Optical connector device with cover

Abstract

An optical connector apparatus is provided. The optical connector apparatus includes a semiconductor package including a receptacle and a cap. The optical connector apparatus also includes an adapter attached to the cap of the semiconductor package and a connector removably attached to the adapter. The adapter includes a raised portion adapted to fit into an adapter opening of the cap, an adapter recess adapted to house at least a portion of the connector, and a first retainer in the adapter recess to removably attach the connector to the adapter at a predetermined position. The connector includes an optical fiber array corresponding to the receptacle and extending in a vertical direction with respect to a plane of the semiconductor package, a second retainer used in conjunction with the first retainer, and a biasing member to bias a portion of the connector toward the semiconductor package.

Description

Background Technology

[0001] This disclosure relates to the electrical, electronic, and computer fields. In particular, this disclosure relates to an optical connector for an optical multi-chip module (MCM) that includes a lens array that can be used to connect optical waveguides and optical fibers from one module to another. Summary of the Invention

[0002] Embodiments of this disclosure relate to an optical connector device. The optical connector device includes a semiconductor package comprising a container and a cover. The optical connector device further includes: an adapter attached to the cover of the semiconductor package; and a connector removably attached to the adapter. The adapter includes: a protrusion adapted to fit into an adapter opening of the cover; an adapter recess adapted to receive at least a portion of the connector; and a first retainer located in the adapter recess to removably attach the connector to the adapter at a predetermined position. The connector includes: an optical fiber array corresponding to the container and extending in a direction perpendicular to the plane of the semiconductor package; a second retainer used in conjunction with the first retainer; and a biasing member for biasing a portion of the connector toward the semiconductor package.

[0003] Other embodiments of this disclosure relate to an optical connector device. The optical connector device includes: a semiconductor package including a container and a cover; a connector attachable to the container; an adapter movably coupled to the connector and removably attached to the cover; and a biasing member positioned between the connector and the adapter. The biasing member is adapted to bias the connector toward the semiconductor package. The connector includes: an optical fiber array corresponding to the container and extending in a direction perpendicular to the plane of the semiconductor package; and a protrusion adapted to fit into a connector opening in the cover. Furthermore, the adapter includes a first retainer adapted to fit into a first retainer opening in the cover.

[0004] The above description is not intended to depict every illustrated embodiment or every implementation of this disclosure. Attached Figure Description

[0005] The accompanying drawings included in this application are incorporated in and form a part of this specification. They illustrate embodiments of the present disclosure and, together with the specification, explain the principles of the disclosure. The drawings are merely illustrative of certain embodiments and are not intended to limit the scope of the disclosure.

[0006] Figure 1 This is a cross-sectional view of the basic structure of the multi-chip module (MCM) fiber optic connection device according to an embodiment.

[0007] Figure 2A This is a cross-sectional view of the optical connector device according to an embodiment at an intermediate stage of the manufacturing or assembly process.

[0008] Figure 2B According to the embodiments Figure 2A A top view of the container of the optical connector device shown.

[0009] Figure 2C According to the embodiments Figure 2A A cross-sectional view of an optical connector device in a later stage of the manufacturing or assembly process.

[0010] Figure 2D According to the embodiments Figure 2C The top view of the cover of the optical connector device shown.

[0011] Figure 2E According to the embodiments Figure 2C A cross-sectional view of an optical connector device in a later stage of the manufacturing or assembly process.

[0012] Figure 2F According to the embodiments Figure 2E The adapter shown is a side view.

[0013] Figure 2G According to the embodiments Figure 2E The adapter shown is a bottom view.

[0014] Figure 2H According to the embodiments Figure 2E A cross-sectional view of an optical connector device in a later stage of the manufacturing or assembly process.

[0015] Figure 2I According to the embodiments Figure 2H A side view of the connector of the optical connector device.

[0016] Figure 2J According to the embodiments Figure 2H The image shows a bottom view of the connector of the optical connector device.

[0017] Figure 3A This is a cross-sectional view of the optical connector device according to an embodiment at an intermediate stage of the manufacturing or assembly process.

[0018] Figure 3B According to the embodiments Figure 3A A top view of the adapter and fiber optic bundle.

[0019] Figure 3C According to the embodiments Figure 3A Top view of the connector and cover.

[0020] Figure 3D According to the embodiments Figure 3A Side view of the connector and cover.

[0021] Figure 3E According to the embodiments Figure 3A Side view of the adapter and cover.

[0022] Figure 3F According to the embodiments Figure 3A A bottom view of the connector and cover.

[0023] Figure 3G According to the embodiments Figure 3A Bottom view of the connector, cover, and adapter.

[0024] Figure 3H -J illustrates the adapter and connector according to the embodiment in three stages to Figure 3A The attachment of the cover to the optical connector device shown.

