electronic devices

Abstract

The present application discloses an electronic device, belonging to the technical field of electronic products. The electronic device comprises: a first folding portion, a second folding portion, and a hinge structure, wherein the first folding portion and the second folding portion are rotatably connected by the hinge structure; the first folding portion comprises a frame, a circuit board assembly, and a snap-fit ​​assembly, the frame comprising a first receiving groove and a second receiving groove disposed opposite each other, the first receiving groove and the second receiving groove being distributed along the thickness direction of the first folding portion, the hinge structure being partially received in the first receiving groove, and the circuit board assembly being snap-fitted and received in the second receiving groove by the snap-fit ​​assembly; the snap-fit ​​assembly is provided with a snap-fit ​​structure, and a snap-fit ​​groove adapted to the snap-fit ​​structure is provided on the side wall of the battery compartment of the frame, wherein the snap-fit ​​structure and the snap-fit ​​groove cooperate to snap-fit ​​the snap-fit ​​assembly to the frame.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and specifically relates to an electronic device. Background Art

[0002] Currently, the main and battery circuit boards of foldable electronic devices are typically connected via board-to-board (BTB) connectors. As foldable electronic devices integrate more and more functions, the space available for BTB connectors is shrinking. Therefore, snapping the main and battery circuit boards together in the hinge area of ​​foldable electronic devices has become the predominant solution.

[0003] Because the main circuit board and battery circuit board need to be secured together via the BTB fixing plate to prevent disengagement, buckle and screw positions must be designed on the BTB fixing plate. Furthermore, to ensure safe and waterproof positioning of the buckle and screw positions, corresponding first and second bumps must be designed on the frame. However, both the first and second bumps occupy the installation space of the hinge structure of the foldable electronic device, thereby affecting the hinge structure's motion trajectory and the folding performance of the foldable electronic device.

[0004] It can be seen that the assembly and fixation of the circuit board assembly in the related art has the problem of occupying a large space. Summary of the Invention

[0005] The present application aims to provide an electronic device that can solve the problem of large space occupation in the assembly and fixation of circuit board components in the related art.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] An embodiment of the present application provides an electronic device, comprising: a first folding portion, a second folding portion, and a hinge structure, wherein the first folding portion and the second folding portion are rotatably connected via the hinge structure;

[0008] The first folding portion includes a frame, a circuit board assembly, and a buckling assembly. The frame includes a first receiving groove and a second receiving groove disposed opposite to each other. The first receiving groove and the second receiving groove are distributed along the thickness direction of the first folding portion. The hinge structure is partially received in the first receiving groove. The circuit board assembly is buckled and received in the second receiving groove by the buckling assembly.

[0009] The buckle assembly is provided with a buckle structure, and the battery compartment side wall of the frame is provided with a buckle groove adapted to the buckle structure. The buckle structure and the buckle groove cooperate to enable the buckle assembly to be buckled and fixed on the frame.

[0010] In an embodiment of the present application, by setting a buckle groove that cooperates with the buckle structure on the side wall of the battery compartment of the frame, it is possible to avoid the buckle protrusion corresponding to the buckle groove occupying the movement space of the hinge structure in the first receiving groove, thereby improving the movement performance of the hinge structure and enhancing the folding performance of the electronic device.

[0011] In addition, since the buckling groove that cooperates with the buckling structure is set on the side wall of the battery compartment of the frame, when assembling the circuit board assembly, it is only necessary to cooperate with the buckling groove and the buckling structure to achieve the purpose of buckling and fixing the circuit board assembly in the second receiving groove through the buckling assembly, thereby achieving the purpose of reducing the installation space required for assembling and fixing the circuit board assembly.

[0012] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0014] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application in a closed state;

[0015] Figure 2 for Figure 1 The electronic device is shown in a flattened state.

