Light emitting panel and light emitting device

Abstract

The application discloses a light-emitting panel and a light-emitting device. The light-emitting panel comprises a substrate, the substrate comprises a light-emitting area and a peripheral area surrounding the light-emitting area, and a blocking structure is arranged on the peripheral area. The blocking structure comprises a plurality of blocking columns arranged at intervals, each of the blocking columns comprises a pixel definition layer and a raised structure stacked. A wiring layer, a pixel definition layer, a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer are sequentially arranged on the light-emitting area. The raised structure comprises a first raised structure and / or a second raised structure. The application provides a light-emitting panel and a device with high reliability.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic technology, and more particularly to a light-emitting panel and a light-emitting device. Background Technology

[0002] In light-emitting panels, an organic encapsulation layer is often required in the light-emitting area to protect the light-emitting material and ensure a flat surface.

[0003] However, since the organic encapsulation layer is made of organic materials, it is relatively thick, and organic materials have high fluidity during the manufacturing process. Therefore, a barrier structure is needed to prevent the organic material from overflowing. However, with the increasing demand for cost reduction and thinner panels, the thickness of the raw material layer used to prepare the barrier structure is difficult to meet the requirements, causing organic materials to easily overflow into the surrounding areas of the panel and cause pollution. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed to provide a light-emitting panel and light-emitting device that overcome or at least partially solve the above problems.

[0005] In a first aspect, a light-emitting panel is provided, comprising:

[0006] A substrate, the substrate comprising a light-emitting region and a peripheral region surrounding the light-emitting region, wherein a blocking structure is disposed on the peripheral region;

[0007] The blocking structure includes a plurality of blocking pillars spaced apart, each blocking pillar including a stacked pixel definition layer and a height-increasing structure; the height-increasing structures are spaced apart to increase the height of the blocking pillars and increase the gap size between adjacent blocking pillars.

[0008] The light-emitting area is sequentially provided with a wiring layer, a pixel definition layer, a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer.

[0009] The height-enhancing structure includes: a first height-enhancing structure and / or a second height-enhancing structure; the first height-enhancing structure is located on the side of the pixel definition layer closest to the substrate, and the first height-enhancing structure is on the same layer as the wiring layer; the second height-enhancing structure is located on the side of the pixel definition layer furthest from the substrate, and the second height-enhancing structure is on the same layer as the first inorganic encapsulation layer.

[0010] Optionally, the heightening layer includes the first heightening structure, which includes three stacked metal layers, wherein the size of the middle metal layer in a first direction is less than or equal to the size of the metal layers on both sides in the first direction, and the two ends of the first direction point to the light-emitting area and the peripheral area, respectively.

[0011] Optionally, the heightening layer includes the second heightening structure; in each of the blocking pillars, the size of the surface of the second heightening structure that contacts the pixel definition layer is smaller than the size of the surface of the pixel definition layer that contacts the second heightening structure.

[0012] Optionally, the pixel definition layers at the blocking structure are spaced apart, and the thickness of the pixel definition layers at the blocking structure is at least 5000 angstroms.

[0013] Optionally, the blocking structure includes at least five blocking pillars; the height of the top of each blocking pillar relative to the surface of the substrate is at least 50 micrometers.

[0014] Optionally, the light-emitting area includes a substrate, and a wiring layer and a pixel definition layer sequentially disposed on the substrate, wherein the pixel definition layer is made of an inorganic material.

[0015] Optionally, the light-emitting area further includes: a first electrode, the first electrode being located on the side of the pixel definition layer near the substrate; wherein the wiring layer is located between the first electrode layer and the pixel definition layer.

[0016] Optionally, the peripheral area further includes a sensor, and the blocking structure is disposed between the sensor and the light-emitting area.

[0017] In a second aspect, a light-emitting device is provided, comprising the light-emitting panel described in any of the first aspects.

[0018] Optionally, the light-emitting device is a taillight.

