Display panel and display device

Abstract

The present invention discloses a display panel and a display device, wherein the display panel comprises: a substrate and a circuit layer; the circuit layer comprises a thin film transistor; the circuit layer further comprises a first semiconductor layer and at least two conductive structures located on a side of the first semiconductor layer close to the substrate; the first semiconductor layer comprises an active layer of the thin film transistor; in the thickness direction of the display panel, the conductive structure at least covers the channel region of the active layer of the thin film transistor; the circuit layer further comprises a connecting structure; at least two conductive structures are electrically connected via the connecting structure; the resistance of the connecting structure is greater than the resistance of the conductive structure. By adopting the above technical solution, a large-area conductive structure can be separated into small-area conductive structures, reducing charge accumulation and avoiding surface arcing when preparing the conductive structure at the bottom of the display panel, thereby affecting the preparation of the conductive structure and subsequent processes; it also increases the difficulty of charge flow and reduces the speed of charge flow, thereby suppressing discharge and preventing electrostatic damage.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In the field of active matrix displays, thin-film transistors play an irreplaceable role as pixel switches. High-resolution and large-size displays have become a new direction for the development of display technology, which has also put forward higher requirements for thin-film transistors.

[0003] The active layer of the thin film transistor is sensitive to light, and the carrier activity of the active layer is easily affected by light. Therefore, a conductive structure needs to be provided at the bottom of the thin film transistor to block the light from reaching the bottom.

[0004] However, the conductive structure at the bottom of the thin film transistor is prone to arcing during the preparation process, which affects the preparation process. Summary of the Invention

[0005] The present invention provides a display panel and a display device to solve the problem that arcing is easily generated in a conductive structure at the bottom of a thin film transistor during the preparation process.

[0006] According to one aspect of the present invention, there is provided a display panel, comprising: a substrate and a circuit layer located on one side of the substrate; the circuit layer comprises a thin film transistor;

[0007] The circuit layer further includes a first semiconductor layer and at least two conductive structures located on a side of the first semiconductor layer close to the substrate; the first semiconductor layer includes an active layer of the thin film transistor;

[0008] In the thickness direction of the display panel, the conductive structure at least covers the channel region of the active layer of the thin film transistor;

[0009] The circuit layer further includes a connection structure; at least two of the conductive structures are electrically connected via the connection structure; and the resistance of the connection structure is greater than the resistance of the conductive structure.

[0010] According to another aspect of the present invention, a display device is provided, comprising the above-mentioned display panel.

[0011] The technical solution of the present invention is to set at least two conductive structures on the side of the first semiconductor layer close to the substrate, so that a large-area conductive structure can be separated into a small-area conductive structure, thereby reducing the accumulation of charge and avoiding the surface arc phenomenon when preparing the conductive structure at the bottom of the display panel, which affects the preparation of the conductive structure and subsequent processes; the conductive structure is electrically connected through the connecting structure, and only a small number of vias are required to enable all conductive structures to receive stable signals, which can reduce the number of vias, improve the integration of the display panel, and is conducive to the thinness of the display panel. For transparent display panels, the proportion of the light-transmitting area can also be increased, which is conducive to transparent display; the resistance of the connecting structure is greater than the resistance of the conductive structure, which increases the difficulty of charge flow and reduces the speed of charge flow, which can suppress discharge, prevent electrostatic damage, protect the circuit structure in the display panel, and improve the reliability of the display panel.

[0012] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0014] Figure 1 This is a structural diagram of a transparent display panel in the prior art;

[0015] Figure 2 It is along Figure 1 A schematic diagram of a cross-sectional structure of the A-A' section;

[0016] Figure 3 is a structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0017] Figure 4 It is along Figure 3 A schematic diagram of a cross-sectional structure of the BB' section;

[0018] Figure 5 It is along Figure 3 Another cross-sectional structural diagram of the BB' section;

[0019] Figure 6 is a structural diagram of another display panel provided by an embodiment of the present invention;

[0020] Figure 7 It is along Figure 6 A schematic diagram of a cross-sectional structure of the C-C' section;

[0021] Figure 8 is a structural diagram of another display panel provided by an embodiment of the present invention;

[0022] Figure 9 Yes, yes, along Figure 3 Another cross-sectional structural diagram of the BB' section;

[0023] Figure 10 It is along Figure 3 Another cross-sectional structural diagram of the BB' section;

