Optical module

Abstract

The present disclosure provides a kind of optical module, including lower shell, circuit board and digital signal processor, lower shell includes bottom plate and two lower side plates connected with bottom plate, circuit board is installed in lower shell, digital signal processor is electrically connected with circuit board by solder ball, solder ball is arranged in rectangular array, and solder ball includes ground solder ball and power supply solder ball;Wherein, circuit board includes the upper layer plate, at least one heat-conducting plate and lower layer plate arranged in stack, the heat-conducting layer is plated on the upper layer plate, and the heat-conducting layer is in contact with the ground gold finger on lower side plate and upper layer plate;The side of at least one heat-conducting plate is in contact with lower side plate, and the upper layer plate is connected with heat-conducting plate by the fifth heat-conducting via, and heat-conducting plate is connected with ground gold finger by the sixth heat-conducting via.The present disclosure transmits the heat of digital signal processor to the heat-conducting plate in the inner layer of circuit board, then is transmitted to the side wall of lower shell and the ground gold finger on the surface of circuit board by heat-conducting plate, increases the heat dissipation channel, to improve the heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. BACKGROUND

[0002] In cloud computing, mobile Internet, video and other new business and application modes, optical communication technology will be used. In optical communication, the optical module is a device for converting optical and electrical signals, and is one of the key devices in optical communication equipment.

[0003] The optical module includes laser, digital signal processor (DSP) and other optoelectronic devices. The optoelectronic devices generate heat when working, which causes the temperature in the optical module to rise. However, when the optoelectronic devices are in a high-temperature environment, the performance of the optoelectronic devices will be affected. Therefore, heat dissipation is necessary in the optical module. The common heat dissipation method is to contact the heat-generating optoelectronic devices with the upper shell of the optical module or with the lower shell of the optical module, so as to transfer the heat generated by the optoelectronic devices to the optical module housing for heat dissipation through the metal housing.

[0004] When the heat generated by the optoelectronic devices is transferred to the optical module housing for heat dissipation, the contact area between the optoelectronic devices and the housing is small, resulting in low heat dissipation efficiency of the optical module. SUMMARY

[0005] Embodiments of the present disclosure provide an optical module to improve the heat dissipation efficiency of the optical module.

[0006] The present disclosure provides an optical module, comprising:

[0007] A lower shell comprising a bottom plate and two lower side plates, the two lower side plates being connected to opposite sides of the bottom plate;

[0008] A circuit board installed in the lower shell, the two opposite sides of the circuit board being in contact with the two lower side plates, respectively;

[0009] A digital signal processor electrically connected to the circuit board by solder balls, the solder balls being arranged in a rectangular array, the solder balls comprising ground solder balls and power solder balls;

[0010] The circuit board comprises:

[0011] An upper layer plate having a heat-conducting layer plated on the surface, the heat-conducting layer being in contact with the lower side plate, and the ground solder balls at the edge of the digital signal processor being connected to the heat-conducting layer; one end of the upper layer plate is provided with a ground gold finger, and the heat-conducting layer is connected to the ground gold finger;

[0012] A lower layer plate stacked with the upper layer plate;

[0013] At least one heat-conducting plate is located between the upper plate and the lower plate, and the side of the heat-conducting plate is in contact with the lower side plate; a fifth heat-conducting via is arranged between the upper plate and the heat-conducting plate, and the two ends of the fifth heat-conducting via are connected with the grounding solder ball and the heat-conducting plate, respectively; a sixth heat-conducting via is arranged between the heat-conducting plate and the grounding gold finger, and the two ends of the sixth heat-conducting via are connected with the heat-conducting plate and the grounding gold finger, respectively.

[0014] As can be seen from the above embodiments, the optical module provided by the embodiments of the present disclosure includes a lower shell, a circuit board and a digital signal processor. The lower shell includes a bottom plate and two lower side plates, and the opposite sides of the two lower side plates are connected with the bottom plate. The circuit board is installed in the lower shell, and the opposite sides of the circuit board are in contact with the two lower side plates, respectively, so as to transfer the heat of the circuit board to the lower shell. The digital signal processor is electrically connected with the circuit board through solder balls, and the solder balls include grounding solder balls and power supply solder balls. The solder balls are arranged in a rectangular array, so that the digital signal processor performs electrical signal transmission with the circuit board through the solder balls. The circuit board includes an upper plate, a lower plate and at least one heat-conducting plate. The upper plate, the at least one heat-conducting plate and the lower plate are arranged in layers. A heat-conducting layer is plated on the upper plate, and the heat-conducting layer is in contact with the lower side plate. The grounding solder ball at the edge of the digital signal processor is connected with the heat-conducting layer, and the heat-conducting layer is connected with the grounding gold finger on the upper plate. In this way, the heat generated by the digital signal processor is transferred to the heat-conducting layer on the upper plate, and then transferred to the lower shell and the grounding gold finger through the heat-conducting layer, so as to dissipate heat of the digital signal processor. The fifth heat-conducting via is arranged between the upper plate and the heat-conducting plate, and the two ends of the fifth heat-conducting via are connected with the grounding solder ball and the heat-conducting plate, respectively. The heat-conducting plate is in contact with the lower side plate, so as to transfer the heat of the digital signal processor to the heat-conducting plate in the inner layer of the circuit board through the fifth heat-conducting via, and then conduct the heat to the lower shell through the heat-conducting plate. Meanwhile, the sixth heat-conducting via is arranged between the heat-conducting plate and the grounding gold finger, and the two ends of the sixth heat-conducting via are connected with the heat-conducting plate and the grounding gold finger, respectively, so as to transfer the heat of the heat-conducting plate to the grounding gold finger on the surface of the circuit board. The optical module provided by the present disclosure transfers the heat of the digital signal processor with the largest power consumption to the side wall of the lower shell and the grounding gold finger on the surface of the circuit board through the heat-conducting layer on the surface layer of the circuit board, transfers the heat to the heat-conducting plate in the circuit board through the heat-conducting via on the circuit board, and then transfers the heat to the side wall of the lower shell and the grounding gold finger on the surface of the circuit board through the heat-conducting plate. This can increase the heat dissipation channel, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0015] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, etc. involved in the embodiments of the present disclosure.

[0016] Figure 1 A connection relationship diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0017] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0018] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0019] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0020] Figure 5 A schematic diagram of the assembly of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure;

[0021] Figure 6 A schematic diagram of a local structure of a circuit board in an optical module according to some embodiments of the present disclosure Figure 1 ;

[0022] Figure 7 A schematic diagram of a local structure of a circuit board in an optical module according to some embodiments of the present disclosure Figure 2 ;

[0023] Figure 8 A partial assembly cross-sectional view of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure Figure 1 ;

[0024] Figure 9 A partial assembly cross-sectional view of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure Figure 2 ;

[0025] Figure 10 A partial assembly diagram of a circuit board, a digital signal processor, and a lower housing in an optical module according to some embodiments of the present disclosure;

[0026] Figure 11An assembly sectional view of a circuit board, a digital signal processor and a lower shell in an optical module according to some embodiments of the present disclosure;

[0027] Figure 12 A partial assembly sectional view of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure Figure 3 ;

[0028] Figure 13 A partial assembly sectional view of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure Figure 4 ;

[0029] Figure 14 A partial assembly sectional view of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure Figure 5 ;

[0030] Figure 15 An assembly schematic view of an optical module and a switch cage according to some embodiments of the present disclosure;

[0031] Figure 16 An assembly schematic view of a circuit board and an electrical connector in an optical module according to some embodiments of the present disclosure;

[0032] Figure 17 An assembly sectional view of a circuit board and an electrical connector in an optical module according to some embodiments of the present disclosure;

[0033] Figure 18 An assembly sectional view of a circuit board and an electrical connector in an optical module according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present disclosure will be described clearly and detailedly below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0035] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light, uses the propagation of light to realize information transmission, and the light loaded with information is optical signal. Optical signal propagates in information transmission devices, which can reduce the loss of optical power and realize high-speed, long-distance and low-cost information transmission. The information that information processing devices can process exists in the form of electrical signal. Optical network terminal / gateway, router, switch, mobile phone, computer, server, tablet computer and television are common information processing devices, and optical fiber and optical waveguide are common information transmission devices.

