A heat dissipation module

Abstract

The application provides a heat dissipation module, relates to the technical field of electronic heat dissipation, and can effectively prevent liquid material metal from leaking out. The heat dissipation module comprises a heat dissipation device and a sealing frame. The bottom of the heat dissipation device comprises a contact area, and a groove is arranged around the edge of the contact area. A liquid metal layer is arranged on the contact area, and the liquid metal layer is used for filling air gaps between interfaces. At least one flow guide groove is arranged on the contact area, a first end of the flow guide groove is communicated with the groove, a second end of the flow guide groove extends to a central area of the contact area, and the flow guide groove is used for guiding liquid metal flowing into the groove in the liquid metal layer back to the contact area. The sealing frame is arranged in the groove, and the sealing frame is used for sealing the gap between the contact area and the heat dissipation element.

Description

Technical Field

[0001] This application relates to the field of electronic heat dissipation technology, and in particular to a heat dissipation module. Background Technology

[0002] In the process of electronic heat dissipation, the unevenness of the contact surface between the heat source and the heat sink will create a gap at the interface between the two solids. The thermal conductivity of the air in the gap is only 0.02 W / (m·K), which will greatly reduce the efficiency of heat transfer from the heat source to the heat sink. Therefore, in order to improve the efficiency of heat transfer from the heat source to the heat sink, liquid metal material is usually filled between the heat source and the heat sink for heat conduction.

[0003] However, during the operation of the heat source, the operating temperature of the heat source can easily exceed the phase transition point of the liquid metal material, which will lead to increased fluidity of the liquid metal material and leakage (external leakage refers to the phenomenon of liquid metal material flowing out between the heat source and the heat sink). This can cause short circuits in electronic components around the heat source. Therefore, how to prevent leakage of liquid metal material has become an urgent problem to be solved in the field of electronic heat dissipation technology. Summary of the Invention

[0004] This application provides a heat dissipation module that can effectively prevent the leakage of liquid metal materials.

[0005] To achieve the above objectives, in a first aspect, this application provides a heat dissipation module, including a heat sink and a sealing frame; the bottom of the heat sink includes a contact area, and a groove is provided around the edge of the contact area; a liquid metal layer is provided on the contact area, the liquid metal layer being used to fill the air gap between the interfaces; at least one flow channel is provided on the contact area, the first end of the flow channel communicating with the groove, and the second end of the flow channel extending towards the center region of the contact area, the flow channel being used to guide the liquid metal flowing into the groove from the liquid metal layer back to the contact area; the sealing frame is disposed in the groove, the sealing frame being used to seal the gap between the contact area and the heat dissipation element.

[0006] In one possible design, the depth of the guide channel gradually increases from the second end to the first end.

[0007] In one possible design approach, the shape of the contact area matches the shape of the heat dissipation element.

[0008] In one possible design approach, the contact area is polygonal in shape, with the first end located at one of the apex corners of the polygon.

[0009] In one possible design approach, each vertex of the polygon is provided with a corresponding flow channel.

[0010] In one possible design, the sealing frame includes an inner frame and an outer frame. The inner frame has a capillary structure and is fitted around the periphery of the contact area. The inner frame is used to absorb liquid metal flowing into the groove. The outer frame is fitted around the periphery of the inner frame and is used to seal the gap between the contact area and the heat dissipation element.

[0011] In one possible design, the height of the inner frame is the same as the depth of the groove.

[0012] In one possible design, the height of the outer frame is higher than a first height and lower than a second height, where the first height is the sum of the depth of the groove and the thickness of the liquid metal layer, and the second height is the sum of the depth of the groove, the thickness of the liquid metal layer, and the thickness of the heat dissipation element.

[0013] In one possible design approach, the outer frame is made of a high-temperature resistant sealing material.

[0014] In one possible design approach, the liquid metal is one or more of gallium-based alloys, bismuth-based alloys, and their derivative metallic materials.

