Solder heating temperature control method based on visual recognition

Abstract

The present invention provides a solder heating temperature control method based on visual recognition, which collects and analyzes a soldering gap image to obtain soldering gap state information, thereby ensuring that the soldering gap is accurately and quantitatively filled with solder, thereby improving the utilization efficiency of the solder; according to the respective melting point temperature information of the solder and the brazing base material, the heating temperature of the solder is determined, and the heating temperature state of a heating device that performs a melting process on the solder is adjusted, thereby ensuring that the solder can be stably heated within a corresponding temperature range, thereby improving the diffusion uniformity between the solder and the base material; collecting and analyzing a soldering process image to obtain filling state information of the solder in the soldering gap, thereby adjusting the heating position state of the heating device, thereby improving the heating uniformity of the solder; when the brazing of the soldering gap is completed, the heating temperature state of the heating device is adjusted again, thereby ensuring that the temperature inside the solder gradually and stably decreases, thereby improving the mechanical strength of the solder after cooling and solidification.

Description

Technical Field

[0001] The present invention relates to the technical field of brazing operations, and in particular to a brazing material heating temperature control method based on visual recognition. Background Art

[0002] Brazing uses a filler metal with a lower melting point than the parent metal. After the filler metal is heated and melted, the liquid filler metal wets the parent metal, fills the gaps in the joint, and diffuses into the metal, thus joining the parts. Low brazing temperatures minimize the impact on the properties of the parent metal, resulting in a smooth joint surface and minimal deformation of the welded parts, ensuring an aesthetically pleasing finish. The temperature of the filler metal directly impacts the quality of the brazing. If the temperature is too low, the filler metal fails to transform into a liquid state, preventing uniform and comprehensive diffusion within the parent metal, weakening the bond between the two materials. If the temperature is too high, the parent metal can also melt, deforming it and compromising the original structure of the weld. During the brazing process, the filler metal's heating temperature must be precisely controlled to prevent sudden temperature changes during heating. This ensures uniform and stable heating, improves diffusion efficiency within the parent metal, and enhances the stability of the bond between the two materials. Summary of the Invention

[0003] In response to the defects of the prior art, the present invention provides a solder heating temperature control method based on visual recognition, which collects and analyzes the solder gap image to obtain the solder gap status information, thereby ensuring that the solder gap is accurately and quantitatively filled with solder, thereby improving the utilization efficiency of the solder; according to the melting point temperature information of the solder and the brazing base material, the heating temperature of the solder is determined, and the heating temperature state of the heating device that performs the melting treatment on the solder is adjusted, thereby ensuring that the solder can be stably heated within the corresponding temperature range, thereby improving the diffusion uniformity between the solder and the base material; collecting and analyzing the brazing process image to obtain the filling state information of the solder in the brazing gap, thereby adjusting the heating position state of the heating device, and improving the heating uniformity of the solder; when the brazing of the brazing gap is completed, the heating temperature state of the heating device is adjusted again, thereby ensuring that the temperature inside the solder gradually and stably decreases, thereby improving the mechanical strength of the solder after cooling and solidification, thereby increasing the bonding stability and strength of the solder and the base material.

[0004] The present invention provides a solder heating temperature control method based on visual recognition, comprising the following steps:

[0005] Step S1, collecting a brazing gap image, analyzing the brazing gap image to obtain brazing gap status information; and filling the corresponding brazing gap with brazing material according to the brazing gap status information;

[0006] Step S2, determining a heating temperature range for melting the solder according to the melting point temperature information of the solder and the brazing base material; adjusting the heating temperature of the heating device performing the melting process according to the actual temperature of the solder during the melting process;

[0007] Step S3, collecting a brazing process image of the brazing gap, analyzing the brazing process image to obtain filling state information of the brazing material in the brazing gap; and adjusting the heating position state of the heating device according to the filling state information;

[0008] Step S4: After the brazing of the brazing gap is completed, the heating temperature state of the heating device is adjusted again.

