Heat dissipation structure and electronic equipment

Abstract

The embodiments of the present application provide a heat dissipation structure and an electronic device, which relate to the field of heat dissipation technology and are used to solve the problem of severe local heating of electronic devices in related technologies. Among them, the heat dissipation structure includes a first cover plate, a second cover plate and a liquid absorption structure. The first cover plate and the second cover plate are interconnected to enclose a accommodating cavity. The liquid absorption structure is located in the accommodating cavity. The first cover plate includes a first sealing layer, a first material layer and a second sealing layer; the first material layer is located between the first sealing layer and the second sealing layer; the first cover plate has a plurality of buffer grooves arranged at intervals, and the positions corresponding to the buffer grooves in the first material layer include elastic deformation. The heat dissipation structure can be applied to electronic devices to improve the problem of severe local heating of electronic devices and protect the screen.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of heat dissipation technology, and in particular to a heat dissipation structure and an electronic device. Background Art

[0002] Electronic devices such as mobile phones, tablets, and notebooks generate heat when they are working. If this heat is not dissipated in time and accumulates in a local area of ​​the electronic device, it will cause the temperature of the local area of ​​the electronic device to rise, thereby affecting the performance and user experience of the electronic device. In severe cases, it will cause the electronic device to malfunction and be damaged. Therefore, it is necessary to provide a heat dissipation solution to solve the heat dissipation problem of electronic devices. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a heat dissipation structure and an electronic device, which are used to solve the problem of serious local heating of electronic devices in the related art.

[0004] In order to achieve the above purpose, the present application provides the following solutions:

[0005] On the one hand, a heat dissipation structure is provided, comprising a first cover plate, a second cover plate and a liquid absorption structure. The first cover plate and the second cover plate are interconnected to enclose a receiving cavity. The liquid absorption structure is located in the receiving cavity. The heat dissipation structure has a first area and a second area; the liquid absorption structure extends from the first area to the second area. The receiving cavity also has a steam channel, which extends from the second area to the first area. The first cover plate comprises a first sealing layer, a first material layer and a second sealing layer; the first material layer is located between the first sealing layer and the second sealing layer; the first cover plate has a plurality of buffer grooves arranged at intervals, and the positions of the first material layer corresponding to the buffer grooves include elastic deformation.

[0006] In the heat dissipation structure provided in the embodiment of the present application, the heat of the heating device can be dissipated in time, so that the electronic device is not prone to serious local heating problems, and the performance degradation and life shortening of each device in the area caused by overheating in the local area, as well as screen burns and display effects can be improved. In addition, since there are multiple buffer grooves on the first cover plate, and the multiple buffer grooves are arranged at intervals, the first cover plate has a good buffering and supporting effect. Since the first cover plate includes a first sealing layer, a first material layer and a second sealing layer, the first material layer is sandwiched between the first sealing layer and the second sealing layer, and the position of the buffer groove in the first material layer includes elastic deformation, the buffer groove of the first cover plate has better stress absorption and release capabilities, thereby further improving the compressive deformation and recovery capabilities of the first cover plate. Exemplarily, when the heat dissipation structure is applied to the aforementioned electronic device, for example, when the heat dissipation structure is squeezed by the aforementioned screen, since the first cover plate has excellent buffering and supporting effects, the buffer groove has better stress absorption and release capabilities, so that the first cover plate has better flexibility, and since the first material layer bound by the first sealing layer and the second sealing layer will not have excessive rebound force, that is, the screen will not have light and shadow, black spots, stencils, bright spots, green lines, fragmentation and other failure problems due to the excessive rebound force of the first cover plate.

[0007] In addition, since the first material layer has a first sealing layer and a second sealing layer on opposite sides, on the one hand, the first material layer can be well sealed and protected, thereby increasing the life of the first cover plate and enhancing the reliability of the first cover plate; on the other hand, since a relatively symmetrical structure can be formed, the flatness of the first cover plate can be better. For example, since the mechanical material parameters such as the modulus of the material in the thickness direction of the first cover plate are more symmetrical, the first cover plate is not prone to curling. In addition, the unit weight of the first material layer can be less than the unit weight of the first sealing layer, and can be less than the unit weight of the second sealing layer. Compared with the first cover plate of the same thickness and without the first material layer, the total weight of the first cover plate can be reduced to achieve a lightweight design.

[0008] In some embodiments, the yield point strain of the first material layer is greater than the yield point strain of the first sealing layer, and greater than the yield point strain of the second sealing layer; the position of the first sealing layer and the second sealing layer corresponding to the buffer groove includes plastic deformation. Among them, the plastically deformed first sealing layer and the second sealing layer can constrain the shape of the first material layer. In this case, the buffer groove can be made by compression molding. Such a setting is also conducive to simplifying the process and reducing production costs.

[0009] In some embodiments, at least a portion of the top openings of the buffer grooves face the side of the first cover plate away from the second cover plate. This arrangement is conducive to improving the buffer support effect of the first cover plate.

[0010] In some embodiments, the shape of any buffer groove includes any one of a circle, a polygon, a straight bar and a wavy bar. Such a configuration can make the buffer groove play a better buffer protection role.

[0011] In some embodiments, the first cover plate further comprises: a first filler located in at least one buffer groove; the material of the first filler comprises an organic polymer material. Such a configuration is conducive to further improving the buffer protection capability of the first cover plate.

[0012] In some embodiments, the first cover plate further includes: a second filler located in at least one buffer groove; the material of the second filler includes a phase change energy storage material. Such a configuration is conducive to further improving the thermal conductivity of the first cover plate.

[0013] In some embodiments, the ratio of the thickness of the first material layer to the total thickness of the first cover plate is greater than or equal to 20%. This arrangement enables the first cover plate to have a good lightweight benefit. In addition, when a plurality of protruding structures are formed on the first cover plate by compression molding, wrinkles or even breaks are not likely to occur.

[0014] In some embodiments, the thickness of the first material layer is greater than or equal to 5 μm. This configuration enables the first cover plate to have a good lightweight benefit. In addition, when a plurality of protruding structures are formed on the first cover plate by compression molding, wrinkles or even breaks are not likely to occur.

[0015] In some embodiments, the thickness of the first sealing layer is equal to or substantially equal to the thickness of the second sealing layer. Here, “substantially equal” means that there may be a small deviation between the two, and the small deviation may, for example, mean that the difference in thickness between the two is less than 5% of the thickness of the smaller one, or may also mean that the difference in thickness between the two is less than 10% of the thickness of the smaller one. In this example, it is also beneficial to make the mechanical parameters of the first cover plate symmetrical in the thickness direction, so that the first cover plate is not prone to curling.

[0016] In some embodiments, the first sealing layer and the second sealing layer are made of the same material. This configuration is beneficial for making the mechanical parameters of the first cover plate symmetrical in the thickness direction, thereby preventing the first cover plate from curling easily.

[0017] In some embodiments, the material of the first material layer includes an organic polymer material. Organic polymer materials include polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc. In this example, the first material layer can have better plasticity and higher elongation, so that the first cover plate formed is easy to be stamped or hot pressed and other shaping processes, and is not easy to break.

[0018] In some embodiments, the material of at least one of the first sealing layer and the second sealing layer includes: at least one of metal and ceramic. The metal includes copper, for example, pure copper, copper alloy, etc. In this example, the structural strength of the first sealing layer and / or the second sealing layer is relatively high, and the first sealing layer and / or the second sealing layer has good sealing and toughness. This is conducive to improving the structural strength of the first cover plate and improving the service life of the first cover plate.

[0019] In some embodiments, the second cover plate includes a third sealing layer and a second material layer; the second material layer is located on a side of the third sealing layer away from the first cover plate; and the yield point strain of the second material layer is greater than the yield point strain of the third sealing layer.

[0020] In this embodiment, by setting the second cover plate to also include a second material layer, and the yield point strain of the second material layer is greater than the yield point strain of the third sealing layer, the structural strength of the second cover plate is improved. For example, when etching structures such as micro-pillars and / or support pillars on the surface of the third sealing layer away from the second material layer, the base material thickness of the third sealing layer can be etched to less than or equal to 0.03 mm without wrinkling or cracking. In addition, the unit weight of the second material layer can be less than the unit weight of the third sealing layer, and the total weight of the second cover plate can be reduced relative to the second cover plate of the same thickness and without the second material layer, thereby achieving a lightweight design.

[0021] In some embodiments, the ratio of the thickness of the second material layer to the total thickness of the second cover plate is greater than or equal to 50%. This arrangement enables the second cover plate to have a good lightweight benefit. In addition, when etching structures such as micro-pillars and / or support pillars on the second cover plate, and when the second cover plate is bent multiple times, wrinkles or even breaks are not likely to occur.

[0022] In some embodiments, the material of the second material layer includes organic polymer materials, such as polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc. In this example, the second material layer can have better toughness, so that the second cover plate is not prone to wrinkles or even breaks.

[0023] In some embodiments, the material of the third sealing layer includes: at least one of metal and ceramic. The metal includes copper, for example, pure copper, copper alloy, etc. In this example, the third sealing layer has a relatively high structural strength and has good sealing and toughness. This is conducive to improving the structural strength of the second cover plate and increasing the service life of the second cover plate.

[0024] In some embodiments, the second sealing layer is closer to the third sealing layer than the first sealing layer; the material of the third sealing layer is the same as that of the second sealing layer. Such a configuration is conducive to welding and sealing the third sealing layer with the second sealing layer, that is, it is conducive to welding and fixing the first cover plate with the second cover plate.