[0036] The optical signal and the electrical signal between the information processing device and the information transmission device are converted by the optical module. For example, the optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and the optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into the first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into the second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since the information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and all types of information processing devices do not need to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0037] Figure 1 A local architecture diagram of an optical communication system is provided according to some embodiments of the present disclosure. As shown in Figure 1 The local architecture of the optical communication system is shown in FIG. 1, which includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0038] One end of the optical fiber 101 extends to the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the remote information processing device 1000 is transmitted into the optical module 200, or the optical signal from the optical module 200 is propagated to the remote information processing device 1000, thereby realizing long-distance and low-power loss information transmission.

[0039] The number of optical fibers 101 can be one or more (two or more). The optical fiber 101 and the optical module 200 are connected in a plug-in manner, or they can be fixedly connected.

[0040] The host computer 100 has an optical module interface 102 configured to connect to the optical module 200, so that the host computer 100 and the optical module 200 establish a one-way / two-way electrical signal connection; the host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor and control the working state of the optical module 200.

[0041] The host computer 100 has external electrical interfaces, such as a Universal Serial Bus (USB) interface, a network interface 104, which can access an electrical signal network. For example, the network interface 104 is configured to access a network cable 103, so that the host computer 100 establishes a one-way / two-way electrical signal connection with the network cable 103.

[0042] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Terminal (ONT), and data center server are common host computers.

[0043] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

[0044] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal to the optical fiber 101. The second optical signal propagates in the optical fiber 101 towards the remote information processing device 1000.

[0045] For example, the first optical signal from the remote information processing device 1000 propagates through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal. The host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0046] The optical module is a tool for converting optical signals and electrical signals. In the conversion process of the optical signals and the electrical signals, the information does not change, and the encoding and decoding method of the information can change.

[0047] Figure 2 A partial structure diagram of a host computer according to some embodiments of the present disclosure is provided. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure related to the optical module 200 and the host computer 100 is shown. For example, Figure 2As shown, the host computer 100 further comprises a PCB circuit board 105 arranged in the housing, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure to increase the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0048] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0049] Figure 3 A structural diagram of an optical module according to some embodiments of the present disclosure is provided, Figure 4 An exploded view of an optical module according to some embodiments of the present disclosure is provided. As Figure 3 and Figure 4 As shown, the optical module 200 comprises a housing, a circuit board 300 arranged in the housing, and optoelectronic devices, light emitting components, and light receiving components arranged on the circuit board 300. However, the present disclosure is not limited thereto, and in some embodiments, the optical module 200 comprises one of the light emitting components and the light receiving components.

[0050] The housing comprises an upper housing 201 and a lower housing 202. The upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings 204 and 205. The outer contour of the housing generally presents a square body.

[0051] In some embodiments, the lower housing 202 comprises a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021. The upper housing 201 comprises a cover plate 2011, and the cover plate 2011 is covered on the two lower side plates 2022 of the lower housing 202 to form the above-mentioned housing.

[0052] In some embodiments, the lower housing 202 comprises a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021. The upper housing 201 comprises a cover plate 2011 and two upper side plates 2012 arranged perpendicularly to the cover plate 2011 on both sides of the cover plate 2011. The two upper side plates 2012 and the two lower side plates 2022 are combined to realize that the upper housing 201 is covered on the lower housing 202.

[0053] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical interface, from which gold fingers 301 of circuit board 300 extend and are inserted into an electrical connector of a host computer. Opening 205 is an optical port, configured to receive optical fiber 101, thereby connecting optical fiber 101 to the optical emitting component and / or optical receiving component in optical module 200.

[0054] The combined assembly of upper and lower housings 201 and 202 facilitates installation of components such as the circuit board 300, optoelectronic devices, light-emitting components, and / or light-receiving components within the housing. These components are encapsulated and protected by the upper and lower housings 201 and 202. Furthermore, during assembly of components such as the circuit board 300, optoelectronic devices, light-emitting components, and / or light-receiving components, positioning components, heat dissipation components, and electromagnetic shielding components are easily positioned, facilitating automated production.

[0055] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0056] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0057] For example, the unlocking member 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes engaging components that mate with the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the engaging components of the unlocking member 600 secure the optical module 200 within the cage 106. When the unlocking member 600 is pulled, the engaging components of the unlocking member 600 move accordingly, thereby changing the connection between the engaging components and the host computer, thereby releasing the fixed engagement between the optical module 200 and the host computer, allowing the optical module 200 to be removed from the cage 106.

[0058] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected together according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0059] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0060] The circuit board 300 further includes a gold finger 301 formed on its end surface. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (for example, Figure 4 The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0061] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0062] Figure 5 FIG1 is a schematic diagram of an assembly of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure. Figure 5 As shown, the DSP chip 302 on the circuit board 300 is electrically connected to the circuit board 300, and the DSP chip 302 is electrically connected to the gold finger 301 on the circuit board 300 through the signal trace to transmit the electrical signal received by the gold finger 301 to the DSP chip 302, and the DSP chip 302 then transmits the electrical signal to the optical emitting component of the optical module 200 through the signal trace to realize light emission.

[0063] After the light receiving component of the optical module converts the external optical signal into an electrical signal, the electrical signal is processed by the DSP chip 302 and transmitted to the gold finger 301, and then transmitted to the host computer 100 through the gold finger 301 to realize light reception.

[0064] In some embodiments, the DSP 302 is electrically connected to the gold finger 301 on the circuit board 300 through a power line to supply power to the DSP chip 302 .

[0065] In some embodiments, the voltage provided by the gold finger 301 is generally 3.3V. If the power supply voltage required by the DSP chip 302 is less than 3.3V, a power chip is set on the circuit board 300. One end of the power chip is electrically connected to the gold finger 301 through a power line, and the other end of the power chip is electrically connected to the DSP chip 302 through a power line. The voltage provided by the gold finger 301 is processed by the power chip, and the processed voltage is then transmitted to the DSP chip 302.

[0066] Since the DSP chip 302 receives the electrical signal provided by the gold finger 301, and the electrical signal is processed by the DSP chip 302 and then transmitted to the optical transmitting component, and the electrical signal output by the optical receiving component is processed by the DSP chip 302 and then transmitted to the gold finger 301, the DSP chip 302 is the electrical chip with the highest power consumption in the optical module, and its operation generates a high amount of heat.

[0067] To dissipate heat from the DSP chip 302, the DSP chip 302 can contact the upper housing 201, or the DSP chip 302 can contact the lower housing 202 via the circuit board 300, thereby transferring heat generated by the DSP chip 302 to the outer shell of the optical module. However, the contact area between the DSP chip 302 and the upper housing 201 or the circuit board 300 is relatively small, resulting in low heat dissipation efficiency.

