Apparatus for processing a substrate and method for processing a substrate

Abstract

This invention discloses an apparatus and a method for processing a substrate, specifically a method for processing a substrate in multiple chambers. The substrate processing method may include: performing liquid processing on the substrate located in the chambers via supply lines connecting the circulation lines and the multiple chambers, while liquid circulates in a circulation line; wherein the flow rate per unit time of liquid flowing downstream of a valve in the supply line is constantly maintained as a reference flow rate; and controlling either the upstream or downstream flow rate based on a distribution flow rate to maintain the reference flow rate; the upstream flow rate is the flow rate per unit time of liquid flowing upstream of the circulation line (not the supply line), the downstream flow rate is the flow rate per unit time of the liquid flowing downstream of the circulation line (not the supply line), and the distribution flow rate is the flow rate per unit time of liquid flowing upstream of the valve.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean patent applications filed on December 24, 2021, with application number 10-2021-0186773, and filed on April 20, 2022, with application number 10-2022-0048731, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to an apparatus and method for processing a substrate, and more specifically, to a substrate processing apparatus and a substrate processing method for processing a liquid substrate. Background Technology

[0004] Typically, various processes such as imaging, etching, ion implantation, and deposition are performed to manufacture semiconductor devices. Furthermore, impurities (byproducts) such as particles and organic contaminants are generated during these processes. These impurities adhere to the substrate and act as defect factors that directly affect the performance and yield of semiconductor devices. The manufacturing process of semiconductor devices must involve cleaning processes to remove these impurities.

[0005] When performing a cleaning process within a chamber, it is essential to maintain a constant flow rate of liquid supplied to the substrate located within the chamber. Excessive liquid flow can damage various films or patterns formed on the substrate. Conversely, insufficient liquid flow results in impurities adhering to the substrate not being removed. When subsequent processes are performed with impurities adhering to the substrate, the substrate cannot be smoothly processed in those subsequent steps.

[0006] Typically, a constant pressure valve is used to maintain a constant flow rate to the substrate. However, when the flow rate of the liquid flowing into the constant pressure valve increases per unit time, the pressure of the liquid transmitted to the valve increases. This increased pressure damages the valve. Damage to the valve generates particles, which are introduced into the chamber and adhere to the substrate located within it. As described above, this leads to substrate defects. Furthermore, when the flow rate of the liquid flowing into the constant pressure valve decreases per unit time, the pressure of the liquid transmitted to the valve decreases, making it difficult to supply an appropriate flow rate to the substrate located in the chamber. Additionally, as described above, impurities adhering to the substrate cannot be effectively removed, resulting in substrate defects in subsequent processes. Summary of the Invention

[0007] The purpose of this invention is to provide an apparatus and method for processing substrates, which can efficiently process substrates.

[0008] Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of supplying a constant flow rate of liquid to a substrate.

[0009] Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can maintain a constant flow rate of liquid supplied to a chamber by adjusting the flow rate of liquid per unit time in a circulation pipeline in which liquid circulates.

[0010] Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can maintain a constant flow rate of liquid supplied to each chamber even if the number of chambers supplied with liquid changes.

[0011] Other objects of the present invention are not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

[0012] An exemplary embodiment of the present invention provides a method for processing a substrate in multiple chambers. The substrate processing method may include: performing liquid processing on the substrate located in the chambers via supply lines connecting the circulation lines and the multiple chambers, while liquid is circulating in a circulation line, wherein the flow rate per unit time of liquid flowing downstream of a valve disposed in the supply line is constantly maintained as a reference flow rate; and controlling an upstream flow rate or a downstream flow rate based on a distributed flow rate to maintain the reference flow rate, wherein the distributed flow rate is the flow rate per unit time of liquid flowing upstream of the valve, the upstream flow rate is the flow rate per unit time of liquid flowing upstream of the circulation line but not the supply line, and the downstream flow rate is the flow rate per unit time of liquid flowing downstream of the circulation line but not the supply line.

[0013] According to an exemplary embodiment, the pump and the first electro-pneumatic regulator can be located upstream of the circulation line to supply liquid downstream of the circulation line using fluid pressure, and the first electro-pneumatic regulator can control the upstream flow by feeding back distribution flow data and changing the fluid pressure supplied to the pump.

[0014] According to an exemplary embodiment, the back pressure valve and the second electro-pneumatic regulator can be located downstream of the circulation line to change the opening rate according to the pressure, and the second electro-pneumatic regulator can change the pressure supplied to the back pressure valve by feedback of the distribution flow data, and the second electro-pneumatic regulator changes the opening rate according to the changing pressure to control the downstream flow.

[0015] According to an exemplary embodiment, the method may include a first state in which liquid processing is performed in at least one of a plurality of chambers and a second state in which liquid processing is performed in a relatively smaller number of chambers than in the first state, and in each of the first state and the second state, the upstream flow or the downstream flow may be controlled differently from each other.

[0016] According to an exemplary embodiment, the fluid pressure supplied to the pump in the second state can be further reduced than the fluid pressure supplied to the pump in the first state, and the upstream flow rate in the second state can be controlled to be smaller than the upstream flow rate in the first state.

[0017] According to an exemplary embodiment, in the second state, the fluid pressure supplied to the back pressure valve can be further reduced than the fluid pressure supplied to the back pressure valve in the first state to increase the opening, and the downstream flow rate in the second state can be controlled to be greater than the downstream flow rate in the first state.

[0018] According to an exemplary implementation, the upstream flow in the second state can be controlled to be smaller than the upstream flow in the first state, and the downstream flow in the second state can be controlled to be larger than the downstream flow in the first state.

[0019] According to an exemplary embodiment, the valve may be a constant pressure valve, and a flow meter located upstream of the constant pressure valve may be installed in each supply line and the flow meter is used to measure the distributed flow rate. Furthermore, the opening of the constant pressure valve may remain constant when liquid processing is performed on the substrate.

[0020] Furthermore, another exemplary embodiment of the present invention provides a method for processing a substrate. The substrate processing method may include: supplying liquid supplied from a pump to the substrate located in the chamber via a supply line connecting the circulation line and the chamber, wherein the flow rate per unit time of liquid flowing downstream of a valve disposed in the supply line is constantly maintained as a reference flow rate; and changing the downstream flow rate according to a change in the distribution flow rate to maintain the reference flow rate, the downstream flow rate being the flow rate per unit time of liquid flowing downstream of the circulation line, and the distribution flow rate being the flow rate per unit time of liquid flowing upstream of the valve.

[0021] According to an exemplary implementation, the downstream flow can change proportionally to the change in the allocated flow.

[0022] According to an exemplary embodiment, the back pressure valve and the electro-pneumatic regulator can be located downstream of the circulation line to change the opening degree according to the pressure, and the electro-pneumatic regulator can change the pressure supplied to the back pressure valve according to the change in the distributed flow rate, and can change the downstream flow rate by changing the opening degree according to the changing pressure.

[0023] According to an exemplary embodiment, when the allocated flow rate changes from a first flow rate to a second flow rate having a greater flow rate per unit time than the first flow rate, the electro-pneumatic regulator can change the pressure supplied to the back pressure valve from a first pressure to a second pressure that is less than the first pressure, thereby increasing the opening degree.

[0024] According to an exemplary implementation, when the allocated flow rate changes from a second flow rate to a first flow rate having a smaller flow rate per unit time than the second flow rate, the electro-pneumatic regulator can change the pressure supplied to the back pressure valve from a second pressure to a first pressure that is greater than the second pressure, thereby reducing the opening degree.

[0025] According to an exemplary embodiment, the flow rate can be varied based on the pump capacity or the number of chambers supplying liquid to the substrate.

[0026] According to an exemplary embodiment, the valve may be a constant pressure valve, and a flow meter located upstream of the constant pressure valve may be installed in each supply line and the flow meter is used to measure the distributed flow rate. In the case of liquid processing of the substrate, the opening of the constant pressure valve may remain constant.