[0009] Furthermore, in step S1, a brazing gap image is collected and analyzed to obtain brazing gap status information, including:

[0010] Performing binocular photography on the brazing gap to obtain a binocular image of the brazing gap; and obtaining a three-dimensional image of the brazing gap based on the binocular parallax of the binocular image of the brazing gap;

[0011] The boundary contour of the brazing gap is identified from the three-dimensional image of the brazing gap, and the distribution position information of the brazing gap in the object to be brazed and the gap volume information of the brazing gap are obtained based on the distribution state information of the boundary contour.

[0012] Furthermore, in the step S1, filling the corresponding brazing gap with brazing material according to the brazing gap state information includes:

[0013] Determining the volume of solder to be filled into the brazing gap according to the gap volume information of the brazing gap;

[0014] An operation posture for filling the brazing gap with solder is determined based on the distribution position information of the brazing gap in the object to be brazed.

[0015] Furthermore, in step S2, determining a heating temperature range for melting the solder according to the melting point temperature information of the solder and the brazing base material includes:

[0016] According to the liquidus line of the solder, the maximum temperature value and the minimum temperature value of the solder in the liquid state are obtained;

[0017] According to the liquidus line of the welding base material, a minimum temperature value at which the welding base material is in a liquid state is obtained;

[0018] The heating temperature range for melting the solder is determined according to the maximum temperature value and the minimum temperature value of the solder and the minimum temperature value of the welding base material.

[0019] Furthermore, in step S2, determining the heating temperature range for melting the solder according to the maximum and minimum temperatures of the solder and the minimum temperature of the welding base material includes:

[0020] Step S201, using the following formula (1), according to the maximum temperature value and the minimum temperature value of the solder, the temperature rise and fall rate of the current melting process is controlled.

[0021]

[0022] In the above formula (1), μ represents the temperature rise and fall rate of the heating temperature of the current melting process; Q max Indicates the maximum temperature value of the solder; Q min Indicates the minimum temperature value of the solder; T represents the preset change unit time;

[0023] Step S202, using the following formula (2), according to the maximum temperature value and the minimum temperature value of the solder and the heating temperature of the current melting process, controls the temperature rise and fall value of the current melting process heating temperature,

[0024]

[0025] In the above formula (2), t represents the current time; q(t) represents the current time;

[0026] If ΔQ(t) ≥ 0, it means that the heating temperature of the melting process at the current moment needs to be increased by ΔQ(t);

[0027] If ΔQ(t)<0, it means that the heating temperature of the melting process at the current moment needs to be reduced by -ΔQ(t) temperature;

[0028] Step S203, using the following formula (3), according to the current melting process heating temperature rise and fall temperature value and the current melting process heating temperature rise and fall rate, control the current melting process heating temperature rise and fall rate value,

[0029]

[0030] In the above formula (3), V represents the temperature rise and fall rate value of the heating temperature of the current melting process; | | represents the absolute value.

[0031] Furthermore, in the step S2, adjusting the heating temperature state of the heating device performing the melting process according to the actual temperature state of the solder during the melting process includes:

[0032] Collecting thermal infrared images of the solder during the melting process, analyzing the thermal infrared images, and obtaining a real-time temperature distribution state within the solder during the melting process;

[0033] According to the real-time temperature distribution state, the heating device performing the melting process is instructed to adjust the actual heating temperature and the heating temperature change rate of the solder within the heating temperature range, so that the solder can be melted uniformly.

[0034] Furthermore, in step S3, a brazing process image of the brazing gap is collected, and the brazing process image is analyzed to obtain filling state information of the brazing material in the brazing gap, including:

[0035] The brazing gap is panoramically photographed during the brazing operation to obtain a brazing process image; the brazing process image is analyzed to obtain liquid solder distribution status information inside the brazing gap, and based on the liquid solder distribution status information, position information of a liquid solder-filled missing area inside the brazing gap and area information of the liquid solder-filled missing area are determined.

