z-axis height and the Y-axis extension length.

[0052] In some embodiments, such as Figure 2 As shown, the conveying component is a conveyor belt 14, and the stator includes at least two stator members 20; the conveyor belt 14 surrounds the stator members 20 and moves relative to the stator members 20.

[0053] The conveyor belt provided in this embodiment can not only better realize the transmission of the Y-axis suction cup, but also simplify the structure, realizing double-stroke transmission of the Y-axis suction cup based on the principle of movable pulley with the simplest structure.

[0054] In some embodiments, such as Figure 1 and 2 As shown, the mechanism also includes a second connector 19, one end of which is fixedly connected to one end 14-1 of the transmission assembly, and the other end of which is fixedly connected to the substrate 11.

[0055] Secondly, embodiments of the present invention provide a wafer handling apparatus. This apparatus includes: the Y-axis double-stroke mechanism 1 described in the first aspect above.

[0056] In some embodiments, such as Figure 3 and4 As shown, the device also includes: a transport drive assembly; the Y-axis double stroke mechanism 1 is fixed to the transport drive assembly via a base plate 11.

[0057] In some embodiments, such as Figure 3 and 4 As shown, the conveying drive assembly includes: a Z-axis lifting mechanism 2 for controlling the lifting height of the device, a rotation θ-axis mechanism 3 for controlling the rotation angle of the device, and a Z-axis sensing sensor assembly 4 for monitoring the lifting height of the Z-axis lifting mechanism 2; the Z-axis sensing sensor assembly 4 is mounted on the Z-axis lifting mechanism 2.

[0058] The rotating θ-axis mechanism 3 includes a rotating θ-axis fixing plate 32 and a rotating module 31. The rotating θ-axis fixing plate 32 is fixed on the Z-axis lifting mechanism 2, the rotating module 31 is fixed on the rotating θ-axis fixing plate 32, and the base plate 11 is fixed on the rotating module 31 and rotates with the rotating θ-axis mechanism 3.

[0059] Workflow: The entire wafer handling device is fixed to the corresponding equipment. When a product needs to be moved, the Z-axis lifting mechanism 2 rises and falls to a set height, simultaneously detected by the Z-axis sensing sensor component 5. The θ-axis rotation mechanism 3 rotates the Y-axis double-stroke mechanism 1 to a certain position, causing the Y-axis double-stroke mechanism 1 to activate, adsorb the product, and then the θ-axis rotation mechanism 3 rotates to the designated position. The Z-axis lifting mechanism 2 rises and falls to a certain set height, and the Y-axis double-stroke mechanism 4 activates, placing the product in the designated position. This completes the wafer pick-and-place operation.

[0060] Among them, such as Figure 4 As shown, the transport drive assembly mainly consists of a Z-axis electric cylinder assembly 21, a Z-axis lifting guide shaft 22, a linear bearing 23, a rotating θ-axis fixing plate 32, and a rotating module 31.

[0061] Workflow: The Z-axis electric cylinder assembly 21 provides power for lifting, and the Z-axis lifting and guiding are achieved through the Z-axis lifting guide shaft 22 and linear bearing 23. The rotating θ-axis fixing plate 32 is fixed on the Z-axis lifting plate mechanism, and the rotating module 31 is fixed on the rotating θ-axis fixing plate 32. The entire mechanism can realize the movement of the Z-axis and θ-axis.

[0062] The wafer handling device provided in this embodiment of the invention is equipped with the Y-axis double stroke mechanism described in the first aspect above, which enables the device to not only improve operating efficiency, production efficiency and operational safety, but also reduce costs and complete normal handling operations in confined spaces.

[0063] In addition, this embodiment of the invention also provides a machine casing (not shown), mainly composed of a maintenance door, an electrical control box, a button box, a touch screen, a display, tri-color lights, a feeding door, and fluorescent lights. To avoid electrostatic interference, the upper part of the casing uses anti-static transparent acrylic material as doors and windows. The transparent acrylic also ensures that management personnel can clearly see the internal operating status from the outside. The fluorescent lights are turned off when the machine is running. Maintenance personnel can perform maintenance through the maintenance door, and products are fed into the equipment through the feeding door. When the equipment malfunctions, a tri-color light will trigger an alarm, and the alarm system can be manually handled via the touch screen.

[0064] Based on the above disclosure, the wafer handling apparatus provided in the embodiments of the present invention has at least the following advantages:

[0065] 1. Use anti-static outer cover material to prevent the generation of static electricity.

[0066] 2. The accuracy of this device is divided into Z-axis lifting and rotation θ accuracy. Both of these components use high-precision motion parts, ensuring that the handling accuracy meets the requirements of the working conditions and solving the problem of wafer handling accuracy.

[0067] 3. Traditional Y-axis clamping mechanisms all have a single stroke. If a Y-axis suction cup stroke of 1000mm is required, the telescopic component of the traditional Y-axis clamping mechanism needs a stroke of 1000mm. However, if the Y-axis double stroke mechanism provided in this embodiment of the invention is used, only a telescopic component stroke of 500mm is required. This occupies relatively less space during rotation, thus solving the problem of long-stroke transportation of the device in a confined space.

[0068] 4. In the device provided in this embodiment of the invention, the conveying speed is determined by the speed of the Z-axis lifting module and the rotation θ, which solves the problem of the conveying speed of the entire equipment.