[0016] Figure 3 for Figure 1 One of the structural schematic diagrams of the electronic device shown;

[0017] Figure 4 for Figure 1 One of the cross-sectional views of the electronic device shown;

[0018] Figure 5 for Figure 4 A magnified view of area A in FIG;

[0019] Figure 6 for Figure 1 The second structural diagram of the electronic device shown;

[0020] Figure 7 for Figure 1 A second cross-sectional view of the electronic device shown;

[0021] Figure 8 for Figure 1 A third cross-sectional view of the electronic device shown;

[0022] Figure 9 for Figure 8Magnified view of region B shown;

[0023] Figure 10 for Figure 1 The third structural diagram of the electronic device shown. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0025] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0027] An embodiment of the present application provides an electronic device having a hinge structure, specifically, a foldable device such as a foldable mobile phone or a laptop computer.

[0028] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application in a closed state; Figure 2 for Figure 1 The electronic device shown is a schematic diagram of a structure in a flat state. In this embodiment, the electronic device can be a foldable mobile phone. Specifically, Figure 1 and Figure 2As shown, the electronic device includes a first folding part 10, a second folding part 20 and a hinge structure 30. The first folding part 10 and the second folding part 20 are rotatably connected by the hinge structure 30, and under the action of the hinge structure 30, the electronic device can be switched between a closed state and a flattened state.

[0029] The closed state can be understood as the unfolding angle between the first folding portion 10 and the second folding portion 20 being 0°, and the flattened state can be understood as the unfolding angle between the first folding portion 10 and the second folding portion 20 being 180°.

[0030] In the embodiment of the present application, the unfolding angle of the electronic device can be switched between 0° and 180° to meet the application requirements of the electronic device at different unfolding angles.

[0031] In some implementations, the unfolding angle of the electronic device can even be switched between 0° and 360°.

[0032] Furthermore, it is understandable that the number of folding parts included in the electronic device can also be three or more. In addition, when the number of folding parts is three or more, those skilled in the art can expand accordingly based on the technical ideas of this application, which will not be described in detail here.

[0033] It should be noted that Figure 1 、 Figure 2 The following figures and the accompanying drawings only schematically illustrate some components of the electronic device, and the actual shapes, sizes, positions and structures of these components are not affected by the present invention. Figure 1 、 Figure 2 and the accompanying drawings below.

[0034] For ease of description, the width direction of the electronic device can be defined as the X axis, the length direction of the electronic device as the Y axis, and the thickness direction of the electronic device as the Z axis. It is understood that the coordinate system setting of the electronic device can be flexibly set according to actual needs.

[0035] See also Figures 3 to 10 , Figure 3 for Figure 1 One of the structural schematic diagrams of the electronic device shown; Figure 4 for Figure 1 One of the cross-sectional views of the electronic device shown; Figure 5 for Figure 4 A magnified view of area A in FIG; Figure 6 for Figure 1 The second structural diagram of the electronic device shown; Figure 7 for Figure 1 A second cross-sectional view of the electronic device shown; Figure 8 for Figure 1A third cross-sectional view of the electronic device shown; Figure 9 for Figure 8 Magnified view of region B shown; Figure 10 for Figure 1 The third structural diagram of the electronic device shown in FIG. Figures 1 to 10 As shown, the first folding portion 10 includes a frame 11, a circuit board assembly 12 and a buckling assembly 13. The frame 11 includes a first receiving groove 111 and a second receiving groove 112 arranged opposite to each other. The first receiving groove 111 and the second receiving groove 112 are distributed along the thickness direction of the first folding portion 10, that is, the first receiving groove 111 and the second receiving groove 112 can be distributed along the Z-axis direction in the figure, and the hinge structure 30 is partially received in the first receiving groove 111. The circuit board assembly 12 is buckled and received in the second receiving groove 112 through the buckling assembly 13.

