A glass via metallization process

Abstract

The application provides a glass hole metallization process, comprising the following steps: sequentially performing film pasting before sheeting, hole metallization, pre-baking, film tearing, surface conductive paste treatment and solid baking on the glass, and obtaining a hole metallization glass product after packaging. Compared with the prior art, the glass hole metallization process provided by the application realizes overall good interaction by adopting specific process steps, can be applied to hole metallization of ultra-thin glass, has low breakage rate and good conduction effect. Experimental results show that the glass hole metallization process provided by the application has a breakage rate of less than 2%; the obtained hole metallization ultra-thin glass product has a conductive resistance of 1±0.9 Ω, realizes more clear rigid and flexible miniled display effect, and has wide application prospect.

Description

Technical Field

[0001] This invention relates to the field of hole metallization technology, and more specifically, to a hole metallization process for glass. Background Technology

[0002] Glass through-hole metallization is divided into through-hole metallization and blind-hole metallization. For blind-holes, a thinning process is required after metallization to expose the metal pillars. However, glass is relatively brittle, and the thinning process can easily cause cracks in the hole or other areas, or even shatter the entire glass sheet. Furthermore, due to the density of glass, there are problems such as slow glass grinding rates and grinding difficulties. Additionally, blind holes formed by laser ablation have relatively large wall roughness, posing a significant challenge to blind-hole metallization. For through-holes, a thin layer of metal is generally fabricated on the inner wall to form an interconnect. However, through-hole metallization is prone to voids and incomplete metal filling, resulting in poor metal quality and low reliability. Moreover, a lengthy metal planarization process is required after metallization, leading to high costs, impacting the reliability of the adapter plate, and limiting the application areas of glass adapter plates.

[0003] At present, the existing glass hole metallization process has the following shortcomings: (1) 0.1mm glass is too thin and is easy to break, and the breakage rate of hole metallization is 80%; (2) The glass hole spacing is dense at 0.2mm, and the conductive paste in the hollow hole of the base fixture is not saturated, resulting in no resistance value. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a hole metallization process for glass that is applicable to the hole metallization of ultrathin glass, with low breakage rate and good conductivity.

[0005] This invention provides a process for metallizing the pores of glass, comprising the following steps:

[0006] The glass is subjected to a series of processes, including pre-filming, hole metallization, pre-baking, film removal, surface conductive paste treatment, and final baking. After packaging, the glass product with hole metallization is obtained.

[0007] Preferably, the glass is thick glass or thin glass; the thickness of the thick glass is 0.5mm to 1.5mm; the thickness of the thin glass is 0.08mm to 0.20mm.

[0008] Preferably, the film applied before the film is attached is a high-temperature PE film.

[0009] Preferably, the hole metallization process follows a bottom-up sequence of hole treatment combination for the base, glass, and steel mesh, with the steel mesh being coated using a scraper.

[0010] Preferably, the steel mesh is a positioning steel mesh with openings only in the effective area of ​​the pattern.

[0011] Preferably, the positioning steel mesh is at an angle of 20 to 40 degrees to the base.

[0012] Preferably, the base is configured as a groove with the same thickness as the glass, and a groove of 0.1~0.3mm is set below the pattern for placing the film to be applied before the sheet is placed.

[0013] Preferably, the pre-baking temperature is 80℃~100℃ and the time is 20min~30min.

[0014] Preferably, the process of treating the surface with conductive paste specifically includes:

[0015] The conductive paste on the surface is removed by polishing. The first step is to place the glass in the polishing base, and the second step is to start polishing to remove the conductive paste on the surface. The polishing time is 30 to 40 minutes on both sides, and the polishing pressure is 250KG to 300KG.

[0016] or,

[0017] The conductive paste on the surface is removed by a light sweeping method. The first step is to place the glass into the light sweeping base, and the second step is to start the light sweeping to remove the conductive paste on the surface. The light sweeping time is 30 to 40 minutes on both sides, and the light sweeping pressure is 25 to 30 kg.