[0024] Figure 11 This is a schematic structural diagram of a conductive structure and a connection structure provided by an embodiment of the present invention;

[0025] Figure 12 is a structural diagram of another display panel provided by an embodiment of the present invention;

[0026] Figure 13 It is along Figure 12 A schematic diagram of a cross-sectional structure of the D-D' section;

[0027] Figure 14 is a structural diagram of a pixel unit provided by an embodiment of the present invention;

[0028] Figure 15 1 is a schematic diagram of a circuit structure of a pixel driving circuit provided by an embodiment of the present invention;

[0029] Figure 16 is a structural diagram of another display panel provided by an embodiment of the present invention;

[0030] Figure 17 It is along Figure 16 A schematic diagram of a cross-sectional structure of the E-E' section;

[0031] Figure 18 It is along Figure 16 A schematic diagram of a cross-sectional structure of the F-F' section;

[0032] Figure 19 is a structural diagram of another display panel provided by an embodiment of the present invention;

[0033] Figure 20 yes Figure 19 A partial enlarged view of the middle region G;

[0034] Figure 21 is a structural diagram of another display panel provided by an embodiment of the present invention;

[0035] Figure 22 is a structural diagram of another display panel provided by an embodiment of the present invention;

[0036] Figure 23 is a structural diagram of another display panel provided by an embodiment of the present invention;

[0037] Figure 24 It is a structural schematic diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0039] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0040] Figure 1 This is a structural diagram of a transparent display panel in the prior art. Figure 2 It is along Figure 1 A schematic diagram of the cross-sectional structure of the A-A' section. Figure 1 and Figure 2 The transparent display panel 01 includes a display area AA and a non-display area NA surrounding the display area. The display area AA includes multiple pixel units 02, each of which also includes a light-transmitting area 03. The transparent display panel 01 also includes a glass substrate 011, a thin-film transistor 012, and a conductive structure 013 located between the glass substrate 011 and the thin-film transistor 012. To facilitate the connection of a suitable stable potential to the conductive structure 013, the conductive structure 013 of the transparent display panel 01 is generally a mesh-like integrated structure. The conductive structure 013 is electrically connected to the signal line 014 through a via.

[0041] However, the presence of such a large conductive structure 013 in the transparent display panel 01 can easily cause surface arcing during fabrication, leading to unsuccessful fabrication of the conductive structure 013. Furthermore, the conductive structure 013 is located on the side of the thin-film transistor 012 closest to the glass substrate 011, so arcing in the conductive structure 013 can also affect subsequent fabrication processes. Furthermore, the large conductive structure 013 can easily accumulate a large amount of charge, which can flow through the conductive structure 013, causing discharge and damaging the pixel circuits in the transparent display panel 01.

[0042] To solve the above technical problems, an embodiment of the present invention provides a display panel, comprising: a substrate and a circuit layer located on one side of the substrate; the circuit layer includes a thin film transistor; the circuit layer also includes a first semiconductor layer and at least two conductive structures located on a side of the first semiconductor layer close to the substrate; the first semiconductor layer includes an active layer of the thin film transistor; in the thickness direction of the display panel, the conductive structure at least covers the channel region of the active layer of the thin film transistor; the circuit layer also includes a connecting structure; at least two conductive structures are electrically connected through the connecting structure; and the resistance of the connecting structure is greater than the resistance of the conductive structure.

[0043] By adopting the above technical solution, at least two conductive structures are set on the side of the first semiconductor layer close to the substrate, so that the large-area conductive structure can be separated into small-area conductive structures, thereby reducing the accumulation of charge and avoiding the surface arc phenomenon when preparing the conductive structure at the bottom of the display panel, which affects the preparation of the conductive structure and subsequent processes; the conductive structure is electrically connected through the connecting structure, and all the conductive structures can receive stable signals through only a small number of vias, which can reduce the number of vias, improve the integration of the display panel, and is conducive to the thinness of the display panel. For transparent display panels, the proportion of the light-transmitting area can also be increased, which is conducive to transparent display; the resistance of the connecting structure is greater than the resistance of the conductive structure, which increases the difficulty of charge flow and reduces the speed of charge flow, which can suppress discharge, prevent electrostatic damage, protect the circuit structure in the display panel, and improve the reliability of the display panel.

[0044] The above is the core concept of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without inventive effort are within the scope of protection of the present invention. The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings.

