A light-emitting module, a manufacturing method thereof, an electric appliance cavity for a light-emitting device, and a light-emitting device

By employing interference fit between connecting components and grooves and colloidal deformation curing technology in the light-emitting module, the problems of complex assembly and low automation have been solved, achieving efficient production and good sealing effect, and improving the service life of the light-emitting module.

CN116336422BActive Publication Date: 2026-01-27HANGZHOU HPWINNER OPTO CORP
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202310195666.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-03-03
Publication Date
2026-01-27
Estimated Expiration
2043-03-03

AI Technical Summary

Technical Problem

The assembly of existing light-emitting modules is complex and has a low degree of automation, resulting in low production efficiency and poor sealing effect. The lifespan is easily affected by the loose connection between the lens and the substrate.

Method used

By employing an interference fit between the connecting components and the grooves, and by designing slot and groove structures on the lens layer and the substrate, the adhesive is deformed and cured during the pressing process to form a fixation and seal, replacing the traditional screw and sealing ring connection method.

Benefits of technology

It improves the ease of installation and automation of the light-emitting module, enhances the fixation and sealing of the lens and substrate, and reduces production costs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN116336422B_ABST
    Figure CN116336422B_ABST
Patent Text Reader

Abstract

The application provides a light-emitting module, which comprises a lens layer and a substrate; the periphery of the substrate comprises a first groove, the first width of the top of the first groove is greater than the second width of the bottom of the first groove; the periphery of the lens layer comprises a first connecting assembly, the bottom of the first connecting assembly is provided with a slot; the slot width of the first connecting assembly when the first connecting assembly is inserted into the first groove is smaller than the slot width of the first connecting assembly when the first connecting assembly is not inserted into the first groove; the third width of the bottom of the first connecting assembly when the first connecting assembly is not inserted into the first groove is greater than the second width of the bottom of the first groove; the periphery of the substrate and the periphery of the lens layer form a second groove surrounding the lens layer; and the first groove and / or the second groove is filled with glue. The application solves the technical problems of complex assembly and low automation degree of the traditional light-emitting module, adopts the interference fit of the lens and the substrate combined with glue to replace screws, buckles and sealing rings, and improves the production efficiency, which is more conducive to automatic production.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of lighting, specifically to a light-emitting module and its manufacturing method, an electrical cavity for a light-emitting device, and a light-emitting device. Background Technology

[0002] Light-emitting modules typically use snap-fit ​​connections and sealing rings to connect the lens to the substrate and heat sink. During operation, the heat generated by the light-emitting module causes pressure inconsistencies between the inside and outside of the lens. Insufficient clamping force between the lens and the substrate can easily lead to a decrease in fixation performance and sealing, thus affecting the normal operation and lifespan of the light-emitting module, and significantly impacting its sealing effect. The use of snap-fit ​​components, nuts, and sealing rings complicates the manufacturing process of light-emitting modules. While automated production of individual components relies on molding processes, the degree of automation in assembly remains limited. Summary of the Invention

[0003] To address the technical problems of low production efficiency caused by complex assembly and limited automation in existing technologies, the first aspect of this invention provides a light-emitting module, comprising: a lens layer and a substrate;

[0004] The substrate has a continuous first groove around its perimeter, and the first width at the top of the first groove is greater than the second width at the bottom of the first groove.

[0005] The lens layer includes a continuous first connecting component surrounding the light-emitting area. The bottom of the first connecting component is provided with a slot. The width of the slot when the first connecting component is inserted into the first slot is smaller than the width of the slot when the first connecting component is not inserted into the first slot. The third width of the bottom of the first connecting component when the first connecting component is not inserted into the first slot is greater than the second width of the bottom of the first slot.

[0006] The four peripheral edges of the substrate and the four peripheral edges of the lens layer form a second groove surrounding the lens layer;

[0007] The first groove and / or the second groove contain colloid.

[0008] In some embodiments, a plurality of protrusions are provided at intervals on the inner side of the groove edge of the first groove near the lens layer, and the first connecting component includes a plurality of recesses corresponding to the protrusions on the side near the plurality of protrusions.

[0009] In some embodiments, the top width of the protrusion is greater than the bottom width of the protrusion; the top width of the recess is less than the bottom width of the recess.

[0010] The angle formed by the difference between the top width and the bottom width of the protrusion is greater than the angle formed by the difference between the bottom width and the top width of the recess.

[0011] In some embodiments, the top of the first connection component includes a first step structure, and the first step structure and the four peripheral edges of the substrate form a second groove surrounding the lens layer;

[0012] and / or;

[0013] The substrate has a second step structure around its periphery, and the second step structure and the lens layer together form a second groove surrounding the lens layer.

[0014] In some embodiments, the lens layer includes a light-emitting area and the first connecting component, the light-emitting area and the first connecting component are integral, a first gap is formed between the light-emitting area and the first connecting component, the groove edge of the first groove near the lens layer is located within the first gap, the top width of the first gap is greater than the top width of the groove edge of the first groove near the lens layer, and the bottom width of the first gap is greater than the bottom width of the groove edge of the first groove near the lens layer.

