Vehicle lamp

Abstract

A vehicle lamp is provided which ensures support rigidity of a substrate connecting portion in a front-rear direction without increasing the number of components. A vehicle lamp (1) includes a light source portion (3), a power supply member (5), a heat dissipation member (4), and a socket (7). The light source portion (3) has a light emitting element (31) and a substrate (32) connected to the light emitting element (31). The power supply member (5) supplies electric power to the light source portion (3). The heat dissipation member (4) has the light source portion (3) mounted thereto. The socket (7) is assembled on a rear side opposite to a front surface (4A) of the heat dissipation member (4) on which the light source portion (3) is mounted. In the vehicle lamp (1), the power supply member (5) is electrically connected to the substrate (32) via a substrate connecting portion (32c). The heat dissipation member (4) integrally has an expansion support portion (42) which supports the substrate connecting portion (32c) at least in a front-rear direction of the heat dissipation member (4).

Description

Technical Field

[0001] This disclosure relates to a vehicle lighting fixture. Background Technology

[0002] In existing vehicle lighting fixtures, a light-emitting chip is mounted on the upper surface (mounting surface) of a substrate, and the abutting surface, which is the lower surface of the substrate, is in close contact with the abutting surface, which is the upper surface of a metal body. The fixing surface, which is the lower surface of the metal body, is fixed to a thermally conductive resin component. The metal body transfers the heat generated by the light source unit, which consists of the light-emitting chip, substrate, etc., to the thermally conductive resin component. A clearance recess is provided on one side of the outer periphery of the metal body (the side corresponding to the power supply component) to avoid the power supply component. One end of the power supply component penetrates the substrate and is electrically connected and mechanically mounted via solder (see, for example, Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-247062 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In existing vehicle lighting fixtures, a portion of the substrate is positioned in a recessed area in the direction perpendicular to the contact surface of the substrate, thus leaving a portion of the substrate unsupported by a metal body. Furthermore, since the substrate connection portion on the substrate side, where the substrate and power supply components are electrically connected via solder or similar means, is a portion of the substrate not supported by a metal body, it is difficult to support this substrate connection portion. Therefore, there is a problem that the support rigidity of the substrate connection portion in the vertical direction cannot be guaranteed.

[0008] This disclosure was made in view of the above-mentioned problems, and its object is to provide a vehicle lamp that can ensure the support rigidity of the substrate connection in the front-rear direction without increasing the number of components.

[0009] Solution for solving the problem

[0010] To achieve the above objectives, the vehicle lamp disclosed herein includes a light source unit, a power supply unit, a heat dissipation unit, and a socket. The light source unit has a light-emitting element and a substrate connected to the light-emitting element. The power supply unit supplies power to the light source unit. The heat dissipation unit mounts the light source unit. The socket is assembled on the rear side opposite to the front surface of the heat dissipation unit on which the light source unit is mounted. In this vehicle lamp, the power supply unit is electrically connected to the substrate via a substrate connection portion. The heat dissipation unit integrally has an expanded support portion that supports the substrate connection portion at least in the longitudinal direction of the heat dissipation unit.

[0011] The effects of the invention are as follows.

[0012] Therefore, it is possible to ensure the support rigidity of the substrate connection in the front-to-back direction without increasing the number of components. Attached Figure Description

[0013] Figure 1 This is an explanatory diagram illustrating the vehicle lighting fixtures disclosed herein.

[0014] Figure 2 This is a front perspective view of the light source unit of this disclosure.

[0015] Figure 3 This is an exploded perspective view showing the light source unit of this disclosure.

[0016] Figure 4 This is an explanatory diagram illustrating the light source unit, heat dissipation component, power supply component, and power supply side connector of this disclosure.

[0017] Figure 5 This is a cross-sectional view showing the light source unit, heat dissipation component, power supply component, and power-side connector of this disclosure; it is a cross-sectional view showing a partial section of the power-side connector of this disclosure; and it is... Figure 4 A cross-sectional view at line II.

[0018] Figure 6 This is a cross-sectional view showing the light source section and heat dissipation component of this disclosure, and is taken from... Figure 4 The cross-sectional view at line II-II, after removing the power supply components and the power supply side connector.

[0019] Figure 7 This is an explanatory diagram illustrating the heat dissipation component of this disclosure.

[0020] Figure 8 This is a cross-sectional view showing the heat dissipation component of this disclosure, and is Figure 7 A cross-sectional view at line III-III.

[0021] Figure 9 This is a cross-sectional view showing the heat dissipation component of this disclosure, and is Figure 7 A cross-sectional view at line IV-IV.

[0022] Figure 10 This is an exploded perspective view showing the light source unit, heat dissipation component, and power supply component of this disclosure.

[0023] Figure 11 This is a rear perspective view showing the light source unit of this disclosure.

[0024] Figure 12 This is a front perspective view showing the socket of this disclosure. Detailed Implementation

[0025] Hereinafter, based on Embodiment 1 shown in the accompanying drawings, a method for implementing the vehicle lamps of this disclosure will be described.

[0026] Example 1

[0027] The vehicle lamp 1 in Embodiment 1 is used as a lamp for automobiles and other vehicles, such as headlights, fog lights, daytime running lights, and distance lights. In the following description, in the vehicle lamp 1, the direction of the vehicle's forward movement (front-to-back direction) and the direction of the illuminating light are defined as the optical axis (denoted as "Z" in the attached drawing, with the illuminating side designated as the front). The vertical direction while mounted on the vehicle is defined as the up-down direction (denoted as "Y" in the attached drawing), and the direction orthogonal to the optical axis and the up-down direction (left-right direction) is defined as the width direction (denoted as "X" in the attached drawing). The structure of Embodiment 1 will be described below as "overall structure," "structure of the light source unit," and "main structure of the heat dissipation component."

[0028] Reference Figure 1 Explain the overall structure.

[0029] like Figure 1 As shown, the vehicle lamp 1 includes a lamp housing 11, a lamp lens 12, a reflector 13, and a light source unit 2. The lamp housing 11 is formed from a non-transparent component such as a colored, coated resin material, and has a hollow shape with an opening at the front and a sealed rear. A mounting hole 11a is provided in the lamp housing 11, extending through the sealed rear end. At the edge of the mounting hole 11a, multiple cutouts and limiting portions are provided at approximately equal intervals.

[0030] The lamp lens 12 is formed from light-transmitting components such as transparent resin and glass, and is shaped to cover the open front end of the lamp housing 11. The lamp lens 12 is fixed to the opening of the lamp housing 11 in a sealed state, ensuring water tightness. The lamp housing 11 and the lamp lens 12 divide the space to form the lamp chamber 14.

[0031] The reflector 13 is a light distribution control unit that controls the light emitted from the light source unit 2, and is fixed to the lamp housing 11 or the like. The reflector 13 is disposed inside the lamp chamber 14. The reflector 13 is formed into a curved shape with a focal point near the light-emitting part 31c (hereinafter referred to as the light-emitting part) of the light source unit 2. The inner surface of the reflector 13 serves as the reflecting surface 13a of the reflected light, and a mounting hole 13b is provided at the bottom. When the reflector 13 is disposed inside the lamp chamber 14, the mounting hole 13b is in a positional relationship communicating with the mounting hole 11a of the lamp housing 11. Furthermore, although the reflector 13 is formed as a component independent of the lamp housing 11, the inner surface of the lamp housing 11, which is an integral structure, can also serve as the reflecting surface, or other structures can be used. Moreover, a light guide component can be provided on the front side of the light source unit 2 in the optical axis direction to emit light in an area that is different in position and size from the light-emitting part 31c, instead of the reflector 13 (reflecting surface 13a), and the structure is not limited to that of Embodiment 1. Even with a light guide component like this, the vehicle lamp 1 can be used as, for example, a headlight, fog light, daytime running light, or distance light.

[0032] In the lamp chamber 14, a light source unit 2 is arranged such that it passes through the mounting hole 11a of the lamp housing 11 and the mounting hole 13b of the reflector 13. A sealing component 15 (O-ring, rubber gasket) is sandwiched between the light source unit 2 and the lamp housing 11, allowing it to be detachably mounted in the mounting hole 11a of the lamp housing 11. Alternatively, the light source unit 2 can also be installed in the lamp chamber 14 via a vertical optical axis adjustment mechanism or a horizontal optical axis adjustment mechanism.

[0033] Next, refer to Figures 2 to 12 The structure of light source unit 2 will be described.