[0068] In order to solve the above problems, the present disclosure provides an optical module, which transfers the heat of the DSP chip to the side wall of the lower shell through the heat-conducting layer on the surface of the circuit board, transfers it to the heat-conducting plate on the inner layer of the circuit board through the heat-conducting vias on the circuit board, and then transfers it to the side wall of the lower shell through the heat-conducting plate, thereby increasing the heat dissipation channel and improving the heat dissipation efficiency.

[0069] Figure 6 A schematic diagram of a local structure of a circuit board in an optical module according to some embodiments of the present disclosure Figure 1 .like Figure 6 As shown, the DSP chip 302 has many interfaces for connecting to the outside, so as to connect to the circuit board 300, the light emitting component and / or the light receiving component through the interfaces. When the DSP chip 302 is connected to the circuit board 300, electrical communication is mainly achieved by mounting BGA solder balls on the circuit board 300.

[0070] In some embodiments, when the DSP chip 302 is mounted on the circuit board 300 through BGA solder balls, the electrical interface of the BGA solder balls is in the form of a rectangular array, that is, the BGA solder balls are evenly arranged on the bottom surface of the DSP chip 302, and then the BGA solder balls are pasted on the surface of the circuit board 300 to achieve electrical connection between the DSP chip 302 and the circuit board 300 through the BGA solder balls.

[0071] In some embodiments, the circuit board 300 is composed of a multi-layer board. In order to improve the heat dissipation efficiency of the DSP chip 302, a thermal conductive layer 3019 can be plated on the upper surface of the circuit board 300. The edge of the thermal conductive layer 3019 can contact the lower side plate 2022 of the lower shell 202, and the thermal conductive layer 3019 can be directly connected to the ground solder balls in the BGA solder balls. In this way, the heat of the DSP chip 302 is transferred to the thermal conductive layer 3019 through the ground solder balls, and then directly transferred to the lower side plate 2022 of the lower shell 202 via the thermal conductive layer 3019.

[0072] In some embodiments, the ground solder balls at the edge of the DSP chip 302 can directly reach the edge of the circuit board 300 through the heat conductive layer 3019 on the surface of the circuit board 300 , and transfer part of the heat of the DSP chip 302 directly to the lower housing 202 .

[0073] Figure 7 A schematic diagram of a local structure of a circuit board in an optical module according to some embodiments of the present disclosure Figure 2 .like Figure 7 As shown, since the ground solder balls at the edge of the DSP chip 302 are connected to the thermal conductive layer 3019 on the surface of the circuit board 300, part of the heat of the DSP chip 302 is directly transferred to the lower housing 202. Therefore, the ground solder balls on the inside of the DSP chip can be connected to the ground solder balls at the edge of the DSP chip 302 to increase the heat dissipation channel from the DSP chip 302 to the thermal conductive layer 3019.

[0074] In some embodiments, a thermally conductive connection block 312 is provided on the upper surface of the circuit board 300. The thermally conductive connection block 312 can directly extend from the ground solder ball at the edge of the DSP chip 302 to the ground solder ball inside the DSP chip 302. The heat transferred from the ground solder ball inside the DSP chip 302 is transferred to the ground solder ball at the edge of the DSP chip 302 through the thermally conductive connection block 312, and then the heat is transferred to the thermal conductive layer 3019 on the surface of the circuit board 300 through the ground solder ball at the edge of the DSP chip 302, so that the heat is transferred to the lower shell 202 through the thermally conductive layer 3019.

[0075] In some embodiments, the heat-conducting connecting block 312 can connect the ground solder balls near the edge of the DSP chip 302 with the ground solder balls at the edge of the DSP chip 302, and since the BGA solder balls of the DSP chip 302 also include signal solder balls and power solder balls, if the heat-conducting connecting block 312 is connected with the signal solder balls and the power solder balls, it can affect the electrical signal transmission of the DSP chip 302, so the heat-conducting connecting block 312 cannot extend to the entire solder ball area of the DSP chip 302.

[0076] In order to improve the heat dissipation efficiency of the DSP chip 302, a via hole can be punched on the circuit board 300, and the heat of the DSP chip 302 is transmitted to the inner layer of the circuit board 300 through the via hole, and the heat is transmitted to the lower side plate 2022 of the lower shell 202 through the inner layer of the circuit board 300.

[0077] Figure 8 A partial assembly cross-section of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure Figure 1 As shown in Figure 8 , the circuit board 300 includes an upper layer plate 303, a lower layer plate 306, and a heat-conducting plate, the upper layer plate 303, the heat-conducting plate, and the lower layer plate 306 are stacked, the heat-conducting layer 3019 is plated on the upper layer plate 303, and the side surface of the heat-conducting plate is in contact with the lower side plate 2022 of the lower shell 202.

[0078] A heat-conducting via hole can be arranged between the upper layer plate 303 and the heat-conducting plate, and the two ends of the heat-conducting via hole are respectively connected with the ground solder balls of the DSP chip 302 and the heat-conducting plate in the inner layer of the circuit board 300, so that the heat of the DSP chip 302 can be transmitted to the heat-conducting plate in the inner layer of the circuit board 300 through the heat-conducting via hole, and the heat is transmitted to the lower side plate 2022 of the lower shell 202 through the heat-conducting plate.

[0079] In some embodiments, in order to transmit the heat of the DSP chip 302 through the heat-conducting plate in the inner layer of the circuit board 300, the number of heat-conducting plates inside the circuit board 300 is greater than or equal to 1, and the area size of at least one heat-conducting plate is greater than the area size of the DSP chip 302, so as to improve the heat dissipation efficiency of the heat-conducting plate.

[0080] In some embodiments, the circuit board 300 includes a first heat-conducting plate 304 and a second heat-conducting plate 305, the first heat-conducting plate 304 is located between the upper layer plate 303 and the lower layer plate 306, and the second heat-conducting plate 305 is located between the first heat-conducting plate 304 and the lower layer plate 306, so that the upper layer plate 303, the first heat-conducting plate 304, the second heat-conducting plate 305, and the lower layer plate 306 are stacked.

[0081] The opposite side of the first heat-conducting plate 304 can be in contact with the lower side plate 2022 of the lower shell 202, and the opposite side of the second heat-conducting plate 305 can not be in contact with the lower side plate 2022 of the lower shell 202, so as to transfer heat to the lower shell 202 through the first heat-conducting plate 304; or the opposite side of the first heat-conducting plate 304 can not be in contact with the lower side plate 2022 of the lower shell 202, and the opposite side of the second heat-conducting plate 305 can be in contact with the lower side plate 2022 of the lower shell 202, so as to transfer heat to the lower shell 202 through the second heat-conducting plate 305; or the opposite sides of the first heat-conducting plate 304 and the second heat-conducting plate 305 are both in contact with the lower side plate 2022 of the lower shell 202, so as to transfer heat to the lower shell 202 through the first heat-conducting plate 304 and the second heat-conducting plate 305.

[0082] The first heat-conducting via 307 is arranged between the upper layer plate 303 and the first heat-conducting plate 304, one end of the first heat-conducting via 307 is connected with the ground solder ball of the DSP chip 302, and the other end of the first heat-conducting via 307 is connected with the first heat-conducting plate 304, so as to conduct part of heat of the DSP chip 302 to the first heat-conducting plate 304 through the first heat-conducting via 307.

[0083] When the side of the first heat-conducting plate 304 is in contact with the lower side plate 2022, the first heat-conducting plate 304 directly transfers heat to the lower shell 202. When the first heat-conducting plate 304 is not in contact with the lower side plate 2022 and the second heat-conducting plate 305 is in contact with the lower side plate 2022, the first heat-conducting plate 304 can transfer heat to the second heat-conducting plate 305 through the medium, and then the second heat-conducting plate 305 transfers heat to the lower shell 202.