[0015] The heat dissipation module provided in this application embodiment has grooves surrounding the edge of the contact area at the bottom of the heat sink. Therefore, when the operating temperature of the heat dissipation element exceeds the melting point of the liquid metal, and the fluidity of the liquid metal increases, the more fluid liquid metal will flow into the grooves. The sealing frame within the grooves will enclose the liquid metal, thus preventing leakage and ensuring the normal operation of the electronic device. Furthermore, at least one flow channel is provided on the contact area at the bottom of the heat sink. This flow channel can guide the liquid metal enclosed in the grooves back to the contact area, ensuring that the efficiency of heat transfer from the heat dissipation element to the heat sink is not significantly reduced. Attached Figure Description

[0016] Figure 1 A schematic diagram of the contact surface between the heat sink and the heat dissipation element provided in the embodiments of this application;

[0017] Figure 2 This is an exploded view of a heat dissipation module provided in an embodiment of this application;

[0018] Figure 3 A planar schematic diagram of the contact area at the bottom of the heat sink provided in the embodiments of this application. Figure 1 ;

[0019] Figure 4 A planar schematic diagram of the contact area at the bottom of the heat sink provided in the embodiments of this application. Figure 2

[0020] Figure 5 A planar schematic diagram of the contact area at the bottom of the heat sink provided in the embodiments of this application. Figure 3 ;

[0021] Figure 6 A planar schematic diagram of the contact area at the bottom of the heat sink provided in the embodiments of this application. Figure 4 ;

[0022] Figure 7 A planar schematic diagram of the contact area at the bottom of the heat sink provided in the embodiments of this application. Figure 5 ;

[0023] Figure 8 A partial cross-sectional view of a heat dissipation module provided in an embodiment of this application;

[0024] Figure 9 This is an overall side view of a heat dissipation module and heat dissipation element provided in an embodiment of this application;

[0025] Figure 10 This is a schematic diagram of the overall structure of a heat dissipation module and heat dissipation element provided in an embodiment of this application.

[0026] The following are the labeling elements in the figure:

[0027] 1-Radiator: 10-Contact area; 101-Coating area; 102-Groove; 103-Flow channel;

[0028] 103-Guide channel: 103a-First end of guide channel 103; 103b-Second end of guide channel 103;

[0029] 2-Sealed frame: 201-Inner frame; 202-Outer frame;

[0030] 3-Liquid metal layer;

[0031] 4-Heat dissipation components. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Throughout the description, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0033] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] In the description of this application, it should be understood that the terms "upper", "lower", "side", "front", "rear", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0037] In electronic devices, the core processing units (such as CPUs and chips) on the circuit board typically experience a continuous rise in temperature during operation. When these core processing units operate at high temperatures for extended periods, their performance can be compromised. Therefore, heat sinks are often installed on the surface of these core processing units. The heat sink is usually in close contact with the surface of the core processing unit. When the core processing unit generates heat, the heat is first transferred to the heat sink, which then transfers the heat to the surrounding air, thus helping to lower the temperature of the core processing unit and ensure the normal operation of the electronic device.

[0038] like Figure 1As shown, the contact surface between the core processing unit and the heat sink is uneven, creating a gap between them. The thermal conductivity of air within this gap is only 0.02 W / (m·K), significantly reducing the efficiency of heat transfer from the core processing unit to the heat sink. Therefore, to improve this efficiency, liquid metal is typically filled between the heat sink and the core processing unit for heat conduction. However, during operation, the core processing unit's operating temperature can easily exceed the phase transition point of the liquid metal, leading to increased fluidity and leakage (liquid metal flowing out of the space between the core processing unit and the heat sink). This leakage can cause short circuits in the electronic components surrounding the core processing unit.

[0039] To address the aforementioned issues, this application provides a heat dissipation module that effectively prevents liquid metal leakage. The heat dissipation module provided in this application will be described exemplarily below with reference to the accompanying drawings.