[0034] like Figure 2 , Figure 3 as well as Figure 11 As shown, the light source unit 2 includes a light source section 3, a heat dissipation component 4 (heat sink), a power supply component 5 (light source side connector), a power supply side connector 6, a socket 7, and a sealing component 15 (see reference). Figure 1 ).

[0035] like Figures 2-6 As shown, the light source unit 3 has a light-emitting element 31, a circuit board 32 (board), and a pair of bonding leads 33 (bonding strips).

[0036] The light-emitting element 31 has a sub-mounting substrate 31a, a pair of light-emitting electrode portions 31b (light-emitting terminal portions), a light-emitting portion 31c (light-emitting chip), and an adhesive 31d (adhesive layer). The light-emitting element 31 is a sub-base type in which the light-emitting portion 31c is provided on the sub-mounting substrate 31a and is separately disposed from the circuit board 32.

[0037] The sub-mounting substrate 31a is roughly rectangular in shape when viewed from the front along the optical axis. On the front surface and lower side of the sub-mounting substrate 31a, there are two light-emitting electrode portions 31b, one on each side, and a light-emitting portion 31c is mounted on the front surface and upper side of the sub-mounting substrate 31a. The sub-mounting substrate 31a has a circuit that electrically connects the light-emitting electrode portions 31b and the light-emitting portion 31c. The rear surface of the sub-mounting substrate 31a is mounted to the heat dissipation component 4 using an adhesive 31d. The adhesive 31d is thermally conductive. The adhesive 31d is made of epoxy resin, silicone resin, or acrylic resin, and is in a liquid, flowable, or strip-like form.

[0038] The light-emitting part 31c is a self-emissive semiconductor light source such as an LED (Light Emitting Diode), LD chip (Laser Diode Chip), or EL (Organic Electron Electron), and is roughly rectangular in shape when viewed from the front. With the light source unit 2 assembled in the lamp housing 11, the light-emitting part 31c is positioned near the focal point of the reflector 13. When power is supplied from the circuit board 32 to the light-emitting electrode part 31b, the light-emitting part 31c illuminates. Furthermore, when using the aforementioned light guide member, the light-emitting part 31c is positioned near the incident portion of the light guide member.

[0039] The circuit board 32 transmits control signals from the control circuit mounted on the vehicle to the light-emitting unit 31c, and appropriately provides multiple components such as capacitors. The circuit board 32 supplies power from the power supply unit 5 to the light-emitting element 31. When viewed from the front, the circuit board 32 has a substrate cutout portion 32B formed by cutting off the upper side of the central portion 32A. In other words, when viewed from the front, the circuit board 32 is formed into a U-shape or a concave shape. The circuit board 32 has a pair of riveting holes 32a (holes), a pair of bending holes 32b, a pair of terminal connection holes 32c (substrate connection portions on the substrate side), a pair of substrate electrode portions 32d, and an adhesive sheet 32e. The circuit board 32 is provided with a circuit that electrically connects the terminal connection holes 32c and the substrate electrode portions 32d. The pair of riveting holes 32a, the pair of bending holes 32b, and the pair of terminal connection holes 32c pass through the optical axis direction of the circuit board 32. The circuit board 32 is mounted to the heat dissipation unit 4 by the adhesive sheet 32e. At least the portions of the adhesive sheet 32e corresponding to the riveting hole 32a, bending hole 32b, and terminal connection hole 32c of the circuit board 32 are cut off. The adhesive sheet 32e is made of epoxy resin adhesive, silicone resin adhesive, or acrylic resin adhesive, and is in strip form. The adhesive sheet 32e may also be in liquid or flow form instead of strip form.

[0040] A riveting hole 32a is provided on each of the left and right sides of the substrate cutout 32B. A positioning protrusion 46 (described below) is inserted into each of the riveting holes 32a, and the circuit board 32 is fixed to the heat sink 4 by riveting the positioning protrusions 46. A bending hole 32b is provided between the substrate cutout 32B and the riveting hole 32a. The bending hole 32b is formed into a bent shape protruding towards the substrate cutout 32B in the width direction. A terminal connection hole 32c is provided on each of the left and right sides below the substrate cutout 32B. When the circuit board 32 is mounted on the front surface 4A of the heat sink 4, the terminal connection holes 32c are respectively located at positions overlapping (corresponding positions) with the left and right terminal insertion holes 42a (described below) in the optical axis direction. One end 51a of a terminal is inserted into each of the terminal connection holes 32c. Furthermore, on the front side of the terminal connection hole 32c, the terminal connection hole 32c and one end 51a of the terminal are electrically connected via solder (not shown). The substrate electrode portion 32d is provided on both the left and right sides between the substrate cutout portion 32B and the terminal connection hole portion 32c in the vertical direction. With the light-emitting element 31 and the circuit board 32 mounted on the heat sink 4, the substrate electrode portion 32d is positioned further outward in the width direction than the light-emitting electrode portion 31b (see reference). Figure 4 ).

[0041] The bonding leads 33 electrically connect the left and right light-emitting electrode portions 31b to the left and right substrate electrode portions 32d respectively by means of ultrasonic wire bonding. As a result, the circuit board 32 supplies power from the power supply component 5 to the light-emitting element 31. The bonding leads 33 are formed into a curved shape that protrudes forward in the optical axis direction.

[0042] like Figures 3 to 10 As shown, the heat dissipation component 4 is a heat sink component that conducts (releases) the light generated by the light-emitting part 31c to the socket 7, and is formed of a metal material or resin material with high thermal conductivity. For example, the heat dissipation component 4 is formed of a die-cast aluminum part with thermal conductivity. The heat dissipation component 4 integrally has a base part 41 (main body part), an expansion support part 42, a fin part 43, a first protrusion 44, a second protrusion 45, and a pair of positioning protrusions 46.

[0043] like Figures 7-9 As shown, the base portion 41 is formed as a plate orthogonal to the optical axis. When viewed from the front, the upper side of the base portion 41 is approximately arc-shaped, and the lower side is approximately rectangular. A first protrusion 44 and a second protrusion 45 are provided on the front side of the base portion 41, and a fin portion 43 is provided on the rear side of the base portion 41. An expansion support portion 42 is provided on the lower side of the base portion 41.

[0044] The expansion support portion 42 is located at the front end of the base portion 41 along the optical axis and is situated on the lower side of the base portion 41. In other words, the expansion support portion 42 expands the base portion 41 downwards. Or, the expansion support portion 42 is located on the lower side in the vertical direction, closer to the first protrusion 44 when mounted on the vehicle. The expansion support portion 42 is formed as a plate orthogonal to the optical axis. When viewed from the front, the expansion support portion 42 is approximately arc-shaped. Figure 5 and Figure 10 As shown, the expansion support 42 has a pair of terminal insertion holes 42a, a pair of first protrusions 42b, and a pair of second protrusions 42c. The terminal insertion holes 42a extend through the optical axis of the expansion support 42, and are provided on both the left and right sides. When the circuit board 32 is mounted on the front surface 4A of the heat sink 4, the terminal insertion holes 42a are respectively positioned at positions overlapping (corresponding positions) with the terminal connection holes 32c in the optical axis direction. Therefore, the expansion support 42 supports the terminal connection holes 32c on the insertion port 7 side (rear side) in the optical axis direction. The diameter of the terminal insertion holes 42a is set to be larger than the diameter of the terminal connection holes 32c. One end 51a of the power supply terminal 51 is inserted into the terminal insertion holes 42a. The first protrusions 42b are formed as protrusions extending from the expansion support rear surface 42B of the expansion support 42. There is one first protrusion 42b on each side, positioned to sandwich a pair of terminal insertion holes 42a in the width direction. If one end 51a of the terminal is inserted into the terminal insertion hole 42a, the first protrusion 42b abuts against the insulating end face 52a (described below). The second protrusion 42c is formed in a protruding shape where the expanded support surface 42B protrudes beyond the first protrusion 42b. There is one second protrusion 42c on each side, and they are positioned to sandwich a pair of first protrusions 42b in the width direction.