[0019] The technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages:

[0020] The light-emitting panel and light-emitting device provided in this embodiment of the invention include a blocking structure comprising multiple blocking pillars. In addition to a pixel definition layer forming the blocking pillars, a heightening structure is added at each blocking pillar. The spaced-apart heightening structures increase the height of each blocking pillar and the capacity of the gaps between adjacent pillars, thereby increasing the blocking ability against organic materials in the light-emitting area and preventing organic pollution caused by their overflow. Furthermore, the heightening structure includes a first heightening structure and / or a second heightening structure. The first heightening structure is on the same layer as the wiring layer, and the second heightening structure is on the same layer as the first inorganic encapsulation layer, ensuring compatibility with existing processes and simplifying the manufacturing process. Attached Figure Description

[0021] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0022] Figure 1 This is a schematic diagram of the structure of the light-emitting panel in an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of the light-emitting panel in an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the light-emitting panel in an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the I-shaped height-increasing structure in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of the light-emitting panel in an embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the discontinuity-type height-increasing structure in an embodiment of the present invention;

[0028] Figure 7 This is a schematic diagram of the structure of the light-emitting panel in an embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of the structure of the light-emitting area of ​​a light-emitting panel in the prior art;

[0030] Figure 9 This is a schematic diagram of the structure of the light-emitting area of ​​the light-emitting panel in an embodiment of the present invention;

[0031] Figure 10 This is a schematic diagram of the structure of the light-emitting panel integrating the sensor in an embodiment of the present invention;

[0032] Figure 11 This is a structural diagram of the light-emitting device in an embodiment of the present invention. Detailed Implementation

[0033] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0034] The accompanying drawings illustrate various structural schematics according to embodiments of the present disclosure. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0035] In the context of this disclosure, when a layer / element is referred to as being "above" another layer / element, the layer / element may be directly above the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "above" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0036] This application provides a light-emitting panel, such as... Figures 1-7 As shown, it includes: a substrate 3, the substrate 3 includes a light-emitting region 1 and a peripheral region 2 surrounding the light-emitting region 1, and a blocking structure 4 is provided on the peripheral region 2;

[0037] The blocking structure 4 includes a plurality of blocking pillars 41 spaced apart. Each blocking pillar 41 includes a stacked pixel definition layer 411 and a heightening structure 412. The heightening structures 412 are spaced apart to increase the height of the blocking pillars 41 and increase the gap size between adjacent blocking pillars 41.

[0038] A wiring layer 5, a pixel definition layer 411, a first inorganic encapsulation layer 6, an organic encapsulation layer 7, and a second inorganic encapsulation layer 8 are sequentially disposed on the light-emitting area 1.

[0039] The height enhancement structure 412 includes: a first height enhancement structure and / or a second height enhancement structure; the first height enhancement structure is located on the side of the pixel definition layer 411 close to the substrate 3, and the first height enhancement structure is on the same layer as the wiring layer 5; the second height enhancement structure is located on the side of the pixel definition layer 411 away from the substrate 3, and the second height enhancement structure is on the same layer as the first inorganic encapsulation layer 6.

[0040] It should be noted that the light-emitting panel can be an organic light-emitting diode (OLED) panel or an electroluminescent (EL) panel. There are no restrictions here. As long as there is a need to prevent the material from overflowing from the light-emitting area 1, the light-emitting panel structure provided in this application can be used.

[0041] Please refer to Figure 1This is a schematic diagram of the light-emitting panel provided in an embodiment of this application. The left diagram shows the positions of the light-emitting area 1 and the peripheral area 2. The right diagram is an enlarged view of the area within the dashed box on the left. It can be seen that the peripheral area 2 surrounds the light-emitting area 1, and a blocking structure 4 is provided on the peripheral area 2. Multiple blocking pillars 41 are spaced apart in the blocking structure 4 to prevent the organic material of the light-emitting area 1 from overflowing during the preparation process. In optional embodiments, it can be as follows... Figure 1 As shown in the bold line, the blocking structure 4 is arranged in a ring around the light-emitting area 1, and the corresponding blocking pillars 41 are ring-shaped pillar walls. Multiple blocking pillars 41 are arranged in a spaced-out nested pattern. Of course, the blocking structure 4 can also be set on one or more sides of the peripheral area 2, and there is no limitation here.