[0084] In some embodiments, the second heat-conducting via 308 is arranged between the upper layer plate 303 and the second heat-conducting plate 305, one end of the second heat-conducting via 308 is connected with the ground solder ball of the DSP chip 302, and the other end of the second heat-conducting via 308 is connected with the second heat-conducting plate 305, so as to transfer part of heat of the DSP chip 302 to the second heat-conducting plate 305 through the second heat-conducting via 308.

[0085] When the side of the first heat-conducting plate 304 is in contact with the lower side plate 2022 and the side of the second heat-conducting plate 305 is not in contact with the lower side plate 2022, the second heat-conducting plate 305 transfers heat to the first heat-conducting plate 304 through the medium, and then the first heat-conducting plate 304 transfers heat to the lower shell 202. When the side of the second heat-conducting plate 305 is in contact with the lower side plate 2022, the second heat-conducting plate 305 directly transfers heat to the lower shell 202.

[0086] In some embodiments, the first heat conducting plate 304 and the second heat conducting plate 305 are thermally conductive copper plates. There may be copper planes with other properties in the circuit board 300. Except for the copper plane with specified heat dissipation properties (thermal conductive copper plate) which can be copper-plated on the edge side and connected to the lower shell 202, the copper planes with other properties do not extend to the edge side of the circuit board 300, and there is no conductivity between the copper planes with other properties and the copper plane with specified heat dissipation properties.

[0087] In some embodiments, due to the presence of different electrical signals on the DSP chip 302, when different electrical signals are transmitted on the circuit board 300, the signal routing may need to pass through different layers of the circuit board 300. Therefore, the heat conducting plate in the circuit board 300 needs to avoid vias with different properties from itself, that is, it is necessary to dig a hole in the heat conducting plate, and a via passes through the inside of the hole.

[0088] Figure 9 A partial assembly cross-sectional view of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure Figure 2 .like Figure 9 As shown, when the DSP chip 302 is connected to the heat conducting plate inside the circuit board 300 through the thermal vias, in order to transfer heat to the heat conducting plate more efficiently, a heat conducting block 311 can be embedded in the inner layer of the circuit board 300. The heat conducting block 311 is arranged between the upper plate 303 and the second heat conducting plate 305. In some embodiments, the heat conducting block 311 can be a heat conducting copper block.

[0089] Illustratively, a mounting hole is provided between the upper plate 303 and the second heat conducting plate 305, into which a heat conducting block 311 is embedded. The side surfaces of the heat conducting block 311 are in contact with the first heat conducting plate 304 and the second heat conducting plate 305. The area of ​​the heat conducting block 311 can be larger than the area of ​​the DSP chip 302, and a third heat conducting via 309 is provided between the upper plate 303 and the heat conducting block 311. One end of the third heat conducting via 309 is connected to the ground solder ball of the DSP chip 302, and the other end of the third heat conducting via 309 is connected to the heat conducting block 311. This allows heat from the DSP chip 302 to be quickly transferred to the first heat conducting plate 304 and the second heat conducting plate 305 via the heat conducting block 311, thereby improving heat dissipation efficiency.

[0090] In some embodiments, the bottom surface of the heat conductive block 311 may be in contact with the bottom surface of the second heat conductive plate 305, and the heat of the DSP chip 302 is transferred to the heat conductive block 311 through the third heat conductive via 309. The heat conductive block 311 transfers the heat to the first heat conductive plate 304 and the second heat conductive plate 305 respectively, so as to transfer the heat to the lower housing 202 through the first heat conductive plate 304 and the second heat conductive plate 305, thereby improving the heat dissipation efficiency.

[0091] In some embodiments, the bottom surface of the heat-conducting block 311 may also contact the top surface of the second heat-conducting plate 305, and a fourth heat-conducting via 310 may be provided between the bottom surface of the heat-conducting block 311 and the bottom surface of the second heat-conducting plate 305 to transfer the heat of the heat-conducting block 311 to the second heat-conducting plate 305 through the fourth heat-conducting via 310, thereby improving the heat dissipation efficiency.

[0092] In some embodiments, since the BGA solder balls of the DSP chip 302 also include solder balls with other attributes such as signal solder balls and power solder balls, and the heat conductive block 311 is only used to improve heat dissipation efficiency, therefore, when solder balls with other attributes except the ground solder balls are electrically connected through the solder balls on the circuit board 300, the vias connected to the solder balls with other attributes are not connected to the heat conductive block 311 to avoid affecting the performance of the solder balls with other attributes.

[0093] In some embodiments, when the ground solder ball of the DSP chip 302 is connected to the heat conducting plate and heat conducting block 311 on the inner layer of the circuit board 300 through the heat conducting via, the heat is transferred to the side of the circuit board 300 through the heat conducting plate. In order to transfer the heat to the lower shell 202, the side of the circuit board 300 can be directly or indirectly in contact with the lower side plate 2022 of the lower shell 202.

[0094] Figure 10 This is a partial assembly diagram of a circuit board, a digital signal processor, and a lower housing in an optical module according to some embodiments of the present disclosure. Figure 11 This is a cross-sectional view of the assembly of a circuit board, a digital signal processor, and a lower housing in an optical module according to some embodiments of the present disclosure. Figure 10 、 Figure 11 As shown, when the side of the circuit board 300 is in direct contact with the lower side plate 2022 of the lower shell 202, a metal layer can be plated on the opposite sides of the circuit board 300, and the metal layer is in direct contact with the lower side plate 2022 to improve the heat dissipation efficiency between the circuit board 300 and the lower shell 202.

[0095] In some embodiments, when a metal layer is plated on the side of the circuit board 300, in order to avoid the risk of electrostatic discharge (ESD), a gap is provided between the metal layer and the heat conducting plate inside the circuit board 300 to prevent direct contact between the metal layer and the heat conducting plate. The heat conducting plate inside the circuit board 300 transfers heat to the metal layer on the side of the circuit board 300 through heat conduction, and then transfers the heat to the lower shell 202 through the metal layer.

[0096] In some embodiments, a thermal pad 900 may be provided on opposite sides of the circuit board 300. The thermal pad 900 contacts the lower side plate 2022 of the lower shell 202, so as to achieve indirect contact between the metal layer on the side of the circuit board 300 and the lower side plate 2022 through the thermal pad 900. The thermal pad 900 is a high-performance thermal pad that only conducts heat but not electricity to prevent ESD.

[0097] In some embodiments, when the circuit board 300 contacts the lower side plate 2022 of the lower housing 202 through the thermal pad 900 , in order to improve heat dissipation efficiency, the thickness of the thermal pad 900 is 2 to 10 mm.

[0098] In some embodiments, the gold fingers 301 set at the end of the circuit board 300 include high-speed signal gold fingers, low-speed signal gold fingers, power gold fingers, ground gold fingers, etc., among which the ground gold fingers account for the largest proportion, and the power gold fingers account for the second largest proportion. The area of ​​the power gold fingers is large, and when the DSP chip 302 is connected to the power gold fingers through the power lines, the power lines can also conduct heat. Therefore, when the heat of the DSP chip 302 is transferred to the lower shell 202 through the heat conduction plate on the inner layer of the circuit board 300, the DSP chip 302 can also be cooled through the power gold fingers.