[0027] Furthermore, another exemplary embodiment of the present invention provides an apparatus for processing a substrate. The substrate processing apparatus may include: a chamber in which liquid processing of a substrate is performed; a circulation line through which liquid circulates; a supply line equipped with a constant pressure valve and supplying liquid to the substrate located within the chamber; and a controller, wherein the circulation line may include a pump and a back pressure valve, the pump being located upstream of the circulation line and supplying liquid from a tank to the downstream of the circulation line using fluid pressure, the back pressure valve being located downstream of the circulation line to change its opening according to the pressure, the supply line being connectable to a position in the circulation line between the location of the pump and the location of the back pressure valve, and when fluid is supplied to the chamber via the supply line, the controller may control the upstream or downstream flow rate based on a distribution flow rate to maintain a constant flow rate per unit time of liquid flowing downstream of the constant pressure valve as a reference flow rate, the upstream flow rate being the flow rate per unit time of liquid flowing upstream of the circulation line (not the supply line), the downstream flow rate being the flow rate per unit time of liquid flowing downstream of the circulation line (not the supply line), and the distribution flow rate being the flow rate per unit time of liquid flowing upstream of the valve.

[0028] According to an exemplary embodiment, a first electro-pneumatic regulator may be further disposed upstream of the circulation pipeline to control the upstream flow based on the allocated flow data, and a second electro-pneumatic regulator may be further disposed downstream of the circulation pipeline to control the downstream flow based on the allocated flow data.

[0029] According to an exemplary embodiment, multiple chambers can be provided, and the supply lines can be independently connected to each of the circulation lines and the multiple chambers. The controller can control the first electro-pneumatic regulator to control the upstream flow by feeding back the allocated flow data and changing the fluid pressure supplied to the pump; and the controller can control the second electro-pneumatic regulator to change the pressure supplied to the back pressure valve and change the opening degree according to the changed pressure to control the downstream flow and maintain the reference flow.

[0030] According to an exemplary embodiment, in a first state in which liquid processing is performed in at least one of a plurality of chambers and in a second state in which liquid processing is performed in a relatively smaller number of chambers than in the first state, the controller may control a first electro-pneumatic regulator or a second electro-pneumatic regulator such that the upstream flow rate in the second state is controlled to be smaller than the upstream flow rate in the first state.

[0031] According to an exemplary embodiment, the controller can control a first electro-pneumatic regulator or a second electro-pneumatic regulator such that the downstream flow in the second state is controlled to be greater than the downstream flow in the first state.

[0032] According to an exemplary embodiment of the present invention, the substrate can be processed effectively.

[0033] Furthermore, according to an exemplary embodiment of the present invention, a constant flow rate of liquid can be supplied to the substrate.

[0034] Furthermore, according to an exemplary embodiment of the present invention, the flow rate of liquid supplied to the chamber can be kept constant by adjusting the flow rate of liquid per unit time in the circulation line in which the liquid circulates.

[0035] Furthermore, according to an exemplary embodiment of the present invention, even if the number of chambers supplying liquid changes, the flow rate of liquid supplied to each chamber can be maintained constant.

[0036] The effects of the present invention are not limited to those described above, and those skilled in the art will clearly understand from this specification and the accompanying drawings the effects not mentioned. Attached Figure Description

[0037] Figure 1 A diagram illustrating an exemplary embodiment of the substrate processing apparatus of the present invention is shown for illustrative purposes.

[0038] Figure 2 For illustrative purposes only Figure 1 A diagram of an exemplary embodiment of the chamber.

[0039] Figure 3 A diagram illustrating an exemplary embodiment of the liquid supply unit is shown for illustrative purposes.

[0040] Figure 4 For illustrative purposes only Figure 3 The diagram shows the state in which the liquid supply unit supplies liquid to the chamber in the first state.

[0041] Figure 5 For illustrative purposes only Figure 3 A diagram illustrating an exemplary embodiment of a liquid supply unit controlling the flow rate of liquid to the chamber in the second state.

[0042] Figure 6 and Figure 7 For illustrative purposes only Figure 3 A figure shows another exemplary embodiment of the liquid supply unit controlling the flow rate of liquid supplied to the chamber in the second state.

[0043] Figure 8 For illustrative purposes only Figure 3 A figure shows another exemplary embodiment of the liquid supply unit supplying liquid to the chamber in the first state.

[0044] Figure 9 For illustrative purposes only Figure 3 A figure shows another exemplary embodiment of the liquid supply unit supplying liquid to the chamber in the second state. Detailed Implementation

[0045] In the following description, exemplary embodiments of the invention will be described in more detail with reference to the accompanying drawings. Various modifications to the exemplary embodiments of the invention are possible, and the scope of the invention should not be construed as limited to the exemplary embodiments described below. Exemplary embodiments will be provided to those skilled in the art to provide a more complete description of the invention. Therefore, the shapes, etc., of components in the drawings are exaggerated for clearer emphasis.

[0046] Terms such as "first" and "second" are used to describe various component elements, but these component elements are not limited by these terms. These terms are only used to distinguish one component from other components. For example, without departing from the scope of the invention, a first component element may be named a second component element, and similarly, a second component element may be named a first component element.

[0047] In this exemplary embodiment, a process for liquid treating a substrate by supplying a liquid (such as a cleaning solution) onto the substrate is described as an example. However, the exemplary embodiment described below is not limited to a cleaning process, but can be applied to various processes using liquid-treated substrate W, such as etching, ashing, or developing processes.

[0048] In the following text, reference will be made to Figures 1 to 9Embodiments of the substrate processing apparatus of the present invention are described in detail.

[0049] Figure 1 A top view illustrating an embodiment of the substrate processing apparatus of the present invention is shown for illustrative purposes. (Reference) Figure 1 The substrate processing apparatus 1 includes an indexing module 10 and a processing module 20. According to an exemplary embodiment, the indexing module 10 and the processing module 20 are arranged along one direction. Hereinafter, the direction in which the indexing module 10 and the processing module 20 are arranged will be referred to as a first direction 2. When viewed from above, the direction perpendicular to the first direction 2 will be referred to as a second direction 4, and the direction perpendicular to the plane including the first direction 2 and the second direction 4 will be referred to as a third direction 6.

[0050] The indexing module 10 transfers the substrate W from the cassette C, in which the substrate W is housed, to the processing module 20 for processing the substrate W. The indexing module 10 houses the substrate W already processed in the processing module 20 within the cassette C. Furthermore, the indexing module 10 houses the substrate W to be processed in the processing module 20 within the cassette C. The indexing module 10 may have a longitudinal direction parallel to the second direction 4. The indexing module 10 has a loading port 120 and an index frame 140.

[0051] A box C containing the substrate W is positioned on the loading port 120. Based on the index frame 140, the loading port 120 is located on the opposite side of the processing module 20. The index module 10 may have multiple loading ports 120. These multiple loading ports 120 may be arranged along the second direction 4. The number of loading ports 120 can be increased or decreased depending on the process efficiency and floor space requirements of the processing module 20.

[0052] Multiple slots (not shown) are provided in box C. The substrate W can sit on the slots (not shown). The multiple slots (not shown) are spaced apart from each other along a third direction 6. The substrate W can sit on the slots (not shown) and be accommodated in box C when placed horizontally on the ground.

[0053] As pod C, a sealed container such as a front-open unified pod (FOUP) can be used. Pod C can be placed on loading port 120 by a conveyor (not shown) or by an operator, such as an overhead conveyor, overhead transport vehicle, or automated guided vehicle.

[0054] Index track 142 and indexing robot 144 are located inside index frame 140. Index track 142 has a longitudinal direction parallel to the second direction 140 in index frame 140. Indexing robot 144 transports substrate W. Indexing robot 144 can transport substrate W between index module 10 and buffer chamber 220 (described below).

[0055] The indexing robot 144 includes an indexing hand 146. A base plate W sits on the indexing hand 146. The indexing hand 146 can move along a second direction 4 on an index track 142. Therefore, the indexing hand 146 can move back and forth along the index track 142. Furthermore, the indexing hand 146 can rotate in a third direction 6, which is its axis. Additionally, the indexing hand 146 can move vertically along the third direction 6. The indexing robot 144 may include multiple indexing hands 146. The multiple indexing hands 146 can be spaced apart from each other in the vertical direction. The multiple indexing hands 146 can move forward and backward independently, and rotate.

[0056] The controller 15 can control the substrate processing apparatus 1. The controller 15 may include a process controller, a user interface, and a storage unit. The process controller consists of a microprocessor (computer) that executes control of the substrate processing apparatus 1. The user interface consists of a keyboard or display, etc. The keyboard is used for operator input of commands to manage the substrate processing apparatus 1. The display, etc., is used to visualize and display the movement status of the substrate processing apparatus 1. The storage unit stores control programs for executing processes performed in the substrate processing apparatus 1 under the control of the process controller, or programs (i.e., processing schemes) for executing processes in each configuration unit according to various data and processing conditions. Furthermore, the user interface and storage unit can be connected to the process controller. The processing scheme can be stored in a storage medium in the storage unit, and the storage medium can be a hard disk, a portable hard disk (such as a CD-ROM or DVD), or a semiconductor memory (such as flash memory).

