Diaphragm for sound production device and sound production device having the same

Abstract

The application discloses a diaphragm for a sound generating device and a sound generating device with the same, the diaphragm comprising a main body part and a conductive part, the main body part being made of one of polyether ether ketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber and hydrogenated nitrile rubber, the conductive part being arranged on the main body part, at least a part of the conductive part being exposed to electrically connect with a voice coil and an external circuit of the sound generating device; the conductive part comprising a base and a conductive material dispersed in the base, the base being formed into a film layer prepared by cross-linking reaction of alpha, omega-dihydroxy polysiloxane and a cross-linking agent, the change rate of the elongation at break of the conductive part being less than 20% after aging for 168 hours in an environment of 180 DEG C, and the molecular structure of the alpha, omega-dihydroxy polysiloxane being: R is one of -CH3, -CH2CH3, -C6H5 and -CH2CH2CF3. The conductive part of the diaphragm according to the application has excellent temperature resistance and flexibility.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electroacoustics, and more particularly, to a diaphragm for a sound emitting device and a sound emitting device using the same. BACKGROUND

[0002] At present, the conductive film layer commonly used in the field of loudspeakers generally needs to meet the requirements of low resistance, good flexibility and high temperature resistance. The existing conductive film layer prepared by conductive adhesive generally has certain defects. For example, the conductive film layer prepared by solvent type conductive adhesive has poor heat resistance and cannot be used in high temperature environment; the polyurethane conductive film layer has good flexibility but poor temperature resistance and cannot be used in long-term high temperature vibration environment; the conductive film layer prepared by epoxy conductive adhesive has low elongation at break and is prone to fracture during vibration, etc. The above factors limit the application of the existing conductive adhesive in loudspeakers.

[0003] Therefore, there is a need for a new technical solution to meet the requirements of diaphragm in high temperature resistance and flexibility, etc. SUMMARY

[0004] An object of the present application is to provide a diaphragm for a sound emitting device, which has excellent high temperature resistance while maintaining good flexibility.

[0005] Another object of the present application is to provide a sound emitting device composed of the above-mentioned diaphragm for a sound emitting device.

[0006] In order to achieve the above objects, the present application provides the following technical solutions.

[0007] The diaphragm for a sound emitting device according to the first aspect of the present application comprises a main body and a conductive part, the main body is made of one of polyether ether ketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber and hydrogenated nitrile rubber, the conductive part is arranged on the main body, and at least a part of the conductive part is exposed to be electrically connected with a voice coil and an external circuit of the sound emitting device.

[0008] The conductive part comprises a base and a conductive material dispersed in the base, the base is formed into a film layer prepared by cross-linking reaction of alpha, omega-dihydroxy polysiloxane and a cross-linking agent, and the change rate of elongation at break of the conductive part is less than 20% after aging for 168h in an environment of 180℃,

[0009] The molecular structure of the alpha, omega-dihydroxy polysiloxane is as follows:

[0010] Wherein, R is one of -CH3, -CH2CH3, -C6H5 and -CH2CH2CF3.

[0011] According to some embodiments of the present application, the viscosity of the α,ω-dihydroxyl polysiloxane is 10000 mPa·s to 1000000 mPa·s.

[0012] According to some embodiments of the present application, the percentage of the α,ω-dihydroxyl polysiloxane in the total weight of the conductive part is 3wt% to 30wt%, and the percentage of the cross-linking agent in the total weight of the conductive part is 0.1wt% to 10wt%.

[0013] According to some embodiments of the present application, the cross-linking agent is one of a de-alcohol type cross-linking agent, a de-ketoxime type cross-linking agent, a de-acetone type cross-linking agent, and a de-acid type cross-linking agent.

[0014] According to some embodiments of the present application, the percentage of the conductive material in the total mass of the conductive part is 70wt% to 95wt%.

[0015] According to some embodiments of the present application, the conductive material is at least one of silver powder particles, gold powder particles, nickel powder particles, aluminum powder particles, copper powder particles, or ionic liquid.

[0016] According to some embodiments of the present application, the conductive material is at least one of a spherical shape, a flaky shape, and an irregular polygonal shape, and the maximum size of the conductive material is less than 40μm.

[0017] According to some embodiments of the present application, the conductive material includes spherical conductive material and flaky conductive material, and the percentage of the spherical conductive material in the total mass of the conductive material is less than 13%.

[0018] According to some embodiments of the present application, the α,ω-dihydroxyl polysiloxane and the cross-linking agent are subjected to a cross-linking reaction under the action of a catalyst, and the catalyst is at least one of an organic tin carboxylate and a chelate thereof, an organic bismuth carboxylate and a chelate thereof, a titanate and a chelate thereof.

[0019] According to some embodiments of the present application, the matrix further includes an antioxidant, and the antioxidant is one of antioxidant 168, antioxidant 245, antioxidant 1010, antioxidant 1098, and antioxidant 1024.

