A heat dissipation structure for a photoelectric board card

Abstract

The application provides a heat dissipation structure for an optoelectronic board card, which is characterized by being provided with a first heat dissipation assembly on the side of a laser assembly, and the first heat dissipation assembly is specially designed, that is, a plurality of first rib segments on the first heat dissipation assembly are sequentially connected end to end and surround a polygonal cavity, each laser emitter is accommodated in each cavity, and two first rib segments at the tail of each cavity hold the corresponding fiber structure at the end position close to the tail, so that the laser emitter and the fiber structure are not directly blown by the heat dissipation wind flow, the laser emitter and the fiber structure are protected, and heat isolation between the laser emitter and a large photon-electron hybrid chip is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optoelectronic transmission and optoelectronic computing technology, and in particular to a heat dissipation structure for an optoelectronic board card. BACKGROUND

[0002] In the conventional technology, an electronic integrated circuit chip is generally the entire heat sink, and its typical feature is that the height is relatively low, so that the space left for the heat sink is also large enough (a large space is easy to dissipate heat), and it does not involve a photonic integrated circuit chip and an optical package.

[0003] In recent years, photonic-electronic hybrid chips are being used more and more widely, and the typical feature of the optical package involving a photonic integrated circuit chip is that the height is relatively high and it is sensitive to temperature, because temperature will affect the wavelength and power of the laser, and in addition, the photonic integrated circuit chip needs to be transmitted from the laser transmitter to the inside of the photonic integrated circuit chip via an optical fiber structure.

[0004] However, the existing optoelectronic board card integrated with a photonic-electronic hybrid chip lacks effective design for the laser transmitter part, so it cannot guarantee effective heat dissipation of the laser transmitter, cannot guarantee the influence of the laser transmitter on the subsequent heat sink due to its large size, and cannot guarantee the fixation of the optical fiber structure. Therefore, there is an urgent need to propose a new heat dissipation structure for an optoelectronic board card. SUMMARY

[0005] In order to overcome the shortcomings of the prior art, the purpose of the present application is to provide a heat dissipation structure for an optoelectronic board card, which can guarantee effective heat dissipation of the laser transmitter and can also avoid the influence of the laser transmitter on the subsequent heat sink due to its large size.

[0006] The purpose of the present application is achieved by adopting the following technical solutions:

[0007] According to one aspect of the present application, a heat dissipation structure for an optoelectronic board card is provided, comprising:

[0008] a substrate having a first surface, a laser assembly and a photonic-electronic hybrid chip being arranged on the first surface, the laser assembly and the photonic-electronic hybrid chip being arranged along a first direction;

[0009] the laser assembly comprising a plurality of laser transmitters and a plurality of optical fiber structures arranged along a second direction, the plurality of laser transmitters being arranged one-to-one with the plurality of optical fiber structures, wherein the first direction intersects the second direction;

[0010] The photon-electron hybrid chip comprises a photonic integrated circuit chip, wherein a waveguide array and an optical coupler are arranged on the photonic integrated circuit chip, the plurality of optical fiber structures are aligned with the optical couplers in the photonic integrated circuit chip one by one to transmit the light emitted by the plurality of laser emitters to the photonic integrated circuit chip, and the optical coupler is configured to perform mode spot conversion on the light input through the plurality of optical fiber structures and couple the mode spot converted light to the waveguide array in the photonic integrated circuit chip.

[0011] Further, a first heat dissipation assembly is arranged above the first surface, the first heat dissipation assembly comprises a plurality of first rib segments, the plurality of first rib segments are sequentially connected end to end and surround to form a polygonal cavity, and each of the laser emitters is accommodated in each of the cavities.

[0012] Along the first direction, each of the cavities comprises a head and a tail, the tail comprises two first rib segments, and at the end position adjacent to the tail, the two first rib segments are close to each other and hold the corresponding optical fiber structure.

[0013] Further, the head comprises two first rib segments, at the front end position adjacent to the head, the two first rib segments are close to each other and converge to form a sharp edge structure, and at the end position adjacent to the head, the two first rib segments are separated from each other.

[0014] Further, the first heat dissipation assembly further comprises a plurality of second rib segment groups arranged along a second direction, each of the second rib segment groups comprises a plurality of second rib segments, and the plurality of second rib segments extend along the first direction and are arranged along the second direction.