[0015] In some embodiments, the width of the first connecting component at a position parallel to the bottom of the second groove is greater than the third width of the bottom of the first connecting component.

[0016] The viscosity of the colloid in the first groove is greater than that of the colloid in the second groove.

[0017] In some embodiments, the height of the slot is less than the height of the first groove; the first groove is divided in the height direction into a deformable portion corresponding to the position of the slot and an interference portion offset from the position of the slot; the interference portion forms an interference fit with the first connecting component.

[0018] In some embodiments, the light-emitting module further includes a circuit board located on the substrate.

[0019] A second aspect of the present invention provides an electrical cavity for a light-emitting device, comprising a first cavity assembly and a second cavity assembly, wherein the first cavity assembly includes a third groove around its perimeter, and the first width of the top of the third groove is greater than the second width of the bottom of the third groove;

[0020] The second cavity assembly includes a second connecting component around its perimeter, and the second connecting component has a slot at its top or bottom; the slot width when the second connecting component is inserted into the third groove is smaller than the slot width when the second connecting component is not inserted into the third groove; the third width of the bottom of the second connecting component when the second connecting component is not inserted into the third groove is larger than the second width of the bottom of the third groove.

[0021] The four peripheral edges of the first cavity assembly and the four peripheral edges of the second cavity assembly form a fourth groove surrounding the second cavity assembly.

[0022] The third and fourth grooves contain colloids.

[0023] In some embodiments, a plurality of cavity component protrusions are provided at intervals on the inner side of the groove edge of the third groove near the second cavity component, and the second connecting component includes a plurality of cavity component recesses corresponding to the cavity component protrusions on the side near the plurality of cavity component protrusions.

[0024] In some embodiments, the top width of the protrusion of the cavity assembly is greater than the bottom width of the protrusion of the cavity assembly; the top width of the recess of the cavity assembly is less than the bottom width of the recess of the cavity assembly.

[0025] The angle formed by the difference between the top width and bottom width of the protruding part of the cavity assembly is greater than the angle formed by the difference between the bottom width and top width of the concave part of the cavity assembly.

[0026] In some embodiments, the top of the second connecting component includes a second step structure, and the second step structure and the four peripheral edges of the first cavity component form a fourth groove surrounding the second cavity component;

[0027] and / or;

[0028] The four periphery of the first cavity assembly includes a second step structure, and the second step structure and the four periphery of the second cavity assembly form a fourth groove surrounding the second cavity assembly.

[0029] A third aspect of the present invention provides a light-emitting module, comprising: a lens layer and a substrate;

[0030] The substrate has a first groove around its perimeter, and the first width of the top of the first groove is greater than the second width of the bottom of the first groove.

[0031] The lens layer is surrounded by a first connecting component, and the top of the first connecting component is provided with a slot; the width of the slot when the first connecting component is inserted into the first slot is smaller than the width of the slot when the first connecting component is not inserted into the first slot; the third width of the bottom of the first connecting component when the first connecting component is not inserted into the first slot is greater than the second width of the bottom of the first slot.

[0032] The four peripheral edges of the substrate and the four peripheral edges of the lens layer form a second groove surrounding the lens layer;

[0033] The first groove and the second groove contain colloid.

[0034] In some embodiments, when the first connecting component is pressed into the first groove, the top height of the first groove is equal to or slightly exceeds the top height of the first connecting component.

[0035] In some embodiments, the first connecting component is a U-shaped structure.

[0036] In some embodiments, a plurality of protrusions are provided at intervals on the inner side of the groove edge of the first groove near the lens layer, and the first connecting component includes a plurality of recesses corresponding to the protrusions on the side near the plurality of protrusions.

[0037] In some embodiments, the top width of the protrusion is greater than the bottom width of the protrusion; the top width of the recess is less than the bottom width of the recess.

[0038] The angle formed by the difference between the top width and the bottom width of the protrusion is greater than the angle formed by the difference between the bottom width and the top width of the protrusion.

[0039] A fourth aspect of the present invention provides a light-emitting device, comprising the light-emitting module and an electrical cavity for the light-emitting device, wherein the light-emitting module is connected to the light-emitting module.

[0040] The fifth aspect of this invention provides a method for manufacturing a light-emitting module, comprising:

[0041] Provide lens layer and substrate;

[0042] A first colloid is placed inside the first groove;

[0043] The lens layer is placed on the substrate, and the first connecting component is placed into the first groove;

[0044] Apply pressure to the lens layer until the lens layer adheres to the substrate;

[0045] A second colloid is placed inside the second groove.

[0046] In some embodiments, the manufacturing method further includes: placing a circuit board on the substrate; applying pressure to the lens layer until the lens layer is bonded to the substrate includes: the lens layer being bonded to the circuit board, and the circuit board being bonded to the substrate.