[0020] According to some embodiments of the present application, the linear resistance value of the conductive part is less than or equal to 0.2Ω / mm.

[0021] According to some embodiments of the present application, the thickness of the diaphragm is 30μm to 200μm, and the thickness of the conductive part is 5μm to 150μm.

[0022] According to some embodiments of the present application, the sound generating device includes the diaphragm for a sound generating device.

[0023] According to the diaphragm and sound production device of the embodiments of the present application, the conductive part of the diaphragm is prepared by using a film layer prepared from α,ω-dihydroxy polysiloxane through a cross-linking reaction, the α,ω-dihydroxy polysiloxane main chain is Si-O structure, the Si-O chemical bond has high bond energy, and can work for a long time under high temperature conditions of 180℃ without chemical bond rupture, and has high temperature aging resistance, and thus the prepared conductive part has excellent high temperature resistance and bending resistance.

[0024] Other features of the present application, and their advantages, will become apparent from the following detailed description of exemplary embodiments of the present application, with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0025] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0026] Figure 1 Structure diagram of a diaphragm according to an embodiment of the present application;

[0027] Figure 2 Partial sectional view of a diaphragm according to an embodiment of the present application;

[0028] Figure 3 Partial sectional view of a diaphragm according to another embodiment of the present application;

[0029] Figure 4 Schematic diagram of a diaphragm according to an embodiment of the present application in a 3mm*3mm square test diagonal;

[0030] Figure 5 Partial sectional view of a sound production device according to an embodiment of the present application;

[0031] Figure 6 Partial sectional view of a sound production device according to another embodiment of the present application.

[0032] REFERENCE NUMERALS:

[0033] Diaphragm 10; main body part 11; conductive part 12;

[0034] Voice coil 20; first diaphragm 21; second diaphragm 22. DETAILED DESCRIPTION

[0035] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. Note that the relative arrangement, numerical expressions, and numerical values of the components and steps set forth in these embodiments are not limiting to the scope of the present application, unless otherwise specifically stated.

[0036] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0037] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0038] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0039] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0040] The following first describes in detail, with reference to the accompanying drawings, a diaphragm 10 for a sound-producing device according to an embodiment of the present invention. The sound-producing device 100 may be a speaker unit, which includes a magnetic circuit system, a diaphragm 10, and a voice coil 20 disposed on the diaphragm 10. The end of the voice coil 20, distal from the diaphragm 10, is inserted into the magnetic gap of the magnetic circuit system. When the speaker unit is operating, current flows through the voice coil 20, causing it to vibrate back and forth under the influence of the magnetic field, driving the diaphragm 10 to vibrate and produce sound.

[0041] like Figures 1 to 6 As shown, the diaphragm 10 for a sound-emitting device according to an embodiment of the present invention includes a main body 11 and a conductive part 12. The main body 11 is made of one of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber, and hydrogenated nitrile rubber. The conductive part 12 is provided on the main body 11, and at least a portion of the conductive part 12 is exposed to be electrically connected to the voice coil 20 of the sound-emitting device and an external circuit.

[0042] The conductive portion 12 includes a matrix and a conductive material dispersed in the matrix. The matrix is ​​formed into a film layer prepared by a cross-linking reaction of α,ω-dihydroxy polysiloxane and a cross-linking agent. The elongation at break of the conductive portion 12 after aging for 168 hours at 180°C is less than 20%.

[0043] The molecular structure of α,ω-dihydroxy polysiloxane is:

[0044] Wherein, R is one of -CH3, -CH2CH3, -C6H5 and -CH2CH2CF3.

[0045] In other words, if Figure 1As shown, the diaphragm 10 according to the embodiment of the present application can be used in a sound generating device, and the diaphragm 10 mainly comprises a main body part 11 and a conductive part 12, wherein the main body part 11 is a structure prepared from any one of an ethylene-acrylate rubber film, an acrylate rubber film, a hydrogenated nitrile rubber film and an ethylene-propylene rubber film, and the main body part 11 constitutes the main structure of the diaphragm 10, and at least a part of the conductive part 12 is exposed on the surface of the main body part 11, and the conductive part 12 exposed on the surface of the main body part 11 can be electrically connected with a voice coil 20 and an external circuit of the sound generating device, and the circuit connection operation is simple.

[0046] The conductive part 12 mainly comprises a base and a conductive material, the base constitutes the main structure of the conductive part 12, for example, can be a film layer arranged on the main body part 11, that is, the conductive part 12 is also formed as a film layer structure, and the base can be prepared from an α,ω-dihydroxy polysiloxane and a cross-linking agent through a cross-linking reaction to form a film layer, the main chain of the α,ω-dihydroxy polysiloxane is a Si-O structure, and the chemical bond energy is 460 kJ / mol. The C-N structure in the conventional polyurethane adhesive has a chemical bond energy of 305 kJ / mol, the C-O structure has a chemical bond energy of 326 kJ / mol, and the conventional acrylic temperature-resistant adhesive contains a C-C structure, and the chemical bond energy is 332 kJ / mol. Compared with the conventional adhesive, the Si-O chemical bond energy of the film layer of the conductive part 12 prepared from the α,ω-dihydroxy polysiloxane is high, and the conductive part 12 can work at a high temperature of 180℃ for a long time without chemical bond rupture, and has excellent high-temperature aging resistance.