[0025] In some embodiments, the second cover plate has a molded placement groove on one side close to the first cover plate, and the liquid absorption structure is placed in the placement groove. Since in some examples, the second cover plate has a second material layer with better toughness, and the placement groove formed by molding on the side of the second cover plate close to the first cover plate has a larger area, the structural strength of the second cover plate is still relatively high, and it is not easy to wrinkle or even break.

[0026] In some embodiments, the third sealing layer has a groove on one side close to the first cover plate, and the groove includes a first groove portion and a second groove portion, and the first groove portion is close to the bottom wall of the groove relative to the second groove portion. The second cover plate also includes a plurality of columnar structures located in the first groove portion, and the plurality of columnar structures are connected to the bottom wall. The liquid absorbing structure includes a liquid absorbing core, and the liquid absorbing core is placed in the second groove portion; and the plurality of columnar structures support the liquid absorbing core. In this scheme, since the second cover plate has a second material layer with better toughness, the groove located in the third sealing layer can be formed by compression molding or etching. Regardless of the method, the structural strength of the formed second cover plate is still relatively high. In addition, when the groove is formed by etching, the plurality of columnar structures in the groove can also be directly etched. When the groove is formed by compression molding, the plurality of columnar structures in the groove can be formed by dispensing. Such a setting is conducive to ensuring that the second cover plate has sufficient structural strength.

[0027] In some embodiments, the second cover plate includes at least two stacked metal layers, which is helpful to improve the structural strength of the second cover plate, thereby improving the reliability of the entire heat dissipation structure.

[0028] In some embodiments, the at least two metal layers include any one of copper steel, copper titanium, copper steel copper, copper titanium copper, copper aluminum copper, copper magnesium copper, and copper (magnesium aluminum alloy) copper. The selected composite material has a large strength, which can greatly improve the overall mechanical structure performance of the heat dissipation structure, avoid deformation of the heat dissipation structure when it is squeezed, and improve the manufacturing yield of the heat dissipation structure and the reliability of the whole machine.

[0029] On the other hand, another heat dissipation structure is provided, including a fourth sealing layer, a third material layer and a fifth sealing layer; along the first direction, the third material layer is located between the fourth sealing layer and the fifth sealing layer; the material of the third material layer includes at least one of a graphite material and a graphene material; the heat dissipation structure has a plurality of buffer grooves arranged at intervals; the position of the corresponding buffer groove in the third material layer includes elastic deformation and / or plastic deformation.

[0030] In another heat dissipation structure provided by the embodiment of the present application, since the material of the third material layer includes at least one of a graphite material and a graphene material, and the position corresponding to the buffer groove in the third material layer includes elastic deformation and / or plastic deformation, the heat dissipation structure has a good heat dissipation and temperature uniformity effect, especially the heat dissipation structure corresponding to the buffer groove position is not easy to have heat accumulation phenomenon. In addition, since the fourth sealing layer and the fifth sealing layer are respectively provided on the opposite sides of the third material layer, on the one hand, the third material layer can be well sealed and protected, so that the third material layer is not easy to collapse, so that it can play a good buffering and supporting role on the screen, preventing the screen from having light and shadow, black spots, mold printing, bright spots, green lines, fragmentation and other failure problems, and it is not easy to weaken the temperature uniformity heat dissipation ability of the heat dissipation structure due to the collapse of the third material layer, thereby improving the life of the heat dissipation structure and enhancing the reliability of the first cover plate; on the other hand, since a relatively symmetrical structure can be formed, the flatness of the first cover plate can be better, for example, because the mechanical material parameters such as the modulus of the material in the thickness direction of the first cover plate are more symmetrical, the heat dissipation structure is not easy to curl. In addition, the weight of the third material layer is lighter, which is also conducive to reducing the total weight of the heat dissipation structure and realizing a lightweight design.

[0031] In some embodiments, the thermal conductivity of the third material layer is greater than or equal to 400 W / (m·k). This arrangement enables the heat dissipation structure to have a higher thermal conductivity efficiency.

[0032] In some embodiments, the material of at least one of the fourth sealing layer and the fifth sealing layer includes copper. This configuration can provide better sealing and protection for the third material layer and has higher heat dissipation efficiency.

[0033] In another aspect, an electronic device is provided, comprising: a screen and a heating device; and a heat dissipation structure as in any of the above embodiments. The heat dissipation structure is located between the screen and the heating device.

[0034] The electronic device provided in the embodiment of the present application has a heat dissipation structure in any of the aforementioned embodiments, and therefore has a good heat dissipation effect, is less likely to have serious local heating problems, and can protect the screen to achieve a lightweight design.

[0035] In some embodiments, the electronic device further includes: an adhesive layer located between the heat dissipation structure and the screen. By providing the adhesive layer, the heat dissipation structure can be bonded and fixed to the screen. In addition, when the heat dissipation structure is bonded and fixed to the screen, since the heat dissipation structure has a buffer groove, the buffer groove can also be used to prevent the adhesive layer between the screen and the heat dissipation structure from debonding and failing due to shear stress. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0037] Figure 2 A schematic diagram of a heat dissipation structure provided in an embodiment of the present application;

[0038] Figure 3 for Figure 2 A schematic cross-sectional view of the heat dissipation structure along the AA direction;

[0039] Figure 4 The operating principle of the heat dissipation structure provided in the embodiment of the present application and the schematic diagram of the gas-liquid phase working medium flow;

[0040] Figure 5 A schematic cross-sectional view of an electronic device provided in an embodiment of the present application;

[0041] Figure 6 A schematic cross-sectional view of an electronic device provided by an embodiment of the present application when the screen is deformed;

[0042] Figure 7 A schematic diagram of the structure of a first cover plate provided in an embodiment of the present application when no buffer groove is formed;

[0043] Figure 8 A stress-strain curve diagram of a first sealing layer (or a second sealing layer) and a first material layer provided in an embodiment of the present application;

[0044] Fig. 9 A schematic diagram of the structure of a jig and a first cover plate for molding a buffer groove provided in an embodiment of the present application;

[0045] Fig.10 A schematic structural diagram of a first cover plate provided in an embodiment of the present application;

[0046] Fig.11 for Fig.10 A schematic cross-sectional view of the first cover plate along the BB direction;

[0047] Fig.12 A schematic diagram of the structure of another first cover plate provided in an embodiment of the present application;

[0048] Fig.13 A schematic structural diagram of another first cover plate provided in an embodiment of the present application;

[0049] Fig.14 A schematic structural diagram of another first cover plate provided in an embodiment of the present application;

[0050] Fig.15 A schematic diagram of the structure of a first cover plate and a screen in cooperation with each other provided in an embodiment of the present application;

[0051] Fig.16 This is a schematic diagram of a heat dissipation structure in an embodiment of the present application;

[0052] Fig.17 It is a structural schematic diagram of another heat dissipation structure in an embodiment of the present application;

[0053] Fig.18 This is a structural schematic diagram of another heat dissipation structure in an embodiment of the present application;

[0054] Fig.19 This is a structural schematic diagram of another heat dissipation structure in an embodiment of the present application;

[0055] Fig. 20 This is a structural schematic diagram of another heat dissipation structure in an embodiment of the present application;

[0056] Fig.21 A schematic diagram of the structure of a heat dissipation structure provided in an embodiment of the present application in cooperation with a screen and a heating device;

[0057] Fig. 22 A schematic diagram of a combination of a first cover plate and a second liquid absorbent core provided in an embodiment of the present application;

[0058] Fig.23 A schematic diagram of another heat dissipation structure provided in an embodiment of the present application;

[0059] Fig.24 A schematic diagram of the structure of a heat dissipation structure and a screen provided in an embodiment of the present application. DETAILED DESCRIPTION

[0060] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0061] In the following, the terms "first", "second", etc. are used only for convenience of description and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0062] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "electrical connection" may refer to a direct electrical connection or an indirect electrical connection via an intermediate medium.

[0063] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0064] In the embodiments of the present application, "and / or" describes the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B may be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0065] In the embodiments of the present application, directional indications such as up, down, left, right, front, and back, etc., used to explain the structure and movement of different components in the present application are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component position changes, then these directional indications will also change accordingly.

[0066] The embodiment of the present application provides an electronic device, which may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, a watch, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet. Exemplarily, the electronic device may be a portable electronic device. Exemplarily, the electronic device may be any electronic device with heat dissipation requirements.

[0067] See also Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of the present application. For ease of description, the width direction of the electronic device 1000 is defined as the X1 axis; the length direction of the electronic device 1000 is defined as the Y1 axis; and the thickness direction of the electronic device 1000 is defined as the Z1 axis. It is understood that the coordinate system setting of the electronic device 1000 can be flexibly set according to specific actual needs.

[0068] exist Figure 1 In the embodiment of the present invention, the electronic device 1000 is a mobile phone. Exemplarily, the electronic device 1000 may include a screen 1001, a back shell 1002 and a heating device 1003. It is understood that Figure 1 and Figure 2 Only some components of the electronic device 1000 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 1 and Figure 2 For example, in some other examples, the electronic device 1000 may not include the screen 1001 .

[0069] Screen 1001 is used to display images, videos, etc. Screen 1001 can be a flexible display screen or a rigid display screen; illustratively, screen 1001 can be any one of an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MIL-E) display screen, a micro organic light-emitting diode (MIL-E) display screen, a micro organic light-emitting diode (MIL-E) display screen, a quantum dot light-emitting diode (QLED) display screen, and a liquid crystal display (LCD).