[0047] The light-emitting module and its manufacturing method provided by this invention use an interference fit between the connecting component and the groove to replace screws, clips, and other connection methods, improving the convenience of installation. During the pressing process, a viscous colloid deforms with the slot and eventually solidifies in its deformed form in the connecting component and the first groove, forming the first layer of fixation and sealing. A viscous colloid with lower viscosity forms the second layer of fixation and sealing in the connecting component and the second groove after pressing. By using dispensing instead of sealing rings, the system achieves a high degree of automation, high production efficiency, and low production cost. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of the invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Detailed Implementation

[0049] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0050] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0051] Figure 1 This is a structural diagram of the light-emitting module provided in Embodiment 1 of the present invention;

[0052] Figure 2 A1 is a partial enlarged view of the light-emitting module provided in Embodiment 1 of the present invention;

[0053] Figure 3 A1 is a partial enlarged view of the light-emitting module provided in Embodiment 1 of the present invention.

[0054] Figure 4 This is a structural diagram of the light-emitting module substrate provided in Embodiment 1 of the present invention;

[0055] Figure 5This is a partial enlarged view of the light-emitting module substrate B provided in Embodiment 1 of the present invention;

[0056] Figure 6 This is a structural diagram of the lens layer of the light-emitting module provided in Embodiment 1 of the present invention;

[0057] Figure 7 This is a partial enlarged view of the lens layer C2 of the light-emitting module provided in Embodiment 1 of the present invention;

[0058] Figure 8 This is a structural diagram of the first cavity assembly of the electrical cavity provided in Embodiment 2 of the present invention;

[0059] Figure 9 This is a partial enlarged view of the first cavity assembly D of the electrical cavity provided in Embodiment 2 of the present invention;

[0060] Figure 10 This is a structural diagram of the second cavity assembly of the electrical cavity provided in Embodiment 2 of the present invention;

[0061] Figure 11 This is a partial enlarged view of the first cavity assembly E of the electrical cavity provided in Embodiment 2 of the present invention.

[0062] Figure 12 This is a cross-sectional view of the electrical cavity provided in Embodiment 2 of the present invention;

[0063] Figure 13 This is a partial enlarged view of the electrical cavity F provided in Embodiment 2 of the present invention;

[0064] Figure 14 This is a structural diagram of the light-emitting module provided in Embodiment 3 of the present invention;

[0065] Figure 15 This is a partial enlarged view of the light-emitting module G provided in Embodiment 3 of the present invention.

[0066] Example 1

[0067] This embodiment provides a light-emitting module, such as Figure 1-7 As shown.

[0068] The light-emitting module includes a lens layer 1, a circuit board 2, and a substrate 3.

[0069] The lens layer 1 includes a light-emitting area 11 and a first connecting component 12 surrounding the light-emitting area 11, with a first gap 13 between the light-emitting area 11 and the first connecting component 12. The first connecting component includes a first connecting portion 121 protruding upwards above the light-emitting area 11, a second connecting portion 122 connected to the first connecting portion 121 and wider at the top than at the bottom, a third connecting portion 122 with a slot at a position parallel to the bottom of the second groove 5, and a third connecting portion 123 connected to the second connecting portion 122. The first connecting portion 121, the second connecting portion 122, the third connecting portion 123, and the light-emitting area 11 are integrally formed using a mold through automated production.

[0070] The substrate 3 includes a support region 31 and a first groove 32 surrounding the support region 31. A heat sink 33 is provided under the support region of the substrate. In some embodiments, the heat sink and the substrate can be connected separately or integrally molded. In some embodiments, multiple light-emitting modules share a set of heat sinks, and the substrates of the multiple light-emitting modules are bonded to the heat sink. The first groove 32 includes a first groove edge 321 near the support region 31 and a second groove edge 322 extending outward from the substrate. The support region 31, the first groove edge 321, and the second groove edge 322 are integrally molded using an automated production process based on a mold.

[0071] The design of the second connecting portion 122, which is wider at the top and narrower at the bottom, allows the first connecting component 12 to be easily placed in the first groove 32 before pressing in, with a certain margin of error, facilitating subsequent pressing. The height of the groove is related to the interference required during the pressing process. The greater the interference required, the greater the groove height can be; the smaller the interference required, the smaller the groove height can be. When the groove height is small, there are certain requirements for the pressing pressure; the first connecting component 12 needs to be pressed in with greater pressure and has greater downward friction. In some preferred embodiments, the groove height is 2mm-5mm.

[0072] Furthermore, the height of the first groove 32 is higher than the height of the slot. The first groove 32 is divided into a deformable portion corresponding to the position of the slot and an interference portion offset from the position of the slot in the height direction; the interference portion forms an interference fit with the first connecting component 12, that is, the height of the interference fit between the first connecting component 12 and the first groove 32 is greater than the height of the slot.

[0073] When the first connecting component 12 is pressed into the first groove 32, the slot provides deformation space for the extrusion force exerted by the first connecting component 12 during pressing into the first groove 32. The extrusion force is equal to the elastic force provided by the deformation of the slot. As the first connecting component 12 is pressed into the first groove 32, the interference between the first connecting component 12 and the first groove 32 increases, that is, the extrusion force increases with the pressing process, and the applied extrusion force is approximately 2-3 tons. When the interference position is flush with the root of the slot, the slot is more difficult to deform, and the elastic force provided by the slot is at its maximum. The friction caused by the increasing extrusion force and the volume change caused by the interference deformation enable the first connecting component 12 to be effectively pressed into the first groove 32, thereby enabling the lens 1 and the substrate 3 to be stably connected.