[0057] The controller 15 can control the substrate processing apparatus 1 to perform the substrate processing method described below. For example, the controller 15 can control the components included in the liquid supply unit 400 (described below) to perform the substrate processing method described below.

[0058] Process module 20 includes a buffer unit 220, a transfer frame 240, and a chamber 300. The buffer unit 220 provides a buffer space in which substrates W loaded into and unloaded from the processing module 20 temporarily reside. The transfer frame 240 provides a transfer space for transferring substrates W between the buffer unit 220 and the chamber 300.

[0059] Chamber 300 can perform liquid processing processes on the liquid-processing substrate W. For example, the liquid processing process performed in chamber 300 can be a cleaning process that cleans the substrate W by supplying a cleaning solution to the substrate W. According to an exemplary embodiment, all chemical processing, rinsing processing, and drying processing can be performed on the substrate W in chamber 300. However, unlike the above embodiment, a drying chamber (not shown), different from chamber 300, is connected to processing module 20, where chemical processing and rinsing processing are performed on the substrate W in chamber 300, and drying processing can be performed in the drying chamber (not shown).

[0060] A buffer unit 220 can be disposed between the index module 140 and the transfer frame 240. The buffer unit 220 can be located at one end of the transfer frame 240 in the longitudinal direction. A slot (not shown) for placing the substrate W is disposed inside the buffer unit 220. Multiple slots (not shown) can be disposed inside the buffer unit 220. The multiple slots (not shown) can be spaced apart from each other along a third direction 6. The buffer unit 220 has an open front and a rear. The front is the face facing the index module 140, and the rear is the face facing the transfer frame 240. The indexing robot 144 can access the buffer unit 220 through the front, and the transfer robot 244 (described below) can access the buffer unit 220 through the rear.

[0061] The conveying frame 240 may have a longitudinal direction parallel to the second direction 2. The chamber 300 may be disposed on one side of the conveying frame 240. The conveying frame 240 and the chamber 300 may be disposed along the second direction 4.

[0062] According to an embodiment, the chambers 300 can be disposed on both sides of the conveying frame 240, and the chambers 300 can be arranged in an array of A×B (A and B are natural numbers of 1 or greater than 1) along the first direction 2 and the third direction 6 on one side of the conveying frame 240. In this document, "A" represents the number of chambers 300 arranged in a row along the first direction 2, and "B" represents the number of chambers 300 arranged in a row along the third direction 6.

[0063] For example, when four or six chambers 300 are provided on one side of the transfer frame 240, the chambers 300 can be arranged in a 2×2 or 3×2 array. The number of chambers 300 can be increased or decreased. Unlike those described above, the chambers 300 can be provided only on one side of the transfer frame 240. Furthermore, the chambers 300 can be arranged in a single layer on one side surface and both sides surface of the transfer frame 240.

[0064] The transfer frame 240 includes a guide rail 242 and a transfer robot 244. The guide rail 242 and the transfer robot 244 are located inside the transfer frame 240. The guide rail 242 may have a longitudinal direction parallel to the first direction 2. The transfer robot 244 can move linearly along the first direction 2 on the guide rail 242. The transfer robot 244 transfers the substrate W between the buffer unit 220 and the chamber 300.

[0065] The transfer robot 244 includes a transfer hand 246 on which a base plate W is placed. The transfer hand 246 can move along a second direction 2 on an index track 242. Therefore, the transfer hand 246 can move forward and backward along the track 242. Furthermore, the transfer hand 246 can rotate in a third direction 6, which is its axis. Additionally, the transfer hand 246 can move vertically along the third direction 6. The transfer robot 244 may include multiple transfer hands 246. The multiple transfer hands 246 can be arranged to be spaced apart from each other in the vertical direction. The multiple transfer hands 246 can move forward and backward independently and rotate independently.

[0066] Chamber 300 can perform liquid processing processes. These processes can be cleaning processes to remove process byproducts or byproducts such as particles adhering to the substrate W. Depending on the type of process used to process the substrate W, chamber 300 can have various structures. However, individual chambers 300 can have the same structure as each other.

[0067] Figure 2 For illustrative purposes only Figure 1 A diagram illustrating the implementation scheme of the chamber. (Reference) Figure 2 The chamber 300 may include a housing 310, a processing container 320, a support unit 330, and a nozzle unit 340.

[0068] The housing 310 has an internal space. The housing 310 may have a generally rectangular parallelepiped shape. An opening (not shown) may be formed in one side wall of the housing 310. This opening (not shown) serves as an inlet through which the substrate W is loaded into or removed from the internal space of the housing 310 by the transfer robot 244. The processing container 320, the support unit 330, and the nozzle unit 340 are located within the internal space of the housing 310.

[0069] The processing container 320 has a processing space with an open upper section. The processing container 320 can be configured to handle...

[0070] The processing space is a bowl-shaped structure. It serves as the space in which the support unit 330 (described below) supports the 5 and the rotating substrate W. Furthermore, the processing space serves as the space in which the nozzle unit 340 (described below) is located.

[0071] (Line description) Liquid is supplied to substrate W to process the space of substrate W.

[0072] According to an embodiment, the processing container 320 may have a guide wall 321 and a plurality of recovery tanks 323, 325, and 327. Each recovery tank 323, 325, and 327 separates and recovers different components of the liquid used to process the substrate W.

[0073] Type of liquid. Recovery tanks 323, 325 and 327 each have a recovery space for recovering liquid used to process substrate W.

[0074] The guide wall 321 and the recovery tanks 323, 325, and 327 are arranged in an annular shape around the support unit 330. When liquid is supplied to the substrate W, the liquid splashed out by the rotation of the substrate M is introduced through the inlets 323a, 325a, and 327a (described below) of the respective recovery tanks 323, 434, and 436.

[0075] To the recycling space. Different types of liquids can be introduced into the corresponding recycling tanks 323, 325 and 3275.

[0076] The processing container 320 has a guide wall 321, a first recycling tank 323, a second recycling tank 325, and a third recycling tank 327. The guide wall 321 has an annular shape surrounding the support unit 330. The first recycling tank 323 has an annular shape surrounding the guide wall 321. The second recycling tank 325 has an annular shape surrounding the first recycling tank 323. The third recycling tank 327 has an annular shape surrounding the second recycling tank 325.

[0077] The space between the guide wall 321 and the first recovery tank 323 is used as the first inlet 323a for introducing liquid.

[0078] The space between the first recovery tank 323 and the second recovery tank 325 is used as a second inlet 325a for introducing liquid.

[0079] The space between the second recovery tank 325 and the third recovery tank 327 serves as a third inlet 327a for introducing liquid. The second inlet 325a can be located above the first inlet 323a, and the third inlet 327a can be located above the second...

[0080] Above inlet 325a. The liquid introduced into the first inlet 323a, the liquid introduced into the second inlet 325a, and the liquid introduced into the third inlet 327a can be different types of liquids.

[0081] The space between the lower end of the guide wall 321 and the first recovery tank 323 serves as a first outlet 323b, through which impurities and gaseous gases generated from the liquid are discharged. The space between the lower end of the first recovery tank 323 and the second recovery tank 325 serves as a second outlet 325b, through which impurities and gaseous gases generated from the liquid are discharged.

[0082] The space between the lower end of the second recovery tank 323 and the third recovery tank 327 is used as a third outlet 327b, through which impurities and gaseous gases generated from the liquid are discharged. Impurities and gaseous gases discharged from the first outlet 323b, the second outlet 325b and the third outlet 327b are discharged to the outside of the chamber 300 through the discharge unit 370 (described below).

[0083] Vertically downward-extending recovery lines 323c, 325c, and 327c connect to the bottom surfaces of corresponding recovery tanks 322, 325, and 327. Each recovery line 323c, 325c, and 327c discharges liquid introduced through the corresponding recovery tanks 323, 325, and 327. The discharged liquid can be recycled and reused in an external regeneration system (not shown).

[0084] The support unit 330 can support and rotate the substrate W in the processing space. The support unit 330 may include a spin chuck 331, a support pin 333, a chuck pin 335, a rotation shaft 337, and a drive unit 339.