[0047] In addition, the α,ω-dihydroxy polysiloxane resin has good high-temperature resistance, and the prepared conductive part 12 has high temperature resistance, and the elongation at break of the conductive part 12 changes by less than 20% after heat aging in an oven at 180℃ for 168 h, and the elongation at break increases with the increase of the content of the α,ω-dihydroxy polysiloxane resin, and the change rate of the elongation at break after high-temperature aging is smaller.

[0048] Therefore, the diaphragm 10 and the sound generating device according to the embodiment of the present application use the film layer prepared from the α,ω-dihydroxy polysiloxane through the cross-linking reaction as the conductive part 12 of the diaphragm 10, the main chain of the α,ω-dihydroxy polysiloxane is a Si-O structure, the Si-O chemical bond energy is high, and the conductive part 12 can work at a high temperature of 180℃ for a long time without chemical bond rupture, and has excellent high-temperature aging resistance, and the prepared conductive part 12 has excellent high-temperature resistance and bending resistance.

[0049] According to one embodiment of the present application, the viscosity of the α,ω-dihydroxy polysiloxane is 10000 mPa·s to 1000000 mPa·s.

[0050] Specifically, the viscosity of the α, ω-dihydroxy polysiloxane directly affects the elongation at break and viscosity of the conductive part 12 after curing. When the viscosity of the α, ω-dihydroxy polysiloxane is less than 10000 mPa·s, the molecular weight is too low, the crosslinking density of the conductive part 12 after curing is high, and the elongation at break is low; when the viscosity of the α, ω-dihydroxy polysiloxane is greater than 1000000 mPa·s, the molecular weight of the conductive part 12 is too high, resulting in high viscosity and difficult to use.

[0051] Therefore, according to the diaphragm 10 of the embodiment of the present application, by controlling the viscosity of the α, ω-dihydroxy polysiloxane to be between 10000 mPa·s and 1000000 mPa·s, for example, 10000 mPa·s, 50000 mPa·s, 100000 mPa·s, 200000 mPa·s, 500000 mPa·s, 1000000 mPa·s, etc., the elongation at break and viscosity of the conductive part 12 can be effectively controlled, and the use effect is guaranteed.

[0052] In some specific embodiments of the present application, the percentage of α, ω-dihydroxy polysiloxane in the total weight of the conductive part 12 is 3wt% to 30wt%, and the percentage of crosslinking agent in the total weight of the conductive part 12 is 0.1wt% to 10wt%; when the amount of crosslinking agent is less than 0.1wt%, there is no crosslinking or the crosslinking density is low, and the temperature resistance is poor; when the crosslinking agent is greater than 10wt%, the crosslinking density is too high, and the elongation at break is poor, that is, the flexibility is reduced. In order to facilitate the description, the percentage of each component in the present application can be described in parts, for example, the percentage of α, ω-dihydroxy polysiloxane in the total weight of the conductive part 12 is 3wt%, which can be understood as 3 parts of α, ω-dihydroxy polysiloxane, and the percentage of α, ω-dihydroxy polysiloxane in the total weight of the conductive part 12 is 30wt%, which can be understood as 30 parts of α, ω-dihydroxy polysiloxane.

[0053] Specifically, the content of α, ω-dihydroxy polysiloxane directly affects the change of the elongation at break of the conductive part 12. Table 1 shows the influence of different contents of α, ω-dihydroxy polysiloxane on the elongation at break of the conductive part 12 prepared.

[0054] Table 1 Influence of different contents of α, ω-dihydroxy polysiloxane in the conductive part on the elongation at break

[0055]

[0056]

[0057] As can be seen from Table 1, as the content of α, ω-dihydroxy polysiloxane resin in the conductive part 12 increases, the elongation at break increases, and the change rate of the elongation at break after high temperature aging is smaller.

[0058] In some embodiments of the present application, the conductive material is at least one of silver powder particles, gold powder particles, nickel powder particles, aluminum powder particles, copper powder particles, or ionic liquid. The specific selection of the conductive material can be adjusted according to the scene in which the diaphragm is needed to be used.

[0059] Optionally, the conductive material is at least one of a spherical shape, a flaky shape, and an irregular polygonal shape, and the maximum size of the conductive material is less than 40 μm.