[0074] In some embodiments, if the interference fit requirement during the lamination process of the lens layer 1 and the substrate 3 is permissible, the height of the slot can be 0, so that the bent shape of the first connecting component forms an interference fit with the first groove 32 to achieve a better connection effect.

[0075] During the pressing process of lens layer 1 with circuit board 2 and substrate 3, the first connecting component 12 is pressed into the first groove 32. The two sides of the third connecting part 123 with slots are squeezed and deformed by the inner wall of the first groove 32, and the gap between the slots becomes narrower, so that the first connecting component 12 can be inserted into the first groove 32 more smoothly. The interference fit between the third connecting part 123 and the first groove 32 makes the lens layer tightly attached to the circuit board 2 and substrate 3.

[0076] Before the pressing process, the first groove 32 contains a first colloid with a high viscosity. During the pressing process, the first colloid with a certain viscosity is squeezed into the groove and fully fills the deformed groove as the groove spacing gradually narrows due to the pressing. Since the first connecting component 12 is arranged around the light-emitting area 11, the groove of its third connecting part 123 is a three-dimensional annular hollow area surrounding the light-emitting area 11. After the first colloid deforms and fully fills the groove and dries, a narrow three-dimensional annular shape with a certain height and a width equal to the width of the deformed groove is formed in the groove. Below the groove, that is, at the empty height between the first connecting component 12 and the bottom of the first groove 32, a wide three-dimensional annular shape with a shorter height and a width equal to the bottom width of the first groove 32 is formed. Due to the fluidity of the colloid, the narrow three-dimensional annular shape in the groove after drying and the wide three-dimensional annular shape at the empty height between the first connecting component 12 and the bottom of the first groove 32 are a two-segment annular integral structure.

[0077] The combination of the first colloid with the slot and the empty height at the bottom of the first connecting component 12 and the first groove 32, especially the cooperation of the first colloid with the deformation of the slot during the pressing process, effectively improves the overall connection stability after the first connecting component 12 is inserted into the first groove 32. This avoids the lens layer from detaching from the substrate due to inconsistent air pressure inside and outside the lens layer caused by heat generation during the operation of the light-emitting module, which affects the sealing effect. On the other hand, it also serves as a substitute for the conventional sealing ring of the light-emitting module. The technical solution of this embodiment uses colloid to simultaneously achieve multiple functions of fastening connection and water and oxygen dust resistance sealing. It has low production cost and avoids the problems of difficult gripping and positioning by robotic arms caused by the soft and easily deformed sealing ring and the difficulty in controlling its size. This provides favorable conditions for automated production.

[0078] This embodiment achieves fixation and sealing of the lens layer and substrate by forming a continuous ring structure in the empty height and slot at the bottom of the first connecting component 12 and the first groove 32 instead of the traditional sealing ring. It replaces the accurate positioning, placement and installation required in the sealing ring assembly process with glue application, which is more conducive to automated production, effectively improves the production efficiency of the light-emitting module and reduces the production cost of the light-emitting module.

[0079] In the pressed state, the first groove edge 321 is placed in the first interval 13 formed by the light-emitting area 11 and the first connecting component 12. Gaps exist both horizontally and vertically between the first groove edge 321 and the first interval 13. These gaps facilitate the deformation of the second groove edge 322 and its displacement towards the light-emitting area 11 due to pressure when the first connecting component 12 of the lens layer 1 is pressed into the first groove 32. This prevents insufficient space within the first interval 13 due to deformation of the second groove edge 322 during the pressing process, which could prevent the first connecting component 12 from being fully pressed into the first groove 32, thus ensuring that the light-emitting area 11 and circuit board 2 are not tightly adhered to the substrate 3 without gaps. Because the light-emitting module generates heat during operation, the air pressure inside and outside the lens layer will be inconsistent. If the connection between the lens layer and the substrate is not tight enough, the lens layer will detach from the substrate, affecting the sealing effect of the light-emitting module and consequently its lifespan.

[0080] Multiple protrusions 3211 are spaced apart on the inner side of the first groove edge 321. Each protrusion 3211 is a three-dimensional trapezoid that is wider at the top and narrower at the bottom. In some embodiments, the bottom width of the three-dimensional trapezoid is 0, that is, the cross-section of the protrusion 3211 can be triangular. In a preferred embodiment, the slope of the first groove edge 321 at the position not involving the protrusion 3211 is 2°-5°, and the slope of the first groove edge 321 at the position of the protrusion 3211 is 8°-12°.

[0081] The inner side of the first connecting component 12 is provided with recessed portions 120 corresponding to the protrusions 3211 on the edge of the first groove 321. The recessed shape of the recessed portions 120 is a three-dimensional trapezoid that is wider at the top and narrower at the bottom. In some embodiments, the bottom width of the three-dimensional trapezoid is 0, that is, the cross-section of the recessed shape of the recessed portions 120 can be triangular. In a preferred embodiment, the slope of the inner side of the first connecting component 12 that does not involve the position of the recessed portions 120 is 1°-3°, and the slope of the inner side of the first connecting component 12 at the position of the recessed portions 120 is 4°-7°.

