A coupler structure

By using a coupler with a stacked structure and multi-layer circuit design, the problems of large size and low phase accuracy of four-phase couplers are solved, and a miniaturized and high-precision coupler structure is achieved.

CN116365209BActive Publication Date: 2026-05-15YANTEL CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
YANTEL CORP
Filing Date
2023-03-09
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

Existing four-phase couplers cannot simultaneously meet the requirements of small size and high phase accuracy.

Method used

The coupler adopts a stacked structure design, with the load printed on the top surface of the coupler structure. The coupler's circuitry is divided into multiple layers and connected by stacking dielectric layers, which shortens the connection path and improves phase accuracy.

Benefits of technology

This reduces the size of the coupler structure, improves phase shift accuracy, shortens the connection length of the load, and reduces the space occupied by the device.

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Abstract

The application provides a coupler structure, which comprises a top core plate, a middle layer and a bottom core plate which are sequentially stacked, a top layer circuit layer and a first ground metal layer are printed on the opposite surfaces of the top core plate respectively, the top layer circuit layer comprises three loads; a bottom layer circuit layer and a second ground metal layer are printed on the opposite surfaces of the bottom core plate respectively, the bottom layer circuit layer comprises an input end, four output ends and a ground end, the phases of two adjacent output ends are 90 degrees different, and the ground end, the first ground metal layer and the second ground metal layer are connected; the middle layer comprises a first core plate, a support plate and a second core plate which are sequentially stacked through a dielectric layer, a part of a circuit and a first signal line of three couplers are arranged on the first core plate, another part of the circuit and a second signal line of the three couplers are arranged on the second core plate, and the first signal line and the second signal line are connected to form a quarter wavelength line. The application solves the problem that the existing four-phase coupler cannot simultaneously meet the requirements of small size and high phase accuracy.
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Description

Technical Field

[0001] This application relates to the field of coupler technology, and in particular to a coupler structure. Background Technology

[0002] For receiving devices that are static or moving, it is desirable to receive signals from all directions (360 degrees). To achieve omnidirectional reception, i.e., reception of 0-degree phase, 90-degree phase, 180-degree phase and 270-degree phase, four phase shifters or multiple couplers are required. These are costly and bulky. Currently, four-phase couplers have emerged. Although they are smaller than multiple couplers, their phase accuracy is not high. Summary of the Invention

[0003] This application provides a coupler structure that solves the problem that existing four-phase couplers cannot simultaneously meet the requirements of small size and high phase accuracy.

[0004] This invention is implemented as follows: a coupler structure includes a top core board, a bottom core board, and an intermediate layer stacked with the top and bottom core boards respectively through a dielectric layer. The top core board has a top circuit layer and a first ground metal layer printed on its opposite surfaces, and the top circuit layer includes three loads. The bottom core board has a bottom circuit layer and a second ground metal layer printed on its opposite surfaces, and the bottom circuit layer includes an input terminal, four output terminals, and a ground terminal. The phase difference between two adjacent output terminals is 90 degrees. The ground terminal, the first ground metal layer, and the second ground metal layer are connected. The intermediate layer includes a first core board, a support plate, and a second core board stacked sequentially through dielectric layers. The first core board has a portion of the circuitry for the three couplers and a first signal line. The second core board has another portion of the circuitry for the three couplers and a second signal line. The first signal line and the second signal line are connected to form a quarter-wavelength line.

[0005] In one embodiment, a portion of the circuitry of the three couplers includes a first line and a second line respectively disposed on opposite surfaces of the first core board, wherein the first signal line and the second line are disposed on the same surface of the first core board and connected to each other.

[0006] Another part of the circuitry of the three couplers includes a third line and a fourth line respectively disposed on opposite surfaces of the second core board, wherein the second signal line and the third line are disposed on the same surface of the second core board and are connected to each other.

[0007] The first core board, the second core board, and the support plate are all provided with signal connection holes. The first line, the second line, the third line, and the fourth line are connected through the signal connection holes to form three couplers. The first signal line and the second signal line are connected through the signal connection holes to form a quarter-wavelength line.