[0025] Figure 4 It is applied according to the embodiment to Figure 3A A diagram of the optical connector device shown.

[0026] Figure 5 This is a cross-sectional view of an optical connector device including a connector, adapter, cover, and container according to an embodiment.

[0027] Figures 6A-6C These are, respectively, a top view, a side view, and a cross-sectional view of the adapter of the optical connector device according to the embodiment.

[0028] It should be understood that the elements in the accompanying drawings are shown for simplicity and clarity. For simplicity and to aid in understanding the illustrated embodiments, well-known elements that may be useful or necessary in commercially viable embodiments may not be shown. Detailed Implementation

[0029] This disclosure describes an optical connector device. Specifically, the embodiments disclosed herein include optical connector devices comprising various combinations of adapters and connectors. The connector includes an array of fiber bundles, and the adapter helps to accurately and flexibly secure the connector to a semiconductor package attached to a substrate. Each embodiment includes components of the optical connector device that allow for both coarse and fine alignment of the adapter and connector with the container of the semiconductor package. Furthermore, the embodiments allow for reduction of stress that may be applied to the fibers of the fiber bundle array or to the connector itself. In related devices, there may be an effect where the connector can be damaged by tension from the fiber. The adapter of this embodiment can mitigate these effects.

[0030] Various embodiments of this disclosure are described herein with reference to the accompanying drawings. Alternative embodiments may be devised without departing from the scope of this disclosure. Note that various connections and positional relationships (e.g., above, below, adjacent, etc.) are set forth between elements in the following description and drawings. Unless otherwise specified, these connections and / or positional relationships may be direct or indirect, and this disclosure is not intended to be limiting in this respect. Thus, coupling of entities may refer to direct or indirect coupling, and positional relationships between entities may be direct or indirect positional relationships. As an example of an indirect positional relationship, the description of forming layer "A" above layer "B" includes cases where one or more intermediate layers (e.g., layer "C") are between layer "A" and layer "B," provided that the relevant characteristics and functions of layer "A" and layer "B" are not substantially altered by the one or more intermediate layers.

[0031] The following definitions and abbreviations are used to interpret the claims and specification. As used herein, the terms “comprising,” “including,” “having,” “containing,” or any other variations thereof are intended to cover a non-exclusive inclusion. For example, a composition, mixture, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or inherent to such compositions, mixtures, processes, methods, articles, or apparatus.

[0032] For the purposes described below, the terms “upper,” “lower,” “right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” and their derivatives shall apply to the described structures and methods, as oriented as shown in the figures. The terms “cover,” “on top,” “positioned on,” or “positioned on top” indicate that a first element, such as a first structure, is present on a second element, such as a second structure, wherein an intermediate element, such as an interface structure, may be present between the first and second elements. The term “direct contact” means that the first element, such as a first structure, and the second element, such as a second structure, are connected at the interface of the two elements without any intermediate conductive, insulating, or semiconductor layer. It should be noted that the terms “selective towards what,” such as “the first element is selective towards the second element,” mean that the first element can be etched, and the second element can act as an etch stop layer.

[0033] Now referring to the accompanying drawings, in which the same reference numerals denote the same or similar elements, first refer to... Figure 1 This illustrates an example of a general conceptual configuration of an MCM fiber optic connection device 100 according to an embodiment. Figure 1 As shown, a substrate 102 (e.g., an organic substrate) is provided, which can be used as a supporting base structure for the remaining components of the MCM fiber optic connection device 100. A cover 104 (e.g., a heat sink cover) covers the various components of the MCM fiber optic connection device 100.

[0034] like Figure 1 As shown, in some embodiments, the MCM fiber optic connectivity device 100 may include a chip-scale package 110 (CSP) connected to an organic substrate 102 (or other circuitry electrically connected to the organic substrate 102) via a first plurality of bonding pads 112 (e.g., solder bumps). Similarly, a logic chip 114 (e.g., a central processing unit or CPU) may be connected to the CSP 110 via a second plurality of bonding pads 113. In some embodiments, a cover 104 covers the CSP 110 and the logic chip 114.