[0085] When viewed from above, the rotary chuck 331 has a generally circular upper surface. The upper surface of the rotary chuck 331 may have a diameter larger than that of the substrate W. A plurality of support pins 333 are provided on the upper surface of the rotary chuck 331. The plurality of support pins 333 are provided on the edge portion of the upper surface of the rotary chuck 331 at constant intervals from each other. The support pins 333 support the edge region of the rear surface of the substrate W, such that the substrate W is spaced apart from the upper surface of the rotary chuck 331 by a predetermined distance.

[0086] Multiple chuck pins 335 are disposed on the upper surface of the rotary chuck 331. The chuck pins 335 are positioned further away from the center of the rotary chuck 331 than the support pins 333. When the substrate W rotates, the chuck pins 335 support the side surfaces of the substrate W so as not to deviate from their original positions in the lateral direction.

[0087] A rotating shaft 337 is connected to a rotating chuck 331. The rotating shaft 337 can be connected to the lower surface of the rotating chuck 331. The rotating shaft 337 can have a longitudinal direction horizontal to a third direction. The rotating shaft 337 can rotate by receiving power from a driver 339. The rotating shaft 337 rotates via the driver 339, and the rotating chuck 331 rotates via the rotating shaft 337. The driver 339 rotates the rotating shaft 337. The driver 339 can change the rotational speed of the rotating shaft 337. The driver 339 can be a motor for generating driving force. However, the invention is not limited thereto, and the driver 339 can be modified in various ways to generate driving force from known devices.

[0088] The nozzle unit 340 supplies liquid to the substrate W. The nozzle unit 340 supplies liquid to the substrate W supported by the support unit 3330. The liquid supplied to the substrate W by the nozzle unit can be varied. The nozzle unit 340 may include a support rod 341, an arm 342, a driver 343, and a supply nozzle 344.

[0089] The support rod 341 is located within the interior space of the housing 310. The support rod 341 may be located on one side of the processing container 320 within the interior space. The support rod 341 may have a rod shape with a longitudinal direction parallel to the third direction 6. The support rod 341 can be rotated along the third direction 6, which serves as its axis, by an actuator 343 (described below).

[0090] Arm 342 is connected to the upper end of support rod 341. Arm 342 extends perpendicular to the longitudinal direction of support rod 341. Supply nozzle 344 (described below) can be fixedly connected to the end of arm 342. Arm 342 can move forward and backward along its longitudinal direction. Arm 342 can be oscillated via support rod 341 by a drive 343 for rotating support rod 341.

[0091] A drive 343 is coupled to a support rod 341. The drive 343 is disposed on the bottom surface of the housing 310. The drive 343 generates a driving force for rotating the support rod 341. The drive 343 may be a known motor for generating the driving force.

[0092] The supply nozzle 344 supplies liquid to the substrate W supported by the support unit 330. The supply nozzle 344 supplies liquid received from the liquid supply unit 400 (described below) to the substrate W. The supply nozzle 344 can supply the same type of liquid to the substrate W. Optionally, the supply nozzle 344 can supply different types of liquid to the substrate W. The supply nozzle 344 is coupled to the arm 342 and can swing between a process position and a standby position by rotating the arm 342. The process position can be a position facing the substrate W supported by the support unit 330. According to an embodiment, the process position can be a position where the center of the supply nozzle 344 faces the center of the substrate W supported by the support unit 330. The standby position can be a position where the supply nozzle 344 does not overlap with the substrate W when viewed from above.

[0093] Unlike the exemplary embodiments described above, a plurality of supply nozzles 344 are disposed on the arm 342, and the plurality of supply nozzles 344 can supply different types of liquids to the substrate W. Optionally, each of the plurality of supply nozzles 344 may independently have an arm, a support rod, and a driver, and independently swing and move forward and backward to move between a process position and a standby position.

[0094] A lifting unit 350 is disposed within the internal space of the housing 310. The lifting unit 350 controls the relative height between the processing container 320 and the support unit 330. The lifting unit 350 linearly moves the processing container 320 in a third direction 6. As a result, since the recovery tanks 323, 325, and 327 for recovering liquid change according to the type of liquid supplied to the substrate W, the liquid can be recovered individually. In contrast, the processing container 320 is fixedly disposed, and the lifting unit 350 moves the support unit 330 up and down to change the relative height between the support unit 330 and the processing container 320.

[0095] The discharge unit 370 discharges impurities generated in the processing space. A pressure reducing unit (not shown) is provided in the discharge unit 370. The discharge unit 370 can be coupled to the bottom surface of the processing container 320. For example, the discharge unit 370 can be coupled to a point on the bottom surface of the processing container 320 between the rotating shaft 337 and the inner wall of the processing container 320.

[0096] Figure 3 A diagram illustrating an embodiment of the liquid supply unit is provided. (Reference) Figure 3 and Figure 4The liquid supply unit 400 supplies liquid to the chamber 300. The liquid supply unit 400 supplies liquid to the nozzle 344. The nozzle 344, receiving liquid from the liquid supply unit 400, supplies liquid to the substrate W supported by the support unit 330. The liquid transferred from the liquid supply unit 400 to the nozzle 344 can include various types of liquid.

[0097] According to an exemplary embodiment, the liquid supply unit 400 can deliver at least one of chemicals, rinsing fluid, and organic solvents to the supply nozzle 344. For example, chemicals may include diluted sulfuric acid (H₂SO₄), phosphoric acid (P₂O₅), hydrofluoric acid (HF), and ammonium hydroxide (NH₄OH). For example, rinsing fluids may include pure water or deionized water (DIW). For example, organic solvents may include alcohols, such as isopropyl alcohol (IPA). However, the invention is not limited thereto, and the liquid delivered from the liquid supply unit 400 to the supply nozzle 344 may include various known liquids. Hereinafter, for ease of understanding, an example will be described where the liquid supplied from the liquid supply unit 400 to the supply nozzle 344 is an organic solvent. Furthermore, hereafter, when liquid flows from one point to another, the point through which the liquid flows is defined as upstream, and the other point through which the liquid flows is defined as downstream.

[0098] The liquid supply unit 400 includes a tank 410, a circulation line 420, a pump 430, supply lines 440, 450 and 460, and a back pressure valve 470.

[0099] Tank 410 has a storage space therein. Liquid is stored in the storage space of tank 410. A level sensor (not shown) may be installed in tank 410. The level sensor (not shown) can detect the level of the liquid stored in the storage space.

[0100] Tank 410 is connected to a first discharge line 402. A pressure-reducing component (not shown) is provided in the first discharge line 402 to discharge the liquid stored in the storage space of tank 410 to the outside of the liquid supply unit 400.

[0101] Furthermore, tank 410 is connected to supply source 412. Supply source 412 supplies liquid to tank 410. A first valve 414, a first pressure gauge 416, and a first filter 418 may be installed in pipeline 411 connecting supply source 412 and tank 410. The first valve 414, the first pressure gauge 416, and the first filter 418 may be sequentially installed from upstream to downstream of pipeline 411.

[0102] The first valve 414 can be an on / off valve for opening and closing line 411. When the first valve 414 is open, liquid stored in supply source 412 flows into tank 410. The first pressure gauge 416 can measure the pressure of the liquid flowing through line 411. The flow rate of the liquid flowing through line 411 per unit time can be determined by the pressure measured by the first pressure gauge 416. The first filter 418 removes impurities that may be contained in the liquid flowing through line 411.

[0103] Although not shown, a flow meter (not shown) capable of measuring the flow rate of the liquid flowing through line 411 per unit time can be installed in line 411. Furthermore, when the liquid supplied by liquid supply unit 400 to supply nozzle 344 is an organic solvent, a nitrogen supply source (not shown) can be further connected to tank 410. The nitrogen supply source (not shown) can supply nitrogen to tank 410.

[0104] A circulation line 420 is connected to a tank 410. The circulation line 420 circulates the liquid stored in the tank 410. A pump 430 and a back pressure valve 470 are located in the circulation line 420. Furthermore, supply lines 440, 450, and 460 are connected to the circulation line 420 between the location where the pump 430 is located and the location where the back pressure valve 470 is located.