[0008] In one embodiment, a portion of the lines of the three couplers and another portion of the lines of the three couplers are both half of the lines of the three couplers.

[0009] In one embodiment, the surface of the first core board on which the first signal line is disposed is opposite to the surface of the second core board on which the second signal line is disposed.

[0010] In one embodiment, the coupling line width of one of the three couplers is 0.065 mm, and the coupling line width of the other two couplers is 0.08 mm.

[0011] The width of both the first signal line and the second signal line is 0.1 mm.

[0012] In one embodiment, the edges of the signal connection holes on the first core board and the second core board are provided with metal rings.

[0013] In one embodiment, the support plate is made of an iron-nickel alloy material;

[0014] The support plate has a filling hole, which is filled with resin, and the resin has a signal connection hole.

[0015] In one embodiment, the diameter of the filling hole is 0.3 mm, and the diameter of the signal connection hole is 0.1 mm.

[0016] In one embodiment, the bottom core board has the signal connection hole and the displacement hole connected to the signal connection hole by a connecting line, and the second ground metal layer has an insulating sheet located around the signal connection hole, the connecting line and the displacement hole.

[0017] In one embodiment, an identifier is provided on one side surface of the top layer of the printed circuit board, the identifier being used to identify the front, back and taping direction of the coupler structure.

[0018] In one embodiment, the top core board has an input terminal identifier and an output phase identifier on one side surface of the top circuit layer.

[0019] In one embodiment, the dimensions of the coupler structure are 5.3mm*3.4mm*0.8mm.

[0020] In one embodiment, the thickness of the top core board is 0.05 mm, the thickness of the dielectric layer between the top core board and the intermediate layer is 0.07 mm, the thickness of the first core board is 0.01 mm, the thickness of the dielectric layer between the first core board and the support plate is 0.09 mm, the thickness of the support plate is 0.06 mm, the thickness of the dielectric layer between the support plate and the second core board is 0.09 mm, the thickness of the second core board is 0.01 mm, the thickness of the dielectric layer between the intermediate layer and the bottom core board is 0.07 mm, and the thickness of the bottom core board is 0.05 mm.

[0021] The beneficial effects of the coupler structure provided in this application are as follows: Compared with the prior art, this application adopts a stacked arrangement of the coupler structure and prints the load of the coupler on the top surface of the coupler structure. This not only reduces the volume of the coupler structure, but also reduces the space occupied by the load. While further reducing the volume of the coupler structure, it can also shorten the length of the coupler connecting the load, thereby improving the phase shifting accuracy. Attached Figure Description

[0022] Figure 1 This is a circuit schematic diagram of the coupler structure provided in the embodiments of this application;

[0023] Figure 2 This is a cross-sectional view of the coupler structure provided in the embodiments of this application;

[0024] Figure 3 This is a top view of the top circuit layer of the coupler structure provided in the embodiments of this application;

[0025] Figure 4 This is a top view of the first ground metal layer of the coupler structure provided in the embodiments of this application;

[0026] Figure 5 This is a top view of the surface of the first core plate of the coupler structure provided in this application embodiment, near the top core plate;

[0027] Figure 6 This is a top view of the surface of the first core plate away from the top core plate of the coupler structure provided in this application embodiment;

[0028] Figure 7 This is a top view of the support plate of the coupler structure provided in the embodiments of this application;

[0029] Figure 8This is a top view of the surface of the second core plate of the coupler structure provided in this embodiment of the application, near the support plate.

[0030] Figure 9 This is a top view of the side surface of the second core plate away from the support plate of the coupler structure provided in the embodiments of this application;

[0031] Figure 10 This is a top view of the second grounding metal layer of the coupler structure provided in the embodiments of this application;

[0032] Figure 11 This is a top view of the bottom line layer of the coupler structure provided in the embodiments of this application.