[0045] Figure 3 is a structural diagram of a display panel provided by an embodiment of the present invention, Figure 4 It is along Figure 3 A schematic diagram of the cross-section structure of the BB' section. Figure 1 and Figure 2The display panel 10 includes: a substrate 100 and a circuit layer 200 located on one side of the substrate; the circuit layer 200 includes a thin film transistor 210; the circuit layer 200 also includes a first semiconductor layer 201 and at least two conductive structures 220 located on a side of the first semiconductor layer 201 close to the substrate 100; the first semiconductor layer 201 includes an active layer of the thin film transistor 210; in the thickness direction of the display panel 10, the conductive structure 220 at least covers the channel region of the active layer of the thin film transistor 210; the circuit layer 200 also includes a connecting structure 230; at least two conductive structures 220 are electrically connected through the connecting structure 230; the resistance of the connecting structure 230 is greater than the resistance of the conductive structure 220.

[0046] The substrate 100 may be transparent, translucent or opaque, and may be a rigid substrate or a flexible substrate, which is not specifically limited in this embodiment. The material of the rigid substrate may include but is not limited to glass, and the material of the flexible substrate may include but is not limited to one or more of polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), and polymethyl methacrylate (PMMA). The thin film transistor 210 may be a thin film transistor 210 in a pixel driving circuit located in the display area AA, or a thin film transistor 210 in a scan driving circuit located in the non-display area NA, which is not limited here. The conductive structure 220 includes but is not limited to metal materials, which may include, for example, copper, gold, silver, iron, and the like. The transmittance of the conductive structure 220 is lower than the transmittance of the substrate, which can block the light in the environment from reaching the channel area of ​​the active layer of the thin film transistor 210, improve the impact of light on the channel carriers of the thin film transistor 210, improve the accuracy of the signal transmitted by the thin film transistor 210, and improve the display effect of the display panel 10; in addition, it can also prevent the light on the side of the substrate 100 away from the light-emitting surface from reaching the light-emitting surface of the display panel 10, interfering with the display luminescence of the display panel 10, and improving the display contrast.

[0047] Exemplary, reference Figure 3 and Figure 4 The display panel 10 also includes a light-transmitting area 300. The display panel 10 is a transparent display panel. In this case, the substrate 100 may include a glass substrate. The preparation process of the conductive structure 220 may be a chemical vapor deposition method, in which patterned and discrete metal blocks are formed on one side of the substrate 100 through a mask. These discrete metal blocks are the conductive structures 220. The conductive structures 220 may be located in the same film layer position, and all conductive structures 220 may be prepared in the same process. Then, a patterned first insulating layer 250 is formed on the side of the conductive structure 220 away from the substrate 100. The insulating layer 250 includes a plurality of vias. The connection structure 230 located on the side of the first insulating layer 250 away from the substrate 100 is electrically connected to the conductive structure 220 through these vias.

[0048] It should be noted that the display panel 10 in the embodiment of the present invention is only described by taking a transparent display panel as an example. The display panel 10 can also be a translucent display panel or a non-transparent display panel. The technical solution of the present invention is also applicable to translucent display panels or non-transparent display panels. The principle is similar to that of the transparent display panel and will not be repeated here.

[0049] Continue to refer Figure 3 and Figure 4 , all the conductive structures 220 can be electrically connected to each other through the connection structure 230 to form a connection network, connecting all the conductive structures 220. In this way, it is possible to electrically connect to the signal line 240 through only one via 241, so that all the conductive structures 220 can receive electrical signals. Alternatively, only part of the conductive structures 220 can be electrically connected to each other through the connection structure 230 to form multiple connection networks (not shown in the figure), which can reduce the number of conductive structures 220 connected to each connection network and the area of ​​the conductive structures 220 connected to each connection network, thereby reducing charge accumulation and alleviating discharge phenomena. By connecting the conductive structures 220 through the connection structure 230, it is not necessary to set a via 241 above each conductive structure to achieve that all the conductive structures 220 can receive electrical signals. The number of connection networks can be set according to actual needs, and the embodiment of the present invention does not limit this.

[0050] Among them, the conductive structure 220 can receive a fixed signal, and the signal line 240 can be, for example, a power signal line or a ground signal line, or a signal line with a fixed potential, so that the conductive structure 220 can have a stable potential, which can reduce the parasitic capacitance formed by the conductive structure 220 and other film layer structures in the circuit layer 200, and avoid the conductive structure 220 from interfering with the signal in the circuit structure in the circuit layer 200.

