A jet impingement type semiconductor refrigeration device and cooling method thereof

Abstract

The present invention discloses a jet-impact semiconductor refrigeration device, comprising a semiconductor refrigeration body embedded in a cooling body. A jet-impact cooling channel is provided within the cooling body, forming a jet-impact cooling structure between the jet-impact cooling channel and the semiconductor refrigeration body. A cooling method for the jet-impact semiconductor refrigeration device is also disclosed. The jet-impact semiconductor refrigeration device has a compact and simple structure. The jet-impact cooling structure allows coolant to maximize contact with the semiconductor refrigeration body and quickly separate after impact contact, rapidly removing heat. This effectively improves the heat dissipation and cooling capabilities of the semiconductor refrigeration body, while also saving energy and achieving efficient utilization of electrical energy.

Description

Technical Field

[0001] The present invention relates to the intersecting fields of semiconductor refrigeration, fluid machinery and thermal energy utilization, and in particular to a jet impact type semiconductor refrigeration device and a cooling method thereof. Background Art

[0002] As an emerging refrigeration application technology, semiconductor refrigeration technology has many advantages over traditional compressor refrigeration technology, such as no noise, small size, easy application and easy maintenance. It has been widely used in medical laboratory instruments, weapons and equipment, special test instruments and daily life.

[0003] With the rapid development of semiconductor refrigeration technology, semiconductor refrigeration technology has been widely used and recognized, but the current jet impact semiconductor refrigeration device is mainly limited to natural heat dissipation of the hot surface radiator and forced heat dissipation of the hot surface radiator plus fan combination; there are generally defects such as high hot surface temperature or large hot surface size, which leads to the semiconductor refrigeration sheet not being able to perform its cooling performance well. However, this is ultimately the result of poor heat dissipation of the hot surface.

[0004] There are also technical solutions for cooling hot surfaces in the prior art. For example, a Chinese patent document (publication date: 2022-08-23, publication number: CN217274936U) discloses a TEC semiconductor refrigeration plate integrated with multiple reaction tables, including a fixed seat, a cooling channel is opened in the inner cavity of the fixed seat, and a mounting platform is fixed on the top and top of the fixed seat, and a placement groove is opened on the mounting platform. The semiconductor refrigeration plate body is arranged in the placement groove, and a cooling plate is provided on the top of the mounting platform. The cooling plates are fixedly connected by threaded rods.

[0005] The above technical solution cools the heat-generating end of the semiconductor refrigeration chip by injecting a coolant into the cooling channel and circulating the coolant. Although this technical solution can also improve the heat dissipation effect of the semiconductor refrigeration chip, it still cannot meet the requirement of efficient heat dissipation of the semiconductor refrigeration chip. Summary of the Invention

[0006] The purpose of the present invention is to solve the problems of poor heat dissipation effect of existing semiconductor refrigeration plates, and to provide a jet impact type semiconductor refrigeration device and its cooling method that can greatly improve the heat dissipation capacity of the hot surface of the jet impact type semiconductor refrigeration device, thereby improving the cooling capacity of the cold surface of the jet impact type semiconductor refrigeration device, and correspondingly can also make the input electrical energy achieve the purpose of energy saving and high efficiency.

[0007] The technical solution adopted by the present invention to achieve its first invention purpose is: a jet impact type semiconductor refrigeration device, including a semiconductor refrigeration body, the semiconductor refrigeration body is embedded in a cooling body, a jet impact cooling channel is provided inside the cooling body, and a jet impact cooling structure is formed between the jet impact cooling channel and the semiconductor refrigeration body. The jet-impact semiconductor refrigeration device comprises a cooling body with a jet-impact cooling channel formed within the cooling body. A jet-impact cooling structure is formed between the jet-impact cooling channel and the semiconductor refrigeration body. The jet-impact cooling structure enables jet-impact cooling of the semiconductor refrigeration body, achieving rapid cooling. Furthermore, due to the jet-impact cooling, the coolant jet directly impinges on the semiconductor refrigeration body, maximizing contact with the semiconductor refrigeration body and rapidly separating after impact, rapidly removing heat. This prevents the heated coolant from continuing to contact the semiconductor refrigeration body, which would otherwise affect the heat dissipation effect. This jet-impact cooling structure effectively enhances the heat dissipation capacity of the semiconductor refrigeration body, improves the cooling capacity of the semiconductor refrigeration body, and also saves input electrical energy, achieving efficient utilization of electrical energy. Furthermore, the jet-impact semiconductor refrigeration device has a compact and simple structure, effectively resolving the problems of prior art cooling methods that rely on circulating coolant, which fail to enhance cooling efficiency and meet the requirements for efficient heat dissipation of jet-impact semiconductor refrigeration devices.