[0033] Reference numerals: 1. Top core board; 11. Top wiring layer; 12. First grounding metal layer; 110. Load;

[0034] 2. Bottom core board; 21. Bottom circuit layer; 22. Second grounding metal layer; 211. Input terminal; 222. Output terminal; 223. Grounding terminal; 20. Shift hole; 201. Connecting wire; 202. Insulating sheet;

[0035] 3. Intermediate layer; 31. First core board; 311. First circuit; 312. Second circuit; 32. Support plate; 33. Second core board; 331. Third circuit; 332. Fourth circuit; 310. First signal line; 330. Second signal line;

[0036] 4. Dielectric layer; 5. Metal ring; 6. Identifier; 71. Input terminal identifier; 72. Output phase identifier. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0038] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0039] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0041] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example in the figure. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0042] This application provides a coupler structure that solves the problem that existing four-phase couplers cannot simultaneously meet the requirements of small size and high phase accuracy.

[0043] refer to Figure 1 The coupler structure provided in this application embodiment is a four-phase coupler, which can output signals with phases of 0°, -90°, -180°, and -270° respectively. This four-phase coupler includes three couplers ( Figure 1 The three self-loads shown are C1, C2, and C3. Figure 1 R1, R2, R3 (as shown) and a quarter-wavelength line ( Figure 1 M shown), Figure 1The input terminal C1-1 of coupler C1 serves as the input terminal 211 of the four-phase coupler. The coupling terminal of coupler C1 is connected to the input terminal C2-1 of coupler C2. The through terminal of coupler C1 is connected to one end of the quarter-wavelength line M. The isolation terminal of coupler C1 is connected to one end of the self-load R1, and the other end of the self-load R1 is grounded. The coupling terminal C2-2 of coupler C2 serves as the 0° output terminal 222 of the four-phase coupler, and the through terminal C2-3 of coupler C2 serves as the -90° output terminal of the four-phase coupler. Output terminal 222, the isolation terminal of coupler C2 is connected to one end of self-load R2, and the other end of self-load R2 is grounded; the other end of quarter-wavelength line M is connected to input terminal C3-1 of coupler C3, the coupling terminal C3-2 of coupler C3 serves as the -180° output terminal 222 of the four-phase coupler, the through terminal C3-3 of coupler C3 serves as the -270° output terminal 222 of the four-phase coupler, the isolation terminal of coupler C3 is connected to one end of self-load R3, and the other end of self-load R3 is grounded.

[0044] refer to Figure 2 The coupler structure provided in this application includes a top core board 1, a bottom core board 2, and an intermediate layer 3 stacked with the top core board 1 and the bottom core board 2 respectively through a dielectric layer 4. The top core board 1 has a top circuit layer 11 and a first ground metal layer 12 printed on its two opposite surfaces. The top circuit layer 11 includes three loads 110. The bottom core board 2 has a bottom circuit layer 21 and a second ground metal layer 22 printed on its two opposite surfaces. The bottom circuit layer 21 includes an input terminal 211, four output terminals 222 and a ground terminal 223. The phase difference between two adjacent output terminals 222 is 90 degrees. The ground terminal 223, the first ground metal layer 12 and the second ground metal layer 22 are connected. The intermediate layer 3 includes a first core board 31, a support plate 32 and a second core board 33 stacked sequentially through a dielectric layer 4. The first core board 31 has a portion of the circuits of the three couplers and a first signal line 310. The second core board 33 has another portion of the circuits of the three couplers and a second signal line 330. The first signal line 310 and the second signal line 330 are connected to form a quarter-wavelength line.

[0045] In this embodiment, the coupler structure is arranged in a stacked manner, which can reduce the volume of the coupler structure. Moreover, the loads 110 of the coupler, namely R1, R2, and R3, are all printed on the top surface of the coupler structure. This can reduce the space occupied by the loads 110, further reduce the volume of the coupler structure, and also shorten the length of the coupler connecting the loads 110, thereby improving the phase shifting accuracy.