[0045] like Figures 8-10As shown, the fin portion 43 has a plurality of parallel fins 43a and a plurality of connecting fins 43b protruding from the rear surface 41B of the base. Each parallel fin 43a is formed in the rear surface 41B of the base as a flat plate orthogonal to the vertical direction. The parallel fins 43a are arranged side by side with a predetermined interval in the vertical direction. That is, each parallel fin 43a has a flat outer surface on the top and bottom respectively by being set as a flat plate shape, and is arranged side by side so that the outer surfaces of each other face each other. For example, there are four parallel fins 43a. Connecting fins 43b are mounted on each parallel fin 43a in the vertical direction. For example, there are two connecting fins 43b. Two connecting fins 43b are positioned inwards from the ends of the parallel fins 43a in the width direction, and move vertically from the uppermost parallel fin 43a1 through the two middle parallel fins 43a2 and 43a3 to the lowermost parallel fin 43a4. Therefore, the fin section 43 is formed by combining four parallel fins 43a and two connecting fins 43b in a grid pattern. The parallel fins 43a and connecting fins 43b overlap at their intersections.

[0046] like Figure 8 As shown, the middle parallel fin 43a3 (the third parallel fin counting from the topmost parallel fin 43a1) is positioned at a location overlapping with a pair of positioning protrusions 46 in the optical axis direction (positioned on the same straight line in the optical axis direction). Figure 9 As shown, the connecting fins 43b are respectively positioned at locations that overlap with the positioning protrusions 46 in the optical axis direction (positions on the same straight line in the optical axis direction). That is, the middle parallel fins 43a3 and the left and right intersecting portions of the connecting fins 43b are respectively positioned at locations that overlap with the positioning protrusions 46 in the optical axis direction (positions on the same straight line in the optical axis direction).

[0047] like Figures 7-9 As shown, the first protrusion 44 is formed as a convex shape protruding from the front surface 41A of the base. When viewed from the front, the first protrusion 44 is rectangular in shape. The first protrusion 44 is located in the central portion of the entire front surface 4A of the heat dissipation component 4. Furthermore, the entire front surface 4A of the heat dissipation component 4 is the surface after removing the positioning protrusion 46 from the heat dissipation component 4. The second protrusion 45 is formed as a convex shape protruding from the front surface 41A of the base. When viewed from the front, the upper side of the second protrusion 45 is approximately arc-shaped, and the lower side is rectangular. In other words, when viewed from the front, the second protrusion 45 is formed as a T-shape. The second protrusion 45 is located on the upper side of the entire front surface 4A of the heat dissipation component 4 and is located on the upper side in the vertical direction than the first protrusion 44 when mounted on the vehicle. The first protrusion 44 and the second protrusion 45 are formed as convex shapes protruding forward by the same amount (see reference). Figure 8The first protrusion 44 and the second protrusion 45 are formed as a single convex shape. In other words, the second protrusion 45 is continuous from the upper side of the first protrusion 44, and the first protrusion 44 and the second protrusion 45 are adjacent to each other without any gap between them. A step difference is generated in the entire front surface 4A of the heat dissipation component 4 due to the first protrusion 44 and the second protrusion 45. Therefore, the entire front surface 4A of the heat dissipation component 4 is divided into a convex portion 4A1 of the first protrusion 44 and the second protrusion 45, and a remaining concave portion 4A2 that is recessed relative to the convex portion 4A1.

[0048] The positioning protrusion 46 is formed into a cylindrical shape that protrudes forward from the front surface 41A of the base further than the first protrusion 44 and the second protrusion 45. One positioning protrusion 46 is provided on each side of the first protrusion 44, and they are positioned to sandwich the first protrusion 44 in the width direction. Riveting holes 32a are inserted into the positioning protrusions 46, and the circuit board 32 is fixed to the heat sink 4 (see reference 4) by riveting. Figure 4 (etc.). The positions of the positioning protrusions 46 are the positions that overlap with the middle parallel fins 43a3 and the left and right intersecting parts of the connecting fins 43b in the optical axis direction (positions on the same straight line in the optical axis direction).

[0049] like Figure 5 As shown, the power supply component 5 is the light source-side connector on the light source side of the connector. Furthermore, the connector includes the power supply component 5 and the power supply-side connector 6. The power supply component 5 can be mechanically and detachably connected and can be intermittently electrically connected to the power supply-side connector 6 (see reference). Figure 11 The power from the power supply connector 6 is supplied to the light source unit 3. For example... Figure 3 and Figure 12 As shown, the power supply component 5 is fixed to the socket 7 by means of insulating material embedded in the power supply mounting hole 71f (described below). Figure 5 and Figure 10As shown, the power supply component 5 has a pair of power supply terminals 51 (electrode pins) and a power supply insulation portion 52. The power supply terminals 51 are pin-shaped and are covered by the power supply insulation portion 52, leaving one end 51a and the other end 51b of the terminals uncovered. The one end 51a of the terminals is inserted into the terminal insertion hole portion 42a and the terminal connection hole portion 32c, respectively. Moreover, on the front side of the terminal connection hole portion 32c, the terminal connection hole portion 32c and the one end 51a of the terminals are electrically connected via solder (not shown). The other ends 51b of the terminals are electrically connected by being inserted into each of the connector electrode portions 61 (hereinafter referred to as such). When the one end 51a of the terminals is inserted into the terminal insertion hole portion 42a, the insulating end face 52a of the power supply insulation portion 52 abuts against a pair of first protrusions 42b. Thus, the power supply component 5 is positioned relative to the heat dissipation component 4, and the one end 51a of the terminals is positioned relative to the terminal connection hole portion 32c. If the other end 51b of the terminal is inserted into the connector electrode portion 61, the other insulating end face 52b of the power supply insulation portion 52 abuts against one end face 6a of the connector (described below). Thus, the power supply component 5 is sandwiched between the expansion support portion 42 and the power supply side connector 6 in the optical axis direction.

[0050] like Figure 1 and Figure 5 As shown, the power supply connector 6 is the power supply connector among the connectors, supplying power to the power supply component 5. Figure 11 As shown, the power supply connector 6 is fixed to the socket 7 by engaging with the socket 7 from the rear and underside of the socket heat dissipation part 72 (described below). Figure 5 and Figure 11 As shown, the power supply connector 6 has a pair of connector electrode portions 61, a pair of wire harness connection portions 62, and a connector insulation portion 63. The pair of connector electrode portions 61 and the pair of wire harness connection portions 62 are covered by the connector insulation portion 63, leaving the end electrode portions uncovered. The connector electrode portions 61 are electrically connected to the other end 51b of the terminal, respectively. The wire harness connection portions 62 are electrically connected to the wire harness 16, respectively (see reference). Figure 1 Thus, power supply terminal 51 and wiring harness 16 are electrically connected via power supply side connector 6 (see reference). Figure 1 and Figure 5 If the other end 51b of the terminal is inserted into the connector electrode portion 61, then one end face 6a of the connector abuts against the other end face 52b of the insulation.

[0051] like Figures 1-3 , Figure 11 as well as Figure 12As shown, the socket 7 is a component that releases (radiates) heat conducted from the heat dissipation component 4 to the outside, and is formed of a thermally conductive material (e.g., resin). The socket 7 is assembled on the rear side opposite to the front surface 4A of the heat dissipation component 4 on which the light source section 3 is mounted. The socket 7 integrally has a socket body portion 71 and a socket heat dissipation portion 72. In the optical axis direction, the socket body portion 71 is provided on the front side of the socket 7, and the socket heat dissipation portion 72 is provided on the rear side of the socket 7.

[0052] The socket body 71 has a peripheral wall 71a, a flange wall 71b, a bottom wall 71c, four mounting protrusions 71d, a groove 71e, a power supply mounting hole 71f, and a pair of positioning holes 71g. The socket body 71 is separated from the socket heat dissipation part 72 side, i.e., the rear side in the optical axis direction, by the bottom wall 71c. The peripheral wall 71a is formed into a cylindrical shape extending along the optical axis direction, with an outer diameter slightly smaller than the inner diameter of the mounting hole 11a of the lamp housing 11. The flange wall 71b is formed into a flat plate shape that protrudes from the rear side of the peripheral wall 71a to the outer side in a direction orthogonal to the optical axis direction throughout the entire circumference. The bottom wall 71c closes the rear side of the cylindrical peripheral wall 71a. That is, the bottom wall 71c corresponds to the bottom surface of the socket body 71.