[0015] Further, along the second direction, the cavity is located between two adjacent second rib segment groups.

[0016] Further, the two second rib segments located on both sides of the cavity form two air inlet ports with the two first rib segments located at the head, respectively.

[0017] Further, a second heat dissipation assembly is further included, the second heat dissipation assembly is located on the side of the photon-electron hybrid chip away from the substrate, and the second heat dissipation assembly comprises a carrier plate and a plurality of heat dissipation fins located above the carrier plate.

[0018] Further, the plurality of heat dissipation fins extend along the first direction and are arranged along the second direction.

[0019] Further, the carrier plate and the surface of the side of the photon-electron hybrid chip away from the substrate are in contact through a first heat dissipation pad.

[0020] Further, one or more small chips are arranged on the first surface of the substrate, and in the direction parallel to the first surface, the one or more small chips and the photon-electron hybrid chip are fixed on the region of the first surface covered by the projection of the second heat dissipation component.

[0021] Further, the side surface of the one or more small chips away from the substrate is in contact with the second heat dissipation pad.

[0022] The heat dissipation structure for the optoelectronic board card provided by the embodiment of the present application is designed by arranging the first heat dissipation component on the side of the laser component and specially designing the first heat dissipation component, that is, a plurality of first rib segments on the first heat dissipation component are sequentially connected end to end and surround to form a polygonal cavity, each laser emitter is correspondingly accommodated in each cavity, and two first rib segments at the tail of each cavity hold the corresponding fiber structure at the end position close to the tail, so that the laser emitter and the fiber structure are not directly blown by the heat dissipation wind flow, the laser emitter and the fiber structure are protected, and the thermal isolation between the laser emitter and the large photon-electron hybrid chip is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other embodiments can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0024] Figure 1 is a structural schematic diagram of the heat dissipation structure for the optoelectronic board card according to the embodiment of the present application.

[0025] Figure 2 is a top view structural schematic diagram of the heat dissipation structure for the optoelectronic board card shown in Figure 1 .

[0026] Figure 3 is a side view structural schematic diagram of the heat dissipation structure for the optoelectronic board card from the length direction according to Figure 1 .

[0027] Figure 4 is a side view structural schematic diagram of the heat dissipation structure for the optoelectronic board card from the width direction according to Figure 1 . DETAILED DESCRIPTION

[0028] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0030] To make the objectives, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] Figure 1 This is a schematic diagram of a heat dissipation structure for an optoelectronic board according to an embodiment of the present invention. Figure 2 It is based on Figure 1 The diagram shows a top view of the heat dissipation structure for an optoelectronic board. Figure 3 It is based on Figure 1 The diagram shows a side view of the heat dissipation structure for an optoelectronic board, viewed from the length direction. Figure 4 It is based on Figure 1 The diagram shows a side view of the heat dissipation structure for an optoelectronic board, viewed from the width direction.

[0032] like Figures 1-4 As shown, the heat dissipation structure for an optoelectronic board provided in this embodiment of the invention includes:

[0033] The substrate 101 has a first surface 101a on which a laser assembly 200 and a photonic-electronic hybrid chip 401 (i.e. a chip that is a hybrid package of a photonic integrated circuit chip and an electronic integrated circuit chip) are disposed. The laser assembly 200 and the photonic-electronic hybrid chip 401 are arranged along a first direction.

[0034] The laser assembly 200 includes a plurality of laser emitters 210 and a plurality of fiber structures 220 arranged along a second direction, wherein the plurality of laser emitters 210 and the plurality of fiber structures 220 are arranged in a one-to-one correspondence, wherein the first direction intersects the second direction.

[0035] The photon-electronic hybrid chip 401 comprises a photonic integrated circuit chip, and a waveguide array (not shown in the figure) and an optical coupler (not shown in the figure) are arranged on the photonic integrated circuit chip. The plurality of optical fiber structures 220 are aligned with the optical coupler (not shown in the figure) in the photonic integrated circuit chip one by one to transmit the light emitted by the plurality of laser emitters 210 to the photonic integrated circuit chip. The optical coupler (not shown in the figure) is configured to perform mode spot conversion on the light input through the plurality of optical fiber structures 220 and couple the mode spot converted light to the waveguide array (not shown in the figure) in the photonic integrated circuit chip.