[0099] Figure 12 A partial assembly cross-sectional view of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure Figure 3 .like Figure 12 As shown, an avoidance groove is provided on the heat conducting plate of the inner layer of the circuit board 300, and a power line is provided in the avoidance groove; a via is provided between the upper board 303 and the heat conducting plate of the inner layer of the circuit board 300, one end of the via is electrically connected to the power solder ball 3022 of the DSP chip 302, and the other end of the via is electrically connected to the power line.

[0100] When the heat conducting plate in the inner layer of the circuit board 300 includes a first heat conducting plate 304 and a second heat conducting plate 305, power lines can be arranged on the first heat conducting plate 304 and the second heat conducting plate 305 respectively, and the DSP chip 302 is electrically connected to the power lines on the first heat conducting plate 304 and the second heat conducting plate 305 through different vias.

[0101] A power gold finger is provided at one end of the circuit board 300, and a via is provided between the power gold finger and the heat conducting plate on the inner layer of the circuit board 300. One end of the via is electrically connected to the power gold finger, and the other end is electrically connected to the power trace, thereby realizing the electrical connection between the power solder ball 3022 of the DSP chip 302 and the power gold finger on the circuit board 300.

[0102] The power supply soldering ball 3022 of the DSP chip 302 and the power supply gold fingers on the circuit board 300 realize the conduction of electrical signals and the transmission of heat at the same time, realizing the effect of simultaneous use of electricity and heat.

[0103] In some embodiments, a first via 319 is arranged between the upper layer plate 303 and the first heat-conducting plate 304, one end of the first via 319 being electrically connected to the power supply soldering ball 3022 of the DSP chip 302, and the other end of the first via 319 being electrically connected to the power supply wiring on the first heat-conducting plate 304; a second via 320 is arranged between the upper layer plate 303 and the second heat-conducting plate 305, one end of the second via 320 being electrically connected to the power supply soldering ball 3022 of the DSP chip 302, and the other end of the second via 320 being electrically connected to the power supply wiring on the second heat-conducting plate 305.

[0104] In order to improve the heat dissipation efficiency, the power supply gold fingers on the upper layer plate 303 of the circuit board 300 include a first row of power supply gold fingers 3015 and a second row of power supply gold fingers 3016, the second row of power supply gold fingers 3016 being located at the edge of the upper layer plate 303, and the first row of power supply gold fingers 3015 being located between the second row of power supply gold fingers 3016 and the DSP chip 302.

[0105] A third via is arranged between the first row of power supply gold fingers 3015 and the heat-conducting plate, one end of the third via being electrically connected to the first row of power supply gold fingers 3015, and the other end of the third via being electrically connected to the power supply wiring on the heat-conducting plate; a fourth via is arranged between the second row of power supply gold fingers 3016 and the heat-conducting plate, one end of the fourth via being electrically connected to the second row of power supply gold fingers 3016, and the other end of the fourth via being electrically connected to the power supply wiring on the heat-conducting plate.

[0106] When the inner layer of the circuit board 300 includes the first heat-conducting plate 304 and the second heat-conducting plate 305, the third via includes a first sub-via 321 and a second sub-via 322, the two ends of the first sub-via 321 being respectively connected to the first row of power supply gold fingers 3015 and the first heat-conducting plate 304, and the two ends of the second sub-via 322 being respectively connected to the first row of power supply gold fingers 3015 and the second heat-conducting plate 305, so as to respectively transmit the heat of the first heat-conducting plate 304 and the second heat-conducting plate 305 to the first row of power supply gold fingers 3015.

[0107] The two ends of one sub-via in the fourth via are respectively connected to the second row of power supply gold fingers 3016 and the first heat-conducting plate 304, and the two ends of another sub-via in the fourth via are respectively connected to the second row of power supply gold fingers 3016 and the second heat-conducting plate 305, so as to respectively transmit the heat of the first heat-conducting plate 304 and the second heat-conducting plate 305 to the second row of power supply gold fingers 3016.

[0108] The power supply soldering ball 3022 of the DSP chip 302 is electrically connected with the power supply trace on the heat conduction plate through the via, the power supply trace is electrically connected with the first row of power supply fingers 3015 through the third via, the power supply trace is electrically connected with the second row of power supply fingers 3016 through the fourth via, and the heat of the DSP chip 302 is transmitted to the power supply fingers on the upper layer plate 303 through the via and the power supply trace, so that the effect of simultaneous use of electricity and heat is realized.

[0109] In some embodiments, in order to improve the heat dissipation efficiency, the power supply fingers can also be arranged on the lower layer plate 306 of the circuit board 300, that is, the third row of power supply fingers 3017 and the fourth row of power supply fingers 3018 are arranged at one end of the lower layer plate 306, and the fourth row of power supply fingers 3018 is located at the end of the lower layer plate 306, and the third row of power supply fingers 3017 is located between the DSP chip 302 and the fourth row of power supply fingers 3018.

[0110] The third row of power supply fingers 3017 and the heat conduction plate in the inner layer of the circuit board 300 are provided with the fifth via, and the third row of power supply fingers 3017 is electrically connected with the power supply trace on the heat conduction plate through the fifth via; the fourth row of power supply fingers 3018 and the heat conduction plate in the inner layer of the circuit board 300 are provided with the sixth via, and the fourth row of power supply fingers 3018 is electrically connected with the power supply trace on the heat conduction plate through the sixth via, so that the power supply soldering ball 3022 on the DSP chip 302 is electrically connected with the power supply fingers on the lower layer plate 306 of the circuit board 300, heat is transmitted at the same time as the transmission of electrical signals, and the effect of simultaneous use of electricity and heat is realized.

[0111] When the heat conduction plate in the inner layer of the circuit board 300 includes the first heat conduction plate 304 and the second heat conduction plate 305, two ends of a sub-via in the fifth via are respectively connected with the third row of power supply fingers 3017 and the second heat conduction plate 305, and two ends of another sub-via in the fifth via are respectively connected with the third row of power supply fingers 3017 and the first heat conduction plate 304, so as to respectively transmit the heat of the first heat conduction plate 304 and the second heat conduction plate 305 to the third row of power supply fingers 3017.

[0112] The sixth via includes a third sub-via 323 and a fourth sub-via 324, two ends of the third sub-via 323 are respectively connected with the fourth row of power supply fingers 3018 and the second heat conduction plate 305, and two ends of the fourth sub-via 324 are respectively connected with the fourth row of power supply fingers 3018 and the first heat conduction plate 304, so as to respectively transmit the heat of the first heat conduction plate 304 and the second heat conduction plate 305 to the fourth row of power supply fingers 3018.

[0113] The power solder ball 3022 of the DSP chip 302 is electrically connected to the power trace on the heat conducting plate through a via, the power trace is electrically connected to the third row of power gold fingers 3017 through a fifth via, and the power trace is electrically connected to the fourth row of power gold fingers 3018 through a sixth via. The heat of the DSP chip 302 is transferred to the power gold fingers on the lower layer board 306 through the vias and the power trace, thereby achieving the effect of simultaneous electrical and thermal multiplexing.

[0114] In the optical module provided by the present disclosure, there are two heat dissipation path designs for the heat of the DSP chip 302. One is that the ground solder ball of the DSP chip 302 is connected to the heat conducting plate on the inner layer of the circuit board 300 through a thermal via, and the edge side of the thermal plate is in direct or indirect contact with the lower side plate of the lower shell 202, so as to transfer the heat of the DSP chip 302 to the lower shell 202 through the thermal conducting plate on the inner layer of the circuit board 300, and the solder balls of other properties of the DSP chip 302 are used for auxiliary heat dissipation; the other is that the power solder ball of the DSP chip 302 is electrically connected to the power trace on the heat conducting plate on the inner layer of the circuit board 300 through the thermal via, and the power trace is electrically connected to the power pad on the upper plate 303 and / or the lower plate 306 of the circuit board 300 through the thermal via, so that heat is transferred while the electrical signal is transmitted, thereby achieving the effect of simultaneous electrical and thermal multiplexing, and the solder balls of other properties of the DSP chip 302 are used for auxiliary heat dissipation.

