Node motion parameter measurement method, computer-readable medium, electronic device, centripetal force measurement method, spacer selection method

Abstract

The present invention relates to a method for calculating node motion parameters, a computer-readable medium, an electronic device, a method for calculating centripetal force, and a method for selecting spacer dampers. In the method for calculating centripetal force, when using motion finite element simulation to calculate the centripetal force of the spacer damper, the established node motion model of the sub-conductor takes into account the effects of the mass of the conductor system, the damping of the conductor system, the stiffness of the conductor system, and the external load factors of the sub-conductor on the motion of the sub-conductor. The external load of the sub-conductor includes the self-weight load of the conductor system and the electromagnetic attraction load of the sub-conductor. When calculating the node position in the sub-conductor motion model, the present invention takes into account the influence of the collision factor on the motion of the sub-conductor during the motion of the sub-conductor, making the calculated node motion parameters closer to the actual node motion parameters. In this way, when calculating the centripetal force, the obtained centripetal force data is more accurate.

Description

Technical Field

[0001] The present invention relates to the technical field of calculating the centripetal force of multi-split conductors, and specifically relates to a method for calculating the centripetal force borne by a spacer, and a method for selecting a spacer type.

[0002] The present invention also relates to the technical field of the motion model of multi-split conductors, and specifically relates to a method for calculating the node motion parameters for finite element analysis of multi-split conductors, a computer-readable medium storing a program for calculating node motion parameters, and an electronic device. Background Art

[0003] A spacer is a protective fitting that keeps multiple sub-conductors in a relative spaced position in one phase (pole) of a conductor, and is used to maintain the geometric shape of the sub-conductors and limit the relative movement between the sub-conductors. When current passes through the sub-conductors, they will attract each other, causing the spacer to be compressed by the centripetal force of the sub-conductors. According to the "Technical Conditions and Test Methods for Spacers" (DL / T 1098-2009), the centripetal force generated by the sub-conductors during a conductor short circuit can be simulated through a spacer centripetal force test to test the ability of the spacer to withstand compressive forces.

[0004] In this field, the Manuzio (C. Manuzio) formula is usually used to calculate the centripetal force generated by the sub-conductors during a conductor short circuit, and then the centripetal force is applied to the spacer clamp by means of experiments or numerical simulations to detect the centripetal force bearing performance of the spacer. For example, the article "Simulation Study on the Force of Spacers under Short-Circuit Current" (authors: Si Xuezhen, Tao Yaguang, Song Gaoli, Ren Pengliang, Chen Zhao, Xie Kai) published in the 13th issue of "Henan Science and Technology" in May 2020 discloses a method of using ANSYS finite element simulation software to perform simulation modeling on a certain double-frame spacer. By applying a centripetal force load to the spacer, its working conditions during a short-circuit fault in a transmission line are simulated, so as to determine the maximum stress part of the spacer and guide the direction of spacer structure improvement.

[0005] When designing a UHV DC transmission line, the centripetal force of the multi-split conductor with spacers still uses the Manuzio formula for calculation. However, the short-circuit fault of the UHV DC transmission line is different from that of the AC transmission line, and it has not been confirmed whether the Manuzio formula is applicable to calculate the centripetal force generated by the split conductors during a DC transmission line short circuit. Summary of the Invention

[0006] The purpose of the present invention is to provide a method for calculating the centripetal force borne by a spacer, so as to calculate the centripetal force borne by the spacer by adopting a new technical route.

[0007] Based on this, the present invention further provides a method for selecting spacer dampers, so as to improve the selection efficiency of spacer dampers and reduce the failure frequency of spacer dampers installed on multi - split conductors caused by the radial supporting force being lower than the centripetal force under the condition of considering cost.

[0008] Based on this, the present invention further provides a method for calculating node motion parameters for finite element analysis of multi - split conductors, a computer - readable medium storing a program for calculating node motion parameters, and an electronic device, so that when using finite element analysis to analyze the centripetal force of multi - split conductors with spacer dampers, when the short - circuit current is too large and causes the sub - conductors to collide, the obtained node motion parameters are closer to the actual node motion parameters.

