Wafer cassette conveying device

Abstract

This invention discloses a wafer cassette transport device, comprising a U-shaped loading area, a transfer area, a wafer guide area, and a wafer detection module. The wafer detection module includes an optical detection unit and a band detection unit. The optical detection unit includes at least one set of receiving integrated components and a light source integrated component. Each set of receiving integrated components and light source integrated components is located at the bottom of the wafer cassette support position and on both sides of the corresponding cutout position. The receiving integrated components move up and down and / or rotate and swing as a whole to receive and redirect light. The light source integrated components move up and down and / or rotate and swing as a whole to integrate the light transmitted by the receiving integrated components. The wafer cassette transport device provided by this invention can perform optical scanning on the wafers in the wafer cassette to reflect the real-time status of the wafers.

Description

Technical Field

[0001] This invention relates to the field of wafer transport, and more particularly to a wafer cassette transport device. Background Technology

[0002] Semiconductor wafer wet cleaning tank equipment prioritizes high-efficiency wafer transfer per unit time, enabling the transfer of wafers or wafer cassettes throughout the overall process. Taking tank cleaning equipment as an example, the wafer mechanical movement device is a wafer transfer system. The device, comprised of wafer transfer and guide modules, must effectively achieve high-efficiency wafer transfer in practice.

[0003] During wafer transfer, it is necessary to maintain the wafers within the wafer cassette to ensure coordinated movement and controllability throughout the process. It is also essential to prevent damage to the wafer cassette caused by shaking or other external forces. Therefore, it is necessary to measure the wafer cassette and wafers during the transfer process and to detect the position of the wafer cassette. Summary of the Invention

[0004] In order to detect wafers during the transmission process, the present invention provides a wafer cassette transport device.

[0005] The wafer cassette transport device provided by this invention adopts the following technical solution:

[0006] A wafer cassette transport device includes a U-shaped loading area, a transfer area, a wafer guide area, and a wafer detection module.

[0007] The loading area is equipped with an inbound transfer platform. One end of the inbound transfer platform is connected to the wafer box inbound window and is equipped with several wafer box carrier positions with hollowed-out centers. Transfer channels are opened on both sides of several wafer box carrier positions. The transfer channels connect the hollowed-out positions and pass through the inbound transfer platform for the carrying and transfer of single or double wafer boxes, providing temporary load for the wafer boxes.

[0008] The transfer area is equipped with a connecting platform that connects to the other end of the inbound transfer platform. The connecting platform slides between the loading area and the wafer guide area to transfer the wafer cassette from the inbound transfer platform to the wafer guide area.

[0009] The wafer detection module includes an optical detection unit and a band detection unit.

[0010] The optical detection unit includes at least one set of receiving integrated components and light source integrated components. Each set of receiving integrated components and light source integrated components is located at the bottom of the wafer carrier position and on both sides of the corresponding cutout position. The receiving integrated components move up and down and / or rotate and swing as a whole to receive and redirect light. The light source integrated components move up and down and / or rotate and swing as a whole to integrate the light transmitted by the receiving integrated components. The optical scanning of the wafer in the wafer carrier is performed through the cutout position to reflect the real-time status of the wafer.

[0011] The band detection unit is set at least in one of the X-axis, Y-axis and Z-axis directions of wafer transmission, and emits millimeter waves to the wafer to perform spectral scanning, thereby feeding back the spatial position of the wafer through the transmission and reception of millimeter waves.

[0012] Optionally, at least one set of the receiving integrated component and the light source integrated component is arranged on the wafer cassette carrier position of the receiving transfer platform near the connecting platform, and the band detection unit is arranged in the middle position of the receiving transfer platform, with the band radiating to all wafer cassette carrier positions.

[0013] Optionally, the optical detection unit further includes a light source emitting end, which is parallel to the receiving and transfer platform and disposed below the receiving and transfer platform.

[0014] Optionally, wafer box positioning blocks are provided at the four corners of the cutout position of the wafer box carrier. The wafer box positioning blocks are equipped with detection sensors. When the detection sensors detect that the wafer box is placed on the positioning feet of the wafer box positioning blocks, the light source emitter is activated and emits light towards the wafer.

[0015] Optionally, the band detection unit includes a band transmitter and a band receiver, both positioned parallel to the loading and unloading platform and at the center of the wafer cassette.

[0016] Optionally, the wafer guide area is parallel to the loading area and is used to extract the wafer from the wafer cassette and transfer the extracted wafer to the cleaning area for cleaning by a robotic arm; wherein, the optical detection unit is located in the Z-axis direction of the wafer guide area and is used to monitor the wafer guide process and the clamping action of the robotic arm on the wafer.

