Electronic device including display module having multiple FPCBs

Abstract

An electronic device according to various embodiments disclosed in this document includes a frame, a first partition wall formed to protrude from the frame in a first direction and to divide the frame into a first area and a second area, a second partition wall portion formed to protrude from the frame in the first direction and to divide the frame into the second area and a third area, a first printed circuit board disposed in the first area of the frame, a battery disposed in the second area of the frame, a second printed circuit board disposed in the third area of the frame, and a display module including at least two flexible printed circuit boards and disposed on the frame in a second direction opposite to the first direction. The flexible printed circuit boards of the display module include an overlapping area in which at least some areas overlap, the overlapping area can be disposed in the second area, spaced apart from the first partition wall portion, and in the frame, an opening can be formed in a portion facing the overlapping area of the flexible printed circuit boards of the display module. Various other embodiments are also possible.

Description

Technical Field

[0001] The various embodiments disclosed in this disclosure relate to electronic devices including display modules having multiple flexible printed circuit boards (FPCBs). Background Technology

[0002] A display module including a touchscreen configured to perform touch functions may include multiple flexible printed circuit boards, the multiple flexible printed circuit boards having flexible printed circuit boards connected to the touchscreen.

[0003] Depending on the type of display module, the display driver IC (DDI) configured to drive the display can be mounted on one of multiple flexible printed circuit boards. To achieve a high-speed response display, the area of ​​the flexible printed circuit board on which the DDI is mounted can also be increased. Therefore, the positions of the overlapping areas of the multiple flexible printed circuit boards may change.

[0004] On the other hand, as electronic devices become smaller and thinner, their internal space also becomes narrower. Summary of the Invention

[0005] Technical issues

[0006] To secure a battery located inside an electronic device to its original position, a mechanism for holding the battery in place can exist. This mechanism can also be used to stably hold the battery in its original position even when an external impact is applied to the electronic device.

[0007] As the size of the multiple flexible printed circuit boards included in the display module increases, interference may occur between the overlapping areas of the multiple flexible printed circuit boards and the mechanism used to fix the battery.

[0008] To avoid this interference, a method that partially utilizes the deformation of the mechanism used to fix the battery can be used, but in this case, the battery may become more susceptible to impact.

[0009] Various embodiments of this disclosure can provide an electronic device that avoids interference between overlapping areas of multiple flexible printed circuit boards included in a display module and a mechanism for securing a battery without deformation of the battery-secured mechanism, and includes a structure capable of maintaining the thickness of the electronic device.

[0010] Solution to the problem

[0011] An electronic device according to various embodiments of the present disclosure may include: a frame; a first partition wall formed to protrude from the frame in a first direction and divide the frame into a first region and a second region; a second partition wall portion formed to protrude from the frame in the first direction and divide the frame into a second region and a third region; a first printed circuit board disposed in the first region of the frame; a battery disposed in the second region of the frame; a second printed circuit board disposed in the third region of the frame; and a display module including at least two flexible printed circuit boards disposed on the frame in a second direction opposite to the first direction, wherein the flexible printed circuit boards of the display module may include at least some overlapping regions therein, the overlapping regions may be disposed in the second region and spaced apart from the first partition wall portion, and in the frame, an opening may be formed in the portion of the overlapping region facing the flexible printed circuit boards of the display module.

[0012] An electronic device according to various embodiments of the present disclosure includes: a frame; a first partition wall formed to protrude from the frame in a first direction and divide the frame into a first region and a second region; a first printed circuit board disposed on the first region of the frame; a battery disposed on the second region of the frame; and a display module including at least two flexible printed circuit boards disposed on the frame in a second direction opposite to the first direction, wherein the flexible printed circuit boards of the display module include overlapping regions therein, the overlapping regions may be disposed in the second region and spaced apart from the first partition wall portion, and in the frame, an opening may be formed in the portion of the overlapping region facing the flexible printed circuit boards of the display module.

[0013] Beneficial effects of the invention

[0014] According to various embodiments of this disclosure, interference between the mechanism for securing the battery and the overlapping areas of multiple flexible printed circuit boards included in the display module can be avoided. Furthermore, the problem of increased electronic device thickness due to the overlap of the multiple flexible printed circuit boards can be resolved. Attached Figure Description

[0015] Regarding the description of the accompanying drawings, the same or similar elements may be represented by the same or similar reference numerals.