[0040] For example, such as Figure 2 The diagram shown is an exploded view of a heat dissipation module provided in an embodiment of this application, including: a heat sink 1 and a sealing frame 2. The bottom of the heat sink 1 may include a contact area 10, on which a liquid metal layer 3 may be disposed. The liquid metal layer 3 can be used to fill the air gap between interfaces and improve the interface heat transfer performance. A groove 102 may be disposed around the edge of the contact area 10. The groove 102 can be used to receive liquid metal flowing out from the liquid metal layer 3. At least one guide groove 103 may be formed on the contact area 10. The first end 103a of the guide groove 103 can communicate with the groove 102, and the second end 103b of the guide groove 103 can extend towards the center area of ​​the contact area 10. The guide groove 103 can be used to guide the liquid metal flowing into the groove from the liquid metal layer 3 back to the contact area 10. The sealing frame 2 may be disposed in the groove 102. The sealing frame 2 is used to seal the gap between the contact area 10 and the heat dissipation element 4.

[0041] Optionally, the heat dissipation element 4 can be a core processing unit on the circuit board of an electronic device, such as a CPU, chip, or other electronic components. The embodiments of this application do not limit this.

[0042] The heat dissipation module provided in this application embodiment has a groove 102 surrounding the edge of the contact area 10 at the bottom of the heat sink 1. When the operating temperature of the heat dissipation element 4 exceeds the phase transition point of the liquid metal, and the fluidity of the liquid metal increases, the highly fluid liquid metal will flow into the groove 102. The sealing frame 2 provided in the groove 102 will seal the liquid metal within the groove 102, thereby preventing the liquid metal from leaking out and affecting the normal operation of the electronic device. In addition, at least one guide groove 103 is provided on the contact area 10 at the bottom of the heat sink 1. The guide groove 103 can guide the liquid metal sealed in the groove back to the contact area to ensure that the efficiency of heat dissipation element 4 in transferring heat to heat sink 1 is not significantly reduced.

[0043] Optionally, one or more flow channels 103 may be provided on the contact area 10, and the embodiments of this application do not limit this.

[0044] For example, such as Figure 3 The image shown is a planar schematic diagram of the contact area 10 at the bottom of the heat sink 1 provided in this embodiment of the application. Figure 3 As shown, four guide grooves 103 can be set on the contact area 10.

[0045] By setting multiple guide channels 103, the liquid metal flowing from the liquid metal layer 3 into the groove 102 can flow back to the contact area 10 in different directions through the guide channels 103, so that the liquid metal on the contact area 10 can be evenly distributed.

[0046] In one example, the shape of the contact area 10 can be matched with the shape of the heat dissipation element 4.

[0047] For example, such as Figure 3 As shown, when the heat dissipation element 4 is square, the contact area 10 can also be set to a square shape accordingly.

[0048] Optional, such as Figure 4 As shown, when the heat dissipation element 4 is rectangular, the contact area 10 can also be set to a rectangle accordingly.

[0049] Optional, such as Figure 5 As shown, when the heat dissipation element 4 is circular, the contact area 10 can also be set to be circular accordingly.

[0050] Of course, the shape of the contact area 10 may not match the shape of the heat dissipation element 4. For example, when the shape of the heat dissipation element 4 is square, the shape of the contact area 10 may be set to rectangle; when the shape of the heat dissipation element 4 is square, the shape of the contact area 10 may be set to circle. The embodiments of this application do not limit this.

[0051] In one example, the contact area 10 can be polygonal in shape, and the first end 103a of the guide groove 103 can be located at one of the apex corners of the polygon.

[0052] For example, the above Figure 3 The contact area 10 shown is square. The first end 103a of the guide groove 103 can be located at one of the top corners of the square, and the second end 103b of the guide groove 103 can point to the central area.

[0053] Optionally, the above Figure 4 The contact area 10 shown is rectangular. The first end 103a of the guide groove 103 can be located at one of the top corners of the rectangle, and the second end 103b of the guide groove 103 can point towards the central area.