[0105] In the following text, the upstream and downstream of circulation line 420 are defined based on supply lines 440, 450, and 460 connected to circulation line 420. For example, circulation line 420 between pump 430 and supply lines 440, 450, and 460 is defined as upstream of circulation line 420, and circulation line 420 between supply lines 440, 450, and 460 and back pressure valve 470 is defined as downstream of circulation line 420. Liquid stored in tank 410 can flow back to tank 410 via pump 430, supply lines 440, 450, and 460, and back pressure valve 470.

[0106] Upstream of the circulation line 420 may be a pump 430, a second discharge line 404, a heater 433, a second pressure gauge 434, a second filter 435, a second valve 436, and a third pressure gauge 437.

[0107] Pump 430 is positioned upstream of circulation line 420. Pump 430 provides flow in circulation line 420, allowing liquid stored in the storage space of tank 410 to flow along circulation line 420. According to an exemplary embodiment, pump 430 may be a bellows pump that uses fluid pressure. The flow rate per unit time of the liquid flowing upstream of circulation line 420 can be adjusted by changing the fluid pressure supplied to pump 430.

[0108] The fluid pressure supplied to pump 430 can be changed by a first electro-pneumatic regulator 432. The first electro-pneumatic regulator 432 can change the fluid pressure supplied to pump 430 by feeding back the distributed flow rate data measured by flow meters 442, 452, and 462 (described below). For example, the first electro-pneumatic regulator 432 can change the fluid pressure supplied to pump 430 based on the distributed flow rate measured by flow meters 442, 452, and 462, by receiving a flow control signal transmitted from controller 15. The detailed mechanism is described below.

[0109] The second discharge line 404, heater 433, second pressure gauge 434, second filter 435, second valve 436 and third pressure gauge 437 can be located downstream of pump 430.

[0110] The second discharge line 404 is connected to the circulation line 420. A pressure-reducing component (not shown) is provided in the second discharge line 404 to discharge the liquid flowing in the circulation line 420 to the outside of the circulation line 420.

[0111] Heater 433 heats the liquid flowing through circulation line 420. For example, heater 433 heats the liquid flowing upstream of circulation line 420 to a temperature suitable for process requirements. Although a single heater 433 is shown in the figure, multiple heaters 433 may be provided upstream of circulation line 420. A second pressure gauge 434 may be provided upstream of circulation line 420, near pump 430. The second pressure gauge 434 measures the pressure of the liquid flowing upstream of circulation line 420. A second filter 435 removes impurities that may be present in the liquid upstream of circulation line 420.

[0112] The second valve 436 can be an on / off valve. When the second valve 436 is open, liquid flows from the upstream to the downstream of the circulation line 420. Conversely, when the second valve 436 is closed, the flow of liquid from the upstream to the downstream of the circulation line 420 is blocked. A third pressure gauge 437 can be located downstream of the second valve 436.

[0113] Unlike those described above, the positions of the second discharge line 404, heater 433, second pressure gauge 434, second filter 435, second valve 436, and third pressure gauge 437 can be varied in the circulation line 420.

[0114] Supply lines 440, 450, and 460 are connected to circulation line 420. First supply line 440 is connected to circulation line 420. First supply line 440 connects circulation line 420 and first chamber 300a to each other. Second supply line 450 is connected to circulation line 420. Second supply line 450 connects circulation line 420 and second chamber 300b to each other. Third supply line 460 is connected to circulation line 420. Third supply line 460 connects circulation line 420 and third chamber 300c to each other. First supply line 440 can be connected to circulation line 420 closer to pump 430 than second supply line 450. Furthermore, second supply line 450 can be connected to circulation line 420 closer to pump 430 than third supply line 460.

[0115] A first flow meter 442, a first constant pressure valve 444, and a first supply valve 446 may be disposed in a first supply line 440. The first flow meter 442, the first constant pressure valve 444, and the first supply valve 446 may be sequentially disposed upstream of the first supply line 440. The first flow meter 442 can measure the flow rate of liquid flowing through the first supply line 440 per unit time. That is, the first flow meter 442 can measure the flow rate distributed from the circulation line 420 to the first supply line 440. Hereinafter, the flow rate of liquid flowing upstream of the first constant pressure valve 444 (described below) in the first supply line 440 is defined as the first distribution flow rate. According to an exemplary embodiment, the first flow meter 442 measures the first distribution flow rate and transmits the first distribution flow rate data to the controller 15.

[0116] According to an exemplary embodiment, the first constant pressure valve 444 may be a constant pressure valve. The liquid passing through the first constant pressure valve 444 may have a constant flow rate. The flow rate of the liquid passing through the first constant pressure valve 444 per unit time may be maintained constant at a reference flow rate. According to an exemplary embodiment, the liquid having passed through the first constant pressure valve 444 at the reference flow rate is transferred to a supply nozzle disposed in the first chamber 300a.

[0117] The first supply valve 446 is configured as an on / off valve. When the first supply valve 446 is open, the liquid circulating in the circulation line 420 is transferred to the first chamber 300a via the first supply line 440. Conversely, when the first supply valve 446 is open, the liquid does not flow into the first supply line 440 and continues to circulate in the circulation line 420.

[0118] The second flow meter 452, the second constant pressure valve 454, and the second supply valve 456 can be disposed in the second supply line 450. The third flow meter 462, the third constant pressure valve 464, and the third supply valve 466 can be disposed in the third supply line 460. According to the exemplary embodiment, the second flow meter 452 and the third flow meter 462 are disposed equivalent to or similarly to the first flow meter 442 described above. Furthermore, the second constant pressure valve 454 and the third constant pressure valve 464 are disposed equivalent to or similarly to the first constant pressure valve 444 described above. Furthermore, the second supply valve 456 and the third supply valve 466 are disposed equivalent to or similarly to the first supply valve 446 described above. Therefore, repeated descriptions of the second flow meter 452, the second constant pressure valve 454, the second supply valve 456, the third flow meter 462, the third constant pressure valve 464, and the third supply valve will be omitted below.

[0119] Back pressure valve 470 and third valve 438 can be located downstream of circulation line 420.

[0120] A back pressure valve 470 is disposed in the circulation line 420. According to an exemplary embodiment, the back pressure valve 470 is disposed downstream of the circulation line 420. The back pressure valve 470 can regulate the flow rate per unit time of the liquid flowing downstream of the circulation line 420. The back pressure valve 470 according to the exemplary embodiment can be a back pressure control valve (HIBV) whose opening varies with pressure. For example, as the pressure applied to the back pressure valve 470 increases, the opening of the back pressure valve 470 can decrease. When the opening of the back pressure valve 470 decreases, the flow rate per unit time of the liquid flowing downstream of the circulation line 420 can increase. For example, as the pressure applied to the back pressure valve 470 increases, the opening of the back pressure valve 470 can decrease.

[0121] The pressure applied to the back pressure valve 470 can be changed by the second electro-pneumatic regulator 472. The second electro-pneumatic regulator 472 can change the pressure applied to the back pressure valve 470 by feeding back the distributed flow data measured by flow meters 442, 452, and 462. For example, the second electro-pneumatic regulator 472 can change the pressure transmitted to the back pressure valve 470 based on the distributed flow measured by flow meters 442, 452, and 462, by receiving a flow control signal transmitted from the controller 15. The detailed mechanism will be described below.

[0122] The third valve 438 can be located downstream of the second valve 436 and the back pressure valve 470. For example, the third valve 438 can be an on / off valve. When the third valve 438 is open, liquid is recovered from downstream of the circulation line 420 to the tank 410.

[0123] In the exemplary embodiments described above, for ease of understanding, the connection of three supply lines 440, 450, and 460 to the circulation line 420 has been described as an example, but this is not a limitation. For example, two or at least four supply lines may be connected to the circulation line 420.

[0124] The substrate processing method according to an exemplary embodiment of the present invention will be described in detail below. The substrate processing method described below can be performed in the liquid supply unit 400 described above. Furthermore, the controller 15 can control the components included in the liquid supply unit 400 to perform the substrate processing method described below.

[0125] Figure 4 For illustrative purposes only Figure 3 The diagram shows the state in which the liquid supply unit supplies liquid to the chamber in the first state. Figure 5 For illustrative purposes only Figure 3 A diagram illustrating an implementation scheme for controlling the flow rate of liquid to the chamber in the second state using a liquid supply unit.

[0126] The liquid supply unit 400 can supply liquid to at least one chamber 300. For example, as... Figure 4 As shown, the liquid supply unit 400 can supply liquid to three chambers 300a, 300b, and 300c. In contrast, as... Figure 5 As shown, the liquid supply unit 400 can supply liquid to two chambers 300a and 300b.

