Optical connection systems and methods

Abstract

A detachable optical connection system includes a fiber array unit (FAU) assembly, a waveguide chip with a waveguide, and a plurality of pins. The FAU assembly is removably coupled couplable to the waveguide chip by via the plurality of pins and the FAU assembly is aligned with the waveguide for optical communication.

Description

OPTICAL CONNECTION SYSTEMS AND METHODSPRIORITY APPLICATION

[0001] This application claims the benefit of priority of U. S. Provisional Application Serial No.63 / 723,280 filed on November 21, 2024, the content of which is relied upon and incorporated herein by reference in its entirety.BACKGROUND

[0002] The present disclosure is directed to optical connections systems and methods of assembling the same. In particular, the disclosure is directed to detachable optical connections between fiber array units and substrates including a waveguide.

[0003] Co-packaged Optics refers to the innovative technology practice of integrating optical transceivers directly into the same package as an Application- Specific Integrated Circuit (ASIC). This innovative technology aims to reduce power consumption while also increasing bandwidth capacity by eliminating electrical interfaces between the ASIC and the optical module. Conventional practices involve a separate high-speed electrical connection between the ASIC and the optical module. However, as data rates increase, the power required by the electrical input / output also increases. Additionally, the demand for more bandwidth leads to a need for more optics and more electrical input / output, which thus requires more power. The resulting high energy costs and thermal management issues cause the practice to be unsustainable in the long run.

[0004] Thus a need exists for a detachable optical connector solution capable of delivering high bandwidth and data transfer rates while also lowering power consumption. Moreover, a need also exists for such solutions to fit within and be scalable to a variety of applications.SUMMARY

[0005] In one embodiment, a detachable optical connection system includes a fiber array unit (FAU) assembly, a waveguide chip with a waveguide, and a plurality of pins. The FAU assemblyis removably couplable to the waveguide chip via the plurality of pins and the FAU assembly is aligned with the waveguide for optical communication.

[0006] In another embodiment, a detachable optical connection system includes a fiber array unit (FAU) assembly, a waveguide chip, and a plurality of pins. The FAU assembly includes an FAU base defining a plurality of pin-receiving grooves, a plurality of fibers positioned within the FAU base, and a lid affixed to the FAU base and extending over the plurality of pin-receiving grooves. The waveguide chip comprises a waveguide. The FAU assembly is removably couplable to the waveguide chip via the plurality of pins and the plurality of fibers are aligned with the waveguide for optical communication. The plurality of pins are received between the FAU base and the lid, within the plurality of pin-receiving grooves.

[0007] In another embodiment, a method of assembling a optical connection system includes aligning a fiber array unit (FAU) assembly with a waveguide chip comprising a waveguide. The FAU assembly includes an FAU base defining a plurality of pin-receiving grooves and a lid affixed to the FAU base and extending over the plurality of pin-receiving grooves. The method further includes removably coupling the FAU assembly to the waveguide chip via a plurality of pins.

[0008] Additional features and advantages will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments described herein, including the detailed description which follows, the claims, as well as the appended drawings.

[0009] It is to be understood that both the foregoing general description and the following detailed description describe various embodiments and are intended to provide an overview or framework for understanding the nature and character of the claimed subject matter. The accompanying drawings are included to provide a further understanding of the various embodiments, and are incorporated into and constitute a part of this specification. The drawings illustrate the various embodiments described herein, and together with the description serve to explain the principles and operations of the claimed subject matter.BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The embodiments set forth in the drawings are illustrative and exemplary in nature and are not intended to limit the subject matter defined by the claims. The following detailed description of the illustrative embodiments can be understood when read in conjunction with the following drawings, where like structure is indicated with like reference numerals and in which:

[0011] FIG. 1A schematically illustrates a perspective view of a detachable optical connection system including a waveguide chip and a fiber array unit (FAU) assembly in spaced relationship with one another, according to one or more embodiments shown and / or described herein;

[0012] FIG. 1B schematically illustrates the waveguide chip detachably assembled to the FAU assembly of FIG. 1A via a plurality of pins, according to one or more embodiments shown and / or described herein;

[0013] FIG. 1C schematically illustrates connection between a pin of FIG. 1B within a pin-receiving groove of the FAU assembly, according to one more embodiments shown and / or described herein;

[0014] FIG. 1D schematically illustrates an end view of the FAU assembly of FIG. 1B having an intermediate lid, according to one or more embodiments shown and / or described herein;

[0015] FIG. 1E schematically illustrates the FAU assembly of FIG. 1A having a plurality of pin-receiving grooves within in which a plurality of optical fibers are positioned, according to one or more embodiments shown and / or described herein;

[0016] FIG. 1F schematically illustrates alignment of the waveguide chip of FIGS. 1A-1E with optical fibers of the FAU assembly, according to one or more embodiments shown and / or described herein;

[0017] FIG. 2A schematically illustrates a lock for use with the detachable optical connection system of FIGS. 1A-1E, according to one or more embodiments shown and / or described herein;

[0018] FIG. 2B schematically illustrates the lock of FIG. 2A lowered to an engaged positioned with the plurality of pins, according to one or more embodiments shown and / or described herein;

[0019] FIG. 3A schematically illustrates a perspective view of another embodiment of a detachable optical connection system including a waveguide chip and an FAU assembly, according to one or more embodiments shown and / or described herein;

[0020] FIG. 3B schematically illustrates the waveguide chip and the FAU assembly of FIG. 3 A assembled to one another with a plurality of pins and a lock in a disengaged position, according to one or more embodiments shown and / or described herein;

[0021] FIG. 3C schematically illustrates the lock moved to an engaged positioned, according to one or more embodiments shown and / or described herein;

[0022] FIG. 4A schematically illustrates another embodiment of a detachable optical connection system including a waveguide chip, an FAU assembly, a plurality of pins, and a lock, according to one or more embodiments shown and / or described herein;

[0023] FIG. 4B schematically illustrates a top view of the detachable optical connection system of FIG. 4A, according to one or more embodiments shown and / or described herein;

[0024] FIG. 4C schematically illustrates a sectional view taken along line 4C-4C of FIG. 4B, according to one or more embodiments shown and / or described herein;

[0025] FIG. 4D schematically illustrates a side view of the detachable optical connection system with the lock in an unlocked position, according to one or more embodiments shown and / or described herein;

[0026] FIG. 4E schematically illustrates the lock actuated to a locked position, according to one or more embodiments shown and / or described herein;

[0027] FIG. 4F illustrates a perspective view of the detachable optical connection system of FIG.4E, according to one or more embodiments shown and / or described herein;

[0028] FIG. 5 A schematically illustrates another embodiment of a detachable optical connection system including a waveguide chip, an FAU assembly, a plurality of pins, and a lock in an unassembled configuration, according to one or more embodiments shown and / or described herein;

[0029] FIG. 5B schematically illustrates the detachable optical connection system in an assembled configuration, according to one or more embodiments shown and / or described herein;