[0070] The back shell 1002 is used to protect the internal electronic devices (such as the heating device 1003) of the electronic device 1000. Among them, the back shell 1002 may include a back cover and a middle frame, and the middle frame is fixed to the back cover. Exemplarily, the middle frame can be fixedly connected to the back cover by adhesive. The middle frame can also be an integrally molded structure with the back cover, that is, the middle frame and the back cover are an integral structure. The screen 1001 can be connected to the middle frame. There may be components such as circuit boards and batteries in the space between the screen, the middle frame and the back cover. The circuit board may include a flexible circuit board and a rigid circuit board. Power devices such as chips may be provided on the circuit board.

[0071] Exemplarily, the heating device 1003 may be a chip on a circuit board, and the chip may be, for example, a processing chip, a memory chip, etc. Of course, in some other embodiments, the heating device 1003 may also be other power devices in the electronic device 1000. Exemplarily, any device that generates heat when the electronic device 1000 is running may be the heating device 1003. In addition, the number of heating devices 1003 in the electronic device 1000 may be one, or two or more. When the number of heating devices 1003 is two or more, at least some of the heating devices 1003 may be of the same type, such as two processing chips, or two memory chips.

[0072] The inventor of the present application has found that the presence of the heating device 1003 in the electronic device 1000 may cause the electronic device 1000 to have a serious local heating problem. Figure 1 In the embodiment, since the heating device 1003 is located in the upper half of the electronic device 1000, there is a problem that the heat of the heating device 1003 is difficult to dissipate from the upper half to the lower half in time; this will cause the performance of various components in the upper half of the electronic device 1000 to decline, shorten their lifespan, and easily burn the part of the screen facing the heating device, affecting the display effect.

[0073] Based on this, some embodiments of the present application provide a heat dissipation structure 100. The heat dissipation structure 100 can be connected to the middle frame. Figures 2 to 4 , Figure 2 This is a schematic diagram of the structure of the heat dissipation structure 100 provided in an embodiment of the present application. Figure 3 for Figure 2 A schematic cross-sectional view of the heat dissipation structure 100 along the AA direction, Figure 4 The operating principle and gas-liquid phase working medium flow diagram of the heat dissipation structure 100 provided in the embodiment of the present application. The heat dissipation structure 100 provided in the embodiment of the present application includes a first cover plate 10, a second cover plate 20 and a liquid absorption structure 30.

[0074] The first cover plate 10 and the second cover plate 20 are connected to form a receiving cavity 50. For example, the edge 41 of the first cover plate 10 and the edge 42 of the second cover plate 20 can be welded and fixed (for ... Figure 3 The welding method can be brazing, cold welding, pressure welding, diffusion welding, ultrasonic welding, electromagnetic pulse welding and other low temperature welding processes. The welding temperature is less than 320 degrees. In addition, solder can be used without solder or with an additional solder layer.

[0075] For ease of description, the width direction of the heat dissipation structure 100 is defined as the X2 axis, which can be parallel to the aforementioned X1 axis; the length direction of the heat dissipation structure 100 is defined as the Y2 axis, which can be parallel to the aforementioned Y1 axis; the thickness direction of the heat dissipation structure 100 is defined as the Z2 axis, which can be parallel to the aforementioned Z1 axis. It is understandable that the coordinate system setting of the heat dissipation structure 100 can be flexibly set according to specific actual needs.

[0076] The heat dissipation structure 100 has a first region 01 and a second region 02. The first region 01 and the second region 02 may be arranged along the Y2 axis direction. It is understandable that the first region 01 and the second region 02 may be adjacent (e.g. Figure 2 and Figure 3 ), or they may be non-adjacent (as shown in Figure 4 As shown, they are located at both ends of the heat dissipation structure along the Y2-axis direction).

[0077] The liquid absorption structure 30 is located in the accommodating cavity 50. The liquid absorption structure can extend from the first area 01 to the second area 02. Exemplarily, the number of the liquid absorption structure 30 can be one or more; when the number of the liquid absorption structure is multiple, the multiple liquid absorption structures can be arranged in parallel and spaced apart, and each liquid absorption structure 30 can extend from the first area 01 to the second area 02. In addition, the accommodating cavity 50 also has a steam channel 51, and the steam channel 51 can extend from the second area 02 to the first area 01, so as to form a working medium (such as pure water, propanol, alcohol, etc.) circulation loop.

[0078] Exemplarily, the liquid wicking structure 30 may include a liquid wick 31. The liquid wick 31 may be a mesh structure with dense through holes such as a woven mesh, an etched mesh, such as a copper mesh, a stainless steel mesh, an organic material woven mesh, etc. The copper mesh may be sintered from copper powder, or the copper mesh may be woven from copper wires. The liquid wick 31 may be a capillary structure.

[0079] As another example, the liquid wicking structure 30 may include a plurality of micropillars 32 disposed on the first cover plate 10 and / or the second cover plate 20. Figure 3 In the embodiment, a plurality of micro-pillars 32 are arranged on the inner wall surface of the second cover plate 20. There are fine grooves 52 (for example, the groove depth may be less than or equal to 0.1 mm, and the groove width may be less than or equal to 1 mm) between the plurality of micro-pillars 32, that is, a capillary structure.

[0080] For example, Figure 3 As shown, the liquid wicking structure 30 may include a liquid wick 31 and a plurality of microcolumns 32 located on the first cover plate 10 and / or the second cover plate 20, thereby forming a double-layer or triple-layer composite capillary structure. Figure 3 The double-layer composite capillary structure including the liquid absorption core and a plurality of micro-pillars 32 located on the second cover plate 20 is taken as an example for illustration.

[0081] Capillary structure means that due to the surface tension of the liquid surface, when the infiltrated liquid is in the capillary pore, its liquid surface is concave, so that the liquid surface will exert a pulling force on the liquid below, causing the liquid to move upward along the wall of the capillary pore. This causes the capillary phenomenon. The capillary structure can include multiple capillaries or fine grooves similar to capillaries. In this way, when the liquid working medium enters the capillary pores or fine grooves in the capillary structure, it will flow to the other end of the capillary pore through capillary action, completing the transfer and return of the working medium.

[0082] Exemplarily, the heat dissipation structure 100 can be a vapor chamber (VC). A vapor chamber, also known as a temperature averaging plate, is a vacuum chamber with a microstructure (capillary structure) on the inner wall and a working fluid injected. The working principle of the vapor chamber is roughly the same as that of a heat pipe, which specifically includes four main steps: conduction, evaporation, convection, and condensation. The material of the vapor chamber can be copper, and the working fluid inside it can be pure water.

[0083] In some embodiments, a plurality of support columns 43 may be provided on the first cover plate 10 and / or the second cover plate 20. Figure 4 In the embodiment of the present invention, a plurality of support columns 43 are provided on the inner wall surface of the first cover plate 10. The support columns 43 are used to prevent the heat dissipation structure 100 from collapsing. A steam channel 51 may be formed between the plurality of support columns. The depth of the steam channel 51 may be greater than 0.1 mm, and the width may be greater than 1 mm.

[0084] Exemplarily, the center distance between two adjacent support pillars 43 may be greater than 2 mm. In this case, the heat dissipation structure 100 is less likely to collapse.

[0085] Exemplarily, in the first cover plate 10 and the second cover plate 20: when a plurality of support columns 43 are arranged on the inner wall surface of one and a plurality of micro columns 32 are arranged on the inner wall surface of the other, the plurality of support columns 43 can be designed to be opposite to the plurality of micro columns 32 (for example, one support column 43 is opposite to one micro column 32, or one support column 43 is opposite to two or more micro columns 32), so that the heat dissipation structure 100 has a higher structural strength, the heat dissipation structure 100 is not easy to collapse and block the steam channel 51, and thus it is not easy to fail and has higher reliability.

[0086] On this basis, illustratively, a wick 31 can be set between multiple support columns 43 and multiple micro columns 32. At this time, multiple support columns 43 can abut against the first surface of the wick 31, and multiple micro columns 32 can abut against the second surface of the wick 31, and the second surface is opposite to the first surface.

[0087] It can be understood that the above is only an example of the setting position of the support column 43 and the micro column 32. In other embodiments of the present application, the support column 43 can also be set on the second cover plate 20, and the micro column 32 can be set on the first cover plate 10; or, the support column 43 can also be set on the first cover plate 10 and the second cover plate 20; or, the micro column 32 can also be set on the first cover plate 10 and the second cover plate 20 at the same time.

[0088] When the heat dissipation structure 100 provided in the embodiment of the present application is applied to the electronic device 1000, the heat dissipation structure 100 can be located between the screen 1001 and the heating device 1003. At this time, the first cover plate 10 can be close to the screen 1001, and the second cover plate 20 can be close to the heating device 1003; or the second cover plate 20 can be close to the screen 1001, and the first cover plate 10 can be close to the heating device 1003. This application does not limit this.

[0089] For example, Figure 4 As shown, the heating device 1003 in the heat source area can be contacted by the second cover plate 20 located in the first area 01. When the heat generated by the heating device 1003 is thermally conducted into the heat dissipation structure 200 through the second cover plate 20 in the first area 01, the liquid working medium near the heating device 1003 in the heat dissipation structure 100 absorbs the heat and quickly vaporizes, taking away a large amount of heat at the same time. Then, by using the latent heat of steam, when the steam in the heat dissipation structure 100 diffuses from the high-pressure area (such as the first area 01, which is the high-temperature area at this time) to the low-pressure area (such as the second area 02, which is the low-temperature area at this time) through the steam channel 51, the steam will quickly condense into liquid and release heat energy when it contacts the inner wall with a lower temperature; the working medium condensed into liquid returns to the first area 01 through the capillary force of the liquid absorption structure (i.e., the capillary structure), thereby completing a heat conduction cycle and forming a two-way circulation system in which the working medium coexists in vapor and liquid phases.