[0053] The mounting protrusion 71d is formed as a convex shape protruding outward from the peripheral wall 71a in a direction orthogonal to the optical axis, located forward of the flange wall 71b. Four mounting protrusions 71d are arranged at approximately equal intervals in the circumferential direction of the peripheral wall 71a, allowing them to pass through the cutout of the mounting hole 11a in the lamp housing 11. After passing through the cutout, each mounting protrusion 71d, due to the change in rotational posture relative to the lamp housing 11, fits tightly against the limiting portion, thereby allowing the peripheral portion of the mounting hole 11a and the sealing member 15 (see reference) to be clamped between the mounting protrusion 71d and the flange wall 71b. Figure 1 Thus, each mounting protrusion 71d can engage with the flange wall 71b to detachably mount the socket 7, i.e., the light source unit 2, to the lamp housing 11 via the sealing member 15.

[0054] The groove 71e, the power supply mounting hole 71f, and the positioning hole 71g are formed on the inner side of the cylindrical peripheral wall 71a.

[0055] The groove 71e is the portion into which the fin portion 43 of the heat dissipation component 4 is inserted, and is formed in a shape such that the fin portion 43 is reversed. The groove 71e is formed by multiple wall portions 71e1 and a bottom wall 71c corresponding to the bottom of the groove. The groove 71e is formed by combining parallel groove portions 71e2 suitable for four parallel fins 43a and connecting groove portions 71e3 suitable for two connecting fins 43b in a grid pattern. Therefore, the groove 71e can receive the fin portion 43 in a manner that properly engages with the fin portion 43. In addition, thermally conductive grease 100 (thermal conductor) is applied to the groove 71e.

[0056] The power supply mounting hole 71f is a hole for mounting the power supply component 5, penetrating the bottom wall 71c in the optical axis direction. The power supply mounting hole 71f is formed to mimic the shape of the power supply insulation portion 52 (except for the insulating end face 52a and the insulating other end face 52b). The power supply mounting hole 71f is embedded in the power supply component 5 through insulating material, thereby ensuring the insulation of the power supply component 5. When the power supply component 5 is embedded in the power supply mounting hole 71f, the other end 51b of the terminal is exposed on the rear side of the socket 7. Moreover, by mounting the power supply side connector 6 on the other end 51b of the terminal, the other end 51b of the terminal is electrically connected to the connector electrode portion 61 (see reference). Figure 5 and Figure 11 ).

[0057] The positioning hole 71g is the portion into which the second protrusion 42c is inserted. The positioning hole 71g is formed to extend rearward in the optical axis direction and to allow the insertion of the second protrusion 42c. The positioning hole 71g is disposed outside the power supply mounting hole 71f in the width direction and between the slot 71e and the power supply mounting hole 71f in the vertical direction. The positioning hole 71g determines the relative position of the heat dissipation component 4 and the socket 7 by inserting the second protrusion 42c. That is, the second protrusion 42c is the positioning part on the side of the heat dissipation component 4, and the positioning hole 71g is the positioning part on the side of the socket 7. Furthermore, since the second protrusion 42c and the positioning hole 71g determine the relative position of the heat dissipation component 4 and the socket 7, the position and number can be set appropriately. For example, the protrusion and the hole can be replaced, and the structure is not limited to that of Embodiment 1.

[0058] The socket heat dissipation section 72 releases (radiates) heat conducted from the heat dissipation component 4 to the outside via the socket body section 71. The socket heat dissipation section 72 has a plurality of socket fins 72a. The socket fins 72a are formed as plates that protrude from the rear surfaces of the flange wall 71b and the bottom wall 71c toward the rear side in the optical axis direction and are perpendicular to the width direction. The socket fins 72a are arranged side by side with a predetermined spacing in the width direction. There is a portion behind and under the socket heat dissipation section 72 where no socket fins 72a are provided (see reference). Figure 11 The portion without the socket fin 72a has a fitting part (not shown) for engaging with the power supply connector 6. The fitting part allows for mechanical attachment and detachment of the power supply connector 6. By mounting the power supply connector 6 in the fitting part, the power supply connector 6 is secured in the socket 7, and the power supply connector 6 is electrically connected to the power supply component 5.

[0059] Next, refer to Figures 4-9 The main structure of heat dissipation component 4 is described.

[0060] Reference Figure 4 and Figure 7 The entire front surface 4A area of ​​the heat dissipation component 4 will be described.

[0061] The entire front surface 4A of the heat dissipation component 4 is divided as follows. The entire front surface 4A of the heat dissipation component 4 is divided into an expansion support region 4Ae and the remaining base region 4Aa (remaining region). The expansion support region 4Ae is the expansion support part 42, which is located at the lower side in the vertical direction of the vehicle state, closer to the light-emitting region 4Af (described below). The base region 4Aa is the base part 41, and is the entire base front surface 41A of the base part 41.

[0062] The entire front surface 4A of the heat dissipation component 4 is divided into a light-emitting region 4Af, a circuit board region 4Ag (board region), and an expanded light-emitting region 4Ah. The light-emitting region 4Af is the first protrusion 44 and is the region where the light-emitting element 31 is mounted. The circuit board region 4Ag is a part of the base portion 41 and the expanded support portion 42, and is the region where the circuit board 32 is mounted. The circuit board region 4Ag includes the expanded support region 4Ae. In other words, a portion of the circuit board region 4Ag overlaps with the expanded support region 4Ae. The expanded light-emitting region 4Ah is the second protrusion 45 and is the region after expanding the light-emitting region 4Af. The expanded light-emitting region 4Ah is positioned higher in the vertical direction than the light-emitting region 4Af when mounted on the vehicle. The expanded light-emitting region 4Ah is the region where no components are mounted.

[0063] Furthermore, the base region 4Aa is the region that combines the light-emitting region 4Af, the expanded light-emitting region 4Ah, and the riveting region 4Aj. The riveting region 4Aj is the region where the hole portion 32a, the bent hole portion 32b, and the positioning protrusion portion 46 are disposed, and it is the region where the positioning protrusion portion 46 is riveted. In other words, the riveting region 4Aj is the region from which the expanded support region 4Ae is removed from the circuit board region 4Ag. The circuit board region 4Ag is the region that combines the expanded support region 4Ae and the riveting region 4Aj.

[0064] Reference Figures 6-9 The thickness (dimension) of the heat dissipation component 4 in the optical axis direction will be explained. Furthermore, the thickness of the heat dissipation component 4 in the optical axis direction is the thickness of the heat dissipation component 4 after removing the fin portion 43 and the positioning protrusion 46.

[0065] The thickness 40e of the expansion support region 4Ae is set to be thinner than the thickness 40a of the base region 4Aa (the thickness of the remaining region). In other words, the thickness 40e of the expansion support region 4Ae is set to be thinner than the thickness 40f of the light-emitting region 4Af, the thickness 40h of the expansion light-emitting region 4Ah, and the thickness 40j of the riveting region 4Aj.

[0066] The thickness 40f of the light-emitting region 4Af is set to be the same as the thickness 40h of the expanded light-emitting region 4Ah. The light-emitting region 4Af and the expanded light-emitting region 4Ah in the entire front surface 4A of the heat dissipation component 4 are continuous regions on the front surface 4A and are located on the same plane (coplanar) on the front side. The light-emitting region 4Af and the expanded light-emitting region 4Ah are adjacent to each other without any gaps between them.

[0067] The thickness 40f of the light-emitting region 4Af and the thickness 40h of the expanded light-emitting region 4Ah are set to be thicker than the thickness 40g of the circuit board region 4Ag. In other words, the thickness 40f of the light-emitting region 4Af and the thickness 40h of the expanded light-emitting region 4Ah are set to be thicker than either the thickness 40e of the expanded support region 4Ae or the thickness 40j of the riveting region 4Aj.

[0068] The thickness 40j of the riveting region 4Aj is set to be thicker than the thickness 40e of the expansion support region 4Ae. The thickness 40j of the riveting region 4Aj is set to be thinner than the thickness 40f of the light-emitting region 4Af and the thickness 40h of the expansion light-emitting region 4Ah by an amount equivalent to the thickness 40k (thickness of the convex portion 4A1, step difference) of the first protrusion 44 and the second protrusion 45. The expansion support region 4Ae and the riveting region 4Aj in the entire front surface 4A of the heat dissipation component 4 are continuous regions on the front surface 4A and are located on the same plane (coplanar) on the front side. The expansion support region 4Ae and the riveting region 4Aj are adjacent to each other without any gap between them. The thickness 40e of the expansion support region 4Ae is set to be 40m thinner than the thickness 40j of the riveting region 4Aj.