[0035] Similarly, Figure 1 As shown, for the MCM fiber optic connection device 100, there is a light emitting section 160 and a light receiving section 162. The light emitting section 160 may include a light emitting device 150 (e.g., one or more vertical-cavity surface-emitting lasers or VCSELs, or any other suitable light emitting device). The light receiving section 162 may include a light receiving device 152 (e.g., one or more photodiodes or PDs, or any other suitable light receiving device). Typically, in some embodiments, light generated in the light emitting device 150 passes through a first optical waveguide 105A (i.e., a light guide plate) by means of a first reflective element 106A. The reflected light propagates upward to a first container 132, then through a first adapter 130, then through a first connector 128, and then through a first connector cap 126 to reach the fiber array 122. Light travels from the light emitting section 160 side through the fiber array 122 to the light receiving section 162 side. In particular, the light travels through a second connector cap 120, then through a second connector 118, then through a second adapter 116, and then through a second container 138. Light that has traveled through the second container is received by the second optical waveguide 105B (i.e., the light guide plate) and travels through the second optical waveguide 105B to reach the light receiving device 152 by means of the second reflective element 106B. In some embodiments, the cover 104 has an opening (or bore or aperture) to accommodate at least the first container 130 and the second container 116. In some embodiments, the opening of the cover 104 may also accommodate at least a portion of the first container 132 and the second container 138. Thus, in the MCM fiber optic connection device 100, the light emitting section 160 and the light receiving section 162 enable transmission from one side to the other via the fiber array 122 and the other components discussed above. It should be understood that Figure 1 These are merely conceptual diagrams of a few components of an example MCM fiber optic connection device 100, illustrating how optical connectors can be used to transmit light, and that additional components may or may not be required. Figure 1 Some of the components shown. Furthermore... Figure 1 The various components shown may not be drawn to scale.

[0036] Now for reference Figure 2A-2J First refer to Figure 2A A cross-sectional view of an embodiment of an optical connector device 201 at an intermediate stage of the manufacturing or assembly process is shown. Figure 2A As shown, a substrate 200 is provided. In some embodiments, the substrate 200 may be composed of one or more organic materials. An optical waveguide 202 is disposed on the substrate 200. The optical waveguide 202 may be related to the above-mentioned... Figure 1 The optical waveguides 105A and 105B discussed may be similar or different. A first fiber optic connection array 204 is disposed on or within the optical waveguide 202. The first fiber optic connection array 204 may include, for example, an array of 12 or 24 different fiber optic lenses for receiving or transmitting light through the optical waveguide 202. In other words, light can pass through the lenses of the fiber optic connection array 204 from either the top or bottom side.

[0037] like Figure 2A As shown, a container 206 is disposed on top of the optical waveguide 202. Therefore, in some examples, the container 206 is attached to the organic substrate 200 on which the waveguide is integrated, and is fixed thereto using, for example, an adhesive. In some embodiments, the container 206 includes an alignment recess 207 configured to receive alignment pins from the adapter 224, as discussed in further detail below. The container 206 also includes a second fiber optic connection array 208. The second fiber optic connection array 208 has the same number and pattern of lenses as the first fiber optic connection array 204 discussed above regarding the optical waveguide. Figure 2B The diagram shows a top view of a container 206 including a second fiber optic connection array 208. Figure 2B In the example shown, the second fiber optic connection array 208 includes a 2×12 lens array. However, it should be understood that any array of suitable size can be used.

[0038] Now for reference Figure 2C This illustrates the subsequent stages of the manufacturing or assembly process. Figure 2A A cross-sectional view of an embodiment of the optical connector device 201 shown. The cover 212 is attached to the substrate 200 using adhesive. Figure 2D As shown, it illustrates Figure 2C The top view of the cover 212 shows that the cover 212 includes a first opening 222 corresponding to the size of the container 206. The cover 212 also includes, for example, two attachment holes 214. In this example, the attachment holes 214 are on opposite sides of the first opening 222. As discussed in further detail below, the attachment holes 214 are configured to receive screws for securing the adapter 224 to the cover 212.

[0039] Now for reference Figure 2E The following is illustrated according to an embodiment. Figure 2C A cross-sectional view of an optical connector device in a later stage of the manufacturing or assembly process. (e.g.) Figure 2EAs shown, adapter 224 is fitted onto container 206 and screwed onto cap 212. Specifically, adapter 224 includes two studs 228 that fit into alignment recesses 207 in container 206. Figure 2E As shown in the example, stud 228 may have a tapered portion 229 (or a tapered end) that allows stud 228 to slide more easily into the alignment recess 207 of container 206. It should be understood that stud 228 may have any suitable shape or profile that allows easy connection between container 206 and adapter 224, and allows for precise alignment between them. Therefore, after adapter 224 is assembled into container 206 (i.e., by inserting stud 228 into alignment recess 207), the third fiber optic connection array 234 (i.e., which is part of adapter 224) is aligned with the first fiber optic connection array 204 and the second fiber optic connection array 208. Thus, all three fiber optic connection arrays are aligned with each other to allow light to pass from optical waveguide 202 through container 206 and through adapter 224. Similarly, as... Figure 2E As shown, the adapter 224 is connected to the cover 212 using screw 226.