[0030] FIG. 5C schematically illustrates a perspective view of the lock of FIG. 5 A and 5B in isolation, according to one or more embodiments disclosed or described herein;

[0031] FIG. 5D schematically illustrates another perspective view of the assembled detachable optical connection system of FIG. 5B, according to one or more embodiments disclosed or described herein;

[0032] FIG. 5E schematically illustrates a top view of the detachable optical connection system of FIG. 5D, according to one or more embodiments disclosed or described herein;

[0033] FIG. 5F illustrates a sectional view of the detachable optical connection system of FIG.5E taken along line 5F-5F, according to one or more embodiments disclosed or described herein;

[0034] FIG. 6 A schematically illustrates another embodiment of a detachable optical connection system including a waveguide chip, an FAU assembly, a plurality of pins, and a lock in an unassembled configuration, according to one or more embodiments disclosed or described herein;

[0035] FIG. 6B schematically illustrates the detachable optical connection system in an assembled configuration, according to one or more embodiments disclosed or described herein;

[0036] FIG. 6C schematically illustrates a rear perspective view of the detachable optical connection system of FIG. 6B, according to one or more embodiments disclosed or described herein;

[0037] FIG. 7 A schematically illustrates a substrate for connection to a waveguide chip, according to one or more embodiments shown and / or described herein;

[0038] FIG. 7B schematically illustrates the substrate arranged above the waveguide chip in an unassembled configuration, according to one or more embodiments shown and / or described herein;

[0039] FIG. 7C schematically illustrates assembly of the substrate to the waveguide chip, according to one or more embodiments shown and / or described herein; and

[0040] FIG. 8 schematically illustrates an embodiment of a waveguide chip with a micro lens array (MLA), according to one or more embodiments disclosed or described herein.DETAILED DESCRIPTION

[0041] Embodiments of the present disclosure are directed to detachable optical connection systems and methods regarding the same. In particular, optical connection systems of the present disclosure may be used for coupling fiber optic signals to optical receivers / transceivers, which may be present in communication networks and / or computer architecture. The optical connection systems of the present disclosure may have particular use in any type of optical communications, such as photonic, laser (such as non -modulated, continuous-wave, laser), or the like. Referring generally to the figures, embodiments of photonic connection systems as provided include a fiber array unit (FAU) assembly, a waveguide chip, and a plurality of pins. The FAU may hold a plurality of fibers that transmit an optical signal, which may be directed into a waveguide formed within the waveguide chip, thereby allowing data communication via light transmitted from the plurality of fibers. The FAU assembly and the waveguide chip are removably couplable (that is matable and detachable) to one another via the plurality of pins as described in greater detail herein. This removable connection allows for simple, repeatable, and detachable connection and disconnection of a fiber cable thereby allowing connection / disconnection of various fiber cables without substantial disassembling and / or damaging components. Further, embodiments may further be directed to increasing bandwidth, data transfer rates, reducing power consumption by eliminating need for electrical interfaces, and other benefits. The various detachable optical connection systems and associated methods are described in more detail herein with specific reference to the corresponding figures.

[0042] Reference will now be made in greater detail to various embodiments, some embodiments of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or similar parts.

[0043] Before describing several exemplary embodiments, it is to be understood that the present disclosure is not limited to the details of construction or process steps set forth in the presentdisclosure. The disclosure provided herein is capable of other embodiments and of being practiced or being carried out in various ways.

[0044] Reference throughout this specification to “one embodiment,” “certain embodiments,” “various embodiments,” “one or more embodiments” or “an embodiment” means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the disclosure. Thus, the appearances of the phrases such as “in one or more embodiments,” “in certain embodiments,” “in various embodiments,” “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily referring to the same embodiment, or to only one embodiment. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0045] In the following description, like reference characters designate like or corresponding parts throughout the several views shown in the figures. It is also understood that, unless otherwise specified, terms such as “top,” “bottom,” “outward,” “inward,” and the like are words of convenience and are not to be construed as limiting terms. In addition, whenever a group is described as comprising at least one of a group of elements and combinations thereof, it is understood that the group may comprise, consist essentially of, or consist of any number of those elements recited, either individually or in combination with each other. Similarly, whenever a group is described as consisting of at least one of a group of elements or combinations thereof, it is understood that the group may consist of any number of those elements recited, either individually or in combination with each other. Unless otherwise specified, a range of values, when recited, includes both the upper and lower limits of the range as well as any ranges therebetween.

[0046] As used herein, the indefinite articles “a,” “an,” and the corresponding definite article “the” mean “at least one” or “one or more,” unless otherwise specified. It also is understood that the various features disclosed in the specification and the drawings can be used in any and all combinations.

[0047] It is noted that the terms "substantially" and "about" may be utilized herein to represent the inherent degree of uncertainty that may be attributed to any quantitative comparison, value,measurement, or other representation. These terms are also utilized herein to represent the degree by which a quantitative representation may vary from a stated reference without resulting in a change in the basic function of the subject matter at issue.

[0048] FIGS. 1A-1F schematically depict an embodiment of a detachable optical connection system 100A, which includes a FAU assembly 200 and a waveguide chip 300. The FAU assembly 200 and the waveguide chip 300 may be removably mounted to one another via one or more coupling components. For example, as depicted, the detachable optical connection system 100A may include one or more, such as a plurality of, pins 400. Detachable optical connection systems may include a greater or fewer number of components without departing from the scope of the present disclosure. For instance, and as will be described in further detail below, a lock may be provided, to prevent movement of the waveguide chip 300 relative to the FAU assembly 200 when mounted to one another. That is, the lock may be configured to maintain a connection between the FAU assembly 200 and the waveguide chip 300 until disconnection is desired.

[0049] The waveguide chip 300 may provide a signal connection point between an optical fiber and additional hardware such as within a computer architecture or communication transceiver or receiver. The waveguide chip 300 may contain one or more waveguides, such as a plurality of waveguides 304, formed therein for propagating an optical signal received from the optical fiber. The waveguide chip 300 may be formed of any suitable material such as glass, plastic, ceramic, or the like. The plurality of waveguides 304 formed within a body 302 of the waveguide chip 300 may be formed via any suitable process such as ion-exchange, laser, etc. For example, the plurality of waveguides 304 may be single mode waveguides, which allow light to travel in only one mode or path. The waveguide chip 300 with plurality of waveguides 304 allow for data, in the form of optical signals, to be communicated from optical fibers 214 (depicted in FIGS. ID and IE) and through the waveguide chip 300 via the plurality of waveguides 304. The data may then move to the other hardware components the waveguide chip is connected to, including optical integrated circuit (PIC), application-specific integrated circuit (ASIC), or the like.

