Wafer flip abnormality detection method and system

Abstract

The application discloses a wafer overturning abnormality detection method and system, and belongs to the technical field of measuring instruments. In the wafer overturning abnormality detection system, the structure is improved for the problem that no alarm is given when a wafer overturns abnormally, a sensor is added, and an alarm is given in time when overturning is abnormal, so that the influence of abnormality on the wafer is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of measuring instruments, in particular to a wafer overturning abnormality detection method and system. BACKGROUND

[0002] BSM back sputtering is a process for the back of the wafer. The wafer is upright in the Foup (front opening wafer transfer box, which is a container used to protect, transport and store wafers in semiconductor processing). Before entering the machine for operation and after the operation is completed, the wafer needs to be overturned by 180 degrees.

[0003] The overturning abnormality occurs before the wafer is overturned before operation, the machine occasionally has no awareness alarm, and the front of the wafer is sputtered with metal, causing scrap. SUMMARY

[0004] The embodiments of the present application provide a wafer overturning abnormality detection method and system. The technical solution is as follows:

[0005] According to one aspect of the present application, a wafer overturning abnormality detection system is provided, which comprises a back sputtering device, a overturning mechanism, a detection sensor and an audible and visual alarm device;

[0006] The back sputtering device is used for processing the back of the wafer;

[0007] The overturning mechanism is located in the working range of the back sputtering device, and the overturning mechanism is used for fixing the wafer and performing overturning operation;

[0008] The detection sensor is arranged at the back sputtering device, and the detection space of the detection sensor includes the action space of the overturning mechanism;

[0009] The audible and visual alarm device and the detection sensor electrically interact with information, and the audible and visual alarm device is used to issue an alarm when the detection sensor detects an abnormality.

[0010] Optionally, the detection sensor comprises a transmitting sensor and a receiving sensor, and the transmitting sensor and the receiving sensor are arranged at intervals;

[0011] The transmitting sensor is used for transmitting detection light to the receiving sensor, and the receiving sensor is used for receiving the detection light.

[0012] Optionally, the audible and visual alarm device comprises an alarm buzzer and a reset button;

[0013] The alarm buzzer alarms with light flashing, and the reset button is used for recovery after alarm.

[0014] Optionally, the detection light is infrared light.

[0015] Optionally, the probe light is visible light.

[0016] Optionally, the thickness of the wafer is between 50um and 990um.

[0017] According to another aspect of the present application, a wafer flipping abnormality detection method is provided, which is used in the wafer flipping abnormality detection system as described above, and the method comprises:

[0018] In response to the wafer being transmitted to the flipping mechanism, the detection sensor is started with the flipping mechanism.

[0019] In response to the detection time of the detection sensor exceeding the target detection time, the audible and visual alarm device alarms.

[0020] Optionally, the method further comprises:

[0021] In response to the audible and visual alarm device not alarming, it is detected that the wafer is completed flipping.

[0022] In the embodiments of the present application, a wafer flipping abnormality detection system is provided, which is structurally improved for the problem of no alarm when the wafer flips abnormally, and a sensor is added to timely alarm when the wafer flips abnormally, thereby reducing the influence of the abnormality on the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a structural schematic diagram of the wafer flipping abnormality detection system provided by an illustrative embodiment of the present application;

[0024] Figure 2 is a structural schematic diagram of the detection sensor provided by an illustrative embodiment of the present application;

[0025] Figure 3 shows a logic schematic diagram of the wafer flipping abnormality detection method provided by an illustrative embodiment of the present application. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0027] In this document, "multiple" refers to two or more. "And / or" describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can represent the three cases of A alone, A and B together, and B alone. The character " / " generally represents an "or" relationship between the associated objects before and after it.

[0028] Reference should be made to Figure 1This illustration shows a schematic diagram of a wafer flipping anomaly detection system provided in an illustrative embodiment of this application. The system includes a back-side sputtering device 10, a flipping mechanism 20, a detection sensor 30, and an audible and visual alarm device 40.

[0029] The back-side sputtering equipment 10 is used to process the back side of the wafer. The flipping mechanism 20 is located within the working range of the back-side sputtering equipment 10. The flipping mechanism 20 is used to fix the wafer and perform flipping operations. The detection sensor 30 is set at the back-side sputtering equipment 10. The detection space of the detection sensor 30 includes the operating space of the flipping mechanism 20.