[0046] It should be noted that circuit layers are provided on both sides of the top core board 1, bottom core board 2, first core board 31, support plate 32, and second core board 33, that is, circuit layers are provided on both sides of the top core board 1, bottom core board 2, first core board 31, support plate 32, and second core board 33. Figure 1 The circuit is constructed in 10 layers, allowing for a more efficient arrangement of components and significantly reducing the size of the coupler structure. Specifically, the circuit layers arranged in the order of top core board 1, first core board 31, support board 32, second core board 33, and bottom core board 2 are designated as L1, L2, L3, L4, L5, L6, L7, L8, L9, and L10, respectively. Blind vias are installed inside the coupler structure to connect the electrical signals of each layer. The ground of different layers is connected to the ground terminal 223 of the bottom circuit layer 21 via a metal grounding via Gh, where the diameter of the metal grounding via Gh is 0.2 mm. A portion of couplers C1, C2, and C3 is fabricated on the first core board 31, specifically, a portion of couplers C1, C2, and C3 is layer L3 and layer L4; the other portion of couplers C1, C2, and C3 is fabricated on the second core board 33, specifically, the other portion of couplers C1, C2, and C3 is layer L7 and layer L8. This circuit configuration facilitates the alignment of the two portions of couplers C1, C2, and C3, ensuring the design accuracy of the phase.

[0047] In some embodiments, the thickness of the top core plate 1 is 0.05 mm, the thickness of the dielectric layer 4 between the top core plate 1 and the intermediate layer 3 is 0.07 mm, the thickness of the first core plate 31 is 0.01 mm, the thickness of the dielectric layer 4 between the first core plate 31 and the support plate 32 is 0.09 mm, the thickness of the support plate 32 is 0.06 mm, the thickness of the dielectric layer 4 between the support plate 32 and the second core plate 33 is 0.09 mm, the thickness of the second core plate 33 is 0.01 mm, the thickness of the dielectric layer 4 between the intermediate layer 3 and the bottom core plate 2 is 0.07 mm, and the thickness of the bottom core plate 2 is 0.05 mm. This minimizes the volume of the coupler structure; the external dimensions of the coupler structure in this embodiment can reach 5.3 mm * 3.4 mm * 0.8 mm.

[0048] The thickness of the first core plate 31 is the thickness of the coupling medium of a portion of the upper and lower coils of couplers C1, C2, and C3, and the thickness of the second core plate 33 is the thickness of the coupling medium of another portion of the upper and lower coils of couplers C1, C2, and C3.

[0049] In this embodiment, the top core board 1, the bottom core board 2, the first core board 31, the support board 32, and the second core board 33 can be made of materials with different dielectric constants. Specifically, materials with high dielectric constants can be used to make the coupler circuit. The coupler wires made in this way are very thin, and the coils of the coupler can be made very narrow, thereby reducing the size of the coupler structure.

[0050] refer to Figure 3 , Figure 3The diagram shows the top layer 11, also known as layer L1. Three self-contained loads R1, R2, and R3 are printed on the top layer 11. Since the transmitting and receiving signals operate at very high frequencies, typically in the 900MHz, 1400MHz-1600MHz, or 2500MHz bands, placing the self-contained loads R1, R2, and R3 on the top layer of the coupler structure can shorten the soldering path of the load 110, improve the phase shifting accuracy of the four-phase coupler, and thus improve the positioning accuracy. Compared to external loads on the coupler, printing the load 110 on the top layer in this application can reduce the external size occupied by the three loads 110, saving device space. In addition, after printing the self-contained loads R1, R2, and R3, they are laser-adjusted to 50 ohms and then covered with resin.

[0051] refer to Figure 3 On one side surface of the printed top layer circuit layer 11 of the top core board 1, an identifier 6 is provided. The identifier 6 is used to identify the front, back and taping direction of the coupler structure. That is, the identifier 6 is provided on the top surface of the coupler structure, which makes it easy for users to identify the front, back and taping direction of the coupler structure.

[0052] Specifically, identifier 6 can be printed on one side surface of the printed top layer circuit layer 11 of the top core board 1, thus not increasing the volume of the coupler structure. In this embodiment, identifier 6 is set above the center line X on the top surface of the four-phase coupler. The purpose of identifier 6 is to identify the front, back, and tape direction of the four-phase coupler, making it easier for users to place the four-phase coupler in the correct tape direction and facilitating automatic tape feeding. One or more identifiers 6 can be set. When one identifier is set, it can be a black strip parallel to the center line X on the top surface of the four-phase coupler. When multiple identifiers are set, they can be multiple black strips spaced apart on the top surface of the four-phase coupler, parallel to the center line X. The specific number of identifiers 6 can be set according to actual needs, and this embodiment does not limit it.