[0054] Optionally, the above Figure 5 The contact area 10 shown is circular. The first end 103a of the guide groove 103 can be located at a segment of the circular arc, and the second end 103b of the guide groove 103 can point towards the central area.

[0055] In the embodiments of this application, the so-called central region can be understood as the coating area 101 of the liquid metal layer 3 when it leaves the factory.

[0056] In another example, the contact area 10 can be polygonal in shape, and the first end 103a of the guide channel 103 can be located on each side of the polygon.

[0057] For example, such as Figure 6 As shown, when the contact area 10 is square, the first end 103a of the guide groove 103 can be located at the center of each side of the square.

[0058] Optional, such as Figure 7 As shown, when the contact area 10 is rectangular, the first end 103a of the guide groove 103 can be located at the center of each side of the rectangle.

[0059] In this embodiment, the number of flow channels 103 can be set according to actual needs. For example, flow channels 103 can be provided at each vertices of the polygon to ensure that the liquid metal in the grooves in each direction can flow smoothly back to the central area. The number of flow channels 103 can also be set appropriately according to the size of the contact area 10. If the size of the contact area 10 is large, multiple flow channels 103 can be provided in each direction of the contact area 10. For example, the above... Figure 5The contact area 10 shown is circular. When the diameter of the circle is large, six guide grooves 103 can be provided on the contact area 10. In this case, the contact area 10 can be divided into six equal parts to facilitate the return of liquid metal to the central area. If the size of the contact area 10 is small, a few guide grooves 103 can be provided on the contact area 10 (for example, four guide grooves 103).

[0060] In one example, the depth of the guide groove 103 gradually increases along the direction from the second end 103b to the first end 103a.

[0061] For example, such as Figure 8 The image shown is a partial cross-sectional view of a heat dissipation module provided in an embodiment of this application. Figure 8 As shown, the depth of the guide groove 103 gradually increases along the direction from the second end 103b to the first end 103a, wherein liquid metal can be disposed on the coating area 101 to form a liquid metal layer 3.

[0062] For example, such as Figure 9 The image shown is a side view of a heat dissipation module provided in an embodiment of this application. The heat dissipation element 4 can extend into the outer frame 202 and fully contact the liquid metal layer 3. The heat dissipation element 4 can transfer heat to the heat sink 1 through the liquid metal layer 3.

[0063] It is understandable that by gradually increasing the depth of the guide channel 103 along the direction from the second end 103b to the first end 103a, the flow resistance of the liquid metal can be reduced, which is beneficial to accelerating the flow rate of the liquid metal back to the contact area 10.

[0064] In one example, such as Figure 2 As shown, the sealing frame 2 may include an inner frame 201 and an outer frame 202. The inner frame 201 may be a capillary structure and may be fitted around the periphery of the contact area 10 to absorb liquid metal flowing into the groove 102; the outer frame 202 may be fitted around the periphery of the inner frame 201 and may be used to seal the gap between the contact area 10 and the heat dissipation element 4.

[0065] By setting the inner frame 201 as a capillary structure, it can not only absorb the liquid metal flowing into the groove 102, but also accelerate the flow rate of the liquid metal flowing into the groove 102, so as to improve the efficiency of the return flow of the guide groove 103.

[0066] Optionally, the inner frame 201 can also be any other structure capable of efficiently absorbing liquids, such as fibrous structures, and the embodiments of this application are not limited in this regard.

[0067] Optionally, the outer frame 202 can be any high-temperature resistant sealing material, such as silicone, fluoropolymer, etc., and the embodiments of this application do not limit this.

[0068] In one example, such as Figure 9 As shown, the height of the inner frame 201 can be the same as the depth of the groove 102, so that the capillary structure can absorb the liquid metal flowing into the groove 102 in a timely manner.

[0069] Optional, such as Figure 9 As shown, the height of the outer frame 202 can be higher than the first height and lower than the second height. The first height can be the sum of the depth of the groove 102 and the thickness of the liquid metal layer 3, and the second height can be the sum of the depth of the groove 102, the thickness of the liquid metal layer 3, and the thickness of the heat dissipation element 4.

