Light-emitting panel and display device

Abstract

The present application relates to a light-emitting panel and a display device. The light-emitting panel includes: a driving substrate, including a plurality of rectangular partitions distributed in an array and connected in sequence, the endpoints of the plurality of rectangular partitions forming first nodes and second nodes alternately arranged along the row direction and the column direction respectively; and a plurality of light-emitting components, which are arranged at the plurality of first nodes of the driving substrate in a one-to-one correspondence, the light-emitting components including light-emitting elements and light-expanding structures arranged around the light-emitting elements, the light-expanding structures being used to emit light emitted by the light-emitting elements along the light-emitting direction and diffuse the light along the plurality of rectangular partitions on its circumference. The light-emitting panel can increase the brightness radiation range of a single light-emitting element, and can reduce the number of light-emitting elements used while achieving high partitioning, thereby reducing costs.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting panel and a display device. Background Art

[0002] The LCD panel itself does not emit light, so a backlight module is required to provide it with sufficient brightness and evenly distributed light so that it can display images normally. The number of partitions of the backlight module largely determines the display effect of the LCD panel. The more partitions there are, the better the dynamic dimming effect is, and the more light and dark details can be displayed. However, the current way to increase the number of partitions in the industry is generally to increase the number of light-emitting elements, and tend to use a one-zone-one-lamp method (that is, each light-emitting element independently controls the brightness). However, increasing the number of light-emitting elements greatly increases the production cost. Summary of the Invention

[0003] The present application aims to provide a light-emitting panel and a display device, which can expand the brightness radiation range of a single light-emitting element, reduce the number of light-emitting elements used while achieving high partitioning, and reduce costs.

[0004] In the first aspect, an embodiment of the present application proposes a light-emitting panel, comprising: a driving substrate, comprising a plurality of rectangular partitions distributed in an array and connected in sequence, the endpoints of the plurality of rectangular partitions forming first nodes and second nodes alternately arranged along the row direction and the column direction respectively; and a plurality of light-emitting components, which are arranged one-to-one at the plurality of first nodes of the driving substrate, the light-emitting components comprising a light-emitting element and a light-expanding structure arranged around the light-emitting element, the light-expanding structure being used to emit light emitted by the light-emitting element along the light-emitting direction and diffuse the light along the plurality of rectangular partitions on its periphery.

[0005] In one possible embodiment, the light expansion structure includes: a wall, which is arranged on the outer peripheral side of the light-emitting element; a first transparent encapsulant, which covers the light-emitting element; and a second transparent encapsulant, which covers the first transparent encapsulant and fills between the wall and the first transparent encapsulant, and the refractive index of the second transparent encapsulant is higher than the refractive index of the first transparent encapsulant.

[0006] In one possible embodiment, the first transparent encapsulation glue includes a first encapsulation part and a second encapsulation part arranged in sequence along the light emitting direction of the light emitting element, the first encapsulation part is a column covering the light emitting element, and its height is less than 1 / 2 of the height of the wall; the second encapsulation part is an arcuate body covering the first encapsulation part, and its vertex is lower than the height of the wall.

[0007] In a possible implementation, the refractive index n1 of the first transparent encapsulant is less than 1.2, and the refractive index n2 of the second transparent encapsulant is greater than 1.6.

[0008] In a possible implementation, the height of the second transparent encapsulant is flush with the height of the surrounding wall.

[0009] In a possible implementation, the second transparent encapsulant is filled with a scattering material for scattering light.

[0010] In a possible implementation, the light emitting element is a micro light emitting diode or a sub-millimeter light emitting diode.

[0011] In a possible implementation, a surface of the driving substrate along the light emitting direction is coated with a first reflective layer, and an orthographic projection of the first reflective layer on the driving substrate does not overlap with an orthographic projection of the light emitting component on the driving substrate.

[0012] In a possible implementation, the surface of the wall is coated with a second reflective layer.

[0013] In a second aspect, an embodiment of the present application further proposes a display device, comprising the light-emitting panel as described above.

