A dual-mode differential pressure sensor that is easy to assemble

Abstract

This invention discloses a dual-mode differential pressure sensor that is easy to assemble. Through an innovative design of the structure of the fixing frame and connecting spring, a hollow cavity is set on the fixing frame. During the product manufacturing process, only manual insertion of the ceramic module into the second mounting slot and the surface mount circuit board sub-assembly into the first mounting slot are required. This leaves the electrical connection between the ceramic module and the surface mount circuit board sub-assembly open in the hollow cavity. Then, the connecting spring is snapped into the hollow cavity at a defined position to achieve rapid alignment and connection of the electrical connection lines between the ceramic module and the surface mount circuit board sub-assembly. The structural design helps to ensure the stability of the electrical connection, making the assembly of the entire dual-mode differential pressure sensor simple and efficient. It eliminates the need to purchase expensive precision ultrasonic welding equipment and saves the time spent debugging the ultrasonic process, thus solving the problem of precise positioning of aluminum wire.

Description

Technical Field

[0001] This invention relates to the field of differential pressure sensor technology. More specifically, this invention relates to a dual-mode differential pressure sensor that is easy to assemble. Background Technology

[0002] Existing dual-mode differential pressure sensor structures typically employ aluminum wire bonding to ensure electrical connection between the ceramic module and the surface-mount circuit board sub-assembly, followed by precision ultrasonic welding. However, the aluminum wires are thin and difficult to position, and the precision ultrasonic welding equipment is expensive, resulting in large upfront fixed asset investments, low return on investment for single products, and complex and difficult-to-control ultrasonic welding process parameters. Ultimately, this leads to high product costs and weak product competitiveness. Summary of the Invention

[0003] One object of the present invention is to solve at least the above-mentioned problems and to provide at least the advantages that will be described later.

[0004] Another objective of this invention is to provide a dual-mode differential pressure sensor that is easy to assemble, in order to solve the technical problem in the prior art where dual-mode differential pressure sensors rely on aluminum wire welding for electrical connection when assembling ceramic modules and surface mount circuit board subassemblies, resulting in positioning difficulties.

[0005] To achieve these objectives and other advantages according to the present invention, a dual-mode differential pressure sensor that is easy to assemble is provided, comprising:

[0006] The housing sub-assembly has a cavity with an opening at the top. Two pressure ports are provided at the bottom of the housing sub-assembly, and a pin is connected to one end of the cavity with the bottom facing upward.

[0007] The mounting bracket is assembled at the bottom of the cavity and is configured to cooperate with the side wall of the cavity from the side. The mounting bracket has a through interface hole corresponding to the pressure interface and a through insertion hole corresponding to the pin position. The mounting bracket has a first mounting slot and a second mounting slot arranged from top to bottom. The first mounting slot is used to limit the mounting of the surface mount circuit board sub-assembly, and the second mounting slot is used to limit the mounting of the ceramic module. The insertion hole is connected to the first mounting slot. The second mounting slot is located above the interface hole and is connected to the interface hole. The mounting bracket is vertically connected at the same edge of the first and second mounting slots to form a hollow cavity.

[0008] The ceramic module has a built-in pressure chip. A first pad is installed on one side of the ceramic module. The ceramic module is assembled and connected to the second mounting slot with the first pad facing downwards. A plug-in port is provided at the bottom of the ceramic module, and the plug-in port is aligned with the pressure interface.

[0009] A second pad is installed on one side of the surface mount circuit board sub-assembly. The surface mount circuit board sub-assembly is assembled and connected to the first mounting slot with the second pad facing upward. Vertically, the second pad is aligned with the first pad in the hollow cavity. The surface mount circuit board sub-assembly has a circuit board hole aligned with the pin. The pin passes through the hole and the circuit board hole in sequence and is then soldered to the surface mount circuit board sub-assembly.

[0010] A connecting spring has pins at both ends, and the pins are clamped on the upper and lower sides of the hollow cavity. The upper pin of the connecting spring is clamped downward at the second pad, and the lower pin is clamped upward at the first pad, so as to form an electrical connection between the ceramic module and the surface mount circuit board sub-assembly.

[0011] The outer shell sub-assembly has a limiting cavity on the outside of the hollow cavity corresponding to the position of the connecting spring, which is used to limit the connecting spring in the lateral direction;

[0012] A cover plate, which covers the top of the cavity and is fixedly connected to the housing sub-assembly.