[0009] When using dynamic finite element simulation to calculate the centripetal force of spacer dampers, it is necessary to establish a node motion model of the sub - conductors. In the node motion model of the sub - conductors in the present invention, the influences of the mass, damping, stiffness of the conductor system and the external load factors of the sub - conductors on the motion of the sub - conductors are considered. The external load of the sub - conductors includes the self - weight load of the conductor system and the electromagnetic attraction load of the sub - conductors.

[0010] In addition, when the short - circuit current is too large, collisions will also occur between the sub - conductors, which will also affect the calculation of the ability of the spacer damper to withstand compressive forces. Therefore, when calculating the node positions in the sub - conductor motion model, based on the premise that "each sub - conductor collision process is to understand the collision process and there is no energy loss during the collision", the present invention considers the influence of the collision factor on the motion of the sub - conductors during the motion of the sub - conductors, so that the calculated node motion parameters are closer to the actual node motion parameters. In this way, when calculating the centripetal force, the obtained centripetal force data is more accurate.

[0011] The technical solution of the present invention is as follows:

[0012] A method for calculating node motion parameters for finite element analysis of multi - split conductors, comprising the following steps:

[0013] S121. According to the velocity and external load of the paired nodes at the previous moment, combined with the node motion model of the sub - conductors, calculate the velocity of the paired nodes at the current moment and the displacement in the previous integration period;

[0014] S122. Calculate the calculated distance r of the paired nodes according to the position of the paired nodes at the previous moment and the displacement in the previous integration period;

[0015] S123. If the calculated distance r is less than the diameter of the sub - conductor, correct the component velocity of the velocity obtained in step S121 in the direction of the line segment to reverse its direction, determine the velocity of the two nodes at the current moment based on the corrected velocity, and correct the displacement obtained in step S121 to 0;

[0016] If the calculated spacing r is greater than or equal to the diameter of the sub-conductor, the velocity of the paired node at the current moment and the displacement in the previous integration period are not corrected.

[0017] S124. Use the position of the paired node at the previous moment and the displacement of the paired node in the previous integration period obtained in step S123 to determine the position and spacing of the paired node at the current moment.

[0018] S125. Calculate the external load of the paired node at the current moment according to the spacing of the paired node at the current moment.

[0019] Among them, the external load of each node includes the node gravity load and the node electromagnetic force load.

[0020] Preferably, in step S121, the node motion model of the sub-conductor is

[0021]

[0022] In the formula, M is the mass matrix of the conductor system, C is the damping matrix of the conductor system, K is the stiffness matrix of the conductor system, the conductor system includes sub-conductors and spacer dampers, {g(i)} represents the column vector composed of the gravity loads of each node of the conductor system, {f(i)} represents the column vector composed of the electromagnetic force loads of each node of the conductor system; v x is the velocity of the node in the x direction, v y is the velocity of the node in the y direction, v z is the velocity of the node in the z direction; δ x is the displacement of the node in the x direction, δ y is the displacement of the node in the y direction, δ z is the displacement of the node in the z direction.

[0023] Preferably, in step S121, the 4th-order Runge-Kutta algorithm is used to calculate the velocity of the paired node at the current moment and the displacement in the previous integration period.

[0024] A computer-readable medium storing a node motion parameter measurement program, which, when executed by a processor, implements the foregoing node motion parameter measurement method.

[0025] An electronic device includes a processor and the foregoing computer-readable medium.

[0026] A method for calculating the centripetal force borne by a spacer dampener. When using the finite element analysis method to calculate the kinematic characteristics of a multi - split conductor with spacer dampeners, the aforementioned node motion parameter calculation method is used to calculate the motion positions of all nodes at the target time, and based on the motion positions of all nodes at the target time, the maximum centripetal force borne by the spacer dampener is calculated.

[0027] Preferably, it includes the following steps:

[0028] S21. Establish a dynamic finite element model of a multi - split conductor with spacer dampeners, and configure the node motion model of the sub - conductors in the dynamic finite element model;

[0029] S22. Set the time step and the test duration to generate the calculation time points, and use the aforementioned node motion parameter calculation method to calculate the motion positions of all nodes at all calculation time points;

[0030] S23. Input the motion positions of all nodes at all calculation time points into the dynamic finite element model, and the dynamic finite element model outputs the radial forces borne by the spacer dampener at all calculation time points;

[0031] S24. Take the maximum radial force borne by the spacer dampener at the calculation time points as the maximum centripetal force borne by the spacer dampener.