[0014] According to the light-emitting panel and display device provided by the embodiment of the present application, the light-emitting panel includes: a driving substrate, including a plurality of rectangular partitions distributed in an array and connected in sequence, the endpoints of the plurality of rectangular partitions forming first nodes and second nodes alternately arranged along the row direction and the column direction respectively; and a plurality of light-emitting components, which are arranged at the plurality of first nodes of the driving substrate in a one-to-one correspondence, the light-emitting components including a light-emitting element and a light-expanding structure arranged around the light-emitting element, the light-expanding structure being used to emit the light emitted by the light-emitting element along the light-emitting direction and along the plurality of rectangular partitions around it. In this way, the brightness radiation range of a single light-emitting element can be expanded. When any of the light-emitting elements fails to light up, the dynamic dimming effect of the plurality of rectangular partitions around the faulty light-emitting element can be achieved by controlling the brightness of the plurality of normal light-emitting elements around the faulty light-emitting element. While achieving high partitioning, the number of light-emitting elements used can be reduced, greatly reducing the cost and failure rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The features, advantages, and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings. In the drawings, identical components are denoted by the same reference numerals. The drawings are not drawn to scale and are intended only to illustrate relative positions. Layer thicknesses in certain locations are exaggerated for ease of understanding, and the layer thicknesses depicted in the drawings do not necessarily represent actual layer thickness proportions.

[0016] Figure 1 A schematic diagram showing a top view of the light-emitting panel provided in the first embodiment of the present application is shown;

[0017] Figure 2 Show Figure 1 Schematic diagram of the structure and light path of the light-emitting component;

[0018] Figure 3A schematic diagram showing a top view of the light-emitting panel provided in the second embodiment of the present application is shown;

[0019] Figure 4 A schematic structural diagram of a display device provided in the third embodiment of the present application is shown.

[0020] Description of reference numerals:

[0021] 1. Luminous panel;

[0022] 10, driving substrate; AA, rectangular partition; 101, first node; 102, second node; 103, first reflective layer;

[0023] 11. Light-emitting assembly; 111. Light-emitting element; 112. Light-expanding structure; 1121. First transparent encapsulating adhesive; F1. First encapsulating portion; F2. Second encapsulating portion; 1122. Second transparent encapsulating adhesive; 1123. Enclosure; 1124. Second reflective layer;

[0024] 100, backlight module; 110, back panel; 120, optical component; 200, liquid crystal display panel. DETAILED DESCRIPTION

[0025] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are set forth in order to provide a comprehensive understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the well-known structures and techniques are not shown in order to avoid unnecessary ambiguity in the present application; and, for clarity, the sizes of regional structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0026] First embodiment

[0027] Figure 1 A schematic diagram showing a top view of the light-emitting panel provided in the first embodiment of the present application is shown; Figure 2 Show Figure 1 Schematic diagram of the structure and light path of the light-emitting component.

[0028] like Figure 1 and Figure 2 As shown, the first embodiment of the present application provides a light-emitting panel 1 , which includes a driving substrate 10 and a plurality of light-emitting components 11 .

[0029] The driving substrate 10 includes a plurality of rectangular partitions AA distributed in an array and connected in sequence. End points of the plurality of rectangular partitions AA form first nodes 101 and second nodes 102 alternately arranged along the row direction and the column direction, respectively.

[0030] Multiple light-emitting assemblies 11 are disposed one-to-one at multiple first nodes 101 of the driver substrate 10. Each light-emitting assembly 11 includes a light-emitting element 111 and a light-diffusing structure 112 disposed around the light-emitting element 111. The light-diffusing structure 112 is configured to diffuse light emitted by the light-emitting element 111 along a light-emitting direction and along multiple rectangular sections AA around the light-diffusing structure 112. Four rectangular sections AA are disposed around each light-emitting assembly 11.

[0031] Optionally, the driving substrate 10 is a rigid printed circuit board (PCB), and the light-emitting element 111 is soldered to the rigid printed circuit board. Optionally, the driving substrate 10 is a glass substrate, and the light-emitting element 111 adopts COB (Chips on Board) or COG (Chips on Glass) technology, and is adhered to the driving substrate 10 by conductive glue or non-conductive glue, and then wire bonding is performed to achieve electrical connection. No bracket, gold wire, etc. are required, and less material is used. The process can reduce one reflow soldering and avoid the risk of secondary reflow. The light-emitting element 111 can be a blue light chip with a main wavelength in the range of 440nm-470nm.