[0008] Preferably, a jet cooling port connected to the semi-conductive refrigeration body is provided on the cooling body, a guide body is provided inside the cooling body, a guide cavity is provided inside the guide body, and a jet nozzle is provided on the guide cavity; the guide cavity, the jet nozzle and the jet cooling port form a jet impact cooling channel. Since the cooling body is used to directly cool the semiconductor refrigeration body, thereby improving the cooling effect, a jet cooling port directly connected to the semiconductor refrigeration body is provided on the cooling body to facilitate the coolant to be directly sprayed onto the heat dissipation surface of the semiconductor refrigeration body for rapid cooling. In order to form an effective jet impact, a guide body is provided inside the cooling body, a guide cavity is provided inside the guide body, and a jet nozzle is provided at the tail end of the guide cavity, thereby forming a jet impact cooling channel formed by the guide cavity, the jet nozzle, and the jet cooling port on the cooling body. The coolant enters the guide cavity from the inlet of the guide cavity, forms an impact vortex at the bottom of the guide cavity, and after entering the jet nozzle, a high-speed coolant flow or coolant vortex is generated due to the rapid pressurization, and is sprayed from the jet nozzle to the heat dissipation surface of the semiconductor refrigeration body embedded in the jet cooling port. The heat is taken away at the moment of impact contact with the heat dissipation surface of the semiconductor refrigeration body, and then quickly separated from the heat dissipation surface of the semiconductor refrigeration body to take away the heat, which greatly improves the cooling effect and the cooling effect of the semiconductor refrigeration body, while also achieving the purpose of high efficiency and energy saving.

[0009] Preferably, the jet impact cooling channel is an angled jet structure, wherein the axis of the guide cavity and the axis of the jet nozzle are arranged at an angle, and the coolant forms a vortex jet impact cooling structure through the angled jet structure. Preferably, the jet impact cooling channel is arranged as an angled jet structure, that is, the coolant flow direction of the guide cavity and the spray direction of the jet nozzle are arranged at an angle, for example, it can be preferably arranged at an angle of 90 degrees, or it can be arranged at an angle of 120 degrees. Such a structural arrangement is to meet the needs of jet impact cooling and the installation layout requirements of the jet impact semiconductor refrigeration device. When cooling, the coolant enters the jet nozzle after impacting the guide cavity and reflecting back. Due to the rapid pressurization, a high-speed coolant vortex is formed. After the coolant vortex is ejected from the jet nozzle, a vortex jet impact cooling structure is formed, which can contact the heat dissipation surface of the semiconductor refrigeration body to the greatest extent, dissipate heat quickly, and have a good cooling effect.

[0010] Preferably, a vortex channel is provided at the bottom of the guide cavity. To form a more effective vortex jet impingement cooling structure, a vortex channel is provided at the bottom of the guide cavity. After the coolant enters the guide cavity, it forms a primary vortex flow within the vortex channel. The primary vortex flow is rapidly pressurized by the jet nozzle to produce a high-speed secondary vortex flow, which is ejected to form a vortex flow. When the vortex flow is directed toward the heat dissipation surface of the semiconductor refrigeration body, it collides with the heat dissipation surface with a vortex structure, enabling more effective contact with the heat dissipation surface and rapid removal of heat.

[0011] Preferably, the jet impact cooling channel is a direct injection structure, the guide cavity and the jet nozzle are coaxially arranged, and the coolant passes through the direct injection structure to form a direct injection jet impact cooling structure. The jet impact cooling channel can also be set as a direct injection structure, that is, the guide cavity and the jet nozzle are coaxially arranged, and the cooling liquid directly enters the jet nozzle from the guide cavity. Due to the rapid pressure increase inside the jet nozzle, a high-speed coolant flow is generated, which is ejected from the jet nozzle at high speed to the heat dissipation surface of the semiconductor refrigeration body, realizing jet impact cooling. The coolant impacts the heat dissipation surface of the semiconductor refrigeration body, removes the heat therefrom, and then quickly falls back and separates from the heat dissipation surface of the semiconductor refrigeration body, thereby achieving the purpose of efficient cooling and effectively improving the cooling effect of the semiconductor refrigeration body.

[0012] Preferably, a heat dissipation reflux chamber is provided inside the cooling body, the heat dissipation reflux chamber being located outside the guide body and isolated from the jet impact cooling channel. To achieve a better cooling effect and separate the heated coolant from the ejected coolant, a heat dissipation reflux chamber is provided inside the cooling body, the heat dissipation reflux chamber being located outside the guide body and isolated from the interior of the guide chamber. The heat dissipation reflux chamber is used to recover the heated coolant after the jet impact, outputting it for reuse.

