A preparation method of a light-emitting device and an auxiliary structure thereof

Abstract

The present invention provides a method for preparing a light-emitting device, which relates to the field of semiconductor technology. The method steps include: preparing a high-temperature resistant UV film with a grid pattern and laying the high-temperature resistant UV film with the grid pattern flat on a stage; arranging chips evenly at the center of the high-temperature resistant UV film with the grid pattern; fixedly installing a dispensing bracket at the bottom of the high-temperature resistant UV film with the grid pattern; preparing a fluorescent glue and evenly coating the fluorescent glue on the chips, and then performing baking; controlling the dispensing bracket and the steel sheet on the dispensing bracket to be demolded together, and removing the high-temperature resistant UV film with the grid pattern and the chips from the stage; a spectrometer performs spectral sorting and arranging of the finished chips on the high-temperature resistant UV film with the grid pattern. In the technical solution provided by the present application, it is possible to keep the thickness and color of the fluorescent film consistent.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to a method for preparing a light-emitting device and an auxiliary structure thereof. Background Art

[0002] The full name of CSP packaging (Chip Scale Package) is chip-level packaging. It is a packaging component with the same volume as the LED wafer or a volume not greater than 20% of the LED wafer, and with complete functions. The advantages of CSP packaging are to reduce the packaging volume, improve the reliability of the wafer, and enhance the heat dissipation of the wafer.

[0003] In the prior art, the packaging process of this kind of LED is relatively simple. The specific process is as follows: First, a fixing film is laid on a carrier plate, then an LED chip is fixed on the fixing film. Next, a fluorescent glue is encapsulated on the LED chip. During the encapsulation of the fluorescent glue, a pressing plate is used to press the fluorescent glue so that the fluorescent glue can reliably cover the LED chip. Then, the cured fluorescent glue is cut, and finally, the carrier plate and the fixing film are separated. In the prior art, although this process is simple, when encapsulating the fluorescent glue, since the fluorescent glue has a certain fluidity, it is difficult to control the shape and dosage of the fluorescent glue, and it is also difficult to control the thickness uniformity of the fluorescent glue at various places. The quality of the chip-level packaged LED is difficult to guarantee. Summary of the Invention

[0004] The main object of the present invention is to provide a method for preparing a light-emitting device and an auxiliary structure thereof, aiming to solve the technical problems of uneven thickness and inconsistent color of the fluorescent film in the prior art.

[0005] To achieve the above object, the present invention provides a method for preparing a light-emitting device, including the following steps:

[0006] Prepare a high-temperature resistant UV film with a grid pattern and lay the high-temperature resistant UV film with the grid pattern flat on a stage;

[0007] Arrange the chips evenly at the center of the high-temperature resistant UV film with the grid pattern;

[0008] Fix and install a dispensing bracket at the bottom of the high-temperature resistant UV film with the grid pattern;

[0009] Prepare a fluorescent glue, evenly coat the fluorescent glue on the chips, and then perform baking;

[0010] Control the dispensing bracket and the steel sheet on the dispensing bracket to be demolded together, and remove the high-temperature resistant UV film with the grid pattern and the chips from the stage;

[0011] A spectrometer sorts and arranges the finished chips on the high-temperature resistant UV film with the grid pattern.

[0012] Optionally, the steps of preparing the high-temperature resistant UV film with a grid pattern include:

[0013] Lay and fix the high-temperature resistant UV film on the stage, and control the non-adhesive surface of the high-temperature resistant UV film to face upward.

[0014] Set the power of the laser marking machine to 3W, the frequency to 50KHz, and etch out the grid pattern at an etching speed of 300 mm / s.

[0015] Optionally, the steps of preparing the fluorescent glue include:

[0016] Put the fluorescent powder, transparent silica gel, and anti-settling powder fumed silica into a glass cup according to a certain mass ratio, and manually stir evenly in a clockwise direction with a glass rod.

[0017] Put the prepared fluorescent glue into a centrifugal stirrer for stirring.

