An optical coupling assembly and method of manufacturing the same

Abstract

The application relates to the technical field of optical communication, and provides an optical coupling assembly and a manufacturing method thereof. The optical coupling assembly comprises a plurality of laser chips, a plurality of first lenses, an AWG MUX chip, a second lens, an isolator and an optical fiber array assembly; the plurality of laser chips emit a plurality of optical signals, the optical signals are coupled and converged through corresponding first lenses respectively, and then enter the AWG MUX chip; the AWG MUX chip couples the plurality of optical signals into a combined wave signal, and then outputs the combined wave signal through the AWG MUX chip; the second lens couples and converges the combined wave signal; and the combined wave signal enters an optical fiber in the optical fiber array assembly with the isolator. In the application, the optical coupling assembly has a simple structure, the assembly process is easy to realize, and the optical coupling assembly has a significant cost advantage.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to an optical coupling component and its manufacturing method. Background Technology

[0002] Traditional four-channel FA (Fiber Array) optical coupling components are based on four-channel emitting lasers, typically using four wavelength chips. The coupling method involves the light emitted by the four laser chips being coupled and converged by four LD lenses (diode lenses), passing through a four-channel isolator array, and then entering four different input waveguide ports of an AWG MUX (Arrayed Waveguide Grating Multiplexer) chip. The AWG MUX chip combines the four wavelengths of light into a single beam, which is emitted from the output waveguide port of the AWG MUX chip and enters a single fiber in the FA. Due to the use of a four-channel isolator array, the structure of this optical coupling component is relatively complex and the manufacturing cost is high.

[0003] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide an optical coupling component and its manufacturing method, so as to solve the problems of complex structure and high manufacturing cost of optical coupling components in the prior art.

[0005] The present invention adopts the following technical solution:

[0006] In a first aspect, embodiments of the present invention provide an optical coupling component, the optical coupling component comprising: a plurality of laser chips 1, a plurality of first lenses 2, an AWG MUX chip 3, a second lens 4, an isolator 5, and an optical fiber array assembly 6, wherein:

[0007] Each of the laser chips 1 is disposed on one side of the first lens 2, and each laser chip 1 corresponds to one first lens 2. The laser chip 1 is used to emit light signals.

[0008] The first lens 2 is disposed on one side of the AWG MUX chip 3, and the second lens 4 is disposed on the other side of the AWG MUX chip 3; the first lens 2 is used to transmit its corresponding optical signal to the AWG MUX chip 3, and the AWG MUX chip 3 is used to couple multiple optical signals into a combined signal and transmit the combined signal to the second lens 4;

[0009] The isolator 5 is disposed between the second lens 4 and the fiber array assembly 6; the second lens 4 is used to send the multiplexed signal to the isolator 5, and the fiber array assembly 6 is used to transmit the multiplexed signal to the outside.

[0010] Furthermore, the optical coupling assembly also includes a substrate 7, on which the laser chip 1, the first lens 2, the AWG MUX chip 3, the second lens 4, and the fiber array assembly 6 are all disposed.

[0011] Furthermore, the optical coupling assembly also includes a plurality of pads 8 disposed on the substrate 7 and below the first lens 2 and / or the second lens 4.

[0012] Furthermore, the optical coupling component also includes a substrate 9, which is disposed on the substrate 7, and the laser chip 1 is disposed on the substrate 9 at predetermined intervals. The substrate 9 is used to dissipate heat from the laser chip 1.

[0013] Furthermore, the AWG MUX chip 3 includes multiple input waveguide ports 31, a multiplexing region 32, and an output waveguide port 33, wherein:

[0014] The first lens 2 is provided on the opposite side of the input waveguide port 31 so that the input waveguide port 31 can receive multiple optical signals emitted by the laser chip 1.

[0015] The multiplexing region 32 is used to couple multiple optical signals into a multiplexed signal;

[0016] The second lens 4 is provided on the opposite side of the output waveguide port 33 to facilitate the transmission of the combined signal to the fiber array assembly 6.

[0017] Furthermore, the optical coupling assembly also includes a monitoring chip 10 and a third lens 11, and the AWG MUX chip 3 also includes multiple backlight waveguide ports 34, wherein:

[0018] Each backlight waveguide port 34 corresponds to each input waveguide port 31 to receive the optical signal emitted by the corresponding laser chip 1;

[0019] The monitoring chip 10 is disposed on the opposite side of the backlight waveguide port 34, and the third lens 11 is disposed between the monitoring chip 10 and the backlight waveguide port 34.

[0020] The monitoring chip 10 is used to receive the optical signal output from the backlight waveguide port 34 in order to detect the working status of the laser chip 1;

[0021] When the monitoring chip 10 detects that one of the laser chips 1 is in an abnormal working state, it sets up two laser chips 1 as a laser chip group, and each laser chip group is used to emit one optical signal so that the optical coupling component can be used normally.

[0022] In a second aspect, embodiments of the present invention provide a method for manufacturing an optical coupling component, used to manufacture the optical coupling component as described in the first aspect, the manufacturing method comprising:

[0023] Multiple laser chips 1, AWG MUX chips 3, isolators 5, and fiber array components 6 are sequentially arranged at corresponding positions on the substrate 7.