[0013] Preferably, an adsorbent is provided on the wall of the heat dissipation reflux chamber. Due to the jet impact cooling structure, hot gas or water vapor is generated during the jet impact between the coolant and the heat dissipation surface of the semiconductor refrigeration body. The hot gas or water has the characteristic of flowing upward. In order to achieve better cooling and avoid the hot gas or water vapor affecting the heat dissipation effect of the semiconductor refrigeration body, an adsorbent is provided on the wall of the heat dissipation reflux chamber near the semiconductor refrigeration body. The adsorbent has a strong heat or water vapor adsorption capacity and can quickly absorb the hot gas or water vapor generated by the jet impact onto the adsorbent, and then guide it to drip into the heat dissipation reflux chamber for reflux recycling.

[0014] Preferably, the cooling body is made of a plastic material with good thermal conductivity; the cooling body is provided with a cooling circulating liquid inlet and a cooling circulating liquid outlet, and the cooling circulating liquid inlet is connected to the guide cavity. The cooling body is responsible for cooling the semiconductor refrigeration body. Therefore, in order to accelerate the cooling effect, the cooling body is made of a plastic material with good thermal conductivity. During the circulating liquid cooling process, the heat of the cooling body itself can be absorbed and dissipated through radiation, so that the cooling body is always maintained at a relatively stable temperature. The cooling body is provided with a cooling circulating liquid inlet and a cooling circulating liquid outlet for connecting with the external circulating coolant, introducing the coolant into the cooling body, and returning the heat-carrying coolant to the external cooling system for cooling and recycling.

[0015] Preferably, the semiconductor refrigeration body includes a semiconductor refrigeration plate having a cold surface and a hot surface, a cold conduction block connected to the cold surface of the semiconductor refrigeration plate, a heat conduction plate connected to the hot surface of the semiconductor refrigeration plate, a foam frame is provided on the outside of the semiconductor refrigeration plate and the cold conduction block, the lower part of the foam frame is sealed with the heat conduction plate, and the upper part of the cold conduction block extends to the outside of the foam frame. The semiconductor refrigeration body mainly includes a semiconductor refrigeration plate. In order to effectively transfer the cold energy generated by the semiconductor refrigeration plate to the terminal object, a cold conduction block is connected to the cold surface of the semiconductor refrigeration plate. In order to transfer and dissipate the heat generated by the hot surface of the semiconductor refrigeration plate, a heat conduction plate is connected to the hot surface of the semiconductor refrigeration plate, and the connection with the refrigeration body is achieved through the heat conduction plate. In order to improve the cooling capacity of the semiconductor refrigeration plate, a foam frame is provided on the outside of the semiconductor refrigeration plate and the cold conduction block to achieve the heat preservation function and ensure that the cold energy is not wasted.

[0016] Preferably, a plurality of jet heat dissipation structures are provided on the lower surface of the heat conducting plate. In order to increase the jet impact contact surface and improve the cooling effect, a plurality of jet heat dissipation structures are provided on the lower surface of the heat conducting plate.

[0017] The technical solution adopted by the present invention to achieve the second invention object is: a cooling method for a jet impingement type semiconductor refrigeration device, comprising the following steps:

[0018] Step 1: Coolant circulation works;

[0019] Step 2: Jet impact cooling: The coolant enters the guide cavity from the cooling circulating liquid inlet, enters the jet nozzle at a certain angle or vertically, and is rapidly pressurized by the jet nozzle to form a high-speed coolant flow or coolant vortex. The coolant flow or coolant vortex shoots onto the lower plate surface of the heat transfer plate or the jet heat dissipation structure, removing the heat from the heat transfer plate;

[0020] Step 3: Reflux circulation: The coolant with heat quickly falls back after impact and gathers in the heat dissipation reflux chamber. It flows to the external environment through the cooling circulation liquid outlet to cool down and then returns to the cooling circulation liquid inlet for cyclic cooling.

[0021] This cooling method is easy to operate, is carried out in a cyclic manner, and adopts jet impact cooling, which has a good cooling effect. The coolant can contact with the semiconductor refrigeration body to the maximum extent and quickly separate after impact contact, and can quickly take away the heat, thereby avoiding the coolant with heat from continuing to contact with the semiconductor refrigeration body, affecting the heat dissipation effect, effectively improving the heat dissipation capacity and refrigeration capacity of the semiconductor refrigeration body, and also enabling the input electrical energy to achieve the purpose of energy saving, thereby realizing the efficient use of electrical energy.

[0022] Preferably, step 2 also includes the adsorption of hot air or water vapor. The hot air or water vapor generated by the cooling liquid flow or cooling liquid vortex during the jet impact cooling process is quickly adsorbed by the adsorbent and merged into the heat dissipation reflux chamber. It flows to the external environment through the cooling circulating liquid outlet for cooling and then returns to the cooling circulating liquid inlet for cyclic cooling.