[0030] The audible and visual alarm device interacts with the detection sensor via electrical communication. The audible and visual alarm device is used to issue an alarm when the detection sensor detects an abnormality.

[0031] Optional, such as Figure 2 As shown, the detection sensor 30 includes a transmitting sensor 31 and a receiving sensor 32, which are spaced apart.

[0032] The transmitting sensor is used to emit probe light to the receiving sensor, and the receiving sensor is used to receive the probe light.

[0033] Optionally, the audible and visual alarm device includes an alarm buzzer and a reset button.

[0034] The alarm buzzer flashes an indicator light when it sounds an alarm, and the reset button is used to restore the status quo after an alarm.

[0035] Optionally, the detection light can be infrared light or visible light.

[0036] In summary, the embodiments of this application provide a wafer flipping anomaly detection system, which improves the structure to address the problem of no alarm when wafer flipping anomalies occur by adding a sensor to issue an alarm in a timely manner when an anomaly occurs, thereby reducing the impact of the anomaly on the wafer.

[0037] Please refer to Figure 3 This illustrates a logical diagram of a disc flipping anomaly detection method provided in another illustrative embodiment of this application.

[0038] In response to the disc being transmitted to the flipping mechanism, the detection sensor and the flipping mechanism are activated.

[0039] In the first scenario (abnormal non-flipping process), the disc is transmitted to the flipping mechanism (Flip). In response to the detection sensor's sensing time exceeding the target sensing time (e.g., 8 seconds), the audible and visual alarm device sounds an alarm, and the disc is removed by the arm assembly.

[0040] The second case (normal flip process), the wafer is transmitted to the flip mechanism (Flip), the wafer is flipped, especially in the vertical state, the infrared or visible light of the flip mechanism is blocked, the sensing time is cut off, and is less than the target sensing time (for example, 8 seconds), further, after the flip is completed, the infrared or visible light of the flip mechanism is restored to be transmitted, the sensing time does not exceed the target sensing time (for example, 8 seconds), after the flip is completed, the wafer is taken out by the arm assembly.

[0041] In a possible implementation, the target sensing time is set according to the flip time, for example, the target sensing time (8 seconds) is greater than the first-stage flip time (5.4 seconds) and the second-stage flip time (6.6 seconds), but the target sensing time (8 seconds) is not greater than the total time of the two stages.

[0042] The embodiment of the present application further provides a computer readable medium, which stores at least one instruction, the at least one instruction is loaded and executed by the processor to realize the wafer flip abnormality detection method as described in each of the above embodiments.

[0043] The above only describes optional embodiments of the present application, and does not limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer flip abnormality detection system, comprising: The system comprises a back sputtering device, a turnover mechanism, a detection sensor and an audible and visual alarm device. The back sputtering device is used for processing the back of a wafer. The turnover mechanism is located in the working range of the back sputtering device, and is used for fixing the wafer and performing a turnover operation. The detection sensor is arranged at the back sputtering device, and the detection space of the detection sensor comprises the action space of the turnover mechanism. The detection sensor comprises a transmitting sensor and a receiving sensor, and the transmitting sensor and the receiving sensor are arranged at intervals. The transmitting sensor is used for transmitting a detection light to the receiving sensor.

2. The system of claim 1, wherein, The receiving sensor is used for receiving the detection light. The audible and visual alarm device and the detection sensor perform information interaction.

3. The system of claim 1, wherein, When the wafer is turned over by the turnover mechanism, if the duration that the detection light is not blocked by the wafer or the turnover mechanism exceeds a preset target sensing time, the audible and visual alarm device alarms.

4. The system of claim 1, wherein, The audible and visual alarm device comprises an alarm buzzer and a reset button.

5. The system of claim 1, wherein, When the alarm buzzer alarms, the alarm buzzer flashes with light.

6. A wafer flip abnormality detection method characterized by comprising: The reset button is used for restoring after the alarm. The detection light is infrared light. The detection light is visible light.

7. The method of claim 6, wherein, The thickness of the wafer is between 50um and 990um. The method is used for the wafer turnover abnormality detection system as claimed in any one of claims 1 to 5. The detection sensor and the turnover mechanism are started in response to the wafer being transmitted to the turnover mechanism. The audible and visual alarm device alarms in response to the sensing time of the detection sensor exceeding the target sensing time. The method further comprises: The wafer is detected to be turned over in response to the audible and visual alarm device not alarming.

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