[0013] Preferably, the connecting spring includes a fixing part arranged along the length direction of the first mounting groove and a plurality of metal plates connected to the fixing part. The metal plates are arranged at intervals along the length direction of the fixing part and the intervals are consistent with the spacing of the first pad. The metal plates are C-shaped in general. The middle part of the metal plate is connected to the fixing part, and the two ends extend to form a pin. The gap between the upper and lower pins of each metal plate is less than the total thickness of the ceramic module and the surface mount circuit board sub-assembly. The inner side of the fixing part abuts against the outer wall of the fixing frame located in the hollow cavity. The limiting cavity is used to limit the outer side of the fixing part.

[0014] Preferably, the fixing frame has guide walls on both sides of the bottom of the outer wall of the hollow cavity, and a guide angle is provided at the end of the guide wall away from the second mounting groove. All the pins at the lower end of the connecting spring are located between the guide walls on both sides.

[0015] Preferably, the end of the metal sheet has an inwardly oriented slot to form a plurality of contact feet at the pin.

[0016] Preferably, the outer end of the pin is curved outward to form a rounded corner.

[0017] Preferably, the side of the limiting cavity facing the fixing part is provided with positioning ribs, the outer end of the positioning ribs abuts against the corresponding side of the fixing part, the positioning ribs are arranged at intervals along the direction surrounding the fixing part, each positioning rib is centered with the central axis of one of the metal sheets, and the top of each positioning rib is provided with a guide angle.

[0018] Preferably, the fixing part is configured as a limiting part on the outside of the metal sheet through which the fixing part passes. The upper and lower surfaces of the limiting part are both flat. The bottom of the limiting cavity is provided with a boss facing upwards corresponding to the lower surface of the limiting part. The limiting part rests precisely on the boss. The cover plate is provided with a protruding rib facing downwards corresponding to the position of the limiting part. After the cover plate is closed on the top of the cavity, the bottom of the protruding rib abuts against the upper surface of the limiting part.

[0019] Preferably, a reinforcing rib is provided between the side of the protruding rib facing the cavity and the bottom surface of the cover plate.

[0020] Preferably, the outer shell sub-assembly has a slot formed downwards on the side of the limiting cavity opposite to the limiting cavity. The slot is located on the outside of the cavity. A card plate is connected downwards to the edge of the cover plate corresponding to the position of the slot. The card plate is inserted downwards into the slot and is configured to cooperate with the slot.

[0021] Preferably, the outer shell sub-assembly has a lower limiting groove around the two pressure ports at the bottom of the cavity, a limiting rib is provided at the bottom of the fixing frame corresponding to the limiting groove, an upper limiting groove is provided at the top outer periphery of the outer shell sub-assembly, a fixing rib is provided at the outer periphery of the cover plate extending downward to form a fixing rib, and the clamping plate is located outside the fixing rib.

[0022] The present invention has at least the following beneficial effects: The dual-mode differential pressure sensor of the present invention, which is easy to assemble, has an innovative design for the structure of the fixing frame and the connecting spring. The fixing frame is provided with a hollow cavity. During the product manufacturing process, the assembly only requires manual insertion of the ceramic module into the second mounting slot and the surface mount circuit board sub-assembly into the first mounting slot. This leaves the electrical connection between the ceramic module and the surface mount circuit board sub-assembly in the hollow cavity. Then, the connecting spring is picked up and inserted into the hollow cavity at the specified position to achieve quick alignment and connection of the electrical connection lines between the ceramic module and the surface mount circuit board sub-assembly. The structural design helps to ensure the stability of the electrical connection, making the assembly of the entire dual-mode differential pressure sensor simple and efficient. It eliminates the need to purchase expensive precision ultrasonic welding equipment and saves the time of debugging the ultrasonic process. It also solves the problem of precise positioning of aluminum wire. By setting a limiting cavity on the outer shell sub-assembly to form a limiting design for the connecting spring, the assembly accuracy of the connecting spring is improved, and the service life of the connecting spring is also increased.

[0023] Other advantages, objectives and features of the present invention will become apparent in part from the following description, and in part from those skilled in the art through study and practice of the invention. Attached Figure Description

[0024] Figure 1This is a schematic diagram of the split structure of the dual-mode differential pressure sensor of the present invention, which is easy to assemble.