[0023] The beneficial effects of the present invention are: the jet impact type semiconductor refrigeration device has a compact and simple structure, and adopts a jet impact type cooling structure. The coolant can contact with the semiconductor refrigeration body to the maximum extent and quickly separate after the impact contact, and can quickly take away the heat, effectively improving the heat dissipation and cooling capabilities of the semiconductor refrigeration body, and can also make the input electrical energy achieve the purpose of energy saving, thereby realizing the efficient use of electrical energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a structural schematic diagram of the jet impingement semiconductor refrigeration device of the present invention;

[0025] Figure 2 This is a schematic diagram of the exploded structure of the jet impingement semiconductor refrigeration device of the present invention;

[0026] Figure 3 This is a cross-sectional structural diagram of the jet impingement type semiconductor refrigeration device of the present invention;

[0027] Figure 4This is a schematic structural diagram of a cooling body in Example 2 of the present invention;

[0028] Figure 5 This is a schematic structural diagram of a jet impingement semiconductor refrigeration device in Example 3 of the present invention;

[0029] Figure 6 This is a schematic structural diagram of a heat conducting plate in Example 4 of the present invention;

[0030] Figure 7 This is a schematic structural diagram of a jet impingement semiconductor refrigeration device in Example 5 of the present invention;

[0031] Figure 8 This is a schematic structural diagram of a cooling body in Example 6 of the present invention;

[0032] In the figure: 100, semiconductor refrigeration body, 200, cooling body, 300, jet impact cooling channel;

[0033] 1. Semiconductor refrigeration plate, 2. Cold surface, 3. Hot surface, 4. Cooling block, 5. Heat conduction plate, 6. Foam frame, 7. Heat conduction plate fixing screws, 8. Cooling jacket, 9. Cooling jacket body, 10. Connection and fixing structure, 11. Jet cooling port, 12. Heat conduction plate slot, 13. Fastening hole, 14. Cooling circulating liquid inlet, 15. Cooling circulating liquid outlet, 16. Diverter, 17. Diversion cavity, 18. Jet nozzle, 19. Heat dissipation reflux cavity, 20. Vortex channel, 21. Jet heat dissipation structure, 22. Adsorbent, 23. Wire, 24. Cooling liquid. DETAILED DESCRIPTION

[0034] The various aspects of the present invention are described in detail below through specific embodiments in conjunction with the accompanying drawings.

[0035] Example 1:

[0036] exist Figure 1 、 Figure 2 、 Figure 3 In the embodiment shown, a jet-impact semiconductor refrigeration device includes a semiconductor refrigeration body 100, which is embedded in a cooling body 200. A jet-impact cooling channel 300 is provided inside the cooling body 100, and a jet-impact cooling structure is formed between the jet-impact cooling channel 300 and the semiconductor refrigeration body 100.

[0037] The semiconductor refrigeration unit 100 includes a semiconductor cooling plate 1. A cooling block 4 is connected to the cold surface 2 of the semiconductor cooling plate 1. A heat conducting plate 5 is connected to the hot surface 3 of the semiconductor cooling plate 1. A foam frame 6 surrounds the semiconductor cooling plate 1 and the cooling block 4. The heat conducting plate 5, the semiconductor cooling plate 1, and the cooling block 4 are fixed together by heat conducting plate fixing screws 7. The foam frame 6 extends from the upper end of the cooling block 4. The cooling block 4 is used to connect to a terminal object requiring cooling, transferring the cooling energy generated by the semiconductor cooling plate 1 to the terminal object. The wires 23 of the semiconductor cooling plate 1 are led out of the foam frame 6.

[0038] Since the hot surface 3 of the semiconductor refrigeration plate generates heat while the cold surface 2 of the semiconductor refrigeration plate generates cold energy, a heat conducting plate 5 is connected to the hot surface 3 of the semiconductor refrigeration plate to achieve heat transfer and heat dissipation.

[0039] In order to improve the heat dissipation effect of the semiconductor refrigeration plate 1, improve the cooling capacity of the cold surface 2, and make the input electrical energy efficient and energy-saving, a cooling jacket 8 is provided. The cooling jacket 8 is made of non-conductive material, such as plastic material or other composite materials.

[0040] The cooling body 200 primarily comprises a cooling jacket 8, which primarily comprises a cooling jacket body 9. A connecting and fixing structure 10 is disposed around the cooling jacket body 9 for securing the jet impingement semiconductor refrigeration device. A jet cooling port 11 is disposed on the upper portion of the cooling jacket body 9. A heat conducting plate retaining slot 12 is disposed on the cooling jacket body 9 around the jet cooling port 11. Four fastening holes 13 are disposed around the heat conducting plate retaining slot 12 for securing the heat conducting plate 5. The heat conducting plate 5 is retained within the heat conducting plate retaining slot 12 and directly engages the jet cooling port 11. A cooling circulating liquid inlet 14 and a cooling circulating liquid outlet 15 are horizontally disposed on the cooling jacket body 9. A guide body 16 is disposed within the cooling jacket body 9 along the axial direction of the cooling circulating liquid inlet 14. A guide cavity 17 is disposed within the guide cavity 16 and communicates with the cooling circulating liquid inlet 14. A jet nozzle 18 is disposed on the guide cavity 17 in a direction perpendicular to the axis of the guide cavity 17 and facing the jet cooling port 11. In order to achieve a better jet effect and realize rapid pressure increase, the jet nozzle 18 has a closed structure, that is, an inverted trumpet structure. The guide cavity 17, the jet nozzle 18 and the jet cooling port 11 form the jet impact cooling channel 300.