[0032] like Figure 1 As shown, the driver substrate 10 includes a plurality of rectangular partitions AA distributed in an array and connected in sequence. The endpoints of the plurality of rectangular partitions AA form first nodes 101 and second nodes 102 alternately arranged along the row and column directions, respectively. A plurality of light-emitting components 11 are disposed one-to-one at the plurality of first nodes 101 of the driver substrate 10. The light emitted by each light-emitting component 11 can radiate to the four rectangular partitions AA on its side, so that the brightness of each rectangular partition AA can be formed by the superposition of the light emitted by two diagonally distributed light-emitting components 11, thereby improving the overall brightness of the backlight module 100. Since the light-emitting components 11 are only disposed at some nodes on the driver substrate 10, and the total number of rectangular partitions AA remains unchanged, the number of light-emitting components 111 is greatly reduced compared to the technical solution in the related art where each rectangular AA is provided with a light-emitting component 111, which helps to reduce costs.

[0033] Furthermore, when any one of the light-emitting elements 111 fails and does not light up, the four rectangular partitions AA around the faulty light-emitting element 111 can be lit separately by the four normally working adjacent light-emitting elements 111 around it, and the luminous brightness of the four normally working light-emitting elements 111 can be controlled, for example, the brightness can be increased to keep it as consistent as possible with the brightness during normal operation, so as to achieve the dynamic dimming effect of the four rectangular partitions AA around the faulty device without affecting the overall luminous effect of the light-emitting panel 1, thereby greatly reducing the failure rate.

[0034] by Figure 1 Taking the faulty light-emitting element marked E with black shadow as an example, when the faulty light-emitting element E is not lit, the four rectangular subareas AA around it are dark. However, because the four light-emitting elements M1 to M4 around the faulty light-emitting element E are normally emitting light, the light emitted by each of the light-emitting elements M1 to M4 can be radiated to the four rectangular subareas AA in a one-to-one correspondence, thus avoiding the dark state. By controlling the brightness of the light-emitting elements M1 to M4, the dynamic dimming effect of the four rectangular subareas AA around the faulty light-emitting element E can be achieved, so that the brightness is as consistent as possible with that during normal operation, thereby not affecting the overall lighting effect of the light-emitting panel 1.

[0035] According to an embodiment of the present application, a light-emitting panel 1 is provided, comprising a driving substrate 10 and a plurality of light-emitting components 11. The driving substrate 10 comprises a plurality of rectangular partitions AA arranged in an array and connected in sequence, wherein the endpoints of the plurality of rectangular partitions AA form first nodes 101 and second nodes 102 alternately arranged along the row direction and the column direction, respectively. The plurality of light-emitting components 11 are arranged one-to-one at the plurality of first nodes 101 of the driving substrate 10. The light-emitting components 11 include a light-emitting element 111 and a light-expanding structure 112 arranged around the light-emitting element 111. The light-expanding structure 112 is used to diffuse the light emitted by the light-emitting element 111 along the light-emitting direction and along the plurality of rectangular partitions AA around the light-emitting element 111. Thus, the brightness radiation range of a single light-emitting element 111 can be expanded. When any light-emitting element 111 fails to illuminate, the brightness of the plurality of normal light-emitting elements 111 around the faulty light-emitting element 111 can be controlled to achieve a dynamic dimming effect for the plurality of rectangular partitions AA around the faulty light-emitting element 111. This reduces the number of light-emitting elements 111 used while achieving high zoning, significantly reducing costs and failure rates.

[0036] The specific structure of the light-emitting panel 1 provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0037] In some embodiments, the light expansion structure 112 includes a first transparent encapsulant 1121 , a second transparent encapsulant 1122 , and a surrounding wall 1123 .

[0038] The wall 1123 is arranged on the outer peripheral side of the light-emitting element 111, the first transparent encapsulant 1121 covers the light-emitting element 111, and the second transparent encapsulant 1122 covers the first transparent encapsulant 1121 and fills the space between the wall 1123 and the first transparent encapsulant 1121, wherein the refractive index of the second transparent encapsulant 1122 is higher than the refractive index of the first transparent encapsulant 1121.