[0053] refer to Figure 3 The top layer core board 1 has an input terminal identifier 71 and an output phase identifier 72 on one side surface of the printed top layer circuit layer 11. This facilitates users to quickly connect external devices to the input terminal 211 and output terminal 222 of the four-phase coupler.

[0054] Specifically, the input terminal 211 is marked with a dot in-M, meaning the electrode on the bottom layer 21 corresponding to this dot in-M is the signal input electrode, i.e., the input terminal 211 of the four-phase coupler. Furthermore, the output phase identifier 72 can be four values—0, 90, 180, and 270—silicone on the top layer core board 1, corresponding to four phases: 0°, -90°, -180°, and -270°, respectively. Generally, for printing convenience, the "-" sign is omitted. The electrodes of the four output terminals 222 on the bottom layer 21 correspond to these four phases. Figure 3 The four phases are designed with left-hand rotation (i.e., counter-clockwise rotation), which is generally used in receiving antennas; of course, the phases can also be designed with right-hand rotation (i.e., clockwise rotation), which is generally used in transmitting antennas. The specific phase position settings can be designed according to the actual application of the coupler structure, and the embodiments in this application do not impose specific limitations.

[0055] refer to Figure 4 , Figure 4 The first grounding metal layer 12, also known as the L2 layer, is shown. The entire first grounding metal layer 12 is grounded (G), and it is connected to the grounding terminal 223 of the bottom line layer 21 through a metal grounding hole Gh.

[0056] refer to Figures 5-6 , Figure 5 The image shows layer L3. Figure 6 The diagram shows layer L4. A portion of the circuitry for the three couplers includes a first line 311 and a second line 312 respectively disposed on opposite surfaces of the first core board 31. The first signal line 310 and the second line 312 are disposed on the same surface of the first core board 31 and connected to each other. Specifically, the first line 311 is the top-level circuit C11, C21, and C31 of a portion of the coupling lines of the four-phase couplers C1, C2, and C3, i.e., layer L3; the second line 312 is the bottom-level circuit C'11, C'21, and C'31 of a portion of the coupling lines of the four-phase couplers C1, C2, and C3; the first signal line 310 is a portion of the quarter-wavelength line M, i.e., M1; and the circuit connecting the first signal line 310 and the second line 312 is layer L4.

[0057] refer to Figures 8-9 , Figure 8 The image shows layer L7. Figure 9The diagram shows layer L8. Another portion of the circuitry for the three couplers includes third line 331 and fourth line 332, respectively disposed on opposite surfaces of the second core board 33. Second signal line 330 and third line 331 are disposed on the same surface of the second core board 33 and connected to each other. Specifically, third line 331 is the top-level circuitry C12, C22, and C32 of another portion of the coupling lines for couplers C1, C2, and C3 of the four-phase coupler; second signal line 330 is another portion of the quarter-wavelength line M, namely M2; the circuit connecting second signal line 330 and third line 331 is layer L7; fourth line 332 is the bottom-level circuitry C'12, C'22, and C'32 of another portion of the coupling lines for couplers C1, C2, and C3 of the four-phase coupler, i.e., layer L8.

[0058] In some embodiments, to reduce the size of the four-phase coupler, the coupling line width of one of the three couplers is 0.065 mm, and the coupling line widths of the other two couplers are 0.08 mm. Specifically, the coupling line width K1 of C11 can be designed to be 0.065 mm, and the widths K2 and K3 of C21 and C31 can both be designed to be 0.08 mm. The coupling line width K'1 of C'11 is designed to be 0.065 mm, and the widths K'2 of C'21 and K'3 of C'31 are both designed to be 0.08 mm. Simultaneously, the coupling line width K1 of C12 is also designed to be 0.065 mm, and the widths K2 and K3 of couplers C22 and C32 are also designed to be 0.08 mm. The coupling line width K1 of coupler C'12 is designed to be 0.065 mm, and the widths K2 and K3 of couplers C'22 and C'32 are both designed to be 0.08 mm.