[0050] In embodiments, the waveguide chip 300 may also have one or more grooves, such as a plurality of grooves 306 formed therein. For example, the plurality of grooves 306 may include a first groove and a second groove as depicted. The body 302 of the waveguide may define anengagement surface 302a for engagement with the FAU assembly 200, the plurality of grooves 306 may be recessed into the body 302 of the waveguide and extend from the engagement surface 302a along the X axis of the depicted coordinate axes. In embodiments, the plurality of grooves 306 may be recessed through a top surface 302b, such as on either side of the plurality of waveguides 304, as depicted. It is contemplated that the plurality of grooves 306 may instead be recessed in other surfaces or encapsulated between the top surface 302b and a bottom surface 302c. The plurality of grooves may extend along a portion of a length (e.g., along the X axis of the depicted coordinated axes) or along the entire length. The grooves 306 may have any suitable shape such as U-shaped, V-shaped, or the like. The grooves may be formed via any suitable manufacturing technique, such as via etching, machining, or the like. It is noted that U-shaped grooves may be formed via etching, which may allow for groove length to be controlled. V-shaped grooves, which may be formed via dicing, which may require formation of grooves 306 along the entire length of the waveguide chip 300.

[0051] The FAU assembly 200 may include an FAU base 210 and, in some embodiments, a lid 220. The FAU base 210 may have base body 211, which may define a plurality of fiber grooves 213 for receiving and aligning optical fibers 214 therein. For example, the base body 211 may have an upper surface 21 la within which the fiber grooves 213 are positioned. In embodiments, the upper surface 211a may include a first portion 21 la-1 and a second portion 21 la-2. In embodiments the first portion 21 la-1 may be positioned adjacent a coupling end 211b of the base body 211 and the second portion 21 la-2 may be positioned next to the first portion 21 la-1, such that the first portion 21 la-1 is between the coupling end 211b and the second portion 21 la-2. In embodiments, the first portion 21 la-1 may be elevated in the Y direction of the depicted coordinated axes relative to the second portion 21 la-2, as depicted. The fibers grooves 213 will be further described below. However, it is noted that plurality of optical fibers 214 (depicted in FIGS ID and IE) for transmitting data may be positioned in the plurality of fiber grooves 213. The optical fibers 214 may be single mode fibers or multi-mode optical fibers.

[0052] The FAU base 210 may define a plurality of pin-receiving grooves 212, In the depicted embodiment, the plurality of pin-receiving grooves 212 are V-grooves, though other shapes are contemplated and possible, such as U-shaped grooves, rectangular grooves, or the like. However, V-grooves are particularly beneficial as V-grooves act as precise alignment features as comparedto other shaped grooves. The pin-receiving grooves 212 may be formed via any suitable manufacturing technique, such as via etching, machining, or the like. As noted above, V-grooves as typically made via dicing operations which would typically cause the V-grooves to extend along the entire length of the substrate in which V-grooves are formed. However, because of the stepped relationship between the first portion 21 la-1 and the second portion 21 la-2, the plurality of pin¬ receiving grooves 212 may only be formed within the first portion 21 la-1.

[0053] The lid 220 may be made of glass, plastic, ceramic, or other suitable material. The lid 220 may be affixed to the FAU base 210 by, for example epoxy 240 (such as an optical adhesive). It is noted that while the lid 220 is depicted as a planar plate, the lid 220 may be any suitable size and / or shape. In particular, the lid 220 may assist in holding the optical fibers within the plurality of fiber grooves 213 by overlying the plurality of fiber grooves 213. Moreover, the lid 220 overlies the pin-receiving grooves 212, such that when the pins 400 are received within the pin-receiving grooves 212, vertical displacement (e.g., in the Y direction of the depicted coordinate axes) is limited by the lid 220. For example, the connection of the lid 220 to the FAU base 210 may create a precise vertical distance between the lid 220 and the FAU base 210 such that the plurality of pins 400 may be received between the FAU base 210 and the lid 220 within the plurality of pin¬ receiving grooves 212. The spacing may be such as to provide a press-fit, interference fit, or frictional fit between the plurality of pins 400 and the FAU assembly 200.

[0054] During manufacturing, in order to precisely control the vertical distance between the FAU base 210 and the lid 220, the lid 220 may be epoxied to the FAU base 210 with the plurality of pins 400 within the plurality of pin-receiving grooves 212. To accomplish this, the plurality of pins 400 may be placed in the plurality of pin-receiving grooves 212 while the lid 220 is placed above the FAU base 210 and contacting the plurality of pins 400. The lid 220 may then be affixed to the FAU base 210 by epoxy 240 and allowed to cure with the plurality of pins 400 still in place. This process creates an epoxy 240 layer in between the FAU base 210 and the lid 220. In embodiments, though any suitable epoxy is contemplated, it may be beneficial to use a filled epoxy, such as silica-filled epoxies, which may have a coefficient of thermal expansion similar to that of other portions of the FAU assembly, which may assist in maintaining proper alignment throughout use. An example, a filled epoxy may include OPTOCAST 3410, commercially available from EMI UV.

[0055] As noted above, the waveguide chip 300 and the FAU assembly 200 may be mounted to one another via the plurality of pins 400. The plurality of pins 400 may have elongate bodiesextending between a first end 402a and a second end 402b. The plurality of pins 400 may be formed of any suitable material (such as metal, glass, etc.). In the depicted embodiment, the plurality of pins 400 are affixed to the waveguide chip 300, such as within the plurality of grooves 306. That is, the first end 402a of a pin 400 may be positioned and affixed (such as via adhesive or other suitable coupling methods) within each groove 306, such that the second end 402b extends beyond the engagement surface 302a, so as to be insertable into the FAU assembly 200.

[0056] FIG. 1A shows the detachable optical connection system 100 A in an unassembled configuration with the waveguide chip 300 and plurality of pins 400 spaced from the FAU assembly 200. FIG. IB illustrates the waveguide chip 300 mounted to the FAU assembly 200 in an assembled configuration. In the assembled configuration, the plurality of pins 400 are received between the lid 220 and the FAU base 210 and within the plurality of pin-receiving grooves 212. When in the assembled position, optical fibers (not shown) within the FAU base 210 are caused to be aligned with the waveguide to provide data transmission. In embodiments, the engagement surface 302a may be pressed against the coupling end 211b of the FAU base 210.

[0057] FIG. 1C schematically depicts positioning of a pin 400 of the plurality of pins 400 positioned within a pin-receiving groove 212. The pin 400 is able to be precisely positioned within the pin-receiving groove 212 by having a generally round shape such that the pin 400 contacts the FAU base 210 at two contact points 430 while contacting and being restricted vertically by the lid 220 at a third contact point 420. It is noted that while the pin is generally depicted as having a circular cross-section, other changes are contemplated and possible (e.g., oval, square, rectangle, or any other regular or irregular shape).

[0058] FIG. ID schematically illustrates an end view of a FAU assembly 200 with a plurality of fibers 214 positioned within the plurality of fiber grooves 213. While the plurality of fiber grooves 213 are illustrated as V-grooves, other shapes are contemplated and possible, such as U-shaped grooves, rectangular grooves, or the like. However, V-grooves are particularly beneficial as V- grooves act as precise alignment features as compared to other shaped grooves. The fiber grooves 213 may be formed via any suitable manufacturing technique, such as via etching, machining, or the like. As noted above, V-grooves as typically made via dicing operations which would typically cause the V-grooves to extend along the entire length of the substrate in which V-grooves areformed. However, because of the stepped relationship between the first portion 21 la-1 and the second portion 21 la-2, the plurality of fiber grooves 213 may only be formed within the first portion 21 la-1.