[0024] Multiple second lenses 4 are pre-coupled at predetermined positions in the optical path between the AWG MUX chip 3 and the isolator 5. The second lenses 4 are adjusted until the fiber array assembly 6 can receive the multiplexed signal.

[0025] In the optical path between the laser chip 1 and the AWG MUX chip 3, the positions of multiple first lenses 2 are adjusted sequentially, and then the power of the laser chip 1 is adjusted until the optical power of the combined signal received by the fiber array assembly 6 reaches a preset standard value.

[0026] Furthermore, the step of sequentially mounting the plurality of laser chips 1, AWG MUX chips 3, isolators 5, and fiber array components 6 on corresponding positions on the substrate 7 includes:

[0027] The AWG MUX chip 3 is disposed on the substrate 7, and the substrate 9 is disposed at the corresponding positions of the multiple input waveguide ports 31 of the AWG MUX chip 3. Multiple laser chips 1 are disposed on the substrate 9 so that the light-emitting strip of the laser chip 1 is aligned with the corresponding input waveguide port 31.

[0028] Multiple pads 8 are provided on the sides of the multiple input waveguide ports 31 of the AWG MUX chip 3, and multiple first lenses 2 are provided on the multiple pads 8; a pad 8 is provided on the side of the output waveguide port 33 of the AWG MUX chip 3, and a second lens 4 is provided on the pad 8.

[0029] The isolator 5 is placed at the input end of the fiber array assembly 6, the fiber array assembly 6 is placed on the substrate 7, and the isolator 5 is aligned with the output waveguide port 33 of the AWG MUX chip 3.

[0030] Further, the step of pre-coupling multiple second lenses 4 at predetermined positions in the optical path between the AWG MUX chip 3 and the isolator 5, and adjusting the second lenses 4 until the fiber array assembly 6 can receive the multiplexed signal, includes:

[0031] Powering all laser chips 1 simultaneously causes all laser chips 1 to emit multiple optical signals;

[0032] Adjust the positions of the second lens 4, the isolator 5, and the fiber array assembly 6 to ensure that the fiber array assembly 6 can receive the multiplexed signal;

[0033] Adjust the power of all laser chips 1 so that the optical power of the optical signals emitted by all laser chips 1 meets the pre-coupling standard value, so that after the multiple optical signals are coupled into a combined signal in the AWG MUX chip 3, the combined signal can be transmitted to the fiber array assembly 6.

[0034] Further, the step of sequentially adjusting the positions of multiple first lenses 2 and then adjusting the power of the laser chip 1 in the optical path between the laser chip 1 and the AWG MUX chip 3 until the optical power of the combined signal received by the fiber array assembly 6 reaches a preset standard value includes:

[0035] Powering all laser chips 1 simultaneously causes all laser chips 1 to emit multiple optical signals;

[0036] The first lens 2 is placed on the pad 8 between the AWG MUX chip 3 and the laser chip 1, and the position of the first lens 2 is adjusted to ensure the focusing effect of the first lens 2;

[0037] The power of all laser chips 1 is adjusted based on the coupling standard value until the combined signal meets the preset standard value requirement.

[0038] In this embodiment of the invention, the optical coupling component includes: multiple laser chips 1, multiple first lenses 2, an AWG MUX chip 3, a second lens 4, an isolator 5, and an optical fiber array assembly 6. The laser chips 1 are disposed on one side of the first lenses 2, the first lenses 2 are disposed on one side of the AWG MUX chip 3, and the second lenses 4 are disposed on the other side of the AWG MUX chip 3. The isolator 5 is disposed between the second lenses 4 and the optical fiber array assembly 6. Multiple laser chips 1 emit multiple optical signals, which are coupled and converged by their respective first lenses 2, and then enter the AWG MUX chip 3. The AWG MUX chip 3 couples the multiple optical signals into a combined signal, which is then output. The second lenses 4 couple and converge the combined signal, which then enters one optical fiber in the optical fiber array assembly 6 equipped with the isolator 5. In this embodiment of the invention, only one isolator is required, the optical coupling component has a simple structure, is easy to assemble, and has significant cost advantages. Attached Figure Description

[0039] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0040] Figure 1 This is a schematic diagram of the structure of an optical coupling component provided in an embodiment of the present invention;

[0041] Figure 2 This is a schematic diagram of another structure of an optical coupling component provided in an embodiment of the present invention;

[0042] Figure 3 This is a front view schematic diagram of the structure of an optical coupling component provided in an embodiment of the present invention;

[0043] Figure 4 This is a top view schematic diagram of the structure of an optical coupling component provided in an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram of the internal structure of an AWG MUX chip for an optical coupling component provided in an embodiment of the present invention;

[0045] Figure 6 This is a schematic flowchart of a method for manufacturing an optical coupling component according to an embodiment of the present invention;

[0046] Figure 7 This is provided by the embodiments of the present invention. Figure 6 A detailed flowchart of step 101 is shown below;

[0047] Figure 8 This is provided by the embodiments of the present invention. Figure 6 A detailed flowchart of step 102 is shown below;

[0048] Figure 9 This is provided by the embodiments of the present invention. Figure 6 A schematic diagram of the specific process for step 103.

