Analog sense points for measuring circuit dies

Abstract

The various embodiments described herein provide analog sensing points for measuring circuit dies, which may form part of an integrated circuit (IC) package and facilitate the measurement of at least a portion of the circuit die using Kelvin measurement methods.

Description

Technical Field

[0001] Embodiments of this disclosure generally relate to voltage measurement, and more specifically, to analog sensing points for circuit dies that may form part of an integrated circuit (IC) package and facilitate the measurement of at least a portion of the circuit die using Kelvin measurement. Background Technology

[0002] To facilitate the debugging or testing of manufactured circuits, such as memory integrated circuit (IC) packages, the manufactured circuit may include one or more interfaces that enable the use of external measuring instruments to measure signal voltages generated by the manufactured circuit. For example, while the manufactured circuit is operating, one or more probes of the measuring instrument may be coupled to the circuit's interface, which facilitates the measurement of signals or voltages passing through portions of the circuit. Additionally, standard interfaces, such as the JTAG (Joint Test Action Group) interface, can be used in some cases to provide certain measurements as digital data. Summary of the Invention

[0003] In one aspect, this disclosure relates to a circuit comprising: a substrate having a top side; a circuit die mounted to the top side of the substrate; and a plurality of analog sensing points disposed on the top side of the substrate, the plurality of analog sensing points being operatively coupled to the circuit die such that the plurality of analog sensing points are configured to provide voltage measurement of portions of the circuit die.

[0004] In another aspect, this disclosure relates to an integrated circuit package comprising: a printed circuit board having a top side and a bottom side, wherein one of a pin grid array or a ball grid array is disposed on the bottom side; a circuit die mounted to the top side of the printed circuit board; and a plurality of analog sensing pads disposed on the top side of the printed circuit board, the plurality of analog sensing pads being operatively coupled to the circuit die such that the plurality of analog sensing pads are configured to provide voltage measurement of portions of the circuit die.

[0005] In another aspect, this disclosure relates to a method comprising: manufacturing a circuit substrate including: a plurality of analog sensing points disposed on a side of the circuit substrate; and a plurality of conductive paths operatively coupling the plurality of analog sensing points to a location on the side of the circuit substrate configured to receive a circuit die; and mounting the circuit die to the location such that the circuit die is operatively coupled to the plurality of analog sensing points via the plurality of conductive paths, the plurality of analog sensing points being configured to provide voltage measurement of a portion of the circuit die. Attached Figure Description

[0006] This disclosure will be more fully understood from the detailed description given below and from the accompanying drawings of various embodiments thereof. However, the drawings should not be used to limit this disclosure to the particular embodiments, but are merely for explanation and understanding.

[0007] Figure 1 Examples of analog sensing points for circuit dies according to some embodiments of this disclosure are described.

[0008] Figure 2 This section describes example simulation sensing points implemented relative to the substrate of an integrated circuit package according to some embodiments of this disclosure.

[0009] Figure 3 This is a flowchart illustrating an example method of using analog sensing points to measure a circuit die according to some embodiments of this disclosure.

[0010] Figure 4 This is a flowchart illustrating an example method for manufacturing a circuit that includes analog sensing points to measure circuit dies, according to some embodiments of this disclosure. Detailed Implementation

[0011] Various aspects of this disclosure relate to analog sensing points for circuit dies (or bare blocks), which may form part of an integrated circuit (IC) package (e.g., a memory circuit die on an IC package) and facilitate the measurement (e.g., voltage measurement) of portions of the circuit die using Kelvin measurement methods. Specifically, some embodiments provide one or more analog sensing points disposed on a circuit substrate of an integrated circuit (IC) package or, for example, a substrate of a printed circuit board (PCB), wherein the one or more analog sensing points facilitate measurement relative to the die of the IC package mounted on the substrate. For example, the embodiments described herein may relate to circuit die implementations of a memory subsystem. As used herein, a memory subsystem may be a memory device, a memory module, or a mixture of a memory device and a memory module. Generally, a host system may utilize a memory subsystem comprising one or more memory components (hereinafter also referred to as a "memory device"). The host system may provide data to be stored in the memory subsystem and may request data to be retrieved from the memory subsystem.