[0051] In an embodiment of the present invention, by providing at least two conductive structures on a side of the first semiconductor layer close to the substrate, a large-area conductive structure can be separated into small-area conductive structures, thereby reducing charge accumulation and avoiding surface arcing when preparing the conductive structure at the bottom of the display panel, which affects the preparation of the conductive structure and subsequent processes; the conductive structures are electrically connected through the connecting structure, and all the conductive structures can receive stable signals through only a small number of vias, which can reduce the number of vias, improve the integration of the display panel, and is conducive to the thinness of the display panel. For transparent display panels, the proportion of the light-transmitting area can also be increased, which is conducive to transparent display; the resistance of the connecting structure is greater than the resistance of the conductive structure, which increases the difficulty of charge flow and reduces the speed of charge flow, which can suppress discharge, prevent electrostatic damage, protect the circuit structure in the display panel, and improve the reliability of the display panel.

[0052] In an optional embodiment, the connection structure 230 and the conductive structure 220 are provided in the same layer, such as Figure 5 ,in, Figure 5 It is along Figure 3 Another cross-sectional structure diagram of the BB' section. Figure 5 After the conductive structure is prepared, a connection structure 230 can be directly formed in the area between the conductive structures 220 through another mask plate. The connection structure 230 and the conductive structure 220 are arranged in the same layer.

[0053] It should be noted that the fill patterns in the figures are only used to distinguish different film structures, and the pattern type is not used to distinguish the film materials. The same pattern type can be used for different film materials and different film structures, and the same film material can also have different fill patterns. In an optional embodiment, the connection structure 230 and the conductive structure 220 are made of different materials, or the connection structure 230 and the conductive structure 220 are made of the same material. The resistance of the connection structure 230 can be changed by changing one or more of the length, width, or thickness of the connection structure 230, so that the resistance of the connection structure 230 is greater than the resistance of the conductive structure 220. This is not limited in the present embodiment.

[0054] In an optional embodiment, the conductive structure 220 located on the side of the first semiconductor layer 201 close to the substrate 100 may also be located in a different film layer, such as Figure 6 and Figure 7 As shown, Figure 6 is a structural diagram of another display panel provided by an embodiment of the present invention. Figure 7 It is along Figure 6 Schematic diagram of a cross-sectional structure of the C-C' section.

[0055] Exemplary, reference Figure 6 and Figure 7The conductive structure 220 can be formed on one side of the substrate 100 in two steps using different mask plates. For example, a first conductive structure 221 is first formed on one side of the substrate 100 using a first mask plate and a first chemical vapor deposition process. In the thickness direction of the display panel 10, the first conductive structure 221 only covers a portion of the channel region of the active layer of the thin film transistor 210. Then, a second conductive structure 222 is formed on one side of the substrate 100 using a second mask plate and a second chemical vapor deposition process. In the thickness direction of the display panel 10, the second conductive structure 222 can cover another portion of the channel region of the active layer of the thin film transistor 210. In the thickness direction of the display panel 10, the first conductive structure 221 and the second conductive structure 222 overlap in the thickness direction of the display panel 10, which not only prevents the formation of an integral conductive structure 220, but also prevents ambient light from passing through the area between the conductive structures 220 to the channel region of the active layer of the thin film transistor 210 or the light-emitting surface of the display panel 10, thereby affecting the display effect.

[0056] Continue to refer Figure 6 and Figure 7 The connection structure 230 can connect the first conductive structure 221 and the second conductive structure 222 at the same time; or, the connection structure 230 can also only connect the first conductive structure 221 or the second conductive structure 222 (not shown in the figure). The connection structure 230 that is only connected to the first conductive structure 221 and the connection structure 230 that is only connected to the first conductive structure 221 can be arranged in the same layer or in different layers, which is not limited in the implementation of the present invention.

[0057] Optional, Figure 8 FIG. 1 is a structural diagram of another display panel provided by an embodiment of the present invention. Figure 3 and Figure 8 Along the first direction X, the size of the connection structure 230 is smaller than or equal to the size of the conductive structure 220 . The first direction X intersects with the arrangement direction of the conductive structure 220 .