[0049] The reference numerals in the attached figures are as follows: laser chip 1; first lens 2; AWG MUX chip 3; input waveguide port 31; multiplexing area 32; output waveguide port 33; backlight waveguide port 34; second lens 4; isolator 5; fiber array assembly 6; substrate 7; pad 8; substrate 9; monitoring chip 10; third lens 11. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0051] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0052] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0053] Example 1:

[0054] Embodiment 1 of the present invention provides an optical coupling component, combined with Figure 1 The optical coupling assembly includes: multiple laser chips 1, multiple first lenses 2, an AWG MUX chip 3, a second lens 4, an isolator 5, and an optical fiber array assembly 6.

[0055] Each of the laser chips 1 is disposed on one side of the first lens 2, and each laser chip 1 corresponds to one first lens 2. The laser chip 1 is used to emit light signals.

[0056] The first lens 2 is disposed on one side of the AWG MUX chip 3, and the second lens 4 is disposed on the other side of the AWG MUX chip 3; the first lens 2 is used to transmit its corresponding optical signal to the AWG MUX chip 3, and the AWG MUX chip 3 is used to couple multiple optical signals into a combined signal and transmit the combined signal to the second lens 4.

[0057] The isolator 5 is disposed between the second lens 4 and the fiber array assembly 6; the second lens 4 is used to send the multiplexed signal to the isolator 5, and the fiber array assembly 6 is used to transmit the multiplexed signal to the outside.

[0058] The first lens 2 and the second lens 4 are LD lenses (Lens Laser Diode Lenses). The first lens 2 focuses the optical signal emitted by the laser chip 1 to accurately transmit the optical signal to the AWG MUX chip 3. The second lens 4 focuses the combined signal to accurately transmit the combined signal to the isolator 5. The isolator 5 prevents the optical signal entering the fiber array assembly 6 from being transmitted backward and prevents the reverse-transmitted optical signal from interfering with the transmission of the combined signal by the second lens 4 and the AWG MUX chip 3, thereby improving the stability of the optical path within the optical coupling assembly.

[0059] Compared to setting multiple isolators at the laser chip 1 end, this embodiment only sets one isolator 5 at the fiber array assembly 6 end. The reason is that in the optical path from the laser chip 1 to the AWG MUX chip 3 side, because the input waveguide port of the AWG MUX chip 3 is small, the optical path between the laser chip 1 and the AWG MUX chip 3 is very precise, and the optical signal is not easily reflected. In the optical path from the AWG MUX chip 3 to the fiber array assembly 6 end, because the input port of the fiber array assembly 6 is relatively large, the combined signal is prone to reflection at this point. Therefore, setting one isolator 5 at the fiber array assembly 6 end can prevent most of the optical signal reflection, effectively improving the stability of the system optical path, while reducing the structural complexity and manufacturing cost of the optical coupling assembly.

[0060] In this embodiment, multiple laser chips 1 emit multiple optical signals, which are coupled and converged by corresponding first lenses 2, and then enter the AWG MUX chip 3. The AWG MUX chip 3 couples the multiple optical signals into a combined signal, which is then output as a combined signal. The second lens 4 couples and converges the combined signal, which then enters one optical fiber in the fiber array assembly 6 with an isolator 5. In this embodiment, the optical coupling assembly only has one isolator on the fiber array assembly side, resulting in a simpler structure, easier assembly, and significant cost advantages. Because the input waveguide port of the AWG MUX chip 3 is small, the optical path between the laser chip 1 and the AWG MUX chip 3 is very precise, making optical signal reflection less likely. Even without the isolator, optical crosstalk will not increase.

[0061] In order to fix the components on the optical coupling assembly, combined with Figures 2-4The optical coupling assembly further includes a substrate 7, on which the laser chip 1, the first lens 2, the AWG MUX chip 3, the second lens 4, and the fiber array assembly 6 are sequentially disposed.

[0062] The substrate 7 is a ceramic substrate. The AWG MUX chip 3 and the fiber array assembly 6 are attached to the substrate 7. The isolator 5 is attached to the fiber array assembly 6. The isolator 5 is positioned facing the AWG MUX chip 3. Multiple laser chips 1 are equally spaced on the substrate 7.

[0063] In order to better couple the first lens 2 and the second lens 4 into the optical path of the optical coupling assembly, combined Figures 2-4 The optical coupling assembly further includes a plurality of pads 8, which are disposed on the substrate 7 and below the first lens 2 and / or the second lens 4.

[0064] The spacer 8 is a glass spacer. Multiple spacers 8 are disposed between the AWG MUX chip 3 and the laser chip 1, and these multiple spacers 8 are used to mount multiple first lenses 2. Spacers 8 are also disposed between the AWG MUX chip 3 and the fiber array assembly 6, and these spacers 8 are used to mount second lenses 4. The spacers 8 are attached to predetermined positions on the substrate 7, and the first lenses 2 and second lenses 4 are disposed on the spacers 8, coupled into the optical path of the optical coupling assembly at predetermined tilt angles and heights.