[0012] IC packages often rely on digital methods for measuring voltages within the IC package. These digital methods typically provide voltage measurements as digital data via JTAG (Joint Test Action Group) or a similar interface on the IC package. Unfortunately, IC packages are subject to high resistance and inductance, which can lead to measurement errors provided by digital methods. Furthermore, the resolution provided by digital voltage measurement methods can be limited.

[0013] Kelvin sensing points facilitate the Kelvin method for measuring circuits (e.g., voltage, current, resistance, or impedance) to reduce measurement errors. Generally, the Kelvin measurement method (also known as four-point sensing) is an analog measurement method that can be used to measure voltage via four sensing points (e.g., probes or electrodes)—a pair of points (also known as force points) for measuring the resistance or impedance (hereinafter, resistance / impedance) of a part of the circuit (e.g., by driving a known current through a portion of the circuit) and another pair of points (also known as sensing points) for measuring the voltage of the part. Additionally, even without needing to use said pair of points for current, the other pair of points can be used to measure the voltage of the part based on a known or unknown current that has flowed through the part during operation of the circuit. Thus, depending on the embodiment, two sensing points (e.g., Kelvin sensing points) can be used to measure voltage, or four points (e.g., Kelvin sensing points) can be used to measure resistance or impedance. Using the Kelvin method avoids measurement errors (e.g., voltage measurement errors) caused by inductance or resistance in the wires of the circuit. Although Kelvin voltage sensing points can be used to measure the voltage of a circuit, they are not currently used in relation to IC packages.

[0014] This disclosure addresses the shortcomings of conventional methods for measuring the voltage of a die in an IC package. According to various embodiments, one or more analog sensing points (e.g., pads) are disposed or embedded on the top layer (e.g., top side) of the substrate of the IC package, which facilitates accurate voltage measurement of at least a portion of the circuit die (or die) of the IC package mounted on the substrate. Specifically, the one or more analog sensing points disposed on the top layer of the substrate facilitate Kelvin measurement of the die voltage. The one or more analog sensing points can serve as Kelvin sensing points and facilitate Kelvin connection between the die and one or more measuring instruments (e.g., oscilloscope, voltmeter, galvanometer, or multimeter). For example, regarding the portion of the circuit die being measured, the one or more analog sensing points include a pair of analog sensing points for measuring the voltage of that portion. These two (Kelvin) sensing points for measuring the voltage have little or no current flowing along their sensing lines, and therefore resistance and inductance do not affect the voltage measurement. In another example, one or more analog sensing points include a pair of analog sensing points for measuring the resistance / impedance of the section, and another pair of analog sensing points for measuring the voltage of the section. The first pair of analog sensing points may be conductively coupled to an external probe point relative to the section, while the second pair of analog sensing points may be conductively coupled to an internal probe point closer to the section. This example is relative to... Figure 1 Note: The substrate may include a printed circuit board (PCB) of an IC package. High-frequency voltages generated by the die, such as voltages up to 1-10 GHz, can be measured using the analog sensing points described herein.

[0015] In some embodiments, one or more analog sensing points include one or more conductive pads (e.g., metal pads) disposed on a substrate. Additionally, the analog sensing pads may include solder bumps (e.g., bumps) disposed on the conductive pads. The die of the IC package may include a flip-chip BGA or a wire-bonded chip with a BGA mounted on a substrate. The analog sensing pads can be operatively coupled to the die of the IC package via conductive paths (e.g., wires or traces) disposed on the substrate.

[0016] In some embodiments, one or more analog sensing points are located on or near the periphery or edge of the IC package. In this way, the one or more analog sensing points can be positioned at a lower routing density than, for example, near a die at the center of the IC package, allowing the one or more analog sensing points to have a larger size than would otherwise be possible. Some embodiments are implemented by removing one or more of the IC package cover, encapsulant, and solder mask to expose one or more conductive pads (e.g., metal pads) for use as one or more analog sensing pads.