[0090] It can be seen that the heat dissipation structure 100 provided in the embodiment of the present application can dissipate the heat of the heating device 1003 in a timely manner, for example, Figure 1 In the embodiment, the upper part of the electronic device 1000 (in contact with the portion of the heat dissipation structure 100 located in the first area 01) dissipates heat to the lower part (in contact with the portion of the heat dissipation structure 100 located in the second area 02) in a timely manner, thereby making it less likely for the electronic device 1000 to have severe local heating problems, and can improve the performance degradation and life shortening of various components in the area caused by overheating in the local area, as well as screen burns and display effect problems.

[0091] In addition, in other implementations, the heat dissipation structure 100 can also be replaced by a graphite sheet and / or a graphene film. It can be understood that when both a graphite sheet and a graphene film are included, the two can be stacked along the Z1 axis direction. Among them, the graphite sheet and the graphene film have a good thermal conductivity. At this time, the heat of the heating device 1003 can be effectively dissipated through the graphite sheet and / or the graphene film.

[0092] See also Figure 5 , Figure 5 A cross-sectional schematic diagram of an electronic device 1000 provided in an embodiment of the present application. The electronic device 1000 includes a middle frame 81, a back cover 82, a screen 1001, a battery 83, a chip 84, a mainboard 85 and a heat sink 86. Among them, the middle frame 81 includes a frame 811 and a middle plate 812. One end of the frame 811 along the Z1 axis direction is connected to the screen 1001, and the other end is connected to the back cover 82. The middle plate 812 is connected and fixed to the inner side of the frame. The chip 84, the mainboard 85, and the battery 83 are located between the middle plate 812 and the back cover 82. The chip 84 is located on the mainboard 85, and the chip 84 is in contact with the middle plate 812. The battery 83 and the mainboard 85 are arranged along a set direction (such as the Y1 axis direction). The heat sink 86 is located between the middle plate 812 and the screen 1001. The heat sink 86 can be connected to the middle frame (for example, bonding, lap welding, screw locking, etc.). For example, the heat sink 86 may be at least one of the aforementioned heat sink structure 100, a graphite sheet, and a graphene film. The heat of the chip 84 may be dissipated in the direction of the arrow.

[0093] See also Figure 6 , Figure 6 The cross-sectional diagram of an electronic device 1000 provided in an embodiment of the present application when the screen 1001 is deformed. Figure 5 and Figure 6 Further research found that when the heat sink 86 is not provided, due to the large air gap between the screen and the middle plate, the screen is prone to deformation when subjected to external force (such as extrusion force), resulting in the screen lacking support and being prone to breakage. In some embodiments of the present application, a heat sink 86 is provided, which can play a certain buffering and supporting effect and improve the above problems to a certain extent. However, when graphite sheets and graphene films are used as heat sinks 86, since the graphite sheets and graphene films are very soft, the buffering and supporting capabilities are very weak when the screen is deformed and squeezed, and there is still a great risk of screen breakage. When the heat dissipation structure 100 is used as the heat sink 86, since the outer shell (first cover plate and second cover plate) of the heat dissipation structure is a metal material (such as copper, copper alloy, stainless steel) with a high elastic modulus, high hardness and low elongation, the outer shell will produce a large rebound force on the screen when the screen is subjected to external impact and thus contacts the outer shell of the heat dissipation structure, which causes the screen to easily have light and shadow, black spots, mold printing, bright spots, green lines, and fragmentation. Failure problems.

[0094] Based on this, see Figure 7 , Figure 8 and Fig. 9 , Figure 7 This is a schematic structural diagram of a first cover plate 10 provided in an embodiment of the present application when the buffer groove 70 is not formed. Figure 8 A stress-strain curve diagram of a first sealing layer 11 (or a second sealing layer 13) and a first material layer 12 provided in an embodiment of the present application, Fig. 9 A schematic diagram of the structure of a jig and a first cover plate 10 with a buffer groove 70 provided in some embodiments of the present application. In some embodiments of the present application, the first cover plate 10 includes a first sealing layer 11, a first material layer 12 and a second sealing layer 13, and the first material layer 12 is located between the first sealing layer 11 and the second sealing layer 13. The first cover plate 10 has a plurality of buffer grooves 70 on the surface of the side facing away from the second cover plate 20, and the plurality of buffer grooves 70 are arranged at intervals. The position corresponding to the buffer groove 70 in the first material layer 12 includes elastic deformation. It can be understood that the position corresponding to the buffer groove 70 in the first material layer 12 here includes elastic deformation, and it does not completely exclude the situation that the position corresponding to the buffer groove 70 in the first material layer 12 also includes local plastic deformation. The elastic deformation here can be determined by whether the first material layer 12 rebounds after the first sealing layer 11 and the second sealing layer 13 are removed. The rebound here does not require the first material layer 12 to rebound completely to a planar state.

[0095] In some examples, the yield point strain of the first material layer 12 is greater than the yield point strain of the first sealing layer 11, and greater than the yield point strain of the second sealing layer 13. The positions of the first sealing layer 11 and the second sealing layer 13 corresponding to the buffer groove include plastic deformation. Among them, the plastically deformed first sealing layer 11 and the second sealing layer 13 can constrain the shape of the first material layer 12. The strain can include surface strain ε = (area change / initial total area) * 100%, and the yield point strain refers to the strain corresponding to the yield point position, that is, Figure 8 The horizontal coordinate value corresponding to the yield point position shown in FIG. can also be understood as the dividing point between elastic deformation and plastic deformation. At this time, the buffer groove 70 can be made by compression molding. For example, Fig. 9 As shown, the jig includes an upper pressing plate 91 and a lower pressing plate 92, the upper pressing plate 91 includes a convex block 911, and the lower pressing plate 92 includes a concave block 921. When the upper pressing plate 91 and the lower pressing plate 92 are close to each other, the convex block 911 and the concave block 921 cooperate with each other to mold the buffer groove 70 on the first cover plate 10. For example, Figure 8It can be seen that after the bump 911 contacts the first cover plate 10, it can go through three stages, wherein in stage A, the first cover plate 10 does not produce obvious deformation; in stage B, the first sealing layer 11, the first material layer 12 and the second sealing layer 13 in the first cover plate 10 all produce elastic deformation; and in stage C, the first material layer 12 in the first cover plate 10 is still elastically deformed, and the first sealing layer 11 and the second sealing layer 13 are plastically deformed. Therefore, the first sealing layer 11 and the second sealing layer 13 can be used to constrain the deformation state of the first material layer 12.

[0096] It should be noted that Fig. 9 And some of the following figures are only used to illustrate the formation of the buffer groove by compression molding. Of course, in some other embodiments, other process methods can also be used (for example, in the two opposite surfaces of the first material layer 12 that undergoes elastic deformation, one surface is electroplated with a first sealing layer 11, and the other surface is electroplated with a second sealing layer 13, so as to limit the first material layer 12 from returning to its original state) to form the buffer groove 70. Therefore, in some embodiments of the present application, there is no restriction on the formation method of the buffer groove 70. It is only necessary to ensure that the position corresponding to the buffer groove 70 in the first material layer 12 includes elastic deformation, and the buffer groove 70 can absorb stress when the first cover plate 10 is deformed. In addition, the shape and size of any two buffer grooves 70 can be the same or different.

[0097] In the heat dissipation structure 100 provided in the embodiment of the present application, since the first cover plate 10 has a plurality of buffer grooves 70, and the plurality of buffer grooves 70 are arranged at intervals, the first cover plate 10 has a good buffering and supporting effect. In addition, since the first cover plate 10 includes a first sealing layer 11, a first material layer 12 and a second sealing layer 13, the first material layer 12 is sandwiched between the first sealing layer 11 and the second sealing layer 13, and the position corresponding to the buffer groove 70 in the first material layer 12 includes elastic deformation, the buffer groove 70 of the first cover plate 10 has a better stress absorption and release capability, thereby further improving the compression deformation and recovery capability of the first cover plate 10. Exemplarily, when the heat dissipation structure 100 is applied to the aforementioned electronic device 1000, for example, when the heat dissipation structure 100 is squeezed by the aforementioned screen 1001, since the first cover plate 10 has excellent buffering and supporting effects, the buffer groove 70 has better stress absorption and release capabilities, so that the first cover plate 10 has better flexibility, and since the first material layer 12 bound by the first sealing layer 11 and the second sealing layer 13 will not have excessive rebound force, that is, the screen 1001 will not have failure problems such as light and shadow, black spots, mold printing, bright spots, green lines, and fragmentation due to the excessive rebound force of the first cover plate 10.

[0098] In addition, since the first material layer 12 has the first sealing layer 11 and the second sealing layer 13 on opposite sides, on the one hand, the first material layer 12 can be well sealed and protected, thereby increasing the life of the first cover plate 10 and enhancing the reliability of the first cover plate 10; on the other hand, since a relatively symmetrical structure can be formed, the flatness of the first cover plate 10 can be better, for example, since the mechanical material parameters such as the modulus of the material in the thickness direction of the first cover plate 10 are more symmetrical, the first cover plate 10 is not prone to curling. In addition, the unit weight of the first material layer 12 can be less than the unit weight of the first sealing layer 11, and can be less than the unit weight of the second sealing layer 13. Compared with the first cover plate 10 of the same thickness and without the first material layer 12, the total weight of the first cover plate 10 can be reduced to achieve a lightweight design.

