Buffer chamber and AM system with buffer chamber

Abstract

In an AM system, an environment in which fine particles such as a powder material are built does not scatter from a region in which the fine particles can exist to other regions. According to one embodiment, an AM system for manufacturing a molded article is provided, the AM system having a molding chamber configured with an AM device, and a buffer chamber connected to the molding chamber, the buffer chamber having an inlet connected to an ambient environment, an outlet connected to the molding chamber, a grid floor, and an exhaust port, the AM system having a first door capable of opening and closing the inlet of the buffer chamber, and a second door capable of opening and closing the outlet of the buffer chamber.

Description

Technical Field

[0001] This application relates to a buffer chamber and an AM system having a buffer chamber. This application claims priority based on Japanese Patent Application No. 2020-174652, filed October 16, 2020. All disclosures of Japanese Patent Application No. 2020-174652, including the description, claims, drawings, and abstract, are incorporated herein by reference in their entirety. Background Technology

[0002] Techniques for directly creating three-dimensional objects from three-dimensional data on a computer that represents three-dimensional objects are known. For example, Additive Manufacturing (AM) is known. As an example, Direct Energy Deposition (DED) is an AM method that involves deposition. DED is a technique that creates objects by locally supplying metal material while using a suitable heat source to melt and solidify the metal material together with a substrate. Another example of an AM method is Powder Bed Fusion (PBF). PBF involves irradiating a two-dimensional metal powder layer with a laser beam or electron beam as a heat source onto the area to be shaped, causing the metal powder to melt, solidify, or sinter, thereby creating the layers of a three-dimensional object. In PBF, by repeating this process, the desired three-dimensional object can be created.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Publication No. 2018-535320

[0006] In AM devices using either the DED (Dry Molding) or PBF (Pure Paper Fabric) method, microparticles such as metal powder are mostly used as molding materials. Alternatively, sometimes spool-shaped wire is used instead of powder, but this generates fumes and other microparticles during the molten process. These microparticles are easily inhaled and, depending on their type, can sometimes have health effects. In AM devices, the molding board, which becomes the molding surface, is sometimes set manually on the molding workbench by operators, and the molded object is also removed manually after molding. The processes of replenishing powder material to the powder supply device before molding and removing molded objects with residual powder after molding pose a risk of microparticle inhalation for operators.

[0007] Therefore, in AM (Advanced Particulate Air) systems using powder materials, protective clothing or gloves and dust masks must be worn when handling powder materials. To reduce the risk of workers being exposed to particles, it is best to allow workers to replenish powder materials and remove or place molded objects without directly contacting the molding chamber. Additionally, it is ideal to create an environment where particles cannot be dispersed from areas where powder materials or other particulate matter may be present into other areas. Summary of the Invention

[0008] One object of this application is to provide a structure that can solve or mitigate at least a portion of these problems.

[0009] According to one embodiment, an AM system for manufacturing sculpted objects is provided. The AM system includes: a sculpting chamber equipped with AM devices; and a buffer chamber connected to the sculpting chamber, the buffer chamber having: an entrance connected to the surrounding environment; an outlet connected to the sculpting chamber; a grid floor; and an exhaust vent. The AM system also includes: a first door capable of opening and closing the entrance of the buffer chamber; and a second door capable of opening and closing the outlet of the buffer chamber. Attached Figure Description

[0010] Figure 1 It is a diagram that roughly represents an AM system based on one implementation.

[0011] Figure 2 It is a diagram that roughly represents an AM system based on one implementation.

[0012] Figure 3 It is a diagram that roughly represents an AM system based on one implementation.

[0013] Figure 4 It is a diagram that roughly represents an AM system based on one implementation.

[0014] Figure 5 It is a diagram that roughly represents an AM system based on one implementation.

[0015] Figure 6 It is a diagram that roughly represents an AM system based on one implementation.