[0040] like Figure 2E As shown, in some embodiments, adapter 224 includes connector recess 236, which enables attachment of a connector, as discussed in further detail below. Two guide pin recesses 232' are formed in adapter 224 to receive two guide pins 232 (see... Figure 2I The guide pin 232 can be made of metal (or any other suitable material) and can have a diameter of, for example, approximately 0.7 mm (or any other suitable diameter). Figure 2E As shown, adapter 224 includes two leaf springs 238 extending upward from connector recess 236. The leaf springs 238 are constructed in any suitable manner to guide the insertion and retention of the connector, which will be discussed in further detail below. In this example, the leaf springs 238 include a retaining portion having an inclined upper surface 240 for guiding the connector into the connector recess 236 of adapter 224. In this example, the retaining portion of the leaf springs 238 also includes an inclined lower surface 242, which acts as a pawl or retaining structure that prevents the connector from being removed once it is inserted and connected to adapter 224. It should be understood that this particular shape of the leaf springs 238 should not be construed as limiting and can be used to facilitate connector insertion (see...). Figure 2H The connector 250 can be inserted and retained in any suitable shape. For example, instead of the inclined upper surface 240 and inclined lower surface 242 of the leaf spring 238, a curved surface profile may exist on the inside of the leaf spring 238.

[0041] Now for reference Figure 2FThe figure illustrates an embodiment. Figure 2E The cross-sectional side view of adapter 224 is shown. Figure 2F As shown, adapter 224 includes a stud 228 extending from the underside of adapter 224. Adapter 224 also includes a lower portion 244 whose width in the Y direction approximately corresponds to the width of the first opening 222 of cover 212 in the Y direction (i.e., the width of the lower portion 244 is slightly smaller than the width of the first opening 222 so that the lower portion 244 can be fitted into the first opening 222), and whose length in the X direction approximately corresponds to the length of the first opening 222 of cover 212 in the X direction (i.e., the length of the lower portion 244 is slightly smaller than the length of the first opening 222 so that the lower portion 244 can be fitted into the first opening 222). Similarly, as... Figure 2F As shown, adapter 224 includes an upper portion 246, the width of which in the Y direction is greater than the width of the first opening 22 in the Y direction. Therefore, the bottom surface of the stud 228 (of adapter 224) contacts (or is close to) the lower surface of the container 206 in the recess 207, and the middle lower surface 247 of adapter 224 contacts the upper surface of the cover 212.

[0042] Now for reference Figure 2G The figure illustrates an embodiment. Figure 2E The diagram shows a top view of adapter 224. Screw holes 248 are provided in adapter 224 to accommodate screws. Figure 2E Screw 226 is shown. Additionally, a third fiber optic connection array 234 is shown. It should be understood that in some embodiments, the diameter of the screw hole 248 is slightly larger than the diameter of the screw 226 because screw 226 is not required for any fine alignment of the adapter 224 relative to the container 206 (i.e., this fine alignment is achieved using the studs 228 of the adapter 224 and the alignment recesses 207 of the container 206).

[0043] Now for reference Figure 2H A cross-sectional view of a connector 250 for an optical connector device 201 is shown according to an embodiment. Figure 2HAs shown, connector 250 is fitted onto adapter 224 via guide pin 232 (i.e., fitted into connector recess). In some embodiments, connector 250 includes a slider 252 movably coupled to the body of connector 250. Connector 250 includes a spring 254 that biases slider 252 away from the body of connector 250 in the vertical z-direction. Connector 250 also includes a first body protrusion 264 having a first lower inclined surface 260 and a second upper inclined surface 262. When connector 250 is attached to adapter 224, the first lower inclined surface 260 of connector 250 initially contacts the inclined upper surface 240 of leaf spring 238. As connector 250 moves downward after this initial contact, leaf spring 238 is pushed outward until connector 250 snaps into place in connector recess 236 of adapter 224. Figure 2H As shown, when connector 250 is connected to adapter 224, leaf spring 238 quickly returns to its position and the inclined lower surface 242 of leaf spring 238 contacts (or approaches) the second upper inclined surface 262 of the first body protrusion 264 of connector 250. Therefore, leaf spring 238 acts as a brake to keep connector 250 attached to adapter 224.

[0044] Similarly, Figure 2H As shown, once connector 250 is snapped into place, spring 254 pushes slider 252 downward. To remove connector 250, slider 252 can be pulled upward. When connector 250 and slider 252 are pulled upward, leaf spring 238 is pushed outward to release connector 250 from adapter 224. Second body protrusion 266 of connector 250 extends outward from connector 250 and is positioned above leaf spring 238. Spring 254 is positioned between first slider protrusion 270 of slider 252 and third body protrusion 268 of connector 250. Although in Figure 2H Not shown, but when connector 250 and slider 252 are not installed to adapter 224, spring 254 can bias slider 252 such that first slider protrusion 270 contacts second body protrusion 266 of connector 250. However, as Figure 2H As shown, when connector 250 and slider 252 are installed onto adapter 224, a small gap may exist between the first slider protrusion 270 and the second body protrusion 266 of connector 250. Similarly, as... Figure 2H As shown, fiber optic bundle 258 is connected to the top of connector 250. This fiber optic bundle 258 can be used with the above-mentioned... Figure 1 The fiber array 122 discussed is the same as or similar to the one discussed.