[0099] In some embodiments, the shape of any buffer groove 70 includes any one of a circle, a polygon, a straight bar, and a wavy bar. Here, the shape of the buffer groove 70 can be understood as the shape of the positive projection of the buffer groove 70 on the X2-Y2 plane. Figure 10-13 , Fig.10 This is a schematic structural diagram of a first cover plate 10 provided in an embodiment of the present application. Fig.11 for Fig.10 A schematic cross-sectional view of the first cover plate 10 along the BB direction, Fig.12 A schematic diagram of the structure of another first cover plate provided in an embodiment of the present application, Fig.13 This is a schematic diagram of the structure of another first cover plate 10 provided in an embodiment of the present application. Fig.10 and Fig.11 The shape of the buffer tank 70 is shown as a circle. Fig.12 Taking the shape of the buffer groove 70 as a hexagon as an example, Fig.13 The shape of the buffer groove 70 is a straight bar for illustration. The wavy bar shape can be formed into a wavy shape along the Y2 axis direction and / or the Z2 axis direction on the basis of the straight bar shape.

[0100] Exemplary, reference Fig.11 , a rounded corner R1 can be set at the bottom of the buffer groove 70, and a rounded corner R2 can be set at the top. In this way, when the first cover plate 10 is bent, it is not easy to break at the position where the buffer groove 70 is set. Fig.11 The shape of the buffer groove 70 is circular as an example. Fig.12 , Fig.13 For the embodiment, it can also have a structure similar to the above-mentioned rounded corners R1 and rounded corners R2.

[0101] In addition, Figure 10-13In the embodiments, all buffer grooves 70 in the first cover plate 10 are of the same shape and size. However, the present application is not limited thereto. For example, buffer grooves 70 of different shapes and sizes may also be provided on the same first cover plate 10.

[0102] In some embodiments, the top openings of at least some of the buffer grooves 70 (eg, one, two, or more buffer grooves 70) are toward the side of the first cover plate 10 that is away from the second cover plate 20. Fig.10 , Fig.12 , Fig.13 In the embodiment, the top opening of the buffer groove 70 faces the direction indicated by the Z2 axis. In this way, the buffering effect of the buffer groove 70 can be fully exerted. Exemplarily, at this time, the second cover plate 20 can be set to contact the screen 1001, and the first cover plate 10 is located on the side of the second cover plate 20 away from the screen 1001, which is conducive to improving the screen imprint problem caused by the buffer groove 70.

[0103] In other embodiments, the top opening of at least part of the buffer grooves 70 (e.g., one, two or more buffer grooves 70) faces the side of the first cover plate 10 close to the second cover plate 20. For example, the top opening of the buffer groove 70 may face the direction indicated by the -Z2 axis. In this way, the screen mold problem can be prevented while the first cover plate 10 contacts the screen 1001.

[0104] See also Fig.14 , Fig.14 This is a schematic structural diagram of another first cover plate 10 provided in an embodiment of the present application.

[0105] In some embodiments, the first cover plate 10 further includes: a first filler 44, which is located in at least one buffer groove 70. The material of the first filler 44 includes an organic polymer material. Such a configuration is conducive to further improving the buffer protection capability of the first cover plate 10. Among them, the organic polymer material includes at least one of polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), and polyamide (PA).

[0106] In some embodiments, the first cover plate 10 further includes: a second filler 45, which is located in at least one buffer groove 70. The material of the second filler 45 includes a phase change energy storage material. Such a configuration is conducive to further improving the thermal conductivity of the first cover plate 10. Among them, the phase change energy storage material refers to a material that changes to different states (such as liquid and gas, liquid and solid, solid and gas) at different temperatures. At this time, a capping layer can also be provided to confine the phase change energy storage material to the buffer groove 70.

[0107] Understandably, Fig.14 For example, among the multiple buffer grooves 70 of the first cover plate 10, the first filler 44 is disposed in a part of the buffer grooves 70, and the second filler 45 is disposed in another part of the buffer grooves 70. However, in other embodiments, the first filler 44 may be disposed in all the buffer grooves 70, or the second filler 45 may be disposed in all the buffer grooves 70; or the first filler 44 and the second filler 45 may be simultaneously filled in the same buffer groove 70.

[0108] In some embodiments, see Fig.15 , Fig.151001. The electronic device 1000 may further include an adhesive layer 14, which is located between the heat dissipation structure 100 and the screen 1001. For example, the adhesive layer 14 may be located on the side of the first cover plate 10 facing away from the second cover plate 20 (i.e., Fig.15 ), or located on the side of the second cover plate 20 away from the first cover plate 10 (not shown). By providing the adhesive layer 14, the first cover plate 10 (or the second cover plate 20) can be bonded and fixed to the screen 1001. In addition, when the adhesive layer 14 is located on the side of the first cover plate 10 away from the second cover plate 20, since the first cover plate 10 has a buffer groove 70, the buffer groove 70 can also be used to prevent the adhesive layer 14 between the screen 1001 and the first cover plate 10 from debonding and failing due to shear stress. At the same time, when a phase change energy storage material is provided in the buffer groove 70, the adhesive layer 14 may also be equivalent to the aforementioned capping layer, which confines the phase change energy storage material within the buffer groove 70.

[0109] In some embodiments, see Fig. 9 , Fig.14 and Fig.15 , a plurality of protruding structures 71 are also provided on the first cover plate 10, wherein any protruding structure 71 protrudes in a direction close to the second cover plate 20. The protruding structure 71 here can be used as the aforementioned support column 43, or as the aforementioned micro-column 32, or can also be a structure with other uses. The present application does not limit the specific size and use of the protruding structure 71. Exemplarily, the protruding structure 71 can be formed by molding (such as stamping, hot pressing and other shaping processes), and protrudes in a direction close to the second cover plate 20 (such as the -Z2 axis direction). Exemplarily, the protruding structure 71 can be made of Fig. 9 The jig in the embodiment is molded. At this time, the protruding structure 71 can be formed together with the buffer groove 70, which has a simple process and lower cost.

[0110] In addition, it should be noted that when the second sealing layer 13 is closer to the second cover plate than the first sealing layer 11, if it is necessary to etch a support column 43 on the surface of the first cover plate 10 close to the second cover plate 20 and form a sufficient steam channel height, the second sealing layer 13 needs to have a sufficient thickness, for example, a thickness greater than 0.15 mm, which will cause a significant increase in the weight of the first cover plate 10. For the first cover plate 10 provided in some embodiments of the present application, a shaping process such as stamping or hot pressing can be used to form the buffer groove 70 and the protruding structure 71 (such as the support column 43 or the micro column 32, etc.), so that the first cover plate 10 is more lightweight and the production cost is reduced.

[0111] Exemplarily, the material of the first sealing layer 11 may include metal or ceramic. The metal may be pure copper, copper alloy, etc. In this example, the structural strength of the first sealing layer 11 is relatively high, and the first sealing layer 11 has good sealing performance and toughness. This is conducive to improving the structural strength of the first cover plate 10 and improving the service life of the first cover plate 10.

[0112] Exemplarily, the material of the second sealing layer 13 may include metal or ceramic. The metal may be pure copper, copper alloy, etc. In this example, the structural strength of the second sealing layer 13 is relatively high, and the second sealing layer 13 has good sealing performance and toughness. This is conducive to improving the structural strength of the first cover plate 10 and improving the service life of the first cover plate 10.

[0113] Exemplarily, the first sealing layer 11 and the second sealing layer 13 are made of the same material. This configuration is conducive to making the mechanical parameters of the first cover plate 10 symmetrical in the thickness direction (Z2 axis), so that the first cover plate 10 is not prone to curling.

[0114] Exemplarily, the thickness of the first sealing layer 11 is equal or substantially equal to the thickness of the second sealing layer 13. “Substantially equal” means that there may be a small deviation between the two, and the small deviation may, for example, mean that the difference in thickness between the two is less than 5% of the thickness of the smaller one, or may also mean that the difference in thickness between the two is less than 10% of the thickness of the smaller one.

[0115] In this example, it is also beneficial to make the mechanical parameters of the first cover plate 10 in the thickness direction (Z2 axis) symmetrical, so that the first cover plate 10 is not prone to curling.

[0116] Exemplarily, the thermal conductivity of the first material layer 12 is greater than or equal to 400 W / (m·k), for example, the thermal conductivity of the first material layer 12 may be 400 W / (m·k), 500 W / (m·k), 600 W / (m·k), 800 W / (m·k), etc. This arrangement enables the first cover plate 10 to have a higher thermal conductivity.

[0117] In some embodiments, the material of the first material layer 12 may include an organic polymer material, for example, the organic polymer material includes polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc.

[0118] In this example, the first material layer 12 can have better plasticity and higher elongation, so that the formed first cover plate 10 can be easily subjected to shaping processes such as stamping or hot pressing.

[0119] It is worth pointing out that the inventors of the present application have found that if the first cover plate 10 is directly provided to include only the first material layer 12, the material of the first material layer 12 includes an organic polymer material, although the weight can be reduced, the organic polymer material is composed of organic macromolecules, and the material itself has large pores. Therefore, the first cover plate 10 made of organic polymer material directly cannot guarantee long-term airtightness, and there will be problems of steam leakage. In addition, the organic polymer material is directly in contact with the working fluid (such as water) inside the accommodating cavity 50, and it is easy to chemically react to produce non-condensable gas. Non-condensable gas may accumulate in the cold zone of the accommodating cavity 50, causing its uniform temperature heat dissipation performance to decrease. In the embodiment of the present application, the first material layer 12 is sandwiched between the first sealing layer 11 and the second sealing layer 13. On the one hand, it can effectively reduce the total weight of the first cover plate 10 and realize a lightweight design; on the other hand, it can also play a good role in sealing and protecting the first material layer 12, thereby improving the life of the first cover plate 10 and enhancing the reliability of the first cover plate 10.

