Optoelectronic module based on a glass-based waveguide substrate

Abstract

The application discloses an optoelectronic module based on a glass-based waveguide substrate, which comprises a glass-based waveguide substrate, an organic medium layer arranged outside the upper surface of the glass-based waveguide substrate and an optoelectronic chip; a glass waveguide is arranged in the upper surface of the glass-based waveguide substrate, the first end of the glass waveguide is provided with a bevel with a preset angle, and the bevel with the preset angle is used for reflecting light incident from the second end of the glass waveguide in a direction away from the upper surface of the glass-based waveguide substrate; the organic medium layer is provided with a light through hole and a conductive circuit, one end of the light through hole is connected to the first end, so that the light reflected by the bevel with the preset angle passes through the light through hole to the other end of the light through hole; the optoelectronic chip comprises an optical connection port and an electrical connection port, the electrical connection port is connected to the conductive circuit when the optoelectronic chip is installed, and the optical connection port is connected to the other end of the light through hole; so that the optical path loss is effectively reduced, and the optical path transmission efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of component packaging technology, and in particular to an optoelectronic module based on a glass-based waveguide substrate. Background Technology

[0002] As signal rates increase, the problems of traditional pluggable optical modules become apparent. Limited by the inherent properties of copper trace interconnects, traditional electrical interconnect technologies are unable to support data transmission at higher rates and frequencies. The most prominent advantage of optical interconnects is that their losses are independent of the transmission frequency. Therefore, the bandwidth and delay of optical links are actually independent of length, fan-out / fan-in, and the overall interconnect density. Optical interconnect technology can provide lower system design complexity and lower system power consumption, and has the potential to achieve higher channel density through wavelength division multiplexing (WDM) technology.

[0003] Currently, the conventional approach for short-distance interconnection between daughter cards and backplanes is to use embedded waveguide interconnection, integrating polymer waveguides on organic substrates or glass carriers to achieve optoelectronic interconnection integration within the module. However, due to the poor matching between the refractive index of the polymer waveguide and the refractive index of the external optical fiber, there are problems such as high optical path coupling loss and low optical path transmission efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide an optoelectronic module based on a glass-based waveguide substrate to address the above-mentioned technical problems, so as to solve the problem in the prior art that the refractive index of the polymer waveguide is not well matched with the refractive index of the external optical fiber, resulting in high optical path coupling loss and low optical path transmission efficiency.

[0005] To address the aforementioned technical problems, this invention provides an optoelectronic module based on a glass-based waveguide substrate, comprising:

[0006] A glass-based waveguide substrate, an organic dielectric layer disposed on the outer surface of the upper surface of the glass-based waveguide substrate, and an optoelectronic chip;

[0007] A glass waveguide is disposed on the upper surface of the glass-based waveguide substrate. The first end of the glass waveguide has a bevel at a preset angle. The bevel at the preset angle is used to reflect light rays incident from the second end of the glass waveguide in a direction away from the upper surface of the glass-based waveguide substrate.

[0008] The organic dielectric layer is provided with a light-passing hole and a conductive line. One end of the light-passing hole is connected to the first end, so that the light reflected by the inclined surface at the preset angle can reach the other end of the light-passing hole through the light-passing hole.

[0009] The optoelectronic chip includes an optical connection port and an electrical connection port. When the optoelectronic chip is installed, the electrical connection port is connected to the conductive line, and the optical connection port is connected to the other end of the light-passing hole.

[0010] Optionally, the photoelectric module further includes:

[0011] An optical connector, one end of which is connected to the second end of the glass waveguide, and the other end of which is used to connect to an external optical path.

[0012] Optionally, a solder ball is disposed on the upper surface of the organic dielectric layer, and the solder ball is connected to the conductive line.

[0013] Optionally, the glass-based waveguide substrate is provided with electrical interconnect vias connecting both sides of the glass-based waveguide substrate, and an electrical interconnect structure connecting the conductive lines is provided in the electrical interconnect vias.

[0014] Optionally, a solder ball is disposed on the lower surface of the glass-based waveguide substrate, the solder ball being connected to one end of the electrical interconnect structure, and the other end of the electrical interconnect structure being connected to the conductive line.

[0015] Optionally, an organic waveguide is disposed within the optical aperture, and the organic waveguide is connected to the inclined surface of the glass waveguide at a preset angle.

[0016] Optionally, the inclination angle of the inclined surface is 45°, and the organic waveguide is perpendicular to the glass-based waveguide substrate.