[0069] Here, in the entire front surface 4A of the heat dissipation component 4, the light-emitting region 4Af and the expanded light-emitting region 4Ah form a convex portion 4A1, while the circuit board region 4Ag (expansion support region 4Ae and riveting region 4Aj) forms a concave portion 4A2. In other words, the light-emitting region 4Af and the expanded light-emitting region 4Ah are formed into a convex shape in which the front surface 4A of the heat dissipation component 4 protrudes further than the circuit board region 4Ag. Moreover, if the circuit board 32 is mounted in the circuit board region 4Ag, the circuit board 32 protrudes further forward than the first protrusion 44 (see reference). Figure 6 Furthermore, if the light-emitting element 31 is installed in the light-emitting region 4Af, the position of the light-emitting electrode portion 31b is forward of the position of the substrate electrode portion 32d in the optical axis direction (see reference). Figure 6 In the optical axis direction, the thickness of the circuit board 32 is set to be thinner than the sum of the thickness of the first protrusion 44 and the thickness of the light-emitting element 31 (see reference). Figure 6 In other words, the thickness 40k of the first protrusion 44 in the optical axis direction is determined based on the thickness of the circuit board 32 in the optical axis direction, etc.

[0070] Next, the functions of Embodiment 1 will be explained in the following categories: “assembly function of light source unit 2”, “support rigidity function of terminal connection hole 32c”, “function of expansion support part 42”, “basic function of heat dissipation of vehicle lamp 1”, and “characteristic function of heat dissipation of vehicle lamp 1”.

[0071] First, the assembly function of the light source unit 2 will be explained.

[0072] First, such as Figure 3 As shown, the power supply component 5 is embedded in the power supply mounting hole 71f of the socket 7 via insulating material.

[0073] Next, refer to Figure 4 and Figure 7 The installation of the light source unit 3 relative to the heat dissipation component 4 will be described. First, the light-emitting element 31 is installed in the light-emitting area 4Af using adhesive 31d. Next, the circuit board 32 is installed in the circuit board area 4Ag using adhesive sheet 32e. When installing the circuit board 32, the cut portion of the adhesive sheet 32e is aligned with the terminal insertion hole 42a and the positioning protrusion 46. Next, the positioning protrusion 46 is inserted into the riveting hole 32a, aligning the terminal connection hole 32c and the terminal insertion hole 42a. Then, the positioning protrusion 46 is plastically deformed by flattening its front end. In other words, the positioning protrusion 46 is riveted. Thus, the circuit board 32 is fixed to the heat dissipation component 4. Next, the left and right light-emitting electrode units 31b and the left and right substrate electrode units 32d are connected by ultrasonic wire bonding. When the connection is made, the two ends of each bonding lead 33 adjacent to each light-emitting electrode portion 31b and each substrate electrode portion 32d are electrically connected by using ultrasonic wire bonding.

[0074] Next, refer to Figure 3 , Figure 10 as well as Figure 12 The assembly of heat dissipation component 4 and connector 7 is explained.

[0075] Next, thermally conductive grease 100 (thermal conductor) is applied to the groove 71e of the socket 7. Here, the thermally conductive grease 100 is used to improve the thermal conductivity between the fin portion 43 of the heat dissipation component 4 and the groove 71e. Next, each of the second protrusions 42c is inserted into the positioning hole 71g. Next, the heat dissipation component 4 is pressed into the socket 7 using ultrasonic waves. During pressing, the fin portion 43 is embedded into the groove 71e by the positioning effect of each of the second protrusions 42c and the positioning hole 71g. In addition, using the same effect, each terminal end 51a of the power supply component 5 is inserted into the terminal connection hole 32c after being inserted into the terminal insertion hole 42a. Then, the insulating end face 52a of the power supply insulation portion 52 abuts against a pair of first protrusions 42b. In addition, a portion (front end) of the terminal end 51a protrudes from the terminal connection hole 32c to a slightly forward position than the front surface of the circuit board 32.

[0076] Next, as Figure 2 and Figure 4 As shown, on the front side of the terminal connection hole 32c, each of the terminals at one end 51a is electrically connected to each of the terminal connection holes 32c using solder (not shown). This assembles the light source unit 2.

[0077] Then, as Figures 1-3 As shown, the sealing member 15 is installed around the peripheral wall 71a and close to the flange wall 71b. Next, with the sealing member 15 installed, the light source unit 2 is inserted into the mounting hole 11a of the lamp housing 11 from the light-emitting part 31c side. Then, each mounting protrusion 71d of the socket 7 passes through the cutout provided at the edge of the mounting hole 11a. Next, the rotational posture of the socket body 71 relative to the lamp housing 11 changes. Then, each mounting protrusion 71d comes into close contact with its corresponding limiting part. Thus, with the sealing member 15 sandwiched between the flange wall 71b and the peripheral edge of the mounting hole 11a, the light source unit 2 is installed in the lamp housing 11. Afterwards, the reflector 13 and the lamp lens 12 are installed in the lamp housing 11. Thus, the vehicle lamp 1 is assembled.

[0078] Therefore, in the vehicle lamp 1, the light source 3 is disposed within the lamp chamber 14 via the mounting hole 11a of the lamp housing 11 and the mounting hole 13b of the reflector 13, and is disposed on the reflective surface 13a side of the reflector 13. Additionally, the vehicle lamp 1 has a power supply connector 6 (see reference 1) with a wiring harness 16 connected to it mounted at the fitting portion of the socket 7. Figure 1 Therefore, power can be supplied from the circuit board 32 to the light-emitting element 31 via the power supply component 5, thereby enabling the light-emitting part 31c to light up and turn off.

[0079] Next, the supporting rigidity of the terminal connection hole 32c will be explained.

[0080] This disclosure addresses the issue that the support rigidity of the substrate connection portion in the vertical direction (optical axis direction) cannot be ensured in existing vehicle lighting fixtures. Furthermore, if the support rigidity of the substrate connection portion cannot be ensured, there are concerns that the substrate connection portion or its surrounding area may be damaged during connection between the substrate and the power supply component, or that the connection between the substrate and the power supply component may be broken due to external vibrations.

[0081] In response to this, in Example 1, as follows Figure 5 As shown, the circuit board 32 and the power supply component 5 are electrically connected via a terminal connection hole 32c. Furthermore, the heat dissipation component 4 integrally includes an expansion support portion 42 that supports the terminal connection hole 32c in the optical axis direction of the heat dissipation component 4. That is, since the expansion support portion 42 expands downwards to the base portion 41, the number of components does not need to be increased. Additionally, in the optical axis direction of the heat dissipation component 4, the expansion support portion 42 supports the rear side (socket 7 side) of the terminal connection hole 32c. In other words, the expansion support portion 42 bears the supporting force on the rear side of the terminal connection hole 32c. As a result, the supporting rigidity of the terminal connection hole 32c in the optical axis direction is ensured without increasing the number of components. Therefore, when the circuit board 32 is connected to the power supply component 5, concerns about damage to the terminal connection hole 32c and its surrounding area, or the connection between the circuit board 32 and the power supply component 5 being disrupted by external vibrations, are suppressed. In addition, since the number of components can be increased, the support rigidity of the terminal connection hole 32c in the optical axis direction can be ensured without increasing the assembly time.

[0082] Next, the function of the expansion support part 42 will be explained.

[0083] In Example 1, as Figure 7 and Figure 8 As shown, the thickness 40e of the expansion support region 4Ae of the heat dissipation component 4 in the optical axis direction is set to be thinner than the thickness 40a of the base region 4Aa. Here, the part (terminal connection hole 32c) where the circuit board 32 (terminal connection hole 32c) and the power supply component 5 (terminal end 51a) are connected at the expansion support region 42 via solder is not a part that requires heat dissipation as a heat dissipation component 4 (or a part with lower heat dissipation requirements). Therefore, the thickness 40e of the expansion support region 4Ae can be set to be thinner than the thickness 40a of the base region 4Aa. Thus, the original heat dissipation of the heat dissipation component 4 is maintained, and the support rigidity of the terminal connection hole 32c in the optical axis direction is ensured.

[0084] Furthermore, in Embodiment 1, the heat dissipation component 4 integrally comprises a base portion 41 and an expansion support portion 42. The expansion support portion 42 is integrally provided at the front end of the base portion 41 and is located below the base portion 41 in the vertical direction. This ensures an assembly space of at least 40 μm thickness behind the expansion support portion 42. Therefore, the degree of freedom in positioning the power supply component 5 in relation to the terminal connection hole portion 32c is increased.