[0069] 5. In the device provided in this embodiment of the invention, all moving parts have overload protection functions. If the resistance is too great, the device will automatically cut off the power and sound an alarm. At the same time, the forces of the moving parts are relatively small and within the range that the human body can withstand. Furthermore, the operating speed of the moving parts is not very fast. Therefore, the device provided in this embodiment of the invention solves the problem of human operational safety during handling.

[0070] 6. The device provided in the embodiments of the present invention solves the problem of transportation cost, specifically including: a. The device is fully automatic, eliminating manual labor; b. The device has a simple structure, eliminating complex mechanisms and using a small motion mechanism (i.e., the Y-axis double stroke mechanism 1 provided by the present invention), thereby saving the investment cost of the device; c. The device uses the Y-axis double stroke mechanism 1 provided by the present invention, eliminating the cost of selecting large moving parts and manufacturing components.

[0071] 7. The device provided in this embodiment of the invention further improves and upgrades the operator's labor intensity, work efficiency, and personal safety.

[0072] The various embodiments of the present invention have now been described in detail. To avoid obscuring the concept of the invention, some details known in the art have not been described. Those skilled in the art will fully understand how to implement the technical solutions disclosed herein based on the above description.

[0073] While specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of the invention. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any manner.

Claims

1. A Y-axis double-stroke mechanism, characterized in that, The mechanism includes: a base plate (11), a Y-axis electric cylinder (12), a telescopic assembly, a transmission assembly, and a Y-axis suction cup (16). The Y-axis electric cylinder (12) is fixed on the base plate (11), and the telescopic component is slidably connected to the Y-axis electric cylinder (12). The Y-axis electric cylinder (12) is used to push the telescopic component forward or backward. One end (14-1) of the conveying component is fixedly connected to the substrate (11), and the other end (14-2) of the conveying component is fixedly connected to the Y-axis suction cup (16); the telescopic component is provided with a fixed part, and the conveying component is movably sleeved on the fixed part; the Y-axis suction cup (16) is slidably disposed on the telescopic component; wherein, the conveying component, the telescopic component and the Y-axis suction cup (16) form a movable pulley motion model, the conveying component is a conveyor belt (14), and the fixed part includes at least two stator parts (20); the conveyor belt (14) is sleeved on the stator parts (20) and moves relative to the stator parts (20), and the mechanism further includes: a second connecting member (19), one end of the second connecting member (19) is fixedly connected to the conveyor belt (14), and the other end of the second connecting member (19) is fixedly connected to the substrate (11).

2. The mechanism according to claim 1, characterized in that, The telescopic assembly is provided with a Y-axis linear guide rail (15), and the bottom of the Y-axis suction cup (16) is provided with a first guide rail groove; the Y-axis suction cup (16) is slidably mounted on the telescopic assembly based on the Y-axis linear guide rail (15) and the first guide rail groove; and / or The telescopic assembly is provided with a second guide rail groove, and the bottom of the Y-axis suction cup (16) is provided with an upper guide rail. The Y-axis suction cup (16) is slidably mounted on the telescopic assembly based on the second guide rail groove and the upper guide rail.

3. The mechanism according to claim 2, characterized in that, The bottom of the Y-axis suction cup (16) is provided with a first connector (17); one side of the first connector (17) is fixedly connected to the other end (14-2); the other side of the first connector (17) is slidably disposed on the telescopic assembly; The first guide rail groove is located at the bottom of the other side of the first connector (17), or the upper guide rail is located at the bottom of the other side of the first connector (17).

4. The mechanism according to claim 2, characterized in that, The telescopic assembly includes: a sliding assembly (18) and a fixed plate (13); the sliding assembly (18) is fixedly connected to the fixed plate (13); The telescopic component is slidably connected to the Y-axis electric cylinder (12) via the sliding component (18), the fixed component is disposed on the fixed plate (13), and the Y-axis linear guide (15) and / or the second guide groove is disposed on the fixed plate (13).

5. The mechanism according to claim 4, characterized in that, One end of the fixed plate (13) is fixedly connected to the top of the sliding assembly (18).

6. A wafer handling device, characterized in that, The device includes: the Y-axis double stroke mechanism (1) as described in any one of claims 1-5.

7. The apparatus according to claim 6, characterized in that, The device further includes: a transport drive assembly; the Y-axis double stroke mechanism (1) is fixed to the transport drive assembly via the base plate (11).

8. The apparatus according to claim 7, characterized in that, The transport drive assembly includes: a Z-axis lifting mechanism (2) for controlling the lifting height of the device, a rotation θ-axis mechanism (3) for controlling the rotation angle of the device, and a Z-axis sensing sensor assembly (4) for monitoring the lifting height of the Z-axis lifting mechanism (2); the Z-axis sensing sensor assembly (4) is disposed on the Z-axis lifting mechanism (2). The rotating θ-axis mechanism (3) includes a rotating θ-axis fixing plate (32) and a rotating module (31). The rotating θ-axis fixing plate (32) is fixed on the Z-axis lifting mechanism (2), the rotating module (31) is fixed on the rotating θ-axis fixing plate (32), and the base plate (11) is fixed on the rotating module (31) and rotates with the rotating θ-axis mechanism (3).

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