[0036] The buckle assembly 13 is provided with a buckle structure 131 , and the battery compartment side wall of the frame 11 is provided with a buckle groove 113 adapted to the buckle structure 131 . The buckle structure 131 and the buckle groove 113 cooperate to buckle the buckle assembly 13 to be fixed on the frame 11 .

[0037] In the related art, the buckle structure 131 is usually arranged in the axial direction of the hinge, that is, the buckle structure 131 is in the axial direction of the frame 11. Figure 3 The buckle fits in the Y-axis direction shown. Since there is a water inlet path in the axial direction of the hinge, the buckle groove on the frame 11 used to cooperate with the buckle structure 131 must be a blind groove, so as to block the water inlet path. In this way, the groove wall of the blind groove will increase the size of the frame in the Y direction. In addition, a corresponding protruding structure must be provided on the frame 11 for waterproofing, which further increases the size of the frame 11 in the Y direction. In the embodiment of the present application, the buckle groove 113 is provided on the wall of the battery compartment, and the buckle structure 131 cooperates with the buckle groove 113 in the X direction. Since the battery compartment itself is a sealed and waterproof structure and there is no water inlet path, the buckle groove 113 can be designed as a through hole. Therefore, the cooperation between the buckle structure 131 and the buckle groove 113 does not need to increase the original size in the X direction. Through the solution of the embodiment of the present application, the space occupied by the buckle structure can be reduced while ensuring the waterproof performance of the entire machine, and the size occupied by the buckle assembly 13 in the Y direction can be reduced.

[0038] The frame 11 can be understood as the frame structure of the first folding portion 10 , which is used to support and assemble functional components of the electronic device, such as a battery and a camera.

[0039] The first receiving groove 111 and the second receiving groove 112 can be formed during the molding stage of the frame 11. For example, if the frame 11 is a plastic frame, the first receiving groove 111 and the second receiving groove 112 can be formed by injection molding. It is understood that the frame 11 can also be a frame structure made of other materials.

[0040] The hinge structure 30 may include a first swing arm, a second swing arm, and a rotating shaft. The first swing arm may be connected to the first folding portion 10, and the second swing arm may be connected to the second folding portion 20. The first swing arm and the second swing arm are rotatably connected via the rotating shaft, so that the first folding portion 10 and the second folding portion 20 can achieve relative rotation via the hinge structure 30. The first swing arm for connecting to the first folding portion 10 may be received in the first receiving groove 111, and the second swing arm for connecting to the second folding portion 20 may be received in the receiving groove on the second folding portion 20.

[0041] The coupling and connection between the buckling structure 131 and the buckling groove 113 can be understood as a snap-fit, that is, the buckling assembly 13 is buckled and fixed to the frame 11 by snapping the buckling structure 131 into the buckling groove 113 .

[0042] The above-mentioned circuit board assembly 12 can be understood as a circuit board component that needs to be assembled and fixed in the hinge area of ​​the first folding portion 10 .

[0043] In some embodiments, the circuit board assembly 12 includes a first circuit board 121, a BTB connector 122, and a second circuit board 123. The first circuit board 121 and the second circuit board 123 can be electrically connected through the BTB connector 122; the above-mentioned snap-fit ​​assembly 13 can be understood as a BTB snap-fit ​​assembly, which is used to fix the connection between the first circuit board 121, the BTB connector 122, and the second circuit board 123, and prevent the BTB connector from being disengaged.

[0044] The first circuit board 121 may be a mainboard circuit board, and the second circuit board 123 may be a battery circuit board.

[0045] Since the buckling assembly 13 and the hinge structure 30 are respectively located at two opposite sides of the frame body 11 in the thickness direction, when the buckling groove 113 is formed on the frame body 11 , a corresponding buckling protrusion is formed in the first receiving groove 111 .

[0046] In this embodiment, by setting the buckle groove 113 that cooperates with the buckle structure 131 on the side wall of the battery compartment of the frame 11, it is possible to avoid the buckle protrusion corresponding to the buckle groove 113 occupying the movement space of the hinge structure 30 in the first receiving groove 111, thereby improving the movement performance of the hinge structure 30 and enhancing the folding performance of the electronic device.