[0039] Optionally, the material of the first transparent encapsulant 1121 or the second transparent encapsulant 1122 can be ultraviolet curing glue (UV glue) or thermal curing glue. Optionally, the refractive index n1 of the first transparent encapsulant 1121 is less than 1.2, and the refractive index n2 of the second transparent encapsulant 1122 is greater than 1.6. According to the principle of refraction, light will be refracted when passing through the interface of the first transparent encapsulant 1121 with a low refractive index and the second transparent encapsulant 1122 with a high refractive index, and the refracted light will diffuse outward, so that it can cover multiple rectangular partitions AA around the side of the light-emitting element 111, achieving the light-emitting effect of one light-emitting element 111 radiating multiple rectangular partitions AA.

[0040] like Figure 2 As shown, the light emitted by light-emitting element 111 can be divided into three parts: the first light L1 directly passes through the first transparent encapsulant 1121 and the second transparent encapsulant 1122 and is collimated to emit; the second light L2 passes through the interface of the first transparent encapsulant 1121 and the second transparent encapsulant 1122 with different refractive indices, is refracted and diffused outward, thereby expanding the light coverage range of light-emitting element 111; the third light L3 is reflected after passing through the wall 1123 and is concentrated directly above light-emitting element 111, further improving the luminous brightness. This can achieve the light expansion effect of a single light-emitting element 111 covering multiple rectangular partitions AA, while achieving high partitioning while reducing the number of light-emitting elements 111 used, greatly reducing costs and failure rates.

[0041] In some embodiments, the first transparent encapsulation glue 1121 includes a first encapsulation part F1 and a second encapsulation part F2 arranged in sequence along the light emitting direction of the light emitting element 111. The first encapsulation part F1 is a column covering the light emitting element 111, and its height is less than 1 / 2 of the height of the wall 1123; the second encapsulation part F2 is an arcuate body covering the first encapsulation part F1, and its vertex is lower than the height of the wall 1123.

[0042] like Figure 2As shown, the first transparent encapsulant 1121 includes a first encapsulation portion F1 and a second encapsulation portion F2, arranged sequentially along the light-emitting direction of the light-emitting element 111. The cylindrical structure of the first encapsulation portion F1 reflects light back directly above the light-emitting element 111 after passing through the wall 1123, thereby improving the brightness of the light. The height of the first encapsulation portion F1 is less than half the height of the wall 1123, which increases the height of the second encapsulation portion F2. The curved surface structure of the second encapsulation portion F2 completely covers the first transparent encapsulant 1121. When light passes through the interface between the curved surface and the second transparent encapsulant 1122, it refracts and diffuses outward, expanding the light coverage of the light-emitting element 111. The vertex of the second encapsulant F2 is lower than the height of the wall 1123. When some light passes through the interface between the curved surface and the second transparent encapsulant 1122, the refracted light is reflected and focused directly above the light-emitting element 111 upon reaching the wall 1123, further improving the brightness of the light-emitting panel 1.

[0043] In some embodiments, the height of the second transparent encapsulant 1122 is flush with the height of the surrounding wall 1123. This configuration allows the light emitted by the light-emitting element 111 to be emitted forward along the light-emitting direction while being diffused along the multiple rectangular partitions AA around the periphery, ensuring uniform visual effects and improving light utilization.

[0044] In some embodiments, the second transparent encapsulant 1122 is filled with a scattering material for scattering light, so as to further increase the light coverage of the light emitting element 111 .

[0045] In some embodiments, the light-emitting element 111 is a micro light-emitting diode (Micro-LED) or a submillimeter light-emitting diode (Mini-LED). The light energy distribution of the light-emitting element 111 is a Lambertian distribution, in which the central light has the highest energy. Micro-LED refers to an LED chip with a grain size of less than 200 microns, and Mini-LED refers to an LED chip with a grain size of about 200 to 300 microns. Mini-LED or Micro-LED can be used as a self-luminous light-emitting element display, with the advantages of low power consumption, high brightness, high resolution, high color saturation, fast response speed, long life, and high efficiency.