[0025] Figure 2 This is a top view of the dual-mode differential pressure sensor of the present invention after assembly and fixing.

[0026] Figure 3 This is a cross-sectional view of the internal structure of the dual-mode differential pressure sensor of the present invention after assembly, which is easy to assemble.

[0027] Figure 4 This is a top view of the outer casing assembly of the present invention;

[0028] Figure 5 This is a schematic diagram of the structure of the fixing frame of the present invention;

[0029] Figure 6 This is a schematic diagram of the cover plate of the present invention on one side of the bottom surface;

[0030] Figure 7 This is a schematic diagram of the ceramic module of the present invention on one side of the bottom surface;

[0031] Instruction manual drawing reference numerals: 1. Outer shell sub-assembly, 2. Cavity, 3. Pressure interface, 4. Pin, 5. Fixing bracket, 6. Interface hole, 7. Insertion hole, 8. First mounting slot, 9. Second mounting slot, 10. Hollow cavity, 11. Ceramic module, 12. First solder pad, 13. Plug-in port, 14. Surface mount circuit board sub-assembly, 15. Second solder pad, 16. Circuit board hole, 17. Connecting spring, 18. Pin, 19. Limiting cavity, 20. Cover plate, 21. Fixing part, 22. Metal sheet, 23. Guide wall, 24. Guide angle, 25. Slot, 26. Rounded corner, 27. Positioning rib, 28. Boss, 29. Protruding rib, 30. Reinforcing rib, 31. Slot, 32. Card plate, 33. Lower limiting slot, 34. Limiting rib, 35. Upper limiting slot, 36. Fixing rib, 37. Waterproof and breathable membrane. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings, so that those skilled in the art can implement it based on the description.

[0033] It should be noted that, unless otherwise specified, the experimental methods described in the following embodiments are all conventional methods, and the reagents and materials described are all commercially available unless otherwise specified. In the description of this invention, the terms "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0034] like Figure 1-7 As shown, the present invention provides a dual-mode differential pressure sensor that is easy to assemble, comprising:

[0035] The housing assembly 1 has a cavity 2 with an opening at the top. Two pressure ports 3 are provided at the bottom of the housing assembly 1. A pin 4 is connected to the bottom of one end of the cavity 2.

[0036] The mounting bracket 5 is assembled at the bottom of the cavity 2 and is configured to cooperate with the side wall of the cavity 2 from the side. The mounting bracket 5 has a through interface hole 6 corresponding to the pressure interface 3 and a through insertion hole 7 corresponding to the position of the pin 4. The mounting bracket 5 is provided with a first mounting groove 8 and a second mounting groove 9 from top to bottom. The first mounting groove 8 is used to limit the installation of the surface mount circuit board sub-assembly 14, and the second mounting groove 9 is used to limit the installation of the ceramic module 11. The insertion hole 7 is connected to the first mounting groove 8, and the second mounting groove 9 is located above the interface hole 6 and is connected to the interface hole 6. The mounting bracket 5 is vertically connected at the same side edge of the first mounting groove 8 and the second mounting groove 9 to form a hollow cavity 102.

[0037] The ceramic module 11 has a built-in pressure chip. A first solder pad 12 is installed on one side of the ceramic module 11. The ceramic module 11 is assembled and connected to the second mounting groove 9 with the first solder pad 12 facing downward. A plug-in port 13 is provided at the bottom of the ceramic module 11, and the plug-in port 13 is aligned with the pressure interface 3.

[0038] A second pad 15 is mounted on one side of the surface mount circuit board sub-assembly 14. The surface mount circuit board sub-assembly 14 is assembled and connected to the first mounting groove 8 with the second pad 15 facing upward. In the vertical direction, the second pad 15 is aligned with the first pad 12 and is set at the hollow cavity 102. The surface mount circuit board sub-assembly 14 has a circuit board hole 16 aligned with the pin 4. The pin 4 passes through the hole 7 and the circuit board hole 16 in sequence and is then soldered to the surface mount circuit board sub-assembly 14.

[0039] A connecting spring 17 has pins 18 at both ends, and the pins 18 are clamped on the upper and lower sides of the hollow cavity 102. The upper pin 18 of the connecting spring 17 is clamped downward at the second pad 15, and the lower pin 18 is clamped upward at the first pad 12, so as to form an electrical connection between the ceramic module 11 and the surface mount circuit board assembly 14.