[0016] Figure 7 It is a diagram that roughly represents an AM system based on one implementation. Detailed Implementation

[0017] Hereinafter, embodiments of the buffer chamber and AM system equipped with the buffer chamber according to the present invention will be described with reference to the accompanying drawings. In the drawings, the same or similar elements are labeled with the same or similar reference numerals, and repeated descriptions related to the same or similar elements are sometimes omitted in the description of each embodiment. In addition, the features shown in each embodiment can also be applied to other embodiments as long as they do not contradict each other.

[0018] Figure 1 This is a schematic diagram representing an AM system 1000 based on one implementation. Figure 1 The arrow z shown indicates the height direction. Figure 1 The AM system 1000 shown includes a molding chamber 100 and a buffer chamber 200. A door 102 separates the molding chamber 100 and the buffer chamber 200. The door 102 is located on the entrance side of the molding chamber 100 and the exit side of the buffer chamber 200. A door 202 is located on the entrance side of the buffer chamber 200, separating the buffer chamber 200 from the surrounding environment. Figure 1 In the system 1000 shown, items can be retrieved and placed in the molding chamber 100 solely through the buffer chamber 200. Doors 102 and 202 can be, for example, sliding doors that can slide laterally, or doors that can open and close towards the front or inward. Using sliding doors for doors 102 and 202 reduces the impact of differential pressure. In particular, as described later, the buffer chamber 200 sometimes experiences lower pressure than the surrounding environment; by making the door 202, which isolates the surrounding environment from the buffer chamber 200, a sliding door reduces the impact of differential pressure.

[0019] In one embodiment, the AM system 1000 may include sensors for detecting the opening and closing states of doors 102 and 202, and locking mechanisms for keeping doors 102 and 202 in a closed state. For example, by controlling the door 202 to be opened only when door 102 is closed, and the door 102 to be opened only when door 202 is closed, it is possible to prevent the styling room 100 from being directly exposed to the surrounding environment.

[0020] An AM device 150 for performing AM (Advanced Powder Molding) is installed in the molding room 100. The AM device 150 includes a powder material supply device, a heat source such as a laser source or an electron beam source, a gas source, various actuation mechanisms, and control devices. The AM device 150 can be a DED (Dual Effect Device) type AM device or a PBF (Powder-Based Fiber) type AM device. The AM device can utilize any AM device including those in the prior art. Since the AM device 150 can use any device, it will not be described in detail in this specification.

[0021] exist Figure 1In the AM system 1000 shown, sculpting preparation, sculpting processing using the AM device 150, and post-sculpting processing are performed in the sculpting chamber 100. During sculpting preparation, sculpting materials such as powder are replenished to the designated material supply device, the base plate for sculpting using the AM device 150 is set up, and various replacement parts used in the AM device are installed. The sculpting process is performed using the AM device 150 under automatic computer control, according to a specified sculpting procedure. Post-sculpting processing includes removing residual powder materials, removing the sculpted object, and cleaning the sculpting chamber.

[0022] In one implementation, such as Figure 1 As shown, gloves 110 and 210 are disposed on the walls of the molding chamber 100 and the buffer chamber 200. The gloves 110 and 210 extend inward from the walls of the molding chamber 100 and the buffer chamber 200, allowing access to the interior of the molding chamber 100 and the buffer chamber 200 from the outside. Using the gloves 110 and 210, operations within the molding chamber 100 and the buffer chamber 200 can be performed manually from the outside. For example, the following operation can be performed: a container containing powder material is brought into the molding chamber 100 via the buffer chamber 200, and the powder material is filled into the material supply device of the AM device 150 via the gloves 110 while the door 102 is closed and sealed. An empty container that was previously filled with powder material is moved to the buffer chamber 200 via the door 102, and after the door 102 is closed, the door 202 is opened again to remove the empty container.