[0017] Optionally, the loading area is equipped with a first long-axis linear robot for conveying wafer cassettes to the corresponding wafer cassette carrying positions along the direction of the receiving and transfer platform, and the wafer guide area is equipped with a second long-axis linear robot for receiving wafer cassettes in the wafer guide area and the transfer area.

[0018] Optionally, both the first and second long-axis linear robots include a tray that can pass through the hollowed-out area, a support arm that can pass through the transfer channel, and a motion device integrating multiple movements, through which the following actions are performed:

[0019] The tray moves horizontally in a straight line, carrying the wafer cassette to the corresponding wafer cassette support position.

[0020] The lifting and lowering motion causes the tray to rise or fall, lifting the wafer cassette away from or into the wafer cassette carrier position.

[0021] The rotating motion causes the tray carrying the wafer cassette to rotate 180 degrees, changing the orientation of the wafer cassette.

[0022] Optionally, the connecting platform is provided with a wafer box carrier with a hollow center, and the wafer box carrier has a transfer channel facing the receiving and transfer platform. Both the first long axis linear robot and the second long axis linear robot pass through the transfer channel to receive the wafer box.

[0023] Optionally, at least one set of receiving integration components and light source integration components is disposed at the bottom of the connection platform, corresponding to the wafer carrier position of the connection platform.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] When the detection sensor of this invention detects that the wafer cassette is placed on the positioning foot of the wafer cassette positioning block, the light source emitter is activated and emits light to the wafer. The receiving integrated component moves up and down and / or rotates to receive and redirect the light. The light source integrated component moves up and down and / or rotates to receive the light transmitted by the integrated component. The light source integrated component performs an optical scan of the wafer inside the wafer cassette through the cutout position to reflect the real-time status of the wafer. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a wafer cassette conveying device according to the present invention;

[0027] Figure 2 This is a diagram showing the movement path of a wafer cassette in a wafer cassette conveying device according to the present invention.

[0028] Figure 3 This is a schematic diagram of the transfer of a wafer cassette in a wafer detection system according to the present invention;

[0029] Figure 4 This is a schematic diagram showing the positional relationship between the receiving integrated component and the light source integrated component in a wafer cassette conveying device according to the present invention;

[0030] Figure 5 This is a schematic diagram showing the lifting of the receiving integrated component and the light source integrated component in a wafer cassette conveying device according to the present invention;

[0031] Figure 6 This is a schematic diagram showing the rotation of the receiving integrated component and the light source integrated component in a wafer cassette conveying device according to the present invention.

[0032] Figure 7 This is a schematic diagram of the path detected in a wafer cassette transport device according to the present invention;

[0033] Figure 8 This is a schematic diagram showing the relative positions of the wafer cassette, optical detection unit, and band detection unit in a wafer cassette transport device according to the present invention.

[0034] Figure 9 This is a schematic diagram of millimeter wave transmission and reception in a wafer cassette transport device according to the present invention.

[0035] In the diagram: 1. Loading area; 11. Inbound transfer platform; 12. Wafer box carrier; 13. Wafer box positioning block; 14. First long axis linear robot; 2. Transfer area; 21. Connection platform; 3. Wafer guide area; 31. Second long axis linear robot; 4. Receiving integration component; 5. Light source integration component. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Reference Figures 1 to 9 The present invention provides an embodiment of a wafer cassette transport device, which includes a U-shaped loading area 1, a transfer area 2, a wafer guide area 3, and a wafer detection module.

[0038] The loading area 1 is equipped with an inbound transfer platform 11. One end of the inbound transfer platform 11 is connected to the wafer box inbound window, and several wafer box carrier positions 12 with hollowed-out centers are provided. Transfer channels are opened on both sides of the wafer box carrier positions 12. The transfer channels connect the hollowed-out positions and pass through the inbound transfer platform 11 for the carrying and transfer of single or double wafer boxes, providing temporary load for the wafer boxes.

[0039] The transit area 2 is equipped with a connecting platform 21, which connects to the other end of the receiving transfer platform 11. The connecting platform 21 slides between the loading area 1 and the wafer guide area 3, transferring the wafer cassette on the receiving transfer platform 11 to the wafer guide area 3.

[0040] For details, please refer to Figure 1 , Figure 2As shown, the wafer guide area 3 is parallel to the loading area 1 and is used to extract wafers from the wafer cassette. A robotic arm then transfers the extracted wafers to the cleaning area for cleaning. The loading area 1 is equipped with a first long-axis linear robot 14, which transports wafer cassettes along the receiving transfer platform 11 to the corresponding wafer cassette receiving position 12. The wafer guide area 3 is equipped with a second long-axis linear robot 31, which receives the wafer cassettes during transport between the wafer guide area 3 and the transfer area 2. The movement path of the wafer cassettes between the loading area 1, the transfer area 2, and the wafer guide area 3 is U-shaped, saving overall space and improving space utilization while also increasing wafer transport efficiency.