[0018] Put the stirred fluorescent glue into a vacuum degassing machine for degassing.

[0019] Optionally, after evenly coating the fluorescent glue on the chip and then performing the baking step, the following steps are further included:

[0020] Place the stage on a grinding machine for leveling treatment.

[0021] Fix and install the steel sheet on the dispensing bracket.

[0022] Mix a light diffusing agent and silica gel in a certain proportion to form a transparent glue, and evenly coat the transparent glue on the fluorescent glue.

[0023] Control the height of the transparent glue to be flush with the top of the dispensing bracket, and perform baking.

[0024] In addition, to achieve the above object, the present invention also provides an auxiliary structure for preparing a light-emitting device, including:

[0025] A stage, on the end face of which a plurality of positioning posts are arranged at intervals, and the positioning posts are arranged circumferentially around the stage.

[0026] A dispensing bracket, which extends in the horizontal plane direction, and a plurality of first opening holes are provided on the end face of the dispensing bracket.

[0027] Optionally, a plurality of first mounting holes are provided through the end face of the dispensing bracket, and the first mounting holes are arranged circumferentially around the dispensing bracket.

[0028] Optionally, the auxiliary structure for preparing the light-emitting device further includes a steel sheet, and a plurality of second opening holes are provided on the end face of the steel sheet, and the second opening holes are arranged in one-to-one correspondence with the first opening holes.

[0029] Optionally, a plurality of second mounting holes are penetrated through the end face of the steel sheet, and the second mounting holes are arranged along the circumferential direction of the steel sheet.

[0030] Optionally, an installation groove is provided on the back surface of the carrier, and a magnetic attracting member is provided in the installation groove.

[0031] In the technical solution provided by the present invention, the method steps include: preparing a high-temperature resistant UV film with a grid pattern and laying the high-temperature resistant UV film with a grid pattern flat on the carrier; arranging the chips evenly at the center of the high-temperature resistant UV film with a grid pattern; fixedly installing the dispensing bracket at the bottom of the high-temperature resistant UV film with a grid pattern; preparing a fluorescent glue and uniformly coating the fluorescent glue on the chips, and then performing baking; controlling the dispensing bracket and the steel sheet on the dispensing bracket to be demolded together, and removing the high-temperature resistant UV film with a grid pattern and the chips from the carrier; the spectrometer performs spectral sorting and arranging of the finished chips on the high-temperature resistant UV film with a grid pattern. In the technical solution provided by the present application, it is possible to keep the thickness and color of the fluorescent film consistent. Description of the Drawings

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0033] Figure 1 It is a schematic flow chart of an embodiment of the preparation method of the light-emitting device provided by the present invention;

[0034] Figure 2 It is a schematic flow chart of an embodiment of the preparation method of the light-emitting device provided by the present invention;

[0035] Figure 3 It is a schematic installation diagram between the light-emitting device provided by the present invention and the auxiliary structure;

[0036] Figure 4 For Figure 3 The top view of the carrier in;

[0037] Figure 5 For Figure 3 The bottom view of the carrier in;

[0038] Figure 6 For Figure 3 The structural schematic diagram of the dispensing bracket in;

[0039] Figure 7 is Figure 3 a schematic structural diagram of a middle steel sheet;

[0040] Figure 8 is Figure 3 a schematic structural diagram of a high-temperature resistant UV film with a grid pattern.

[0041] Explanation of the reference numerals in the drawings:

[0042] Label Name Label Name 100 Auxiliary structure 60 Fluorescent glue 10 Carrier stage 70 Steel sheet 20 Positioning post 80 Transparent glue 30 High-temperature resistant UV film with grid 92 Installation groove 40 Chip 93 First installation hole 50 Dispensing bracket 94 First windowing hole 90 Positioning post 95 Second installation hole 91 Magnetic part 96 Second windowing hole

[0043] The realization, functional features and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0044] To make the object, technical solutions and advantages of the present invention more clear and understandable, the present invention will be further described in detail below with reference to specific embodiments and the accompanying drawings. The technical solutions in the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0045] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present invention. In the following detailed description, for the sake of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present invention. However, obviously, one or more embodiments can also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present invention.