[0017] Voltage measurement at the top-level analog sensing point used in the embodiments enables the testing and debugging of IC packages while at least reducing voltage measurement errors. For example, the top of the substrate outside the circuit die area can be exposed and used for probe points (e.g., as illustrated by cover removal).

[0018] By embedding analog sensing pads into the top layer of an IC package, as described herein, various embodiments can provide higher resolution and accuracy for voltage measurements at the circuit die, including high-frequency voltages (e.g., 1-10 GHz), than conventional methods. Additionally, the analog sensing pads described herein can provide voltage measurements at the circuit die while reducing or avoiding measurement errors caused by the resistance of the IC package or filtering caused by the inductance of the IC package (e.g., high-frequency voltages). The top-layer voltage sensing pads of the embodiments eliminate the need for additional bottom-side pins for the IC package, which can be expensive and increase the IC package footprint. Furthermore, some embodiments can be used as an alternative to using digital methods to measure the voltage of the circuitry within the IC package, which provides less accurate voltage measurements. Some embodiments provide physical access for measuring the voltage of portions of the circuit die (e.g., by placing exposed points on top of the substrate, whether or not a cover is used), where physical access to the circuit die for such measurements would otherwise be difficult. Conventional substrate connections at the circuit die are typically inaccessible and are located on top of and connected therebetween the substrate. For conventional substrate connections, there is no space at the bottom of the package pins because these are reserved (e.g., for important signals and power).

[0019] Although various embodiments are described herein with respect to pads, it will be understood that for some embodiments, the analog sensing point may be implemented by different means. Furthermore, although various embodiments are described herein with respect to a measured voltage, it will be understood that for some embodiments, the analog sensing point may be used to measure other aspects of the circuit die, such as resistance / impedance or current.

[0020] As used herein, the Kelvin measurement method may also be referred to as four-wire sensing or four-point probe method. Additionally, as used herein, measuring instruments may include devices that measure voltage, current, resistance, impedance, or a combination thereof relative to a circuit. Examples of measuring instruments may include oscilloscopes, voltmeters, galvanometers, and multimeters.

[0021] This document discloses some examples of IC packages that include or use voltage sensing points as described herein, which can be used to measure voltage using the Kelvin method.

[0022] Figure 1 Examples of analog sensing points 102, 104, 110, 112 for a circuit die 130 according to some embodiments of this disclosure are described below. For illustrative purposes, Figure 1 This is a simplified representation of an analog sensing point on a substrate that is operatively coupled to a circuit die mounted on the substrate, and does not include additional details typically found in the practical application of the embodiments.

[0023] exist Figure 1 In the circuit 100, a substrate 120, a circuit die 130 mounted on the top side of the substrate 120, and analog sensing points 102, 104, 110, and 112 disposed on the top side of the substrate 120. As shown, the analog sensing points 102, 104, 110, and 112 are disposed at or near the outer periphery or edge of the substrate 120, which allows the analog sensing points 102, 104, 110, and 112 to avoid routing congestion at or near the circuit die 130 that would limit the size of the analog sensing points 102, 104, 110, and 112. Additionally, each of the analog sensing points 102, 104, 110, and 112 may include a conductive pad (e.g., a metal pad) on which solder balls (e.g., bumps) may be further disposed.

[0024] In various embodiments, substrate 120 includes a printed circuit board. Multiple connections may be disposed on the bottom side of substrate 120. For example, a pin grid array or ball grid array may be disposed on the bottom side of substrate 120, allowing substrate 120 to be operatively coupled to a larger circuit (e.g., a larger printed circuit board with a chip socket configured to receive and operatively coupled to substrate 120). By disposing the analog sensing points 102, 104, 110, 112 on the top side of substrate 120, various embodiments eliminate the need for additional connection (e.g., conductive) elements (e.g., pins or balls) disposed on the bottom side of substrate 120. This not only reduces the overall cost of manufacturing circuit 100 but also avoids the need to increase the footprint of substrate 120.