[0018] Preferably, the baking temperature is 150℃~180℃ and the baking time is 50min~60min.

[0019] This invention provides a glass hole metallization process, comprising the following steps: pre-coating the glass with a film, hole metallization, pre-baking, film removal, surface conductive paste treatment, and final baking, followed by packaging to obtain a finished glass product with hole metallization. Compared with existing technologies, the glass hole metallization process provided by this invention employs specific process steps to achieve better overall interaction, making it suitable for hole metallization of ultra-thin glass, with a low breakage rate and good conductivity. Experimental results show that the glass hole metallization process provided by this invention has a breakage rate of less than 2%; the resulting ultra-thin glass product with hole metallization has a conductivity of 1±0.9Ω, achieving clearer rigid and flexible mini LED display effects and possessing broad application prospects. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the large steel mesh before and after improvement in an embodiment of the present invention;

[0021] Figure 2 A technical roadmap for the glass hole metallization process provided in this embodiment of the invention;

[0022] Figure 3 This is a schematic diagram of the film application process before the film is applied in an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the steel mesh in an embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the hole metallized base in an embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the hole processing assembly in an embodiment of the present invention;

[0026] Figure 7 The image shows the effect of the metallization of the holes in the finished glass obtained by the hole metallization process provided in the embodiment of the present invention. Detailed Implementation

[0027] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0028] This invention provides a process for metallizing the pores of glass, comprising the following steps:

[0029] The glass is subjected to a series of processes, including pre-filming, hole metallization, pre-baking, film removal, surface conductive paste treatment, and final baking. After packaging, the glass product with hole metallization is obtained.

[0030] In this invention, the glass is preferably thick glass or thin glass; the source of the glass is not particularly limited and commercially available products known to those skilled in the art can be used.

[0031] In this invention, the thickness of the thick glass is preferably 0.5 mm to 1.5 mm; the thickness of the thin glass is preferably 0.08 mm to 0.20 mm.

[0032] In this invention, the film applied before the sheet is attached is preferably a high-temperature PE film; any commercially available product well-known to those skilled in the art can be used. This invention adds the aforementioned high-temperature PE film to the effective patterned area on the bottom of the glass, ensuring that the conductive paste can be pre-baked in contact with the film surface in subsequent steps without breaking the sheet.

[0033] In this invention, the hole metallization process is preferably carried out in the following order from bottom to top: hole treatment combination of base, glass, and steel mesh, and the steel mesh is coated by scraping with a scraper.

[0034] In this invention, the steel mesh is preferably a positioning steel mesh that opens only to the effective area of ​​the pattern, thereby reducing contact with the ineffective area of ​​the glass. By using the aforementioned positioning steel mesh, this invention reduces contact with the ineffective area of ​​the ultra-thin glass, lowering the risk of breakage. Simultaneously, the addition of the aforementioned high-temperature PE film prevents breakage due to adhesion to the plate, thus achieving a breakage rate of less than 2% when the overall process is used for metallizing holes in ultra-thin glass.

[0035] In this invention, the positioning steel mesh and the base are preferably at an angle of 20 to 40 degrees, more preferably 30 degrees; changing the steel mesh pattern to a 30-degree bevel can prevent the accumulation of conductive paste on the edges from causing the steel mesh to stick to fragments when the plate is lifted.

[0036] In this invention, the base is preferably configured as a groove with the same thickness as the glass, and a groove of 0.1~0.3mm, more preferably 0.2mm, is preferably provided below the pattern for placing the film to be applied before the sheet is placed.

[0037] In this invention, the pre-baking temperature is preferably 80℃~100℃, more preferably 90℃; the pre-baking time is preferably 20min~30min, more preferably 30min; after metallization of the front face of the ultra-thin glass, it is pre-baked and then metallized on the back face, which can reduce the poor conductivity rate to three per thousand.

[0038] The present invention does not impose any special restrictions on the process of peeling off the film; any technical solution known to those skilled in the art of peeling off the film applied before filming can be used.