[0046] The terms used herein are merely for describing specific embodiments and are not intended to limit the present invention. The terms "including", "comprising" and the like used herein indicate the presence of the described features, steps, operations and / or components, but do not exclude the presence or addition of one or more other features, steps, operations or components.

[0047] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those of ordinary skill in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0048] In the case of using expressions such as "at least one of A, B, and C, etc.", generally, it should be interpreted according to the meaning that those skilled in the art usually understand this expression (for example, "a system having at least one of A, B, and C" should include but not be limited to a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.). In the case of using expressions such as "at least one of A, B, or C, etc.", generally, it should be interpreted according to the meaning that those skilled in the art usually understand this expression (for example, "a system having at least one of A, B, or C" should include but not be limited to a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0049] It should be noted that if there are directional indications in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship, movement conditions, etc. between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0050] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, or scenario B, or the scenario where both A and B are satisfied simultaneously. Also, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0051] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention.

[0052] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "coupling" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0053] In addition, in the description of the present invention, unless otherwise specified, the meanings of "a plurality of", "multiple roots" and "multiple groups" are two or more.

[0054] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0055] In the prior art, the packaging process of this kind of LED is relatively simple. The specific process is as follows: first, a fixing film is laid on a carrier plate, then an LED chip is fixed on the fixing film, and then a fluorescent glue is encapsulated on the LED chip. During the process of encapsulating the fluorescent glue, a pressing plate is used to press the fluorescent glue so that the fluorescent glue can reliably cover the LED chip, and then the solidified fluorescent glue is cut, and finally the carrier plate and the fixing film are separated. In the prior art, although this process is simple, when encapsulating the fluorescent glue, since the fluorescent glue has a certain fluidity, it is difficult to control the shape and dosage of the fluorescent glue, and it is also difficult to control the thickness uniformity of the fluorescent glue everywhere, and the quality of the chip-level packaged LED is difficult to be guaranteed.

[0056] In view of this, the present invention provides a method for preparing a light-emitting device and its auxiliary structure, aiming to solve the above problems. Refer to Figure 1 , Figure 1 is a schematic flow chart of an embodiment of the method for preparing a light-emitting device according to the present invention. In one embodiment, the method for preparing a light-emitting device includes the following steps:

[0057] Step S10: Prepare a high-temperature resistant UV film 30 with a grid pattern and lay the high-temperature resistant UV film 30 with the grid pattern flat on a stage 10.

[0058] Step S20: Arrange chips 40 evenly at the center of the high-temperature resistant UV film 30 with the grid pattern.

[0059] Step S30: Fix and install a dispensing bracket 50 at the bottom of the high-temperature resistant UV film 30 with the grid pattern.

[0060] Step S40: Prepare the fluorescent glue 60, evenly coat the fluorescent glue 60 on the chip 40, and then perform baking.

[0061] Step S50: Control the dispensing bracket 50 and the steel sheet 70 on the dispensing bracket to demold together, and remove the high-temperature resistant UV film 30 with a grid pattern and the chip 40 from the carrier 10.

[0062] Step S60: The spectrometer performs spectral sorting and arranging of the finished chips 40 on the high-temperature resistant UV film 30 with a grid pattern.

[0063] In this embodiment, the high-temperature resistant UV film 30 with a grid pattern is laid flat on the fixed planar carrier 10. The high-temperature resistant UV film 30 with a grid pattern needs to pass through 4 positioning posts 20 with grooves on the fixed planar carrier 10. The purpose is to lay and fix the high-temperature resistant UV film 30 with a grid pattern on the carrier 10 without tension, facilitating the flat and non-tilted arrangement of the chips.