[0058] Exemplarily, the first direction X may be perpendicular to the arrangement direction of the conductive structure 220, at least part of the conductive structure 220 extends along the arrangement direction of the conductive structure 220, the size of the conductive structure 220 along the first direction X is the width of at least part of the conductive structure 220, the size of the connecting structure 230 along the first direction X is the width of the connecting structure 230, and the width of the connecting structure 230 is less than or equal to the width of at least part of the conductive structure 220. In this way, the volume of the connecting structure 230 can be reduced, avoiding excessive occupation of the space of the circuit structure in the circuit layer 200, which is conducive to the thinness of the display panel 10.

[0059] In an optional embodiment, the first direction X is parallel to the plane of the substrate 100 . For a transparent display panel, the space utilization rate of the non-light-transmitting area can be reduced, and the size of the non-light-transmitting area can be reduced, which is beneficial to the light transmittance of the transparent display panel.

[0060] Optional, Figure 9 Yes, yes, along Figure 3 Another cross-sectional structure diagram of the BB' section. Figure 9 , the first semiconductor layer 201 further includes a connection structure 230 .

[0061] For example, the first semiconductor layer 201 may include high-resistance polysilicon, and the connection structure 230 may also include high-resistance polysilicon, with the connection structure 230 being co-located with the active layer of the thin-film transistor 210. On the one hand, the conductive structure 220 and the connection structure 230 are fabricated in different processes and comprise different materials, thereby avoiding discharge and arcing during the fabrication process and protecting manufacturing equipment from damage. The high resistance of the connection structure 230 can reduce the flow rate of charge and inhibit discharge. On the other hand, the co-location of the connection structure 230 with the active layer of the thin-film transistor 210 can reduce the number of film layers in the circuit layer 200, improve the space utilization of the circuit layer 220, and facilitate the thinning and lightening of the display panel 10.

[0062] Optional, Figure 10 It is along Figure 3 Another cross-sectional structure diagram of the BB' section. Figure 10 The circuit layer 200 further includes a conductive layer 202 ; the conductive layer 202 is located on a side of the conductive structure 220 away from the substrate 100 ; the conductive layer 202 includes a connecting structure 230 .

[0063] Exemplary, reference Figure 10 The conductive layer 202 includes the gate electrode of the thin film transistor 210. The connecting structure 230 and the gate electrode are provided in the same layer and prepared in the same process, which can simplify the process and reduce the number of film layers in the circuit layer 200. The gate electrode generally comprises molybdenum material, which has a relatively high resistivity. The connecting structure 230 and the gate electrode are provided in the same layer, and the connecting structure 230 also comprises molybdenum material, which can make the connecting structure 230 have a relatively high resistance and can suppress the discharge of the conductive structure 220. The material of the conductive structure 220 can be the same as that of the gate electrode. Since the connecting structure 230, the gate electrode, and the conductive structure 220 are all made of the same material, there is no need to frequently change the preparation materials, which can improve production efficiency.

[0064] It can be understood that the conductive layer can also include the source and drain of the thin transistor, the connecting lines in the circuit structure, the signal lines, etc. (not shown in the figure), and the connection structure can also be set on the same layer as the source and drain of the thin transistor, the connecting lines in the circuit structure, the signal lines, etc., and the number of film layers of the circuit layer can also be reduced, the space utilization rate of the circuit layer can be improved, and it is conducive to the lightweight and thinning of the display panel.

[0065] When the conductive layer 202 and the conductive structure 220 include the same material, the connecting structure 230 and the conductive structure 220 include the same material, the resistivity of the connecting structure 230 is equal to the resistivity of the conductive structure, and the resistance of the connecting structure 230 can be changed by changing one or more of the length, width or thickness of the connecting structure 230 so that the resistance of the connecting structure 230 is greater than the resistance of the conductive structure 220.

[0066] Optional, Figure 11 This is a schematic diagram of a structure in which a conductive structure and a connection structure are connected, provided by an embodiment of the present invention. Figure 11 Along the first direction X, the size of the connection structure 230 is smaller than that of the conductive structure 220 ; along the first direction X, the difference between the size of the conductive structure 220 and the size of the connection structure 230 is greater than 0.5 μm.

[0067] Exemplary, reference Figure 11 Along the first direction X, the conductive structure 220 has a dimension d1, and the connection structure 230 has a dimension d2, where d1-d2>0.5 μm. By setting the width of the connection structure 230 to be significantly smaller than the width of the conductive structure 220, the resistance of the connection structure 230 can be increased, suppressing discharge from the conductive structure 220, preventing electrostatic damage, and improving the reliability of the display panel.