[0065] In order to ensure that the optical coupling component has good heat dissipation performance, combined with Figures 2-4 In this embodiment, the optical coupling component further includes a substrate 9, which is disposed on the substrate 7. The laser chip 1 is disposed on the substrate 9 at predetermined intervals, and the substrate 9 is used to dissipate heat for the laser chip 1.

[0066] Because the laser chip 1 generates a significant amount of heat during operation, without proper heat dissipation measures, its temperature will continue to rise, affecting its normal operation and potentially causing damage. Therefore, a substrate 9 is needed to dissipate heat from the laser chip 1. The substrate 9 possesses excellent thermal conductivity and high reliability, enabling efficient and prolonged heat dissipation from the laser chip 1.

[0067] In practical applications, substrate 9 can be a single substrate, and multiple laser chips 1 can share a single substrate; or, substrate 9 can be an independent small substrate, with each laser chip 1 corresponding to a small substrate.

[0068] In an optional embodiment, each laser chip 1 is provided with a separate substrate 9, which saves material of the substrate 9 and reduces the cost of the optical coupling component compared to multiple laser chips 1 sharing a single substrate 9.

[0069] In an optional embodiment, the substrate 9 is a single substrate. Compared to each laser chip 1 having a separate substrate 9, the substrate 9 has a larger volume, which can enhance the heat dissipation function of the substrate 9 for the laser chip 1.

[0070] In order to perform multiplexer processing on multiple optical signals, combined with Figure 5 In this embodiment, the AWG MUX chip 3 includes multiple input waveguide ports 31, a multiplexing region 32, and an output waveguide port 33. The multiple input waveguide ports 31 are connected to the multiplexing region 32, and the multiplexing region 32 is connected to the output waveguide port 33.

[0071] The input waveguide port 31 is provided with a corresponding first lens 2 on its opposite side, so that the input waveguide port 31 can receive multiple optical signals emitted by the laser chip 1; the multiplexing region 32 is used to couple multiple optical signals into a multiplexed signal; the output waveguide port 33 is provided with a second lens 4 on its opposite side, so that the multiplexed signal can be transmitted to the fiber array assembly 6.

[0072] Each laser chip 1 emits an optical signal. The optical signal passes through the corresponding first lens 2 and enters the AWG MUX chip 3 through the corresponding input waveguide port 31. The multiplexing area 32 combines the received multiple optical signals to form the combined signal. The combined signal is transmitted through the internal optical path to the output waveguide port 33 and output to the outside of the AWG MUX chip 3. After being focused by the second lens 4, the combined signal enters the fiber array assembly 6 through the isolator 5.

[0073] To transmit optical signals of different wavelengths, in this embodiment, each laser chip 1 emits optical signals of different wavelengths. The types of laser chips 1 include, but are not limited to, DFB (Distributed Feedback Laser), FB (Feedback Laser), VCSEL (Vertical-Cavity Surface-Emitting Laser), and EML (Electroabsorption Modulated Laser); the wavelengths of the optical signals emitted by the laser chip 1 include, but are not limited to, 850nm, 1310nm, and 1550nm.

[0074] In order to monitor the operating status of the optical coupling component, in this embodiment, combined with Figures 1-5 The optical coupling assembly further includes a monitoring chip 10 and a third lens 11. The AWG MUX chip 3 also includes multiple backlight waveguide ports 34, wherein: each backlight waveguide port 34 corresponds to each input waveguide port 31 to receive the optical signal emitted by the corresponding laser chip 1; the monitoring chip 10 is disposed on the opposite side of the backlight waveguide port 34, and the third lens 11 is disposed between the monitoring chip 10 and the backlight waveguide port 34; the monitoring chip 10 is used to receive the optical signal output by the backlight waveguide port 34 to detect the working status of the laser chip 1.

[0075] The third lens 11 is used to collimate the optical signal so that it can be transmitted to the monitoring chip 10. The monitoring chip 10 can determine whether there is a laser chip 1 with abnormal operating status based on the optical power of multiple optical signals. The monitoring chip 10 internally stores an optical power lookup table, which stores the overall optical power values ​​of multiple optical signals when different numbers of laser chips 1 are operating. When the optical coupling component is working, the monitoring chip 10 determines whether the laser chip 1 is faulty based on the optical power lookup table and the real-time acquired overall optical power values ​​of multiple optical signals.

[0076] When one of the laser chips 1 fails, the overall optical power of the multi-channel optical signals drops by approximately a preset value. At this point, the monitoring chip 10 can determine that one of the laser chips 1 is faulty. When two laser chips 1 fail, the overall optical power of the multi-channel optical signals drops by approximately two preset values. In other words, when one laser chip 1 fails, the overall optical power of the multi-channel optical signals drops by one step; when two laser chips 1 fail, the overall optical power of the multi-channel optical signals drops by two steps, and so on. The monitoring chip 10 determines the number of faulty laser chips 1 based on the overall optical power of the multi-channel optical signals.

[0077] When the monitoring chip 10 detects that one of the laser chips 1 is in an abnormal working state, it groups the laser chips 1 into pairs, with each laser chip group emitting one optical signal so that the optical coupling component can be used normally.

[0078] Under normal circumstances, when one of the laser chips 1 malfunctions, the operation of the optical coupling component needs to be stopped immediately, and the faulty optical coupling component needs to be replaced with a normal one to ensure that information can be transmitted normally.