[0036] The first heat dissipation assembly 300 is further arranged above the first surface 101a, and the first heat dissipation assembly 300 comprises a plurality of first rib segments 301. The plurality of first rib segments 301 are sequentially connected end to end and surround a polygonal cavity 310. Each of the laser emitters 210 is accommodated in each of the cavities 310.

[0037] In the first direction, each of the cavities 310 comprises a head portion 311 and a tail portion 312. The tail portion 312 comprises two first rib segments 301. At the end position adjacent to the tail portion 312, the two first rib segments 301 are close to each other and hold the corresponding optical fiber structure 220.

[0038] Exemplarily, in the embodiment of the present application, the substrate 101 is a board card, a PCB (Printed Circuit Board) or a circuit board. The substrate 101 is a support body of electronic components (such as a photon-electronic hybrid chip and other chips) and is also a carrier for electrical connection of electronic components. For example, copper design is performed on the substrate 101 to serve as a connection wire.

[0039] Specifically, in the embodiment of the present application, the photonic integrated circuit chip is used for information processing and data transmission by taking photons as information carriers, which can be a silicon-based optical chip. The electronic integrated circuit chip is used for information processing and data transmission by taking electrons as information carriers, which can be a silicon-based electronic chip, a germanium-based electronic chip or a compound semiconductor electronic chip. The integration of the photon-electronic hybrid chip can be realized by stacking the photonic integrated circuit chip and the electronic integrated circuit chip. At least one electronic integrated circuit chip is fixed on one side surface of each photonic integrated circuit chip by welding or other means. For example, at least one electronic integrated circuit chip is fixed on one side surface of each photonic integrated circuit chip by flip-chip welding.

[0040] It should be noted that, in the embodiment of the present application, the laser emitter 210 needs to be placed at the upper air outlet because the wind temperature required by the laser emitter 210 is low. However, due to the large size of the laser emitter 210, the heat dissipation air flow will be blocked, which will affect the heat dissipation of the subsequent electronic components. Therefore, some structural transitions need to be made to avoid the loss of wind pressure and the drastic change of wind direction, so that the heat dissipation air flow cannot blow on the subsequent heat dissipation components (heat sinks), thereby causing the effective air cooling to be unable to be realized. In addition, the optical fiber structure 220 cannot be exposed to the wind, otherwise it will be blown away.

[0041] In addition, the first heat dissipation component 300 is not in direct contact with the substrate 101, but is located above the substrate 101, because there are some small chips 402 below the first heat dissipation component 300 which share heat dissipation with the laser assembly 200. These small chips 402 are usually power supply chips and controller chips of the laser emitter 210. In addition, a capillary tube (not shown in the figure) is usually arranged inside the carrier plate 105 of the first heat dissipation component 300, and there are some chambers in the capillary tube, which are used as conventional heat dissipation chambers.

[0042] Therefore, one of the purposes of the embodiment of the present application is to provide a heat dissipation structure for an optoelectronic board card, which can not only meet the lower wind temperature required by the laser emitter, but also avoid heat exchange between the heat dissipation components of the laser emitter and the photon-electronic hybrid chip, and can also realize clamping and fixing of the optical fiber structure, prevent the optical fiber structure from shaking, deforming and misplacing during air cooling, thereby causing the problem of poor optical coupling efficiency between the optical fiber structure and the photon integrated circuit chip in the photon-electronic hybrid chip.

[0043] Exemplarily, in the embodiment of the present application, the laser assembly 200 and the photon-electronic hybrid chip 401 are arranged along a first direction, the laser assembly 200 includes a plurality of laser emitters 210 and a plurality of optical fiber structures 220 arranged along a second direction, the plurality of laser emitters 210 and the plurality of optical fiber structures 220 are one-to-one corresponding, and the first direction intersects the second direction. In some embodiments, the first direction can also be the main extension direction of the heat dissipation air flow line 302 of the first heat dissipation component 300. In some embodiments, the first direction is substantially perpendicular to the second direction.

[0044] Exemplarily, the first heat dissipation assembly 300 comprises a plurality of first rib segments 301, which are sequentially connected end to end and surround to form a polygonal cavity 310, for example, four polygonal cavities 310 are shown in the figure, which can be adaptively adjusted according to the number of laser emitters 210 in actual use. Each laser emitter 210 is correspondingly accommodated in each cavity 310, and each cavity 310 comprises a head 311 and a tail 312 along the first direction, and the tail 312 comprises two first rib segments 301, which are close to each other at the end position adjacent to the tail 312 and hold the corresponding fiber structure 220.