[0045] Now for reference Figure 2I The figure illustrates an embodiment. Figure 2HThe image shows a cross-sectional side view of connector 250 of the optical connector device. Two guide pins 232 are fitted into grooves in connector 250. Figure 2J An example is shown. Figure 2H The diagram shows a bottom view of connector 250 in an optical connector device. In some embodiments, the first dimension D1 of connector 250 (e.g., 5.2 mm) may be larger than the second dimension D2 of connector 250 (e.g., 3.2 mm). In other embodiments, the relative dimensions may differ. Figure 2J As shown, connector holes 280 are provided in the body of connector 250, and they accommodate guide pins 232. In other words, guide pins 232 enable fine alignment between adapter 224 and connector 250. As described above, the studs 228 of adapter 224 and the alignment grooves 207 of container 206 enable fine alignment between adapter 224 and container 206. Therefore, fine alignment can be achieved between all three components of container 206, adapter 224, and connector 250, enabling the first fiber optic connection array 204, second fiber optic connection array 208, third fiber optic connection array 234, and fourth fiber optic connection array 282 of connector 250 (see...). Figure 2J All of them are aligned with each other.

[0046] Now for reference Figure 3A-3J First refer to Figure 3A A cross-sectional view of an embodiment of an optical connector device 301 at an intermediate stage of the manufacturing or assembly process is shown. In this embodiment, as referenced above... Figure 2A-2J In contrast to the described embodiment, the connector is directly attached to the container (i.e., not an adapter) and aligned with the container. Furthermore, in this embodiment, unlike the above-described embodiment… Figure 2A-2J In contrast to the first embodiment described, the adapter is mounted on the outside of the connector (i.e., the connector is not on the outside of the adapter). Furthermore, the adapter does not include fiber optic arrays (i.e., the optical connector device includes only a total of three fiber optic arrays, compared to the four fiber optic arrays of the first embodiment).

[0047] like Figure 3A As shown, a substrate 300 is provided. In some embodiments, the substrate 300 may be composed of one or more organic materials. An optical waveguide 302 is disposed on the substrate 300. The optical waveguide 302 may be related to the above-mentioned... Figure 1 The optical waveguides 105A and 105B discussed may be similar or different. A first fiber optic connection array 304 is disposed on or within the optical waveguide 302. The first fiber optic connection array 304 may include, for example, an array of 12 or 24 different fiber optic lenses for receiving or transmitting light through the optical waveguide 302. In other words, light can pass through the lenses of the fiber optic connection array 304 from either the top or bottom side.

[0048] like Figure 3A As shown, a container 306 is disposed on top of the optical waveguide 302. Therefore, in some examples, the container 306 is attached to the organic substrate 300 on which the waveguide is integrated, and is secured thereto using, for example, an adhesive. In some embodiments, the container 306 includes an alignment recess 307 configured to receive alignment pins from a connector, as discussed in further detail below. The container 306 also includes a second fiber optic connection array 308. The second fiber optic connection array 308 has the same number and pattern of lenses as the first fiber optic connection array 304 discussed above with respect to the optical waveguide 302.

[0049] like Figure 3A As shown, the cover 312 is attached to the substrate 300 (e.g., using adhesive). The cover 312 includes a first opening 322 that roughly corresponds to the size of the container 306 (the size of the first opening 322 may be slightly larger than the size of the container 306). The cover 312 also includes, for example, two adapter attachment holes 314. In this example, the adapter attachment holes 314 are on opposite sides of the first opening 322. As discussed in further detail below, the adapter attachment holes 314 are configured to receive a leaf spring 338 (or a first retainer) of an adapter 324 for securing the adapter 324 to the cover 312.

[0050] like Figure 3A As shown, a connector 350 is provided having a third fiber optic connection array 382 including multiple lenses and a fiber optic bundle 358. It should be understood that in this embodiment (as referenced above)... Figure 2A-2J (In contrast to the discussed embodiment), the fiber bundle 358 is directly attached to the connector 350 instead of the adapter 324. The connector 350 includes two studs 328 that fit into alignment recesses 307 of the container 306. Figure 3A As shown in the example, stud 328 may have a tapered portion 329, which allows the bolt 328 to slide more easily into the alignment recess 307 of the container 206. It should be understood that stud 328 may have any suitable shape or profile that allows for easy connection between the container 306 and the connector 350, and allows for fine alignment between them. Thus, the connector 350, having a lens array and fiber bundle 358, is aligned with the container 306 along the X and Y directions around the periphery of the stud 328, and along the Z direction at the bottom of the alignment recess 307. Therefore, after the connector 350 is assembled into the container 306 (i.e., by inserting the stud 328 into the alignment recess 307), the third fiber connection array 382 (i.e., which is part of the connector 350) is aligned with the first fiber connection array 304 and the second fiber connection array 308. Thus, the lenses of all three fiber connection arrays are aligned with each other to allow light to pass from the optical waveguide 302 through the container 306 and through the connector 350.