[0059] FIG ID further depicts an intermediate lid 222 positioned overlying the plurality of fibers 214 and the plurality of fiber grooves 213 within the FAU base 210 and beneath the lid 220. The intermediate lid 222 may be of similar construction to the lid 220 and may be made of similar materials. In some embodiments, and as depicted, the intermediate lid 222 may be thinner than the lid 220. The intermediate lid 222 may be spaced inward from the plurality of pin-receiving grooves 212 so as not to overly the plurality of pin-receiving grooves 212. The intermediate lid 222 may be used to affix a plurality of optical fibers 214 to the FAU base 210. For example, the plurality of optical fibers 214 may be laid within the plurality of fiber grooves 213. The intermediate lid may then be affixed to the FAU base 210 with the epoxy 240, such as a first layer 222a of the epoxy 240. Then the lid 220 may be affixed to the FAU base 210 on top of the intermediate lid 222, in a manner similar to that described above, such as with a second layer 222b of the epoxy 240. Accordingly, epoxy layers 222a, 222b may be kept very thin, which may minimize effects (e.g., displacement) caused by differences in coefficient of thermal expansion between the epoxy 240 and other portions of the FAU assembly 200,

[0060] FIG. IE schematically illustrates the plurality of optical fibers 214 disposed within a plurality of fiber grooves 213 of the FAU base 210 in isolation. The plurality of optical fibers 214 may be any type of optical fiber such a single mode optical fibers 214a, multi-mode optical fibers 214b, or any combination thereof. Single mode optical fibers 214a differ from multi-mode optical fibers in that single mode optical fibers 214a may only have a single core, such that only a single data transmission may be communicated, whereas multi-mode optical fibers may have multiple cores (e.g., 2 or more, 3 or more, 4 or more etc.) which may transmit multiple data signals simultaneously. Use of multi-mode optical fibers increase potential data transfer, while reducing necessary' groove pitch for proper alignment. The increased data transfer and reduced groove pitch contributes to the desired increase in bandwidth while also having a comparatively smaller footprint relative to systems of similar bandwidth having only single mode fibers. FIG. IF schematically depicts the FAU assembly aligned with the waveguide chip 300 for opticalcommunication. Accordingly, and as depicted the plurality of fibers 214 may be aligned with the waveguides 304 of the waveguide chip 300.

[0061] Any of the embodiments above may provide increased fiber density as compared to commercially available ferrules. In particular, a fiber pitch (e.g., distance between fiber centers may be between about 80 pm to about 250 pm, though other pitches are contemplated. In some embodiments, fiber density may be about 6 optical fibers per millimeter or greater. For example if using multi-mode optical fibers, channels may be greater than or equal to 10 channels per mm. Additionally, in embodiments, materials with respect to the FAU assembly 200 or portions thereof used may be CTE matched to the optical fibers 214 and / or the waveguide chip 300 to eliminate or substantially eliminate any potential thermally induced misalignment over operating conditions.

[0062] FIG. 2A schematically depicts a lock 230A which may be used to prevent movement of the waveguide chip 300 relative to the FAU assembly 200. For example, use of the lock 230 / X may be desirable to prevent the FAU assembly 200 from slipping longitudinally off of the plurality of pins 400. In the depicted embodiment, the lock 230A has a lock body 232. The lock body 232 may define a plurality of cutouts 232a. The plurality of cutouts 232a may be sized and shaped to mate with the plurality of pins 400, For example, referring collectively to FIGS. 2A and 2B the plurality of pins 400 may each define a mating recessed portion 410 which are received within the cutouts 232a. Accordingly, the engagement of the lock body 232 with the mating recessed portions 410 may prevent movement (such as longitudinal movement along the + / -X direction of the depicted coordinate axes) of the FAU assembly 200 relative to the waveguide chip 300. As particularly illustrated in FIG. 2B, the lock body 232 may wrap around the lid 220 such as to hook over an edge 220c of the lid 220. The wrapping of the lock body 232 around the lid 220 thereby prevents the plurality of pins 400 (which are coupled to the lock body 232 by virtue of the mating recessed portions 410 being received within the plurality of cutouts 232a) from being pulled from the FAU assembly 200, The lock body 232 may be sized to frictionally engage front 220d and rear 220c surfaces of the lid 220, such that the lock body 232 does not easily fall away from the lid 220. This frictional engagement may allow for minimal or no use of external means of connection such as epoxy. Further, the frictional nature of the connection between the lock body232 and the lid 220 may contribute to the lock 230A to be moved between a disengaged or unlocked position, such as depicted in FIG 2A, to an engaged or locked position, such as depicted in FIGS. 2B, repeatably as desired. In some embodiments, the lock body 232 may be affixed to the lid such as via epoxy. In some embodiments, the lock body 232 may not wrap around or hook over edge 220c of the lid 220. In such embodiments, the lock body 232 may be affixed to the lid via epoxy or via other suitable means. For example, the lock 230 A may snap into connection with the plurality of pins 400.

[0063] It is contemplated that the lock body 232 may be formed of any suitable material such as a metal, plastic or the like. It is contemplated that the lock body 232 may be formed of a resilient material and be pre-fixed to the lid 220. For example, it is contemplated that as the plurality of pins 400 are directed into the FAU assembly 200, the lock body 232 may deflect upward in the Y direction of the depicted coordinate axes, and then snap into the mating recessed portions 410 of the respective pins 400. If removal is desired, a tool, such as a flat tip screw driver or the like, may be used to lift the lock body 232 to disengage the lock body 232 from the pins 400 and allow withdrawal of the FAU assembly 200 relative to the waveguide chip 300.

[0064] FIGS. 3A-3C illustrate an alternative embodiment of a detachable optical connection system 100B. The depicted embodiment, is similar to that described above with similar components, accordingly, the above description applies unless otherwise noted or apparent. In particular, the optical connection system 100B includes a waveguide chip 300, an FAU assembly 200, a plurality of pins 400, and may further include a lock 230B, However, in the present embodiment, the plurality of pins 400 are affixed to the FAU assembly 200 as opposed to the waveguide chip 300. For example, the plurality of pins 400 may be affixed (such as permanently affixed via an epoxy) to the FAU base 210 within the plurality of pin-receiving grooves 212.

[0065] Moreover, the waveguide chip 300 is part of a waveguide chip assembly 350. The waveguide chip 300 is substantially similar to the waveguide chip 300 as described above, accordingly, the above description applies unless otherwise noted and will not be repeated for brevity. However, in the depicted embodiment, the waveguide chip assembly 350 includes a chip lid 320, which overlies the plurality of grooves 306, The chip lid 320 may be substantially similarto the lid 220 in form and material as described above, but mounted to the waveguide chip 300. It is noted that the FAU assembly 200 may also include a lid 220 as in the embodiment above.