[0023] In one implementation, it can replace Figure 1 The gloves 110 and 210 shown are configured, or further configured, with a crane or other moving mechanism 201 capable of moving across the molding chamber 100 and the buffer chamber 200, and a robot 203 operating inside the molding chamber 100 and the buffer chamber 200. By using the moving mechanism 201 and the robot 203, various operations such as material replenishment and parts installation / removal can be performed inside the molding chamber 100 and the buffer chamber 200 while maintaining their sealed state. Figure 1 In this configuration, the crane is located in the buffer chamber 200. However, by providing a track for the crane to move across the molding chamber 100 and the buffer chamber 200, a moving mechanism 201 can be configured to move across the molding chamber 100 and the buffer chamber 200. Furthermore, in... Figure 1 In the modeling room 100, robot 203 is located in the modeling room 100. However, robot 203 can also be configured to move across the modeling room 100 and the buffer room 200. Alternatively, it can be configured to have a robotic arm that can access both the modeling room 100 and the buffer room 200 when the door 102 is open.

[0024] Figure 2 This is a schematic diagram representing an AM system 1000 based on one implementation. Figure 2 The AM system 1000 of the illustrated embodiment is in Figure 1 A modeling preparation room 300 is arranged between the modeling room 100 and the buffer room 200 shown. Figure 2 In the illustrated embodiment, a door 302 is provided between the exit of the buffer chamber 200 and the entrance of the styling preparation chamber 300, and a door 102 is provided between the exit of the styling preparation chamber 300 and the entrance of the styling chamber 100. In the AM system 1000 illustrated above, styling processing is performed in the styling chamber 100, and styling preparation is performed in the styling preparation chamber 300. Items are moved into / out of the styling chamber 100 via the buffer chamber 200 and the styling preparation chamber 300. Figure 2 In the illustrated embodiment, any one of the modeling chamber 100, the buffer chamber 200, and the modeling preparation chamber 300 can be equipped with a... Figure 1 The gloves 110 and 210, the moving mechanism 201, and the robot 203, as described in the text.

[0025] Figure 3 This is a schematic diagram representing an AM system 1000 based on one implementation. Figure 3 The AM system 1000 shown is... Figure 1 The illustrated embodiment also includes a molding chamber 100 equipped with an AM device 150 and a buffer chamber 200. Figure 3 In the illustrated embodiment, the buffer chamber 200 includes a grid floor 204. The grid floor 204 is a grid-like floor or a floor with multiple through holes. The grid floor 204 can be the entire floor surface of the buffer chamber 200 or a part of the floor surface. Figure 3 The buffer chamber 200 shown is equipped with a humidification device 206. The humidification device 206 is a device for supplying mist or water into the buffer chamber 200. Because... Figure 3 The buffer chamber 200 shown has a humidification device 206, which can suppress the dispersion of particles such as powder materials in the buffer chamber 200.

[0026] like Figure 3 As shown, in one embodiment, a gas-liquid separator 208 is disposed below the grid floor 204 of the buffer chamber 200. The gas-liquid separator 208 is capable of separating a mixture of gas and liquid entering the gas-liquid separator 208 into gas and liquid, which are then discharged separately. Because based on... Figure 3In the embodiment shown, the buffer chamber 200 is equipped with a grid floor 204. Therefore, particles such as powder materials that fly into the buffer chamber 200 are moved towards the air-water separator 208 located below the grid floor 204 by gravity and the exhaust mechanism described later. Furthermore, in the embodiment where the buffer chamber 200 is equipped with a humidification device 206, water can be used to capture floating particles and move them towards the air-water separator 208 below the grid floor 204.

[0027] The gas-liquid separator 208 has an exhaust port 212. An exhaust line 214 is connected to the exhaust port 212. A dust collector 216 is installed on the exhaust line 214. Additionally, the gas-liquid separator 208 has a drain port 218. A drain line 219 is connected to the drain port 218. Liquid passing through the drain line 219 is then transported to a solid / liquid separator; the liquid is sent to a wastewater treatment plant, and the solids are recovered and reused.