[0017] Optionally, the glass waveguide is located inside the glass-based waveguide substrate, and the upper surface of the glass waveguide is in the same plane as the upper surface of the glass-based waveguide substrate.

[0018] Optionally, the thickness of the glass-based waveguide substrate is 0.05-2 mm.

[0019] Optionally, the thickness of the organic dielectric layer is 0.015-1 mm.

[0020] The above solution has the following beneficial effects:

[0021] The optoelectronic module based on a glass-based waveguide substrate of the present invention has a glass waveguide with a preset angled bevel at one end disposed inside the glass-based waveguide substrate. The beveled bevel reflects light incident from the other end through a light-passing hole to the optoelectronic chip, realizing the optical signal transmission of the optoelectronic chip. The connection between the optoelectronic chip and the conductive circuit realizes the transmission of electrical signals. Due to the good matching degree between the glass waveguide in the glass-based waveguide substrate and the external light, the optical path loss can be effectively reduced and the optical path transmission efficiency can be improved. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the first optoelectronic module structure based on a glass-based waveguide substrate provided in one embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of a second optoelectronic module structure based on a glass-based waveguide substrate provided in one embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of a third type of optoelectronic module structure based on a glass-based waveguide substrate provided in one embodiment of the present invention;

[0026] The symbols are explained as follows:

[0027] 100 Glass-based waveguide substrate; 101 Electrical interconnect via; 102 Electrical interconnect structure; 200 Organic dielectric layer; 201 Conductive circuit; 301 Glass waveguide; 302 Optical via; 303 Organic waveguide; 310 Bevel; 400 Optical connector; 500 Solder ball; 600 Optoelectronic chip; 700 Main control chip. Detailed Implementation

[0028] To make the technical problems solved by the present invention, the technical solutions and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0029] It should be understood that the embodiments described below represent essential information to enable those skilled in the art to implement the embodiments and to illustrate the best mode of implementation. Upon reading the following description in conjunction with the accompanying drawings, those skilled in the art will understand the concepts of this disclosure and recognize the applications of these concepts not specifically mentioned herein. It should be understood that these concepts and applications fall within the scope of this disclosure and the appended claims.

[0030] It should also be understood that although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0031] It should also be understood that when a component is referred to as "connected" or "coupled" to another component, it can be directly connected or coupled to the other component, or there may be intermediate components. Conversely, when an element is referred to as "directly connected" or "directly coupled" to another element, there are no intermediate components.

[0032] It should also be understood that the terms “upper,” “lower,” “left,” “right,” “front,” “back,” “bottom,” “middle,” “center,” “top,” etc., may be used herein to describe various elements, indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are used only for the convenience of describing the invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, these elements should not be limited by these terms.

[0033] These terms are used only to distinguish one element from another. For example, a first element may be referred to as the “upper” element, and similarly, a second element may be referred to as the “upper” element depending on the relative orientation of these elements, without departing from the scope of this disclosure.

[0034] To be further understood, the terms “comprising,” “including,” “including,” and / or “include” as used herein specify the presence of the said feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0035] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that the terms used herein should be interpreted as having the same meaning as they mean in the context of this specification and related art, and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0036] In one embodiment, a method such as Figure 1 The optoelectronic module shown is based on a glass-based waveguide substrate. The optoelectronic module includes a glass-based waveguide substrate 100, an organic dielectric layer 200 disposed on the outer surface of the upper surface of the glass-based waveguide substrate 100, and an optoelectronic chip 600.

[0037] The glass waveguide 301 is disposed on the upper surface of the glass waveguide substrate 100. The first end of the glass waveguide 301 has a slope 310 with a preset angle. The slope 310 with the preset angle is used to reflect light incident from the second end of the glass waveguide 310 in a direction away from the upper surface of the glass waveguide substrate 100.

[0038] In this embodiment, an optical aperture 302 and a conductive line 201 are provided in the organic dielectric layer 200. One end of the optical aperture 302 is connected to the first end of the glass waveguide 301, so that the light reflected by the inclined surface 310 at a preset angle can reach the other end of the optical aperture through the optical aperture 302. The optical aperture 302 and the conductive line 201 are arranged alternately and do not directly cross each other. The conductive line 201 is distributed around the optical aperture 302.

[0039] In this embodiment, the optoelectronic chip 600 includes an optical connection port and an electrical connection port. When the optoelectronic chip 600 is installed, the electrical connection port is connected to the conductive line 201, and the optical connection port is connected to the other end of the light-passing hole 302 so as to receive light reflected from the inclined surface 310 through the light-passing hole 302.