[0079] In this embodiment, the laser chips 1 are grouped in pairs for operation, with each laser chip group containing two laser chips 1. This ensures that each laser chip group contains at least one normally functioning laser chip 1, guaranteeing that each laser chip group can normally emit one optical signal. This is equivalent to reducing the operating efficiency of the optical coupling component to ensure that the optical coupling component can normally transmit all information, avoiding information transmission abnormalities due to a problem with one laser chip. When the number of laser chips 1 is odd, there will inevitably be a group containing only one laser chip 1. If this laser chip 1 is functioning normally, the optical power of the multi-channel optical signals after grouping will be greater than half the optical power before grouping; if this laser chip 1 malfunctions, the optical power of the multi-channel optical signals after grouping will be less than half the optical power before grouping. Based on this, the monitoring chip 10 can determine whether a single laser chip 1 has malfunctioned.

[0080] In this embodiment, in order to achieve the multiplexing and transmission of four optical signals, there are four laser chips 1, four first lenses 2, five spacers 8, and the AWG MUX chip 3 includes four input waveguide ports 31. Each first lens 2 is correspondingly disposed at the front end of a laser chip 1, and a spacer 8 is disposed under each first lens 2. Each laser chip 1 corresponds to one input waveguide port 31 to transmit the four optical signals into the AWG MUX chip 3.

[0081] Example 2:

[0082] This embodiment 2 provides a method for manufacturing an optical coupling component, used to manufacture the optical coupling component as described in embodiment 1, in conjunction with... Figure 6 The manufacturing method includes:

[0083] Step 101: Sequentially arrange the laser chips 1, AWG MUX chips 3, isolators 5, and fiber array components 6 on the substrate 7 at corresponding positions.

[0084] The substrate 7 is a ceramic substrate; the isolator 5 is a single-channel isolator, which is attached to the fiber array assembly 6; the AWG MUX chip 3, the substrate 9, and the multiple pads 8 are attached to the substrate 7.

[0085] Step 102: Pre-couple multiple second lenses 4 at predetermined positions in the optical path between the AWG MUX chip 3 and the isolator 5, and adjust the second lenses 4 until the fiber array assembly 6 can receive the multiplexed signal.

[0086] In this configuration, a single second lens 4 is actively coupled and bonded to the pad 8. The significance of optical path pre-coupling is to ensure that the multiple optical signals emitted from the laser chip 1, after being combined by the AWG MUX chip 3, can reach the fiber array assembly 6.

[0087] Step 103: In the optical path between the laser chip 1 and the AWG MUX chip 3, the positions of multiple first lenses 2 are adjusted sequentially, and then the power of the laser chip 1 is adjusted until the optical power of the combined signal received by the fiber array assembly 6 reaches the preset standard value.

[0088] In this configuration, multiple first lenses 2 are actively coupled and bonded to multiple pads 8; both the first lenses 2 and the second lenses 4 are LD lenses. The significance of optical path coupling is to enable the fiber optic array assembly 6 to receive a combined signal with a predetermined power value or higher, ensuring that the optical coupling assembly can function normally.

[0089] In this embodiment, in order to place the components within the optical coupling assembly in the corresponding positions, combined with Figure 7 Step 101 specifically includes:

[0090] Step 1011: The AWG MUX chip 3 is placed on the substrate 7, the substrate 9 is placed at the corresponding positions of the multiple input waveguide ports 31 of the AWG MUX chip 3, and multiple laser chips 1 are placed on the substrate 9 so that the light-emitting strips of the laser chips 1 are aligned with the corresponding input waveguide ports 31.

[0091] In this process, the light-emitting strips of multiple laser chips 1 are aligned with the different input waveguide ports 31 of the AWG MUX chip 3 by a high-precision pick-and-place machine. The high-precision pick-and-place machine identifies the light-emitting strips of multiple laser chips 1 by image recognition and accurately mounts them onto the substrate 9 with the different input waveguide ports 31 of the AWG MUX chip 3 as references.

[0092] Step 1012: Multiple pads 8 are disposed on the multiple input waveguide ports 31 side of the AWG MUX chip 3, and multiple first lenses 2 are disposed on the multiple pads 8; a pad 8 is disposed on the output waveguide port 33 side of the AWG MUX chip 3, and a second lens 4 is disposed on the pad 8.

[0093] The first lens 2 and the second lens 4 are tilted at different angles and heights by means of the pad block 8.

[0094] Step 1013: Place the isolator 5 at the input end of the fiber array assembly 6, place the fiber array assembly 6 on the substrate 7, and align the isolator 5 with the output waveguide port 33 of the AWG MUX chip 3.

[0095] The isolator 5 is used to prevent the combined signal that has entered the fiber array assembly 6 from being transmitted in reverse, so as to improve the optical path stability at the output waveguide port 33 of the second lens 4 and the AWG MUX chip 3.

[0096] To ensure that the optical signal emitted by the laser chip 1 can reach the fiber optic array assembly 6, combined with Figure 8 Step 102 specifically includes:

[0097] Step 1021: Power on all laser chips 1 simultaneously, so that all laser chips 1 emit multiple optical signals.