[0041] The jet impact cooling channel 300 is an angled jet structure, in which the guide cavity 17 and the jet nozzle 18 are arranged at an angle, and the coolant forms a vortex jet impact cooling structure through the angled jet structure; in this embodiment, the axis of the guide cavity and the axis of the jet nozzle are arranged at a 90-degree angle.

[0042] A heat dissipation reflux chamber 19 is provided inside the cooling jacket body 9. The heat dissipation reflux chamber 19 is provided on the periphery of the guide body 16. The guide body separates the guide chamber from the heat dissipation reflux chamber, thereby separating the coolant before cooling and the coolant after cooling from each other to ensure the cooling effect.

[0043] like Figure 3 As shown, during cooling, the coolant entering from the cooling circulating liquid inlet 14 passes through the guide chamber 17 and enters the jet nozzle 18. Due to the rapid pressure increase, a high-speed coolant flow is generated. The high-speed coolant flow is ejected through the jet nozzle 18 and quickly hits the underside of the heat transfer plate 5, thereby reducing the temperature transferred from the hot surface 6 of the semiconductor cooling plate to the heat transfer plate 5, achieving a rapid heat dissipation and cooling effect. The heat-carrying coolant returns to the heat dissipation return chamber 19 and flows out through the cooling circulating liquid outlet 15.

[0044] The cooling body 200 is made of a plastic material with good thermal conductivity, that is, the cooling jacket body 9 is made of a plastic material with good thermal conductivity. During the circulating liquid cooling process, the heat of the cooling jacket body 9 itself can be absorbed and dissolved by radiation, so that the cooling jacket body 9 is always maintained at a relatively stable temperature.

[0045] The cooling jacket body 9 and the heat conducting plate 5 together form a circulating liquid cooling passage, thereby realizing rapid and direct cooling of the jet impingement type semiconductor refrigeration device.

[0046] The heat conducting plate 5 is connected as a whole with the semiconductor refrigeration plate 1 and the cooling block 4 by the heat conducting plate fixing screws 7 connected from bottom to top; the heat conducting plate 5 is fixedly connected with the cooling jacket body 9 by the cooling jacket fixing screws 19 arranged on the four corners of the cooling jacket body, and the foam frame 6 is fixed on the heat conducting plate 5 by independent bonding and is arranged around the outside of the semiconductor refrigeration plate 1 to realize the heat preservation function, thereby ensuring that the cold generated by the cold surface of the semiconductor refrigeration plate will not be dissipated, and can only be transferred to the terminal object through the cooling block, thereby forming an effective jet impact type semiconductor refrigeration device.

[0047] like Figure 3As shown, the direction of the arrow indicates the direction of flow of the coolant 24. One side of the semiconductor refrigeration plate 1 in the jet impact type semiconductor refrigeration device is the heat dissipation surface, and the other side is the cooling surface. Its output circuit is connected to the power supply. After normal power-on according to its corresponding parameters, the cold surface 2 of the semiconductor refrigeration plate transfers the cold (i.e., energy below the ambient temperature) to the cooling block 4 due to cooling, and then fixedly contacts the terminal object to be cooled through the screw reserved holes on the cooling block 4, and finally transfers the cold to the terminal object; at the same time, the hot surface 3 of the semiconductor refrigeration plate transfers a large amount of heat to the heat conducting plate 5 due to the generation of a large amount of heat, and then brings a large amount of heat to the external environment of the device through the circulating coolant 24 in the jet impact cooling channel formed between the heat conducting plate 5 and the cooling sleeve main body 9. The circulating coolant is cooled in the external environment through the cooling circulating liquid outlet 15 and then returns to the cooling circulating liquid inlet 14, thereby continuously playing a heat dissipation role for the hot surface of the jet impact type semiconductor refrigeration device.

[0048] Specifically, the circulating coolant enters the guide cavity 17 from the cooling circulating liquid inlet 14 and is ejected from the jet nozzle 18 at the upper end of the guide cavity 17. When the circulating coolant passes through the jet nozzle, a high-speed coolant vortex is generated due to the rapid pressurization, and is shot onto the lower side surface of the heat conduction plate. During the impact process, the coolant takes away heat, thereby reducing the temperature transferred from the hot surface of the semiconductor refrigeration plate to the heat conduction plate, achieving the effect of rapid heat dissipation and cooling.