[0025] Analog sensing points 102, 104, 110, and 112 are electrically coupled to a portion 136 of the circuit die 130 via conductive paths 132. One or more of the conductive paths 132 may include wires or traces disposed on top of the substrate 120. For example, the circuit die 130 may include a flip-chip ball grid array (BGA), wherein conductive paths 132 couple the analog sensing points 102, 104, 110, and 112 to connection elements 134 (e.g., solder balls or bumps) of the ball grid array of the circuit die 130, and wherein connection elements 134 are coupled to corresponding points relative to portion 136. Although not explicitly stated, alternatively, the circuit die 130 may include a wire-bonded ball grid array (BGA), wherein wires couple the analog sensing points 102, 104, 110, and 112 to connection elements of the ball grid array on the top side of the circuit die 130 (e.g., by means of another substrate disposed on the ball grid array of the circuit die 130). Additionally, when the circuit die 130 includes a wire-bonded BGA and the circuit 100 forms part of an IC package, the top side of the substrate 120 and the circuit die 130 may be covered with epoxy resin (or other filler) so that the epoxy resin (or other filler) is not disposed over the analog sensing points 102, 104, 110, 112. For example, during manufacturing, the epoxy resin can be removed from the analog sensing points 102, 104, 110, 112, thereby providing probe access to the analog sensing points 102, 104, 110, 112.

[0026] Section 136 may represent one or more components of circuit die 130. According to various embodiments, analog sensing points 102, 104 are configured to provide resistance or impedance measurements for section 136, and analog sensing points 110, 112 are configured to provide voltage measurements across section 136. As shown, analog sensing points 110, 112 are coupled closer to the conductive path of section 136 than analog sensing points 102, 104. Given the above, one or more measuring instruments (e.g., their probes) may be coupled to analog sensing points 102, 104, 110, 112 to form a Kelvin connection, which allows one or more measuring instruments to measure voltage across section 136 using a Kelvin method. Therefore, in the context of a Kelvin measurement method, analog sensing points 102, 104 may represent force points or probes, and analog sensing points 110, 112 may represent sensing points or probes. According to some embodiments, by forming a Kelvin connection with analog sensing points 102, 104, 110, 112, one or more measuring instruments can (across portion 136) measure the high-frequency voltage (e.g., 1-10 GHz) at the circuit die 130, with higher resolution than conventional techniques, and can do so while avoiding measurement errors (e.g., those caused by resistance or inductance due to IC packaging, etc.).

[0027] Figure 2 This section describes example simulation sensing points implemented relative to a substrate 200 of an IC package according to some embodiments of this disclosure. Figure 2 In this embodiment, the top side of substrate 200 includes analog sensing pads 210, 212, 214, and 216, which are electrically coupled to a central portion 220 of substrate 200. According to various embodiments, the central portion 220 of substrate 200 corresponds to a location on substrate 200 where a circuit die will be mounted, and is operatively coupled to substrate 200. Traces disposed on substrate 200 can be coupled to connection elements of the circuit die mounted to substrate 200. Furthermore, at least some of those traces can couple one or more of the analog sensing pads 210, 212, 214, and 216 to corresponding connection elements of the circuit die, which facilitates one or more Kelvin connections to one or more portions of the circuit die as described herein.

[0028] Figure 3 This is a flowchart illustrating an example method 300 for measuring a circuit die using analog sensing points, according to some embodiments of this disclosure. For example, method 300 may be relative to... Figure 1 Circuit 100 or relative to Figure 2 The substrate 200 is used for execution. Depending on the embodiment, method 300 may be performed during circuit testing or debugging, or more specifically, the circuit die is coupled to the analog sensing point.

[0029] Initially, in operation 302, the user can remove the package cover, sealant, solder mask, or a combination thereof from the circuit (e.g., 100), which exposes analog sensing points (e.g., 102, 104, 110, 112) of the circuit (e.g., 100) and makes them accessible via probes of one or more measuring instruments. Operation 302 can be performed where the circuit (e.g., 100) forms a portion of an IC package.