[0042] Please refer to Figures 2-7 , Figures 2-7 All along Figure 1 The cross-sectional structure diagram of section A-A'. Figures 2-7 On the left-hand light-emitting area 1, a wiring layer 5, a pixel definition layer 411, a first inorganic encapsulation layer 6, an organic encapsulation layer 7, and a second inorganic encapsulation layer 8 are sequentially arranged. The blocking structure 4 can be used to prevent the organic material of the organic encapsulation layer 7 from overflowing into the surrounding area.

[0043] Figure 2 In the illustrated light-emitting panel, each blocking pillar 41 includes a pixel definition layer 411, and the surface of the blocking structure 4 is covered with a continuous first inorganic encapsulation layer 6. However, since the first inorganic encapsulation layer 6 continuously covers the surface of the blocking structure 4, the height of the blocking pillar 41 relative to the organic encapsulation layer 7 is only the height of the pixel definition layer 411. Since the height that can be fabricated for the pixel definition layer 411 is limited, during the fabrication of the organic encapsulation layer 7 using inkjet printing (IJP) technology, Figure 2 The barrier structure 4 shown does not effectively block organic materials, posing a high risk of organic material spillage.

[0044] This application configures each blocking pillar 41 to include a stacked pixel definition layer 411 and a heightening structure 412. The heightening structures 412 are spaced apart to increase the height of the blocking pillars 41 and the gap size between adjacent blocking pillars 41, thereby increasing the blocking effect on the organic material of the light-emitting area 1. In specific implementations, there are several options for configuring the heightening structures; two examples are listed below:

[0045] The first type, height-increasing structure 412, is the first height-increasing structure.

[0046] like Figure 3As shown, the first augmentation structure is located on the side of the pixel definition layer 411 closest to the substrate 3, and it is on the same layer as the wiring layer 5. That is, the first augmentation structure on the peripheral region 2 and the wiring layer 5 in the light-emitting region 1 are the same layer structure formed using the same material and the same process steps. In the same patterning process step that patterns the wiring material layer of the light-emitting region 1 to form the wiring layer 5 as a signal transmission line structure, patterning is also performed on the peripheral region 2 to form the spaced-apart first augmentation structures. The wiring layer 5 is made of a conductor material, such as various conductive metals or metal compounds.

[0047] Specifically, the fabrication steps can be as follows: first, a wiring material layer is formed using processes such as vapor deposition or sputtering; then, the wiring material layer is patterned using photolithography to form a wiring layer 5 in the light-emitting region 1 and a first heightening structure spaced apart on the peripheral region 2; then, a pixel definition layer 411 is formed covering the wiring layer 5 and the first heightening structure; then, the pixel definition layer 411 is patterned using photolithography to form a light-emitting material definition structure on the light-emitting region 1 and a pixel definition layer 411 stacked on the first heightening structure spaced apart on the peripheral region 2, forming multiple spaced blocking pillars 4. 1; Next, prepare a light-emitting material layer and form a first inorganic encapsulation layer 6 to cover and protect the light-emitting material layer and the blocking pillars 41; Then, prepare an organic encapsulation layer 7 using IJP technology, and block the overflow of organic material by forming multiple spaced blocking pillars 41 through the stacking of the first enhancement layer and the pixel definition layer 411. Even if the first blocking pillar 41 does not completely block the organic material, the gaps between the blocking pillars 41 can accommodate and block the organic material overflowing from the first blocking pillar 41, avoiding contamination of the surrounding area 2; Finally, form a second inorganic encapsulation layer 8 to cover the organic encapsulation layer 7 and the blocking structure 4.

[0048] By setting a graphical first heightening structure to increase the height of the blocking pillar 41, the blocking ability against organic materials can be effectively improved, ensuring reliability. Furthermore, the first heightening structure is fabricated in the same layer as the wiring layer 5, ensuring compatibility with existing processes and simplifying the process.