[0051] like Figure 3A As shown, adapter 324 is coupled to connector 350 via spring 354. Spring 354 provides a biasing force that pushes adapter 324 away from connector 350 in the vertical Z direction. However, connector 350 includes a first connector protrusion 366 projecting outward from a body portion of connector 350, and adapter 324 includes a first adapter protrusion 368 projecting inward. Therefore, adapter includes first adapter protrusion 368 that overlaps with first connector protrusion 366 in a lateral direction relative to the plane of the semiconductor package. Adapter 324 has a cap-like configuration covering (or surrounding) a portion of connector 350. First connector protrusion 366 and first adapter protrusion 368 are configured to overlap in the horizontal X direction to prevent adapter 324 from being removed from connector 350. (Refer to below...) Figure 3I In a further detailed description, when spring 354 is in the extended configuration, the first adapter protrusion 368 will directly contact the first connector protrusion 366. (See again...) Figure 3A In some embodiments, connector 350 may include one or more connector spring protrusions 390, and adapter 324 may include one or more adapter spring protrusions 392. Spring 354 may be coiled around connector spring protrusions 390 and adapter spring protrusions 392 to hold spring 354 in place. The protrusions have a length configured to allow adapter 324 a certain amount of movement to connector 350 in the vertical Z direction. As will be described in further detail below, adapter 324 includes leaf spring 338, which allows adapter 324 to be removably attached to cover 312. In alternative embodiments, adapter 324 may be attached to cover with screws (not shown) instead of leaf spring 324. Leaf spring 338 may include pawl 394, which allows adapter 324 to become removably secured (or mounted or attached or engaged) to cover 312. In some embodiments, connector 350 is secured in the X, Y, and Z directions (i.e., pitch and roll directions) by the force of spring 354 between connector 350 and adapter 324. In order to remove connector 350 and adapter 324 from container 306 and substrate 300, adapter is pulled upward in the Z direction until pawl 394 is pushed upward through adapter attachment hole 314 to release the structure.

[0052] Now for reference Figure 3B , showed Figure 3A A top view of the adapter 324 and fiber bundle 358 shown. Figure 3B As shown, adapter 324 includes adapter hole 396. In some embodiments, adapter hole 396 has a length and width slightly larger than the length and width of fiber bundle 358. Figure 3BIn the example shown, the fiber bundle 358 has a length dimension of 3.0 mm in the X direction and a width of 0.5 mm in the Y direction. Furthermore, the adapter hole has a length dimension of 3.4 mm in the X direction and a width of 0.9 mm in the Y direction. Therefore, a slit “S” (i.e., a gap) exists between the outer periphery of the fiber bundle 358 and the inner periphery of the adapter hole 396. Where the substrate 300 may exhibit a certain degree of warping, the connector 350 can utilize the restoring force of the spring 354 to follow the warping of the substrate 300. Furthermore, as... Figure 3B As shown, regarding connector 350 and fiber bundle 358, any warping of substrate 300 in the X and Y directions can be accommodated by the slit "S" between adapter 324 and connector 350 (i.e., which is attached to fiber bundle 358). Therefore, movement of substrate 300 caused by warping can be resolved by the slit "S" to reduce or eliminate any misalignment of the various components of optical connector device 301.

[0053] Now for reference Figure 3C , showed Figure 3A A top view of connector 350 and cover 312 shown. Figure 3C As shown, two adapter connection holes 314 are formed on both sides of the first opening 322 of the cover 312. (As mentioned above regarding...) Figure 3A As discussed in detail, the size and position of the adapter attachment hole 314 are configured to receive the leaf spring 338 of the adapter 324. As described above, the connector 350 includes two first connector protrusions 366 on both sides of the connector 350. The spring 354 surrounds the fiber bundle 358.

[0054] Now for reference Figure 3D The image shows a side view of connector 350 and cover 312. Figure 3E A side view of the adapter 324, cover 312, and fiber bundle 358 is shown. The connector is received in the first opening 322 of cover 312, as shown in the diagram. Figure 3A The cross-sectional side view is shown.

[0055] Now for reference Figure 3E The image shows a side view of adapter 324 and cover 312. In this view, adapter 324 surrounds (or covers) connector 353 such that only the top portion of the fiber bundle 358 (i.e., which is attached to connector 350) protrudes above the top surface of adapter 324. The leaf spring 338 of adapter 324 is received in adapter attachment hole 314 of cover 312, as shown. Figure 3A The cross-sectional side view is shown.