[0068] The first direction X intersects with the arrangement direction of the conductive structures 220 . In an optional embodiment, the first direction X is perpendicular to the arrangement direction of the conductive structures 220 , and the first direction X is parallel to the plane where the substrate 100 is located.

[0069] Optional, Figure 12 is a structural diagram of another display panel provided by an embodiment of the present invention. Figure 13 It is along Figure 12 A schematic diagram of the cross-sectional structure of the D-D' section. Figure 12 and Figure 13 The circuit layer 200 includes a plurality of pixel driving circuits 25 ; the pixel driving circuit 25 includes at least one thin film transistor 210 ; and in the thickness direction of the display panel 10 , the conductive structure 220 overlaps with at least one pixel driving circuit 25 .

[0070] Exemplarily, the display area AA of the display panel 10 includes multiple pixel units 400, the pixel unit 400 includes a pixel area 410 and a light-transmitting area 300, the pixel area 410 includes multiple sub-pixels, each sub-pixel includes a pixel driving circuit 25, and in the thickness direction of the display panel 10, each conductive structure 220 can simultaneously overlap with multiple sub-pixels of the pixel unit 400, and each conductive structure 220 can simultaneously cover the active layer of the thin film transistor of the multiple pixel driving circuits 25 of the pixel unit 400, and a conductive structure 220 can be set at the bottom of the pixel area 410 of each pixel unit 400.

[0071] In an optional embodiment, the pixel area 410 of the pixel unit 400 includes a red sub-pixel 411, a green sub-pixel 412 and a blue sub-pixel 413. Figure 14 As shown, in the thickness direction of the display panel 10, each conductive structure 220 may overlap only with one sub-pixel in the pixel unit 400, and a conductive structure 220 may be provided at the bottom of each sub-pixel. By providing the conductive structure 220 at the bottom of the pixel driving circuit 25 in the display area close to the substrate, it is possible to block ambient light from reaching the active layer of the thin-film transistor 210 in the pixel driving circuit 25, thereby preventing the ambient light from affecting the channel carriers of the thin-film transistor 210 in the pixel driving circuit 25, thereby affecting the pixel driving current in the pixel driving circuit 25 and causing deviations in the luminance of the display panel 10.

[0072] Optionally, the pixel driving circuit includes a driving transistor and a switching transistor electrically connected to the gate of the driving transistor; in the thickness direction of the display panel, the conductive structure at least covers the channel region of the active layer of the switching transistor.

[0073] For example, Figure 15 is a circuit structure diagram of a pixel driving circuit provided by an embodiment of the present invention, with reference to Figure 15Taking the pixel driving circuit 25 including a 7T1C circuit as an example, the pixel driving circuit 25 includes a first light emission control transistor M1, a data signal writing transistor M2, a driving transistor M3, a compensation transistor M4, a storage unit reset transistor M5 (i.e., a first reset transistor M5), a second light emission control transistor M6, a light emission reset transistor M7 (i.e., a second reset transistor M7), and a storage capacitor Cst. The switching transistor includes a compensation transistor M4 and a first reset transistor M5, both of which are electrically connected to the gate of the driving transistor M3. In the thickness direction of the display panel 10, the conductive structure 220 covers at least the channel region of the active layer of the compensation transistor M4 and the first reset transistor M5. In this way, it can block the light in the environment from irradiating the channel region of the active layer of the compensation transistor M4 and the first reset transistor M5, thereby reducing the influence of the light in the environment on the channel carriers of the compensation transistor M4 and the first reset transistor M5, thereby ensuring the stability and accuracy of the gate potential of the driving transistor M3, thereby improving the stability and accuracy of the channel current of the driving transistor M3, and thus improving the stability of the pixel driving signal and the accuracy of the light displayed by the display panel 10.

[0074] In an optional embodiment, in the thickness direction of the display panel 10, the conductive structure 220 only overlaps with the compensation transistor M4 and the first reset transistor M5, which can reduce the size of the conductive structure 220 and increase the transmittance of the pixel area 410 in the display panel 10, which is beneficial to the transparent display of the display panel.

[0075] It is understandable that the pixel driving circuit 25 may also include circuits such as 6T1C, 9T1C, and 9T2C, which is not limited in the embodiment of the present invention.