[0059] In some embodiments, the width of both the first signal line 310 and the second signal line 330 is 0.1 mm. Specifically, the widths MK of M1 and M2 are both designed to be 0.1 mm. This reduces the area occupied by the quarter-wavelength line M, thereby reducing the size of the four-phase coupler.

[0060] In some embodiments, signal connection holes are provided on the first core board 31, the second core board 33 and the support plate 32. The first line 311, the second line 312, the third line 331 and the fourth line 332 are connected through the signal connection holes to form three couplers. The first signal line 310 and the second signal line 330 are connected through the signal connection holes to form a quarter-wavelength line.

[0061] With the above settings, the coupler circuit of the four-phase coupler is divided into four parts and placed on different layers, and the quarter-wavelength line is divided into two parts and placed on different layers, which can effectively reduce the size of the four-phase coupler.

[0062] It should be noted that the total length of the coupler line of coupler C1 is the sum of the lengths of the coupler lines of C11, C'11, C12, and C'12; the total length of the coupler line of coupler C2 is the sum of the lengths of the coupler lines of C21, C'21, C22, and C'22; the total length of the coupler line of coupler C3 is the sum of the lengths of the coupler lines of C31, C'31, C32, and C'32; and the total length of the quarter-wavelength line M is the sum of the lengths of the first signal line 310 and the second signal line 330.

[0063] In some embodiments, a portion of the lines of the three couplers and another portion of the lines of the three couplers are both half of the lines of the three couplers. That is, the first line 311 and the second line 312 are connected together to form half of the lines of the three couplers, and the third line 331 and the fourth line 332 are connected together to form the other half of the lines of the three couplers. In this way, the lines of the three couplers are evenly distributed on the first core plate 31 and the second core plate 33, so that the area occupied by the lines on the first core plate 31 and the second core plate 33 is the same. This not only reduces the size of the four-phase coupler, but also improves the alignment accuracy of half of the lines of the three couplers and the other half of the lines of the three couplers, thus shortening the connection path.

[0064] It should be noted that, since the coupler circuits are coil-type lines, half of the circuits of the three couplers can be divided into two parts of the same length, namely the first line 311 and the second line 312. Similarly, the other half of the circuits of the three couplers can also be divided into two parts of the same length, namely the third line 331 and the fourth line 332. In this way, the first line 311, the second line 312, the third line 331, and the fourth line 332 are coupling lines of the same length and occupy roughly the same area. This is beneficial for setting the first core board 31 and the second core board 33 to be the same size, making the circuit distribution of the four-phase coupler more uniform and compact, thereby reducing the size of the four-phase coupler.

[0065] In some embodiments, reference Figure 2The surface of the first core board 31 where the first signal line 310 is disposed is opposite to the surface of the second core board 33 where the second signal line 330 is disposed. That is, the L4 layer and the L7 layer are disposed opposite each other. This allows for a shorter connection distance between the first signal line 310 and the second signal line 330, facilitating their connection to form a quarter-wavelength line. The lengths of the first signal line 310 and the second signal line 330 can be set to be the same, ensuring they occupy the same area. Furthermore, the opposite arrangement of the first signal line 310 and the second signal line 330 helps reduce the size of the four-phase coupler.

[0066] In this embodiment, the signal connection hole is a metal hole used to connect the signal terminals of each layer, and the diameter of the signal connection hole is 0.1mm. This embodiment has 15 signal connection holes, namely H1, H2, H3, H4, H5, H6, H7, H8, H9, H10, H11, H12, H13, H14, and H15.

[0067] In some embodiments, the signal connection holes on the first core board 31 and the second core board 33 are provided with metal rings 5 ​​at their edges. This facilitates the processing of the signal connection holes and also makes the interconnected circuits of each layer more securely connected through the signal connection holes, resulting in better conductivity.