[0040] The optoelectronic module based on a glass-based waveguide substrate in this embodiment has a glass waveguide with a preset angled bevel at one end inside the glass-based waveguide substrate. The bevel reflects light incident from the other end through a light-passing hole to the optoelectronic chip, realizing the transmission of optical signals by the optoelectronic chip. The transmission of electrical signals is realized by connecting the optoelectronic chip with the conductive circuit. Due to the good matching degree between the glass waveguide inside the glass-based waveguide substrate and the external light, the optical path loss can be effectively reduced and the optical path transmission efficiency can be improved.

[0041] In one embodiment, a method such as Figure 2 The optoelectronic module shown is based on a glass-based waveguide substrate. The optoelectronic module includes: a glass-based waveguide substrate 100, an organic dielectric layer 200 disposed on the outer surface of the upper surface of the glass-based waveguide substrate 100, an electrical chip 600, a main control chip 700, and an optical connector 400. The organic dielectric layer 200 is directly fabricated on the glass-based waveguide substrate 100.

[0042] In this embodiment, the upper or lower surface of the glass-based waveguide substrate 100 contains one or more arrays of glass waveguides 301. The glass-based waveguide substrate 100 is made of Schott N-bk7 glass, Pyrex glass, quartz and fused silica. The thickness of the glass-based waveguide substrate is 0.05mm-2mm, preferably 0.5mm-1mm.

[0043] Glass has excellent dielectric properties, which is beneficial for realizing small-pitch, small-scale high-frequency electrical signal wiring. In addition, due to the excellent dimensional stability of glass under thermal load and the fact that its coefficient of thermal expansion matches that of silicon-based chips, using glass-based waveguide substrates to replace organic substrates can achieve higher I / O density and better thermomechanical reliability. That is, the coefficient of thermal expansion matches that of silicon, so it is easy to achieve higher alignment accuracy.

[0044] In this embodiment, the organic dielectric layer 200 has a single or multiple conductive lines 201 inside, and the thickness of the organic dielectric layer 200 is 0.015mm-1mm. As a more preferred parameter, the thickness of the organic dielectric layer is 0.1mm-0.3mm.

[0045] The organic dielectric layer 200 can be directly fabricated on the glass-based waveguide substrate 100 using processes such as addition or semi-addition. The organic dielectric layer 200 and the glass-based waveguide substrate 100 are bonded together by a non-conductive film (NCF). The NCF bonding film is fabricated using processes such as spin coating, spraying, or scraping. The aforementioned non-conductive film has good optical transmittance to improve light transmittance.

[0046] In this embodiment, a glass waveguide 301 is disposed on the upper surface of the glass-based waveguide substrate 100. The first end of the glass waveguide 301 has a bevel 310 with a preset angle. The bevel 310 with the preset angle is used to reflect light incident from the second end of the glass waveguide 310 in a direction away from the upper surface of the glass-based waveguide substrate 100. The outstanding advantage of the glass-based waveguide substrate 100 is that the glass has good transparency, which allows for high-efficiency assembly and integration between the waveguide inside the glass core material and the planar active, passive, and electro-optic components.

[0047] The glass waveguide 301 is located inside the glass-based waveguide substrate 100, and the upper surface of the glass waveguide 301 is on the same plane as the upper surface of the glass-based waveguide substrate 100. The arrangement of the glass waveguide 301 in the shallow layer of the glass-based waveguide substrate 100 can shorten the light transmission path and improve the light transmission efficiency.

[0048] The glass waveguide 301 described above can be fabricated by ion exchange, deposition, sol-gel, radio frequency sputtering, sol-gel, etc., among which ion exchange is preferred to produce glass waveguide 301 with graded refractive index.

[0049] In this embodiment, one end of the optical connector 400 is connected to the second end of the glass waveguide 301, and the other end of the optical connector 400 is an optical fiber interface that can be connected to an external optical fiber, thereby connecting to an external optical fiber through the optical connector to receive and transmit light signals; specifically, the optical connector is a mechanically connected MT connector or a modified MT optical connector with a similar structure.

[0050] In this embodiment, an optical via 302 and a conductive line 201 are provided in the organic dielectric layer 200. An organic waveguide 303 is provided in the optical via 302, and the organic waveguide 303 is connected to the inclined surface 310 of the glass waveguide 301 at a preset angle. The optical via 302 and the conductive line 201 are staggered and do not directly cross each other. The conductive line 201 is distributed around the optical via 302. The inclined angle of the inclined surface 310 is 45°, and the organic waveguide 303 is perpendicular to the glass-based waveguide substrate 100 so that the light passing through the inclined surface 310 achieves a better reflection effect.