[0082] The multiple protrusions 3211 on the inner side of the first groove edge 321, which are spaced apart and matched, increase the contact between the first groove 32 and the first connecting component 120. The protrusions 3211 form a strong clamping force on the first groove 32, which increases the biting force between the first groove 32 and the first connecting component 12. This makes the lens layer 1 and the substrate 3 more fixed, and avoids the lens layer from detaching from the substrate due to the inconsistent air pressure inside and outside the lens layer caused by the heat generated during the use of the light-emitting module, which affects the sealing effect.

[0083] The slope of the inner side of the first connecting component 12 at the location not involving the recessed portion 120 is less than the slope of the first groove edge 321 at the location not involving the protrusion 3211, and the slope of the inner side of the first connecting component 12 at the recessed portion 120 is less than the slope of the first groove edge 321 at the protrusion 3211. The slopes of the recessed portions or the inner sides of the first connecting component that do not involve the recessed portions are all less than the slopes of the first groove edge 321 at the corresponding positions. This makes the first connecting component 12 looser at the top and tighter at the bottom during the pressing process into the first groove 32 when pressure is applied to the lens to make it fit the substrate, which is more conducive to assembly and production.

[0084] The first connecting portion 121 of the first connecting component 12 and the second groove edge 322 of the first groove 32 together form the second groove 5.

[0085] In some embodiments, the second groove 5 is formed recessed on the outer side of the first connecting portion 121 of the first connecting component 12.

[0086] In some embodiments, the second groove 5 is formed by recessing the inner side of the second groove edge 322 of the first groove 32.

[0087] In some embodiments, the second groove 5 is recessed on the outer side of the first connecting portion 121 of the first connecting component 12, and the second groove edge 322 of the first groove 32 is recessed on the inner side, with the two opposite recesses forming together.

[0088] The second groove 5 is used to insert the colloid to complete the seal. The viscosity of the colloid in the second groove 5 is less than that of the colloid in the first groove 32. In a preferred embodiment, the viscosity of the colloid in the second groove 5 is 15,000 cps-25,000 cps, and the viscosity of the colloid in the first groove 32 is 50,000 cps-60,000 cps.

[0089] In a preferred embodiment, the outer side of the first connecting portion 121 of the first connecting component 12 is recessed, and the inner side of the second groove edge 322 of the first groove 32 is recessed. These opposing recesses together form the second groove 5. In this embodiment, the opposing recesses ensure that the space of the second groove 5 is not solely provided by the width of the first connecting portion 121 or the second groove edge 322. The shared opposing recesses allow for a better reduction in the overall width of the first connecting component 12 and the second groove edge 322 while maintaining the necessary width of the second groove 5, resulting in a larger light-emitting area and a higher screen-to-body ratio for the light-emitting module. While maintaining the same light-emitting area, this embodiment, with the outer side of the first connecting portion 121 of the first connecting component 12 and the inner side of the second groove edge 322 of the first groove 32 recessed, provides a more balanced width for the first connecting portion 121 and the second groove edge 322 compared to embodiments with only the outer side of the first connecting portion 121 or only the inner side of the second groove edge 322 recessed. This ensures sufficient width for both components to avoid horizontal misalignment during pressure application to the first connecting component 12.

[0090] The light-emitting module disclosed in this embodiment has advantages such as good fixation and sealing, and support for highly automated assembly. Specifically, the light-emitting module disclosed in this embodiment adopts a two-layer fixing and sealing cooperation. First, a viscous colloid deforms with the slot and finally solidifies in the deformed form to form a first layer of fixation and sealing in the connecting component and the first groove. Second, a less viscous colloid forms a second layer of fixation and sealing in the pressed connecting component and the second groove. The two work together to fix the connecting component and the groove twice at different angles and positions, improving the fixation between the lens and the substrate and providing excellent resistance to water, oxygen, and dust. This embodiment uses an interference fit between the connecting component and the groove instead of screws, clips, and other connection methods, improving the convenience of installation. This embodiment uses dispensing instead of sealing rings, avoiding unnecessary gripping, alignment, and installation of sealing rings during the manufacturing process of the light-emitting module, thus improving the automation level of the manufacturing process.

[0091] Example 2

[0092] This embodiment provides an electrical cavity for a light-emitting device, such as... Figure 8-13As shown, it includes a first cavity assembly 8 and a second cavity assembly 9. The first cavity assembly 8 has a third groove 81 around its perimeter, and the first width of the top of the third groove 81 is greater than the second width of the bottom of the third groove 81. The second cavity assembly 9 has a second connecting assembly 91 around its perimeter, and the bottom of the second connecting assembly 91 has a slot. The width of the slot when the second connecting assembly 91 is inserted into the third groove 81 is less than the width of the slot when the second connecting assembly 91 is not inserted into the third groove 81. The third width of the bottom of the second connecting assembly 91 when it is not inserted into the third groove 81 is greater than the second width of the bottom of the third groove 81. The four perimeters of the first cavity assembly 8 and the four perimeters of the second cavity assembly 9 form a fourth groove 7 surrounding the second cavity assembly 9. The third groove 81 and the fourth groove 7 contain colloid.