[0040] The outer shell assembly 1 has a limiting cavity 19 on the outside of the hollow cavity 102 corresponding to the position of the connecting spring 17, which is used to limit the connecting spring 17 in the lateral direction;

[0041] The cover plate 20 is disposed on the top of the cavity 2 and is fixedly connected to the outer shell sub-assembly 1.

[0042] The dual-mode differential pressure sensor of the present invention consists of a housing sub-assembly 1 (including pins 4 and a circular sleeve), a ceramic module 11 (including a pressure chip), a surface mount circuit board sub-assembly 14 (including various electronic components), a cover plate 20, a fixing bracket 5, potting compound (not shown), a connecting spring 17, and a waterproof and breathable membrane 37. In the prior art, a circular sleeve is set on the housing of the differential pressure sensor as a pressure input interface for connecting to the outside. There are two pressure interfaces 3, one high-pressure interface and one low-pressure interface. In addition, a vent is set on the housing, and a waterproof and breathable membrane 37 is covered and bonded to the outside of the vent to conduct the inside of the housing to the outside atmosphere, thereby improving the measurement accuracy. The pins 4 and the circular sleeve are integrated with the housing sub-assembly 1 by injection molding.

[0043] In assembling the dual-mode differential pressure sensor of the present invention, the ceramic module 11 and the surface mount circuit board assembly 14 are first assembled onto the mounting bracket 5 to form an assembly sub-assembly. Specifically, in top-to-bottom order, the ceramic module 11 is first installed in the second mounting slot 9, with the first pad 12 of the ceramic module 11 aligned with the hollow cavity 102 and facing downwards. Then, the surface mount circuit board assembly 14 is installed tightly above the ceramic module 11, with the second pad 15 of the surface mount circuit board assembly 14 aligned with the hollow cavity 102 and facing upwards. Finally, the connecting spring 17 is taken from the outside of the hollow cavity 102... Figure 4The ceramic module 11 and the surface mount circuit board assembly 14 are clamped together from right to left. The connecting spring 17 abuts against the outer side of the right side wall of the hollow cavity 102, while the pins 18 extend into the vertical area of ​​the hollow cavity 102, specifically the area containing the first pad 12 and the second pad 15. The spring force of the connecting spring 17 clamps the pins 18 at both ends to the first pad 12 and the second pad 15, thus separating the ceramic module 11 and the surface mount circuit board assembly. The assembly 14 forms an electrical connection and constitutes an assembly sub-assembly. The ceramic module 11 is bonded and fixed to the mounting bracket 5 and the surface mount circuit board sub-assembly 14 by applying an appropriate amount of potting compound. Then, the assembly sub-assembly is assembled into the cavity 2 of the housing sub-assembly 1. At the same time, the socket 7, the circuit board hole 16 and the pin 4 are aligned, and the pin 4 is brazed to the surface mount sub-assembly to form an electrical connection. Finally, the cover plate 20 is covered and bonded and fixed to the housing sub-assembly 1 by potting compound (not shown).

[0044] The dual-mode differential pressure sensor of this invention mainly achieves its effect through innovative design of the structure of the fixing frame 5 and the connecting spring 17. The fixing frame 5 is provided with a hollow cavity 102. During the product manufacturing process, assembly only requires manual insertion of the ceramic module 11 into the second mounting slot 9 and the surface mount circuit board assembly 14 into the first mounting slot 8, so that the electrical connection between the ceramic module 11 and the surface mount circuit board assembly 14 is left open at the hollow cavity 102. Then, the connecting spring 17 is picked up and snapped into the hollow cavity 102 at the specified position to realize the ceramic module. The rapid alignment and connection of the electrical connection lines between group 11 and the surface mount circuit board sub-assembly 14 helps to ensure the stability of the electrical connection, making the assembly of the entire dual-mode differential pressure sensor structure simple and efficient. It eliminates the need to purchase expensive precision ultrasonic welding equipment and saves time in debugging the ultrasonic process. It also solves the problem of precise positioning of aluminum wire. By setting a limiting cavity 19 on the housing sub-assembly 1 to form a limiting design for the connecting spring 17, the assembly accuracy of the connecting spring 17 is improved, and the service life of the connecting spring 17 is also increased.