[0032] Further preferably, in step S21, a beam element with a circular cross - section is used to establish the spacer dampener simulation model, and a catenary is used to establish the sub - conductor simulation model.

[0033] Further preferably, in step S21, the node motion model of the sub - conductor is

[0034]

[0035] where M is the mass matrix of the conductor system, C is the damping matrix of the conductor system, K is the stiffness matrix of the conductor system, the conductor system includes sub - conductors and spacer dampeners, {g(i)} represents the column vector composed of the gravity loads of each node in the conductor system, {f(i)} represents the column vector composed of the electromagnetic force loads of each node in the conductor system; v x is the velocity of the node in the x - direction, v y is the velocity of the node in the y - direction, v z is the velocity of the node in the z - direction; δ x is the displacement of the node in the x - direction, δ y is the displacement of the node in the y - direction, δ z is the displacement of the node in the z - direction.

[0036] A method for selecting a spacer dampener, including the following steps:

[0037] S31. According to the design structure of the spacer dampers and the multi - split conductors, measure the centripetal force using the aforementioned method for measuring the centripetal force borne by the spacer dampers;

[0038] S32. Select a spacer damper such that the radial supporting force of the spacer damper is greater than the centripetal force.

[0039] The beneficial effects of the present invention are as follows:

[0040] 1. Considering that when the short - circuit current is too large, the sub - conductors will collide due to electromagnetic attraction, which will affect the motion form of the sub - conductors. Therefore, in the method for measuring the node motion parameters for finite - element analysis of multi - split conductors of the present invention, in the method for calculating the position, velocity, and external load of the paired nodes at the current moment, based on the premise that "each sub - conductor collision process is to understand the collision process and there is no energy loss during the collision", the present invention considers the influence of the collision factor during the sub - conductor motion on the sub - conductor motion, making the measured node motion parameters closer to the actual node motion parameters.

[0041] 2. In the method for measuring the node motion parameters for finite - element analysis of multi - split conductors of the present invention, the node motion model of the sub - conductors considers the influence of the mass of the conductor system, the damping of the conductor system, the stiffness of the conductor system, and the external load factors of the sub - conductors on the sub - conductor motion. The external load of the sub - conductors includes the self - weight load of the conductor system and the electromagnetic attraction load of the sub - conductors. In this way, in the dynamic finite - element analysis, the accuracy of the position, velocity, and external load of the nodes at the current moment can be improved.

[0042] 3. In the method for measuring the node motion parameters for finite - element analysis of multi - split conductors of the present invention, in step S121, the 4th - order Runge - Kutta algorithm is used to calculate the velocity of the paired nodes at the current moment and the displacement in the previous integration period. Using this algorithm, the solution is fast and the efficiency is high.

[0043] 4. The method for measuring the centripetal force borne by the spacer dampers of the present invention, using the dynamic finite - element model and combining with the method for measuring the node positions of the sub - conductors, can output the centripetal force of the sub - conductors, and thus can be used to detect the centripetal - force bearing performance of the spacer dampers. Since the method for measuring the node positions of the sub - conductors considers that when the short - circuit current is too large, the sub - conductors will collide due to electromagnetic attraction, in this case, the obtained centripetal force of the sub - conductors is closer to the actual centripetal force. When used for designing and selecting spacer dampers, or for designing multi - split conductors with spacer dampers, the service life of the spacer dampers can be increased and the maintenance frequency of the spacer dampers can be reduced.

[0044] 5. The method for calculating the centripetal force borne by the spacer dampers of the present invention. In step S21, a simulation model of the spacer damper is established using a beam element with a circular cross-section, and a simulation model of the sub-conductors is established using a catenary curve. In this way, when the dynamic finite element model of the multi-split conductors with spacer dampers is used for finite element analysis, the effect is better and closer to the dynamic characteristics of the actual multi-split conductors with spacer dampers. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 FIG. is a schematic diagram of the label and coordinate position of the sub-conductors with spacer dampers.

[0046] Figure 2 FIG. is a schematic diagram of the dynamic finite element model of the multi-split conductors with spacer dampers.

[0047] Figure 3 FIG. is a calculation flow chart of the method for calculating the node motion parameters for the finite element analysis of the multi-split conductors.

[0048] Figure 4 FIG. shows the positions of the two sub-conductors in the yz plane at 0.2 s.