[0056] Now for reference Figure 3FThe diagram shows a bottom view of connector 350 and cover 312. As described above, cover 312 includes a first opening 322 and an adapter attachment hole 314. Connector 350 is received in the first opening 322 of the connector, and the connector includes a first connector protrusion 366 and a third fiber optic connection array 382.

[0057] Now for reference Figure 3G The diagram shows a top view of connector 350, cover 312, and adapter 324. As described above, cover 312 includes a first opening 322 and an adapter attachment hole 314. Connector 350 is received in the first opening 322 of the connector, and the connector includes a first connector protrusion 366 and a third fiber optic connection array 382. Adapter 324 can be seen located in the first opening 322 and adapter attachment hole 314. Although from... Figure 3G It is not obvious in this bottom view, but the pawl 394 of the leaf spring 338 of adapter 324 is hooked onto the bottom surface of cover 312, as is the case here. Figure 3J As shown and described below.

[0058] Now refer to Figure 3H The attachment of adapter 324 and connector 350 to cover 312 of optical connector device 301 is shown in a series of steps. For simplicity and ease of understanding, the above references are omitted here. Figure 3A-3I Some components of the optical connector device 301 discussed. For example... Figure 3H The diagram illustrates the first stage of attaching the adapter 324 and connector 350 to the cover 312. Figure 3H In this phase, adapter 324 and connector 350 move in the direction of travel indicated by the arrow. At this stage, spring 354 extends slightly so that there is no gap between the first connector protrusion 366 of connector 350 and the first adapter protrusion 368 of adapter 324. In other words, because adapter 324 and connector 350 can move relative to each other, and because spring 354 pushes these parts apart, there is no gap that could possibly exist between the first connector protrusion 366 of connector 350 and the first adapter protrusion 368 of adapter 324. Figure 3H As shown, the bottom pawl portion of the leaf spring 338 contacts the top side of the cover 312. In some embodiments, the external dimension D1 of the leaf spring 338 is larger than the external dimension D2 of the adapter attachment hole 314.

[0059] Therefore, as Figure 3I As shown, when the adapter 324 and connector 350 move further in the direction of travel, the leaf spring 338 is forced to bend inward by an angle α. Figure 3I As shown, when the stud 328 is inserted into the alignment groove 307 of the container 306 (see... Figure 3HDuring this process, precise alignment of connector 350 with container 306 is achieved. Once the bottom contact of stud 328 is aligned with the bottom of recess 307, connector 350 can no longer move downwards. However, because there is still space between the bottom of leaf spring 338 and the top surface of optical waveguide 302, adapter 324 can move further downwards in the direction of travel.

[0060] Therefore, as Figure 3J As shown, adapter 324 moves further downward along the travel direction until the pawl portion of leaf spring 338 passes the underside of cover 312, spring 354 is compressed by a certain amount, and a gap is formed in the vertical Z direction between the first connector protrusion 366 of connector 350 and the first adapter protrusion 368 of adapter 324. At this stage, adapter 324 and connector 350 are attached and assembled to cover 312.

[0061] exist Figure 3A-3J In the illustrated embodiment, the restoring force of the spring 354 required to hold the components of the optical connection device 301 in place can be simulated as the force generated by the torque on the rigid T-bar, such as... Figure 4 As shown, in some embodiments, the force on the optical connection device 301 can be simulated as follows: Figure 4 As shown, and as follows:

[0062] as well as

[0063] F sp =kΔy

[0064] In order to keep connector 350 in the proper position, the following conditions must be met:

[0065] F ap >F2

[0066] Therefore, the desired spring has a spring constant k that satisfies the following relationship:

[0067]

[0068] In one example, where h = 10 mm, w = 1 mm, F1 = 0.5 N, and Δy = 1 mm, the spring constant k will need to be greater than 5 N / mm to hold connector 350 in place. In some embodiments, spring 354 may be a Bass spring or a disc spring. However, it should be understood that any suitable type of spring may be used.

[0069] Now for reference Figure 5The diagram shows the dimensions of connector 550 (or an adapter depending on the embodiment described above) relative to cap 512 and container 506. In some embodiments, container 506 and cap 512 satisfy the condition that when connector 550 is fitted into cap hole 522 (i.e., coarse alignment), the center of stud 528 is within the groove circle 507 of container 506, and the stud center and groove center automatically self-align along the stud tapered shape.

[0070]

[0071]

[0072] The diameter of the bolt.

[0073] x con y con The gaps between the connector and the cover are in the X and Y directions, respectively.

[0074] x rec y rec The gaps between the container and the lid in the X and Y directions, respectively.