[0127] In the following text, for ease of understanding, such as Figure 4 As shown, the state in which the liquid supply unit 400 supplies liquid to three chambers 300a, 300b, and 300c is defined as the first state, and the state in which the liquid supply unit 400 supplies liquid to two chambers 300a and 300b is defined as the second state. However, the invention is not limited thereto, and the first state refers to the state in which the liquid supply unit 400 supplies liquid to at least one of the plurality of chambers 300, and the second state refers to the state in which the liquid supply unit 400 supplies liquid to a relatively smaller number of chambers 300 than in the first state.

[0128] like Figure 4As shown, in the first state, the flow rate of the liquid flowing upstream of the circulation line 420 per unit time can be a first flow rate F1. Furthermore, in the first state, the flow rate of the liquid flowing downstream of the circulation line 420 per unit time can be a second flow rate F2. Furthermore, in the first state, the liquid with a first distribution flow rate FD1 can pass through the first flow meter 442. Furthermore, in the first state, the liquid with a second distribution flow rate FD2 can pass through the second flow meter 452. Furthermore, in the first state, the liquid with a third distribution flow rate FD3 can pass through the third flow meter 462. Furthermore, in the first state, the flow rate of the liquid passing through the first constant pressure valve 444, the second constant pressure valve 454, and the third constant pressure valve 464 can all have a reference flow rate FS.

[0129] like Figure 5 As shown, in the second state where the liquid supply unit 400 supplies liquid to the first chamber 300a and the second chamber 300b of the first chamber 300a, the second chamber 300b, and the third chamber 300c, the liquid may not flow in the third supply line 460. When the capacity of the pump 430 is constant and the first state is changed to the second state without changing the fluid pressure supplied to the pump 430 and the pressure applied to the back pressure valve 470, due to the pressure difference between the upstream and downstream of the circulation line 420, the first distribution flow rate FD1' passing through the first flow meter 442 in the second state can be greater than the first distribution flow rate FD1 passing through the first flow meter 442 in the first state. Furthermore, the second distribution flow rate FD2' passing through the second flow meter 452 in the second state can be greater than the second distribution flow rate FD2 passing through the second flow meter 452 in the first state.

[0130] Therefore, controller 15 controls the second electro-pneumatic regulator 472 to change the first distribution flow FD1' passing through the first flow meter 442 in the second state. For example, controller 15 controls the second electro-pneumatic regulator 472 such that the first distribution flow FD1' in the second state is changed to the first distribution flow FD1 in the first state. Furthermore, controller 15 controls the second electro-pneumatic regulator 472 such that the second distribution flow FD2' in the second state is changed to the second distribution flow FD2 in the first state.

[0131] According to an exemplary embodiment of the present invention, controller 15 receives allocated flow data, which is the flow rate of liquid per unit time measured by flow meters 442, 452, and 462. Controller 15 determines a state change between a first state and a second state based on the received allocated flow data. When controller 15 determines that the state has changed from the first state to the second state, controller 15 transmits a flow control signal to a second electro-pneumatic regulator 472. The second electro-pneumatic regulator 472, receiving the flow control signal from controller 15, changes the pressure applied to the back pressure valve 470.

[0132] According to an exemplary embodiment, when the first state is changed to the second state, the controller 15 transmits a downstream flow increase signal to the second electro-pneumatic regulator 472. Therefore, the second electro-pneumatic regulator 472 reduces the pressure applied to the back pressure valve 470. When the pressure applied to the back pressure valve 470 decreases, the opening degree of the back pressure valve 470 can increase. As the opening degree of the back pressure valve 470 increases, the flow rate of the liquid passing through the back pressure valve 470 per unit time can increase. Therefore, the flow rate of the liquid passing downstream of the circulation line 420 per unit time can increase. For example, the flow rate of the liquid passing downstream of the circulation line 420 per unit time changes from a second flow rate F2 in the first state to a fourth flow rate F4, which is greater than the second flow rate F2.

[0133] As the flow rate of the liquid flowing downstream of circulation line 420 increases per unit time, the pressure difference between the upstream and downstream of circulation line 420 decreases, resulting in the first distribution flow rate FD1' in the second state.

[0134] It can be reduced. Therefore, the first allocated flow FD1' can be changed to the first allocated flow FD1 in the first state. Furthermore, in the second state, the second allocated flow FD2' can be reduced. Therefore, the second allocated flow FD2' can be changed to the second allocated flow FD2 in the first state.

[0135] When the number of chambers 300 to which liquid is supplied changes, the flow rate of the liquid flowing into constant pressure valves 444, 454, and 464 per unit time can change.

[0136] When the flow rate per unit time increases, the flow rate of the liquid exiting constant pressure valves 444, 454, and 464 can maintain the reference flow rate, but the constant pressure valves may be damaged. If the flow rate of the liquid exiting the constant pressure valves cannot maintain the reference flow rate due to valve damage, the liquid should not be...

[0137] The liquid is supplied to the substrate located inside chamber 300 at a constant flow rate. If a liquid with an excessive flow rate is supplied to chamber 300 due to a malfunction of the constant pressure valve, the substrate may be damaged. Furthermore, if a liquid with a small flow rate is supplied to chamber 300 due to a malfunction of the constant pressure valve, particles adhering to the substrate may not be easily removed. Additionally, particles generated when the constant pressure valve malfunctions may flow into chamber 300 along with the liquid and adhere to the substrate.

[0138] Therefore, according to one embodiment of the present invention described above, even when the number of chambers 3005 to which liquid is supplied changes, the distribution flow rate (the flow rate of liquid flowing into the constant pressure valve per unit time) can be maintained.

[0139] The flow rate of the liquid flowing downstream of the circulation line 420 is kept constant by varying the flow rate per unit time. Therefore, a constant flow rate of liquid can be supplied to the chamber 300 without damaging the constant pressure valve.

[0140] Except where otherwise described, the substrate processing method described below is consistent with that described in the reference. Figure 5 The substrate processing methods of the exemplary embodiments described are substantially the same or similar.

[0141] 0 Figure 6 and Figure 7 For illustrative purposes only Figure 3 A figure shows another exemplary embodiment of the liquid supply unit controlling the flow rate of liquid supplied to the chamber in the second state.

[0142] refer to Figure 6 The controller 15 controls the first electro-pneumatic regulator 432 to change the first distribution flow FD1' passing through the first flow meter 442 in the second state. For example, the controller 15 controls the first electro-pneumatic regulator 432 such that the first distribution flow FD1' in the second state is changed to the first distribution flow FD1 in the first state. Furthermore, the controller 15 controls the first electro-pneumatic regulator 432 such that the second distribution flow FD2' in the second state is changed to the second distribution flow FD2 in the first state.

[0143] According to an exemplary embodiment of the present invention, controller 15 receives allocated flow data, which is the flow rate of liquid per unit time measured by flow meters 442, 452, and 462. Controller 15 determines a state change between a first state and a second state based on the received allocated flow data. When controller 15 determines that the state has changed from the first state to the second state, controller 15 transmits a flow control signal to a first electro-pneumatic regulator 432. The first electro-pneumatic regulator 432, receiving the flow control signal from controller 15, changes the fluid pressure supplied to pump 430.

[0144] According to an exemplary embodiment, when the first state is changed to the second state, the controller 15 transmits an upstream flow reduction signal to the first electro-pneumatic regulator 432. Therefore, the first electro-pneumatic regulator 432 reduces the fluid pressure supplied to the pump 430. When the fluid pressure supplied to the pump 430 decreases, the flow rate per unit time of the liquid flowing upstream of the circulation line 420 may decrease. For example, the flow rate per unit time of the liquid flowing upstream of the circulation line 420 may change from a first flow rate F1 in the first state to a third flow rate F3, which is smaller than the first flow rate F1.

[0145] As the flow rate of the liquid flowing upstream of circulation line 420 decreases per unit time, the pressure difference between the upstream and downstream of circulation line 420 decreases, allowing the first distribution flow rate FD1' to decrease in the second state. Therefore, the first distribution flow rate FD1' can be changed to the first distribution flow rate FD1 in the first state. Furthermore, in the second state, the second distribution flow rate FD2' can decrease. Therefore, the second distribution flow rate FD2' can be changed to the second distribution flow rate FD2 in the first state.