[0049] Figure 5 FIG. shows the positions of the two sub-conductors in the yz plane at 0.35 s.

[0050] Figure 6 FIG. shows the positions of the two sub-conductors in the yz plane at 0.4 s.

[0051] Figure 7 FIG. shows the positions of the two sub-conductors in the yz plane at 2.0 s.

[0052] Figure 8 FIG. is a graph showing the variation of the centripetal force borne by each spacer damper with time obtained by calculation. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0053] The present invention will be described below in the form of embodiments with reference to the accompanying drawings to assist those skilled in the art in understanding and implementing the present invention. Unless otherwise specified, the following embodiments and the technical terms therein should be understood without departing from the technical knowledge background of the present technical field.

[0054] Embodiment 1: The parameters of a certain conductor section of a certain ±800 kV UHV DC transmission line are as follows: the short-circuit current is 45 kA; the span is 290 m, the transmission line is a 6-split conductor, the split circle radius of the sub-conductors is 500 mm, and the linear horizontal distances between 4 spacer dampers and one of the transmission line suspension points are 43.5 m, 116 m, 177.625 m, and 250.125 m respectively; the spacer damper model is FJZ-650 / 48D, the material is aluminum alloy, its elastic modulus is 71.7 GPa, the Poisson's ratio is 0.33, and the density is 2.73×103 kg / m3 The cross-sectional diameter is set to 5 cm, and the cross-sectional area is 1963.5 mm 2 ; The sub-conductor model is JL1 / G2A-1250 / 100 steel core aluminum stranded wire, and the elastic modulus of the sub-conductor is 65200 N / mm 2 The cross-sectional area of the sub-conductor is 1350.03 mm 2 , and the mass of the sub-conductor per unit length is 4252.3 kg / km.

[0055] For the convenience of identifying the spacer dampers and sub-conductors, the 4 spacer dampers are numbered in the order of 1 to 4, and the 6 sub-conductors are numbered in the order of 1 to 6.

[0056] S1. Establish a dynamic finite element model of a multi-split conductor with spacer dampers;

[0057] When establishing the dynamic finite element model of a multi-split conductor with spacer dampers, the multi-split conductor is modeled according to the catenary equation, as shown below:

[0058]

[0059] In the formula: l is the horizontal distance between the two suspension points of the transmission line, h is the vertical distance between the two suspension points of the transmission line; γ is the ratio of the gravity borne by the sub-conductor per unit length to the conductor cross-section; σ0 represents the stress of the sub-conductor at the lowest point position.

[0060] Since the spacer dampers mainly bear pressure, when establishing the dynamic finite element model of a multi-split conductor with spacer dampers, the spacer dampers are modeled using beam elements with a circular cross-section.

[0061] When the transmission line is a 6-split conductor and the splitting circle radius of the sub-conductors is 500 mm, the intersection coordinates of the spacer dampers and the sub-conductors can be deduced as Figure 1 shown. Let the y-axis and the z-axis determine a plane, then the x-axis is the normal of the plane.

[0062] During the dynamic analysis process, the 6 sub-conductors continuously approach the midpoint under the action of electromagnetic attraction. It is assumed that at any moment, the positions of the sub-conductors in the same plane always form a regular hexagon shape, that is, the displacements of the sub-conductors 1 to 6 at the corresponding positions towards the center point are the same at any moment, and points 3 and 6 are always symmetric about the center point. In this embodiment, to reduce the calculation amount, only the sub-conductors 3 and 6 are used as the research objects, and the dynamic finite element model of the multi-split conductor with spacer dampers is also simplified accordingly. When modeling, each sub-conductor is divided into 400 units, and the schematic diagram of the finite element model of the two sub-conductors and 4 spacer dampers is as Figure 2 shown. The axial force borne by each spacer damper in the dynamic calculation is the centripetal force of the 6-split spacer damper.

[0063] S2. Measure the motion positions of all nodes using the node position measurement method for the sub-conductors;

[0064] Before conducting the centripetal force dynamic analysis under the short-circuit condition of the transmission line, it is necessary to carry out the linear analysis under the uniformly distributed self-weight load of the transmission line to make the initial configuration of the sub-conductor consistent with the actual working condition, and obtain the initial tensile force, prestress, etc. of the conductor. Therefore, the applied load mainly refers to the uniformly distributed self-weight load. For node i, the applied gravity load

[0065]

[0066] In the formula, ρ is the density of the sub-conductor, B is the equivalent cross-sectional area of the conductor, g is the acceleration due to gravity, taking 9.8 m / s 2 , l(n) represents the length of the nth unit connected to node i, and N is the number of units connected to node i.