[0041] Both the first long-axis linear robot 14 and the second long-axis linear robot 31 include a tray that can pass through a hollowed-out area, a support arm that can pass through a transfer channel, and a motion device integrating multiple movements. The motion device performs the following actions:

[0042] The tray moves horizontally and linearly, carrying the wafer cassette to the corresponding wafer cassette support position 12.

[0043] The lifting and lowering motion causes the tray to rise or fall, lifting the wafer cassette away from or loading it into the wafer cassette carrier position 12.

[0044] The rotating motion causes the tray carrying the wafer cassette to rotate 180 degrees, changing the orientation of the wafer cassette.

[0045] The connecting platform 21 is provided with a wafer box carrier position 12 with a hollow center, and the wafer box carrier position 12 is opened with a transfer channel facing the receiving transfer platform 11. The first long axis linear robot 14 and the second long axis linear robot 31 both pass through the transfer channel to receive the wafer box, and the movement paths of the first linear robot 14 and the second linear robot 31 are parallel.

[0046] Furthermore, the wafer cassette transport device also includes a wafer detection module, which includes an optical detection unit and a band detection unit.

[0047] Among them, reference Figure 4 , Figure 5 and Figure 6 The optical detection unit includes at least one set of receiving integrated components 4 and light source integrated components 5. Each set of receiving integrated components 4 and light source integrated components 5 is located on the bottom of the wafer carrier position 12 and on both sides of the corresponding cutout position. The receiving integrated components 4 move up and down and / or rotate and swing as a whole to receive and turn the light to conduct light. The light source integrated components 5 move up and down and / or rotate and swing as a whole to integrate the light conducted by the receiving integrated components 4. The optical scanning of the wafer in the wafer carrier through the cutout position reflects the real-time status of the wafer.

[0048] Reference Figure 7 , Figure 8 and Figure 9The band detection unit is set at least in one of the X-axis, Y-axis and Z-axis directions of wafer transmission, and emits millimeter waves to the wafer to perform spectral scanning, and uses the transmission and reception of millimeter waves to provide feedback on the spatial position of the wafer.

[0049] Reference Figure 3 As shown, at least one set of receiving integration component 4 and light source integration component 5 is disposed on the wafer cassette carrier position 12 near the connecting platform 21 on the receiving transfer platform 11.

[0050] Reference Figure 9 As shown, the band detection unit is located in the middle of the receiving transfer platform 11, and the band radiates to all wafer cassette carrier positions 12.

[0051] Furthermore, the optical detection unit also includes a light source emitter and an optical receiver, which are parallel to the receiving and transfer platform 11 and located below the receiving and transfer platform 11. Wafer box positioning blocks 13 are provided at the four corners of the cutout positions of the wafer box carrier position 12 on the receiving and transfer platform 11. Detection sensors are provided on the wafer box positioning blocks 13. When the detection sensors detect that the wafer box is placed on the positioning feet of the wafer box positioning block 13, the light source emitter is activated, emitting light towards the wafer.

[0052] The band detection unit includes a band transmitter and a band receiver, both positioned parallel to the loading and unloading platform 11 and at the center of the wafer cassette. Preferably, the electromagnetic waves emitted by the band transmitter are millimeter waves.

[0053] In some embodiments of the present invention, at least one set of receiving integration component 4 and light source integration component 5 is disposed at the bottom of the connecting platform 21, corresponding to the wafer carrier position 12 of the connecting platform 21.

[0054] During wafer transport:

[0055] The first long-axis linear robot 14 transports the wafer box to the corresponding wafer box carrier position 12 along the direction of the receiving and transfer platform 11. After the wafer box and wafer are detected to be correct, the first long-axis linear robot 14 moves the wafer box to the wafer box carrier position 12 on the connecting platform 21. The connecting platform 21 performs lateral transfer of the wafer box. The second long-axis linear robot 31 receives the wafer box and transports it from the transfer area 2 to the wafer guide area 3.

[0056] During wafer transport, when the detection sensor detects that the wafer cassette is placed on the positioning foot of the wafer cassette positioning block 13, the light source emitter is activated to emit light towards the wafer. The receiving integrated component 4 moves up and down and / or rotates to receive and redirect the light. The light source integrated component 5 cooperates with the receiving integrated component 4 to move up and down and / or rotate to receive the light transmitted by the receiving integrated component 4. It also performs optical scanning of the wafer inside the wafer cassette through the cutout position. Correspondingly, the band transmitter emits millimeter waves towards the wafer for spectral scanning. The spatial position of the wafer is fed back by the transmission and reception of millimeter waves. Through the analysis of optical scanning and spectral scanning, the real-time status of the wafer cassette and wafer during wafer transport is reflected.