[0066] The chip lid 320 may be made of glass, plastic, ceramic, or other suitable material. The chip lid 320 may be affixed to the waveguide chip 300 by, for example by epoxy (such as an optical adhesive). It is noted that while the chip lid 320 is depicted as a planar plate, the chip lid 320 may be any suitable size and / or shape. In particular, the chip lid 320 overlies plurality of grooves 306, such that when the pins 400 are received within the plurality of grooves 306, vertical displacement (e.g., in the Y direction of the depicted coordinate axes) is limited by the chip lid 320. For example, the connection of the chip lid 320 to the waveguide chip 300 may create a precise vertical distance between the chip lid 320 and the waveguide chip 300 such that the plurality of pins 400 may be received, such as removably received, between the waveguide chip 300 and the chip lid 320 within the plurality of grooves 306. The spacing may be such as to provide a press-fit, interference fit, or frictional fit between the plurality of pins 400 and the waveguide chip assembly 350.

[0067] As in the embodiment above, the lock 230B may be used to prevent movement of the waveguide chip assembly 350 relative to the FAU assembly 200. In the present embodiment, the lock body 232 may engage or wrap around the chip lid 320 of the waveguide chip assembly 350. Similarly to the above embodiment, the plurality of pins 400 may include mating recessed portions 410 which are received within the cutouts 232a to lock movement of the waveguide chip assembly 350 relative to the FAU assembly 200. Once in position, the lock 230B may be epoxied or otherwise affixed in place. For example, the lock 230B may snap into connection with the plurality of pins 400. It is noted that while the lock 230B does not engage opposing sides of the chip lid 320 as illustrated above, in embodiments the lock 230B may engage opposing sides of the chip lid 320 and form a frictional engagement therewith.

[0068] FIGS. 4A-4F illustrate an alternative embodiment of a detachable optical connection system 100C. The depicted embodiment is similar to embodiments described above with similar components, accordingly, the above description applies unless otherwise noted or apparent. In particular, the optical connection system 100C includes the waveguide chip 300, the FAU assembly 200, the plurality of pins 400, and may further include a lock 230C, In the present embodiment, the plurality of pins 400 are illustrated as affixed to the waveguide chip 300 asdescribed above with respect to the first embodiment and are removably received within the FAU assembly 200, which is illustrated with lid 220. However, it is contemplated that the plurality of pins 400 may instead by affixed to the FAU assembly as detachable optical connection system 100B. In the present embodiment, the lock 230C is provided in the form of a clamping unit 500. The clamping unit 500 may include a locking frame 510, a slider 520, a plurality of springs 530, and a spacer 540. The clamping unit 500 may include more or fewer components without departing from the scope of the present disclosure.

[0069] The locking frame 510 may include a clamshell-type body including an upper portion 512a, a lower portion 512b and a connecting portion 512c, which allows the upper portion 512a and the lower portion 512b to pivot relative to one another. For example, the locking frame 510 m y extend between the connecting portion 512c and an openable end 512d. The openable end 512d may define engaging portions 514 extending from the upper portion 512a and the lower portion 512b, which define a waveguide chip-receiving pass-through 516 when moved to a closed configuration. With particular reference to FIG. 4F the connecting portion may define a pass-through 517, which may be sized to allow a portion of the FAU base 210 and any optical cables coupled there to extend there through. For example, the FAU base 210 may be narrower at the portion extending through the pass-through 517 than at portion including the plurality of pin-receiving grooves 212.

[0070] The clamping unit 500, such as the locking frame 510, wraps around the FAU assembly 200. The spacer 540, may be a plate (which may be any suitable material including, but not limited to, glass, metal, composite, el stomer, and the like) with the spacer 540 providing support between the locking frame and the FAU base. For example, the spacer 540 may contact a bottom of the FAU assembly 200 with a top face 540a and an inner surface 512b- 1 of the lower portion 512b of the locking frame 510 with a bottom face 540b. These contacts may provide support between the locking frame 510 and the FAU assembly 200. The spacer 540 may be affixed, such as via adhesive or other convention means, to either the locking frame 510, FAU assembly 200, both, or neither as the spacer 540 may be held in place by friction. The spacer 540 may be a similar thickness to the lid 220 and operate to correctly position the F AU base within the locking frame for alignment and optical communication when connected with the waveguide chip 300.

[0071] The slider 520 may be a sleeve which circumscribes the locking frame 510. The slider 520 is operable to be moved or slid along the locking frame 510 between a first position (illustrated in FIG. 4D) and a second position (illustrated in FIG. 4E). In the first position, the locking frame 510 may be in an open configuration, which allows for insertion of the waveguide chip 300 and plurality of pins 400. In the second position, the locking frame 510 may be in a closed configuration, which may prevent withdrawal of the waveguide chip 300 and the plurality of pins 400 from the FAU assembly 200.

[0072] For example, the waveguide chip 300 may define a plurality of slots 312 formed along longitudinal sides 314 of the waveguide chip 300. The plurality of slots 312 create a portion of the waveguide chip 300 where a width of the waveguide chip 300 reduced in the Z direction of the depicted coordinate axes relative to other portions of the waveguide chip 300. The plurality of slots 312 may be configured to receive a portion of the locking frame 510, such as the engaging portion 514 of the upper and lower portions 512a, 512b of the locking frame 510 when in the closed configuration.

[0073] As noted above, the locking frame 510 can be seen to generally wrap around the FAU assembly 200 with an inner surface 512a-l of the upper portion 512a contacting a top surface 220a of the lid 220. As previously mentioned the inner surface of the locking frame 510 may also contact the bottom surface of the spacer 540 such that the locking frame 510 sandwiches the FAU assembly 200 and the spacer 540. It can also be seen that the locking frame 510 extends beyond the FAU assembly 200 towards the direction of the waveguide chip 300 such that the openable end is able to receive a portion of the waveguide chip 300. The locking frame 510 and / or the sleeve 520 may be constructed out of a variety of materials including metal, composite, and the like. FIG. 4D shows the locking frame 510 in an open configuration which allows for the waveguide chip 300 to be received within the locking frame 510 and the plurality of pins 400 to be received between the lid 220 and the FAU base 210 within the plurality of pin-receiving grooves 212. In some embodiments, the locking frame 510 may have a mechanical bias or spring tension that favors remaining in the open configuration. Figure 4E shows the locking frame in a closed configuration such that the openable end 512d is closed and restricts the waveguide chip 300 from being removed. In particular, in the closed configuration, a portion of the locking frame 510, such as theengaging portions 512 are received within the plurality of slots 312, and substantially prevent relative translation of the waveguide chip 300 and the FAU assembly.