[0060] Taking silver powder as an example, the shape of the silver powder is highly related to the preparation process thereof. The shapes of the silver powders prepared by different processes are different, but the conductive properties thereof are basically consistent. However, in order to reduce the contact resistance, silver powders of different shapes and sizes need to be used in a certain proportion to achieve the target resistance. The larger the size of the silver powder is, the lower the elongation at break of the conductive part 12 film layer prepared thereby is, and at the same time, the roughness of the surface thereof will be increased to a certain extent. Especially when the maximum size of the silver powder is greater than 40 μm, the surface roughness of the conductive part 12 film layer prepared thereby is in the form of scales, and the elongation at break is greatly reduced. Therefore, the maximum size of the silver powder is less than or equal to 40 μm, and is preferably less than or equal to 20 μm. It can be understood that the maximum size of the silver powder is the maximum size of the geometric shape of the silver powder. For example, when the silver powder is a cuboid, the maximum size is the size of the longest, widest, or highest dimension of the silver powder. For another example, when the silver powder is spherical, the maximum size is the outer diameter of the silver powder.

[0061] In Table 2, the influence of the size of the silver powder on the elongation at break of the conductive part 12 film layer is shown at the same mass fraction of the silver powder. As can be seen from Table 2, when the maximum size of the silver powder is less than 10 μm, the elongation at break of the conductive part 12 film layer is basically unchanged as the size of the silver powder increases. However, when the maximum size of the silver powder is greater than 10 μm, the elongation at break of the conductive part 12 gradually decreases as the size of the silver powder increases.

[0062] Table 2 Relationship between the size of the silver powder in the conductive part and the elongation at break of the conductive part

[0063] Silver powder maximum size / pm 0.2 0.6 1.2 10 21 40 50 Elongation at break / % 138 125 119 92 64 42 28

[0064] Therefore, according to the diaphragm 10 of the embodiments of the present application, by controlling the maximum size of the silver powder particles in the conductive part 12, the elongation at break of the conductive part 12 can be effectively controlled, so as to further ensure the mechanical strength of the diaphragm 10.

[0065] According to some embodiments of the present application, the mass percentage of the conductive material in the total mass of the conductive part 12 is 70 wt% to 95 wt%. Optionally, the conductive material includes spherical conductive material and flaky conductive material, and the mass percentage of the spherical conductive material in the total mass of the conductive material is less than 13%.

[0066] In other words, the metal conductive material in the conductive part 12 can be spherical or flaky, or a mixture thereof, or used alone. For example, when the silver powder accounts for 80% of the conductive part 12, that is, 80 parts of the conductive material is added to the matrix, when only spherical conductive material is used, the resistance value of the conductive part 12 is 0.65Ω, and the tensile strength is 0.12MPa; when only flaky conductive material is used, the resistance value of the conductive part 12 is 0.20Ω, and the tensile strength is 0.75MPa; when 10 parts of spherical conductive material and 70 parts of flaky conductive material are used, the resistance value of the conductive part 12 is 0.15Ω, and the tensile strength is 0.60MPa. It can be seen that when the conductive material is a mixture of flaky and spherical materials, the overall use effect of the conductive part 12 is better.

[0067] For example, when the conductive material is silver powder, Table 3 shows the effect of the shape of the silver powder on the tensile strength and resistance value of the conductive part 12 when the total amount of silver powder is 80 parts. As can be seen from Table 3, as the content of spherical silver increases, the elongation at break of the conductive part 12 decreases significantly, and the resistance of the conductive part 12 first decreases and then increases.

[0068] Table 3 Effect of the shape of the silver powder in the conductive part on the performance of the conductive part

[0069]

[0070]

[0071] It can be seen that as the content of spherical silver powder increases, the tensile strength of the conductive part 12 gradually decreases, and when the content of spherical silver powder is greater than 10 parts, the tensile strength of the conductive part 12 decreases significantly. In summary, it is preferred that the content of spherical silver powder in the conductive material be less than 10 parts, that is, the mass percentage of spherical conductive material in the total mass of the conductive material be less than 13%, so that the overall performance of the conductive part 12 is better.

[0072] Therefore, by controlling the shape of the metal particles in the conductive material, the tensile strength and resistance value of the conductive part 12 can be further ensured, thereby ensuring the overall performance of the diaphragm 10.

[0073] Optionally, according to an embodiment of the present application, the crosslinking agent is one of a de-alcohol type crosslinking agent, a de-ketoxime type crosslinking agent, a de-acetone type crosslinking agent, and a de-acid type crosslinking agent.

[0074] Specifically, the cross-linking agent can be a de-alcohol cross-linking agent, such as methyl trimethoxysilane, methyl triethoxysilane, etc. The cross-linking agent can also be a de-ketoxime cross-linking agent, such as methyl tributyloxime silane. The cross-linking agent can also be a de-acetone cross-linking agent, such as methyl triisopropenyl silane, phenyl triisopropenyl silane. Alternatively, the cross-linking agent can also be a de-amide cross-linking agent, such as methyl tri(N-methylacetamido)silane. The cross-linking agent can also be a de-acid cross-linking agent, such as methyl triacetyl siloxane. Since the de-alcohol and de-ketoxime cross-linking agents produce alcohol and ketoxime odor after condensation curing, which has low corrosivity and is more suitable for popularization and use, in the present application, the de-alcohol and de-ketoxime cross-linking agents are preferred.