[0051] The diameter of the aforementioned optical aperture 302 is 20μm-500μm, preferably 50μm-250μm. The optical aperture 302 is filled with an optically transparent organic dielectric layer to form an organic waveguide 303. As a preferred embodiment, the organic dielectric layer structure is a graded refractive index pillar waveguide structure. With this structure, the propagating light is no longer sawtooth-shaped, but is transformed into a continuous arc-shaped light, thereby avoiding light scattering loss caused by interface irregularities and further improving the light transmission efficiency.

[0052] A plurality of solder balls 500 are disposed on the upper surface of the organic dielectric layer 200. The solder balls 500 are connected to the conductive lines 201 inside the organic dielectric layer 200. The solder balls 500 are used for soldering to external circuit boards or lines.

[0053] In this embodiment, a photoelectric chip 600 and a main control chip 700 are flip-chip mounted on the upper surface of the organic dielectric layer 200. The photoelectric chip 600 and the main control chip 700 are assembled on the upper surface of the organic dielectric layer 200 through anisotropic conductive film. The photoelectric chip 600 and the main control chip 700 are connected through conductive lines in the organic dielectric layer 200, thereby realizing the transmission of electrical signals between the photoelectric chip 600 and the main control chip 700.

[0054] The optoelectronic chip 600 includes an optical connection port and an electrical connection port. When the optoelectronic chip 600 is installed, the electrical connection port is connected to the conductive line 201, and the optical connection port is connected to the other end of the light-passing hole 302 so as to receive light reflected from the inclined surface 310 through the light-passing hole 302.

[0055] The optoelectronic module based on a glass-based waveguide substrate in this embodiment has the following characteristics:

[0056] (1) The glass waveguide in the glass-based waveguide substrate has a good matching degree with the external light, which can effectively reduce optical path loss and improve optical path transmission efficiency. In addition, the glass-based waveguide substrate has excellent dielectric properties, which is conducive to realizing small-pitch, small-scale high-frequency electrical signal wiring.

[0057] (2) Since glass-based waveguide substrates have excellent dimensional stability under thermal load and their thermal expansion coefficient matches that of silicon-based chips, replacing organic substrates with glass-based waveguide substrates can achieve higher I / O density and better thermomechanical reliability, and can easily achieve higher alignment accuracy.

[0058] (3) The glass-based waveguide substrate has good transparency, which allows for high-efficiency assembly and integration between the waveguide inside the glass core material and the active and passive components and electro-optic components on the plane.

[0059] (4) Using glass-based waveguide substrates as carriers for copper circuit fabrication not only enables the fabrication of fine lines, but also greatly improves the interlayer alignment between optical and electrical circuit layers, thereby improving the coupling efficiency of optical system packaging.

[0060] (5) Using redistribution (RDL) technology for circuit fabrication can achieve packaging with low dielectric layer thickness. Its fan-out structure is conducive to the realization of chip flip packaging, further shortening the interconnect distance and improving the quality of high-speed signals.

[0061] In one embodiment, a method such as Figure 3 The optoelectronic module shown is based on a glass-based waveguide substrate. This optoelectronic module is related to... Figure 2 The difference in the optoelectronic module is that: the optoelectronic module has an electrical interconnection hole 101 in the glass waveguide substrate 100, and an electrical interconnection structure 102 is provided inside the electrical interconnection hole 101, wherein the electrical interconnection structure 102 is connected to the conductive lines in the organic dielectric layer 200.

[0062] A number of solder balls 500 are disposed on the lower surface of the glass-based waveguide substrate 100. The solder balls 500 are connected to the electrical interconnection structure 102 and are used for soldering to external circuit boards or lines.

[0063] In one example, a number of solder balls 500 are provided on the lower surface of the glass-based waveguide substrate 100 and the upper surface of the organic dielectric layer 200. The solder balls 500 on the upper surface of the organic dielectric layer are connected to the conductive lines inside the organic dielectric layer, and the solder balls 500 on the lower surface of the glass-based waveguide substrate 100 are connected to the electrical interconnection structure 102. The solder balls 500 are used for soldering to external circuit boards or lines.

[0064] In this embodiment, the electrical interconnect 101 is a glass via (TGV). Compared to the more complex through-silicon via (TSV), the glass via does not require any isolation and has a lower manufacturing cost.

[0065] The optoelectronic module based on a glass-based waveguide substrate in this embodiment has other structural similarities to... Figure 2 The structure of the optoelectronic module is the same as that of the other two, so it will not be described in detail here.