[0064] In this embodiment, the chip 40 is taken as an example of a flip-chip for illustration. Then, an aligner is used to evenly arrange the flip-chips in the center of the high-temperature resistant UV film 30 with a grid pattern. It can be understood that a chip aligner is an automated device suitable for the arrangement and feeding of small parts in industrial automated production. It can solve the problems of arranging and feeding parts such as thin sheets, soft magnetic materials, circular, cylindrical, needle-shaped parts, and irregular parts products.

[0065] Then, control the correspondence between the grids of the dispensing bracket 50 and the high-temperature resistant UV film 30 with a grid pattern. After spraying a demolding agent on the inner wall of the dispensing bracket 50, fix the dispensing bracket 50 in the center of the high-temperature resistant UV film 30 with a grid pattern, and control the bottom of the dispensing bracket 50 to closely adhere to the high-temperature resistant UV film 30 with a grid pattern. The specific method is to control the dispensing bracket 50 to be positioned through the first mounting hole 93 and the positioning post 20 on the carrier 10. The purpose is to control the dispensing bracket 50 to be fixed on the carrier 10.

[0066] The demolding agent is a type of isolation film applied between the product and the mold to prevent the formed composite product from adhering to the mold, so that the product can be easily removed from the mold, while ensuring the surface quality of the product and the integrity of the mold. It can be understood that the function of spraying the demolding agent is to facilitate subsequent demolding.

[0067] Then, the silicone and phosphor are mixed in a certain proportion to form the fluorescent glue 60, which is evenly coated on the flip chip, and its height is flush with the top of the control dispensing bracket 50, and then baking is carried out. The control dispensing bracket 50 and the steel sheet 70 are demolded together, and the high-temperature resistant UV film 30 with a grid pattern and the CPS are removed from the fixed planar stage 10 together, and the spectrometer sorts and arranges the finished products on the high-temperature resistant UV film 30 with a grid pattern.

[0068] Further, the method for preparing the high-temperature resistant UV film 30 with a grid pattern includes the following method steps:

[0069] Step S101: Lay and fix the high-temperature resistant UV film 30 with a grid pattern on the stage 10, and control the non-adhesive surface of the high-temperature resistant UV film 30 with a grid pattern to face upward.

[0070] Step S102: Set the power of the laser marking machine to 3W, the frequency to 50KHz, and etch out the grid pattern at an etching speed of 300 mm / s.

[0071] It can be understood that laser marking is to use a laser beam to make permanent marks on the surfaces of various different substances. The marking effect is to expose the deep layer substance by evaporating the surface layer substance, or to "etch" a trace through the chemical and physical changes of the surface layer substance caused by light energy, or to burn off part of the substance by light energy to show the required etched pattern or text.

[0072] In this embodiment, by etching out the grid pattern on the high-temperature resistant UV film 30, the chips 40 can be neatly arranged at the centers of the grid patterns on the high-temperature resistant UV film 30 through a chip mounter, which can specify the positions of the chips 40 and the positions of the fixing molds, so that the arrangement of the chips 40 is in a straight line both horizontally and vertically, facilitating the fixing accuracy of the brackets and ensuring the dimensional accuracy of the product after demolding. In addition, after the high-temperature resistant UV film with a grid pattern is removed from the stage, the chips do not need to be additionally cut, and the cutting process can be omitted.

[0073] Further, the steps for preparing the fluorescent glue 60 further include the following steps:

[0074] Step S401: Put the phosphor, transparent silicone and anti-settling powder fumed silica into a glass cup and manually stir evenly in a clockwise direction with a glass rod.

[0075] Step S402: Put the prepared fluorescent glue 60 into a centrifugal stirrer for stirring.

[0076] Step S403: Put the stirred fluorescent glue 60 into a vacuum degassing machine for degassing.

[0077] In this embodiment, the phosphor, transparent silica gel, and anti-settling powder fumed silica are placed in a glass cup according to a mass ratio of 2:1:0.01, and manually stirred clockwise with a glass rod until evenly mixed; the prepared fluorescent glue 60 is placed in a centrifugal mixer and stirred under the conditions of 2000 rpm / 1 min; the stirred material is placed in a vacuum degassing machine for degassing, with a vacuum degree of -0.1 MPa and a degassing time of 10 to 20 minutes.