[0045] The technical scheme provided by the embodiment of the present application aims to set the first heat dissipation assembly on the side of the laser assembly and specially design the first heat dissipation assembly, that is, sequentially connect end to end and surround to form a polygonal cavity with a plurality of first rib segments on the first heat dissipation assembly, accommodate each laser emitter in each cavity, and hold the corresponding fiber structure at the end position close to the tail of each cavity with two first rib segments of the tail, so as to prevent the laser emitter and the fiber structure from being directly blown by the heat dissipation wind flow, protect the laser emitter and the fiber structure, and ensure the thermal isolation between the laser emitter and the large photon-electron hybrid chip.

[0046] Further, in some embodiments, the head 311 comprises two first rib segments 301, which are close to each other and converge to form a sharp edge structure at the front end position adjacent to the head 311 along the first direction, and the two first rib segments 301 are separated from each other at the end position adjacent to the head 311, so that the heat dissipation wind flow line 302 can flow along the extension direction of the side wall of the sharp edge structure, reducing the wind pressure loss and further affecting the heat dissipation of subsequent electronic components.

[0047] Further, the first heat dissipation assembly 300 further comprises a plurality of second rib segment groups 320 arranged along a second direction, each second rib segment group 320 comprising a plurality of second rib segments 322 extending along the first direction and arranged along the second direction.

[0048] Exemplarily, each second rib segment group 320 comprises 3, 4 or more second rib segments 322, and the plurality of second rib segments 322 extend along the first direction and are arranged along the second direction.

[0049] Further, along the second direction, the cavity 310 is located between two adjacent second rib segment groups 320, so that the wind cooling is uniformly applied to the periphery of the laser module 200, and the wind direction does not change dramatically.

[0050] Further, the two second rib segments 322 located on both sides of the cavity 310 and the two first rib segments 301 located on the head 311 form two air inlet ports 330 respectively, and the cooling gas enters from the air inlet port 330 located on each side of the cavity 310.

[0051] Exemplarily, the heat dissipation structure for the optoelectronic board card provided by the embodiment of the present application further comprises a second heat dissipation assembly 500 located on the side of the photon-electron hybrid chip 401 away from the substrate 101, and the second heat dissipation assembly 500 comprises a bearing plate 510 and a plurality of heat dissipation fins 511 located on the bearing plate 510. The material of the plurality of heat dissipation fins 511 is mainly aluminum and copper, which is used to dissipate the heat transferred from the hot end in the form of convection.

[0052] Further, the plurality of heat dissipation fins 511 extend along the first direction and are arranged along the second direction, so as to drive away the heat on the side of the second heat dissipation assembly 500 by the transferred wind cooling from the side of the first heat dissipation assembly 300, and the gap between two adjacent heat dissipation fins 511 can also be used as an air outlet to discharge the heat.

[0053] In some embodiments, the bearing plate 510 is in contact with the side surface of the photon-electron hybrid chip 401 away from the substrate 101 through a first heat dissipation pad 61.

[0054] Further, one or more small chips 402 are arranged on the first surface 101a of the substrate 101, and in the direction parallel to the first surface 101a, the one or more small chips 402 and the photon-electron hybrid chip 401 are fixed on the region of the first surface 101a covered by the projection of the second heat dissipation assembly 500. That is, the one or more small chips 402 and the photon-electron hybrid chip 401 share heat dissipation through the second heat dissipation assembly 500.

[0055] In some embodiments, the bearing plate 510 is in contact with the side surface of the one or more small chips 402 away from the substrate 101 through a second heat dissipation pad 62.

[0056] It should be noted that in the embodiment of the present application, in the thickness direction of the substrate 101, the thickness of the photon-electron hybrid chip 401 is relatively thick, so the photon-electron hybrid chip 401 is usually in contact with the carrier plate 510 through a thin heat dissipation pad, and one or more small chips near the photon-electron hybrid chip 401 are usually in contact with the carrier plate 510 through a thick heat dissipation pad due to the relatively thin thickness of the one or more small chips. Therefore, the thickness of the first heat dissipation pad 61 is usually greater than the thickness of the second heat dissipation pad 62.