[0067] Under the short-circuit condition of the transmission line, each sub-conductor is subjected to the electromagnetic suction force of the other 5 sub-conductors on it. Taking sub-conductor 3 as an example, let the electromagnetic suction force per unit length it receives from conductor 1 be The electromagnetic suction force received from sub-conductor 2 is The electromagnetic suction force received from conductor 4 is The electromagnetic suction force received from conductor 5 is The electromagnetic suction force received from conductor 6 is Then

[0068]

[0069] In the formula, I is the short-circuit current of the sub-conductor, μ0 is the permeability of free space, and r is the distance between sub-conductors;

[0070] Therefore, the resultant electromagnetic force of the other 5 sub-conductors on sub-conductor 1

[0071]

[0072] Among them, I is the short-circuit current of the sub-conductor, μ0 is the permeability of free space, and r is the distance between sub-conductors;

[0073] According to Equation (6), when the short-circuit current of the sub-conductor is I, the resultant electromagnetic force of each sub-conductor received from other sub-conductors can be calculated Magnitude.

[0074] Considering that as time changes, the distance r between sub-conductors also changes with the node displacement. For node i on sub-conductor 3, the relationship between the sub-conductor distance r(i) and its displacement δ z (i) is:

[0075] r(i) = r0 - 2δ z(i) (7) For node i on sub-conductor 6, the relationship between the sub-conductor spacing r(i) and its displacement δ z (i) in Equation (4) is as follows:

[0076] r(i) = r0 + 2δ z (i) (8) In the formula, r0 is the initial sub-conductor spacing, which is 100 cm in this embodiment; δ z (i) is the displacement of node i in the z direction.

[0077] Therefore, the node load on sub-conductor 3

[0078]

[0079] The node load on sub-conductor 6

[0080]

[0081] In the formula, l i1 、l i2 are the lengths of the two units adjacent to wire node i respectively. For sub-conductor 3, when 2δ z (i) < r0, the wire is subjected to an electromagnetic force in the positive z-axis direction; when 2δ z (i) > r0, the wire is subjected to an electromagnetic force in the negative z-axis direction. Sub-conductor 6 is similar to sub-conductor 3.

[0082] The dynamic equations of each sub-conductor under the action of electromagnetic force are as follows:

[0083] Ma + Cδ + Kv = F C (11) In the formula, M is the mass matrix of the wire system; C is the damping matrix of the wire system; K is the stiffness matrix of the wire system; F C is the external load column vector, which includes the self-weight load and electromagnetic attraction load suffered by the wire system itself; the wire system is composed of sub-conductors and spacer dampers.

[0084] By rewriting Equation (11) into differential form and combining with the calculation of external loads, the system of equations to be solved in the dynamic calculation process can be obtained as follows:

[0085]

[0086] In the formula, {g(i)} represents the column vector composed of the gravity loads of each node of the wire system, and {f(i)} represents the column vector composed of the electromagnetic force loads of each node of the wire system, which are calculated according to Equations (9) and (10) respectively based on the node displacement changes.

[0087] By solving the above system of equations through the 4th-order Runge-Kutta algorithm, the dynamic responses of the wires and spacer dampers can be obtained.

[0088] Considering that when the electromagnetic force is too large, the two sub-conductors will come into contact and then bounce off each other. In fact, there are limits to the displacement of each sub-conductor. Therefore, it is assumed that each collision of the sub-conductor is an ideal collision process without energy loss during the collision. Then the wire nodes in the collision area should have unchanged displacement, and the velocity in the z-direction should be reversed. The two sub-conductors will bounce, and then approach each other again under the action of electromagnetic attraction, collide and bounce off, repeating this process until they are finally attracted together due to the action of damping. Based on the above 4th-order Runge-Kutta algorithm for time integration of the dynamic simulation model, for the displacement results of each node of the sub-conductor calculated at each time step, first calculate the distance r between the corresponding nodes. If r is less than the diameter of the sub-conductor, it is considered that the two sub-conductors are in contact at this time. After the collision, they bounce back. Let the velocity of the corresponding node in the z-direction be reversed while the displacement remains unchanged, and reorganize the column vector Y to be solved at this time step, and continue the time integration until the loop terminates. The specific calculation process is as Figure 3 shown. Figure 3 In it, 0.04146m is the diameter of the sub-conductor.