[0115] The above two heat dissipation methods can both achieve heat dissipation to the side wall of the optical module in the same layer or different layers of the circuit board 300, thereby improving the heat dissipation efficiency.

[0116] In some embodiments, the grounding gold fingers account for the largest proportion of the gold fingers 301 set at the end of the circuit board 300. When the DSP chip 302 and the power gold fingers on the circuit board 300 are electrically heated and reused simultaneously, the heat conducting plate on the inner layer of the circuit board 300 can also be connected to the grounding gold fingers on the surface of the circuit board 300 to dissipate heat through the grounding gold fingers, thereby further improving the heat dissipation efficiency.

[0117] Figure 13 A partial assembly cross-sectional view of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure Figure 4 .like Figure 13 As shown, a fifth thermal via is provided between the upper board 303 and the heat conducting plate, and both ends of the fifth thermal via are respectively connected to the ground solder ball of the DSP chip 302 and the heat conducting plate on the inner layer of the circuit board 300. In this way, the heat of the DSP chip 302 can be transferred to the heat conducting plate on the inner layer of the circuit board 300 through the fifth thermal via.

[0118] The sixth heat-conducting via is arranged between the ground finger of the circuit board 300 and the heat-conducting plate, and two ends of the sixth heat-conducting via are connected with the ground finger and the heat-conducting plate respectively, so that the heat of the heat-conducting plate can be transmitted to the ground finger on the surface of the circuit board 300 through the sixth heat-conducting via.

[0119] In some embodiments, in order to transmit the heat of the DSP chip 302 through the heat-conducting plate in the inner layer of the circuit board 300, the number of the heat-conducting plates in the inner part of the circuit board 300 is greater than or equal to one, and the area size of at least one heat-conducting plate is greater than the area size of the DSP chip 302, so as to improve the heat dissipation efficiency of the heat-conducting plate.

[0120] In some embodiments, the fifth heat-conducting via on the circuit board 300 includes a first sub-heat-conducting via 313 and a second sub-heat-conducting via 314, the first sub-heat-conducting via 313 penetrates the upper layer plate 303 and the first heat-conducting plate 304, and two ends of the first sub-heat-conducting via 313 are connected with the ground solder ball 3021 of the DSP chip 302 and the first heat-conducting plate 304 respectively, so as to transmit the heat of the DSP chip 302 to the first heat-conducting plate 304 through the first sub-heat-conducting via 313.

[0121] The second sub-heat-conducting via 314 penetrates the upper layer plate 303 and the second heat-conducting plate 305, and two ends of the second sub-heat-conducting via 314 are connected with the ground solder ball of the DSP chip 302 and the second heat-conducting plate 305 respectively, so as to transmit the heat of the DSP chip 302 to the second heat-conducting plate 305 through the second sub-heat-conducting via 314.

[0122] In some embodiments, the first heat-conducting via 307 and the first sub-heat-conducting via 313 can be heat-conducting vias at the same position, and the second heat-conducting via 308 and the second sub-heat-conducting via 314 can be heat-conducting vias at the same position; or the first heat-conducting via 307 and the first sub-heat-conducting via 313 can be heat-conducting vias at different positions, and the second heat-conducting via 308 and the second sub-heat-conducting via 314 can be heat-conducting vias at different positions.

[0123] When the inner layer of the circuit board 300 includes the first heat-conducting plate 304 and the second heat-conducting plate 305, the sixth heat-conducting via between the ground finger on the upper layer plate 303 and the heat-conducting plate includes a third sub-heat-conducting via 315 and a fourth sub-heat-conducting via 316, the third sub-heat-conducting via 315 penetrates the ground finger and the first heat-conducting plate 304, and two ends of the third sub-heat-conducting via 315 are connected with the ground finger and the first heat-conducting plate 304 respectively, so as to transmit the heat of the first heat-conducting plate 304 to the ground finger through the third sub-heat-conducting via 315.

[0124] The fourth sub-heat-conducting via 316 penetrates the ground gold finger and the second heat-conducting plate 305, and the two ends of the fourth sub-heat-conducting via 316 are connected with the ground gold finger and the second heat-conducting plate 305 respectively, so as to transmit the heat of the second heat-conducting plate 305 to the ground gold finger through the fourth sub-heat-conducting via 316.

[0125] The heat of the DSP chip 302 is transmitted to the first heat-conducting plate 304 through the first sub-heat-conducting via 313, and the heat of the first heat-conducting plate 304 is transmitted to the ground gold finger through the third sub-heat-conducting via 315; the heat of the DSP chip 302 is transmitted to the second heat-conducting plate 305 through the second sub-heat-conducting via 314, and the heat of the second heat-conducting plate 305 is transmitted to the ground gold finger through the fourth sub-heat-conducting via 316. When the optical module is inserted into the cage of the switch, the ground gold finger of the optical module is connected with the electrical connector of the switch, and the ground gold finger transmits the heat to the electrical connector for heat dissipation through the electrical connector, thereby improving the heat dissipation efficiency of the optical module.

[0126] In some embodiments, in order to improve the heat dissipation efficiency, a plurality of rows of ground gold fingers can be arranged on the upper layer plate 303 to increase the heat dissipation channels in the circuit board 300.

[0127] The first row of ground gold fingers 3011 and the second row of ground gold fingers 3012 are arranged on the upper layer plate 303, the second row of ground gold fingers 3012 is located at the end of the upper layer plate 303, and the first row of ground gold fingers 3011 is located between the DSP chip 302 and the second row of ground gold fingers 3012.

[0128] The first row of ground gold fingers 3011 can be connected with the first heat-conducting plate 304 through the third sub-heat-conducting via 315, and the first row of ground gold fingers 3011 can be connected with the second heat-conducting plate 305 through the fourth sub-heat-conducting via 316, so as to realize the heat transmission of the first heat-conducting plate 304, the second heat-conducting plate 305 and the first row of ground gold fingers 3011.

[0129] In some embodiments, a seventh heat-conducting via is arranged between the second row of ground gold fingers 3012 and the first heat-conducting plate 304, one sub-heat-conducting via in the seventh heat-conducting via is connected with the second row of ground gold fingers 3012 and the first heat-conducting plate 304 respectively, and another sub-heat-conducting via in the seventh heat-conducting via is connected with the second row of ground gold fingers 3012 and the second heat-conducting plate 305 respectively. In this way, the heat transmission of the first heat-conducting plate 304, the second heat-conducting plate 305 and the second row of ground gold fingers 3012 is realized.

[0130] In some embodiments, the heat of the first heat-conducting plate 304 is transferred to the two rows of ground gold fingers on the upper layer plate 303 through one of the third sub-heat-conducting vias 315 and the seventh heat-conducting vias, and the heat of the second heat-conducting plate 305 is transferred to the two rows of ground gold fingers on the upper layer plate 303 through another of the third sub-heat-conducting vias 315 and the seventh heat-conducting vias, which improves the heat dissipation channels on the circuit board 300 and thus improves the heat dissipation efficiency.