[0085] Additionally, in Example 1, as Figure 5 and Figure 10 As shown, the expansion support portion 42 has a terminal insertion hole 42a extending through the optical axis and a first protrusion 42b protruding from the expansion support rear surface 42B. Therefore, if a terminal end 51a is inserted into the terminal insertion hole 42a, the first protrusion 42b abuts against the insulating end face 52a of the power supply insulation portion 52. Thus, when assembling the power supply component 5, the assembly position of the power supply component 5 can be determined by the first protrusion 42b.

[0086] Next, the basic function of heat dissipation of vehicle lamp 1 will be explained.

[0087] In vehicle lighting fixture 1, such as Figure 6 As shown, the light-emitting element 31 is directly disposed on the heat dissipation component 4. Furthermore, the finned portion 43 of the heat dissipation component 4 is embedded in the groove 71e of the socket 7. Thus, heat generated from the light-emitting element 31 is directly conducted to the heat dissipation component 4. Then, the heat conducted to the heat dissipation component 4 is conducted from the finned portion 43 through the groove 71e to the socket 7. Finally, the heat conducted to the socket 7 is released to the outside from the socket 7.

[0088] Therefore, the vehicle lamp 1 can appropriately cool the light-emitting element 31, and can appropriately light up and turn off the light-emitting element 31. Furthermore, since the light-emitting element 31 is directly disposed on the heat dissipation component 4, compared to the substrate assembly type, Embodiment 1 has an advantage in heat dissipation performance (higher heat dissipation performance) for the light-emitting element 31. Additionally, since the socket 7 is provided with socket fins 72a, heat conducted from the heat dissipation component 4 to the socket 7 can be efficiently radiated to the outside. This improves the heat dissipation performance of the heat dissipation component 4. Moreover, as described in the prior art (Japanese Patent Application Laid-Open No. 2013-247062), the substrate assembly type is a type in which the light-emitting chip is mounted on the mounting surface of the upper surface of the substrate, and a metal body is disposed on the lower surface side of the substrate. In other words, the substrate is sandwiched between the light-emitting chip and the metal body.

[0089] Next, the heat dissipation characteristics of vehicle lamp 1 will be explained.

[0090] In recent years, with the development of LEDs in automotive lighting, the importance of heat dissipation from LEDs has increased. However, due to the miniaturization of components caused by new designs and the reduction in the number of components due to cost reductions, there are demands for higher output and higher brightness from LEDs. Furthermore, with the increase in LED output, the heat generated by LEDs increases, thus improving heat dissipation (and thus increasing efficiency) has become a key issue.

[0091] In response to this, in Example 1, as follows Figure 7 and Figure 8 As shown, the thickness 40f of the light-emitting region 4Af in the optical axis direction of the heat dissipation component 4 is set to be thicker than the thickness 40g of the circuit board region 4Ag. That is, the heat capacity of the thickness 40f of the light-emitting region 4Af is greater than the heat capacity of the thickness 40g of the circuit board region 4Ag. As a result, the rate of temperature rise around the light-emitting region 4Af can be delayed, thereby facilitating the conduction of heat generated from the light-emitting element 31 to the heat dissipation component 4. Therefore, the temperature rise of the light-emitting element 31 is suppressed, and the heat dissipation from the light-emitting element 31 is improved.

[0092] Furthermore, in Embodiment 1, the light-emitting region 4Af is formed as a convex shape where the front surface 4A of the heat dissipation component 4 protrudes more than the circuit board region 4Ag. Here, for example, assuming that the surfaces capable of mounting the light-emitting element 31 and the circuit board 32 are on the same plane, there is a concern that the emitted light generated by the light-emitting element 31 might be interrupted by the circuit board 32. To address this, in Embodiment 1, since the light-emitting element 31 is mounted in the light-emitting region 4Af and the circuit board 32 is mounted in the circuit board region 4Ag, the light-emitting element 31 (specifically, the light-emitting portion 31c) is positioned further forward than the circuit board 32. Therefore, the emitted light generated by the light-emitting element 31 (specifically, the light-emitting portion 31c) is less likely to be interrupted by the circuit board 32. In other words, compared to the case where the light-emitting region 4Af and the circuit board region 4Ag are on the same plane, this is advantageous in light distribution design (easier to design light distribution). In addition, since the light-emitting electrode portion 31b of the light-emitting element 31 is positioned further forward than the substrate electrode portion 32d, wire bonding is easier.

[0093] In Example 1, as Figures 7-9As shown, the thickness 40f of the light-emitting region 4Af and the thickness 40h of the expanded light-emitting region 4Ah in the optical axis direction of the heat dissipation component 4 are set to be thicker than the thickness 40g of the circuit board region 4Ag. Furthermore, the light-emitting region 4Af and the expanded light-emitting region 4Ah are formed into a convex shape that protrudes more from the front surface 4A of the heat dissipation component 4 than the circuit board region 4Ag. In addition, the light-emitting region 4Af and the expanded light-emitting region 4Ah are continuous regions on the front surface 4A of the heat dissipation component 4. That is, in addition to the heat capacity of the thickness 40f of the light-emitting region 4Af, the heat capacity of the thickness 40h of the expanded light-emitting region 4Ah is also set to be larger than the heat capacity of the thickness 40g of the circuit board region 4Ag, and the light-emitting region 4Af and the expanded light-emitting region 4Ah are continuous regions. Therefore, the temperature rise rate around the light-emitting region 4Af can be delayed more significantly, corresponding to the heat capacity of the thickness 40h of the expanded light-emitting region 4Ah. Therefore, heat generated from the light-emitting element 31 can be easily conducted from the light-emitting region 4Af to the heat dissipation component 4 (especially the second protrusion 45, which serves as the expanded light-emitting region 4Ah) through thermal conduction. As a result, the temperature rise of the light-emitting element 31 is further suppressed, and the heat dissipation generated from the light-emitting element 31 is further promoted.

[0094] In Embodiment 1, the expanded light-emitting region 4Ah is positioned above the light-emitting region 4Af in the vertical direction when mounted on the vehicle. That is, the configuration of the expanded light-emitting region 4Ah is designed to facilitate heat conduction from the lower to the upper side and to the side with a larger heat capacity. In other words, the heat capacity of the upper side (thickness 40h of the expanded light-emitting region 4Ah) of the heat-generating light-emitting element 31 is set to be greater than the heat capacity of the lower side (thickness 40g of the circuit board region 4Ag). Therefore, heat generated from the light-emitting element 31 is easily conducted to the expanded light-emitting region 4Ah (second protrusion 45) through the light-emitting region 4Af. Thus, the rate of temperature rise around the light-emitting region 4Af can be further delayed, and heat generated from the light-emitting element 31 can be easily conducted to the heat dissipation component 4 through thermal conductivity. This further suppresses the temperature rise of the light-emitting element 31 and further promotes heat dissipation from the light-emitting element 31. Furthermore, since the expansion support area 4Ae does not require heat dissipation as described above, it is positioned on the lower side in the vertical direction, closer to the light-emitting area 4Af when mounted on the vehicle.

[0095] Furthermore, in Embodiment 1, the light-emitting region 4Af and the expanded light-emitting region 4Ah are on the same plane across the entire front surface 4A of the heat dissipation component 4. The expanded light-emitting region 4Ah is an area where no component is installed. Therefore, the emitted light generated by the light-emitting part 31c is difficult to interrupt by the expanded light-emitting region 4Ah. Thus, this is advantageous in light distribution design (easier to design light distribution) compared to the case where the expanded light-emitting region 4Ah is assumed to be an area where a component is installed.

[0096] In Example 1, as Figure 2 and Figure 4 As shown, the heat dissipation component 4 has a positioning protrusion 46 that is inserted into the riveting hole 32a and riveted thereon. That is, when the circuit board 32 is mounted on the heat dissipation component 4, the circuit board 32 is easily positioned relative to the heat dissipation component 4 by inserting the positioning protrusion 46 into the riveting hole 32a. Furthermore, after the positioning protrusion 46 is inserted into the riveting hole 32a, the circuit board 32 is mounted on the heat dissipation component 4 by riveting the positioning protrusion 46. This suppresses the possibility of the circuit board 32 falling off the heat dissipation component 4 due to vibrations during lead connection, vibrations when the heat dissipation component 4 is inserted into the socket 7, vehicle vibrations, etc. Therefore, the circuit board 32 is easily positioned relative to the heat dissipation component 4, and the possibility of the circuit board 32 falling off the heat dissipation component 4 is suppressed. In addition, in Embodiment 1, a bent hole 32b is provided between the substrate cutout 32B and the riveting hole 32a. This allows the stress acting on the riveting hole 32a to be dispersed to the bent hole 32b. Therefore, when the positioning protrusion 46 is riveted, damage to the circuit board 32 can be suppressed.