[0030] In operation 304, a user (e.g., an electrical engineer or technician) couples one or more measuring instruments to multiple analog sensing points (e.g., 102, 104, 110, 112) of a circuit (e.g., 100) that includes analog sensing points and a circuit die (e.g., 130). In various embodiments, the circuit (e.g., 100) includes a substrate (e.g., 120) having a top side, and the circuit die (e.g., 130) is mounted on the top side of the substrate (e.g., 120). Additionally, the analog sensing points (e.g., 102, 104, 110, 112) are disposed on the top side of the substrate (e.g., 120) and are operatively coupled to the circuit die (e.g., 130) such that the analog sensing points are configured to provide voltage measurements for portions (e.g., 136) of the circuit die (e.g., 130). According to various embodiments, the analog sensing points (e.g., 102, 104, 110, 112) include a first plurality of (e.g., pairs) analog sensing points (e.g., 110, 112) for measuring the voltage of a portion (e.g., 136) and a second plurality of (e.g., pairs) analog sensing points (e.g., 102, 104) for measuring the resistance or impedance of a portion (e.g., 136). In view of the above, one or more measuring instruments may be coupled to the analog sensing points (e.g., 102, 104, 110, 112) such that the voltage probe of one or more measuring instruments is coupled to the first plurality of analog sensing points (e.g., 110, 112), and the current / resistance / impedance probe of one or more measuring instruments is coupled to the second plurality of analog sensing points (e.g., 102, 104). This can refer to one or more measuring instruments forming a Kelvin connection by analog sensing points (e.g., 102, 104, 110, 112) relative to a portion (e.g., 136) of a circuit die (e.g., 130).

[0031] In some embodiments, the voltage of the portion (e.g., 136) is measured using a first set of analog sensing points (e.g., 110, 112). In other embodiments, the resistance / impedance of the portion (e.g., 136) is measured by: driving a known current to a second set of analog sensing points (e.g., 102, 104); measuring the voltage of the portion (e.g., 136) using the first set of analog sensing points (e.g., 110, 112); and determining the resistance or impedance of the portion (e.g., 136) using the known current and the measured voltage (e.g., resistance equals the measured voltage divided by the known current (R = V / I)). The resistance may be without any time-varying signal (e.g., direct current (DC)), and the impedance may have a time-varying signal (e.g., alternating current (AC)), wherein the impedance includes the resistance plus the effects of inductance and capacitance.

[0032] Finally, in operation 306, the voltage of section (e.g., 136) is measured using the Kelvin measurement method with one or more measuring instruments. The one or more measuring instruments used may include, but are not limited to, an oscilloscope, a voltmeter, a galvanometer, or a multimeter.

[0033] Figure 4 This is a flowchart illustrating an example method 400 for manufacturing a circuit that includes analog sensing points to measure circuit dies, according to some embodiments of this disclosure. For example, method 400 can be used to manufacture a circuit similar to... Figure 1 The circuit 100 or similar Figure 2 The substrate of 200.

[0034] In operation 402, a circuit die is manufactured that includes a plurality of external connection elements (e.g., pins, bumps, or solder balls) configured to provide Kelvin connections to portions of the circuit die (e.g., internal components or electrical paths). For example, in a circuit die that includes a ball grid array (BGA) as part of its external connection elements, at least two connection elements of the ball grid array (e.g., bumps or solder balls) (e.g., Figure 1 The four connecting elements 134 can be configured to provide connection with parts (e.g., Figure 1 The circuit die may include internal routing or wiring that operatively couples at least four connection elements to a portion of the circuit die, such that when one or more measuring instruments are coupled to at least two connections (via analog sensing pads on the substrate), a Kelvin connection is formed between one or more measuring instruments and a portion of the circuit die. Additionally, external connection elements (e.g., at least four connection elements of a ball grid array) may be positioned such that, once the circuit die is mounted to a substrate as described herein, those external connection elements are operatively coupled to conductive paths (e.g., wires or traces) on the substrate, which are operatively coupled to analog sensing pads on the substrate.