[0016] Figure 1 This is a block diagram of an electronic device in a network environment according to various embodiments.

[0017] Figure 2 This is an exploded perspective view of a display module according to various embodiments of the present disclosure.

[0018] Figure 3a This is an exploded perspective view of a plurality of flexible printed circuit boards included in a display module according to various embodiments of the present disclosure.

[0019] Figure 3b yes Figure 3a The diagram shows a perspective view of the multiple flexible printed circuit boards connected together.

[0020] Figure 4 This is a cross-sectional view of a jelly roll structure of a battery included in an electronic device according to various embodiments of the present disclosure.

[0021] Figure 5a This is a plan view of a frame and a display module connected to the frame according to various embodiments of the present disclosure.

[0022] Figure 5b This is a plan view of a display module according to various embodiments of the present disclosure.

[0023] Figure 6a This is a cross-sectional side view of an electronic device according to various embodiments of the present disclosure.

[0024] Figure 6b yes Figure 6a An enlarged view of part S shown.

[0025] Figure 6c yes Figure 6b A schematic diagram of some of the components is shown.

[0026] Figure 7 This is a view used to illustrate the arrangement relationship of a first printed circuit board, a second printed circuit board, and a battery in an electronic device according to various embodiments of the present disclosure. Detailed Implementation

[0027] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the particular embodiments, and include various variations, equivalents or substitutions for the corresponding embodiments.

[0028] Regarding the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related parts. It will be understood that the singular form of a noun corresponding to an item may include one or more things, unless the relevant context clearly indicates otherwise.

[0029] As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B or C” may include any or all possible combinations of the items listed together in the corresponding phrase. Terms such as “first” and “second” or “first” and “second” as used herein may be used simply to distinguish corresponding components from one other component and do not otherwise limit the components (e.g., importance or order). It will be understood that if a component (e.g., the first component) is referred to as “connected”, “linked to”, “connected to”, or “attached to” another element (e.g., the second component) with or without the terms “operationally” or “communically”, it means that the component can be connected to that other component directly (e.g., wired), wirelessly, or via a third component.

[0030] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. (Refer to...) Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0031] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0032] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0033] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0034] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0035] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0036] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0037] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0038] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0039] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0040] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0041] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0043] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0044] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0045] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0046] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0047] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0048] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0049] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0050] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0051] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0052] Figure 2 This is an exploded perspective view of a display module according to various embodiments of the present disclosure.

[0053] Electronic devices having structures according to various embodiments of the present disclosure (e.g., Figure 1 The electronic device 101 in the middle may include various types of display modules having multiple flexible printed circuit boards (FPCBs) (e.g., Figure 1The display module 160 in this disclosure refers to a display module having a structure such as chip on glass (COG), chip on film (COF), or chip on plastic (COP). Here, COG can refer to a display module having a panel and a display driver IC (DDI) disposed on a substrate made of glass. COF can refer to a display module having a panel disposed on a substrate made of glass or a flexible material (e.g., polyimide) and a DDI disposed on a flexible printed circuit board. COP can refer to a display module having a panel and a DDI disposed on a substrate made of a flexible material.

[0054] Such a display module may include multiple flexible printed circuit boards (e.g., Figure 2 Flexible printed circuit boards 201, 202, and 203 in the display module). Multiple flexible printed circuit boards included in the display module may include connections to a touchscreen (e.g., Figure 2 The flexible printed circuit board of the touch screen 230 (e.g., Figure 2 The flexible printed circuit board 201 in the middle) is connected to the panel (e.g., Figure 2 Flexible printed circuit board (e.g., panel 220) in the middle. Figure 2 Flexible printed circuit board 202) and flexible printed circuit board connected to printed circuit board of electronic device (e.g., Figure 2 (Flexible printed circuit board 203 in the example). In the following description, a display module 200 with a COF structure will be used as a representative example.

[0055] Reference Figure 2 The display module 200 may include a structure in which a touch screen 230, a panel 220, a substrate 210, a polarizing film 240 and an adhesive member 250 are stacked. Figure 2 The structure of the display module 200 shown illustrates some of the various components included in the display module 200, and in addition to Figure 2 In addition to the components shown, the display module 200 may also include other components. Furthermore, in some cases, Figure 2 Some of the components shown can be omitted.