[0049] Example 2:

[0050] exist Figure 4 In the embodiment shown, the technical solution is basically the same as that of Example 1, except that: a plurality of jet nozzles 18 are provided on the guide cavity 17 in a direction perpendicular to the axis of the guide cavity 17 and facing the jet cooling port 11. The plurality of jet nozzles 18 are distributed and arranged at different positions corresponding to the lower plate surface of the heat conducting plate 5. The setting of the plurality of jet nozzles 18 can greatly increase the contact area between the ejected coolant and the heat conducting plate, thereby improving the cooling effect. The plurality of jet nozzles can be arranged perpendicular to the heat conducting plate or inclined toward the heat conducting plate. The angle of the jet nozzle can be reasonably set according to the structure of the product and the requirements of the cooling effect.

[0051] Example 3:

[0052] exist Figure 5 In the embodiment shown, the technical solution is basically the same as that of embodiment 1, except that a vortex channel 20 is provided at the bottom of the guide cavity 17 corresponding to the jet nozzle 18 .

[0053] The coolant entering from the cooling circulation liquid inlet 14 passes through the guide cavity 17 and enters the vortex channel 20. After entering the guide cavity, the coolant forms a primary vortex flow in the vortex channel. The primary vortex flow is rapidly pressurized by the jet nozzle to produce a high-speed secondary vortex flow, which is ejected. This forms a vortex flow. When it is ejected toward the heat dissipation surface of the semiconductor refrigeration body, it collides with the heat dissipation surface with a vortex structure, which can more effectively contact the heat dissipation surface and quickly remove heat, thereby reducing the temperature transferred from the hot surface of the semiconductor refrigeration plate to the heat conduction plate, achieving the effect of rapid heat dissipation and cooling. Due to the use of vortex injection, the contact area between the vortex and the lower plate surface of the heat conduction plate can be greatly increased, thereby enhancing the cooling effect.

[0054] Specifically, after the coolant enters the guide cavity 17 from the circulating cooling inlet 14, it will collide with the inner wall of the cavity at the bottom of the guide cavity 17, and then be ejected from the jet nozzle 18. Therefore, in order to achieve a more effective jet injection effect, a vortex channel 20 is provided at the bottom of the guide cavity 17. After the coolant enters the guide cavity 14, a primary vortex liquid flow is formed inside the vortex channel 20. After the primary vortex liquid flow is ejected from the jet nozzle 18, it is ejected as a high-speed secondary vortex liquid flow, forming a vortex liquid flow. The vortex-shaped coolant collides with the heat conducting plate 5, thereby taking away the heat on the heat conducting plate more comprehensively and quickly.

[0055] Example 4:

[0056] exist Figure 6 The illustrated embodiment employs a technical solution essentially identical to that of Example 1, differing in that a plurality of jet heat dissipation structures 21 are provided on the side of the heat conducting plate 5 facing away from the hot surface 3 of the semiconductor cooling fins. These jet heat dissipation structures 21 can be in the form of arcuate jet grooves, protrusions, or ridges. In this embodiment, the jet heat dissipation structures 21 are arcuate protrusions, which increase the heat dissipation area and efficiency.

[0057] Because the lower surface of the heat conducting plate 5 is provided with a plurality of jet heat dissipation structures 21, during cooling, coolant entering from the cooling circulating liquid inlet 14 passes through the guide cavity 17 and enters the jet nozzle 18. Rapidly pressurized, this generates a high-speed coolant flow, which rapidly shoots through the jet nozzle 18 onto the heat conducting plate 5 and the jet heat dissipation structures 21. This reduces the temperature transferred from the hot surface of the semiconductor refrigeration plate to the heat conducting plate, achieving rapid heat dissipation and cooling. The plurality of jet heat dissipation structures 21 provided on the lower surface of the heat conducting plate increase the heat dissipation area, thereby enhancing the heat dissipation effect when the coolant strikes the jet heat dissipation structures, thereby improving the cooling effect.

[0058] Example 5:

[0059] exist Figure 7In the embodiment shown, the technical solution is basically the same as that of Example 1, except that: the jet impact cooling channel 300 is a direct structure, the guide cavity 17 is coaxially arranged with the jet nozzle 18, and the coolant forms a direct jet impact cooling structure through the direct structure. A cooling circulating liquid inlet 14 is provided in the vertical direction and a cooling circulating liquid outlet 15 is provided in the horizontal direction on the cooling jacket body 9. At the same time, a guide body 16 is provided inside the cooling jacket body 9 along the axial direction of the cooling circulating liquid inlet 14. A guide cavity 17 connected to the cooling circulating liquid inlet 14 is provided inside the guide body 16. A jet nozzle 18 facing the heat transfer plate 5 is provided at the upper end of the guide cavity 17 coaxially with the guide cavity 17. The jet nozzle 18 can be one or more. The arrangement of the jet nozzle 18 in a direction perpendicular to the heat transfer plate 5 can effectively reduce the jet resistance of the coolant and ensure a more effective jet cooling effect.