[0039] In this invention, the process of treating the surface conductive paste is preferably as follows:

[0040] The conductive paste on the surface is removed by polishing. The first step is to place the glass in the polishing base, and the second step is to start polishing to remove the conductive paste on the surface. The polishing time is 30 to 40 minutes on both sides, and the polishing pressure is 250KG to 300KG.

[0041] or,

[0042] The conductive paste on the surface is removed by a light sweeping method. The first step is to place the glass into the light sweeping base, and the second step is to start the light sweeping to remove the conductive paste on the surface. The light sweeping time is 30 to 40 minutes on both sides, and the light sweeping pressure is 25 to 30 kg.

[0043] In this invention, polishing is preferred for thick glass, and sweeping is preferred for thin glass.

[0044] In this invention, the baking temperature is preferably 150℃~180℃, more preferably 160℃; the baking time is preferably 50min~60min, more preferably 60min.

[0045] The present invention does not impose any special restrictions on the packaging process, and the packaged product is a glass product with metallized holes.

[0046] The glass hole metallization process provided by this invention uses a positioning steel mesh and a high-temperature PE film to metallize ultra-thin glass holes, which can reduce the breakage rate to 1% to meet customer product requirements; through hole metallization, the glass is made conductive on both sides, generating resistance with a resistance value of 1±0.9Ω, achieving clearer display effects for both rigid and flexible mini LEDs.

[0047] This invention provides a glass hole metallization process, comprising the following steps: pre-coating the glass with a film, hole metallization, pre-baking, film removal, surface conductive paste treatment, and final baking, followed by packaging to obtain a finished glass product with hole metallization. Compared with existing technologies, the glass hole metallization process provided by this invention employs specific process steps to achieve better overall interaction, making it suitable for hole metallization of ultra-thin glass, with a low breakage rate and good conductivity. Experimental results show that the glass hole metallization process provided by this invention has a breakage rate of less than 2%; the resulting ultra-thin glass product with hole metallization has a conductivity of 1±0.9Ω, achieving clearer rigid and flexible mini LED display effects and possessing broad application prospects.

[0048] To further illustrate the present invention, the following embodiments will be described in detail.

[0049] Example

[0050] (1) Steel mesh section improves fragmentation:

[0051] Before the improvement, the original large steel mesh A pattern area was 560mm×450mm. Even a slight unevenness or looseness of the 0.1mm glass would cause it to break, and conductive paste was prone to sticking to the edges and causing the broken pieces.

[0052] The improved large steel mesh only opens to the effective area of ​​pattern B, reducing contact with the ineffective area of ​​the glass. The steel mesh pattern is also changed to a 30-degree bevel to prevent conductive paste from accumulating on the edges and causing fragments to stick when the steel mesh is lifted.

[0053] The previous method of treating the contact between the glass and the base hole with conductive paste and sticking to the base resulted in the thin glass fragment breaking during the glass removal process.

[0054] After modification, the conductive paste applied to the B-side of the glass will not break after pre-baking and being peeled off.

[0055] (2) Hole treatment base improves conductive paste saturation:

[0056] Before the improvement, the conductive paste inside the hole had to be completely penetrated. A groove was made below the corresponding position of the effective area of ​​the base pattern. This made it easy to break the piece. If the force was not strong enough, the piece would not break. However, the saturation of the conductive paste was not enough, and the resistance value could not be met.

[0057] After improvement, the base is made into a groove with the same thickness as the glass. Then, a 0.2mm groove is made below the pattern to hold the high-temperature PE film. Before the hole is processed, a 0.2mm thick PE film is placed to allow the conductive paste to penetrate and the PE film to fall off.

[0058] The technical roadmap for the glass hole metallization process provided in this embodiment of the invention can be found in the following diagram. Figure 2 As shown, the specific process is as follows:

[0059] Metallization treatment is applied to the interior of the 0.1±0.02mm hole in the ultra-thin glass:

[0060] (1) Applying film before mounting: Prioritize applying the film to the pattern area outside the lines, see [link to relevant documentation]. Figure 3 As shown, there is a large chamfer at the upper left corner of the 650mm long side of the glass. The bottom of the glass is considered as side B, and the top of the glass is considered as side A. The film is applied to side B.