[0049] In optional implementations, it is also possible to... Figure 4As shown, the first heightening structure includes three stacked metal layers. The middle metal layer 401, located in the middle, has a smaller dimension in the first direction than the side metal layers 402 located on both sides in the first direction. The two ends of the first direction point to the light-emitting area 1 and the peripheral area 2, respectively. By reducing the dimension of the middle metal layer 401 in the first direction, an "I-shaped" first heightening structure can be formed, resulting in a concave space at the bottom of the blocking pillar 41. This increases the gap between adjacent blocking pillars 41, allowing for the containment of more overflowing organic material and increasing the blocking capability of the blocking pillars 41. For example, the three metal layers can be a multi-layered metal structure such as titanium-aluminum-titanium or molybdenum-aluminum-molybdenum.

[0050] Of course, in specific implementation, when the first heightening structure includes three stacked metal layers, the dimension of the middle metal layer 401 in the first direction can also be set to be equal to the dimension of the side metal layers 402 located on both sides in the first direction; no limitation is made here. Secondly, the heightening structure 412 is a second heightening structure.

[0051] like Figure 5 As shown, the second augmentation structure is located on the side of the pixel definition layer 411 away from the substrate 3, and the second augmentation structure is on the same layer as the first inorganic encapsulation layer 6. That is, the second augmentation structure on the peripheral region 2 and the first inorganic encapsulation layer 6 on the light-emitting region 1 are the same layer structure formed using the same material and the same process steps. After forming the first inorganic encapsulation layer 6 that covers and protects the light-emitting region 1, patterning is performed on the peripheral region 2 to form spaced-alternating second augmentation structures. The first inorganic encapsulation layer 6 is an inorganic material, such as silicon oxide or silicon nitride.

[0052] Specifically, the fabrication steps can be as follows: First, a wiring material layer is formed using processes such as vapor deposition or sputtering; then, the wiring material layer is patterned using photolithography to form a wiring layer 5 on the light-emitting region 1; then, a pixel definition layer 411 is formed covering the wiring layer 5; then, the pixel definition layer 411 is patterned using photolithography to form a light-emitting material definition structure on the light-emitting region 1 and spaced pixel definition layers 411 are formed on the peripheral region 2; then, a light-emitting material layer is fabricated, and a first inorganic encapsulation layer 6 is formed to cover and protect the light-emitting material layer and the barrier pillars 41; next, the first inorganic encapsulation layer 6 is patterned using photolithography to form a second augmentation structure that is spaced apart and stacked on top of the pixel definition layers 411; then, an organic encapsulation layer 7 is fabricated using IJP technology, and multiple spaced barrier pillars 41 formed by the stacking of the second augmentation layer and the pixel definition layers 411 are used to prevent the overflow of organic material and avoid contamination of the peripheral region 2; finally, a second inorganic encapsulation layer 8 is formed to cover the organic encapsulation layer 7 and the barrier structure 4.

[0053] By setting a graphical second heightening structure to increase the height of the blocking pillar 41, the blocking ability against organic materials can be effectively improved, ensuring reliability. Furthermore, the second heightening structure is fabricated in the same layer as the first inorganic encapsulation layer 6, ensuring compatibility with existing processes and simplifying the manufacturing process.

[0054] In optional implementations, it is also possible to... Figure 6 As shown, in each blocking post 41, the size of the surface of the second augmenting structure that contacts the pixel definition layer 411 is smaller than the size of the surface of the pixel definition layer 411 that contacts the second augmenting structure, thus creating a discontinuity. By creating this discontinuity, the top of the blocking post 41 becomes stepped, increasing the gap between adjacent blocking posts 41, which can accommodate more overflowing organic material and increase the blocking ability of the blocking post 41.

[0055] Of course, in the specific implementation process, the height-increasing structure 412 is not limited to the two situations mentioned above. For example, it can also be as follows: Figure 7 The height-increasing structure 412 includes both the first height-increasing structure 701 and the second height-increasing structure 702.