[0045] In another technical solution, such as Figure 1-3 As shown, the connecting spring 17 includes a fixing part 21 arranged along the length direction of the first mounting groove 8 and a plurality of metal plates 22 connected to the fixing part 21. The metal plates 22 are arranged at intervals along the length direction of the fixing part 21 and are consistent with the arrangement interval of the first pad 12. The metal plates 22 are generally C-shaped. The middle part of the metal plate 22 is connected to the fixing part 21 and the two ends extend to form a pin 18. The gap between the upper and lower pins 18 of each metal plate 22 is less than the total thickness of the ceramic module 11 and the surface mount circuit board sub-assembly 14. The inner side of the fixing part 21 abuts against the outer wall of the fixing frame 5 located in the hollow cavity 102. The limiting cavity 19 is used to limit the outer side of the fixing part 21.

[0046] The fixing part 21 is made of plastic. The metal sheet 22 and the fixing part 21 are integrally injection molded. Then, the end of the metal sheet 22 is formed by bending to form the pin 18, which facilitates point contact connection with the first pad 12 or the second pad 15. The gap between the upper and lower poles of the connecting spring 17 is less than the total thickness of the ceramic module 11 and the surface mount circuit board sub-assembly 14. The purpose is that after the connecting spring 17 is assembled, under the elastic force of the pin 18 of the connecting spring 17, the metal pin 18 is tightly attached to the electrical connection between the ceramic module 11 substrate and the surface mount circuit board sub-assembly 14, ensuring the electrical connection between the ceramic module 11 and the surface mount circuit board sub-assembly 14.

[0047] In another technical solution, such as Figure 5 As shown, the fixing frame 5 has guide walls 23 arranged opposite to each other on the bottom sides of the outer side wall of the hollow cavity 102. The end of the guide wall 23 away from the second mounting groove 9 is provided with a guide angle 24. All the pins 18 at the lower end of the connecting spring 17 are located between the guide walls 23 on both sides.

[0048] Through the guide wall 23 as Figure 4 , 5 The right end is provided with a guide angle 24 to facilitate the guidance of the connecting spring 17 during assembly, allowing it to quickly enter the area where the hollow cavity 102 is located, thus shortening the assembly time. Then, all the pins 18 at the lower end of the connecting spring 17 are inserted horizontally between the guide walls 23 on both sides. The guide walls 23 limit and guide the path of the connecting spring 17 during insertion, improving the stability of the assembly connection. Finally, the inner side of the fixing part 21 of the connecting spring 17, facing the ceramic module 11, abuts against the outer side of the outer wall of the hollow cavity 102, thus completing the installation of the connecting spring 17.

[0049] In another technical solution, such as Figure 1-2 As shown, the end of the metal sheet 22 has an inwardly formed groove 25 to form a plurality of contact feet at the pin 18.

[0050] By slotting the pin 18, the electrical contact of the product changes from single-point contact to multi-point contact, which improves the contact stability of the connecting spring 17 and prevents the product from momentarily disconnecting under high-frequency vibration.

[0051] In another technical solution, such as Figure 1-3 As shown, the outer end of the pin 18 is curved outward to form a rounded corner 26.

[0052] The rounded corner 26, when assembling the connecting spring 17, cooperates with the guide angle 24 on the guide wall 23, facilitating the quick and easy assembly of the connecting spring 17.

[0053] In another technical solution, such as Figure 2 , Figure 4 As shown, the side of the limiting cavity 19 facing the fixing part 21 is provided with positioning ribs 27. The outer end of the positioning ribs 27 abuts against the corresponding side of the fixing part 21. The positioning ribs 27 are arranged at intervals along the direction surrounding the fixing part 21. Each positioning rib 27 is centered with the central axis of a metal piece 22. Each positioning rib 27 is provided with a guide angle 24 at its top.

[0054] After assembling the assembly sub-assembly, the fixing bracket 5, along with the connecting spring 17, is placed downwards into the outer shell sub-assembly 1. The connecting spring 17 is aligned with the position of the limiting cavity 19. The evenly distributed positioning ribs 27 are arranged one-to-one with the number of metal pieces 22 on the fixing part 21. From the top guide angle 24, they guide the fixing part 21 of the connecting spring 17 downwards, shortening the assembly time, and then perform the limiting function. Figure 2 As shown, the positioning rib 27 on the outer periphery of the connecting spring 17 can limit the shaking of the connecting spring 17 in the cavity 2 in the direction of the corresponding side, improve the assembly accuracy, and at the same time prevent the fixing part 21 of the connecting spring 17 from bending as a whole due to uneven force on the connecting spring 17, which would affect the assembly accuracy.