[0068] Specifically, Figure 5 The outer ring of each of the signal connection holes H1, H2, H3, H4, H5, H6, H7, H8, H12, H14, and H15 has a metal ring 5. Figure 6 The outer ring of each of the signal connection holes H1, H2, H3, H4, H5, H6, H10, H12, and H14 has a metal ring 5. Figure 8 The outer ring of each of the signal connection holes H1, H2, H3, H4, H5, H6, H10, H12, and H14 has a metal ring 5. Figure 9 The outer ring of each of the signal connection holes H1, H2, H3, H4, H5, H6, H11, H13, and H15 has a metal ring 5.

[0069] refer to Figure 7 , Figure 7 The diagram shows layers L5-L6. The support plate 32 is made of an iron-nickel alloy. The support plate 32 has filling holes filled with resin, and signal connection holes are formed in the resin. In this way, the support plate 32 not only enhances the overall rigidity of the coupler structure but also acts as a metal shield, preventing short circuits caused by contact between the signal connection holes and the support plate 32.

[0070] Specifically, nine filling holes P, each 0.3 mm in diameter, are drilled on the support plate 32. Resin is applied to the upper and lower surfaces of the support plate 32, and after pressing and heating, the filling holes P are filled with resin. Signal connection holes H1, H2, H3, H4, H5, H6, H10, H12, and H14 are precisely machined and pass through the filling holes P. These signal connection holes H1, H2, H3, H4, H5, H6, H10, H12, and H14 are not connected to the support plate 32. The support plate 32 serves to ensure the four-phase coupler does not deform during manufacturing, provides fixation, and prevents the upper and lower circuits of the four-phase coupler from coupling and interfering with each other. It is important to note that the nine filling holes P are only present on the support plate 32 and not on other core plates of the coupler structure.

[0071] refer to Figures 10-11 , Figure 10 The image shows floor L9. Figure 11 The diagram shows layer L10. The bottom core board 2 has signal connection holes and displacement holes 20 connected to the signal connection holes via connecting lines 201. The second grounding metal layer 22 has insulating sheets 202 surrounding the signal connection holes, connecting lines 201, and displacement holes 20. This allows each signal line, grounding hole, or grounding wire to be routed to the desired location on the bottom layer of the four-phase coupler, completing the wiring of the bottom layer pins of the four-phase coupler.

[0072] It should be noted that the entire second ground metal layer 22 is a ground layer. Therefore, the insulating sheet 202 around the signal connection hole and the displacement hole 20 can effectively prevent the signal connection hole and the displacement hole 20 from connecting to the second ground metal layer 22, thus avoiding grounding of each layer of circuits during electrical connection.

[0073] In this embodiment, the bottom layer 21 (L10 layer) printed on the bottom core board 2 has an input terminal 211 of a four-phase coupler, a 0° output terminal, a -90° output terminal, a -180° output terminal, and a -270° output terminal, as well as a ground terminal 223 of the four-phase coupler. A metal grounding hole Gh is also provided on the bottom core board 2, which is connected to the ground terminal 223 of the bottom layer of the four-phase coupler.

[0074] For details, please refer to Figures 10-11The signal connection hole H15 leads to the input terminal 211 of the four-phase coupler, i.e., the position of the signal input terminal C1-1. The signal connection hole H11 leads to the 0° output terminal, i.e., the coupling terminal C2-2 of coupler C2. The signal connection hole H12 leads to the -90° output terminal, i.e., the through terminal C2-3 of coupler C2. The signal connection hole H13 leads to the -180° output terminal, i.e., the coupling terminal C3-2 of coupler C3. The signal connection hole H14 leads to the -270° output terminal, i.e., the through terminal C3-3 of coupler C3.