[0075] In some embodiments of the present application, the cross-linking reaction of the α,ω-dihydroxyl polysiloxane and the cross-linking agent is carried out in the presence of a catalyst, which is at least one of an organic tin carboxylate and its chelate, an organic bismuth carboxylate and its chelate, a titanate and its chelate. The catalyst enables the cross-linking reaction to be carried out at room temperature, and without the catalyst, the cross-linking reaction needs to be heated to above 120°C. The catalyst plays a role in adhesion and mechanical effect of the conductive film layer. Thus, by adding the catalyst, the preparation conditions of the diaphragm can be simplified, the preparation cost can be reduced, and the preparation efficiency can be improved.

[0076] Alternatively, the substrate further comprises an antioxidant, which is one of antioxidant 168, antioxidant 245, antioxidant 1010, antioxidant 1098, and antioxidant 1024. The antioxidant can capture and neutralize free radicals generated during the oxidation of the polymer, prevent or interrupt the chain reaction, and delay / prevent oxidative degradation, thereby improving the aging resistance.

[0077] When the conductive part 12 is in a large amplitude state of vibration, the material generates a large strain, and there is a risk of film folding, film cracking, or film breaking after a long time of vibration. According to some embodiments of the present application, the elongation at break of the conductive part 12 is greater than or equal to 40%. At this time, the conductive part 12 has good flexibility and can satisfy the vibration with the vibration of the conductive diaphragm 10 and will not have the problem of vibration fracture. The better the flexibility of the material, the greater the elongation at break, and the stronger the ability of the conductive part 12 to resist damage.

[0078] As shown in FIG. 1, according to some embodiments of the present application, the conductive part 12 is disposed on one side surface of the main body part 11. Figure 2

[0079] In some embodiments of the present application, the conductive part 12 is coated or bonded on one side surface of the main body part 11; or, the main body part 11 and the conductive part 12 are integrally injection molded.

[0080] ​That is, the conductive part 12 according to the embodiment of the present application can be a film layer structure arranged on one side surface of the main part 11, and the conductive part 12 can be arranged on the main part 11 by coating or bonding, or can be integrally formed with the main part 11 by integral molding. Thus, the diaphragm 10 according to the embodiment of the present application is simple in structure, easy to manufacture, and can facilitate the electrical connection of the conductive part 12 with the voice coil 20 of the sound generating device or an external circuit.

[0081] Optionally, in some embodiments of the present application, a part of the conductive part 12 is embedded in the main part 11.

[0082] In other words, as shown in FIG. 1, Figure 3 the conductive part 12 according to the embodiment of the present application can also be embedded in the main part 11, that is, the main part 11 can be provided with a recess, a part of the conductive part 12 is arranged in the recess of the main part 11, and the other part of the conductive part 12 is exposed on the surface of the main part 11, and the outer surface of the conductive part 12 can be flush with the outer surface of the main part 11. Thus, the diaphragm 10 of this structure can effectively ensure the assembly stability of the conductive part 12 on the main part 11, and the embedding of the conductive part 12 in the main part 11 can reduce the thickness of the diaphragm 10 to some extent, and increase the design space of the product. In addition, the embedding of the conductive part 12 in the main part 11 can improve the vibration consistency of the conductive part 12 and the main part 11, and improve the sound generating effect of the diaphragm 10.

[0083] According to some embodiments of the present application, the linear resistance value of the conductive part 12 is less than or equal to 0.2 Ω / mm.

[0084] It can be understood that, as shown in FIG. 1, Figure 4 Figure 4 As shown in the 3mm*3mm square test diagonal, according to the test, it can be found that the greater the resistance value of the conductive part 12, the more the power consumed by the film layer of the conductive part 12, and the smaller the amplitude of the diaphragm 10 and the lower the acoustic performance under the same voltage. Thus, by controlling the linear resistance value of the conductive part 12 to be less than 0.2 Ω / mm, the diaphragm 10 according to the embodiment of the present application can effectively increase the amplitude of the diaphragm 10 and improve the acoustic performance of the diaphragm 10.

[0085] In some embodiments of the present application, the thickness of the diaphragm 10 is 30 μm to 200 μm, and the thickness of the conductive part 12 is 5 μm to 150 μm.

[0086] ​It should be noted that when the thickness of the conductive part 12 of the diaphragm 10 is low, for example, less than 5 μm, the conductive part 12 has poor conductivity and the resistance is too high to meet the product use requirements. When the thickness of the conductive part 12 is high, for example, greater than 200 μm, the vibration space of the conductive part 12 is reduced, the amplitude of the loudspeaker diaphragm 10 prepared thereby is reduced, and the acoustic performance is reduced.