[0057] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A wafer cassette conveying device, characterized in that, It includes a U-shaped spare area (1), a transfer area (2), a wafer guide area (3), and a wafer detection module; The loading area (1) is provided with an inbound transfer platform (11). One end of the inbound transfer platform (11) is connected to the wafer box inbound window, and several wafer box carrier positions (12) with hollowed-out middle are provided. Transfer channels are opened on both sides of several wafer box carrier positions (12). The transfer channels connect the hollowed-out positions and pass through the inbound transfer platform (11) for the carrying and transfer of single or double wafer boxes, and provide temporary load for the wafer boxes. The transfer area (2) is provided with a connecting platform (21) that connects to the other end of the receiving transfer platform (11). The connecting platform (21) slides between the loading area (1) and the wafer guide area (3) to transfer the wafer cassette on the receiving transfer platform (11) to the wafer guide area (3). The wafer detection module includes an optical detection unit and a band detection unit. The optical detection unit includes at least one set of receiving integrated components (4) and light source integrated components (5). Each set of receiving integrated components (4) and light source integrated components (5) is located at the bottom of the wafer carrier position (12) and on both sides of the corresponding cutout position. The receiving integrated components (4) move up and down and / or rotate and swing as a whole to receive and turn the light to conduct light. The light source integrated components (5) move up and down and / or rotate and swing as a whole to integrate the light conducted by the receiving integrated components (4). The optical scanning of the wafer in the wafer carrier is performed through the cutout position to reflect the real-time status of the wafer. The band detection unit is set at least in one of the X-axis, Y-axis and Z-axis directions of wafer transmission, and emits millimeter waves to the wafer to perform spectral scanning, thereby feeding back the spatial position of the wafer through the transmission and reception of millimeter waves.

2. The wafer cassette conveying device according to claim 1, characterized in that, At least one set of the receiving integrated component (4) and the light source integrated component (5) is set on the wafer carrier position (12) of the receiving transfer platform (11) near the connecting platform (21), and the band detection unit is set in the middle position of the receiving transfer platform, with the band radiating to all wafer carrier positions (12).

3. The wafer cassette conveying device according to claim 2, characterized in that, The optical detection unit also includes a light source emitting end, which is parallel to the receiving and transfer platform (11) and is located below the receiving and transfer platform (11).

4. The wafer cassette conveying device according to claim 3, characterized in that, The wafer box carrier position (12) has wafer box positioning blocks (13) at the four corners of the cutout position. The wafer box positioning blocks (13) are equipped with detection sensors. When the detection sensors detect that the wafer box is placed on the positioning feet of the wafer box positioning blocks (13), the light source emitter is activated and emits light to the wafer.

5. The wafer cassette conveying device according to claim 3, characterized in that, The band detection unit includes a band transmitter and a band receiver, both of which are positioned parallel to the loading and unloading platform (11) and at the middle of the wafer cassette.

6. The wafer cassette conveying device according to claim 1, characterized in that, The wafer guide area (3) is parallel to the loading area (1) and is used to extract the wafer from the wafer cassette and transfer the extracted wafer to the cleaning area for cleaning by a robotic arm; wherein, the optical detection unit is located in the Z-axis direction of the wafer guide area (3) and is used to monitor the wafer guide area (3) process and the clamping action of the robotic arm on the wafer.

7. The wafer cassette conveying device according to claim 1, characterized in that, The loading area (1) is equipped with a first long axis linear robot (14) for conveying wafer cassettes to the corresponding wafer cassette carrier position (12) along the direction of the loading transfer platform (11). The wafer guide area (3) is equipped with a second long axis linear robot (31) for receiving the wafer cassettes in the wafer guide area (3) and the transfer area (2).

8. The wafer cassette conveying device according to claim 7, characterized in that, Both the first long-axis linear robot (14) and the second long-axis linear robot (31) include a tray that can pass through the hollowed-out position, a support arm that can pass through the transfer channel, and a motion device integrating multiple movements, which performs the following actions: The horizontal linear movement allows the tray to receive the wafer cassette and move it to the corresponding wafer cassette support position (12); The lifting motion, the tray rising or falling, lifts the wafer cassette away from or loads it into the wafer cassette carrier position (12); The rotating motion causes the tray carrying the wafer cassette to rotate 180 degrees, changing the orientation of the wafer cassette.

9. The wafer cassette conveying device according to claim 8, characterized in that, The connecting platform (21) is provided with a wafer box carrier position (12) with a hollow center, and the wafer box carrier position (12) is opened with a transfer channel facing the receiving transfer platform (11). The first long axis linear robot (14) and the second long axis linear robot (31) pass through the transfer channel to receive the wafer box.

10. The wafer cassette conveying device according to claim 1, characterized in that, At least one set of the receiving integrated component (4) and the light source integrated component (5) is disposed at the bottom of the connecting platform (21), corresponding to the wafer carrier position (12) of the connecting platform (21).

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