[0098] In this process, multiple laser chips 1 emit multiple optical signals, which enter the AWG MUX chip 3 through the input waveguide port 31. At this time, the first lens 2 has not yet been set on the substrate 7, and the optical signals emitted by the laser chips 1 do not pass through the first lens 2 for focusing, but directly reach the AWG MUX chip 3.

[0099] Step 1023: Adjust the positions of the second lens 4, the isolator 5, and the fiber array assembly 6 to ensure that the fiber array assembly 6 can receive the multiplexed signal.

[0100] The second lens 4 and the fiber array assembly 6 with isolator 5 are actively coupled to the substrate 7, so that the fiber array assembly 6 can receive the multiplexed signal.

[0101] Step 1022: Adjust the power of all laser chips 1 so that the optical power of the optical signals emitted by all laser chips 1 meets the pre-coupling standard value, so that after the multiple optical signals are coupled into a multiplexed signal in the AWG MUX chip 3, the multiplexed signal can be transmitted to the fiber array assembly 6.

[0102] In this process, a minimum optical power is set as the pre-coupling standard value. First, the optical power of the optical signal of one laser chip 1 is pre-coupled, and then the optical power of the optical signals of other laser chips 1 are gradually coupled, so that the optical power of all laser chip 1 optical signals simultaneously meets the pre-coupling standard value, that is, the optical power of the optical signal is not less than the pre-coupling standard. At the same time, the combined signal can reach the fiber array component 6 when the optical power of the multiple optical signals is minimized.

[0103] To ensure the optical power of the multiplexed signal reaches a preset value, thus guaranteeing the optical coupling component can transmit the multiplexed signal normally, combined with... Figure 9 Step 103 specifically includes:

[0104] Step 1031: Power on all laser chips 1 simultaneously, so that all laser chips 1 emit multiple optical signals.

[0105] In this process, after being focused by the first lens 2, the multiple optical signals enter the AWG MUX chip 3 and are combined to form the combined signal. The optical power of the combined signal is related to the optical power of the multiple optical signals.

[0106] Step 1032: Place the first lens 2 on the pad 8 between the AWG MUX chip 3 and the laser chip 1, and adjust the position of the first lens 2 to ensure the focusing effect of the first lens 2.

[0107] Each laser chip 1 and its corresponding input waveguide port 31 are provided with a first lens 2. If the first lens 2 is not provided or is not properly provided, the light signal emitted by the laser chip will diffuse to a certain extent and the light signal cannot completely enter the AWG MUX chip 3, which will affect the power of the light signal. At this time, the first lens 2 is required to focus the light signal. After the light signal is focused by the first lens 2, most of the light signal can enter the AWG MUX chip 3.

[0108] When adjusting the positions of multiple first lenses 2, first adjust the position of one first lens 2 to maximize the optical power of the combined signal, fix the position of the first lens 2, then adjust the next first lens 2, and so on, adjusting the positions of the first lenses 2 sequentially until all the first lenses 2 are actively coupled into the optical path between the laser chip 1 and the AWG MUX chip 3.

[0109] Step 1033: Adjust the power of all laser chips 1 based on the coupling standard value until the combined signal meets the preset standard value requirement.

[0110] A coupling standard value is set, and the initial optical power of the optical signal of all laser chips 1 is increased based on the coupling standard value until the optical power of the combined signal output by the AWG MUX chip 3 reaches the preset standard value, which can meet the requirements of normal transmission of the combined signal externally.

[0111] In this embodiment of the invention, because the input waveguide port of the AWG MUX chip 3 is small, the optical path between the laser chip 1 and the AWG MUX chip 3 is very precise. At this time, the optical signal is less prone to reflection, and even if the isolator is removed, optical crosstalk will not increase. This embodiment of the invention only requires one isolator on the fiber array assembly 6 side. The optical coupling assembly structure is relatively simple, the assembly process is easy to implement, and it has significant cost advantages.

[0112] Example 3:

[0113] Based on the aforementioned Embodiment 1, this embodiment will be illustrated by taking the case where more than two faulty laser chips appear among all the laser chips.

[0114] This embodiment 3 proposes an optical coupling component based on embodiment 1. The optical coupling component includes: multiple laser chips 1, multiple first lenses 2, an AWG MUX chip 3, a second lens 4, an isolator 5, and an optical fiber array component 6. The AWG MUX chip 3 includes multiple input waveguide ports 31, a multiplexing region 32, and an output waveguide port 33.

[0115] Each laser chip 1 is disposed on one side of the first lens 2, with each laser chip 1 corresponding to one first lens 2. The laser chip 1 is used to emit optical signals. The first lens 2 is disposed on one side of the AWG MUX chip 3, and the second lens 4 is disposed on the other side of the AWG MUX chip 3. The first lens 2 is used to transmit its corresponding optical signal to the AWG MUX chip 3. The AWG MUX chip 3 is used to couple multiple optical signals into a combined signal and transmit the combined signal to the second lens 4. The isolator 5 is disposed between the second lens 4 and the fiber array assembly 6. The second lens 4 is used to send the combined signal to the isolator 5, and the fiber array assembly 6 is used to transmit the combined signal to the outside.