[0074] As noted above, the slider 520 is illustrated as surrounding a portion of the locking frame 510. In embodiments, the bias of the locking frame 510 favoring the open configuration may push on the slider 520 and may create a maintaining force between the slider 520 and the locking frame 510. This maintaining force may restrict the slider 520 from moving freely from the closed configuration along the locking frame 510. FIG. 4D shows the slider in a first position and FIG.4E shows the slider 520 in a second position. Accordingly, with the slider 520 in the first position the locking frame 510 may remain in the open configuration while with the slider 520 in the second position the locking frame 510 may remain in the closed configuration. With the slider 520 in the second position the locking frame 510 is received by the plurality of slots 312 which restricts the waveguide chip 300 from moving away from the FAU assembly 200, If the slider 520 returns to the first position the locking frame 510 may return to the open configuration, which may allow the waveguide chip 300 and plurality of pins 400 to be withdrawn.

[0075] The plurality of springs 530 may be seen in FIGS. 4B through 4F. Referring to FIG. 4C it can be seen that the springs 530 may be disposed between the inner surface 512c-l along the connecting portion 512c of the locking frame and the lid 220. As the plurality of pins 400 are received between the lid 220 and the FAU base 210 within the plurality of pin-receiving grooves 212 the plurality of pins 400 may also be received inside the plurality of springs 530 such that the coils of the springs 530 may wrap around the diameter of a portion of the pins 400. The springs 530 may exert a force between the locking frame 510 and the lid 220. This force pushes the lid 220, and the FAU assembly 200 to which the lid 220 is attached, in the direction of the waveguide chip 300 and the locking frame 510 in the direction opposite of the waveguide chip. As the force pushes the locking frame 510 in the direction opposite the waveguide chip 300 the force also acts on the waveguide chip 300 by acting through the locking frame 510 and contacting the waveguide chip 300 at the plurality of slots 312. As the force acts on the waveguide chip 300 it pushes the waveguide chip in the direction of the FAU assembly 200. Thus the springs 530 generate a force that pushes the FAU assembly 200 and the waveguide chip 300 towards each other creating a mating force. This mating force resists the disconnection of the FAU assembly 200 and the waveguide chip 300 and operates to maintain optical alignment for better signal communication.

[0076] FIGS. 5A-5F illustrate an alternative embodiment of a detachable optical connection system 100D. The depicted embodiment, is similar to embodiments described above with similar components, accordingly, the above description applies unless otherwise noted or apparent. In particular, the optical connection system 100D includes the waveguide chip 300, the FAU assembly 200, the plurality of pins 400, and may further include a lock 230D. In the present embodiment, the plurality of pins 400 are illustrated as are affixed to the waveguide chip 300 as described above with respect to the first embodiment and are removably received within the FAU assembly 200, which is illustrated with lid 220. In this particular embodiment, the lock 230D includes a housing 600. In addition, the waveguide chip 300 forms part of a waveguide chip assembly 350 which further includes a chip lid 320, such as previously described, and the plurality of pins 400 extend between the waveguide chip 300 and the chip lid 320. In this embodiment, the FAU assembly 200 does not include a lid. The chip lid 320 may extend to a second end 402b of the plurality of pins 400.

[0077] The housing 600 may have a top portion 650, one or more side portions 660, one or more bottom portions 630, a locking lip 610, and a retention lip 620. The housing 600 may include an inclined portion 640 that generally connects the top portion 650 to the retention lip 620. The inclined portion 640 may include an opening 612 that allows for optical cables to run through the housing 600 to be coupled to the FAU base 210. The housing may be formed of any suitable material such as plastic, metal or the like. In embodiments, the housing 600 may be formed of a resilient material so that as manipulated may spring back into shape.

[0078] Referring particularly to FIG. 5A it may be seen that the housing 600 generally surrounds the FAU base 210 with the top portion 650 disposed above the plurality of pin-receiving grooves 212 formed within the FAU base 210. The housing 600 may be connected to the FAU base 210 via the one or more bottom portions 630, which may extend beneath the FAU base 210. The one or more bottom portions 630 may be a single strip of material or two wings. The retention lip 620 may engage a rear edge 210c of the FAU base 210. As will be described in greater detail, the connection between the FAU base 210 and the retention lip 620 may restrict the housing’s 600 movement relative to the FAU base 210 when connected with the waveguide chip assembly 350.

[0079] Referring particularly to FIGS. 5A-5B when the FAU base 210 and the waveguide chip 300 are connected, the lid 220 moves past the locking lip 610 and into the housing 600 such that the plurality of pins 400 are received within the plurality of pin-receiving grooves 212. As the connection is completed the housing surrounds the lid 220, the FAU base 210, the plurality of pins 400, and at least a portion of the waveguide chip 300 and the locking lip 610 may wrap around an edge 320d of the chip lid 320 to couple to the chip lid 320. Accordingly, the retention lip 620 acting on the FAU base 210 rear edge 210c and the locking lip 610 acting on the waveguide chip assembly 350 at edge 320d provide opposing forces to prevent disconnection of the FAU assembly 200 from the waveguide chip assembly 350.

[0080] Stated another way, and referring to FIG. 5D, as the housing 600 surrounds the lid 220, the FAU base 210, the pins 400, and at least a portion of the waveguide chip 300 the locking lip 610 makes contact with a front surface 320d of the lid 320 opposite the FAU base 210. This contact works in combination with the contact between the retention lip 620 and a rear edge 210c of the FAU base 210 opposite the waveguide chip 300 in order to restrict against the separation of the FAU base 210 and the waveguide chip assembly 350.?\s a force attempts to pull against the waveguide chip assembly 350 the force acts through the lid 320 which is affixed to the waveguide chip 300, This force then acts on the housing 600 at the locking lip 610 and the force may act through the housing’s 600 inclined portion 640 to the retention lip 620 which contacts the FAU base 210 at a rear edge 210c and restricts movement of the housing 600 in at least the direction of the waveguide chip 300. Thus, a force acting to pull the waveguide chip 300 away from the FAU base 210 would be restricted by the FAU base 210 itself. The bottom portions 630 resist vertical displacement of the waveguide chip 300. When the waveguide chip 300 is connected with the FAU assembly 200 the bottom portions 630 may contact a bottom surface 302c of the waveguide body 302. This contact encapsulates a portion of the waveguide chip assembly 350 in the vertical direction as the top portion 650 contacts the lid 320 at a top surface 320a. When removal is desired, a user may, using a tool, disengage the locking lip 610 from the front surface 320d of the lid 320, thus allowing withdrawal of the FAU assembly 200 relative to the waveguide chip assembly 350 as the chip lid 320 may exit the housing 600, In some embodiments, the one or more bottom portions 630, such as where there are two wings, may be urged (e.g., bent) open to allow that entire housing 500 to be removed in the Y direction of the depicted coordinate axes.