[0097] As described above, the vehicle lamp 1 of Embodiment 1 achieves the effects listed below.

[0098] (1) The vehicle lamp 1 includes a light source unit 3, a power supply unit 5, a heat dissipation unit 4, and a socket 7. The light source unit 3 has a light-emitting element 31 and a circuit board 32 (board) connected to the light-emitting element 31. The power supply unit 5 supplies power to the light source unit 3. The heat dissipation unit 4 is equipped with the light source unit 3. The socket 7 is assembled on the rear side opposite to the front surface 4A of the heat dissipation unit 4 on which the light source unit 3 is mounted. In the vehicle lamp 1, the circuit board 32 (board) and the power supply unit 5 are electrically connected via a terminal connection hole 32c (board connection). The heat dissipation unit 4 integrally has an expansion support 42 that supports the terminal connection hole 32c (board connection) at least in the optical axis direction (front-rear direction) of the heat dissipation unit 4. Therefore, a vehicle lamp 1 can be provided that can ensure the support rigidity of the terminal connection hole 32c (board connection) in the optical axis direction without increasing the number of components.

[0099] (2) The front surface 4A of the heat dissipation component 4 has an expansion support region 4Ae, which serves as an expansion support portion 42. The thickness 40e of the expansion support region 4Ae in the optical axis direction (front-back direction) of the heat dissipation component 4 is set to be thinner than the thickness 40a of the base region 4Aa (the thickness of the remaining region). Therefore, in addition to the effect described in (1) above, the original heat dissipation performance of the heat dissipation component 4 can be maintained, and the support rigidity of the terminal connection hole portion 32c (substrate connection portion) in the optical axis direction can be ensured.

[0100] (3) The front surface 4A of the heat dissipation component 4 has a light-emitting region 4Af for mounting the light-emitting element 31 and a circuit board region 4Ag (board region) for mounting the circuit board 32 (board). The circuit board region 4Ag (board region) includes an expansion support region 4Ae, which serves as an expansion support portion 42. The thickness 40f of the light-emitting region 4Af in the optical axis direction (front-back direction) of the heat dissipation component 4 is set to be at least thicker than the thickness 40g (board region thickness) of the circuit board region 4Ag. Therefore, in addition to the effects of (1) to (2) above, the temperature rise of the light-emitting element 31 can be suppressed, and the heat dissipation generated from the light-emitting element 31 can be promoted.

[0101] (4) On the front surface 4A of the heat dissipation component 4, the light-emitting element 31 and the circuit board 32 (substrate) are mounted in different areas. The front surface 4A of the heat dissipation component 4 has a light-emitting region 4Af for mounting the light-emitting element 31 and a circuit board region 4Ag (substrate region) for mounting the circuit board 32 (substrate). The circuit board region 4Ag (substrate region) includes an expansion support region 4Ae, which serves as an expansion support portion 42. The thickness 40f of the light-emitting region 4Af in the optical axis direction (front-back direction) of the heat dissipation component 4 is set to be at least thicker than the thickness 40g (substrate region thickness) of the circuit board region 4Ag. The light-emitting region 4Af is formed as a convex shape that protrudes from the front surface 4A of the heat dissipation component 4 at least beyond the circuit board region 4Ag (substrate region). Therefore, in addition to the effects of (1) to (3) above, the emitted light generated by the light-emitting element 31 (specifically the light-emitting portion 31c) is difficult to be interrupted by the circuit board 32 (substrate).

[0102] (5) The front surface 4A of the heat dissipation component 4 has a light-emitting region 4Af, a circuit board region 4Ag (board region), and an expanded light-emitting region 4Ah after the expanded light-emitting region 4Af. The thickness 40f of the light-emitting region 4Af and the thickness 40h of the expanded light-emitting region 4Ah in the optical axis direction (front-back direction) of the heat dissipation component 4 are set to be at least thicker than the thickness 40g (board region thickness) of the circuit board region 4Ag. The light-emitting region 4Af and the expanded light-emitting region 4Ah are formed into a convex shape that protrudes from the front surface 4A of the heat dissipation component 4 at least beyond the circuit board region 4Ag (board region), and are continuous in the front surface 4A of the heat dissipation component 4. Therefore, in addition to the effects of (4) above, the temperature rise of the light-emitting element 31 can be further suppressed, and the heat dissipation generated from the light-emitting element 31 can be further promoted.

[0103] (6) The expanded light-emitting area 4Ah is positioned above the light-emitting area 4Af in the vertical direction (vertical direction) when mounted on the vehicle. Therefore, in addition to the effect of (5) above, the temperature rise of the light-emitting element 31 can be further suppressed, and the heat dissipation generated from the light-emitting element 31 can be further promoted.

[0104] (7) The circuit board 32 (board) has a riveting hole 32a (hole). The heat dissipation member 4 has a positioning protrusion 46 that is inserted into the riveting hole 32a (hole) and riveted. Therefore, in addition to the effects of (4) to (6) above, the circuit board 32 (board) can be easily positioned relative to the heat dissipation member 4, and the circuit board 32 (board) can be prevented from falling off the heat dissipation member 4.

[0105] The vehicle lamp 1 of this disclosure has been described above based on Embodiment 1, but the specific structure is not limited to this embodiment. Changes and additions to the design are permitted without departing from the spirit of the invention as described in the claims.

[0106] In Embodiment 1, an example is shown in which the circuit board 32 is electrically connected to the power supply component 5 via solder, and the substrate connection portion of the circuit board 32 is provided as a terminal connection hole portion 32c, but this is not a limitation. For example, the substrate connection portion of the circuit board 32 may also be provided as a plate-shaped terminal. In short, the circuit board 32 and the power supply component 5 can be electrically connected. Even with such a configuration, the effects described in (1) to (7) above are achieved.

[0107] In Embodiment 1, an example is shown where the expansion support 42 supports the terminal connection hole 32c and its periphery (a part of the circuit board 32), but it is not limited to this. In short, the expansion support 42 can be used to support the board connection portion that electrically connects the circuit board 32 and the power supply component 5, at least in the arrangement of the heat dissipation component 4 in the optical axis direction. Even with such a configuration, the effects described in (1) to (7) above are achieved.

[0108] In Embodiment 1, an example is shown in which the entire front surface 4A of the heat dissipation component 4 is divided into a base region 4Aa, an expansion support region 4Ae, a light-emitting region 4Af, a circuit board region 4Ag, an expansion light-emitting region 4Ah, and a riveting region 4Aj, but this is not a limitation. For example, the position and size of the above regions can be changed, and other regions can be added to the above regions. Even with such a configuration, at least the effects described in (1) to (5) and (7) above are achieved.

[0109] In Example 1, an example is shown where the remaining area is set as the base area 4Aa, but it is not limited to this. In short, in the front surface 4A of the heat dissipation component 4, the thickness 40e of the expansion support area 4Ae can be thinner than the thickness of the remaining area. Even if it is configured like this, at least the effects described in (1) to (2) above will be achieved.

[0110] In Example 1, an example was shown where the thickness 40f of the light-emitting region 4Af was set to be thicker than the thickness 40g of the circuit board region 4Ag. Furthermore, an example was shown where the thickness 40f of the light-emitting region 4Af was set to be the same as the thickness 40h of the expanded light-emitting region 4Ah. However, this is not a limitation. For example, the thickness 40f of the light-emitting region 4Af could also be set to be thicker than the thickness 40g of the circuit board region 4Ag and the thickness 40h of the expanded light-emitting region 4Ah (the thickness of the remaining region excluding the light-emitting region 4Af). Even with such a configuration, at least the effects described in (1) to (4) above are achieved.