[0116] In order to monitor the operating status of the optical coupling component, in this embodiment, combined with Figures 1-5 The optical coupling assembly further includes a monitoring chip 10 and a third lens 11. The AWG MUX chip 3 also includes multiple backlight waveguide ports 34, wherein: each backlight waveguide port 34 corresponds to each input waveguide port 31 to receive the optical signal emitted by the corresponding laser chip 1; the monitoring chip 10 is disposed on the opposite side of the backlight waveguide port 34, and the third lens 11 is disposed between the monitoring chip 10 and the backlight waveguide port 34; the monitoring chip 10 is used to receive the optical signal output by the backlight waveguide port 34 to detect the working status of the laser chip 1.

[0117] The monitoring chip 10 can determine whether there is a laser chip 1 with abnormal working status based on the optical power of multiple optical signals. The monitoring chip 10 stores an optical power lookup table, which stores the overall optical power values ​​of multiple optical signals when different numbers of laser chips 1 are working. When the optical coupling component is working, the monitoring chip 10 determines whether the laser chip 1 is faulty based on the optical power lookup table and the overall optical power values ​​of multiple optical signals acquired in real time.

[0118] When N laser chips 1 malfunction, the overall optical power of the multi-channel optical signals drops by approximately N preset values. That is, when N laser chips 1 malfunction, the overall optical power of the multi-channel optical signals drops by N steps. At this point, the monitoring chip 10 can determine that N laser chips 1 have a problem. For example, when the monitoring chip 10 detects that two laser chips 1 are malfunctioning, it groups all the laser chips 1 into groups of three, with each group emitting one optical signal to ensure the optical coupling component functions normally.

[0119] When the monitoring chip 10 detects that N laser chips 1 are malfunctioning, it groups each group of (N+1) laser chips 1, with any group having fewer than (N+1) chips. Each laser chip group 1 is used to emit one optical signal to enable the optical coupling component to function properly. If all laser chips 1 are malfunctioning and the optical coupling component is completely unusable, then grouping the laser chips 1 is unnecessary. After grouping, all laser chips 1 are divided into M groups. If any group has fewer than (N+1) laser chips, the monitoring chip 10 needs to further determine if the group has a problem. If the group contains at least one working laser chip 1, the overall optical power of the grouped multi-channel optical signals should be around M preset values. If all laser chips 1 in the group are faulty, the optical power of the grouped multi-channel optical signals should be less than M preset values. Based on this, the monitoring chip 10 can determine whether the group has malfunctioned. In the event of N laser chip failures, a laser chip group containing (N+1) laser chips must include at least one laser chip that is functioning normally. Each laser chip group is used to emit one optical signal, ensuring that the laser chip group containing (N+1) laser chips can function normally, thereby ensuring that the optical coupling component can be used normally.

[0120] For example, when N is 2, i.e., when the optical coupling component has two faulty laser chips 1, and assuming the optical coupling component has 11 laser chips, then they are grouped into groups of 3 laser chips 1, resulting in 4 groups of laser chip groups. Each laser chip group is used to emit one optical signal. Among them, three groups of laser chip groups contain 3 laser chips 1, and one group of laser chip groups contains two laser chips 1. In this case, the monitoring chip 10 needs to first judge the laser chip group containing two laser chips 1 to determine whether the laser chip group contains at least one laser chip 1 that can work normally, so as to ensure that the optical coupling component can emit 4 different optical signals, so that the optical coupling component can continue to work.

[0121] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An optical coupling component, characterized in that, include: Multiple laser chips (1), multiple first lenses (2), an AWGMX chip (3), a second lens (4), an isolator (5), and a fiber array assembly (6), wherein: Each of the laser chips (1) is disposed on one side of the first lens (2), and each laser chip (1) corresponds to one first lens (2). The laser chip (1) is used to emit light signals. The first lens (2) is disposed on one side of the AWG MUX chip (3), and the second lens (4) is disposed on the other side of the AWG MUX chip (3); the first lens (2) is used to transmit its corresponding optical signal to the AWG MUX chip (3), and the AWG MUX chip (3) is used to couple multiple optical signals into a combined signal and transmit the combined signal to the second lens (4). The isolator (5) is disposed between the second lens (4) and the fiber array assembly (6); the second lens (4) is used to send the multiplexed signal to the isolator (5), and the fiber array assembly (6) is used to transmit the multiplexed signal to the outside. The optical coupling component also includes a monitoring chip (10). The monitoring chip (10) stores an optical power reference table. The optical power reference table stores the overall optical power value of the multi-channel optical signals when different numbers of laser chips (1) are working. The monitoring chip (10) determines whether the laser chip (1) is faulty based on the optical power reference table and the overall optical power value of the multi-channel optical signals acquired in real time. When the monitoring chip (10) detects that N laser chips (1) are in abnormal working state, it divides each N+1 laser chips (1) into a group. If there are fewer than N+1, they are grouped separately. Each laser chip group is used to emit one optical signal so that the optical coupling component can be used normally.

2. The optical coupling component according to claim 1, characterized in that, The optical coupling assembly further includes a substrate (7), on which the laser chip (1), the first lens (2), the AWG MUX chip (3), the second lens (4) and the fiber array assembly (6) are sequentially disposed.