[0028] According to one embodiment, a buffer chamber 200 includes an intake port 220 for drawing gas into the buffer chamber 200. The intake port 220 draws in outside gas into the buffer chamber 200 via a filter and a valve. Figure 3 In the buffer chamber 200, the air intake 220 is located on the upper surface of the buffer chamber 200, but the air intake 220 can also be located on the side of the buffer chamber 200.

[0029] According to one embodiment, the pressure inside the buffer chamber 200 can be adjusted by regulating the exhaust volume through the exhaust port 212 and the exhaust line 214, and by adjusting the intake volume introduced from the intake port 220. In one embodiment, the air pressure in the buffer chamber 200 is preferably controlled such that when the door 202 is opened while the door 102 is closed, the air velocity from the inlet of the buffer chamber 200 toward the inside of the buffer chamber 200 is more than 0.3 m / s and less than 1.3 m / s. By allowing air to flow from the inlet of the buffer chamber 200 toward the inside of the buffer chamber 200 when the door 202 is opened, it is possible to prevent particles floating in the buffer chamber 200 from scattering to the surroundings from the inlet of the buffer chamber 200. However, if the air velocity from the inlet of the buffer chamber 200 toward the inside of the buffer chamber 200 is high, it will entangle the particles in the buffer chamber 200, so it is best not to make the air pressure inside the buffer chamber 200 too low. Preferably, the air pressure inside the buffer chamber 200 is controlled such that the air velocity from the inlet of the buffer chamber 200 toward the interior of the buffer chamber 200 is approximately 1 m / s. The air pressure inside the buffer chamber 200 can be adjusted, for example, by adjusting the exhaust volume discharged from the exhaust line 214 and the amount of outside air taken in from the intake port 220.

[0030] exist Figure 3In the AM system 1000 shown, when door 102 is opened, door 202 is closed first. If the pressure difference between the molding chamber 100 and the buffer chamber 200 is large when door 102 is opened, a large airflow will be generated, entraining particles. Therefore, after closing door 202, the pressure between the buffer chamber 200 and the molding chamber 100 is adjusted to be the same. Specifically, the amount of exhaust gas discharged from the exhaust line 214 and the opening degree of the valve of the intake port 220 are adjusted to make the pressure in the buffer chamber 200 and the molding chamber 100 the same. Afterwards, door 102 can be opened to move items between the buffer chamber 200 and the molding chamber 100.

[0031] In addition, although Figure 3 Not shown in the figure, but based on Figure 3 The buffer chamber 200 of the illustrated embodiment may also include Figure 1 The gloves 110 and 210, the moving mechanism 201, and the robot 203 are shown. Additionally, in... Figure 3 In the embodiment shown, the outlet of the buffer chamber 200 is adjacent to the entrance of the molding chamber 100, but it can also be as follows: Figure 2 As shown, a styling preparation room 300 is provided between the buffer room 200 and the styling room 100.

[0032] Figure 4 This is a schematic diagram representing an AM system 1000 based on one implementation. Figure 4 The AM system 1000 shown is... Figure 1 The embodiment shown also includes a modeling chamber 100 equipped with an AM device 150 and a buffer chamber 200. Figure 4 The buffer chamber 200 shown is Figure 3 The buffer chamber 200 also has a grille floor 204, an exhaust port 212 and an exhaust line 214.

[0033] exist Figure 4 In the illustrated embodiment, the exhaust line 214 includes an opening 213 and a movable damper 215 capable of opening and closing the opening 213. The movable damper 215 includes a movable member capable of rotating about an axis provided on the wall of the exhaust line 214. The movable member of the movable damper 215 is configured to close the opening 213 under the influence of gravity. Figure 4In the illustrated embodiment, since an opening 213 and a movable damper 215 are provided in the exhaust line 214, the air pressure inside the buffer chamber 200 can be adjusted appropriately. When the door 102 and door 202 are closed, etc., and the air pressure in the buffer chamber 200 decreases, the external air pressure causes the movable damper 215 to rotate inward toward the exhaust line 214, thereby opening the opening 213 and allowing outside air to flow from the opening 213 to the exhaust line 214. When the door 202 is open, etc., and the air pressure in the buffer chamber 200 is close to the external air pressure, the movable part of the movable damper 215 closes the opening 213 due to gravity. The movable damper 215 prevents the air pressure inside the buffer chamber 200 from becoming too low.