[0060] Whether the coolant is selected to enter horizontally and be vertically sprayed, or enter vertically and be vertically sprayed, the purpose is to achieve a good jet cooling effect. The difference lies in the different settings according to the location installation requirements of the jet impact semiconductor refrigeration device.

[0061] Example 6:

[0062] exist Figure 8 The illustrated embodiment has a technical solution substantially identical to that of Example 1, differing in that three adsorbents 22 are adhered to the inner three sides of the heat dissipation reflux chamber 19 near the heat conducting plate 5. These adsorbents 22 are made of a material with high air and heat absorption properties. In this embodiment, the adsorbents are adsorbent sponges, which are relatively dense and have numerous pores. Upon contact with water vapor, the adsorbents naturally condense into droplets due to surface adsorption, sinking to the bottom layer of the sponge. These droplets are then driven by the surrounding pressurized, continuously flowing coolant, completing the cooling cycle. The adsorbents 22 are used to rapidly absorb the hot air generated during the jet cooling process, rapidly cooling the heat conducting plate 5 and more effectively ensuring the cooling effect. Since the coolant will generate hot gas during the heat dissipation process of the high-speed shooting heat conducting plate, in order to reduce the influence of the hot gas on the heat dissipation effect of the heat conducting plate 5, the hot gas is quickly absorbed by the adsorbent 22 and condensed into coolant and discharged from the cooling circulating liquid outlet 15, thereby achieving the purpose of rapid cooling. It can greatly improve the heat dissipation capacity of the hot surface of the jet impact type semiconductor refrigeration device, thereby improving the cooling capacity of the cold surface of the jet impact type semiconductor refrigeration device, and correspondingly, it can also make the input electrical energy achieve the purpose of energy saving and high efficiency.

[0063] Since the coolant collides with the hot heat conducting plate during the jet cooling process, hot air or water vapor will be generated. The hot air or water vapor has the characteristic of flowing upward, which will affect the cooling effect of the heat conducting plate 5. Therefore, a circle of adsorbents 22 is provided on the wall of the heat dissipation reflux cavity 19 near the heat conducting plate 5. The adsorbents 22 have the function of quickly adsorbing hot air or water vapor, thereby gathering the hot air or water vapor on the adsorbent and entering the circulation process with the coolant, thereby ensuring the cooling effect.

[0064] The cooling method of the jet impingement semiconductor refrigeration device in the above embodiment has the following specific steps:

[0065] When the jet impact type semiconductor refrigeration device is powered on and working normally, during the operation of the semiconductor refrigeration plate, the cold surface of the semiconductor refrigeration plate generates cold energy and transfers the cold energy to the cooling block, which is then transferred to the terminal object that needs cooling through the cooling block; at the same time, the hot surface of the semiconductor refrigeration plate generates a large amount of heat, which is transferred to the heat conduction plate;

[0066] Step 1: Coolant circulation works;

[0067] Step 2: Jet impact cooling: The coolant enters the guide cavity from the cooling circulating liquid inlet, enters the jet nozzle at a certain angle or vertically, and is rapidly pressurized by the jet nozzle to form a high-speed coolant flow or coolant vortex. The coolant flow or coolant vortex shoots onto the lower plate surface of the heat conduction plate or the jet heat dissipation structure, taking away the heat on the heat conduction plate, thereby cooling the heat conduction plate; during the jet impact cooling process, the hot air or water vapor generated by the coolant flow or coolant vortex in the jet impact cooling process is quickly adsorbed by the adsorbent and merged into the heat dissipation reflux cavity, flows through the cooling circulating liquid outlet to the external environment for cooling, and then returns to the cooling circulating liquid inlet for cyclic cooling.

[0068] Step 3: Reflux circulation: The coolant with heat quickly falls back after impact and gathers in the heat dissipation reflux chamber. It flows to the external environment through the cooling circulation liquid outlet to cool down and then returns to the cooling circulation liquid inlet for circulated cooling; in this way, it continuously dissipates heat for the hot surface of the jet impact semiconductor refrigeration device.

[0069] When the circulating coolant passes through the jet nozzle, a high-speed coolant vortex is generated due to the rapid pressure increase, and is shot at the lower side of the heat conduction plate, thereby reducing the temperature transferred from the hot surface of the semiconductor refrigeration plate to the heat conduction plate, achieving the effect of rapid heat dissipation and cooling.