[0093] During the pressing process of the first cavity assembly 8 and the second cavity assembly 9, the second connecting assembly 9 deforms, and the deformation generated by the colloid in the third groove solidifies and forms a shape, thereby achieving full fixation and sealing between the first cavity assembly 8 and the second cavity assembly 9.

[0094] The third groove 81 has a plurality of cavity component protrusions 82 spaced apart on the inner side of the groove edge near the second cavity component 9, and the second connecting component 91 has a plurality of cavity component recesses 92 on the side near the plurality of cavity component protrusions 82 that are corresponding to the cavity component protrusions 82.

[0095] The top width of the protrusion 82 of the cavity assembly is greater than the bottom width of the protrusion 82 of the cavity assembly; the top width of the recess 92 of the cavity assembly is less than the bottom width of the recess 92 of the cavity assembly; the angle formed by the difference between the top width and the bottom width of the protrusion 82 of the cavity assembly is greater than the angle formed by the difference between the bottom width and the top width of the recess 92 of the cavity assembly.

[0096] In some embodiments, the top of the second connecting component 91 includes a third step structure 910, which together with the four peripheral edges of the first cavity component 91 forms a fourth groove 7 surrounding the second cavity component 9.

[0097] In some embodiments, the four periphery of the first cavity assembly 91 includes a fourth step structure 83, the fourth step structure 83 and the four periphery of the second cavity assembly 9 form a fourth groove 7 surrounding the first cavity assembly 8.

[0098] In some embodiments, the top of the second connecting component 91 includes a third step structure 910, and the four periphery of the first cavity component 91 includes a fourth step structure 83. The third step structure 910 and the fourth step structure 83 on the top of the second connecting component 91 form a fourth groove 7 surrounding the first cavity component 8.

[0099] The electrical cavity of the light-emitting device provided in this embodiment does not require the use of a sealing ring that is prone to deformation during the gripping process. Instead, it uses glue and interference fit deformation fit to effectively fix and seal the components of the electrical cavity of the light-emitting device. While ensuring the fixation and sealing effect, it provides conditions for the automated production of the electrical cavity of the light-emitting device and thus the light-emitting device.

[0100] Example 3

[0101] Please see Figure 14 and Figure 15 This embodiment provides a light-emitting module, including a lens layer 1, a circuit board 2, and a substrate 3. Unlike the first embodiment, the light-emitting module in this embodiment has a slot located on the top of a first connecting component 12, which is essentially a U-shaped structure. When the first connecting component 12 is pressed into the first groove 32, the top height of the first groove 32 is equal to or slightly exceeds the top height of the first connecting component 12. This allows the adhesive to effectively bond the top of the first connecting component 12 and the top of the second groove 5 after filling the interior of the essentially U-shaped first connecting component 12 when the adhesive is injected into the second groove 5 after pressing.

[0102] Other technical features and effects of this embodiment are similar to those of Embodiment 1, and will not be repeated here.

[0103] Example 4

[0104] This embodiment provides an electrical cavity for a light-emitting device. Unlike the second embodiment, in this embodiment, the slot on the second connecting component 91 is located at the top of the second connecting component 91, and the first connecting component is basically U-shaped. When the second connecting component 91 is pressed into the third groove 81, the top height of the third groove 81 is equal to or slightly exceeds the top height of the second connecting component 91. This allows the adhesive to effectively bond the top of the second connecting component 91 and the third groove 81 after filling the interior of the basically U-shaped second connecting component 91 when the adhesive is injected into the third groove 81 after pressing.

[0105] Other technical features and effects of this embodiment are similar to those of Embodiment 2, and will not be repeated here.

[0106] Example 5

[0107] This embodiment provides a method for manufacturing a light-emitting module, used to manufacture the light-emitting module as shown in Embodiment 1, specifically including:

[0108] The lens layer 1, circuit board 2, and substrate 3 are manufactured as provided in Example 1.

[0109] The circuit board 2 is mounted on the substrate 3. The circuit board 2 has necessary directional holes, and the substrate has necessary directional posts. The directional holes and directional posts cooperate to achieve the positioning of the circuit board.

[0110] Waterproof wires are soldered onto the circuit board mounted on the substrate 3, with the positive and negative terminals of the waterproof wires soldered to the positive and negative terminals on the pads of the circuit board 2, respectively.

[0111] In the first groove 32 of the substrate 3, an automated dispensing head is used to apply adhesive around the first groove 32 so that the first adhesive evenly fills the bottom of the first groove 32. The amount of the first adhesive should be more than the amount of adhesive required for the empty height between the first connecting component 12 and the bottom of the first groove 32, so that the first adhesive has excess material to be pressed into the slot during the pressing process.