[0047] Furthermore, since the buckling groove 113 that cooperates with the buckling structure 131 is set on the side wall of the battery compartment of the frame 11, when assembling the circuit board assembly 12, it is only necessary to cooperate with the buckling groove 113 and the buckling structure 131 to achieve the purpose of buckling and fixing the circuit board assembly 12 in the second receiving groove 112 through the buckling assembly 13, thereby achieving the purpose of reducing the installation space required for assembling and fixing the circuit board assembly 12.

[0048] Optionally, the fastening assembly 13 includes a fastening assembly body 132 disposed in contact with the circuit board assembly 12, and a first fastening plate 133 extending from a side edge of the fastening assembly body 132;

[0049] The buckling structure 131 is disposed on the first buckling plate 133 and is located on a side of the first buckling plate 133 facing the battery compartment sidewall 114 .

[0050] In this embodiment, by setting the buckle structure 131 on the side of the first buckle joint 133 facing the battery compartment side wall 114, the space occupied by the buckle protrusion corresponding to the buckle groove 113 in the first receiving groove 111 can be further reduced, and the influence of the buckle protrusion corresponding to the buckle groove 113 on the movement performance of the hinge structure 30 can be further reduced.

[0051] Optionally, the fastening assembly 13 further includes a second fastening plate 134 extending from the other side edge of the fastening assembly body 132, and the first fastening plate 133 and the second fastening plate 134 are respectively located on two opposite sides of the fastening assembly body 132;

[0052] A first positioning hole is provided on the second fastening plate 134 , and a second positioning hole adapted to the first positioning hole is provided on the frame 11 . The first positioning hole and the second positioning hole are connected by screws.

[0053] In this embodiment, the second snap-fitting plate 134 can be fixedly connected to the frame 11 by screws, and the stability of the fixed connection between the snap-fitting component 13 and the frame 11 can be improved, that is, the snap-fitting and fixing effect of the snap-fitting component 13 on the circuit board assembly 12 can be improved.

[0054] Moreover, the second buckling plate 134 and the frame 11 can be detachably connected by screw connection, and the assembly and maintenance of the second buckling plate 134, the frame 11 and other components are convenient.

[0055] In some embodiments, the snap-fit ​​assembly body 132 , the first snap-fit ​​plate 133 , and the second snap-fit ​​plate 134 may be an integrally formed structure to enhance the structural integrity of the snap-fit ​​assembly 13 and thereby enhance the snap-fitting and fixing effect of the snap-fit ​​assembly 13 on the circuit board assembly 12 .

[0056] Among them, the snap-fit ​​assembly body 132 includes a pressure plate and a reinforcement plate. The above-mentioned first snap-fit ​​plate 133 and second snap-fit ​​plate 134 can be extended from the two opposite side edges of the pressure plate. The reinforcement plate is used to enhance the structural strength of the pressure plate, thereby enhancing the snap-fit ​​fixing effect of the snap-fit ​​assembly 13 on the circuit board assembly 12.

[0057] Alternatively, as Figure 4 and Figure 5 As shown, the buckle structure 131 is a first bent structure extending from a first side edge of the first buckle plate 133 , and the first side edge is the side edge of the first buckle plate 133 facing the battery compartment side wall 114 ;

[0058] The buckle slot 113 includes a third receiving slot 1131 adapted to the first bending structure and a buckle through hole 1132 provided through the battery compartment side wall 114;

[0059] The first bending structure cooperates with the buckling groove 113 , and the end of the first bending structure extends into the buckling through hole 1132 and abuts against the inner wall of the buckling through hole 1132 .