[0036] Furthermore, in step S3, adjusting the heating position state of the heating device according to the filling state information includes:

[0037] Instructing the heating device to heat the liquid solder-filled missing area according to the position information of the liquid solder-filled missing area in the brazing gap;

[0038] According to the area information of the liquid solder filling missing area in the brazing gap, the heating device is instructed to adjust the heating area of ​​the liquid solder filling missing area.

[0039] Furthermore, in the step S4, after the brazing of the brazing gap is completed, the heating temperature state of the heating device is adjusted again, including:

[0040] After the brazing of the brazing gap is completed, the heating device is instructed to gradually reduce the heating temperature of the brazing material according to a preset cooling rate.

[0041] Compared with the existing technology, the solder heating temperature control method based on visual recognition collects and analyzes the soldering gap image to obtain the soldering gap status information, so as to ensure that the soldering gap is filled with solder accurately and quantitatively, thereby improving the utilization efficiency of the solder; according to the melting point temperature information of the solder and the brazing base material, the heating temperature of the solder is determined, and the heating temperature state of the heating device that performs the melting treatment on the solder is adjusted, so as to ensure that the solder can be stably heated within the corresponding temperature range, thereby improving the diffusion uniformity between the solder and the base material; collects and analyzes the soldering process image to obtain the filling state information of the solder in the soldering gap, thereby adjusting the heating position state of the heating device and improving the heating uniformity of the solder; when the brazing of the soldering gap is completed, the heating temperature state of the heating device is adjusted again, thereby ensuring that the temperature inside the solder gradually and stably decreases, thereby improving the mechanical strength of the solder after cooling and solidification, thereby increasing the bonding stability and strength of the solder and the base material.

[0042] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purposes and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0043] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0045] Figure 1 A schematic flow chart of the solder heating temperature control method based on visual recognition provided by the present invention. DETAILED DESCRIPTION

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0047] See Figure 1, is a flow chart of a solder heating temperature control method based on visual recognition provided by an embodiment of the present invention. The solder heating temperature control method based on visual recognition comprises the following steps:

[0048] Step S1, collecting a brazing gap image, analyzing the brazing gap image to obtain brazing gap status information; and filling the corresponding brazing gap with brazing material according to the brazing gap status information;

[0049] Step S2, determining a heating temperature range for melting the solder according to the melting point temperature information of the solder and the brazing base material; adjusting the heating temperature of the heating device for performing the melting process according to the actual temperature of the solder during the melting process;

[0050] Step S3, collecting a brazing process image of the brazing gap, analyzing the brazing process image to obtain filling state information of the brazing material in the brazing gap; and adjusting the heating position state of the heating device according to the filling state information;

[0051] Step S4: After the brazing of the brazing gap is completed, the heating temperature state of the heating device is adjusted again.

[0052] The beneficial effects of the above technical solution are as follows: the solder heating temperature control method based on visual recognition collects and analyzes the soldering gap image to obtain the soldering gap state information, thereby ensuring that the soldering gap is accurately and quantitatively filled with solder, thereby improving the utilization efficiency of the solder; according to the respective melting point temperature information of the solder and the brazing base material, the heating temperature of the solder is determined, and the heating temperature state of the heating device that performs the melting treatment on the solder is adjusted, thereby ensuring that the solder can be stably heated within the corresponding temperature range, thereby improving the diffusion uniformity between the solder and the base material; collecting and analyzing the brazing process image to obtain the filling state information of the solder in the brazing gap, thereby adjusting the heating position state of the heating device, and improving the heating uniformity of the solder; when the brazing of the brazing gap is completed, the heating temperature state of the heating device is adjusted again, thereby ensuring that the temperature inside the solder gradually and stably decreases, thereby improving the mechanical strength of the solder after cooling and solidification, thereby increasing the bonding stability and strength of the solder and the base material.

[0053] Preferably, in step S1, collecting a brazing gap image and analyzing the brazing gap image to obtain brazing gap status information includes:

[0054] The brazing gap is photographed binocularly to obtain a binocular image of the brazing gap; and a three-dimensional image of the brazing gap is obtained based on the binocular parallax of the binocular image of the brazing gap;

[0055] The boundary contour of the brazing gap is identified from the three-dimensional image of the brazing gap, and the distribution position information of the brazing gap in the object to be brazed and the gap volume information of the brazing gap are obtained based on the distribution state information of the boundary contour.