[0131] In some embodiments, in order to further improve the heat dissipation efficiency, a plurality of rows of ground gold fingers can also be arranged on the lower layer plate 306 to increase the heat dissipation channels in the circuit board 300.

[0132] The third row of ground gold fingers 3013 and the fourth row of ground gold fingers 3014 are arranged on the lower layer plate 306, the fourth row of ground gold fingers 3014 is located at the end of the lower layer plate 306, and the third row of ground gold fingers 3013 is located between the DSP chip 302 and the fourth row of ground gold fingers 3014.

[0133] The eighth heat-conducting via is arranged between the third row of ground gold fingers 3013 and the heat-conducting plate, and the two ends of the eighth heat-conducting via are connected with the third row of ground gold fingers 3013 and the heat-conducting plate respectively; the ninth heat-conducting via is arranged between the fourth row of ground gold fingers 3014 and the heat-conducting plate, and the two ends of the ninth heat-conducting via are connected with the fourth row of ground gold fingers 3014 and the heat-conducting plate respectively.

[0134] When the first heat-conducting plate 304 and the second heat-conducting plate 305 are included in the inner layer of the circuit board 300, the two ends of one of the sub-heat-conducting vias of the eighth heat-conducting via are connected with the third row of ground gold fingers 3013 and the second heat-conducting plate 305 respectively, and the two ends of another of the sub-heat-conducting vias of the eighth heat-conducting via are connected with the third row of ground gold fingers 3013 and the first heat-conducting plate 304 respectively, so as to realize the heat transfer between the first heat-conducting plate 304, the second heat-conducting plate 305 and the third row of ground gold fingers 3013.

[0135] The ninth heat-conducting via includes a fifth sub-heat-conducting via 317 and a sixth sub-heat-conducting via 318, the two ends of the fifth sub-heat-conducting via 317 are connected with the fourth row of ground gold fingers 3014 and the second heat-conducting plate 305 respectively, and the two ends of the sixth sub-heat-conducting via 318 are connected with the fourth row of ground gold fingers 3014 and the first heat-conducting plate 304 respectively, so as to realize the heat transfer between the first heat-conducting plate 304, the second heat-conducting plate 305 and the fourth row of ground gold fingers 3014.

[0136] In some embodiments, the heat of the first heat conducting plate 304 is transferred to the grounding gold finger on the lower board 306 through another sub-heat conducting via in the eighth heat conducting via and the sixth sub-heat conducting via 318, and the heat of the second heat conducting plate 305 is transferred to the grounding gold finger on the lower board 306 through a sub-heat conducting via in the eighth heat conducting via and the fifth sub-heat conducting via 317, thereby improving the heat dissipation channel on the circuit board 300 and thereby improving the heat dissipation efficiency.

[0137] Figure 14 A partial assembly cross-sectional view of a circuit board and a digital signal processor in an optical module according to some embodiments of the present disclosure Figure 5 .like Figure 14 As shown, when a heat-conducting block 311 is embedded in the inner layer of the circuit board 300, the ground solder ball of the DSP chip 302 is connected to the heat-conducting block 311 through the third heat-conducting via 309, and the side surface of the heat-conducting block 311 is in contact with the first heat-conducting plate 304 and the second heat-conducting plate 305, so that the heat of the DSP chip 302 is quickly transferred to the first heat-conducting plate 304 and the second heat-conducting plate 305 through the heat-conducting block 311, thereby improving the heat dissipation efficiency.

[0138] The heat from the first heat conducting plate 304 is transferred to the first row of grounding fingers 3011 on the upper board 303 through the third sub-thermal via 315. The heat from the first heat conducting plate 304 is then transferred to the second row of grounding fingers 3012 on the upper board 303 through one of the seventh sub-thermal vias. The heat from the second heat conducting plate 305 is then transferred to the first row of grounding fingers 3011 on the upper board 303 through the fourth sub-thermal via 316. The heat from the second heat conducting plate 305 is then transferred to the second row of grounding fingers 3012 on the upper board 303 through another of the seventh sub-thermal vias. This achieves heat transfer between the first heat conducting plate 304, the second heat conducting plate 305, and the grounding fingers on the upper board 303.

[0139] The heat from the first heat conducting plate 304 is transferred to the third row of grounding fingers 3013 on the lower plate 306 through another sub-thermal via in the eighth thermal via. The heat from the first heat conducting plate 304 is then transferred to the fourth row of grounding fingers 3014 on the lower plate 306 through the sixth sub-thermal via 318. The heat from the second heat conducting plate 305 is then transferred to the third row of grounding fingers 3013 on the lower plate 306 through one sub-thermal via in the eighth thermal via. The heat from the second heat conducting plate 305 is then transferred to the fourth row of grounding fingers 3014 on the lower plate 306 through the fifth sub-thermal via 317. This achieves heat transfer between the first heat conducting plate 304, the second heat conducting plate 305, and the grounding fingers on the lower plate 306.

[0140] In some embodiments, when the heat of the DSP chip 302 is transferred to the ground gold fingers on the surface of the circuit board 300 through the heat-conducting plate in the inner layer of the circuit board 300, the heat of the DSP chip 302 can also be assisted to dissipate through the electrical connection between the DSP chip 302 and the power gold fingers on the circuit board 300, so as to improve the heat dissipation efficiency.

[0141] The light module provided by the present disclosure has two directions of heat dissipation path of the heat of the DSP chip 302. One is that the ground soldering ball 3021 of the DSP chip 302 is connected to the heat-conducting plate in the inner layer of the circuit board 300 through the heat-conducting via, the heat-conducting plate is connected to the ground gold fingers on the surface of the circuit board 300 through the heat-conducting via, the heat of the DSP chip 302 is transferred to the ground gold fingers on the surface of the circuit board 300 through the heat-conducting plate in the inner layer of the circuit board 300, and the other soldering balls of the DSP chip 302 are used for auxiliary heat dissipation. The other is that the power soldering ball 3022 of the DSP chip 302 is electrically connected to the power traces on the heat-conducting plate in the inner layer of the circuit board 300 through the via, the power traces are electrically connected to the power gold fingers on the upper plate 303 and / or the lower plate 306 of the circuit board 300 through the via, the heat is transferred at the same time of the electrical signal transmission, the effect of electrical and thermal simultaneous reuse is realized, and the other soldering balls of the DSP chip 302 are used for auxiliary heat dissipation.

[0142] The above two heat dissipation modes can realize the transfer of heat to the ground gold fingers and / or the power gold fingers on the surface of the circuit board 300 in the same layer or different layers of the circuit board 300, so as to greatly improve the heat dissipation efficiency of the DSP chip 302.

[0143] Figure 15 The assembly schematic diagram of the light module and the switch cage according to some embodiments of the present disclosure is shown in FIG. 6. Figure 16 The assembly schematic diagram of the circuit board and the electrical connector in the light module according to some embodiments of the present disclosure is shown in FIG. 7. Figure 17 The assembly cross-sectional view of the circuit board and the electrical connector in the light module according to some embodiments of the present disclosure is shown in FIG. 8. Figure 18 The assembly cross-sectional view of the circuit board and the electrical connector in the light module according to some embodiments of the present disclosure is shown in FIG. 8. Figures 15-18 As shown in FIG. 9, the heat of the DSP chip 302 is transferred to the heat-conducting plate in the inner layer of the circuit board 300 through the heat-conducting via on the circuit board 300, the heat-conducting plate is transferred to the ground gold fingers and the power gold fingers on the surface of the circuit board 300 through the via on the circuit board 300, when the light module 200 is inserted into the cage 106 of the switch, the ground gold fingers and the power gold fingers of the light module 200 are electrically connected to the electrical connector 108 of the switch, the heat on the ground gold fingers and the power gold fingers can be transferred to the electrical connector 108, the electrical connector 108 is cooled by the heat sink in the switch, and the heat dissipation efficiency of the light module is greatly improved.