[0035] During operation 404, the substrate for manufacturing the circuit (e.g., Figure 1 120), wherein the substrate includes a plurality of analog sensing points disposed on the sides of the substrate (e.g., Figure 1 (e.g., 102, 104, 110, 112), and multiple conductive paths (e.g., Figure 1 (132) The conductive path operatively couples a plurality of analog sensing points to said side of the substrate configured to receive the (mounting) location of the circuit die (e.g., on substrate 120). Figure 1 (Position 134). Depending on the embodiment, the conductive path may include wires or traces disposed on the substrate.

[0036] Subsequently, in operation 406, the circuit die manufactured in operation 402 is mounted onto the substrate at a mounting location, such that the circuit die passes through multiple conductive paths (e.g., Figure 1 (132) can be operatively coupled to multiple analog sensing points (e.g., Figure 1 (e.g., 102, 104, 110, 112). In this way, multiple analog sensing points can provide a portion of the circuit die (e.g., Figure 1 The voltage measurement of (136) can be performed via a Kelvin connection as described herein. According to some embodiments, the combination of the substrate and the mounting circuit die forms an IC package, such as a memory IC package.

[0037] Finally, in operation 408, a cover is mounted on the side above the substrate, on which a circuit die is mounted. According to various embodiments, the cover is mounted such that it at least covers the circuit die. In some embodiments, the cover is mounted such that it covers the circuit die and one or more of a plurality of analog sensing points, and the cover can be removed from the substrate to gain access to the plurality of analog sensing points (e.g., for testing or debugging purposes). Generally, the cover can be used for heat dissipation. Alternatively, the circuit die may be exposed so that a heat sink can make direct contact with the circuit die. Encapsulating agents (e.g., such as epoxy resin or solder mask) can be used to seal and protect the circuit die connections. According to some embodiments, the combination of the substrate, the mounted circuit die, and the mounting cover forms an IC package, such as a memory IC package.

[0038] In the foregoing description, embodiments of the present disclosure have been described with reference to specific example embodiments thereof. It will be apparent that various modifications may be made to the embodiments of the present disclosure without departing from the broader spirit and scope set forth in the appended claims. Therefore, the description and drawings should be considered illustrative rather than restrictive.

Claims

1. A circuit comprising: Substrate, having a top side; A circuit die, mounted to the top side of the substrate, the circuit die comprising: The first pair of connecting elements is operatively coupled to a conductive path of a portion of the circuit die to enable voltage measurement of that portion; A second pair of connecting elements is operatively coupled to the conductive path of the portion to enable at least one of resistance measurement or impedance measurement of the portion, wherein the first pair of connecting elements is operatively coupled to the portion closer to the conductive path than the second pair of connecting elements. External analog sensing point pairs are disposed on the top side of the substrate and at or near the edge of the substrate, the external analog sensing point pairs being used to measure at least one of the resistance or impedance of the portion; An internal analog sensing point pair is disposed on the top side of the substrate, at or near the edge of the substrate, and between the external analog sensing point pairs. The internal analog sensing point pairs are used to measure the voltage of the portion. The top side of the circuit die is covered with epoxy resin such that the epoxy resin is not disposed on the external analog sensing point pairs and the internal analog sensing point pairs. An internal trace pair, disposed on the top side of the substrate and operably couples the internal analog sensing point pair to the first pair of connection elements; and An external trace pair, disposed on the top side of the substrate and operatively coupling the external analog sensing point pair to the second pair of connection elements, the external analog sensing point pair and the internal analog sensing point pair being configured to provide the voltage measurement of the portion of the circuit die using a Kelvin measurement method.

2. The circuit of claim 1, wherein the circuit die comprises a flip-chip ball grid array (BGA) and the first pair of connection elements and the second pair of connection elements are portions of the flip-chip ball grid array.

3. The circuit of claim 1, wherein the circuit die comprises a wire-bonded ball grid array (BGA), the first pair of connection elements and the second pair of connection elements are part of the wire-bonded ball grid array, and each analog sensing point in the external analog sensing point pair and the internal analog sensing point pair is operatively coupled to the wire-bonded ball grid array via a wire to the top side of the circuit die.