[0081] FIGS. 6A-6C illustrate an alternative embodiment of a detachable optical connection system 100E. The depicted embodiment, is similar to the detachable optical connection system of FIG. 5 A-5E, described above with similar components, accordingly, the above description applies unless otherwise noted or apparent. However, in the depicted embodiment the plurality of pins 400 are affixed to the FAU base 210 within the plurality of pin-receiving grooves 212 at a first end 402a with a second end 402b extending away from the FAU base 210 within the housing 600 of the lock 630D. The second end 402b may not extend past the locking lip 610 such that the pins 400 are contained within the housing 600. In the present embodiment, the plurality of pins 400 are removably received within the waveguide chip assembly 350, which is illustrated with chip lid 320. In this embodiment, the FAU assembly 200 may or may not include a lid.

[0082] FIGS. 7A-7C show an alternative method of attaching the plurality of pins 400 to the waveguide chip 300 that may be utilized with any embodiment described herein. In particular, in some applications, it may not be desirable to form a plurality of grooves within the waveguide chip 300 and as disclosed in the previous embodiments. Instead, a separate substrate 700 may be used, which may include a plurality of grooves 710 formed therein, which may be any type of groove as described above with respect to the plurality of pin-receiving grooves 212. For example, the plurality of grooves 710 may be V-grooves, U-grooves, or other shaped grooves. The plurality of pins 400 may be affixed within the plurality of grooves 710 such as by adhesive or other means. The substrate 700 may then be affixed to the waveguide chip 300, such as via adhesive or other means, such that the plurality of pin 400 are held between the waveguide chip 300 and the substrate 700. The substrate 700 may be formed of any suitable material (glass, plastic, ceramic, etc.). In some embodiments, the substrate 700 may include a plurality of alignment grooves 712, which may extend parallel to the plurality of grooves 710. The alignment grooves 712 may be sized to receive a plurality of contact rods 720 therein and may act as spacing elements or additional contact points between the substrate 700 and the waveguide chip 300.

[0083] Referring now to FIG. 8, in any of the embodiments provided herein, the waveguide chip 300 may have a Micro Lens Array (MLA) 330 attached thereto. The MLA 330 may be aligned with the plurality of waveguides at an engagement surface 302a of the waveguide chip 300. In such embodiments, the MLA 330 may be positioned within the waveguide chip 300 and the FAU assembly 200. Other embodiments may include the MLA 330 being integrated on the FAU base210. The use of the MLA 330 may increase the beam diameter which thus reduces the connection’s vulnerability to dirt and lateral misalignment. A common issue with this technique is that it escalates angle sensitivity which increases IL when angles are misaligned. Such adverse effects should be minimized by the disclosed embodiments as the plurality of pins 400 combat misalignment.

[0084] Methods of assembling optical connections are also disclosed. Such methods include the assembly of the previously disclosed embodiments herein. Such methods may include aligning the FAU assembly 200 with the waveguide chip 300 and removably coupling the FAU assembly to the waveguide chip via a plurality of pins, as described above. Methods may further include assembling a lock (such as any of locks 230A-230D) to the FAU assembly 200 and the waveguide chip 300 to maintain a connection between the FAU assembly and the waveguide chip.

[0085] Embodiments may be further described with respect to the following listing of clauses:

[0086] 1. A detachable optical connection system comprising: a fiber array unit (FAU) assembly; waveguide chip comprising a waveguide; and a plurality of pins, wherein the FAU assembly is removably couplable to the waveguide chip via the plurality of pins and the FAU assembly is aligned with the waveguide for optical communication.

[0087] 2. The detachable optical connection system of clause 1, wherein the FAU Assembly comprises: an FAU base defining a plurality of pin-receiving grooves; and a lid affixed to the FAU base and extending over the plurality of pin-receiving grooves.

[0088] 3. The detachable optical connection system of clause 2, wherein the plurality of pins are received between the FA U base and the lid, within the plurality of pin-receiving grooves.

[0089] 4. The detachable optical connection system of clause 3, wherein receiving the plurality of pins within the plurality of pin-receiving grooves aligns a plurality of fibers of the FAU assembly with the waveguide.

[0090] 5. The detachable optical connection system of clause 3 or 4, wherein the receiving of the plurality of pins between the plurality of pin-receiving grooves and the lid frictionally connects the FAU assembly to the waveguide chip.

[0091] 6. The detachable optical connection system of any preceding clause, further comprising a lock configured to maintain connection of the FAU assembly with the waveguide chip, the lock comprising a lock body with a cutout formed therein, and wherein: at least one pin of the plurality' of pins defines a mating recess; and the lock body is configured to engage the at least one pin within the mating recess such that the cutout receives the at least one pin.

[0092] 7. The detachable optical connection system of any of clauses 1-5, further comprising a lock configured to maintain connection of the FAU assembly with the waveguide chip, the lock defining a plurality of cutouts, and wherein: the plurality of pins each define a mating recess; and each of the plurality of cutouts are configured to engage one of pins within the mating recess such that each cutout receives one pin.

[0093] 8. The detachable optical connection system of any of clauses 1-5, further comprising a lock configured to maintain a connection of the FAU assembly with the waveguide chip, wherein the FAU assembly comprises: an FAU base defining a plurality of pin-receiving grooves; and a lid affixed to the FAU base and extending over the plurality of pin-receiving grooves and the lock wraps around the lid and engages the plurality of pins.

[0094] 9. The detachable optical connection system of claim 1, further comprising a lock configured to lock the FAU assembly to the waveguide chip, the lock comprising: a locking frame moveable between an open and a closed configuration; and a sliding member operable to slide from a first position to a second position along the locking frame wherein the locking frame is held in the closed configuration when the sliding member is in the second position to maintain connection between the FAU assembly and the waveguide chip.

[0095] 10. The detachable optical connection system of clause 9, wherein the waveguide chip defines a plurality of slots configured to receive the locking frame.

[0096] 11. The detachable optical connection system of clause 10, further comprising a plurality of springs arranged between the locking frame and the lid and biasing the lid toward an opening of the locking frame.

[0097] 12, The detachable optical connection system of any preceding clause, further comprising a waveguide chip assembly, the waveguide chip assembly comprising: the waveguide chip,wherein the waveguide chip defines a plurality of grooves; a lid affixed to the waveguide chip; and a plurality of pins affixed between the grooves and the lid.

[0098] 13, The detachable optical connection system of clause 12, further comprising a lock comprising a housing configured to receive the waveguide chip assembly, the housing being coupled to the FAU assembly.

[0099] 14. The detachable optical connection system of clause 13, wherein the housing surrounds a portion of the waveguide chip assembly when the waveguide chip assembly is received by the housing.

[0100] 15. The detachable optical connection system of clause 14, wherein the housing comprises a locking lip that locks the waveguide chip assembly within the housing.

[0101] 16. A detachable optical connection system comprising: a fiber array unit (FAU) assembly comprising: an FAU base defining a plurality of pin-receiving grooves; a plurality of fibers positioned within the FAU base; a lid affixed to the FAU base and extending over the plurality of pin-receiving grooves; a waveguide chip comprising a waveguide; and a plurality of pins, wherein the FAU assembly is removably couplable to the waveguide chip via the plurality of pins and the plurality of fibers are aligned with the waveguide for optical communication; wherein the plurality of pins are received between the FAU base and the lid, within the plurality of pin-receiving grooves.