[0076] Optional, Figure 16 is a structural diagram of another display panel provided by an embodiment of the present invention. Figure 17 It is along Figure 16 A schematic diagram of the cross-sectional structure of the E-E' section. Figure 18 It is along Figure 16 A schematic diagram of the cross-sectional structure of the F-F' section. Figure 16-18The display panel 10 includes a display area AA and a non-display area NA surrounding the display area AA. The circuit layer 200 includes a plurality of pixel driving circuits 25 arranged in an array in the display area AA and a plurality of scan driving circuits 26 arranged in the non-display area NA along a fourth direction T. The pixel driving circuits 25 and the scan driving circuits 26 each include at least one thin film transistor 210. The conductive structure 220 includes a plurality of third conductive structures 223 arranged in the display area AA along a third direction Z and a plurality of fourth conductive structures 224 arranged in the non-display area NA along a fourth direction T. The third direction Z intersects the fourth direction T. In the thickness direction of the display panel 10, the third conductive structure 223 overlaps with at least one pixel driving circuit 25, and the fourth conductive structure 224 overlaps with at least one scan driving circuit 26.

[0077] Specifically, in the thickness direction of the display panel 10, the third conductive structure 223 can cover the channel region of the active layer of part or all of the thin-film transistors 210 of one or more pixel driving circuits 25, so that the third conductive structure 223 is provided at the bottom of all pixel driving circuits 25. This can reduce the impact of ambient light on the thin-film transistors 210 in the pixel driving circuits 25 and improve the luminous stability and luminous accuracy of the light-emitting elements electrically connected to the pixel driving circuits 25. In the thickness direction of the display panel 10, the fourth conductive structure 224 can cover the channel region of the active layer of part or all of the thin-film transistors 210 of one or more scan driving circuits 26, so that the fourth conductive structure 224 is provided at the bottom of all scan driving circuits 26. This can reduce the impact of ambient light on the thin-film transistors 210 in the scan driving circuits 26 in the non-display area NA, allowing the scan driving circuits 26 to accurately transmit scan driving signals, thereby enabling the display panel 10 to accurately display.

[0078] Continue to refer Figure 16 The connection structure 230 includes a first connection structure 231 and a second connection structure 232; the third conductive structure 223 located in the display area AA and adjacent to it is electrically connected through the first connection structure 231; and the fourth conductive structure 224 located in the non-display area NA and adjacent to it is electrically connected through the second connection structure 232.

[0079] For example, the adjacent third conductive structure 223 and the fourth conductive structure 224 may be electrically connected via the first connecting structure 231, as shown in FIG. Figure 16 As shown, the first connection structure 231 can be connected to the third conductive structure 223 and the fourth conductive structure 224 through two vias; or, the adjacent fourth conductive structure 224 is electrically connected to the third conductive structure 223 through the second connection structure 232, as shown in FIG. Figure 19 and 20 As shown, Figure 19is a structural diagram of another display panel provided by an embodiment of the present invention. Figure 20 yes Figure 19 A partial enlarged view of the middle region G. The second connection structure 232 can be connected to the adjacent fourth conductive structure 224 through two vias (31, 32), and the second connection structure 232 can be connected to the fourth conductive structure 224 and the third conductive structure 223 through a third via (33). The three vias (31, 32, 33) are not connected to each other. In this way, the third conductive structure 223 and the fourth conductive structure 224 can be connected, and the number of connection structures 230 and the number of vias can be reduced, which can improve the space utilization of the circuit layer 200 and facilitate the thinness and high resolution of the display panel 10.

[0080] Optionally, along the third direction Z, at least part of the second connection structures 232 are arranged in a staggered manner; and / or, along the fourth direction T, at least part of the first connection structures 231 are arranged in a staggered manner.

[0081] For example, the third direction Z is the row direction and the fourth direction T is the column direction. Figure 21 , part of the second connection structures 232 are arranged along the column direction, and along the third direction Z, the second connection structures 232 of two adjacent columns are staggered; Figure 22 , some of the first connection structures 231 are arranged along the row direction, and along the fourth direction T, the first connection structures 231 of two adjacent rows are staggered; Figure 23 Some of the second connection structures 232 are arranged along the column direction, while some of the first connection structures 231 are arranged along the row direction. Along the third direction Z, the second connection structures 232 in two adjacent columns are staggered, and along the fourth direction T, the first connection structures 231 in two adjacent rows are staggered. This reduces the number of connection structures 230 and the number of vias, facilitating the rational planning of the spatial layout of the circuit layer 200, thereby reducing the size of the circuit layer 200 or improving the spatial utilization of the circuit layer 200, and contributing to the thinness and high resolution of the display panel 10. Furthermore, for transparent display panels, the light transmittance of the transparent display panel can be increased, contributing to the transparency of the transparent display panel.