[0075] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A coupler structure, characterized in that, include: The top core board (1) has a top circuit layer (11) and a first ground metal layer (12) printed on its two opposite surfaces. The top circuit layer (11) includes three loads (110). The bottom core board (2) has a bottom circuit layer (21) and a second ground metal layer (22) printed on its two opposite surfaces. The bottom circuit layer (21) includes an input terminal (211), four output terminals (222) and a ground terminal (223). The phase difference between two adjacent output terminals (222) is 90 degrees. The ground terminal (223), the first ground metal layer (12) and the second ground metal layer (22) are connected. The intermediate layer (3) is stacked with the top core board (1) and the bottom core board (2) through a dielectric layer (4). The intermediate layer (3) includes a first core board (31), a support plate (32), and a second core board (33) stacked sequentially through the dielectric layer (4). The first core board (31) is provided with a portion of the circuit of three couplers and a first signal line (310). The second core board (33) is provided with another portion of the circuit of three couplers and a second signal line (330). The first signal line (310) and the second signal line (330) are connected to form a quarter-wavelength line. A portion of the circuitry of the three couplers includes a first line (311) and a second line (312) respectively disposed on opposite surfaces of the first core board (31), wherein the first signal line (310) and the second line (312) are disposed on the same surface of the first core board (31) and connected to each other; Another part of the circuit of the three couplers includes a third line (331) and a fourth line (332) respectively disposed on opposite surfaces of the second core board (33), and the second signal line (330) and the third line (331) are disposed on the same surface of the second core board (33) and connected to each other; Signal connection holes are provided on the first core board (31), the second core board (33), and the support plate (32). The first line (311), the second line (312), the third line (331), and the fourth line (332) are connected through the signal connection holes to form three couplers. The first signal line (310) and the second signal line (330) are connected through the signal connection holes to form a quarter-wavelength line. One portion of the circuitry of each of the three couplers and another portion of the circuitry of the three couplers are both half of the circuitry of the three couplers.

2. The coupler structure according to claim 1, characterized in that, The surface of the first core board (31) on which the first signal line (310) is disposed is opposite to the surface of the second core board (33) on which the second signal line (330) is disposed.

3. The coupler structure according to claim 1 or 2, characterized in that, The coupling line width of one of the three couplers is 0.065 mm, and the coupling line width of the other two couplers is 0.08 mm. The width of both the first signal line (310) and the second signal line (330) is 0.1 mm.

4. The coupler structure according to claim 1 or 2, characterized in that, The signal connection holes on the first core plate (31) and the second core plate (33) are provided with metal rings (5) at their edges.

5. The coupler structure according to claim 1 or 2, characterized in that, The support plate (32) is made of iron-nickel alloy material; The support plate (32) has a filling hole, which is filled with resin, and the resin has a signal connection hole.

6. The coupler structure according to claim 5, characterized in that, The diameter of the filling hole is 0.3 mm, and the diameter of the signal connection hole is 0.1 mm.

7. The coupler structure according to claim 1 or 2, characterized in that, The bottom core board (2) is provided with the signal connection hole and the displacement hole (20) connected to the signal connection hole through the connecting line (201). The second ground metal layer (22) is provided with an insulating sheet (202) located around the signal connection hole, the connecting line and the displacement hole.

8. The coupler structure according to claim 1 or 2, characterized in that, The top core board (1) has an identifier (6) on one side surface where the top circuit layer (11) is printed. The identifier (6) is used to identify the front, back and taping direction of the coupler structure. And / or, the top core board (1) has an input terminal mark (71) and an output phase mark (72) printed on one side surface of the top circuit layer (11).

9. The coupler structure according to claim 1 or 2, characterized in that, The dimensions of the coupler structure are 5.3mm*3.4mm*0.8mm; And / or, the thickness of the top core board (1) is 0.05 mm, the thickness of the dielectric layer (4) between the top core board (1) and the intermediate layer (3) is 0.07 mm, the thickness of the first core board (31) is 0.01 mm, the thickness of the dielectric layer (4) between the first core board (31) and the support plate (32) is 0.09 mm, the thickness of the support plate (32) is 0.06 mm, the thickness of the dielectric layer (4) between the support plate (32) and the second core board (33) is 0.09 mm, the thickness of the second core board (33) is 0.01 mm, the thickness of the dielectric layer (4) between the intermediate layer (3) and the bottom core board (2) is 0.07 mm, and the thickness of the bottom core board (2) is 0.05 mm.