[0111] In Embodiment 1, an example is shown where the light-emitting region 4Af is formed in a convex shape where the front surface 4A of the heat dissipation component 4 protrudes beyond the circuit board region 4Ag, but this is not a limitation. For example, the light-emitting region 4Af may also be formed in a convex shape where the front surface 4A of the heat dissipation component 4 protrudes beyond both the circuit board region 4Ag and the expanded light-emitting region 4Ah. For example, the expanded light-emitting region 4Ah may not be formed in a convex shape where the front surface 4A of the heat dissipation component 4 protrudes beyond the circuit board region 4Ag. Even with such a configuration, at least the effects described in (1) to (4) above are achieved. Furthermore, the light-emitting region 4Af may also be formed in a convex shape where the front surface 4A of the heat dissipation component 4 protrudes beyond the circuit board region 4Ag. For example, the light-emitting region 4Af may also be formed in a convex shape where the rear surface of the heat dissipation component 4, opposite to the front surface 4A, protrudes beyond at least the circuit board region 4Ag. Even with such a configuration, at least the effects described in (1) to (3) above are achieved.

[0112] In Example 1, an example was shown where the thickness 40h of the expanded light-emitting region 4Ah was set to be the same as the thickness 40f of the light-emitting region 4Af and thicker than the thickness 40g of the circuit board region 4Ag, but this is not a limitation. For example, the thickness 40h of the expanded light-emitting region 4Ah could also be set to be thinner than the thickness 40f of the light-emitting region 4Af, thicker than the thickness 40g of the circuit board region 4Ag, and thicker than the thickness 40f of the light-emitting region 4Af. That is, the thickness 40h of the light-emitting region 4Af and the expanded light-emitting region 4Ah could not be located on the same plane on the front side. Even with such a configuration, at least the effects described in (1) to (5) above are achieved.

[0113] In Example 1, an example is shown where the extended light-emitting region 4Ah is positioned at the upper side in the vertical direction compared to the light-emitting region 4Af when mounted on the vehicle, but this is not a limitation. For example, the extended light-emitting region 4Ah may also be positioned at the lower side in the vertical direction compared to the light-emitting region 4Af when mounted on the vehicle, or at the left or right sides in the width direction, etc. Even with such a configuration, at least the effects described in (1) to (5) above are achieved.

[0114] In Embodiment 1, an example is shown where the heat dissipation component 4 has a finned portion 43 protruding rearward from the rear surface 41B of the base, but this is not a limitation. For example, the heat dissipation component 4 may not have a finned portion 43. Even with such a configuration, the effects described in (1) to (7) above are achieved. Furthermore, in such a configuration, for example, the rear surface 41B of the base is made flat, and the groove 71e of the socket 7 is made flat. Moreover, thermally conductive grease 100 is applied to the flat surface of the socket 7, and the heat dissipation component 4 is assembled at the socket 7.

[0115] In Embodiment 1, an example is shown where the light-emitting element 31 and the circuit board 32 are separately mounted on the heat dissipation component 4 in a sub-base type, but this is not a limitation. For example, a substrate assembly type may also be used. That is, a type in which the light-emitting element 31 is mounted on the front surface of the circuit board 32 and the heat dissipation component 4 is arranged on the rear side of the circuit board 32 may also be used. In such a configuration, the circuit board 32 may also be configured as a control circuit for driving and controlling the light-emitting part 31c. Even with such a configuration, at least the effects described in (1) to (3) above are achieved. Furthermore, the sub-mounting substrate 31a in Embodiment 1 can be electrically connected to the circuit board 32, and the structure of the bonding lead 33 in Embodiment 1 is not limited.

[0116] In Example 1, an example is shown of using ultrasound to press the heat dissipation component 4 into the socket 7. Additionally, an example is shown of applying thermally conductive grease 100 to the groove 71e of the socket 7. However, this is not a limitation. For example, it may be configured to be a pressing-in process using only pressure, rather than using ultrasound. Furthermore, in the case of pressing in using ultrasound, the thermally conductive grease 100 may not be applied. Even with such a configuration, the effects described in (1) to (7) above are achieved.

[0117] In Embodiment 1, an example is shown of applying the vehicle lamp 1 of this disclosure to a reflective lamp for vehicles such as automobiles, which utilizes a reflective surface 13a (reflector 13). However, this is not a limitation; the vehicle lamp 1 of this disclosure can be applied to lamps utilizing projection lenses, or to light-guiding type lamps that use a light-guiding component in front of the light source (light-emitting part 31c). In short, the vehicle lamp 1 of this disclosure can be any vehicle lamp that includes a light source part, a power supply part, a heat dissipation part integrally equipped with an expansion support part, and a socket, or it can be any other vehicle lamp used in vehicles.

[0118] Explanation of symbols

[0119] 1—Vehicle lamp; 2—Light source unit; 3—Light source section; 31—Light-emitting element; 31c—Light-emitting section; 32—Circuit board (board); 32a—Riveting hole section (hole); 32c—Terminal connection hole section (board connection section); 4—Heat dissipation component (heat sink); 4A—Front surface of heat dissipation component; 4Aa—Base area (remaining area); 4Ae—Expansion support area; 4Af—Light-emitting area; 4Ag—Circuit board area; 4Ah—Expanded light-emitting area; 40a—Base Thickness of the region, 40e—thickness of the expansion support region, 40f—thickness of the light-emitting region, 40g—thickness of the circuit board region, 40h—thickness of the expanded light-emitting region, 42—expansion support part, 44—first protrusion, 45—second protrusion, 46—positioning protrusion, 5—power supply component (light source side connector), 51—power supply terminal (electrode pin), 7—socket, X—width direction (left and right direction), Y—up and down direction (vertical direction), Z—optical axis direction (front and back direction).

Claims

1. A vehicle lamp, characterized in that, have: The light source unit has a light-emitting element and a substrate connected to the light-emitting element; A power supply component that supplies power to the aforementioned light source unit; A heat dissipation component, which mounts the aforementioned light source unit; and The connector is assembled on the rear side, opposite to the front surface of the heat dissipation component on which the light source is mounted. The aforementioned power supply component is electrically connected to the aforementioned substrate via the substrate connection portion. The aforementioned heat dissipation component integrally includes an expansion support portion that supports the substrate connection portion at least in the front-rear direction of the heat dissipation component's configuration. The front surface of the aforementioned heat dissipation component has an expansion support area that serves as the aforementioned expansion support portion. The thickness of the expansion support region in the front-to-back direction of the aforementioned heat dissipation component is set to be thinner than the thickness of the remaining region.

2. The vehicle lighting fixture according to claim 1, characterized in that, The front surface of the aforementioned heat dissipation component has a light-emitting area for mounting the aforementioned light-emitting element and a substrate area for mounting the aforementioned substrate. The aforementioned substrate region includes an expansion support region that serves as the aforementioned expansion support portion. The thickness of the light-emitting region in the front-to-back direction of the heat dissipation component is set to be at least thicker than the thickness of the substrate region.

3. The vehicle lighting fixture according to claim 1, characterized in that, On the front surface of the aforementioned heat dissipation component, the aforementioned light-emitting element and the aforementioned substrate are mounted in different areas. The front surface of the aforementioned heat dissipation component has a light-emitting area for mounting the aforementioned light-emitting element and a substrate area for mounting the aforementioned substrate. The aforementioned substrate region includes an expansion support region that serves as the aforementioned expansion support portion. The thickness of the light-emitting region in the front-to-back direction of the aforementioned heat dissipation component is set to be at least thicker than the thickness of the substrate region. The light-emitting area is formed as a convex shape on the front surface of the heat dissipation component that protrudes at least beyond the substrate area.

4. The vehicle lighting fixture according to claim 3, characterized in that, The front surface of the aforementioned heat dissipation component has the aforementioned light-emitting area, the aforementioned substrate area, and an expanded light-emitting area formed by expanding the aforementioned light-emitting area. The thickness of the light-emitting region and the thickness of the expanded light-emitting region in the front-back direction of the aforementioned heat dissipation component are set to be at least thicker than the thickness of the substrate region. The aforementioned light-emitting area and the aforementioned expanded light-emitting area are formed into a convex shape that protrudes at least beyond the aforementioned substrate area from the front surface of the aforementioned heat dissipation component, and are continuous regions on the front surface of the aforementioned heat dissipation component.

5. The vehicle lighting fixture according to claim 4, characterized in that, The aforementioned extended light-emitting area is positioned above the aforementioned light-emitting area in the vertical direction when mounted on the vehicle.

6. The vehicle lighting fixture according to claim 3, characterized in that, The aforementioned substrate has holes. The aforementioned heat dissipation component has a positioning protrusion that is inserted into the aforementioned hole and riveted.

Images