[0056] The beneficial effects of the above technical solution are as follows: a brazing gap is formed on the object to be brazed. During the brazing operation, brazing filler metal is filled into the brazing gap, which is then heated and melted, allowing the filler metal to diffuse into the base material of the object to be brazed, thereby achieving the brazing operation. The brazing gap is photographed binocularly to obtain a corresponding three-dimensional image of the brazing gap. The shape and size of the brazing gap are quantitatively calibrated, and the distribution position information of the brazing gap in the object to be brazed and the gap volume information of the brazing gap are further determined. This facilitates the subsequent accurate filling of the brazing gap with an appropriate volume of brazing filler metal, thereby avoiding waste of brazing filler metal.

[0057] Preferably, in step S1, filling the corresponding brazing gap with solder according to the brazing gap state information includes:

[0058] Determining the volume of solder to be filled into the brazing gap according to the gap volume information of the brazing gap;

[0059] According to the distribution position information of the brazing gap in the object to be brazed, the operation posture of filling the brazing gap with solder is determined.

[0060] The beneficial effects of the above technical solution are: based on the gap volume information of the brazing gap, the appropriate volume of solder is filled into the brazing gap, effectively improving the utilization efficiency of the solder and avoiding the unevenness of the brazing gap caused by excessive solder. In addition, based on the distribution position information of the brazing gap in the object to be brazed, the operation posture for filling the brazing gap with solder is determined, ensuring the precise filling of the brazing gap with solder.

[0061] Preferably, in step S2, determining the heating temperature range for melting the solder according to the melting point temperature information of the solder and the brazing base material includes:

[0062] According to the liquidus line of the solder, the maximum temperature value and the minimum temperature value of the solder in the liquid state are obtained;

[0063] According to the liquidus line of the welding base material, the minimum temperature value at which the welding base material is in a liquid state is obtained;

[0064] The heating temperature range for melting the solder is determined based on the maximum and minimum temperatures of the solder and the minimum temperature of the welding base material.

[0065] The beneficial effects of the above technical solution are as follows: different types of solders have different liquidus lines, and the liquidus line serves as the temperature change curve corresponding to the process of the solder being transformed from a solid state to a liquid state, and the liquidus line contains a maximum temperature value and a minimum temperature value at which the solder is in a liquid state. It is understandable that when the solder is at the minimum temperature value, the solder is just transformed from a solid state to a liquid state, and when the solder is at the maximum temperature, the solder will be in an unstable liquid state. If the temperature continues to rise, the solder will be transformed into a gaseous state. At the same time, the welding base material of the object to be welded also has its own corresponding liquidus line. During the brazing process, it is not only necessary to heat and melt the solder into a liquid state, but also to ensure that the heating temperature of the solder does not cause the welding base material to melt and deform. Therefore, according to the maximum temperature value and the minimum temperature value of the solder, and the minimum temperature value of the welding base material, the heating temperature range for the melting treatment of the solder is determined, so that heating the solder within the heating temperature range can ensure that the solder is completely melted into a liquid state, and at the same time will not have any effect on the welding base material.

[0066] Preferably, in step S2, determining the heating temperature range for melting the solder according to the maximum and minimum temperatures of the solder and the minimum temperature of the welding base material comprises:

[0067] Step S201, using the following formula (1), according to the maximum temperature value and the minimum temperature value of the solder, the temperature rise and fall rate of the current melting process is controlled.

[0068]

[0069] In the above formula (1), μ represents the temperature rise and fall rate of the heating temperature of the current melting process; Q max Indicates the maximum temperature value of the solder; Q min Indicates the minimum temperature value of the solder; t represents the preset change unit time;

[0070] Step S202, using the following formula (2), according to the maximum temperature value and the minimum temperature value of the solder and the heating temperature of the current melting process, controls the temperature rise and fall value of the current melting process.