[0089] S3. Set the time step and simulation duration. The dynamic finite element model of the multi-split conductor with spacer dampers outputs the displacement changes of typical points on the sub-conductor and the axial force changes of each spacer damper;

[0090] Using the above finite element calculation method, the displacement changes of the sub-conductor and the centripetal force changes of each spacer damper during the collision and bouncing process of the sub-conductor are simulated and calculated. During the simulation process, the time step is set to 10 -5 s, the total simulation duration is 2s, and the simulation takes about 72h. Extract the coordinate positions of each node on the conductor changing with time. The position diagram of the two sub-conductors in the yz plane is as Figures 4 - 7 shown. Extract the curve of the centripetal force of each spacer damper changing with time as Figure 8 shown.

[0091] It can be seen from the simulation results that after the short-circuit fault occurs, under the action of electromagnetic force, the two sub-conductors approach each other with time increasing. At about 0.35 s, contact begins to occur in the b-d section of the conductor, and then rebounds towards the initial positions of the respective sub-conductors. Subsequently, more and more conductor nodes in the b-d section show the phenomena of contact and rebound. However, under the action of damping, the amplitude of each rebound becomes smaller and smaller. After about 1.6 s, some nodes in the b-d section of the conductor are almost completely adhered together, and the rebound amplitude is very small. Finally, the positions of the two sub-conductors are in a stable state. The vibration displacements of each node on the conductor are also consistent with the expectations, and the process of collision and bouncing after the two sub-conductors come into contact is well simulated. When the displacement of each sub-conductor node reaches the limit value, due to the reverse of the velocity, the displacement decreases; then under the action of electromagnetic force, the velocity decreases to 0 and then increases in the reverse direction, resulting in the corresponding conductor nodes continuously being in a cycle of increasing and decreasing displacement. For most of the nodes in the middle of the adhered b-d section of the conductor, the amplitude of each collision and bounce becomes smaller and smaller. After 1.5 s, the displacement change caused by the collision is within the range of 0.05 m, and at this time, the adhered section of the conductor is almost completely close together. From beginning to end, the a-section conductor and the e-section conductor cannot come into contact, so they have been repeating the process of approaching, separating, and approaching again.

[0092] Before about 0.35 s, the two sub-conductors approach each other under the action of electromagnetic force, and the centripetal force of each spacer also increases continuously with time to about 3200 N. After 0.35 s, partial collision and rebound of sub-conductor nodes begin to occur. As more and more sub-conductor nodes come into contact and collide with each other, the axial forces of each spacer oscillate continuously, and the magnitude of the axial force also increases continuously. Under the action of damping, the rebound displacement of each conductor node gradually decreases, and more and more sub-conductor nodes begin to adhere together, and the axial force finally also tends to be stable. During the stable stage, the centripetal force of each spacer fluctuates continuously between about 0 and 10000 N. The peak value of the centripetal force of each spacer during the collision process appears at about 0.55 s, and the maximum centripetal force of the spacer is about 13860 N, which is much greater than the peak value of the centripetal force borne by the spacer under a 10 kA short-circuit current.

[0093] Based on Embodiment 1, a method for measuring node motion parameters for finite element analysis of multi-split conductors can be obtained, including the following steps:

[0094] S121. According to the velocity and external load of the paired node at the previous moment, combined with the node motion model of the sub-conductor, calculate the velocity of the paired node at the current moment and the displacement in the previous integration period.

[0095] S122. According to the position of the paired node at the previous moment and the displacement in the previous integration period, calculate the calculated distance r of the paired node.