[0060] In this embodiment, the first bent structure and the buckling groove 113 are buckled together by abutting the end of the first bent structure against the inner wall of the buckling through-hole 1132. Furthermore, by configuring the buckling through-hole 1132 as a through-hole extending through the battery compartment side wall 114, the space occupied by the buckling projection corresponding to the buckling groove 113 within the first receiving groove 111 can be further reduced, thereby further reducing the impact of the buckling projection corresponding to the buckling groove 113 on the movement performance of the hinge structure 30.

[0061] The first bending structure can be understood as a bending structure after one bending, so as to form a corresponding buckle position, thereby achieving a matching connection with the buckle groove 113 .

[0062] The size of the third receiving groove 1131 matches the size of the first bending structure, so that the end of the first bending structure can be assembled into the buckling through hole 1132 .

[0063] In some embodiments, the length of the buckle slot 113 in the X direction may be 1 to 2 mm, so as to reduce the space occupied by the buckle protrusion corresponding to the buckle slot 113 in the first receiving slot 111 .

[0064] During the assembly process of the bracket slide rail of the hinge structure 30, there is a certain assembly margin between the bracket slide rail and the battery compartment side wall 114; therefore, when the buckle groove 113 is set on the battery compartment side wall 114, the buckle protrusion corresponding to the buckle groove 113 does not occupy the assembly space of the bracket slide rail in the first receiving groove 111, thereby achieving the purpose of improving the movement performance of the hinge structure 30.

[0065] In the process of forming the snap groove 113 on the side wall 114 of the battery compartment, the groove can be cut using a T-type milling cutter. Compared with forming the snap groove at a position other than the side wall, the T-type milling cutter has a larger processing space and can use a larger tool to shorten the processing time and reduce production costs.

[0066] Optionally, the third receiving groove 1131 is connected to the battery receiving cavity 115 of the frame 11 via a buckling through hole 1132 .

[0067] In this embodiment, since the battery receiving cavity 115 for receiving the battery itself has good waterproof performance, by providing a buckle groove 113 on the battery compartment side wall 114, not only can the waterproof requirement of the buckle groove 113 be met, but the wall thickness of the battery compartment side wall 114 can also be shared as the buckling space of the buckle structure 131, thereby saving the space of a waterproof bulge and the space of the wall thickness of the battery compartment side wall 114, that is, the space occupied by the buckle bulge corresponding to the buckle groove 113 in the first receiving groove 111 can be further reduced.

[0068] Optionally, the first folding portion 10 further includes an elastic pre-pressed layer 14 , and the elastic pre-pressed layer 14 wraps the first bending structure.

[0069] In this embodiment, by wrapping the elastic pre-compression layer 14 on the surface of the first bending structure, the problem of insufficient or over-precompression of the snap-fit ​​component 13 can be avoided, and the stability of the snap-fit ​​connection between the snap-fit ​​component 13 and the frame 11 can be improved.

[0070] Furthermore, the elastic pre-compression layer 14 can be used to absorb the accumulated tolerance of the entire structure during the assembly process and improve the connection stability of the entire structure.

[0071] In some embodiments, the elastic pre-pressed layer 14 may be a pre-pressed layer structure such as a foam layer or a silicone layer.

[0072] Optionally, a second side edge of the snap-fit ​​assembly body 132 is provided with a second bending structure 1321 , and the second bending structure 1321 is provided toward the depth direction of the second receiving groove 112 , and the second side edge is the side edge of the snap-fit ​​assembly body 132 away from the battery compartment side wall 114 .

[0073] In this embodiment, a second bending structure 1321 is provided on the second side edge of the snap-fit ​​assembly body 132 in the depth direction of the second receiving groove 112, so that the second bending structure 1321 interferes with the side wall of the second receiving groove 112 and constitutes a rotation limit for the snap-fit ​​assembly body 132 to prevent the snap-fit ​​assembly body 132 from rotating.