[0071]

[0072] In the above formula (2), t represents the current time; q(t) represents the current time;

[0073] If ΔQ(t) ≥ 0, it means that the heating temperature of the melting process at the current moment needs to be increased by ΔQ(t);

[0074] If ΔQ(t)<0, it means that the heating temperature of the melting process at the current moment needs to be reduced by -ΔQ(t) temperature;

[0075] Step S203, using the following formula (3), according to the current melting process heating temperature rise and fall temperature value and the current melting process heating temperature rise and fall rate, control the current melting process heating temperature rise and fall rate value,

[0076]

[0077] In the above formula (3), V represents the temperature rise and fall rate value of the heating temperature of the current melting process; | | represents the absolute value.

[0078] The beneficial effects of the above technical solution are as follows: using the above formula (1), according to the maximum temperature value and the minimum temperature value of the solder, the temperature rise and fall rate of the heating temperature of the current melting process is controlled, so that when the range between the maximum temperature and the minimum temperature is large, it can be adjusted more quickly, and when the range between the maximum temperature and the minimum temperature is small, it can be adjusted more slowly, and the closer to the maximum temperature, the slower the speed of adjusting the temperature will be, so as to prevent the material from being damaged by adjusting to a high temperature state too quickly; then using the above formula (2), according to the maximum temperature value and the minimum temperature value of the solder and the heating temperature of the current melting process, the temperature rise and fall value of the heating temperature of the current melting process is controlled, so that the heating temperature of the melting process can be stabilized at the middle value between the maximum temperature and the minimum temperature, thereby ensuring the reliability and stability of the system; finally, using the above formula (3), according to the temperature rise and fall value of the heating temperature of the current melting process and the temperature rise and fall rate of the heating temperature of the current melting process, the temperature rise and fall rate value of the heating temperature of the current melting process is controlled, thereby achieving the above-mentioned temperature adjustment and indirect control of the adjustment speed by controlling the rate, thereby ensuring the reliability of the system.

[0079] Preferably, in step S2, adjusting the heating temperature state of the heating device performing the melting process according to the actual temperature state of the solder during the melting process includes:

[0080] Collecting thermal infrared images of the solder during the melting process, analyzing the thermal infrared images, and obtaining a real-time temperature distribution state within the solder during the melting process;

[0081] According to the real-time temperature distribution state, the heating device performing the melting process is instructed to adjust the actual heating temperature and the heating temperature change rate of the solder within the heating temperature range so that the solder can be melted uniformly.

[0082] The beneficial effects of the above technical solution are: during the heating and melting process of the solder, the thermal infrared image of the solder is collected, and the thermal infrared image is analyzed to obtain the real-time temperature distribution state of the solder itself during the melting process. In this way, the heating and temperature rise state of different areas inside the solder itself during the heating and melting process can be quantified and determined, which facilitates the subsequent targeted adjustment of the actual heating temperature and heating temperature change rate of the solder by the heating device, ensuring that the solder can be evenly heated and undergo uniform diffusion interaction with the welding base material.

[0083] Preferably, in step S3, collecting a brazing process image of the brazing gap, analyzing the brazing process image, and obtaining filling state information of the brazing material in the brazing gap include:

[0084] A panoramic shot of the brazing gap during the brazing operation is taken to obtain a brazing process image; the brazing process image is analyzed to obtain liquid solder distribution status information inside the brazing gap, and based on the liquid solder distribution status information, position information of the liquid solder-filled missing area inside the brazing gap and area information of the liquid solder-filled missing area are determined.

[0085] The beneficial effect of the above technical solution is that when the solder is heated and melted into a liquid state, the liquid solder will flow inside the brazing gap to fill the internal space of the brazing gap. However, the fluidity of the liquid solder is effective (generally speaking, the higher the temperature, the better the fluidity of the liquid solder), and it is inevitable that there will be areas inside the brazing gap that cannot be filled with the liquid solder. By taking a panoramic shot of the brazing gap during the brazing operation and analyzing the brazing process image, the location and area of ​​the area inside the brazing gap that cannot be effectively filled with the solder can be accurately determined, which facilitates the subsequent adjustment of the heating temperature so that the solder can quickly fill the corresponding missing area.