[0120] In addition, in some examples, the material of the first material layer 12 in the first cover plate 10 is an organic polymer material (such as PI), and the materials of the first sealing layer 11 and the second sealing layer 13 are both metals (such as copper). Among them, the organic polymer material has a small elastic modulus, a large elongation, and good toughness, but the structural strength is weak after plastic deformation and is prone to deformation. The metal has a large elastic modulus and a small elongation. It still has a high structural strength after plastic deformation, and has a high hardness and is not easy to deform. The embodiment of the present application can form a composite material of the first sealing layer 11, the first material layer 12 and the second sealing layer 13 into a first cover plate 10 including a buffer groove 70 and a protruding structure 71 through a plastic forming process (including cold pressing or hot pressing, etc.). The first cover plate 10 combines the advantages of large elongation and good toughness of organic polymer materials and high strength of metals, has a good buffering effect, and can protect the screen 1001.

[0121] Exemplarily, the ratio of the thickness of the first material layer 12 (dimension along the Z2 axis direction) to the total thickness of the first cover plate 10 (dimension along the Z2 axis direction) is greater than or equal to 20%. In this way, the first cover plate 10 has a good lightweight benefit. In addition, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 by compression molding, wrinkles or even breaks are not likely to occur.

[0122] For example, the ratio of the thickness of the first material layer 12 (dimension along the Z2 axis direction) to the total thickness of the first cover plate 10 (dimension along the Z2 axis direction) is greater than or equal to 24%. This configuration makes the lightweight benefit of the first cover plate 10 more obvious. In addition, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 by compression molding, wrinkles or even breaks are not likely to occur.

[0123] For example, the ratio of the thickness of the first material layer 12 (dimension along the Z2 axis direction) to the total thickness of the first cover plate 10 (dimension along the Z2 axis direction) is greater than or equal to 33%. This configuration makes the lightweight benefit of the first cover plate 10 more obvious. In addition, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 by compression molding, wrinkles or even breaks are not likely to occur.

[0124] Exemplarily, the thickness (dimension along the Z2 axis) of the first material layer 12 is greater than or equal to 5 μm. This configuration enables the first cover plate 10 to have a good lightweight benefit. In addition, when a plurality of protruding structures 71 are formed on the first cover plate 10 by compression molding, wrinkles or even breaks are not likely to occur.

[0125] Exemplarily, the thickness of the first material layer 12 is greater than or equal to 15 μm. This configuration makes the first cover plate 10 more lightweight. Furthermore, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 by compression molding, wrinkles or even breaks are not likely to occur.

[0126] It should be noted that the existing three-layer composite flexible copper clad laminate (FCCL) includes a middle substrate (such as PI) and copper layers on both sides, and the thickness of the copper layer does not exceed 0.05 mm. In some examples, the existing three-layer composite flexible copper clad laminate can be directly used to form a buffer groove 70 and a protruding structure 71 by compression molding to form a first cover plate 10 without customizing raw materials with special thickness specifications. This will be more conducive to reducing the cost of raw materials, thereby providing a low-cost, easy-to-mass-produce, and lightweight first cover plate 10. Exemplarily, in the three-layer composite flexible copper clad laminate, the thickness of the upper and lower copper layers can be 12μm, and the thickness of the middle layer can be 25μm.

[0127] Table 1 shows the density values ​​of several raw materials used to make the first cover plate (or the second cover plate) in the embodiments of the present application.

[0128] Table 1

[0129] raw materials model <![CDATA[Density [kg / m 3 > Copper Alloy C5191 8960 Stainless steel 316L 7874 Titanium Alloy TA1 4506 Polyimide (PI) - 1880 FCCL (two or three layers) PI ratio is greater than or equal to 30% 3000～6000

[0130] It can be seen from Table 1 that when the present application adopts a three-layer composite flexible copper clad laminate (FCCL) to form the first cover plate 10, the average density of the first cover plate 10 is smaller (ie, 3000-6000), so it is easier to achieve a lightweight design.

[0131] Next, the second cover plate 20 provided in some embodiments of the present application is described.

[0132] See also Fig.16 and Fig.17 , Fig.16 is a schematic structural diagram of a heat dissipation structure in an embodiment of the present application, Fig.17 FIG. 1 is a schematic diagram of another heat dissipation structure in an embodiment of the present application. Fig.16 and Fig.17 The difference lies in the different structure of the second cover plate. In some embodiments, the second cover plate 20 includes a third sealing layer 21 and a second material layer 22; the second material layer 22 is located on the side of the third sealing layer 21 away from the first cover plate 10; the yield point strain of the second material layer 22 is greater than the yield point strain of the third sealing layer 21.

[0133] In this embodiment, by setting the yield point strain of the second material layer 22 to be greater than the yield point strain of the third sealing layer 21, it is beneficial to improve the structural strength of the second cover plate 20, so that the second cover plate 20 is not prone to cracking. For example, when etching structures such as micro-pillars 32 and / or support pillars 43 on the surface of the third sealing layer 21 away from the second material layer 22, the base material thickness of the third sealing layer 21 can be etched to less than or equal to 0.03 mm without wrinkling or cracking. In addition, the unit weight of the second material layer 22 can be less than the unit weight of the third sealing layer 21. In this way, compared with a second cover plate of the same thickness and without the second material layer 22, the total weight of the second cover plate 20 can be reduced, and a lightweight design can be achieved.

[0134] For example, in the heat dissipation structure 100 provided in some embodiments of the present application, the design thickness of the first cover plate 10 may be not less than 0.03 mm, the design thickness of the wick 31 may be not less than 0.14 mm, and the design thickness of the second cover plate 20 may be not less than 0.03 mm. At this time, the total thickness of the heat dissipation structure 100 may be more than 0.2 mm, which is very thin. In some examples, the design thickness of the first cover plate 10 is 0.05 mm, the design thickness of the wick 31 is 0.15 mm, and the design thickness of the second cover plate 20 is 0.05 mm. At this time, the total thickness of the heat dissipation structure is 0.25 mm. In this example, the heat dissipation structure 100 is relatively thin, and the lightweight benefits are obvious. It can be understood that in Fig.16 and Fig.17 In the embodiment of , since the wick 31 is located in the second cover plate 20, the actual thickness of the second cover plate 20 is the design thickness of the second cover plate plus the design thickness of the wick 31. The total thickness of the heat dissipation structure 100 is the actual thickness of the second cover plate 20 plus the design thickness of the first cover plate 10. The "thickness" here refers to the size along the Z2 axis.

[0135] Exemplarily, the material of the third sealing layer 21 may include metal or ceramic. The metal may be pure copper, copper alloy, etc. In this example, the third sealing layer 21 has a relatively high structural strength and has good sealing performance and toughness. This is conducive to improving the structural strength of the second cover plate 20 and improving the service life of the second cover plate 20.

[0136] Exemplarily, the second sealing layer 13 is closer to the third sealing layer 21 than the first sealing layer 11; the material of the third sealing layer 21 is the same as that of the second sealing layer 13. Such a configuration is conducive to welding and sealing the third sealing layer 21 and the second sealing layer 13, that is, it is conducive to welding and fixing the first cover plate 10 and the second cover plate 20.

[0137] Exemplarily, the material of the second material layer 22 includes organic polymer materials, such as polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc.

[0138] In this example, the second material layer 22 can have good toughness, so that the second cover plate 20 has high structural strength and is less likely to wrinkle or even break.

[0139] Exemplarily, the ratio of the thickness of the second material layer 22 (dimension along the Z2 axis direction) to the total thickness of the second cover plate 20 (dimension along the Z2 axis direction) is greater than or equal to 50%. In this way, the second cover plate 20 has a good lightweight benefit. In addition, when etching structures such as micro-pillars 32 and / or support pillars 43 on the second cover plate 20, wrinkles or even breaks are not likely to occur.

[0140] In some examples, such as Fig.16 As shown, the second cover plate 20 has a placement groove 72 formed by molding on one side close to the first cover plate 10, and the wick 31 is placed in the placement groove 72. At this time, the second cover plate 20 may not be provided with micro-pillars 32.

[0141] In this example, since the second cover plate 20 has a second material layer 22 with better toughness, and the placement groove 72 formed by molding on the side of the second cover plate 20 close to the first cover plate 10 has a larger area, the structural strength of the second cover plate 20 is still relatively high and is not prone to wrinkles or even breakage.

[0142] It should be noted that the existing two-layer composite flexible copper clad laminate (FCCL) includes a substrate (such as PI) and a copper layer on one side of the substrate, and the thickness of the copper layer does not exceed 0.05 mm. In some examples, the existing two-layer composite flexible copper clad laminate can be directly used to form the placement groove 72 by compression molding to form the second cover plate 20 without customizing the raw material with a special thickness specification, which will be more conducive to reducing the cost of the raw material, thereby providing a low-cost, easy-to-mass-produce, and lightweight second cover plate 20.

[0143] As can be seen from the previous Table 2, when the present application uses two layers of composite flexible copper clad laminate (FCCL) to form the second cover plate 20, the average density of the second cover plate 20 is smaller (for example, 3000-6000), so it is easier to achieve lightweight design.

[0144] In other examples, such as Fig.17 As shown, the third sealing layer 21 has a groove 74 on one side close to the first cover plate 10, and the groove 74 includes a first groove portion 741 and a second groove portion 742, and the first groove portion 741 is close to the bottom wall of the groove 74 relative to the second groove portion 742. The second cover plate 20 also includes a plurality of columnar structures 73 located in the first groove portion 741, and the plurality of columnar structures 73 are connected to the bottom wall; the liquid absorbent core 31 is placed in the second groove portion 742; and the plurality of columnar structures 73 support the liquid absorbent core 31.