[0070] By setting the height of the outer frame 202, on the one hand, it is convenient to fix the heat dissipation element 4 on the liquid metal layer 3, and on the other hand, it can be ensured that the height of the outer frame 202 will not affect the connection between the heat dissipation element 4 and other components.

[0071] Optionally, the liquid metal may be one or more of gallium-based alloys, bismuth-based alloys, and their derivative metal materials, and the embodiments of this application do not limit this.

[0072] In one example, such as Figure 10 The diagram shown is a schematic representation of the overall structure of a heat dissipation module and heat dissipation element 4 provided in an embodiment of this application. Figure 10 It can be seen that the height of the outer frame 202 is lower than the sum of the depth of the groove 102, the thickness of the liquid metal layer 3, and the thickness of the heat dissipation element 4. Therefore, the height of the outer frame 202 will not affect the connection between the heat dissipation element 4 and other components.

[0073] In summary, the heat dissipation module provided in this application embodiment has a groove 102 surrounding the edge of the contact area 10 at the bottom of the heat sink 4. Therefore, when the operating temperature of the heat dissipation element 4 exceeds the melting point of the liquid metal, and the fluidity of the liquid metal increases, the highly fluid liquid metal will flow into the groove 102. The sealing frame 2 provided in the groove 102 will seal the liquid metal within the groove 102, thereby preventing the liquid metal from leaking out and affecting the normal operation of the electronic device. In addition, at least one guide groove 103 is provided on the contact area 10 at the bottom of the heat sink 1. The guide groove 103 can guide the liquid metal sealed in the groove 102 back to the contact area 10, so as to ensure that the efficiency of heat dissipation element 4 in transferring heat to heat sink 1 is not significantly reduced.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation module, characterized in that, The heat sink and the sealing frame are included; The bottom of the heat sink includes a contact area, and the edge of the contact area is provided with a groove; A liquid metal layer is arranged on the contact area, which is used to fill the air gap between the heat sink and the heat dissipation element, and the heat dissipation element transmits heat to the heat sink through the liquid metal layer; the groove is used to receive the liquid metal flowing out of the liquid metal layer; At least one flow guide groove is arranged on the contact area, the first end of the flow guide groove is in communication with the groove, and the second end of the flow guide groove extends to the central area of the contact area, the flow guide groove is used to guide the liquid metal flowing into the groove in the liquid metal layer back to the contact area; the depth of the flow guide groove gradually increases along the direction from the second end to the first end; The sealing frame is arranged in the groove, and the sealing frame is used to seal the gap between the contact area and the heat dissipation element; The shape of the contact area matches the shape of the heat dissipation element.

2. The heat dissipation module of claim 1, wherein, The shape of the contact area is a polygon, and the first end is located at one of the top corners of the polygon.

3. The heat dissipation module of claim 2, wherein, Each of the top corners of the polygon is provided with a corresponding flow guide groove.

4. The heat dissipating module according to any one of claims 1-3, wherein, The sealing frame includes an inner frame and an outer frame, the inner frame is a capillary structure, the inner frame is sleeved on the periphery of the contact area, the inner frame is used to absorb the liquid metal flowing into the groove, and the outer frame is sleeved on the periphery of the inner frame, the outer frame is used to seal the gap between the contact area and the heat dissipation element.

5. The heat dissipation module of claim 4, wherein, The height of the inner frame is the same as the depth of the groove.

6. The heat dissipation module of claim 4, wherein, The height of the outer frame is higher than the first height and lower than the second height, the first height is the sum of the depth of the groove and the thickness of the liquid metal layer, and the second height is the sum of the depth of the groove, the thickness of the liquid metal layer and the thickness of the heat dissipation element.

7. The heat dissipation module of claim 4, wherein, The outer frame is a high-temperature-resistant sealing material.

8. The heat dissipation module of claim 1, wherein, The liquid metal is one or more of gallium-based alloy, bismuth-based alloy and derivative metal materials thereof.

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