[0102] 17. The detachable optical connection system of clause 16, wherein the receiving of the plurality of pins between the FAU base and the lid, within the plurality of pin-receiving grooves aligns the plurality of multi-core fibers with the waveguide.

[0103] 18. A method of assembling a optical connection system comprising the steps of: aligning an fiber array unit (FAU) assembly with a waveguide chip comprising a waveguide, the FAU assembly comprising: an FAU base defining a plurality of pin-receiving grooves; and a lid affixed to the FAU base the lid extending over the plurality of pin-receiving grooves; removably coupling the FAU assembly to the waveguide chip via a plurality of pins.

[0104] 19. The method of clause 18, wherein: the plurality of pins are fixedly coupled to the waveguide chip; and the step of removably coupling the FAU assembly to the waveguide chip via the plurality of pins comprises inserting the plurality of pins into the FAU assembly between the lid and the FAU base.

[0105] 20. The method of clause 18 or 19, further comprising assembling a lock to the FAU assembly and the waveguide chip to maintain a connection between the FAU assembly and the waveguide chip.

[0106] It should now be understood that the embodiments described herein provide for a detachable optical connection system and methods of assembling a optical connection. Thus, the detachable optical connections and methods of assembling the same described herein may allow for more efficient and secure connections that allow for increase data transfer and a decrease in power consumption. Moreover, embodiments of the present disclosure may be highly customizable and scalable to different applications. For example, channel count, fiber diameters and other features (lenses, prisms, etc.) may be customized and connections may be disassembled as needed. Moreover, the composite assembly of the FAU assembly enables selection of different material properties as desired for fiber positioning accuracy.

[0107] It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments described herein without departing from the spirit and scope of the claimed subject matter. Thus it is intended that the specification cover the modifications and variations of the various embodiments described herein provided such modification and variations come within the scope of the appended claims and their equivalents.

Claims

What is claimed is:

1. A detachable optical connection system comprising:a fiber array unit (FAU) assembly;a waveguide chip comprising a waveguide; anda plurality of pins, wherein the FAU assembly is removably couplable to the waveguide chip via the plurality of pins and the FAU assembly is aligned with the waveguide for optical communication.

2. The detachable optical connection system of claim 1, wherein the FAU Assembly comprises:an F U base defining a plurality of pin-receiving grooves; anda lid affixed to the FAU base, extending over the plurality of pin-receiving grooves.

3. The detachable optical connection system of claim 2, wherein the plurality of pins are received between the FAU base and the lid, within the plurality of pin-receiving grooves.

4. The detachable optical connection system of claim 2 or claim 3, wherein receiving the plurality of pins within the plurality of pin-receiving grooves aligns a plurality of fibers of the FAU assembly with the waveguide.

5. The detachable optical connection system of claim 3, wherein the receiving of the plurality of pins between the plurality of pin-receiving grooves and the lid frictionally connects the FAU assembly to the waveguide chip.

6. The detachable optical connection system of any one of claims 1 to 5, further comprising a lock configured to maintain connection of the FAU assembly with the waveguide chip, the lock comprising a lock body with a cutout formed therein, and wherein:at least one pin of the plurality of pins defines a mating recess; andthe lock body is configured to engage the at least one pin within the mating recess such that the cutout receives the at least one pin.

7. The detachable optical connection system of any one of claims 1 to 5, further comprising a lock configured to maintain connection of the FAU assembly with the waveguide chip, the lock defining a plurality of cutouts, and wherein:the plurality of pins each define a mating recess; andeach of the plurality of cutouts are configured to engage one of pins within the mating recess such that each cutout receives one pin.

8. The detachable optical connection system of any one of claims 1 to 5, further comprising a lock configured to maintain a connection of the FAU assembly with the waveguide chip, wherein the FAU assembly comprises:an FAU base defining a plurality of pin-receiving grooves; anda lid affixed to the FAU base and extending over the plurality of pin-receiving grooves and the lock wraps around the lid and engages the plurality of pins.

9. The detachable optical connection system of claim 1, further comprising a lock configured to lock the FAU assembly to the waveguide chip, the lock comprising:a locking frame moveable between an open and a closed configuration; anda sliding member operable to slide from a first position to a second position along the locking frame wherein the locking frame is held in the closed configuration when the sliding member is in the second position to maintain connection between the FAU assembly and the waveguide chip.

10. The detachable optical connection system of claim 9, wherein the waveguide chip defines a plurality of slots configured to receive the locking frame.

11. The detachable optical connection system of claim 10, further comprising a plurality of springs arranged between the locking frame and the lid and biasing the lid toward an opening of the locking frame.

12. The detachable optical connection system of any one of claims 1 to 11, further comprising a waveguide chip assembly, the waveguide chip assembly comprising:the waveguide chip, wherein the waveguide chip defines a plurality of grooves;a lid affixed to the waveguide chip; anda plurality of pins affixed between the grooves and the lid.13, The detachable optical connection system of claim 12, further comprising a lock comprising a housing configured to receive the waveguide chip assembly, the housing being coupled to the FAU assembly.

14. The detachable optical connection system of claim 13, wherein the housing surrounds a portion of the waveguide chip assembly when the waveguide chip assembly is received by the housing.

15. The detachable optical connection system of claim 14, wherein the housing comprises a locking lip that locks the waveguide chip assembly within the housing.

16. A detachable optical connection system comprising:a fiber array unit (FAU) assembly comprising:an FAU base defining a plurality of pin-receiving grooves;a plurality of fibers positioned within the FAU base;a lid affixed to the FAU base and extending over the plurality of pinreceiving grooves;a waveguide chip comprising a waveguide; anda plurality of pins, wherein the FAU assembly is removably couplable to the waveguide chip via the plurality of pins and the plurality of fibers are aligned with the waveguide for optical communication;wherein the plurality of pins are received between the FAU base and the lid, within the plurality of pin-receiving grooves.

17. The detachable optical connection system of claim 16, wherein the receiving of the plurality of pins between the FAU base and the lid, within the plurality of pin-receiving grooves aligns the plurality of multi-core fibers with the waveguide.

18. A method of assembling a optical connection system comprising the steps of:aligning a fiber array unit (FAU) assembly with a waveguide chip comprising a waveguide, the FAU assembly comprising:an F U base defining a plurality of pin-receiving grooves; anda lid affixed to the FAU base the lid extending over the plurality of pin-receiving grooves;removably coupling the FAU assembly to the waveguide chip via a plurality of pins.

19. The method of claim 18, wherein:the plurality of pins are fixedly coupled to the waveguide chip; andthe step of removably coupling the FAU assembly to the waveguide chip via the plurality of pins comprises inserting the plurality of pins into the FAU assembly between the lid and the FAU base.

20. The method of claim 18 or claim 19, further comprising assembling a lock to the FAU assembly and the waveguide chip to maintain a connection between the FAU assembly and the waveguide chip.

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