[0145] Exemplarily, the columnar structure 73 here may be the aforementioned support column 43 or micro column 32 .

[0146] For example, the columnar structure 73 can be formed by processes such as stamping, hot pressing, etching or electroplating.

[0147] In this solution, since the second cover plate 20 has a second material layer 22 with better toughness, the groove 74 located in the third sealing layer 21 can be formed by compression molding or etching. Regardless of the method, the structural strength of the second cover plate 20 formed is still relatively high. In addition, when the groove 74 is formed by etching, the multiple columnar structures 73 in the groove 74 can also be directly etched. When the groove 74 is formed by compression molding, the multiple columnar structures 73 in the groove 74 can be formed by dispensing. Such a setting is conducive to ensuring that the second cover plate 20 has sufficient structural strength.

[0148] In some other embodiments, see Fig.18 , Fig.18The schematic diagram of the structure of another heat dissipation structure 100 in the embodiment of the present application is shown in FIG. The second cover plate 20 in the heat dissipation structure 100 is made of metal material such as pure copper or copper alloy, and the thickness of the base material can be greater than 0.03 mm. In this way, wrinkles, cracks and deformations are not likely to occur.

[0149] On this basis, for example, Fig.18 As shown, a groove 74 including a first groove portion 741 and a second groove portion 742 may be provided on the second cover plate 20, and a plurality of columnar structures 73 and a liquid absorbent core 31 may be provided in the groove 74. The specific arrangement method may refer to the aforementioned content and will not be repeated here.

[0150] In some other embodiments, the second cover plate 20 may be arranged in the same manner as the first cover plate 10, which will not be described in detail herein. Fig.19 As shown, Fig.19 Schematic diagram of another heat dissipation structure 100 in an embodiment of the present application.

[0151] In some other embodiments, see Fig. 20 , Fig. 20 It is a structural schematic diagram of another heat dissipation structure 100 in the embodiment of the present application. The material of the second cover plate 20 of the heat dissipation structure 100 can use a double-layer / triple-layer metal composite material (such as the first metal layer 201, the second metal layer 202 and the third metal layer 203), such as copper steel, copper titanium, copper steel copper, copper titanium copper, copper aluminum copper, copper magnesium copper, copper (magnesium aluminum alloy) copper, etc. The composite material has a large strength, which can greatly improve the overall mechanical structural performance of the heat dissipation structure 100, avoid deformation of the heat dissipation structure 100 when it is squeezed, and improve the manufacturing yield of the heat dissipation structure 100 and the reliability of the whole machine. In addition, it is worth pointing out that the double-layer / triple-layer metal composite material provided in the embodiment of the present application is more suitable for the low-temperature process (such as 300 to 400 degrees Celsius) adopted by the first cover plate 10, that is, after the second cover plate 20 is formed, the second cover plate 20 is not easy to soften and can have a higher structural strength.

[0152] On this basis, for example, a plurality of columnar structures 73 can be pressed out on the second cover plate 20 through a shaping process such as stamping or hot pressing. At this time, the columnar structure 73 is equivalent to the support column 43, and a steam channel is formed between the plurality of columnar structures 73. The columnar structure 73 can make the heat dissipation structure 100 have a higher structural strength, so that the heat dissipation structure 100 is not easy to collapse and block the steam channel, and is therefore not easy to fail and has higher reliability.

[0153] In the above, the first cover plate 10, the second cover plate 20 and the absorbent core 31 (hereinafter referred to as the first absorbent core) are introduced, and the second absorbent core and the third absorbent core will be introduced hereinafter.

[0154] In some embodiments, see Fig.21 and Fig. 22 , Fig.21 A schematic diagram of the structure of a heat dissipation structure 100 provided in an embodiment of the present application in cooperation with a screen 1001 and a heating device 1003 is shown. Fig. 22 A schematic diagram of a combination of a first cover plate 10 and a second wick 33 provided in an embodiment of the present application. Among them, the adhesive layer 14 can be located on the side of the second cover plate 20 away from the first cover plate 10, that is, the adhesive layer 14 is bonded between the second cover plate 20 and the screen 1001. Microcolumns 32 and a first wick (i.e., wick 31) are arranged in the second cover plate 20. In addition, a second wick 33 is also arranged in the steam channel 51 between the second cover plate 20 and the first cover plate 10. One side surface of the second wick 33 contacts the first cover plate 10, and the other side surface contacts the first wick. The orthographic projection of the heating device 1003 in the X2-Y2 plane at least partially overlaps with the orthographic projection of the second wick 33 in the X2-Y2 plane. For example, the orthographic projection of the heating device 1003 in the X2-Y2 plane can be located within the orthographic projection of the second wick 33 in the X2-Y2 plane. With such arrangement, the heat of the heating device 1003 can be directly transferred to the second liquid absorbent core 33 through the first cover plate 10, and then transferred from the second liquid absorbent core 33 to the first liquid absorbent core. Compared with the heat transferred to the first liquid absorbent core through the steam channel 51, the thermal resistance is smaller and the temperature uniformity performance is better.

[0155] refer to Fig. 22 It can be known that the second absorbent core 33 can expose the support column 43 on the first cover plate 10 , that is, the second absorbent core 33 can have a through hole penetrating along the Z2 direction, and the through hole is used to pass the support column 43 .

[0156] In some embodiments, see Fig.23 , Fig.23 A schematic structural diagram of another heat dissipation structure 100 provided in an embodiment of the present application. Fig.23 and Fig.19 The difference is that the first absorbent core arranged in series is replaced by the third absorbent core 34 arranged in parallel. The first absorbent core mentioned above can be regarded as a serial capillary solution. Fig.23 In the embodiment, a plurality of third absorbent cores 34 may be provided, wherein two opposite surfaces of each third absorbent core 34 along the Z2 axis direction are in contact with the first cover plate 10 and the second cover plate 20 respectively, and the plurality of third absorbent cores may be arranged at intervals along the X2 direction.

[0157] The material and structure of the second absorbent core 33 and the third absorbent core 34 may be the same as those of the aforementioned absorbent core 31 , and will not be described in detail herein.

[0158] The embodiment of the present application also provides a method for preparing the heat dissipation structure 100, which is specifically as follows: S1, selecting a suitable cover plate raw material; S2, stamping, cutting, etching, etc. the cover plate raw material to form the first cover plate 10 and the second cover plate 20 as described above; S3, welding and fixing the liquid wick 31 to the second cover plate 20 (exemplarily, the welding temperature is less than 300 degrees); S4, welding or bonding a conduit (not shown) between the first cover plate 10 and the second cover plate 20, and welding and fixing the edge of the first cover plate 10 and the edge of the second cover plate 20 (exemplarily, the edge of the second sealing layer 13 and the edge of the third sealing layer 21 as described above can be welded and fixed). S5, detect whether there is leakage between the first cover plate 10 and the second cover plate 20 after welding; S6, change the hydrophobic surface of the liquid wick 31 and the microcolumn 32 into a hydrophilic surface through a reduction reaction (such as a high-temperature reduction reaction, such as about 300 degrees), for example, change its material from copper oxide to copper, so that it has capillary water absorption; S7, inject the working fluid into the containing cavity through the catheter, and evacuate; S8, cut the catheter and seal it to form a closed containing cavity; S9, perform an aging test, such as placing it in a high-temperature box for a predetermined period of time; S10, perform a sealing test on the heat dissipation structure (such as a helium test); S11, other performance experiments, such as testing the thermal conductivity of the heat dissipation structure.

[0159] Exemplarily, the glass transition temperature Td of the first material layer 12 and the second material layer 22 is ≥ 320 degrees. In this way, during the process of preparing the first cover plate 10 and the second cover plate 20, the first material layer 12 and the second material layer 22 can maintain good physical properties.

[0160] The present application also provides another heat dissipation structure 100. Fig.24 , Fig.24 A schematic diagram of another heat dissipation structure 100 provided in an embodiment of the present application in cooperation with a screen 1001. The heat dissipation structure 100 includes a fourth sealing layer 101, a third material layer 102, and a fifth sealing layer 103; along the first direction (Z2 axis direction), the third material layer 102 is located between the fourth sealing layer 101 and the fifth sealing layer 103; the material of the third material layer 102 includes at least one of a graphite material and a graphene material; the heat dissipation structure 100 has a plurality of buffer grooves 70 arranged at intervals; the position of the third material layer 102 corresponding to the buffer groove 70 includes elastic deformation and / or plastic deformation.

[0161] In another heat dissipation structure provided in an embodiment of the present application, since the material of the third material layer 102 includes at least one of a graphite material and a graphene material, and the position corresponding to the buffer groove 70 in the third material layer 102 includes elastic deformation and / or plastic deformation, the heat dissipation structure 100 has a good heat dissipation and temperature equalization effect, especially at the position of the heat dissipation structure 100 corresponding to the buffer groove 70, heat accumulation is not likely to occur. In addition, since the fourth sealing layer 101 and the fifth sealing layer 103 are respectively provided on the opposite sides of the third material layer 102, on the one hand, the third material layer 102 can be well sealed and protected, so that the third material layer 102 is not easy to collapse, thereby providing a good buffer support for the screen 1001, preventing the screen 1001 from having failure problems such as light and shadow, black spots, mold printing, bright spots, green lines, and fragmentation, and it is not easy to weaken the uniform temperature heat dissipation capacity of the heat dissipation structure 100 due to the collapse of the third material layer 102, thereby improving the life of the heat dissipation structure 100 and enhancing the reliability of the heat dissipation structure 100; on the other hand, since a relatively symmetrical structure can be formed, the flatness of the heat dissipation structure 100 can be better, for example, since the mechanical material parameters such as the modulus of the material in the thickness direction of the heat dissipation structure 100 are more symmetrical, the heat dissipation structure 100 is not easy to curl. In addition, the third material layer 102 is lighter in weight, which is also conducive to reducing the total weight of the heat dissipation structure 100 and achieving a lightweight design.