[0057] From the above, it can be seen that the heat dissipation structure for the optoelectronic board card provided by the embodiment of the present application aims to set a first heat dissipation assembly on the side of the laser assembly and specially design the first heat dissipation assembly: in particular, a plurality of first rib segments on the first heat dissipation assembly are sequentially connected end to end and surround to form a polygonal cavity, each laser emitter is correspondingly accommodated in each of the cavities, and two first rib segments at the tail of each cavity hold the corresponding fiber structure at the end position close to the tail, so as to ensure that the laser emitter and the fiber structure are not directly blown by the heat dissipation wind flow, thereby protecting the laser emitter and the fiber structure, and at the same time, heat isolation between the laser emitter and the large photon-electron hybrid chip can be ensured.

[0058] The above is only the preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any equivalent changes and modifications made in the shape, structure, features and spirit of the present application within the scope of the claims of the present application should be included in the scope of the claims of the present application.

Claims

1. A heat dissipation structure for an optoelectronic board, characterized in that, include: A substrate having a first surface on which a laser assembly and a photonics-electron hybrid chip are disposed, the laser assembly and the photonics-electron hybrid chip being arranged along a first direction; The laser assembly includes a plurality of laser emitters and a plurality of fiber structures arranged along a second direction, wherein the plurality of laser emitters and the plurality of fiber structures are arranged in a one-to-one correspondence, and wherein the first direction intersects the second direction; The photonics-electronics hybrid chip includes a photonic integrated circuit chip, on which a waveguide array and an optical coupler are disposed. The plurality of optical fiber structures are aligned one-to-one with the optical coupler within the photonic integrated circuit chip to transmit light emitted by the plurality of laser emitters to the photonic integrated circuit chip. The optical coupler is configured to perform mode conversion on the light input via the plurality of optical fiber structures and couple the mode-converted light to the waveguide array within the photonic integrated circuit chip. A first heat dissipation component is also provided above the first surface. The first heat dissipation component includes a plurality of first rib segments. The plurality of first rib segments are connected end to end in sequence and surround to form a polygonal cavity. Each laser emitter is correspondingly housed in each cavity. Along the first direction, each cavity includes a head and a tail, the tail including two first rib segments, which are close to each other and clamp the corresponding optical fiber structure at the end adjacent to the tail.

2. The heat dissipation structure for optoelectronic circuit boards as described in claim 1, characterized in that, The head includes two first rib segments. Along the first direction, at the front end position near the head, the two first rib segments approach each other and converge to form a pointed edge structure, and at the end position near the head, the two first rib segments separate from each other.

3. The heat dissipation structure for optoelectronic boards as described in claim 1, characterized in that, The first heat dissipation component further includes a plurality of second rib segments arranged along a second direction, each second rib segment group including a plurality of second rib segments, the plurality of second rib segments extending along the first direction and arranged along the second direction.

4. The heat dissipation structure for optoelectronic boards as described in claim 3, characterized in that, Along the second direction, the cavity is located between two adjacent groups of the second rib segments.

5. The heat dissipation structure for optoelectronic circuit boards as described in claim 4, characterized in that, The two second rib segments located on both sides of the cavity and the two first rib segments located at the head form two air intake ports respectively.

6. The heat dissipation structure for optoelectronic boards as described in claim 1, characterized in that, It also includes a second heat dissipation component. The second heat dissipation component is located on the side of the photonic-electronic hybrid chip away from the substrate, and the second heat dissipation component includes a carrier plate and a plurality of heat dissipation fins located on the carrier plate.

7. The heat dissipation structure for optoelectronic boards as described in claim 6, characterized in that, The plurality of heat dissipation fins extend along the first direction and are arranged along the second direction.

8. The heat dissipation structure for optoelectronic boards as described in claim 6, characterized in that, The carrier plate is in contact with the side of the photonic-electronic hybrid chip facing away from the substrate through a first heat dissipation pad.

9. The heat dissipation structure for optoelectronic boards as described in claim 6, characterized in that, One or more small chips are also disposed on the first surface of the substrate, and in a direction parallel to the first surface, the one or more small chips and the photon-electron hybrid chip are fixed on the area of ​​the first surface covered by the projection of the second heat dissipation component.

10. The heat dissipation structure for an optoelectronic board as described in claim 9, characterized in that, The carrier plate is in contact with the side of the one or more small chips facing away from the substrate through a second heat dissipation pad.

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