[0112] A robotic arm is used to grasp the lens layer 1 and place it above the substrate 3. The first connecting component 12 is then placed into the first groove 32, which has been coated with adhesive. Pressure is applied to the lens layer 1 until it adheres to the circuit board 2 on the substrate 3. This pressure application is achieved using automated equipment capable of supporting pressure of 0.5 tons or more. During the pressure application process, as the first connecting component 12 is pressed down, the groove deforms, its spacing decreases, and a portion of the first adhesive is squeezed into the groove, where it solidifies and takes shape. The first adhesive not squeezed into the groove fully fills the empty space between the first connecting component 12 and the bottom of the first groove 32, forming a sealing ring integrally with the adhesive squeezed into the groove.

[0113] Within the second groove 5, an automated dispensing head applies adhesive around the second groove 5, ensuring the second adhesive evenly fills the second groove 5. This second adhesive in the second groove 5 serves as a second layer of seal, in addition to the adhesive in the first groove 32. This multi-layered sealing design enhances the stability of the connection between the lens layer 1 and the substrate 3, resulting in a better overall sealing effect for the light-emitting module.

[0114] Apply adhesive to the groove at the exit point of the waterproof line on the back of the substrate, install the clips, and complete the assembly of the light-emitting module.

[0115] The light-emitting module prepared based on the manufacturing method of the light-emitting module provided in this embodiment adopts an interference fit between the connecting component and the groove instead of screws, clips, and other connection methods during the manufacturing and assembly process, which improves the convenience of installation. During the pressing process, a viscous colloid deforms with the slot and finally solidifies in the deformed form to form a first layer of fixation and sealing in the connecting component and the first groove. A viscous colloid with lower viscosity forms a second layer of fixation and sealing in the connecting component and the second groove after pressing. The use of dispensing replaces the sealing ring, resulting in a high degree of automation, high production efficiency, and low production cost.

[0116] For illustrative purposes, the foregoing description uses specific nomenclature to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Therefore, for purposes of illustration and description, the foregoing description of specific embodiments described herein is presented. These descriptions are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the teachings above. Furthermore, when used herein to refer to the location of components, the terms above and below, or their synonyms, do not necessarily refer to absolute locations relative to external references, but rather to the relative locations of the components with reference to the accompanying drawings.

[0117] Furthermore, the foregoing figures and descriptions include numerous concepts and features that can be combined in various ways to achieve a variety of beneficial effects and advantages. Therefore, features, components, elements, and / or concepts from various different figures can be combined to produce embodiments or implementations that are not necessarily shown or described in this specification. Moreover, in any particular embodiment and / or implementation, not all features, components, elements, and / or concepts shown in the specific figures or descriptions are necessarily required. It should be understood that such embodiments and / or implementations fall within the scope of this specification.

Claims

1. A light-emitting module, characterized in that, include: Lens layer, substrate; The substrate has a first groove around its perimeter, and the first width of the top of the first groove is greater than the second width of the bottom of the first groove. The lens layer is surrounded by a first connecting component, and the bottom of the first connecting component is provided with a slot; the width of the slot when the first connecting component is inserted into the first slot is less than the width of the slot when the first connecting component is not inserted into the first slot; the third width of the bottom of the first connecting component when the first connecting component is not inserted into the first slot is greater than the second width of the bottom of the first slot. The four peripheral edges of the substrate and the four peripheral edges of the lens layer form a second groove surrounding the lens layer; The first groove and / or the second groove contain a colloid.

2. The light-emitting module according to claim 1, characterized in that, The first groove has a plurality of protrusions spaced apart on the inner side of the groove edge, and the first connecting component has a plurality of recesses corresponding to the protrusions on the side near the plurality of protrusions.

3. The light-emitting module according to claim 2, characterized in that, The top width of the protrusion is greater than the bottom width of the protrusion; the top width of the recess is greater than the bottom width of the recess. The angle formed by the difference between the top width and the bottom width of the protrusion is greater than the angle formed by the difference between the bottom width and the top width of the recess.

4. The light-emitting module according to claim 1, characterized in that, The top of the first connecting component includes a first step structure, and the first step structure and the four peripheral edges of the substrate form a second groove surrounding the lens layer; and / or; The substrate has a second step structure around its four periphery, and the second step structure and the lens layer together form a second groove surrounding the lens layer.

5. The light-emitting module according to claim 1, characterized in that, The lens layer includes a light-emitting area and the first connecting component. The light-emitting area and the first connecting component are integrally formed. A first gap is formed between the light-emitting area and the first connecting component. The groove edge of the first groove near the lens layer is located within the first gap. The top width of the first gap is greater than the top width of the groove edge of the first groove near the lens layer. The bottom width of the first gap is greater than the bottom width of the groove edge of the first groove near the lens layer.

6. The light-emitting module according to claim 1, characterized in that, The width of the first connecting component at the position parallel to the bottom of the second groove is greater than the third width of the bottom of the first connecting component.

7. The light-emitting module according to claim 1, characterized in that, The viscosity of the colloid in the first groove is greater than that of the colloid in the second groove.