[0055] In another technical solution, such as Figure 1-4 As shown, the fixing part 21 is set as a limiting part on the outside of the metal sheet 22. The upper and lower surfaces of the limiting part are both flat. The bottom of the limiting cavity 19 is provided with a boss 28 facing upwards corresponding to the lower surface of the limiting part. The limiting part rests on the boss 28. The cover plate 20 is provided with a protruding rib 29 facing downwards corresponding to the position of the limiting part. After the cover plate 20 covers the top of the cavity 2, the bottom of the protruding rib 29 abuts against the upper surface of the limiting part.

[0056] The structure of the fixing part 21 and the limiting cavity 19 is designed to facilitate mutual cooperation. After the connecting spring 17 enters the preset position of the limiting cavity 19, it can be quickly positioned and installed. The bottom side of the fixing part 21 is limited and supported by the set boss 28, and the top side of the fixing part 21 is limited by the cover plate 20 that is finally set, thereby clamping the upper and lower sides of the connecting spring 17, limiting the up and down shaking, and preventing the connecting spring 17 from vibrating due to product vibration during product operation, which would lead to poor electrical connection between the ceramic substrate and the surface mount circuit board assembly 14.

[0057] In another technical solution, such as Figure 3 , Figure 6As shown, a reinforcing rib 30 is provided between the side of the protruding rib 29 facing the cavity 2 and the bottom surface of the cover plate 20. The reinforcing rib 30 is formed by injection molding. The protruding rib 29 is limited on one side by abutting against the upper sidewall of the limiting cavity 19 in the horizontal direction, and is reinforced by the reinforcing rib 30 on the other side, thereby ensuring the force balance of the protruding rib 29 on both sides. This causes the protruding rib 29 to apply only vertical pressure to the upper side of the fixing part 21, which helps to ensure the stability of the entire structure inside the cavity 2.

[0058] In another technical solution, such as Figure 1 , 2 As shown in Figures 4 and 6, on the side of the outer shell assembly 1 where the limiting cavity 19 is located, a slot 31 is formed downwards at the end opposite to the limiting cavity 19. The slot 31 is located on the outside of the cavity 2. A retaining plate 32 is connected downwards to the edge of the cover plate 20 corresponding to the position of the slot 31. The retaining plate 32 is inserted downwards into the slot 31 and is configured to cooperate with the slot 31. By setting the cooperation structure between the slot 31 and the retaining plate 32, when installing the cover plate 20, the retaining plate 32 is aligned with the slot 31 and inserted downwards, thus achieving quick positioning and installation of the cover plate 20.

[0059] In another technical solution, such as Figure 3 , 4 As shown, the outer shell sub-assembly 1 has a lower limiting groove 33 around the two pressure ports 3 at the bottom of the cavity 2, and a limiting rib 34 is provided at the bottom of the fixing frame 5 corresponding to the limiting groove. The outer shell sub-assembly 1 has an upper limiting groove 35 on the outer periphery of the top of the cavity 2. The outer periphery of the cover plate 20 extends downward to form a fixing rib 36, and the clamping plate 32 is located outside the fixing rib 36.

[0060] By setting a lower limiting groove 33 at the bottom of the cavity 2, it is convenient to quickly position and install the fixing frame 5 in the cavity 2. The upper limiting groove 35 and the lower limiting groove 33 can also be used as glue injection positions, which facilitates quick glue injection and bonding between adjacent structures.