[0087] Therefore, according to the diaphragm 10 of the embodiment of the present application, by controlling the thickness of the conductive part 12 to be between 5 μm and 150 μm, for example, 5 μm, 10 μm, 15 μm, 50 μm, 100 μm, 150 μm, etc., and by controlling the thickness of the diaphragm 10 to be between 30 μm and 200 μm, for example, 30 μm, 40 μm, 50 μm, 100 μm, 150 μm, 200 μm, etc., the resistance requirement of the diaphragm 10 is met, and the amplitude and acoustic performance of the diaphragm 10 are ensured.

[0088] The diaphragm 10 provided by the present application can be used to form a sound generating device of any structure. Figure 5 As shown in the sound generating device according to the embodiment of the present application, the sound generating device includes a shell, a magnetic circuit system arranged in the shell, and a vibration system cooperating with the magnetic circuit system. The vibration system includes a diaphragm 10 and a voice coil 20 combined with one side of the diaphragm 10. The magnetic circuit system drives the voice coil 20 to vibrate to drive the diaphragm 10 to generate sound. The diaphragm 10 is the diaphragm 10 of the above-mentioned embodiment. Specifically, when the sound generating device is working, the voice coil 20 is energized and vibrates up and down under the action of the magnetic field force of the magnetic circuit system to drive the diaphragm 10 to vibrate, and the diaphragm 10 can generate sound when it vibrates. The sound generating device includes a diaphragm 10 prepared by the above-mentioned embodiment of the present application, and the diaphragm 10 can be composed of a main body part 11 and a conductive part 12.

[0089] In another specific embodiment of the present application, as shown in Figure 6 The sound generating device according to the embodiment of the present application includes a shell, a magnetic circuit system arranged in the shell, and a vibration system. The vibration system includes a voice coil 20, a first diaphragm 21, and a second diaphragm 22. The top of the voice coil 20 is connected to the first diaphragm 21. The magnetic circuit system drives the voice coil 20 to vibrate to drive the first diaphragm 21 to generate sound. The second diaphragm 22 has two ends connected to an external circuit and the bottom of the voice coil 20, respectively. The second diaphragm 22 is the diaphragm of the above-mentioned embodiment.

[0090] That is, the sound production device according to the embodiment of the present application can further include two diaphragms prepared according to the above-mentioned embodiments of the present application, i.e., the first diaphragm 21 and the second diaphragm 22, the first diaphragm 21 can be used for sound production by vibration, and the second diaphragm 22 can be used for balancing the vibration of the voice coil 20. Specifically, when the sound production device is in operation, the voice coil 20 is energized and vibrates up and down under the action of the magnetic force of the magnetic circuit system, so as to drive the first diaphragm 21 to vibrate, and the first diaphragm 21 can produce sound when it vibrates. The second diaphragm 22 can also vibrate up and down with the voice coil 20. Since the two ends of the second diaphragm 22 are connected to the external circuit and the bottom of the voice coil 20 respectively, the second diaphragm 22 can balance the vibration of the voice coil 20, and can prevent the voice coil 20 from deviating, so as to improve the sound production effect of the sound production device.

[0091] It should be noted that the first diaphragm 21 and the second diaphragm 22 can both use the diaphragm 10 according to the above-mentioned embodiments of the present application, or one of the first diaphragm 21 and the second diaphragm 22 can use the diaphragm 10 according to the above-mentioned embodiments of the present application, and the present application does not make specific limitations in this regard.

[0092] The electronic device according to the embodiment of the present application includes the sound production device according to the above-mentioned embodiments, and the sound production device uses the diaphragm according to the above-mentioned embodiments of the present application. Since the diaphragm according to the above-mentioned embodiments of the present application has the above-mentioned technical effects, the electronic device according to the embodiment of the present application also has corresponding technical effects, i.e., the conductive part 12 film layer will not have the non-solidification phenomenon of the platinum system, and will not have the platinum catalytic failure phenomenon, and the carboxylic acid group has high temperature resistance, so that the diaphragm 10 not only has excellent temperature resistance, but also has high stability.

[0093] The diaphragm 10 of the present application will be described below in conjunction with specific embodiments.

[0094] Embodiment One

[0095] 65 parts of silver powder, 10 parts of copper powder, 15 parts of ionic liquid, 8.5 parts of main body resin with a viscosity of 10052 mPa.s, 0.8 parts of antioxidant 1010, 0.1 parts of fluorescent agent OB, 0.5 parts of crosslinking agent methyl trimethoxysilane, and 0.1 parts of stannous octoate were weighed by parts by weight to prepare a conductive film layer glue.

[0096] The product was filled into a rubber tube and sprayed on the surface of the diaphragm to test the resistance value and aging resistance thereof.