[0046] Optionally, the light-emitting element 111 is fabricated on the driver substrate 10 using a mass transfer method. The mass transfer method is not limited to wire bonding, flip chip bonding, a combination of photolithography and pattern transfer, etc. In addition, the term "micro-LED" or "submillimeter light-emitting diode (Mini-LED)" refers to the entire light-emitting structure formed in various steps of manufacturing the light-emitting element 111, including all layers or regions that have been formed.

[0047] In some embodiments, the surface of the driving substrate 10 along the light emitting direction is coated with a first reflective layer 103 , and the orthographic projection of the first reflective layer 103 on the driving substrate 10 does not overlap with the orthographic projection of the light emitting component 11 on the driving substrate 10 .

[0048] Optionally, the aperture of the first reflective layer 103 is larger than the outer dimensions of the light-emitting component 11. For example, if the driver substrate 10 is a PCB, its reflectivity after ink spraying is generally below 85%. To increase light utilization, a first reflective layer 103 is added to the driver substrate 10. The first reflective layer 103 is a sheet-like structure or is sprayed with a reflective material. The sprayed reflective material may be, for example, but not limited to, BaSO4, TiO2, or organic silicon ZnS, and has a reflectivity of up to 99%.

[0049] Therefore, when the light emitted from the light emitting component 11 reaches the first reflective layer 103 on one side of the driving substrate 10 , most of the light can be reflected to the side of the light emitting direction, further improving the light utilization rate.

[0050] Second embodiment

[0051] Figure 3 A schematic top view of the light emitting panel provided in the second embodiment of the present application is shown.

[0052] like Figure 3 As shown, the light-emitting panel provided in the second embodiment of the present application has a similar structure to the first embodiment, except that the surface of the wall 1123 is coated with a second reflective layer 1124. The second reflective layer 1124 can be sprayed with a reflective material, such as, but not limited to, BaSO4, TiO2, silicone, ZnS, etc., to further increase the reflectivity of the third light L3 after passing through the wall 1123, so that it is more concentrated toward directly above the light-emitting element 111, further improving the luminous brightness.

[0053] Third embodiment

[0054] Figure 4 A schematic structural diagram of a display device provided in the third embodiment of the present application is shown.

[0055] like Figure 4 As shown, the third embodiment of the present application further proposes a display device, including the light-emitting panel 1 as described above.

[0056] In one example, the display device is a liquid crystal display module, comprising a liquid crystal display panel 200 and a backlight module 100 disposed on the backlight side of the liquid crystal display panel 200. Since the liquid crystal display panel 200 itself does not emit light, the backlight module 100 is required to provide it with a light source of sufficient brightness and uniform distribution so that it can properly display images. The backlight module 100 is used to provide light to the liquid crystal display panel 200. The backlight module 100 includes a backplate 110, the light-emitting panel 1 as described above, and an optical assembly 120.

[0057] The back plate 110 can be made of a metal material, such as an aluminum plate, an aluminum alloy plate, or galvanized steel, and can be manufactured using a process such as stamping. Metal materials have good ductility and can protect the backlight module 100 from being easily broken by external forces. The back plate 110 can also be made of a plastic material, such as polyimide, polycarbonate, polyethersulfone, polyethylene terephthalate, polyethylene, etc., to reduce the weight and cost of the backlight module 100.

[0058] The light-emitting panel 1 is located on the back panel 110, and the optical component 120 is located on the side of the light-emitting panel 1 away from the back panel 110. The optical component 120 may include, for example, but not limited to, a light-diffusing plate, a prism structure located on the light-emitting side of the light-diffusing plate, etc., to further improve the overall display effect of the backlight module 100. Among them, the interior of the light-diffusing plate may be provided with bubbles or microporous structures, which have ultra-high reflectivity for incident light energy, thereby delaying the emission of light, obtaining a larger optical path, and achieving a uniform light emission effect. The backlight surface of the light-diffusing plate is provided with an orange peel-like fine structure, which is used to form a diffuse reflection surface, scattered light, and prevent light from being directly emitted from the light-emitting surface, which can improve light efficiency.