[0061] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for the present invention. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A dual-mode differential pressure sensor that is easy to assemble, characterized in that, include: The housing sub-assembly has a cavity with an opening at the top. Two pressure ports are provided at the bottom of the housing sub-assembly, and a pin is connected to one end of the cavity with the bottom facing upward. The mounting bracket is assembled at the bottom of the cavity and is configured to cooperate with the side wall of the cavity from the side. The mounting bracket has a through interface hole corresponding to the pressure interface and a through insertion hole corresponding to the pin position. The mounting bracket has a first mounting slot and a second mounting slot arranged from top to bottom. The first mounting slot is used to limit the mounting of the surface mount circuit board sub-assembly, and the second mounting slot is used to limit the mounting of the ceramic module. The insertion hole is connected to the first mounting slot. The second mounting slot is located above the interface hole and is connected to the interface hole. The mounting bracket is vertically connected at the same edge of the first and second mounting slots to form a hollow cavity. The ceramic module has a built-in pressure chip. A first pad is installed on one side of the ceramic module. The ceramic module is assembled and connected to the second mounting slot with the first pad facing downwards. A plug-in port is provided at the bottom of the ceramic module, and the plug-in port is aligned with the pressure interface. A second pad is installed on one side of the surface mount circuit board sub-assembly. The surface mount circuit board sub-assembly is assembled and connected to the first mounting slot with the second pad facing upward. Vertically, the second pad is aligned with the first pad in the hollow cavity. The surface mount circuit board sub-assembly has a circuit board hole aligned with the pin. The pin passes through the hole and the circuit board hole in sequence and is then soldered to the surface mount circuit board sub-assembly. A connecting spring has pins at both ends, and the pins are clamped on the upper and lower sides of the hollow cavity. The upper pin of the connecting spring is clamped downward at the second pad, and the lower pin is clamped upward at the first pad, so as to form an electrical connection between the ceramic module and the surface mount circuit board sub-assembly. The connecting spring includes a fixing part arranged along the length of the first mounting groove and multiple metal pieces connected to the fixing part. The metal pieces are C-shaped in general. The middle of the metal pieces is connected to the fixing part, and the two ends extend to form a pin. The gap between the upper and lower pins of each metal piece is less than the total thickness of the ceramic module and the surface mount circuit board sub-assembly. The inner side of the fixing part abuts against the outer wall of the fixing frame located in the hollow cavity. The fixing part is set as a limiting part on the outer side of the metal pieces. The upper and lower surfaces of the limiting part are both flat. The bottom of the limiting cavity is provided with a boss facing upwards corresponding to the lower surface of the limiting part. The limiting part rests on the boss. The outer shell sub-assembly has a limiting cavity on the outside of the hollow cavity corresponding to the position of the connecting spring, which is used to limit the connecting spring in the lateral direction; The side of the limiting cavity facing the fixing part is provided with a positioning rib, and the outer end of the positioning rib abuts against the corresponding side of the fixing part; A cover plate, which covers the top of the cavity and is fixedly connected to the housing sub-assembly; The cover plate has a protruding rib at the position corresponding to the limiting part. After the cover plate is closed on the top of the cavity, the bottom of the protruding rib abuts against the upper surface of the limiting part.

2. The dual-mode differential pressure sensor as described in claim 1, characterized in that, The metal sheets are arranged at intervals along the length of the fixing part and the intervals are consistent with those of the first solder pads.

3. The dual-mode differential pressure sensor as described in claim 2, characterized in that, The fixing frame has guide walls on both sides of the bottom of the outer wall of the hollow cavity. The end of the guide wall away from the second mounting groove is provided with a guide angle. All the pins of the lower end of the connecting spring are located between the guide walls on both sides.

4. The dual-mode differential pressure sensor as described in claim 2, characterized in that, The metal sheet has an inwardly oriented slot at its end to form multiple contact feet at the pin.

5. The dual-mode differential pressure sensor as described in claim 2, characterized in that, The outer end of the pin is curved outward to form a rounded corner.

6. The dual-mode differential pressure sensor as described in claim 1, characterized in that, The positioning ribs are arranged at intervals along the direction surrounding the fixing part, each positioning rib is centered on the central axis of one of the metal sheets, and each positioning rib has a guide angle at its top.

7. The dual-mode differential pressure sensor as described in claim 1, characterized in that, A reinforcing rib is provided between the side of the protruding rib facing the cavity and the bottom surface of the cover plate.

8. The dual-mode differential pressure sensor as described in claim 1, characterized in that, The outer shell sub-assembly has a slot on one side of the limiting cavity, opposite to the limiting cavity. The slot is located on the outside of the cavity. The edge of the cover plate is connected downward to a card plate corresponding to the position of the card slot. The card plate is inserted downward into the card slot and is configured to cooperate with the card slot.

9. The dual-mode differential pressure sensor as described in claim 8, characterized in that, The outer shell sub-assembly has a lower limiting groove around the two pressure ports at the bottom of the cavity. The bottom of the fixing frame has a limiting rib at the position corresponding to the limiting groove. The outer shell sub-assembly has an upper limiting groove at the top outer periphery of the cavity. The outer periphery of the cover plate extends downward to form a fixing rib. The clamping plate is located outside the fixing rib.

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