[0034] In addition, Figure 4 In the illustrated embodiment, the buffer chamber 200 includes an intake port 222 for introducing inert gas into the buffer chamber 200 and an inert gas supply line 224 connected to the intake port 222. Figure 4 In the illustrated embodiment, by introducing an inert gas into the buffer chamber 200 from the inert gas supply line 224, the oxygen concentration within the buffer chamber 200 can be reduced. In molding using the AM device 150, when heating powder materials to melt and solidify them, molding is sometimes performed in an inert gas atmosphere to reduce the oxygen concentration and prevent oxidation. Therefore, the molding chamber 100 is preferably set to an inert gas atmosphere with reduced oxygen concentration. Figure 4 In the illustrated embodiment, since the buffer chamber 200 adjacent to the molding chamber 100 can be made into an inactive gas atmosphere, the inactive gas atmosphere of the molding chamber 100 can be maintained even when the door 102 is opened. Based on... Figure 4 In the AM system 1000 of the illustrated embodiment, any features described in other embodiments can be combined.

[0035] Figure 5 This is a schematic diagram representing an AM system 1000 based on one implementation. Figure 5 The buffer chamber 200 in the illustrated embodiment is movable. For example... Figure 5As shown, the buffer chamber 200 can move between a first position connected to but not connected to door 102 and a second position connected to but not connected to door 102. For example, when removing a shaped object, the buffer chamber 200 can be moved to the first position, door 102 can be opened, and the object can be moved from the shaping chamber 100 to the buffer chamber 200. Then, door 102 can be closed, and the buffer chamber 200 can be moved to the second position, and door 202 can be opened again to remove the object. When moving an item into the shaping chamber 100, the buffer chamber 200 can be moved to the second position, door 202 can be opened, and the item can be placed in the buffer chamber 200. Then, door 202 can be closed, and the buffer chamber 200 can be moved to the first position, and door 102 can be opened again to move the item into the shaping chamber 100. Figure 5 In the illustrated embodiment, since the buffer chamber 200 is not simultaneously connected to both door 102 and door 202, the molding chamber 100 will not be mistakenly exposed to the surrounding environment via the buffer chamber 200. Based on... Figure 5 In the AM system 1000 of the illustrated embodiment, any features described in other embodiments can be combined.

[0036] Figure 6 This is a schematic diagram representing an AM system 1000 based on one implementation. Figure 6 In the embodiment shown, the buffer chamber 200 is a box with an open upper surface, which can rotate and move about the rotation axis as shown in the figure. Figure 6 The buffer chamber 200 shown can be in the first position ( Figure 6 (as shown by the solid line) and the second position ( Figure 6 The first position (shown by the dotted line) allows for rotation and movement between the two positions. The first position is where the buffer chamber 200 can be accessed from the styling chamber 100 via door 102, and the second position is where items can be retrieved from the buffer chamber 200 via door 202. (As shown by the dotted line) Figure 6 As shown, gloves 110 are installed on the walls of the molding chamber 100. When the buffer chamber 200 is in the first position, the operator can use gloves 110 to access the buffer chamber 200 from the molding chamber 100 via the door 102, enabling the movement of items between the molding chamber 100 and the buffer chamber 200. Based on... Figure 6 In the AM system 1000 of the illustrated embodiment, any features described in other embodiments can be combined.