[0086] Preferably, in step S3, adjusting the heating position state of the heating device according to the filling state information includes:

[0087] According to the position information of the liquid solder filling missing area in the brazing gap, the heating device is instructed to heat the liquid solder filling missing area;

[0088] According to the area information of the liquid solder filling missing region inside the brazing gap, the heating device is instructed to adjust the heating area of ​​the liquid solder filling missing region.

[0089] The beneficial effects of the above technical solution are as follows: based on the location information of the missing area filled by the liquid solder within the brazing gap, the heating device is instructed to heat the missing area with the liquid solder, thereby increasing the fluidity of the corresponding missing area, so that the solder can quickly fill the missing area. In addition, based on the area information of the missing area filled by the liquid solder within the brazing gap, the heating device is instructed to adjust the heating area of ​​the missing area filled by the liquid solder, which can effectively increase the temperature of the solder near the missing area, increase the fluidity of the corresponding solder, and thus quickly fill the missing area with the solder.

[0090] Preferably, in step S4, after the brazing of the brazing gap is completed, the heating temperature state of the heating device is adjusted again, including:

[0091] After the brazing of the brazing gap is completed, the heating device is instructed to gradually reduce the heating temperature of the brazing material according to a preset cooling rate.

[0092] The beneficial effect of the above technical solution is: through the above method, after the brazing of the brazing gap is completed, the heating device is instructed to gradually reduce the heating temperature of the brazing material according to the preset cooling rate, so that the brazing material can be slowly cooled down and continue to diffuse with the welding base material during the cooling process, thereby improving the bonding stability between the brazing material and the welding base material.

[0093] From the contents of the above embodiments, it can be seen that the solder heating temperature control method based on visual recognition collects and analyzes the soldering gap image to obtain the soldering gap state information, so as to ensure that the soldering gap is accurately and quantitatively filled with solder, thereby improving the utilization efficiency of the solder; according to the melting point temperature information of the solder and the brazing base material, the heating temperature of the solder is determined, and the heating temperature state of the heating device that performs the melting treatment on the solder is adjusted, thereby ensuring that the solder can be stably heated within the corresponding temperature range, thereby improving the diffusion uniformity between the solder and the base material; collecting and analyzing the brazing process image to obtain the filling state information of the solder in the brazing gap, thereby adjusting the heating position state of the heating device and improving the heating uniformity of the solder; when the brazing of the brazing gap is completed, the heating temperature state of the heating device is adjusted again, thereby ensuring that the temperature inside the solder gradually and stably decreases, thereby improving the mechanical strength of the solder after cooling and solidification, thereby increasing the bonding stability and strength of the solder and the base material.