[0078] It should be noted that the mass ratio of the phosphor to the transparent silica gel is 2:1; the particle size of the phosphor is 5 to 20 μm; the mass ratio of the anti-settling powder fumed silica to the transparent silica gel is 0.01:1; the particle size of the anti-settling powder fumed silica is 5 to 10 nm.

[0079] See Figure 2 , further, in this embodiment, after step S40, it further includes:

[0080] Step S41: Place the stage 10 on a grinding machine for surface grinding.

[0081] Step S42: Fix and install the steel sheet 70 on the dispensing bracket 50.

[0082] Step S43: Mix a light diffusing agent and silica gel in a certain proportion to form a transparent glue 80, and evenly coat it on the fluorescent glue 60.

[0083] Step S44: Control the height of the transparent glue 80 to be flush with the top of the dispensing bracket 50, and perform baking.

[0084] In this embodiment, in order to ensure the uniformity of the emission color, it is necessary to control the dispensing height to control the amount of phosphor glue, because the color consistency is related to the phosphor concentration. The height of the phosphor glue cannot be kept consistent by conventional dispensing, so a grinding process needs to be added. The specific implementation method is as follows: Place the stage 10 on a high-speed rotating mechanism, with the height of the cutting tool flush with the top of the dispensing bracket 50, and the moving speed of the cutting tool from the circumference to the center of the circle is 1 mm / s. Through this grinding process, the height consistency of the phosphor glue can be achieved, thereby ensuring the uniformity of the emission color.

[0085] In summary, in the technical solution provided by the present invention, first, the high-temperature resistant UV film 30 with a grid pattern is laid flat on the flat stage, and the high-temperature resistant UV film 30 with a grid pattern passes through the 4 positioning posts 20 with grooves on the stage 10.

[0086] The bottom of the dispensing support 50 is closely attached to the high-temperature resistant UV film 30 with a grid pattern. The dispensing support 50 is stuck on the positioning posts 90 with grooves, and it is ensured that the grids between the dispensing support 50 and the high-temperature resistant UV film 30 with a grid pattern correspond to each other. After spraying a mold release agent on the inner wall of the dispensing support 50, the dispensing support 50 is fixed at the center of the high-temperature resistant UV film 30 with a grid pattern. Then, the flip chips are batch-fixed at the center of the high-temperature resistant UV film 30 with a grid pattern by an array machine. After mixing silica gel and phosphor in a certain proportion to form a fluorescent glue 60, it is evenly coated on the flip chips, and its height is controlled to be flush with the top of the dispensing support 50, so as to control the amount of glue, ensure color consistency, and improve the yield.

[0087] A 50-μm steel sheet 70 is installed on the surface of the dispensing support 50 to control the height of the transparent glue 80 mixed with a light diffusing agent. The steel sheet 70 is closely attached to the dispensing support 50 for controlling the dispensing height through the magnet at the bottom of the carrier 10. The transparent glue 80 mixed with a light diffusing agent is coated on the fluorescent glue 60, and the amount of glue is flush with the top of the steel sheet 70, which can effectively ensure product reliability, increase light scattering and transmission, cover the light source and the dazzling light source, and at the same time make the whole resin emit softer, more beautiful and elegant light, achieving a comfortable effect of light transmission without transparency. In addition, the present invention does not require additional equipment investment, and the process is simple and has good stability.

[0088] In addition, to achieve the above-mentioned invention purpose, referring to Figures 3 - 8 , the present invention also provides an auxiliary structure 100 for preparing a light-emitting device, including a carrier 10 and a dispensing support 50; a plurality of positioning posts 90 are spacedly arranged on the end surface of the carrier 10, and the positioning posts 90 are arranged circumferentially around the carrier 10; the dispensing support 50 extends in the horizontal plane direction, and a plurality of first opening holes 94 are provided on the end surface of the dispensing support 50. There are 4 positioning posts on the surface of the carrier 10 for controlling the positioning of the dispensing support 50. An installation groove 92 is provided on the back of the carrier 10, and a magnetic attraction member 91 is provided in the installation groove 92. In this embodiment, the magnetic attraction member 91 can specifically be a high-temperature resistant magnet.