[0074] Moreover, by forming the second bending structure 1321 to constitute a rotation limit for the snap-fit ​​assembly body 132, the space of the second receiving groove 112 in the thickness direction of the first folding portion 10 can be saved, that is, the space of the second receiving groove 112 in the Z-axis direction can be saved.

[0075] Optionally, the length of the second bending structure 1321 in the depth direction of the second receiving groove 112 is greater than the thickness of the fastening component body 132. This arrangement not only ensures the rotation limiting strength of the fastening component body 132, but also saves space in the thickness direction of the second receiving groove 112 of the first folding portion 10.

[0076] In some embodiments, the length of the second bending structure 1321 in the depth direction of the second receiving groove 112 may be twice the thickness of the fastening component body 132 .

[0077] Optionally, the circuit board assembly 12 includes a first circuit board 121 , a BTB connector 122 , and a second circuit board 123 , and the snap-fit ​​assembly body 132 is disposed in contact with the second circuit board 123 ;

[0078] The flexible connection portion 1231 of the second circuit board 123 and the second fastening plate 134 are arranged in parallel on the first plane, and the first plane is the horizontal plane where the fastening component body 132 is located.

[0079] In this embodiment, by distributing the flexible connection portion 1231 of the second circuit board 123 and the second snap-fit ​​plate 134 side by side within the first surface, it is possible to avoid the need for assembly parts such as screws to pass through the flexible connection portion 1231 when fixing the second snap-fit ​​plate 134 to the frame 11, and to avoid forming a receiving groove on the frame 11 for accommodating the stacked flexible connection portion 1231 and the second snap-fit ​​plate 134. Only a receiving groove needs to be provided to separately accommodate the flexible connection portion 1231 or the second snap-fit ​​plate 134, which effectively reduces the depth of the receiving groove for accommodating the flexible connection portion 1231 or the second snap-fit ​​plate 134, that is, reduces the space occupied by the bulge corresponding to the receiving groove within the first receiving groove 111.

[0080] Moreover, by disposing the flexible connection portion 1231 of the second circuit board 123 and the second buckling plate 134 in parallel, the design size of the second buckling plate 134 can be reduced, and the accommodation space of the second buckling plate 134 on the frame 11 can be reduced.

[0081] Furthermore, the first projection and the second projection are diagonally distributed within the first surface, the first projection is the projection of the first snapping plate 133 within the first surface, and the second projection is the projection of the second snapping plate 134 within the first surface, that is, by distributing the fixing parts (such as screws) corresponding to the snapping structure 131 and the second snapping plate 134 diagonally, the depth of the receiving groove for accommodating the flexible connection part 1231 or the second snapping plate 134 can be further reduced, and the space occupied by the bulge corresponding to the receiving groove within the first receiving groove 111 can be reduced, thereby achieving the purpose of improving the movement performance of the hinge structure 30.

[0082] Optionally, a first positioning structure 116 is provided on the frame 11 , and a second positioning structure 135 adapted to the first positioning structure 116 is provided on the snap-fit ​​assembly 13 . The first positioning structure 116 and the second positioning structure 135 cooperate, and the snap-fit ​​assembly 13 is fixedly assembled on the frame 11 .

[0083] In this embodiment, by providing the first positioning structure 116 and the second positioning structure 135 , the assembly efficiency and assembly accuracy of the snap-fit ​​assembly 13 and the frame 11 can be improved, and the connection stability of the assembled structural parts can be improved.

[0084] Among them, the first positioning structure 116 can be a positioning column set on the frame 11, and the second positioning structure 135 can be a positioning hole set on the snap-fit ​​component 13 and adapted to the positioning column; or, the first positioning structure 116 can be a positioning hole set on the frame 11, and the second positioning structure 135 can be a positioning column set on the snap-fit ​​component 13 and adapted to the positioning hole.

[0085] The second positioning structure 135 can be disposed on the first fastening plate 133 of the fastening assembly 13 .