[0070] The semiconductor cooling device in the above embodiment can greatly improve the heat dissipation capacity of the hot surface of the jet impact semiconductor refrigeration device, thereby improving the cooling capacity of the cold surface of the jet impact semiconductor refrigeration device, and correspondingly can also achieve the purpose of energy saving and high efficiency of the input electrical energy.

[0071] The contents described in the embodiments of this specification are merely an enumeration of the implementation forms of the inventive concept. The protection scope of the inventive type should not be considered as being limited to the specific forms described in the embodiments. The protection scope of the inventive type also extends to equivalent technical means that can be conceived by those skilled in the art based on the inventive concept.

Claims

1. A jet impingement semiconductor refrigeration device, characterized in that: The invention comprises a semiconductor refrigeration body (100), wherein the semiconductor refrigeration body (100) is embedded in a cooling body (200), a jet impact cooling channel (300) is provided inside the cooling body (200), and a jet impact cooling structure is formed between the jet impact cooling channel (300) and the semiconductor refrigeration body (100); a jet cooling port directly connected to the semiconductor refrigeration body is provided on the cooling body, a guide cavity is provided inside the cooling body, a jet nozzle is provided at the tail end of the guide cavity, and the guide cavity, the jet nozzle and the jet cooling port form the jet impact cooling channel; the jet impact cooling channel is an angled jet structure or a straight jet structure, and the coolant forms a vortex jet impact cooling structure or a straight jet impact cooling structure through the angled jet structure or the straight jet structure.

2. The jet impingement semiconductor refrigeration device according to claim 1, characterized in that A flow guide (16) is provided inside the cooling body (200), and a flow guide cavity (17) is provided inside the flow guide (16).

3. The jet impingement semiconductor refrigeration device according to claim 2, characterized in that: In the angled jet structure, the axis of the guide cavity (17) and the axis of the jet nozzle (18) are arranged at an angle; a vortex channel (20) is provided at the bottom of the guide cavity (17).

4. The jet impingement semiconductor refrigeration device according to claim 2, characterized in that: The guide cavity (17) and the jet nozzle (18) are arranged coaxially.

5. The jet impingement semiconductor refrigeration device according to claim 2, characterized in that: A heat dissipation reflux cavity (19) is provided inside the cooling body (200), and the heat dissipation reflux cavity (19) is provided outside the guide body (6) and isolated from the jet impact cooling channel (300); an adsorbent (22) is provided on the cavity wall of the heat dissipation reflux cavity (19).

6. The jet impingement semiconductor refrigeration device according to claim 2, characterized in that: The cooling body (200) is made of a plastic material with thermal conductivity; a cooling circulating liquid inlet (14) and a cooling circulating liquid outlet (15) are provided on the cooling body (200), and the cooling circulating liquid inlet (14) is connected to the guide cavity (17).

7. The jet impingement semiconductor refrigeration device according to any one of claims 1 to 6, characterized in that: The semiconductor refrigeration body (100) includes a semiconductor refrigeration plate (1) having a cold surface (2) and a hot surface (3), a cold conduction block (4) is connected to the cold surface (2) of the semiconductor refrigeration plate (1), and a heat conduction plate (5) is connected to the hot surface (3) of the semiconductor refrigeration plate. A foam frame (6) is provided on the outside of the semiconductor refrigeration plate (1) and the cold conduction block (4), the lower part of the foam frame (6) is sealed with the heat conduction plate (5), and the upper part of the cold conduction block (4) extends to the outside of the foam frame (6).

8. The jet impingement semiconductor refrigeration device according to claim 2, characterized in that: A plurality of jet heat dissipation structures (21) are provided on the lower plate surface of the heat conducting plate (5).

9. A cooling method for a jet impingement semiconductor refrigeration device according to any one of claims 1 to 8, characterized in that The following steps are involved: Step 1: Coolant circulation works; Step 2: Jet impact cooling: The coolant enters the guide cavity from the cooling circulating liquid inlet, enters the jet nozzle at a certain angle or vertically, and is rapidly pressurized by the jet nozzle to form a high-speed coolant flow or coolant vortex. The coolant flow or coolant vortex shoots onto the lower plate surface of the heat transfer plate or the jet heat dissipation structure, removing the heat from the heat transfer plate; Step 3: Reflux circulation: The coolant with heat quickly falls back after impact and gathers in the heat dissipation reflux chamber. It flows to the external environment through the cooling circulation liquid outlet to cool down and then returns to the cooling circulation liquid inlet for cyclic cooling.

10. The cooling method of the jet impingement semiconductor refrigeration device according to claim 9, characterized in that: Step 2 also includes the adsorption of hot air or water vapor. The hot air or water vapor generated by the coolant flow or coolant vortex during the jet impact cooling process is quickly adsorbed by the adsorbent and merged into the heat dissipation reflux cavity. It flows through the cooling circulating liquid outlet to the external environment for cooling and then returns to the cooling circulating liquid inlet for cyclic cooling.

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