[0075] It should be understood that, despite Figure 5 The stud 528 in the design is a cone with a column, but any other suitable shape (such as a cone, pyramid, etc.) can be used.

[0076] Now refer to Figures 6A-6C They respectively showed Figure 3A The top view, side view, and cross-sectional view of the adapter are shown, wherein adapter 624 comprises two separate parts that are attached together with screws 650. However, it should be understood that the adapter may be a single integral part, or it may comprise three or more separate parts attached together.

[0077] In some embodiments, the optical connector device may have high fixation strength and high warpage tolerance. In some embodiments, the optical connector device has a stable and removable fixing device, which can simplify the assembly process. For example, coarse alignment of the connector into the cap hole results in fine self-alignment with the container. Furthermore, the substrate used in the optical MCM can be an optoelectronic composite substrate, so that if the adapter were fixed to the substrate, the manufacturing process would be more complex. However, fixing the adapter to the cap only adds a cap with metalworking, which is advantageous for reliability.

[0078] Various embodiments have been described for illustrative purposes and are not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope of the described embodiments. The terminology used herein has been chosen to best explain the principles of the embodiments, their practical application, or improvements to existing technologies in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. An optical connector device, comprising: A semiconductor package includes a container and a cap, wherein the container includes at least one container alignment recess; An adapter, which is attached to the cover of the semiconductor package; and A connector, which is removably attached to the adapter. The adapter includes: The protruding portion is adapted to fit into the adapter opening of the cover. At least one stud, extending from the protrusion and sized to fit into the at least one container alignment groove. An adapter recess adapted to receive at least a portion of the connector, and A first retainer, located in the adapter recess, is used to removably attach the connector to the adapter at a predetermined position. The connector includes: An optical fiber array, corresponding to the container, extends in a direction perpendicular to the plane of the semiconductor package. The second retainer, which is used in conjunction with the first retainer, and A biasing member for biasing a portion of the connector toward the semiconductor package.

2. The optical connector device according to claim 1, wherein, The stud has a tapered end.

3. The optical connector device according to claim 1, further comprising: At least one guide pin connects and aligns the connector with the adapter.

4. The optical connector device according to claim 1, wherein, The connector includes a first part and a second part, wherein the second part is movably coupled to the first part.

5. The optical connector device according to claim 4, wherein, The biasing member is a spring positioned between the first portion and the second portion of the connector, the spring being adapted to bias the first portion of the connector away from the second portion of the connector in the vertical direction.

6. The optical connector device according to claim 1, wherein, The first retainer is a leaf spring extending upward from the bottom of the adapter recess.

7. The optical connector device according to claim 6, wherein, The second retainer includes a pawl that is coupled to a protrusion of the leaf spring to removably attach the connector to the adapter.

8. The optical connector device according to claim 1, wherein, The adapter is attached to the cover of the semiconductor package by a plurality of screws.

9. The optical connector device according to claim 1, wherein, The connector includes a first optical lens array that corresponds to the pattern of the fiber array.

10. The optical connector device according to claim 9, wherein, The adapter includes a second optical lens array that corresponds to the pattern of the fiber array and the pattern of the first optical lens array.

11. An optical connector device, comprising: A semiconductor package includes a container and a cap, wherein the container includes at least one container alignment recess; A connector that can be attached to the container; An adapter, which is movably coupled to the connector and removably attached to the cover; and A biasing member, positioned between the connector and the adapter, is adapted to bias the connector toward the semiconductor package. The connector includes: an optical fiber array corresponding to the container and extending in a direction perpendicular to the plane of the semiconductor package; a protrusion adapted to be fitted into a connector opening of the cover; and at least one stud extending from the protrusion and sized to fit into the at least one container alignment recess. The adapter includes a first retainer adapted to fit into the first retainer opening of the cover.

12. The optical connector device according to claim 11, wherein, The stud has a tapered end.

13. The optical connector according to claim 11, wherein, The biasing member is a spring positioned between the connector and the adapter, the spring being adapted to bias the connector away from the adapter in the vertical direction.

14. The optical connector according to claim 11, wherein, The first retainer includes a pawl that engages with the lower surface of the cover through the connector opening.

15. The optical connector according to claim 11, wherein, The adapter includes an adapter recess that accommodates a portion of the connector.

16. The optical connector according to claim 11, wherein, The adapter includes an adapter opening, and the fiber array of the connector extends through the adapter opening.

17. The optical connector according to claim 11, wherein, The adapter opening has an adapter opening width and an adapter opening length that are respectively greater than the width of the fiber array and the length of the fiber array.

18. The optical connector according to claim 11, wherein, The adapter includes an adapter protrusion that overlaps with the protruding portion of the connector in a lateral direction relative to the plane of the semiconductor package.

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