[0097] The resistance value of the prepared conductive part 12 was 0.10Ω, and the elongation at break was 45%, which had a relatively low resistance value and a certain elongation at break, and the elongation at break was still maintained at 42% after heat aging in an oven at 180℃ for 168h.

[0098] Embodiment Two

[0099] Take 60 parts of silver powder, 3 parts of copper powder, 17 parts of ionic liquid, 18 parts of main body resin with viscosity 10052 mPa.s, 0.8 parts of antioxidant 1010, 0.1 parts of fluorescent agent OB, 1 parts of crosslinking agent methyl tri-butyl ketone oxime silane, 0.1 parts of organic bismuth catalyst to prepare conductive film layer glue.

[0100] The product is filled into the rubber tube and sprayed on the diaphragm surface to test the resistance value and aging resistance.

[0101] The resistance value of the prepared conductive part 12 is 0.15Ω, and the elongation at break is 85%, which has a lower resistance value and a certain elongation at break, and the elongation at break still remains at 80% after heat aging in the oven at 180℃ for 168h.

[0102] Example three

[0103] Take 70 parts of silver powder, 27 parts of main body resin with viscosity 10052 mPa.s, 0.8 parts of antioxidant 1010, 0.1 parts of fluorescent agent OB, 2 parts of crosslinking agent phenyl tri-isopropyl acryloxy silane, 0.1 parts of organic titanium titanium chelate to prepare conductive film layer glue.

[0104] The product is filled into the rubber tube and sprayed on the diaphragm surface to test the resistance value and aging resistance.

[0105] The resistance value of the prepared conductive part 12 is 0.21Ω, and the elongation at break is 156%, which has a lower resistance value and a certain elongation at break, and the elongation at break still remains at 148% after heat aging in the oven at 180℃ for 168h.

[0106] Example four

[0107] Take 85 parts of silver powder, 5 parts of ionic liquid, 8.5 parts of main body resin with viscosity 10052 mPa.s, 0.8 parts of antioxidant 1010, 0.1 parts of fluorescent agent OB, 0.5 parts of crosslinking agent methyl trimethoxysilane, 0.1 parts of stannous octoate to prepare conductive film layer glue.

[0108] The product is filled into the rubber tube and sprayed on the diaphragm surface to test the resistance value and aging resistance.

[0109] The resistance value of the prepared conductive part 12 is 0.11Ω, and the elongation at break is 43%, which has a lower resistance value and a certain elongation at break, and the elongation at break still remains at 40% after heat aging in the oven at 180℃ for 168h.

[0110] Example five

[0111] Take 85 parts of silver powder, 5 parts of ionic liquid, 8.5 parts of main body resin viscosity 55010 mPa.s, 0.8 parts of antioxidant 1010, 0.1 parts of fluorescent agent OB, 0.5 parts of crosslinking agent methyl trimethoxysilane, 0.1 parts of stannous octoate to prepare conductive film layer glue.

[0112] The product is filled into the rubber tube and sprayed on the surface of the diaphragm to test its resistance value and aging resistance.

[0113] The resistance value of the prepared conductive part 12 is 0.11Ω, and the elongation at break is 57%, which has a lower resistance value and a certain elongation at break, and the elongation at break still remains at 52% after heat aging in the oven at 180℃ for 168h.

[0114] Example six

[0115] Take 85 parts of silver powder, 5 parts of ionic liquid, 8.5 parts of main body resin viscosity 55010 mPa.s, 0.8 parts of antioxidant 1010, 0.1 parts of fluorescent agent OB, 0.5 parts of crosslinking agent methyl trimethoxysilane, 0.1 parts of stannous octoate to prepare conductive film layer glue.

[0116] The product is filled into the rubber tube and sprayed on the surface of the diaphragm to test its resistance value and aging resistance.

[0117] The resistance value of the prepared conductive part 12 is 0.11Ω, and the elongation at break is 57%, which has a lower resistance value and a certain elongation at break, and the elongation at break still remains at 52% after heat aging in the oven at 180℃ for 168h.

[0118] According to the above examples four to six, it can be seen that with the increase of resin viscosity, the elongation at break of the conductive part 12 increases, the resistance value of the conductive material is the same, but with the increase of resin viscosity, the preparation of the conductive part 12 is difficult.

[0119] Comparative example

[0120] In comparative example one, take 20 parts of single component epoxy adhesive and add 80 parts of silver powder, mix uniformly. The mixed product is filled into the rubber tube and sprayed on the surface of the diaphragm to test its resistance value and aging resistance. Test its resistance value, tensile strength, elongation at break, and the change rate of tensile strength and elongation at break after heat aging in the oven at 180℃ for 168h.

[0121] In comparative example two, take 20 parts of conventional solvent-based polyurethane adhesive and add 80 parts of silver powder, mix uniformly. The mixed product is filled into the rubber tube and sprayed on the surface of the diaphragm to test its resistance value and aging resistance. Test its resistance value, tensile strength, elongation at break, and the change rate of tensile strength and elongation at break after heat aging in the oven at 180℃ for 168h.