[0082] Based on the same inventive concept, an embodiment of the present invention further provides a display device, Figure 24 is a structural diagram of a display device provided by an embodiment of the present invention, such as Figure 24 The display device 20 includes the display panel 10 provided by any embodiment of the present invention. The display device 20 provided by the embodiment of the present invention can be Figure 24The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiments of the present invention do not specifically limit this.

[0083] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: include: A substrate and a circuit layer located on one side of the substrate; the circuit layer includes a thin film transistor; The circuit layer further includes a first semiconductor layer and at least two conductive structures located on a side of the first semiconductor layer close to the substrate; the first semiconductor layer includes an active layer of the thin film transistor; In the thickness direction of the display panel, the conductive structure at least covers the channel region of the active layer of the thin film transistor; the conductive structure is used to block the light from the backlight surface of the display panel from irradiating the channel region of the active layer; The circuit layer further includes a connecting structure; at least two of the conductive structures are electrically connected via the connecting structure; and the resistance of the connecting structure is greater than the resistance of the conductive structure; Wherein, along a first direction, the size of the connection structure is smaller than or equal to the size of the conductive structure; the first direction intersects with the arrangement direction of the conductive structure, and the first direction is parallel to the plane where the substrate is located.

2. The display panel according to claim 1, wherein: The light transmittance of the conductive structure is lower than the light transmittance of the substrate.

3. The display panel according to claim 1, wherein: The conductive structure receives a fixed signal.

4. The display panel according to claim 1, wherein: The first semiconductor layer further includes the connection structure.

5. The display panel according to claim 1, wherein: The circuit layer further includes a conductive layer; the conductive layer is located on a side of the conductive structure away from the substrate; and the conductive layer includes the connecting structure.

6. The display panel according to claim 5, wherein: The conductive layer further includes a gate of the thin film transistor; The material of the conductive structure is the same as that of the gate.

7. The display panel according to claim 5, wherein: Along the first direction, the size of the connecting structure is smaller than the size of the conductive structure; Along the first direction, a difference between a size of the conductive structure and a size of the connecting structure is greater than 0.5 μm.

8. The display panel according to claim 1, wherein: The circuit layer includes a plurality of pixel driving circuits; the pixel driving circuit includes at least one thin film transistor; In the thickness direction of the display panel, the conductive structure overlaps with at least one of the pixel driving circuits.

9. The display panel according to claim 8, wherein: The pixel driving circuit includes a driving transistor and a switching transistor electrically connected to the gate of the driving transistor; In the thickness direction of the display panel, the conductive structure at least covers the channel region of the active layer of the switching transistor.

10. The display panel according to claim 1, wherein Also includes: a display area and a non-display area surrounding the display area; The circuit layer includes a plurality of pixel driving circuits located in the display area and arranged in an array, and a plurality of scan driving circuits located in the non-display area and arranged along a fourth direction; each of the pixel driving circuit and the scan driving circuit includes at least one thin film transistor; The conductive structure includes a plurality of third conductive structures located in the display area and arranged along a third direction, and a plurality of fourth conductive structures located in the non-display area and arranged along a fourth direction; the third direction intersects the fourth direction; In the thickness direction of the display panel, the third conductive structure overlaps with at least one pixel driving circuit, and the fourth conductive structure overlaps with at least one scan driving circuit.

11. The display panel according to claim 10, wherein: The connection structure includes a first connection structure and a second connection structure; The third conductive structure located in the display area and adjacent to the third conductive structure is electrically connected via the first connecting structure; and the fourth conductive structure located in the non-display area and adjacent to the fourth conductive structure is electrically connected via the second connecting structure.

12. The display panel according to claim 11, wherein: The adjacent fourth conductive structure is electrically connected to the third conductive structure through the second connecting structure.

13. The display panel according to claim 11, wherein: Along the third direction, at least part of the second connecting structures are staggered; And / or, along the fourth direction, at least part of the first connection structures are staggered.

14. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 13.

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