[0056] In an optional embodiment, the height of the blocking pillars 41 can be further increased by setting the pixel definition layers 411 at intervals at the blocking structure 4 and setting the thickness of the pixel definition layers 411 at the blocking structure 4 to be at least 5000 angstroms. By combining the heightening structure 412 with the additional pixel definition layers 411, the height of the top of the blocking pillar 41 relative to the surface of the substrate 3 can be at least 50 micrometers, so as to completely block organic materials and ensure the reliability of the light-emitting panel. Optionally, the number of blocking pillars can be increased, for example, setting the blocking structure 4 to include at least 5 blocking pillars 41 to enhance the blocking capability.

[0057] In an optional implementation, the pixel definition layer 411 of the light-emitting region 1 can also be made of an inorganic material (e.g., SiO or SiN). Since the pixel definition layer 411 is an inorganic material, it can cover and protect the wiring layer 5, preventing damage to the wiring layer 5 from subsequent processes. Therefore, it is possible to remove... Figure 8 The insulating protective layer 801 in the light-emitting area of ​​the existing light-emitting panel shown reduces the thickness of the light-emitting panel, eliminates the need for the preparation process of the insulating protective layer, saves costs, enhances the protection effect on the light-emitting material, and increases its service life.

[0058] After removing the insulating protective layer 801, considering that during the patterning process of forming the electrode, the etching solution of the electrode material can cause a displacement reaction between the electrode and the aluminum in the wiring layer 5, resulting in In+ precipitation and damage to the wiring layer 5, this application can also improve the structure of the light-emitting region 1 to place the wiring layer 5 after the electrode, thereby avoiding damage to the wiring layer 5. Specifically, it can be done as follows: Figure 9As shown, the light-emitting area 1 also includes a first electrode 901, which is located on the side of the pixel definition layer 411 closest to the substrate 3. The wiring layer 5 is located between the first electrode 901 and the pixel definition layer 411. By placing the wiring layer 5 above the first electrode 901 below the pixel definition layer 411, the wiring layer 5 is fabricated after the first electrode 901 is fabricated, thus avoiding damage to the wiring layer 5 during the image fabrication of the first electrode 901. Furthermore, the pixel definition layer 411, fabricated from inorganic materials, covering the wiring layer 5 also protects the wiring layer 5, preventing damage from subsequent processes.

[0059] Since the pixel definition layer 411 is prepared using inorganic materials, the thickness that can be prepared is limited by the preparation process of inorganic materials. This will result in the pixel definition layer 411 at the blocking structure 4 being thinned. In order to ensure the blocking effect, it is necessary to combine the solution of setting the heightening structure 412 and the pixel definition layer 411 to form the blocking pillar 41 provided in the embodiment of this application to ensure the blocking effect on organic materials. In this way, the reliability is guaranteed while reducing the thickness and saving costs.

[0060] In alternative implementations, such as Figure 10 As shown, the peripheral area 2 can also include: a sensor 1001, and a blocking structure 4 is provided between the sensor 1001 and the light-emitting area 1. Specifically, the sensor 1001 can be configured as follows: Figure 10 As shown, an opening is provided in the peripheral area, and the sensor 1001 is placed in the opening. It can be located below the transparent substrate 3 for protection, or it can be located above the substrate 3. No restriction is made here.

[0061] In practical implementation, sensor 1001 can be placed in the corner area of ​​the light-emitting panel, and a blocking structure 4 can be set around sensor 1001 for protection. Please refer to... Figure 1 It can Figure 1 The central dashed triangular area is not equipped with light-emitting material; instead, it is equipped with sensor 1001 to achieve more control functions in conjunction with the light-emitting area 1. For example, when the light-emitting panel is a taillight panel, the sensor can be set as radar to save radar installation space; when the light-emitting panel is an interior lighting panel, the sensor can be set as a light sensor, voice sensor, or facial recognition sensor to control the opening state of the light-emitting panel based on the sensed information.

[0062] Based on the same inventive concept, embodiments of the present invention also provide a light-emitting device, such as... Figure 11 As shown, it includes the light-emitting panel 1101 provided in the embodiment of the present invention.

[0063] In an optional implementation, the light-emitting device can be a taillight, an interior lighting device, or the like.