[0089] The structural diagram of the dispensing support is as Figure 6 shown. There are first mounting holes 93 matching the carrier 10 at the four corners of the dispensing support 50. The first mounting holes 93 on the dispensing support 50 are inserted into the positioning posts 90 on the carrier 10 to achieve alignment, and the dispensing support 50 is closely attached to the carrier 10 through the magnet at the bottom of the carrier 10; the dispensing support 50 is provided with first opening holes 94, the size of the first opening holes 94 is 1.2 times the area of the chip, and the thickness of the dispensing support 50 is increased by 25 - 120 μm on the basis of the thickness of the chip 40.

[0090] The structural diagram of the steel sheet is as Figure 7As shown, the four corners of the steel sheet 70 have second mounting holes 95 that match the carrier. The second mounting holes 95 on the steel sheet 70 are inserted into the positioning posts 20 on the carrier 10 to achieve alignment. The steel sheet 70 is closely attached to the carrier through the magnets at the bottom of the carrier 10. The steel sheet 70 is provided with second window holes 96, and the size of the second window holes 96 is the same as that of the first window holes 94 on the dispensing bracket 50. The thickness of the steel sheet is 50 μm - 70 μm.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention. The specific embodiments described above have further detailed the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for preparing a light-emitting device, characterized in that, The steps are as follows: Prepare a high-temperature resistant UV film with a grid pattern, and lay the high-temperature resistant UV film with the grid pattern flat on the stage, so that the high-temperature resistant UV film with the grid pattern passes through 4 positioning posts with grooves above the stage; Arrange the chips evenly in the center of the high-temperature resistant UV film with the grid pattern; Fix and install the dispensing bracket on the high-temperature resistant UV film with the grid pattern, so that the dispensing bracket is stuck on the positioning posts with grooves, and control the correspondence between the grids of the dispensing bracket and the high-temperature resistant UV film with the grid pattern; Prepare the fluorescent glue, and evenly coat the fluorescent glue on the chips, and then perform baking; Fix and install a steel sheet that can be attracted by a magnet on the dispensing bracket, and evenly coat a transparent glue containing a light diffusing agent on the fluorescent glue; Control the dispensing bracket and the steel sheet on the dispensing bracket to be demolded together, and remove the high-temperature resistant UV film with the grid pattern and the chips from the stage; The spectrometer performs spectral sorting and arranging of the finished chips on the high-temperature resistant UV film with the grid pattern.

2. The manufacturing method of the light-emitting device according to claim 1, characterized in that, The steps for preparing the high-temperature resistant UV film with the grid pattern include: Lay and fix the high-temperature resistant UV film on the stage, and control the non-bonding surface of the high-temperature resistant UV film to face upward; Set the power of the laser marking machine to 3W, the frequency to 50KHz, and etch the grid pattern at an etching speed of 300 mm / s.

3. The manufacturing method of the light-emitting device according to claim 1, characterized in that The steps for preparing the fluorescent glue include: Put phosphor powder, transparent silica gel and anti-settling powder fumed silica into a glass cup according to a certain mass ratio, and manually stir evenly in a clockwise direction with a glass rod; Put the prepared fluorescent glue into a centrifugal stirrer for stirring; Put the stirred fluorescent glue into a vacuum degassing machine for degassing.

4. The method for preparing the light-emitting device according to claim 1, characterized in that, After the step of evenly coating the fluorescent glue on the chips and then performing baking, the following steps are further included: Place the stage on a grinding machine for leveling treatment; Fix and install the steel sheet on the dispensing bracket; Mix the light diffusing agent and silica gel in a certain proportion to form a transparent glue, and evenly coat the transparent glue on the fluorescent glue; Control the height of the transparent glue to be flush with the top of the dispensing bracket, and perform baking.

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