8. The light-emitting module according to claim 1, characterized in that, The height of the slot is less than the height of the first groove; the first groove is divided into a deformable part corresponding to the position of the slot and an interference part offset from the position of the slot in the height direction; the interference part forms an interference fit with the first connecting component.

9. The light-emitting module according to any one of claims 1-8, characterized in that, The light-emitting module also includes a circuit board, which is located on the substrate.

10. An electrical cavity for a light-emitting device, characterized in that, It includes a first cavity assembly and a second cavity assembly. The first cavity assembly has a third groove around its perimeter. The first width of the top of the third groove is greater than the second width of the bottom of the third groove. The second cavity assembly includes a second connecting component around its perimeter, and the second connecting component has a slot at its top or bottom; the slot width when the second connecting component is inserted into the third groove is smaller than the slot width when the second connecting component is not inserted into the third groove; the third width of the bottom of the second connecting component when the second connecting component is not inserted into the third groove is larger than the second width of the bottom of the third groove. The four peripheral edges of the first cavity assembly and the four peripheral edges of the second cavity assembly form a fourth groove surrounding the second cavity assembly. The third groove and / or the fourth groove contain a colloid.

11. The electrical cavity for the light-emitting device according to claim 10, characterized in that, The third groove has multiple cavity component protrusions spaced apart on the inner side of the groove edge near the second cavity component. The second connecting component has multiple cavity component recesses on the side near the multiple cavity component protrusions that correspond to the cavity component protrusions.

12. The electrical cavity for the light-emitting device according to claim 11, characterized in that, The top width of the protrusion of the cavity assembly is greater than the bottom width of the protrusion of the cavity assembly; the top width of the recess of the cavity assembly is greater than the bottom width of the recess of the cavity assembly. The angle formed by the difference between the top width and bottom width of the protruding part of the cavity assembly is greater than the angle formed by the difference between the bottom width and top width of the concave part of the cavity assembly.

13. The electrical cavity for the light-emitting device according to claim 10, characterized in that, The top of the second connecting component includes a second step structure, which together with the four periphery edges of the first cavity component forms a fourth groove surrounding the second cavity component. and / or; The four periphery of the first cavity assembly includes a second step structure, and the second step structure and the four periphery of the second cavity assembly form a fourth groove surrounding the second cavity assembly.

14. A light-emitting module, characterized in that, include: Lens layer, substrate; The substrate has a first groove around its perimeter, and the first width of the top of the first groove is greater than the second width of the bottom of the first groove. The lens layer is surrounded by a first connecting component, and the top of the first connecting component is provided with a slot; the width of the slot when the first connecting component is inserted into the first slot is less than the width of the slot when the first connecting component is not inserted into the first slot; the third width of the bottom of the first connecting component when the first connecting component is not inserted into the first slot is greater than the second width of the bottom of the first slot. The four peripheral edges of the substrate and the four peripheral edges of the lens layer form a second groove surrounding the lens layer; The first groove and / or the second groove contain a colloid.

15. The light-emitting module according to claim 14, characterized in that, When the first connecting component is pressed into the first groove, the top height of the first groove is equal to or slightly exceeds the top height of the first connecting component.

16. The light-emitting module according to claim 14, characterized in that, The first connecting component has a U-shaped structure.

17. The light-emitting module according to claim 14, characterized in that, The first groove has a plurality of protrusions spaced apart on the inner side of the groove edge near the lens layer, and the first connecting component has a plurality of recesses corresponding to the protrusions on the side near the plurality of protrusions.

18. The light-emitting module according to claim 17, characterized in that, The top width of the protrusion is greater than the bottom width of the protrusion; the top width of the recess is greater than the bottom width of the recess. The angle formed by the difference between the top width and the bottom width of the protrusion is greater than the angle formed by the difference between the bottom width and the top width of the protrusion.

19. A light-emitting device, comprising a light-emitting module according to any one of claims 1-9, 14-18.

20. A light-emitting device, comprising an electrical cavity for a light-emitting device according to any one of claims 10-13.

21. A light-emitting device, comprising a light-emitting module according to any one of claims 1-9, 14-18 and a light-emitting device electrical cavity according to any one of claims 10-13, wherein the light-emitting module is connected to the light-emitting device electrical cavity.

22. A method for manufacturing a light-emitting module, characterized in that, include: Provides a lens layer and substrate for a light-emitting module as described in any one of claims 1-9 and 14-18; A first colloid is placed inside the first groove; The lens layer is placed on the substrate, and the first connecting component is placed into the first groove; Apply pressure to the lens layer until the lens layer adheres to the substrate; A second colloid is placed inside the second groove.

23. The method for manufacturing a light-emitting module according to claim 22, characterized in that, The manufacturing method further includes: placing a circuit board on the substrate; applying pressure to the lens layer until the lens layer is bonded to the substrate includes: the lens layer being bonded to the circuit board, and the circuit board being bonded to the substrate.

Citation Information

Patent Citations

  • LED module and lighting device

    CN105674077A

  • Waterproof lens, waterproof module and lamps and lanterns

    CN207471242U