[0122] The diaphragm 10 prepared from the examples and comparative examples was subjected to various tests such as resistivity, tensile strength, elongation at break, aging test, etc. under the same conditions, and the test parameters obtained are shown in Table 4.

[0123] Table 4 Comparison of test parameters of examples and comparative examples

[0124]

[0125]

[0126] As can be seen from Table 4, the diaphragm 10 prepared from the solvent-based polyurethane adhesive of Comparative Example 2 has a significant decrease in tensile strength and elongation at break after high-temperature aging, and cannot be used under high-temperature conditions. The diaphragm 10 prepared from the epoxy adhesive of Comparative Example 1 has a relatively small decrease in tensile strength and elongation at break after high-temperature aging, but has a low elongation at break, and is prone to brittle fracture under vibration and tensile conditions, and cannot be used in a diaphragm assembly. Only the diaphragm 10 containing the α,ω-dihydroxypolysiloxane adhesive as shown in Examples 1 to 6 can ensure a certain elongation at break > 40% after high-temperature aging, ensure a certain toughness, and have excellent high-temperature resistance, with a change rate of elongation at break of less than 20% after high-temperature aging at 180°C for 168 h.

[0127] Although some specific embodiments of the present application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the present application. Those skilled in the art should understand that the above examples can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A diaphragm for a sound-generating device, characterized in that: The diaphragm includes a main body and a conductive portion, the main body being made of one of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber, and hydrogenated nitrile rubber, the conductive portion being provided on the main body, at least a portion of which is exposed to be electrically connected to the voice coil of the sound-generating device and an external circuit; The conductive portion includes a matrix and a conductive material dispersed in the matrix. The matrix is ​​formed into a film layer prepared by a cross-linking reaction of α,ω-dihydroxy polysiloxane and a cross-linking agent. The change rate of elongation at break of the conductive portion after aging for 168 hours at 180°C is less than 20%. The molecular structure of the α,ω-dihydroxy polysiloxane is: Wherein, R is one of -CH3, -CH2CH3, -C6H5 and -CH2CH2CF3.

2. The diaphragm for a sound-generating device according to claim 1, characterized in that: The viscosity of the α,ω-dihydroxy polysiloxane is 10,000 mPa·s to 1,000,000 mPa·s.

3. The diaphragm for a sound-generating device according to claim 1, characterized in that: The percentage of the α,ω-dihydroxy polysiloxane in the total weight of the conductive portion is 3 wt % to 30 wt %, and the percentage of the cross-linking agent in the total weight of the conductive portion is 0.1 wt % to 10 wt %.

4. The diaphragm for a sound-generating device according to claim 1, characterized in that: The cross-linking agent is one of a dealcoholization type cross-linking agent, a deketoxime type cross-linking agent, a deacetone type cross-linking agent and a deacidification type cross-linking agent.

5. The diaphragm for a sound-generating device according to claim 1, characterized in that: The conductive material accounts for 70 wt % to 95 wt % of the total mass of the conductive part.

6. The diaphragm for a sound-generating device according to claim 1, characterized in that: The conductive material is at least one of silver powder particles, gold powder particles, nickel powder particles, aluminum powder particles, copper powder particles or ionic liquid.

7. The diaphragm for a sound-generating device according to claim 1, characterized in that: The conductive material is in the shape of at least one of a sphere, a sheet, and an irregular polygon, and the maximum size of the conductive material is less than 40 μm.

8. The diaphragm for a sound-generating device according to claim 7, characterized in that: The conductive material includes spherical conductive material and sheet-shaped conductive material, wherein the mass percentage of the spherical conductive material in the total mass of the conductive material is less than 13%.

9. The diaphragm for a sound-generating device according to claim 1, characterized in that: The α,ω-dihydroxy polysiloxane and the crosslinking agent undergo a crosslinking reaction under the action of a catalyst, and the catalyst is at least one of organic tin carboxylates and chelates thereof, organic bismuth carboxylates and chelates thereof, and titanates and chelates thereof.

10. The diaphragm for a sound-generating device according to claim 1, characterized in that: The matrix further includes an antioxidant, and the antioxidant is one of antioxidant 168, antioxidant 245, antioxidant 1010, antioxidant 1098, and antioxidant 1024.

11. The diaphragm for a sound-generating device according to claim 1, characterized in that: The linear resistance value of the conductive portion is less than or equal to 0.2Ω / mm.

12. The diaphragm for a sound-generating device according to claim 1, characterized in that: The thickness of the diaphragm is 30 μm to 200 μm, and the thickness of the conductive portion is 5 μm to 150 μm.

13. A sound-generating device, characterized in that: The invention comprises a diaphragm for a sound-emitting device according to any one of claims 1 to 12.

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