[0037] Figure 7 This is a schematic diagram representing an AM system 1000 based on one implementation. Figure 7 In the embodiment shown, the buffer chamber 200 is a box with an open upper surface, which can rotate and move about the rotation axis as shown in the figure. Figure 7 The buffer chamber 200 shown can be in the first position ( Figure 7(as shown by the solid line) and the second position ( Figure 7 The first position (shown by the dotted line) allows for rotation and movement between the two positions. The first position is where the buffer chamber 200 can be accessed from the styling chamber 100 via door 102, and the second position is where items can be retrieved from the buffer chamber 200 via door 202. (As shown by the dotted line) Figure 7 As shown, gloves 110 are installed on the walls of the molding chamber 100. When the buffer chamber 200 is in the first position, the operator can use gloves 110 to access the buffer chamber 200 from the molding chamber 100 through the door 102, enabling the movement of items between the molding chamber 100 and the buffer chamber 200. Figure 7 In the embodiment shown, by rotating the buffer chamber 200 to the second position, the open upper surface of the buffer chamber 200 can be exposed to allow items to be taken out and placed into the buffer chamber 200. Figure 7 The front of the buffer chamber 200 shown ( Figure 7 The left-side wall (of the buffer chamber 200) functions as a door 202, with its upper surface exposed when the buffer chamber 200 rotates to the second position. When the buffer chamber 200 is in the first position, the front wall isolates the buffer chamber 200 from the surrounding environment. Figure 7 The buffer chamber 200 shown can also be equipped with a door 202, which is a sliding door.

[0038] The features illustrated in the figures of the above embodiments can also be applied to other embodiments. For example, in combination with Figure 1 The gloves 110 and 210, the moving mechanism 201, and the robot 203 described herein can also be applied to other embodiments. Furthermore, the sensors for detecting the open / closed states of doors 102, 202, and 302, and the locking mechanisms for each door 102, 202, and 302, can also be applied to any embodiment. Additionally, in conjunction with... Figure 2 The styling preparation chamber 300 described above can also be configured between the buffer chamber 200 and the styling chamber 100 in other embodiments. Furthermore, in conjunction with... Figure 3 The grid floor 204, humidifier 206, air-water separator 208, dust collector 216, and air intake 220 described herein can also be applied to other embodiments. Figure 4 The described inactive gas supply line 224 and movable damper 215 can also be applied to other embodiments. Figures 5-7 The movable buffer chamber 200 described herein can also be applied to other implementation methods.

[0039] Furthermore, in the above embodiment, an example of connecting one buffer chamber 200 to the shaping chamber 100 is illustrated, but multiple buffer chambers 200 can also be connected to the shaping chamber 100, and multiple buffer chambers 200 can also be connected to the shaping preparation chamber 300. For example, multiple buffer chambers 200 can be connected to the shaping chamber 100, and specific buffer chambers 200 can be used as dedicated buffer chambers 200 for moving specific items. For example, specific buffer chambers 200 can be used for supplying powder material and moving shaped objects with residual powder material, while other buffer chambers 200 can be used for moving items other than powder material. With this arrangement, the grid floor 204, exhaust mechanism, and humidification device 206 can be provided only in the buffer chamber 200 for moving powder material, and not in other buffer chambers 200. In addition, multiple buffer chambers 200 of different sizes can be connected to the shaping chamber 100 to move items of different sizes and weights.

[0040] The following technical concepts can be grasped from the above implementation methods.

[0041] [Method 1] According to Method 1, an AM system for manufacturing shaped objects is provided, the AM system comprising: a shaping chamber equipped with an AM device; and a buffer chamber connected to the shaping chamber, the buffer chamber having: an entrance connected to the surrounding environment; an outlet connected to the shaping chamber; a grid floor; and an exhaust vent, the AM system comprising: a first door capable of opening and closing the entrance of the buffer chamber; and a second door capable of opening and closing the outlet of the buffer chamber.

[0042] [Method 2] According to Method 2, in the AM system based on Method 1, there is an exhaust mechanism that can control the amount of gas discharged from the exhaust port.