[0146] refer to Figure 6 According to the exemplary embodiment of the present invention described above, even if the number of chambers 300 to which liquid is supplied changes, the distribution flow rate (the flow rate of liquid flowing into the constant pressure valve per unit time) can be kept constant by changing the flow rate of liquid flowing upstream of the circulation line 420 per unit time. Therefore, it is possible to supply liquid with a constant flow rate to the chambers 300 without damaging the constant pressure valve.

[0147] refer to Figure 7 In the second state, the controller 15 controls the first electro-pneumatic regulator 432 to change the first distribution flow rate FD1' passing through the first flow meter 442. For example, the controller 15 controls the first electro-pneumatic regulator 432 such that the first distribution flow rate FD1' in the second state is changed to the first distribution flow rate FD1 in the first state. Furthermore, the controller 15 controls the first electro-pneumatic regulator 432 such that the second distribution flow rate FD2' in the second state is changed to the second distribution flow rate FD2 in the first state.

[0148] According to an exemplary embodiment of the present invention, controller 15 receives allocated flow data, which is the flow rate of liquid per unit time measured by flow meters 442, 452, and 462. Controller 15 determines a state change between a first state and a second state based on the received allocated flow data. When controller 15 determines that the state has changed from the first state to the second state, controller 15 transmits flow control signals to a first electro-pneumatic regulator 432 and a second electro-pneumatic regulator 472. The first electro-pneumatic regulator 432, receiving the flow control signal from controller 15, changes the fluid pressure supplied to pump 430. Furthermore, the second electro-pneumatic regulator 472, also receiving the flow control signal from controller 15, changes the pressure applied to back pressure valve 470.

[0149] According to an exemplary embodiment, when the first state is changed to the second state, the controller 15 transmits an upstream flow reduction signal to the first electro-pneumatic regulator 432. Therefore, the first electro-pneumatic regulator 432 reduces the fluid pressure supplied to the pump 430. When the fluid pressure supplied to the pump 430 decreases, the flow rate per unit time of the liquid flowing upstream of the circulation line 420 may decrease. For example, the flow rate per unit time of the liquid flowing upstream of the circulation line 420 may change from a first flow rate F1 in the first state to a third flow rate F3, which is smaller than the first flow rate F1.

[0150] Furthermore, when the first state is changed to the second state, the controller 15 transmits a downstream flow increase signal to the second electro-pneumatic regulator 472. Therefore, the second electro-pneumatic regulator 472 reduces the pressure applied to the back pressure valve 470. When the pressure applied to the back pressure valve 470 decreases and the opening of the back pressure valve 470 increases, the flow rate per unit time of the liquid flowing downstream of the circulation line 420 can increase. For example, the flow rate per unit time of the liquid flowing downstream of the circulation line 420 changes from a second flow rate F2 in the first state to a fourth flow rate F4, which is greater than the second flow rate F2.

[0151] As the flow rate of the liquid flowing upstream of circulation line 420 decreases per unit time and the flow rate of the liquid flowing downstream of circulation line 420 increases per unit time, the pressure difference between the upstream and downstream of circulation line 420 decreases. Therefore, the first distribution flow rate FD1' can be changed to the first distribution flow rate FD1 in the first state. Furthermore, the second distribution flow rate FD2' can be changed to the second distribution flow rate FD2 in the first state.

[0152] refer to Figure 7According to the exemplary embodiment of the present invention described above, even when the number of chambers 300 to which liquid is supplied changes, the pressure difference between the upstream and downstream of the circulation line 420 can be changed more precisely by altering the flow rate per unit time of the liquid flowing upstream and downstream of the circulation line 420, respectively. Therefore, the distribution flow rate (the flow rate per unit time of the liquid flowing into the constant pressure valve) can be maintained constant. Thus, it is possible to supply liquid with a constant flow rate to the chambers 300 without damaging the constant pressure valve.

[0153] Figure 8 For illustrative purposes only Figure 3 A figure shows another exemplary embodiment of the liquid supply unit supplying liquid to the chamber in the first state. Figure 9 For illustrative purposes only Figure 3 A figure shows another exemplary embodiment of the liquid supply unit supplying liquid to the chamber in the second state.

[0154] refer to Figure 8 and Figure 9 The liquid supply unit 400 can supply liquid to the first chamber 300a. In the following description, for ease of understanding, it is described that the liquid supply unit 400 supplies liquid only to the first chamber 300a, but it is not limited thereto, and the liquid supply unit 400 can supply liquid to multiple chambers simultaneously.

[0155] The liquid supply unit 400 may have a first pump 432 and a second pump 434. The first pump 432 may be a pump with a first capacity. The second pump 434 may be a pump with a second capacity. According to an exemplary embodiment, the first capacity may be smaller than the second capacity.

[0156] like Figure 8 As shown, the liquid supply unit 400 can supply liquid to the circulation line 420 using a first pump 432. The first pump 432, having a first capacity, can transfer liquid with a first flow rate F1 per unit time to the upstream of the circulation line 420. Furthermore, as... Figure 9 As shown, the liquid supply unit 400 can supply liquid to the circulation line 420 using a second pump 434. The second pump 434, having a second capacity, can transfer liquid with a third flow rate F3 per unit time to the upstream of the circulation line 420. According to this exemplary embodiment, the first flow rate F1 can be smaller than the third flow rate F3.

[0157] When the state of supplying liquid to chamber 300 using the first pump 432 is changed to the state of supplying liquid to chamber 300 using the second pump 434, the first distribution flow rate may change due to the pressure difference between the upstream and downstream of the circulation line 420 without changing the pressure applied to the back pressure valve 470. For example, the first distribution flow rate FD1' passing through the first flow meter 442 when using the second pump 434 may be greater than the first distribution flow rate FD1 passing through the first flow meter 442 when using the first pump 432.

[0158] Therefore, controller 15 controls the second electro-pneumatic regulator 472 to change the first distribution flow rate FD1' passing through the first flow meter 442. According to an exemplary embodiment of the invention, controller 15 receives distribution flow data, which is the flow rate of the liquid per unit time measured by the first flow meter 442. Controller 15 determines whether to change the capacity of pump 430 based on the received distribution flow data. When controller 15 determines that the capacity of pumps 432 and 434 has changed, controller 15 transmits a flow control signal to the second electro-pneumatic regulator 472. The second electro-pneumatic regulator 472, receiving the flow control signal from controller 15, changes the pressure applied to the back pressure valve 470.

[0159] According to an exemplary embodiment, when the first pump 432 is changed to the second pump 434, the controller 15 transmits a downstream flow increase signal to the second electro-pneumatic regulator 472. Therefore, the second electro-pneumatic regulator 472 reduces the pressure applied to the back pressure valve 470. When the pressure applied to the back pressure valve 470 decreases, the opening of the back pressure valve 470 can increase. As the opening of the back pressure valve 470 increases, the flow rate of liquid passing through the back pressure valve 470 per unit time can increase. Therefore, the flow rate of liquid passing downstream of the circulation line 420 can increase. For example, the flow rate of liquid passing downstream of the circulation line 420 per unit time changes to a fourth flow rate F4, which is greater than the second flow rate F2, the flow rate of liquid passing downstream of the circulation line 420 per unit time when the first pump 422 is used.

[0160] As the flow rate of the liquid flowing downstream of circulation line 420 increases per unit time, the pressure difference between the upstream and downstream of circulation line 420 decreases, making it possible to reduce the first distribution flow rate FD1'. In other words, controller 15 changes the first distribution flow rate FD1' based on the change in the distribution flow rate. For example, when using the first pump 422, controller 15 can change the first distribution flow rate FD1' to be similar to the first distribution flow rate FD1.

[0161] Therefore, according to the exemplary embodiment of the present invention described above, even if the capacity of pump 430 changes and the flow rate per unit time of the liquid flowing upstream of circulation line 420 changes, the distributed flow rate (flow rate per unit time of the liquid flowing into the constant pressure valve) can be kept constant by changing the flow rate per unit time of the liquid flowing downstream of circulation line 420. Thus, a constant flow rate of liquid can be supplied to chamber 300 without damaging the constant pressure valve.

[0162] In the exemplary embodiments of the present invention described above, it has been shown that the flow rate of liquid flowing into the constant pressure valve per unit time varies according to the number of chambers supplying liquid to it or the flow rate of the pump supplying liquid, but this is not a limitation. For example, the present invention can be applied equivalently even when the flow rate of liquid flowing through the circulation line 420 changes according to the opening and closing of the second discharge line 404 for discharging liquid flowing through the circulation line 420.