4. The circuit of claim 1, wherein the circuit forms part of an integrated circuit package, and the substrate comprises a printed circuit board.

5. The circuit of claim 1, wherein one of the pin grid array or the ball grid array is disposed on the bottom side of the substrate.

6. The circuit of claim 1, wherein each of the external analog sensing point pair and the internal analog sensing point pair comprises a conductive pad.

7. An integrated circuit package, comprising: A printed circuit board having a top side and a bottom side, the bottom side having one of a pin grid array or a ball grid array disposed thereon; A circuit die, mounted to the top side of the printed circuit board, the circuit die comprising: The first pair of connecting elements is operatively coupled to a conductive path of a portion of the circuit die to enable voltage measurement of that portion; A second pair of connecting elements, operably coupled to the conductive path of the portion to enable at least one of resistance or impedance measurement of the portion, wherein the first pair of connecting elements is operably coupled to the portion closer to the conductive path than the second pair of connecting elements; an external trace pair disposed on the top side of the printed circuit board and operably couples an external analog sensing point pair to the second pair of connecting elements; and An internal trace pair, disposed on the top side of the printed circuit board and operatively coupling an internal analog sensing point pair to the first pair of connecting elements, the external analog sensing point pair and the internal analog sensing point pair being configured to provide the voltage measurement of the portion of the circuit die using a Kelvin measurement method, the top side of the circuit die being covered with epoxy resin such that the epoxy resin is not disposed on the external analog sensing point pair and the internal analog sensing point pair.

8. The integrated circuit package of claim 7, wherein the circuit die comprises a flip-chip ball grid array (BGA), and the first pair of connection elements and the second pair of connection elements are portions of the flip-chip ball grid array.

9. The integrated circuit package of claim 7, wherein the circuit die includes a wire-bonded ball grid array (BGA), the first pair of connection elements and the second pair of connection elements are part of the wire-bonded ball grid array, and each analog sensing point in the external analog sensing point pair and the internal analog sensing point pair is operatively coupled to the wire-bonded ball grid array via a wire to the top side of the circuit die.

10. A method comprising: Manufacturing a circuit substrate, the circuit substrate comprising: External analog sensing point pairs are disposed on the top side of the circuit substrate and at or near the edge of the circuit substrate, the external analog sensing point pairs being used to measure at least one of the resistance or impedance of a portion of the circuit die. An internal analog sensing point pair is disposed on the top side of the circuit substrate, at or near the edge of the circuit substrate, and between the external analog sensing point pairs, the internal analog sensing point pairs being used to measure the voltage of the portion; Internal trace pairs, disposed on the top side of the circuit substrate and operably coupling the internal analog sensing point pairs to a first pair of connection elements on the circuit die; and An external trace pair, disposed on the top side of the circuit substrate and operatively coupling the external analog sensing point pair to a second pair of connection elements on the circuit die, the top side of the circuit die being covered with epoxy resin such that the epoxy resin is not disposed on the external analog sensing point pair and the internal analog sensing point pair. The location of the circuit substrate on the top side configured to receive the circuit die; and The circuit die is mounted at the location such that the first pair of connecting elements is operatively coupled to the internal trace pair and the second pair of connecting elements is operatively coupled to the external trace pair. The first pair of connecting elements is operatively coupled to the conductive path of the portion to achieve voltage measurement of the portion, and the second pair of connecting elements is operatively coupled to the conductive path of the portion to achieve at least one of resistance measurement or impedance measurement of the portion. The first pair of connecting elements is operatively coupled to the portion closer to the conductive path than the second pair of connecting elements.

11. The method of claim 10, further comprising: The cover is mounted over the top side of the circuit substrate such that the cover at least covers the circuit die.

12. The method of claim 10, wherein the circuit die comprises a ball grid array, and the first pair of connection elements and the second pair of connection elements are part of the ball grid array, the method comprising: The circuit die is fabricated to contain the ball grid array.

13. The method of claim 12, wherein the ball grid array is a flip-chip ball grid array (BGA).

14. The method of claim 12, wherein the ball grid array is a wire-jointed ball grid array (BGA).

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