[0043] [Method 3] According to Method 3, in the AM system based on Method 2, the exhaust mechanism is configured such that, when the first door is open, the exhaust volume is controlled such that the airflow velocity from the inlet toward the buffer chamber is more than 0.3 m / s and less than 1.3 m / s.

[0044] [Method 4] According to Method 4, in an AM system based on Method 2 or Method 3, the exhaust mechanism has a dust collector.

[0045] [Method 5] According to Method 5, in an AM system based on any one of Methods 1 to 4, the buffer chamber has an intake port for taking in gas into the buffer chamber.

[0046] [Method 6] According to Method 6, in an AM system based on any one of Methods 1 to 5, the buffer chamber has a humidification device and an air-water separation device disposed below the grid floor.

[0047] [Method 7] According to Method 7, in an AM system based on any one of Methods 1 to 6, a glove is provided on the wall of the buffer chamber for accessing the interior of the buffer chamber from the outside.

[0048] [Method 8] According to Method 8, in an AM system based on any one of Methods 1 to 7, there is a moving mechanism for moving items between the buffer chamber and the modeling chamber.

[0049] [Method 9] According to Method 9, in an AM system based on any one of Methods 1 to 8, the buffer chamber is connected to a gas supply line for supplying inactive gas into the buffer chamber.

[0050] [Method 10] According to Method 10, in an AM system based on any one of Methods 1 to 9, the buffer chamber is movable between a first position where the exit is connected to the second door and a second position where the entrance is connected to the first door.

[0051] Symbol Explanation

[0052] 100 Styling Studio

[0053] 102 doors

[0054] 110 gloves

[0055] 150 AM device

[0056] 200 buffer chambers

[0057] 201 Mobile Agency

[0058] 202 doors

[0059] 203 Robots

[0060] 204 Grid Flooring

[0061] 206 Humidifier

[0062] 208 gas-water separator

[0063] 212 exhaust port

[0064] 213 opening

[0065] 214 exhaust line

[0066] 215 movable damper

[0067] 216 dust collector

[0068] 218 Drainage Outlet

[0069] 219 drainage line

[0070] 220 intake port

[0071] 222 intake port

[0072] 224 Inactive Gas Supply Line

[0073] 300 Styling Preparation Room

[0074] 302 doors

[0075] 1000AM System

Claims

1. An AM system for manufacturing shaped objects, characterized in that, have: The styling room is equipped with AM (Advanced Visual Aid) devices; and A buffer room, which is connected to the molding room, The buffer chamber has: The entrance, which connects to the surrounding environment; An exit, which is connected to the modeling room; Grille flooring; as well as Exhaust port, The AM system has: A first door, capable of opening and closing the entrance to the buffer chamber; and A second door, capable of opening and closing the exit of the buffer chamber. The buffer chamber has a humidification device and an air-water separation device disposed below the grid floor.

2. The AM system according to claim 1, characterized in that, It has an exhaust mechanism that can control the amount of gas discharged from the exhaust port.

3. The AM system according to claim 2, characterized in that, The exhaust mechanism is configured such that, when the first door is open, the exhaust volume is controlled such that the airflow velocity from the inlet toward the buffer chamber is more than 0.3 m / s and less than 1.3 m / s.

4. The AM system according to claim 2, characterized in that, The exhaust mechanism includes a dust collector.

5. The AM system according to claim 1, characterized in that, The buffer chamber has an air intake for drawing gas into the buffer chamber.

6. The AM system according to claim 1, characterized in that, The walls of the buffer chamber are fitted with gloves for accessing the interior of the buffer chamber from the outside.

7. The AM system according to claim 1, characterized in that, It has a moving mechanism for moving items between the buffer chamber and the shaping chamber.

8. The AM system according to claim 1, characterized in that, The buffer chamber is connected to a gas supply line for supplying inactive gas into the buffer chamber.

9. The AM system according to claim 1, characterized in that, The buffer chamber is movable between a first position where the exit is connected to the second door and a second position where the entrance is connected to the first door.

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