[0162] In some embodiments, the thermal conductivity of the third material layer 102 is greater than or equal to 400 W / (m·k). This configuration enables the heat dissipation structure 100 to have a higher thermal conductivity.

[0163] In some embodiments, the material of at least one of the fourth sealing layer 101 and the fifth sealing layer 103 includes copper. This configuration can provide better sealing and protection for the third material layer 102 and has higher heat dissipation efficiency.

[0164] Continue reading Fig.24 A glue layer 14 may be added between the heat dissipation structure 100 and the screen 1001. By providing the glue layer 14, the heat dissipation structure 100 can be bonded and fixed to the screen 1001. In addition, when the heat dissipation structure 100 and the screen 1001 are bonded and fixed, since the heat dissipation structure 100 has a buffer groove 70, the buffer groove 70 can also be used to prevent the glue layer between the screen and the heat dissipation structure 100 from debonding and failing due to shear stress.

[0165] also, Fig.24 The configuration of the buffer groove 70 in the heat dissipation structure 100 in the embodiment can refer to the description of the buffer groove 70 on the first cover plate 10, which will not be repeated here. In addition, the buffer groove 70 here can also be filled with the first filler 44 and / or the second filler 45 mentioned above.

[0166] In summary, the heat dissipation structure provided in the embodiment of the present application has at least the following advantages:

[0167] 1. Since a buffer groove 70 is provided on the first cover plate 10, the position corresponding to the buffer groove 70 in the first material layer 12 includes elastic deformation, and the buffer groove 70 can absorb stress, so that the first cover plate 10 is more flexible and will not have excessive rebound force, that is, the screen 1001 will not have failure problems such as light and shadow, black spots, mold printing, bright spots, green lines, and fragmentation due to excessive rebound force.

[0168] Second, since the material of the third material layer 102 includes at least one of a graphite material and a graphene material, and the position of the third material layer 102 corresponding to the buffer groove 70 includes elastic deformation and / or plastic deformation, the formed heat dissipation structure 100 has a good heat dissipation and temperature uniformity effect, especially the position of the heat dissipation structure 100 corresponding to the buffer groove 70 is not prone to heat accumulation. In addition, the screen can be protected and lightweight.

[0169] Third, by disposing the first filler 44 and / or the second filler 45 in the buffer groove, it is beneficial to further improve the thermal conductivity and buffer protection capabilities of the first cover plate 10.

[0170] Fourth, when the first cover plate 10 includes the first material layer 12, the average density of the first cover plate 10 is low, which is conducive to reducing the weight of the first cover plate 10. When the second cover plate 20 includes the second material layer 22, the average density of the second cover plate 20 is low, which is conducive to reducing the weight of the second cover plate 20.

[0171] Fifth, the first cover plate 10 can be directly molded by using a three-layer composite flexible copper clad laminate FCCL, and the second cover plate 20 can be directly molded by using a two-layer composite flexible copper clad laminate FCCL. This can reduce the cost of raw materials and make it easier to mass produce.

[0172] 6. The heat dissipation structure shell made of copper alloy, the heat dissipation structure shell made of stainless steel, and the heat dissipation structure shell made of titanium alloy have a maximum process temperature of about 800°C (annealing, sintering), while the heat dissipation structure 100 containing the first material layer 12 and / or the second material layer 22 in the embodiment of the present application has a maximum temperature of about 300°C in the entire process, which can protect the copper layer and other metal layer materials to have good yield strength and fracture strength, so that the heat dissipation structure 100 is not prone to wrinkling, deformation, or cracking after being squeezed or collided.

[0173] 7. Since the first cover plate 10 in the heat dissipation structure 100 may include an insulating first material layer 12 (such as PI), and the second cover plate 20 may include an insulating second material layer 22 (such as PI), the heat dissipation structure 100 can be fully insulated or partially insulated on the side facing the middle frame, thereby avoiding the problem of radiated spurious emission (RSE) of heat in the heat dissipation structure 100.

[0174] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation structure, characterized in that: It comprises a first cover plate, a second cover plate and a liquid absorbing structure; the first cover plate and the second cover plate are connected to each other to enclose a receiving cavity; the liquid absorbing structure is located in the receiving cavity; The heat dissipation structure has a first area and a second area; the liquid absorption structure extends from the first area to the second area; the accommodating cavity also has a steam channel, and the steam channel extends from the second area to the first area; The first cover plate comprises a first sealing layer, a first material layer and a second sealing layer; the first material layer is located between the first sealing layer and the second sealing layer; the first cover plate is provided with a plurality of buffer grooves arranged at intervals; the position of the first material layer corresponding to the buffer groove comprises elastic deformation; The yield point strain of the first material layer is greater than the yield point strain of the first sealing layer, and greater than the yield point strain of the second sealing layer; positions of the first sealing layer and the second sealing layer corresponding to the buffer groove include plastic deformation.

2. The heat dissipation structure according to claim 1, characterized in that: At least a portion of the buffer groove has a top opening facing toward a side of the first cover plate away from the second cover plate.

3. The heat dissipation structure according to claim 1 or 2, characterized in that: The shape of any of the buffer grooves includes any one of a circle, a polygon, a straight bar and a wavy bar.

4. The heat dissipation structure according to claim 1 or 2, characterized in that: The first cover plate further comprises: A first filler is located in at least one of the buffer grooves; the material of the first filler includes an organic polymer material.

5. The heat dissipation structure according to claim 1 or 2, characterized in that: The first cover plate further comprises: A second filler is located in at least one of the buffer slots; the material of the second filler includes a phase change energy storage material.

6. The heat dissipation structure according to claim 1 or 2, characterized in that: A ratio of the thickness of the first material layer to the total thickness of the first cover plate is greater than or equal to 20%.

7. The heat dissipation structure according to claim 1 or 2, characterized in that: The thickness of the first sealing layer is equal to or substantially equal to the thickness of the second sealing layer.

8. The heat dissipation structure according to claim 1, characterized in that: The material of the first material layer includes an organic polymer material; The material of at least one of the first sealing layer and the second sealing layer includes at least one of metal and ceramic.

9. The heat dissipation structure according to claim 1, characterized in that: The second cover plate includes a third sealing layer and a second material layer; the second material layer is located on a side of the third sealing layer away from the first cover plate; and the yield point strain of the second material layer is greater than the yield point strain of the third sealing layer.

10. The heat dissipation structure according to claim 9, characterized in that: The material of the second material layer includes an organic polymer material; The material of the third sealing layer includes at least one of metal and ceramic.

11. The heat dissipation structure according to claim 9 or 10, characterized in that: The second sealing layer is closer to the third sealing layer than the first sealing layer; The material of the third sealing layer is the same as that of the second sealing layer.

12. The heat dissipation structure according to claim 9 or 10, characterized in that: The third sealing layer has a groove on one side close to the first cover plate, the groove includes a first groove portion and a second groove portion, the first groove portion is close to the bottom wall of the groove relative to the second groove portion; The second cover plate further comprises a plurality of columnar structures located in the first groove portion, wherein the plurality of columnar structures are connected to the bottom wall; the liquid absorbing structure comprises a liquid absorbing core, and the liquid absorbing core is placed in the second groove portion; The plurality of columnar structures supports the wick.

13. The heat dissipation structure according to claim 8 or 10, characterized in that: The organic polymer material includes at least one of PI, PP, PTFE, PET, PEN, PDMS, PE, PPC, PVC, PVdC, PS, and PA; The metal includes copper.

14. The heat dissipation structure according to claim 1 or 2, characterized in that: A side of the second cover plate close to the first cover plate is provided with a molded placement groove, and the liquid absorbing structure comprises a liquid absorbing core, and the liquid absorbing core is placed in the placement groove.

15. The heat dissipation structure according to claim 1 or 2, characterized in that: The second cover plate includes at least two stacked metal layers.

16. The heat dissipation structure according to claim 15, characterized in that: The at least two metal layers include any one of copper-steel, copper-titanium, copper-steel-copper, copper-titanium-copper, copper-aluminum-copper, copper-magnesium-copper, and copper (magnesium-aluminum alloy)-copper.

17. A heat dissipation structure, characterized in that: It includes a fourth sealing layer, a third material layer and a fifth sealing layer; along the first direction, the third material layer is located between the fourth sealing layer and the fifth sealing layer; the material of the third material layer includes at least one of a graphite material and a graphene material; the heat dissipation structure has a plurality of buffer grooves arranged at intervals; the position of the third material layer corresponding to the buffer groove includes elastic deformation.

18. The heat dissipation structure according to claim 17, characterized in that: The thermal conductivity of the third material layer is greater than or equal to 400 W / (m·k).

19. The heat dissipation structure according to claim 17 or 18, characterized in that: A material of at least one of the fourth sealing layer and the fifth sealing layer includes copper.

20. An electronic device, characterized in that: include: Screen and heating components; as well as, The heat dissipation structure according to any one of claims 1 to 19, is located between the screen and the heat generating device.

21. The electronic device according to claim 20, characterized in that: include: The adhesive layer is located between the heat dissipation structure and the screen.

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