[0163] The foregoing detailed description illustrates the present invention. Furthermore, the foregoing has shown and described exemplary embodiments of the invention, and the invention can be used in various other combinations, modifications, and environments. That is, modifications or alterations can be made to the foregoing within the scope of the inventive concept disclosed herein, its equivalents, and / or within the scope of the technology or knowledge in the art. Therefore, the foregoing detailed description of the invention is not intended to limit the invention to the disclosed exemplary embodiments. Furthermore, the appended claims should also be interpreted to include other exemplary embodiments. These modifications should not be understood solely from the technical concept and prospects of the invention.

Claims

1. A substrate processing method for processing a substrate in multiple chambers, the substrate processing method comprising: When the liquid circulates in the circulation line, liquid processing is performed on the substrate located in the chamber via the supply line connecting the circulation line and each of the plurality of chambers, wherein the flow rate of the liquid flowing downstream of the valve provided in the supply line is kept constant at a reference flow rate per unit time, and The upstream or downstream flow rate is controlled based on the allocated flow rate to maintain the reference flow rate, wherein the upstream flow rate is the flow rate per unit time of the liquid flowing upstream of the circulation line (not the supply line), the downstream flow rate is the flow rate per unit time of the liquid flowing downstream of the circulation line (not the supply line), and the allocated flow rate is the flow rate per unit time of the liquid flowing upstream of the valve. The valve in question is a constant pressure valve. A flow meter is installed upstream of the constant pressure valve in each of the aforementioned supply lines, and The flow meter is used to measure the distributed flow rate, and the opening of the constant pressure valve remains constant while the liquid treatment is performed on the substrate.

2. The substrate processing method according to claim 1, wherein, A pump and a first electro-pneumatic regulator are installed upstream of the circulation pipeline to supply the liquid downstream of the circulation pipeline using fluid pressure, and The first electro-pneumatic regulator controls the upstream flow rate by feeding back distribution flow data and changing the fluid pressure supplied to the pump.

3. The substrate processing method according to claim 2, wherein, A back pressure valve and a second electro-pneumatic regulator are installed downstream of the circulation pipeline to change the opening degree of the back pressure valve according to the pressure. The second electro-pneumatic regulator changes the pressure supplied to the back pressure valve by feeding back the distributed flow data, and the second electro-pneumatic regulator changes the opening degree according to the changed pressure to control the downstream flow.

4. The substrate processing method according to claim 3, wherein, The method includes a first state in which the liquid treatment is performed in at least one of the plurality of chambers, and a second state in which the liquid treatment is performed in a relatively smaller number of chambers than in the first state. In each of the first and second states, the upstream flow or the downstream flow is controlled differently from each other.

5. The substrate processing method according to claim 4, wherein, In the second state, the fluid pressure supplied to the pump is further reduced compared to the fluid pressure supplied to the pump in the first state, and the upstream flow rate in the second state is controlled to be smaller than the upstream flow rate in the first state.

6. The substrate processing method according to claim 4, wherein, In the second state, the fluid pressure supplied to the back pressure valve is further reduced compared to the fluid pressure supplied to the back pressure valve in the first state to increase the opening, and the downstream flow rate in the second state is controlled to be greater than the downstream flow rate in the first state.

7. The substrate processing method according to claim 4, wherein, The upstream flow in the second state is controlled to be smaller than the upstream flow in the first state, and the downstream flow in the second state is controlled to be larger than the downstream flow in the first state.

8. A substrate processing method for processing a substrate, the substrate processing method comprising: When the liquid is circulated in the circulation line, the liquid supplied by the pump is supplied to the substrate located in the chamber through the supply line connecting the circulation line and the chamber, wherein the flow rate of the liquid flowing downstream of the valve located in the supply line is kept constant at a reference flow rate per unit time, and The downstream flow rate is adjusted based on changes in the allocated flow rate to maintain a reference flow rate. The downstream flow rate is the flow rate per unit time of the liquid flowing downstream of the circulation line, while the allocated flow rate is the flow rate per unit time of the liquid flowing upstream of the valve. The valve in question is a constant pressure valve. A flow meter is installed upstream of the constant pressure valve in each of the aforementioned supply lines, and The flow meter is used to measure the distribution flow rate, and the opening of the constant pressure valve is kept constant while liquid treatment is performed on the substrate.

9. The substrate processing method according to claim 8, wherein, The downstream flow rate changes proportionally to the change in the allocated flow rate.

10. The substrate processing method according to claim 9, wherein, A back pressure valve and an electro-pneumatic regulator are installed downstream of the circulation pipeline to change the opening degree of the back pressure valve according to the pressure. The electro-pneumatic regulator changes the pressure supplied to the back pressure valve according to the change in the distributed flow rate, and changes the downstream flow rate by changing the opening degree according to the changing pressure.

11. The substrate processing method according to claim 10, wherein, When the allocated flow rate changes from the first flow rate to the second flow rate, the electro-pneumatic regulator changes the pressure supplied to the back pressure valve from the first pressure to the second pressure, thereby increasing the opening. The second flow rate has a greater flow rate per unit time than the first flow rate, and the second pressure is lower than the first pressure.

12. The substrate processing method according to claim 10, wherein, When the allocated flow rate changes from the second flow rate to the first flow rate, the electro-pneumatic regulator changes the pressure supplied to the back pressure valve from the second pressure to the first pressure, causing the opening to decrease. The first flow rate has a smaller flow rate per unit time than the second flow rate, and the first pressure is greater than the second pressure.

13. The substrate processing method according to claim 8, wherein, The flow rate is varied depending on the capacity of the pump or the number of chambers supplying the liquid to the substrate.

14. A substrate processing apparatus for processing a substrate, the substrate processing apparatus comprising: A chamber in which liquid treatment is performed on the substrate; A circulation pipeline through which the liquid circulates; A supply line, which is equipped with a constant pressure valve, supplies the liquid to the substrate located in the chamber; as well as Controller The circulation pipeline includes A pump is located upstream of the circulation line and supplies the liquid from the tank to the downstream of the circulation line using fluid pressure; as well as A back pressure valve, located downstream of the circulation line, is configured to change its opening degree according to the pressure applied to it. The supply line is connected to the circulation line at a position between the location where the pump is installed and the location where the back pressure valve is installed, and When fluid is supplied to the chamber through the supply line, the controller controls the upstream or downstream flow rate based on the allocated flow rate to maintain a constant flow rate per unit time of the liquid flowing downstream of the constant pressure valve as a reference flow rate. The upstream flow rate is the flow rate per unit time of the liquid flowing upstream of the circulation line (not the supply line), the downstream flow rate is the flow rate per unit time of the liquid flowing downstream of the circulation line (not the supply line), and the allocated flow rate is the flow rate per unit time of the liquid flowing upstream of the constant pressure valve. A flow meter is installed upstream of the constant pressure valve in each of the aforementioned supply lines, and The flow meter is used to measure the distributed flow rate, and the opening of the constant pressure valve is kept constant while the liquid treatment is performed on the substrate.

15. The substrate processing apparatus according to claim 14, wherein, A first electro-pneumatic regulator is further installed upstream of the circulation pipeline to control the upstream flow based on the allocated flow data, and A second electro-pneumatic regulator is further installed downstream of the circulation pipeline to control the downstream flow based on the allocated flow data.

16. The substrate processing apparatus according to claim 15, wherein, Multiple chambers are provided. The supply line connects the circulation line to each of the plurality of chambers independently, and The controller controls the first electro-pneumatic regulator to control the upstream flow by feeding back the allocated flow data and changing the fluid pressure supplied to the pump; Furthermore, the controller controls the second electro-pneumatic regulator by feeding back the allocated flow data to change the pressure supplied to the back pressure valve, and to change the opening degree according to the changing pressure to control the downstream flow and maintain the reference flow.

17. The substrate processing apparatus according to claim 16, wherein, In a first state where the liquid treatment is performed in at least one of the plurality of chambers, and in a second state where the liquid treatment is performed in a relatively smaller number of chambers than in the first state, The controller controls the first or the second electro-pneumatic regulator to control the upstream flow rate in the second state to be smaller than the upstream flow rate in the first state.

18. The substrate processing apparatus according to claim 17, wherein, The controller controls the first or the second electro-pneumatic regulator to control the downstream flow rate in the second state to be greater than the downstream flow rate in the first state.

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