[0094] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A solder heating temperature control method based on visual recognition, characterized in that: The steps include: Step S1, collecting a brazing gap image, analyzing the brazing gap image to obtain brazing gap status information; and filling the corresponding brazing gap with brazing material according to the brazing gap status information; Step S2, determining a heating temperature range for melting the solder according to the melting point temperature information of the solder and the brazing base material; adjusting the heating temperature of the heating device performing the melting process according to the actual temperature of the solder during the melting process; Step S3, collecting a brazing process image of the brazing gap, analyzing the brazing process image to obtain filling state information of the brazing material in the brazing gap; and adjusting the heating position state of the heating device according to the filling state information; Step S4, after the brazing of the brazing gap is completed, adjusting the heating temperature state of the heating device again; Wherein, in the step S2, determining the heating temperature range for melting the solder according to the melting point temperature information of the solder and the brazing base material includes: According to the liquidus line of the solder, the maximum temperature value and the minimum temperature value of the solder in the liquid state are obtained; According to the liquidus line of the brazing base material, a minimum temperature value at which the brazing base material is in a liquid state is obtained; Determining a heating temperature range for melting the solder according to the maximum and minimum temperatures of the solder and the minimum temperature of the solder base material includes: Step S201, using the following formula (1), according to the maximum temperature value and the minimum temperature value of the solder, the temperature rise and fall rate of the current melting process is controlled. （1） In the above formula (1), Indicates the temperature rise and fall rate of the heating temperature of the current melting process; Indicates the maximum temperature value of the solder; Indicates the minimum temperature value of the solder; Table preset change unit time; Step S202, using the following formula (2), according to the maximum temperature value and the minimum temperature value of the solder and the heating temperature of the current melting process, controls the temperature rise and fall value of the current melting process heating temperature, （2） In the above formula (2), represents the rising and falling temperature value of the heating temperature of the melting process at the current moment; Indicates the current moment; Indicates the heating temperature of the melting process at the current moment; like , it means that the heating temperature of the melting process needs to be increased temperature; like , it means that the heating temperature of the melting process needs to be reduced at the current moment temperature; Step S203, using the following formula (3), according to the current melting process heating temperature rise and fall temperature value and the current melting process heating temperature rise and fall rate, control the current melting process heating temperature rise and fall rate value, （3） In the above formula (3), Indicates the temperature rise and fall rate value of the current melting process heating temperature; Indicates finding the absolute value.

2. The solder heating temperature control method based on visual recognition according to claim 1, characterized in that: In step S1, a brazing gap image is collected and analyzed to obtain brazing gap status information, including: Performing binocular photography on the brazing gap to obtain a binocular image of the brazing gap; and obtaining a three-dimensional image of the brazing gap based on the binocular parallax of the binocular image of the brazing gap; The boundary contour of the brazing gap is identified from the three-dimensional image of the brazing gap, and the distribution position information of the brazing gap in the object to be brazed and the gap volume information of the brazing gap are obtained based on the distribution state information of the boundary contour.

3. The solder heating temperature control method based on visual recognition according to claim 2, characterized in that: In the step S1, filling the corresponding brazing gap with brazing material according to the brazing gap state information includes: Determining the volume of solder to be filled into the brazing gap according to the gap volume information of the brazing gap; An operation posture for filling the brazing gap with solder is determined based on the distribution position information of the brazing gap in the object to be brazed.

4. The solder heating temperature control method based on visual recognition according to claim 1, characterized in that: In the step S2, adjusting the heating temperature state of the heating device performing the melting process according to the actual temperature state of the solder during the melting process includes: Collecting thermal infrared images of the solder during the melting process, analyzing the thermal infrared images, and obtaining a real-time temperature distribution state within the solder during the melting process; According to the real-time temperature distribution state, the heating device performing the melting process is instructed to adjust the actual heating temperature and the heating temperature change rate of the solder within the heating temperature range, so that the solder can be melted uniformly.

5. The solder heating temperature control method based on visual recognition according to claim 1, characterized in that: In the step S3, a brazing process image of the brazing gap is collected, and the brazing process image is analyzed to obtain filling state information of the brazing material in the brazing gap, including: The brazing gap is panoramically photographed during the brazing operation to obtain a brazing process image; the brazing process image is analyzed to obtain liquid solder distribution status information inside the brazing gap, and based on the liquid solder distribution status information, position information of a liquid solder-filled missing area inside the brazing gap and area information of the liquid solder-filled missing area are determined.

6. The solder heating temperature control method based on visual recognition according to claim 5, characterized in that: In step S3, adjusting the heating position state of the heating device according to the filling state information includes: Instructing the heating device to heat the liquid solder-filled missing area according to the position information of the liquid solder-filled missing area in the brazing gap; According to the area information of the liquid solder filling missing area in the brazing gap, the heating device is instructed to adjust the heating area of ​​the liquid solder filling missing area.

7. The solder heating temperature control method based on visual recognition according to claim 1, characterized in that: In the step S4, after the brazing of the brazing gap is completed, the heating temperature state of the heating device is adjusted again, including: After the brazing of the brazing gap is completed, the heating device is instructed to gradually reduce the heating temperature of the brazing material according to a preset cooling rate.

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