[0059] The LCD panel 200 includes an array substrate and a color filter substrate positioned opposite each other, and a liquid crystal layer disposed between the array and color filter substrates. The liquid crystal layer comprises a plurality of liquid crystal molecules, which are typically rod-shaped and can flow like a liquid while also possessing certain crystalline properties. When exposed to an electric field, the alignment of the liquid crystal molecules changes in response to the field.

[0060] Furthermore, the display device further includes an upper polarizer located on the light-emitting side of the liquid crystal display panel 200 and a lower polarizer located on the backlight side of the liquid crystal display panel 200. The lower polarizer and the upper polarizer can polarize the incident light of the liquid crystal display panel 200 to allow light vibrating in only one direction to be transmitted.

[0061] In another example, the display device is a direct display LED display, including the light-emitting panel 1 and the display screen body as described above.

[0062] It should be readily understood that “on,” “above,” and “over” in this application should be interpreted in the broadest manner, such that “on” means not only “directly on something,” but also includes “on something” with intervening features or layers therebetween, and “above” or “over” includes not only the meaning of “above” or “over,” but also includes the meaning of “above” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0063] As used herein, the term "layer" may refer to a portion of a material comprising a region having a certain thickness. A layer may extend over the entire underlying or overlying structure, or may have an extent less than that of the underlying or overlying structure. Furthermore, a layer may be a region of a continuous structure, whether homogeneous or inhomogeneous, having a thickness less than that of the continuous structure. For example, a layer may be located between the top and bottom surfaces of the continuous structure, or between any pair of transverse planes at the top and bottom surfaces. A layer may extend laterally, vertically, and / or along a tapered surface.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A light-emitting panel, characterized in that: include: A driving substrate comprising a plurality of rectangular partitions distributed in an array and connected in sequence, wherein endpoints of the plurality of rectangular partitions form first nodes and second nodes alternately arranged along a row direction and a column direction respectively; as well as a plurality of light-emitting components, arranged in a one-to-one correspondence at the plurality of first nodes of the driving substrate, the plurality of light-emitting components being arranged only at the plurality of first nodes, the light-emitting components comprising a light-emitting element and a light-expanding structure arranged around the light-emitting element, the light-emitting element being parallel to the driving substrate, the light-expanding structure being configured to emit light emitted by the light-emitting element in a light-emitting direction and diffuse light along a plurality of rectangular partitions on its circumference, each light-emitting component being provided with four rectangular partitions on its circumference, and light emitted by each light-emitting component being radiated to the four rectangular partitions on its circumference; The light expansion structure includes: a wall disposed on the outer periphery of the light emitting element; a first transparent encapsulant covering the light emitting element; and a second transparent encapsulant covering the first transparent encapsulant and filling between the wall and the first transparent encapsulant, wherein the refractive index of the second transparent encapsulant is higher than the refractive index of the first transparent encapsulant. The surface of the driving substrate along the light emitting direction is coated with a first reflective layer, and the orthographic projection of the first reflective layer on the driving substrate does not overlap with the orthographic projection of the light emitting component on the driving substrate; the surface of the wall facing the light emitting element is coated with a second reflective layer.

2. The light emitting panel according to claim 1, wherein: The first transparent encapsulation glue includes a first encapsulation part and a second encapsulation part arranged in sequence along the light emitting direction of the light emitting element. The first encapsulation part is a column covering the light emitting element, and its height is less than 1 / 2 of the height of the wall; the second encapsulation part is an arcuate body covering the first encapsulation part, and its vertex is lower than the height of the wall.

3. The light emitting panel according to claim 1, wherein: The refractive index n1 of the first transparent encapsulant is less than 1.2, and the refractive index n2 of the second transparent encapsulant is greater than 1.

6.

4. The light emitting panel according to claim 1, wherein: The height of the second transparent packaging glue is flush with the height of the surrounding wall.

5. The light emitting panel according to claim 1, wherein: The second transparent packaging glue is filled with a scattering material for scattering light.

6. The light emitting panel according to claim 1, wherein: The light emitting element is a micro light emitting diode or a sub-millimeter light emitting diode.

7. A display device, characterized in that: The light-emitting panel comprises the light-emitting panel according to any one of claims 1 to 6.

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