[0144] The optical module provided by the embodiments of the present disclosure directly transmits the heat of the DSP chip with the largest power consumption to the gold fingers on the surface of the circuit board through the heat-conducting layer on the surface layer of the circuit board, the ground solder balls of the DSP chip transmit the heat to the heat-conducting plate in the circuit board through the heat-conducting via holes on the circuit board, the heat on the heat-conducting plate is transmitted to the ground gold fingers on the surface of the circuit board through the heat-conducting via holes, the power supply solder balls of the DSP chip are connected to the power supply traces on the heat-conducting plate in the inner layer of the circuit board through the via holes, and the power supply traces are electrically connected to the power supply gold fingers on the circuit board through the via holes, so that the effect of simultaneous use of electricity and heat is realized. When the optical module is inserted into the switch, the gold fingers of the optical module are connected to the electrical connector of the switch, and the heat of the DSP chip is transmitted to the electrical connector through the circuit board, so that the heat dissipation efficiency of the optical module is greatly improved.

[0145] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, and not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: The lower shell comprises a bottom plate and two lower side plates, wherein the two lower side plates are connected to opposite sides of the bottom plate; A circuit board is installed in the lower housing, and two opposite side surfaces of the circuit board are respectively in contact with and connected to the two lower side plates; A digital signal processor is electrically connected to the circuit board via solder balls, wherein the solder balls are arranged in a rectangular array and include ground solder balls and power solder balls; Wherein, the circuit board includes: The upper plate has a heat-conducting layer plated on its surface, the heat-conducting layer contacts the lower plate, and the ground solder ball on the edge of the digital signal processor is connected to the heat-conducting layer; a grounding gold finger is provided at one end of the upper plate, and the heat-conducting layer is connected to the grounding gold finger; A lower plate, stacked with the upper plate; At least one heat conducting plate is located between the upper plate and the lower plate, and the side surface of the heat conducting plate is in contact with the lower plate; a fifth heat conducting via is provided between the upper plate and the heat conducting plate, and two ends of the fifth heat conducting via are respectively connected to the grounding solder ball and the heat conducting plate; a sixth heat conducting via is provided between the heat conducting plate and the grounding gold finger, and two ends of the sixth heat conducting via are respectively connected to the heat conducting plate and the grounding gold finger.

2. The optical module according to claim 1, wherein The circuit board includes a first heat conducting plate and a second heat conducting plate, the first heat conducting plate is located between the upper plate and the lower plate, the second heat conducting plate is located between the first heat conducting plate and the lower plate, and the side surfaces of the first heat conducting plate and the second heat conducting plate are respectively in contact with the lower plate; A first thermal via is provided between the upper plate and the first thermally conductive plate, and two ends of the first thermal via are respectively connected to the ground solder ball and the first thermally conductive plate; a second thermal via is provided between the upper plate and the second thermally conductive plate, and two ends of the second thermal via are respectively connected to the ground solder ball and the second thermally conductive plate.

3. The optical module according to claim 2, wherein: A heat conducting block is provided between the upper plate and the second heat conducting plate, and the area of ​​the heat conducting block is larger than the area of ​​the digital signal processor; A third thermal via is provided between the upper plate and the thermal block, and two ends of the third thermal via are respectively connected to the ground solder ball and the thermal block, and solder balls of other properties of the digital signal processor except the ground solder ball are not connected to the thermal block.

4. The optical module according to claim 1, wherein: Metal layers are plated on two opposite sides of the circuit board. The metal layers are in contact with the lower side plate, and there is a gap between the metal layers and the heat conducting plate in the circuit board.

5. The optical module according to claim 1, wherein: Thermal pads are provided on two opposite sides of the circuit board, the thermal pads are in contact with and connected to the lower side plate, and the thermal pads are non-conductive.

6. The optical module according to claim 2, wherein: The fifth thermal via includes a first sub-thermal via and a second sub-thermal via, wherein the first sub-thermal via passes through the upper plate and the first thermally conductive plate, and two ends of the first sub-thermal via are respectively connected to the ground solder ball and the first thermally conductive plate; the second sub-thermal via passes through the upper plate and the second thermally conductive plate, and two ends of the second sub-thermal via are respectively connected to the ground solder ball and the second thermally conductive plate; The sixth thermal via includes a third sub-thermal via and a fourth sub-thermal via, the third sub-thermal via passes through the grounding golden finger and the first thermal conductive plate, and two ends of the third sub-thermal via are connected to the grounding golden finger and the first thermal conductive plate respectively; The fourth sub-thermal via penetrates the grounding golden finger and the second thermal conductive plate, and two ends of the fourth sub-thermal via are respectively connected to the grounding golden finger and the second thermal conductive plate.

7. The optical module according to claim 6, wherein: A first row of grounding gold fingers and a second row of grounding gold fingers are provided on the upper layer of the circuit board, the second row of grounding gold fingers are located at an end of the upper layer, and the first row of grounding gold fingers are located between the digital signal processor and the second row of grounding gold fingers; The first row of grounding gold fingers is connected to the first heat conducting plate through the third sub-heat conducting via, and the first row of grounding gold fingers is connected to the second heat conducting plate through the fourth sub-heat conducting via; A seventh thermal via is provided between the second row of grounding gold fingers and the thermal conductive plate. Two ends of one sub-thermal via in the seventh thermal via are respectively connected to the second row of grounding gold fingers and the first thermal conductive plate, and two ends of another sub-thermal via in the seventh thermal via are respectively connected to the second row of grounding gold fingers and the second thermal conductive plate.

8. The optical module according to claim 7, wherein: A third row of power gold fingers and a fourth row of power gold fingers are provided on the lower layer of the circuit board, the third row of power gold fingers are located at the end of the lower layer, and the fourth row of power gold fingers are located between the digital signal processor and the third row of power gold fingers; A fifth via is provided between the third row of power gold fingers and the heat conducting plate, and two ends of the fifth via are electrically connected to the third row of power gold fingers and the power trace on the heat conducting plate respectively; a sixth via is provided between the fourth row of power gold fingers and the heat conducting plate, and two ends of the sixth via are electrically connected to the fourth row of power gold fingers and the power trace on the heat conducting plate respectively.

9. The optical module according to claim 1, wherein: A fourth thermal via is provided between the upper plate and the heat conducting plate, one end of the fourth thermal via is connected to the power solder ball; an avoidance groove is provided on the heat conducting plate, a power line is provided in the avoidance groove, and the power line is connected to the other end of the fourth thermal via; A power gold finger is provided at one end of the upper plate, a heat conduction via is provided between the power gold finger and the heat conduction plate, and two ends of the heat conduction via are respectively connected to the power line and the power gold finger.

10. The optical module according to claim 9, wherein: A first row of power gold fingers and a second row of power gold fingers are provided on the upper layer of the circuit board, the second row of power gold fingers are located at an end of the upper layer, and the first row of power gold fingers are located between the digital signal processor and the second row of power gold fingers; The first row of power gold fingers is electrically connected to the power trace on the heat conducting plate through a third via hole. A fourth via hole is provided between the second row of power gold fingers and the heat conducting plate. Both ends of the fourth via hole are electrically connected to the second row of power gold fingers and the power trace respectively.

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