[0061] (2) Hole metallization: The glass with the film applied is placed into the hole processing machine for hole metallization, where the steel mesh is described in detail. Figure 4 As shown, see the hole metallization base. Figure 5 As shown, see the hole treatment assembly. Figure 6 As shown, the specific steps are as follows:

[0062] First, the hole metallization base is installed into the hole processing machine. Then, the scraper and stencil are installed into the hole processing machine. Finally, conductive paste is added to the stencil.

[0063] (3) Pre-baking: Pre-baking the perforated metallized glass, specifically by placing the perforated metallized glass on a baking rack and pre-baking at 90°C for 30 minutes.

[0064] (4) Peeling off the film: After pre-baking, place the perforated metallized glass into the glass platform and peel off the film manually.

[0065] (5) Treatment of conductive paste on glass surface: The pre-baked glass is then subjected to a polishing process to remove the conductive paste on the surface: First, the glass is placed in the polishing base, and second, the polishing is started to remove the conductive paste on the surface; the polishing time is 30 min to 40 min on both sides, and the polishing pressure is 25 KG to 30 KG.

[0066] (6) Solid baking: The glass after surface conductive paste treatment is placed in a baking rack and solid baked at 160°C for 60 minutes.

[0067] (7) Packaging: After baking, the glass is packaged and transferred to the next process to obtain the ultra-thin glass product with metallized holes.

[0068] The hole metallization effect of the glass obtained by the hole metallization process provided in this embodiment of the invention is shown in the diagram below. Figure 7 As shown; by Figure 7 It can be seen that the conductive paste has penetrated both sides of the glass hole and generated a resistance of 1.

[0069] Furthermore, the glass hole metallization process provided in this embodiment of the invention results in a breakage rate of 1.29%; see Table 1 below for specific data.

[0070]

[0071] The resulting ultrathin glass product with metallized holes has a conductivity of 1±0.9Ω, achieving electrical conduction on both sides, resulting in clearer rigid and flexible mini LED display effects.

[0072] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A process for via metallization of glass, characterized in that, Includes the following steps: The glass is sequentially subjected to pre-film application, hole metallization, pre-baking, film removal, surface conductive paste treatment, and curing, and then packaged to obtain the finished glass product with hole metallization. The hole metallization process follows a bottom-up sequence of hole treatment combination: base, glass, and steel mesh, with the steel mesh being coated using a scraper. The steel mesh is a positioning steel mesh that opens only to the effective area of ​​the pattern; The positioning steel mesh is at an angle of 20 to 40 degrees to the base; The base is designed with a groove of the same thickness as the glass, and a groove of 0.1~0.3mm is set below the pattern to place the film to be applied before the film is placed.

2. The glass via metallization process of claim 1, wherein, The glass can be thick or thin; the thickness of the thick glass is 0.5mm to 1.5mm; the thickness of the thin glass is 0.08mm to 0.20mm.

3. The glass via metallization process of claim 1, wherein, The film applied before the film is a high-temperature PE film.

4. The glass via metallization process of claim 1, wherein, The pre-baking temperature is 80℃~100℃, and the time is 20min~30min.

5. The glass hole metallization process according to claim 1, characterized in that, The specific process of the surface conductive paste treatment is as follows: The conductive paste on the surface is removed by polishing. The first step is to place the glass in the polishing base, and the second step is to start polishing to remove the conductive paste on the surface. The polishing time is 30 to 40 minutes on both sides, and the polishing pressure is 250KG to 300KG. or, The conductive paste on the surface is removed by a light sweeping method. The first step is to place the glass into the light sweeping base, and the second step is to start the light sweeping to remove the conductive paste on the surface. The light sweeping time is 30 to 40 minutes on both sides, and the light sweeping pressure is 25 to 30 kg.

6. The glass via metallization process of claim 1, wherein, The baking temperature is 150℃~180℃, and the time is 50min~60min.

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