3. The optical coupling component according to claim 2, characterized in that, The optical coupling assembly also includes a plurality of pads (8), which are disposed on the substrate (7) and below the first lens (2) and / or the second lens (4).

4. The optical coupling component according to claim 2, characterized in that, The optical coupling assembly further includes a substrate (9) disposed on the substrate (7), and the laser chip (1) is disposed on the substrate (9) at predetermined intervals. The substrate (9) is used to dissipate heat for the laser chip (1).

5. The optical coupling component according to claim 1, characterized in that, The AWG MUX chip (3) includes multiple input waveguide ports (31), a multiplexing region (32), and an output waveguide port (33). The multiple input waveguide ports (31) are connected to the multiplexing region (32), and the multiplexing region (32) is connected to the output waveguide port (33). The first lens (2) is provided on the opposite side of the input waveguide port (31) so that the input waveguide port (31) can receive the optical signal emitted by the laser chip (1); The multiplexing region (32) is used to couple multiple optical signals into a multiplexed signal; The second lens (4) is provided on the opposite side of the output waveguide port (33) to facilitate the transmission of the combined signal to the fiber array assembly (6).

6. The optical coupling component according to claim 5, characterized in that, The optical coupling assembly also includes a third lens (11), and the AWG MUX chip (3) also includes multiple backlight waveguide ports (34), wherein: Each backlight waveguide port (34) corresponds to each input waveguide port (31) to receive the optical signal emitted by the corresponding laser chip (1); The monitoring chip (10) is disposed on the opposite side of the backlight waveguide port (34), and the third lens (11) is disposed between the monitoring chip (10) and the backlight waveguide port (34). The monitoring chip (10) is used to receive the optical signal output from the backlight waveguide port (34) to detect the working status of the laser chip (1).

7. A method for manufacturing an optical coupling component, used to manufacture the optical coupling component as described in any one of claims 1 to 6, characterized in that, include: Multiple laser chips (1), AWG MUX chips (3), isolators (5) and fiber array components (6) are sequentially arranged on the substrate (7) at corresponding positions; Multiple second lenses (4) are pre-coupled at predetermined positions. In the optical path between the AWG MUX chip (3) and the isolator (5), the second lenses (4) are adjusted until the fiber array assembly (6) can receive the combined signal. In the optical path between the laser chip (1) and the AWG MUX chip (3), the positions of multiple first lenses (2) are adjusted in sequence, and then the power of the laser chip (1) is adjusted until the optical power of the combined signal received by the fiber array assembly (6) reaches the preset standard value.

8. The method for manufacturing an optical coupling component according to claim 7, characterized in that, The step of sequentially mounting multiple laser chips (1), AWG MUX chips (3), isolators (5), and fiber array components (6) on the substrate (7) at corresponding positions includes: The AWG MUX chip (3) is placed on the substrate (7), the substrate (9) is placed at the corresponding positions of the multiple input waveguide ports (31) of the AWG MUX chip (3), and multiple laser chips (1) are placed on the substrate (9) so that the light-emitting strip of the laser chip (1) is aligned with the corresponding input waveguide port (31). Multiple pads (8) are provided on the side of multiple input waveguide ports (31) of the AWG MUX chip (3), and multiple first lenses (2) are provided on the multiple pads (8); a pad (8) is provided on the side of the output waveguide port (33) of the AWG MUX chip (3), and a second lens (4) is provided on the pad (8). The isolator (5) is placed at the input end of the fiber array assembly (6), the fiber array assembly (6) is placed on the substrate (7), and the isolator (5) is aligned with the output waveguide port (33) of the AWG MUX chip (3).

9. The method for manufacturing an optical coupling component according to claim 7, characterized in that, The step of pre-coupling multiple second lenses (4) at predetermined positions, adjusting the second lenses (4) in the optical path between the AWG MUX chip (3) and the isolator (5) until the fiber array assembly (6) can receive the combined signal includes: All laser chips (1) are powered on simultaneously, causing all laser chips (1) to emit multiple optical signals; Adjust the positions of the second lens (4), the isolator (5), and the fiber array assembly (6) to ensure that the fiber array assembly (6) can receive the multiplexed signal; Adjust the power of all laser chips (1) so that the optical power of the optical signals emitted by all laser chips (1) meets the pre-coupling standard value, so that after the multiple optical signals are coupled into a combined signal in the AWG MUX chip (3), the combined signal can be transmitted to the fiber array assembly (6).

10. The method for manufacturing an optical coupling component according to claim 7, characterized in that, The process of sequentially adjusting the positions of multiple first lenses (2) and then adjusting the power of the laser chip (1) in the optical path between the laser chip (1) and the AWG MUX chip (3) until the optical power of the combined signal received by the fiber array assembly (6) reaches a preset standard value includes: All laser chips (1) are powered on simultaneously, causing all laser chips (1) to emit multiple optical signals; The first lens (2) is placed on the pad (8) between the AWG MUX chip (3) and the laser chip (1), and the position of the first lens (2) is adjusted to ensure the focusing effect of the first lens (2); The power of all laser chips (1) is adjusted based on the coupling standard value until the combined signal meets the preset standard value requirement.

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