[0096] S123. If the calculated spacing r is less than the diameter of the sub-conductor, correct the component velocity of the velocity obtained in step S121 in the direction of the line segment to reverse its direction, determine the velocities of these two nodes at the current moment based on the corrected component velocity, and correct the displacement obtained in step S121 to be 0;

[0097] If the calculated spacing r is greater than or equal to the diameter of the sub-conductor, the velocity of this paired node at the current moment and the displacement in the previous integration period are not corrected;

[0098] S124. Use the position of this paired node at the previous moment and the displacement of this paired node in the previous integration period obtained in step S123 to determine the position and spacing of this paired node at the current moment;

[0099] S125. Calculate the external load of this paired node at the current moment according to the spacing of this paired node at the current moment;

[0100] Among them, the external load of each node includes the node gravity load and the node electromagnetic force load.

[0101] Preferably, in step S121, the node motion model of the sub-conductor is

[0102]

[0103] In the formula, M is the mass matrix of the conductor system, C is the damping matrix of the conductor system, K is the stiffness matrix of the conductor system, the conductor system includes sub-conductors and spacer dampers, {g(i)} represents the column vector composed of the gravity loads of each node of the conductor system, {f(i)} represents the column vector composed of the electromagnetic force loads of each node of the conductor system; v x is the velocity of the node in the x direction, v y is the velocity of the node in the y direction, v z is the velocity of the node in the z direction; δ x is the displacement of the node in the x direction, δ y is the displacement of the node in the y direction, δ z is the displacement of the node in the z direction.

[0104] Preferably, in step S121, the 4th-order Runge-Kutta algorithm is used to calculate the velocity of this paired node at the current moment and the displacement in the previous integration period.

[0105] The foregoing method for measuring node motion parameters for finite element analysis of multi-split conductors can be written as a computer program and executed by a processor. Therefore, a computer-readable medium storing a node motion parameter measurement program can also be obtained. After the node motion parameter program is executed by the processor, the foregoing method for measuring node motion parameters is implemented.

[0106] The aforementioned computer-readable medium can be installed on an electronic device. Therefore, an electronic device can also be obtained, including a processor and the aforementioned computer-readable medium.

[0107] Based on Embodiment 1, a method for calculating the centripetal force borne by a spacer dampener can be generalized. When using the finite element analysis method to calculate the kinematic characteristics of a multi-split conductor with spacer dampeners, the aforementioned node motion parameter calculation method is used to calculate the motion positions of all nodes at the target time. Based on the motion positions of all nodes at the target time, the maximum centripetal force borne by the spacer dampener is calculated.

[0108] Preferably, it includes the following steps:

[0109] S21. Establish a dynamic finite element model of a multi-split conductor with spacer dampeners, and configure a node motion model for the sub-conductors in the dynamic finite element model;

[0110] S22. Set a time step and a test duration to generate measurement time points, and use the aforementioned node motion parameter calculation method to calculate the motion positions of all nodes at all measurement time points;

[0111] S23. Input the motion positions of all nodes at all measurement time points into the dynamic finite element model, and the dynamic finite element model outputs the radial forces borne by the spacer dampener at all measurement time points;

[0112] S24. Take the maximum radial force borne by the spacer dampener at the measurement time point as the maximum centripetal force borne by the spacer dampener.

[0113] More preferably, in step S21, a beam element with a circular cross-section is used to establish a spacer dampener simulation model, and a catenary is used to establish a sub-conductor simulation model.

[0114] More preferably, in step S21, the node motion model of the sub-conductor is

[0115]

[0116] where M is the mass matrix of the conductor system, C is the damping matrix of the conductor system, K is the stiffness matrix of the conductor system, the conductor system includes sub-conductors and spacer dampeners, {g(i)} represents the column vector composed of the gravity loads of each node in the conductor system, {f(i)} represents the column vector composed of the electromagnetic force loads of each node in the conductor system; v x is the velocity of the node in the x direction, v y is the velocity of the node in the y direction, v z is the velocity of the node in the z direction; δ x is the displacement of the node in the x direction, δy is the displacement of the node in the y direction, δ z is the displacement of the node in the z direction.

[0117] The aforementioned method for calculating the centripetal force borne by the spacer can be applied to the design and selection of the spacer, and the construction of a multi-split conductor with the spacer. Therefore, a method for selecting the spacer can be obtained, comprising the following steps:

[0118] S31, according to the design structure of the spacer bar and the multi-split conductor, using the aforementioned method for calculating the centripetal force borne by the spacer bar to calculate the centripetal force;

[0119] S32. Select a spacer bar so that the radial supporting force of the spacer bar is greater than the centripetal force.