[0086] It can be understood that the related structures included in the above-mentioned first folding part 10 can also be applied to the second folding part 20, and when the above-mentioned buckle structure, buckle groove and other structures are applied to the second folding part 20, the same technical effect can be achieved, which will not be repeated here.

[0087] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0088] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: a first folding portion, a second folding portion, and a hinge structure, wherein the first folding portion and the second folding portion are rotatably connected via the hinge structure; The first folding portion includes a frame, a circuit board assembly, and a buckling assembly. The frame includes a first receiving groove and a second receiving groove disposed opposite to each other. The first receiving groove and the second receiving groove are distributed along the thickness direction of the first folding portion. The hinge structure is partially received in the first receiving groove. The circuit board assembly is buckled and received in the second receiving groove by the buckling assembly. The snap-fit ​​assembly is provided with a snap-fit ​​structure, and a snap-fit ​​groove adapted to the snap-fit ​​structure is provided on the battery compartment side wall of the frame body. The snap-fit ​​structure and the snap-fit ​​groove cooperate to snap-fit ​​and fix the circuit board assembly on the frame body; the snap-fit ​​assembly includes a snap-fit ​​assembly body provided to fit the circuit board assembly, and a first snap-fit ​​plate extending from one side edge of the snap-fit ​​assembly body; the snap-fit ​​structure is provided on the first snap-fit ​​plate and is located on the side of the first snap-fit ​​plate facing the battery compartment side wall.

2. The electronic device according to claim 1, wherein The buckle structure is a first bent structure extending from a first side edge of the first buckle plate, and the first side edge is a side edge of the first buckle plate facing the side wall of the battery compartment; The buckle slot includes a third receiving slot adapted to the first bending structure and a buckle through hole provided through the side wall of the battery compartment; The first bending structure cooperates with the buckle slot, and the end of the first bending structure extends into the buckle through hole and abuts against the inner wall of the buckle through hole.

3. The electronic device according to claim 2, wherein: The third receiving slot is communicated with the battery receiving cavity of the frame body through the buckle through hole.

4. The electronic device according to claim 2, wherein: The first folding portion further includes an elastic pre-pressing layer, and the elastic pre-pressing layer wraps the first bending structure; The elastic pre-pressed layer includes a foam layer or a silicone layer.

5. The electronic device according to claim 1, wherein A second bending structure is provided on the second side edge of the buckling component body, and the second bending structure is arranged toward the depth direction of the second receiving groove. The second side edge is the side edge of the buckling component body away from the side wall of the battery compartment.

6. The electronic device according to claim 5, characterized in that The length of the second bending structure in the depth direction of the second receiving groove is greater than the thickness of the fastening component body.

7. The electronic device according to any one of claims 1 to 6, characterized in that: The fastening assembly further includes a second fastening plate extending from the other side edge of the fastening assembly body, and the second fastening plate and the first fastening plate are respectively located on opposite sides of the fastening assembly body; The second buckling plate is provided with a first positioning hole, the frame is provided with a second positioning hole adapted to the first positioning hole, and the first positioning hole and the second positioning hole are connected by screws.

8. The electronic device according to claim 7, wherein: The circuit board assembly includes a first circuit board, a board-to-board (BTB) connector, and a second circuit board, and the snap-fit ​​assembly body is arranged to fit the second circuit board; The flexible connection portion of the second circuit board and the second fastening plate are distributed side by side in a first plane, and the first plane is a horizontal plane where the fastening component body is located.

9. The electronic device according to claim 8, wherein: The first projection and the second projection are diagonally distributed in the first plane; The first projection is a projection of the first fastening plate on the first surface; The second projection is a projection of the second fastening plate on the first surface.

10. The electronic device according to any one of claims 1 to 6, characterized in that: The frame is provided with a first positioning structure, and the buckle assembly is provided with a second positioning structure adapted to the first positioning structure. The first positioning structure cooperates with the second positioning structure, and the buckle assembly is positioned and assembled on the frame.

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