[0066] The optoelectronic module based on a glass-based waveguide substrate in this embodiment has the following characteristics:

[0067] (1) The glass waveguide in the glass-based waveguide substrate has a good matching degree with the external light, which can effectively reduce optical path loss and improve optical path transmission efficiency. In addition, the glass-based waveguide substrate has excellent dielectric properties, which is conducive to realizing high-frequency electrical signal wiring of small-pitch, small-scale glass through-hole (TGV) interconnection.

[0068] (2) Since glass-based waveguide substrates have excellent dimensional stability under thermal load and their thermal expansion coefficient matches that of silicon-based chips, replacing organic substrates with glass-based waveguide substrates can achieve higher I / O density and better thermomechanical reliability, and can easily achieve higher alignment accuracy.

[0069] (3) The glass-based waveguide substrate has good transparency, which allows for high-efficiency assembly and integration between the waveguide inside the glass core material and the active and passive components and electro-optic components on the plane.

[0070] (4) Using glass-based waveguide substrates as carriers for copper circuit fabrication not only enables the fabrication of fine lines, but also greatly improves the interlayer alignment between optical and electrical circuit layers, improves the coupling efficiency of optical system packaging, and the glass-based waveguide substrates are relatively inexpensive and flexible in size selection.

[0071] (5) Using redistribution (RDL) technology for circuit fabrication can achieve packaging with low dielectric layer thickness. Its fan-out structure is conducive to the realization of chip flip packaging, further shortening the interconnect distance and improving the quality of high-speed signals.

[0072] (6) Using glass as a substrate, electrical connection can be achieved through TGV, and optical connection can be achieved by fabricating waveguides on its surface, thereby realizing optoelectronic integration on the glass substrate.

[0073] (7) Using glass-based waveguide substrates as carriers for circuit fabrication is a mature process for traditional display panel manufacturers. At the same time, the TGV process is also relatively mature, so it has good feasibility and low manufacturing and processing costs.

[0074] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A photoelectric module based on a glass-based waveguide substrate, characterized in that, include: A glass-based waveguide substrate, an organic dielectric layer disposed on the outer surface of the upper surface of the glass-based waveguide substrate, and an optoelectronic chip; A glass waveguide is disposed on the upper surface of the glass-based waveguide substrate. The first end of the glass waveguide has a bevel at a preset angle. The bevel at the preset angle is used to reflect light rays incident from the second end of the glass waveguide in a direction away from the upper surface of the glass-based waveguide substrate. The organic dielectric layer is provided with a light-passing hole and a conductive line. One end of the light-passing hole is connected to the first end, so that the light reflected by the inclined surface at the preset angle reaches the other end of the light-passing hole through the light-passing hole. An organic waveguide is provided in the light-passing hole, and the organic waveguide is connected to the inclined surface at the preset angle of the glass waveguide. The optoelectronic chip includes an optical connection port and an electrical connection port. When the optoelectronic chip is installed, the electrical connection port is connected to the conductive line, and the optical connection port is connected to the other end of the light-passing hole.

2. The optoelectronic module according to claim 1, characterized in that, The optoelectronic module also includes: An optical connector, one end of which is connected to the second end of the glass waveguide, and the other end of which is used to connect to an external optical path.

3. The optoelectronic module according to claim 1, characterized in that, Solder balls are disposed on the upper surface of the organic dielectric layer, and the solder balls are connected to the conductive lines.

4. The optoelectronic module according to claim 1, characterized in that, The glass-based waveguide substrate is provided with electrical interconnect vias connecting the two sides of the glass-based waveguide substrate, and an electrical interconnect structure connecting the conductive lines is provided in the electrical interconnect vias.

5. The optoelectronic module according to claim 4, characterized in that, A solder ball is disposed on the lower surface of the glass-based waveguide substrate. The solder ball is connected to one end of the electrical interconnect structure, and the other end of the electrical interconnect structure is connected to the conductive line.

6. The optoelectronic module according to claim 1, characterized in that, The inclined angle of the slope is 45°, and the organic waveguide is perpendicular to the glass-based waveguide substrate.

7. The optoelectronic module according to claim 1, characterized in that, The glass waveguide is located inside the glass-based waveguide substrate, and the upper surface of the glass waveguide is on the same plane as the upper surface of the glass-based waveguide substrate.

8. The optoelectronic module according to claim 1, characterized in that, The thickness of the glass-based waveguide substrate is 0.05-2 mm.

9. The optoelectronic module according to claim 1, characterized in that, The thickness of the organic medium layer is 0.015-1 mm.

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