[0120] The present invention is described in detail above with reference to the accompanying drawings and embodiments. It should be understood that it is impossible to describe all possible implementation methods in practice, and the inventive concept of the present invention is described as much as possible by way of example. Without departing from the inventive concept of the present invention and without creative work, the technical personnel in this technical field make selections and combinations of the technical features in the above embodiments, make experimental changes to the specific parameters, or use the prior art in this technical field to conventionally replace the disclosed technical means of the present invention to form specific embodiments, which should all belong to the implicit disclosure of the present invention.

Claims

1. A method for measuring node motion parameters for multi-split conductors, characterized in that, It includes the following steps: S121. According to the speed and external load of the paired node at the previous moment, combined with the node motion model of the sub-conductor, use the fourth-order Runge-Kutta algorithm to calculate the speed of the paired node at the current moment and the displacement in the previous integration period. S122. Calculate the calculated distance r of the paired node according to the position of the paired node at the previous moment and the displacement in the previous integration period. S123. If the calculated distance r is less than the diameter of the sub-conductor, correct the component velocity of the speed obtained in step S121 in the direction of the line segment to reverse its direction, determine the speed of the two nodes at the current moment based on the corrected component velocity, and correct the displacement obtained in step S121 to 0. If the calculated distance r is greater than or equal to the diameter of the sub-conductor, the speed of the paired node at the current moment and the displacement in the previous integration period are not corrected. S124. Use the position of the paired node at the previous moment and the displacement of the paired node in the previous integration period obtained in step S123 to determine the position and distance of the paired node at the current moment. S125. Calculate the external load of the paired node at the current moment according to the distance of the paired node at the current moment. Among them, the external load of each node includes the node gravity load and the node electromagnetic force load. The node motion model of the sub-conductor is where M is the mass matrix of the conductor system, C is the damping matrix of the conductor system, K is the stiffness matrix of the conductor system, the conductor system includes sub-conductors and spacer dampers, {g(i)} represents the column vector composed of the gravity loads of each node of the conductor system, and {f(i)} represents the column vector composed of the electromagnetic force loads of each node of the conductor system; v x is the velocity of the node in the x direction, v y is the velocity of the node in the y direction, v z is the velocity of the node in the z direction; δ x is the displacement of the node in the x direction, δ y is the displacement of the node in the y direction, δ z is the displacement of the node in the z direction.

2. A computer-readable medium storing a program for measuring node motion parameters, characterized in that, After the node motion parameter program is executed by the processor, it realizes the node motion parameter measurement method as described in claim 1.

3. An electronic device, characterized in that, It includes a processor and the computer-readable medium as described in claim 2.

4. A method for measuring the centripetal force borne by a spacer dampener, characterized in that, When using the finite element analysis method to measure the kinematic characteristics of a multi-split conductor with spacer dampers, use the node motion parameter measurement method as described in claim 1 to measure the motion positions of all nodes at the target moment, and based on the motion positions of all nodes at the target moment, measure the maximum centripetal force borne by the spacer damper.

5. The method for measuring the centripetal force borne by a spacer dampener according to claim 4, characterized in that, It includes the following steps: S21. Establish a dynamic finite element model of a multi-split conductor with spacer dampers, and configure the node motion model of the sub-conductor in the dynamic finite element model. S22. Set the time step and test duration to generate measurement time points, and use the node motion parameter measurement method to measure the motion positions of all nodes at all measurement time points. S23. Input the motion positions of all nodes at all measurement time points into the dynamic finite element model, and the dynamic finite element model outputs the radial forces borne by the spacer damper at all measurement time points. S24. Take the maximum radial force borne by the spacer damper at the measurement time point as the maximum centripetal force borne by the spacer damper.

6. The method for measuring the centripetal force borne by a spacer dampener according to claim 5, characterized in that, In step S21, use a beam element with a circular cross-section to establish a spacer damper simulation model, and use a catenary to establish a sub-conductor simulation model.

7. A method for selecting a spacer dampener, characterized in that, It includes the following steps: S31. According to the design structures of the spacer damper and the multi-split conductor, use the centripetal force measurement method for the spacer damper as described in any one of claims 4-6 to measure the centripetal force. S32. Select a spacer damper such that the radial support force of the spacer damper is greater than the centripetal force.

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