[0064] The technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages:

[0065] The light-emitting panel and light-emitting device provided in this embodiment of the invention include a blocking structure comprising multiple blocking pillars. In addition to a pixel definition layer forming the blocking pillars, a heightening structure is added at each blocking pillar. The spaced-apart heightening structures increase the height of each blocking pillar and the capacity of the gaps between adjacent pillars, thereby increasing the blocking ability against organic materials in the light-emitting area and preventing organic pollution caused by their overflow. Furthermore, the heightening structure includes a first heightening structure and / or a second heightening structure. The first heightening structure is on the same layer as the wiring layer, and the second heightening structure is on the same layer as the first inorganic encapsulation layer, ensuring compatibility with existing processes and simplifying the manufacturing process.

[0066] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0067] Similarly, it should be understood that, in order to simplify this disclosure and aid in understanding one or more of the various aspects of the invention, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof. However, this method of disclosure should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the following claims, inventive aspects lie in fewer than all features of a single foregoing disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into this detailed description, wherein each claim itself is a separate embodiment of the invention.

[0068] Those skilled in the art will understand that modules in the apparatus of the embodiments can be adaptively changed and placed in one or more apparatuses different from that embodiment. Modules, units, or components in the embodiments can be combined into a single module, unit, or component, and further, they can be divided into multiple sub-modules, sub-units, or sub-components. Except where at least some of such features and / or processes or units are mutually exclusive, any combination can be used to combine all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or apparatus so disclosed. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0069] Furthermore, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the following claims, any of the claimed embodiments can be used in any combination.

[0070] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of components or steps not listed in the claims. The word "a" or "an" preceding a component does not exclude the presence of a plurality of such components. The invention can be implemented by means of hardware comprising several different components and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

Claims

1. A light-emitting panel, characterized in that, include: A substrate, the substrate including a light-emitting region and a peripheral region surrounding the light-emitting region, wherein a blocking structure is disposed on the peripheral region; The blocking structure includes a plurality of blocking pillars spaced apart, each blocking pillar including a stacked pixel definition layer and a height-increasing structure; the height-increasing structures are spaced apart to increase the height of the blocking pillars and increase the gap size between adjacent blocking pillars. The light-emitting area is sequentially provided with a wiring layer, a pixel definition layer, a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The height-enhancing structure includes: a first height-enhancing structure and / or a second height-enhancing structure; the first height-enhancing structure is located on the side of the pixel definition layer closest to the substrate, and the first height-enhancing structure is on the same layer as the wiring layer; the second height-enhancing structure is located on the side of the pixel definition layer furthest from the substrate, and the second height-enhancing structure is on the same layer as the first inorganic encapsulation layer; The first height-increasing structure includes: The three stacked metal layers have a size in the middle metal layer that is smaller than or equal to the size in the first direction of the two metal layers on both sides, with the two ends of the first direction pointing to the light-emitting area and the peripheral area, respectively. In each of the blocking pillars, the size of the surface of the second heightening structure that contacts the pixel definition layer is smaller than the size of the surface of the pixel definition layer that contacts the second heightening structure. The light-emitting area includes a substrate, and a wiring layer and a pixel definition layer sequentially disposed on the substrate, wherein the pixel definition layer is made of an inorganic material; The light-emitting area further includes: a first electrode, which is located on the side of the pixel definition layer near the substrate; wherein the wiring layer is located between the first electrode and the pixel definition layer.

2. The light-emitting panel as described in claim 1, characterized in that: The pixel definition layers at the blocking structure are spaced apart, and the thickness of the pixel definition layers at the blocking structure is at least 5000 angstroms.

3. The light-emitting panel as described in claim 1 or 2, characterized in that: The blocking structure includes at least five blocking posts; The top of the blocking post is at least 50 micrometers above the surface of the substrate.

4. The light-emitting panel as described in claim 1, characterized in that, The surrounding area also includes: The sensor has a blocking structure disposed between it and the light-emitting area.

5. A light-emitting device, characterized in that, Includes the light-emitting panel as described in any one of claims 1 to 4.

6. The light-emitting device as described in claim 5, characterized in that, The light-emitting device is a taillight.

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