[0056] According to various embodiments, substrate 210 may be a base on which various components of display module 200 are stacked. Substrate 210 may be formed of various materials. For example, substrate 210 may be formed of glass material or flexible material such as polyimide (PI) or polyethylene terephthalate (PET).

[0057] According to various embodiments, panel 220 may be disposed on at least a portion of substrate 210. Panel 220 may include a plurality of pixels. A pixel may refer to the smallest unit that converts information into light according to an electrical signal. A pixel may emit red, green, blue, or a combination thereof light according to a signal from DDI. A pixel may include at least one light-emitting device (e.g., organic light-emitting diode (OLED)) and thin-film transistor (TFT). A light-emitting element may refer to an electrical element that emits light according to an electrical signal. A TFT may adjust the brightness of a light-emitting element by adjusting the amount of current applied to the light-emitting element according to the electrical signal transmitted to the TFT.

[0058] According to various embodiments, the polarizing film 240 may be disposed on at least a portion of the panel 220. The polarizing film 240 can prevent the reflection of light incident from the outside onto the display module 200.

[0059] According to various embodiments, the touchscreen 230 may be disposed on the polarizing film 240. The touchscreen 230 enables the display module 200 to recognize touch input. For example, the touchscreen 230 may operate using a capacitive touch method that detects changes in electrical signals caused by a user's skin contact. The touchscreen 230 may include electrodes made of a transparent material (e.g., transparent conductive oxide (TCO), carbon material, or conductive polymer). For example, the touchscreen 230 may include transparent electrodes made of indium tin oxide (ITO). The transparent electrodes included in the touchscreen 230 may be disposed on the touchable portion to form a pattern.

[0060] According to various embodiments, an adhesive member 250 for fixing the polarizing film 240 and the touch screen 230 can be disposed between the polarizing film 240 and the touch screen 230. The adhesive member 250 can be formed of a material with high light transmittance. For example, the adhesive member 250 can be an optically transparent adhesive (OCA).

[0061] According to various embodiments, the first flexible printed circuit board 201 may be electrically connected to the touch screen 230. In one embodiment, a touch IC 221 for controlling the touch screen 230 may be disposed on the first flexible printed circuit board 201.

[0062] According to various embodiments, the second flexible printed circuit board 202 may be electrically connected to the panel 220. In one embodiment, a display driver IC (DDI) 221 may be disposed on the second flexible printed circuit board 202.

[0063] According to various embodiments, the third flexible printed circuit board 203 can be electrically connected to the main printed circuit board of the electronic device.

[0064] Figure 3a This is an exploded perspective view of a plurality of flexible printed circuit boards included in a display module according to various embodiments of the present disclosure. Figure 3b yes Figure 3a The diagram shows a perspective view of the multiple flexible printed circuit boards connected together.

[0065] According to various embodiments, the display module (e.g., Figure 2 The display module 200 may include multiple flexible printed circuit boards 301, 302, and 303. For example, such as Figure 3a As shown, the display module may include a first flexible printed circuit board 301, a second flexible printed circuit board 302, and a third flexible printed circuit board 303.

[0066] According to various embodiments, the first flexible printed circuit board 301, the second flexible printed circuit board 302, and the third flexible printed circuit board 303 can be arranged in a stacked structure while the display module is disposed in the electronic device. For example, as Figure 3a As shown, the third flexible printed circuit board 303, the second flexible printed circuit board 302 and the first flexible printed circuit board 301 can be stacked sequentially from the bottom.

[0067] According to various embodiments, such as Figure 3b As shown, there may be an overlapping area where the first flexible printed circuit board 301, the second flexible printed circuit board 302, and the third flexible printed circuit board 303 overlap. Furthermore, the first flexible printed circuit board 301, the second flexible printed circuit board 302, and the third flexible printed circuit board 303 can be electrically connected. In one embodiment, the first flexible printed circuit board 301, the second flexible printed circuit board 302, and the third flexible printed circuit board 303 can be electrically connected in the overlapping area 310. The electrical connection can be performed in various ways. For example, the first flexible printed circuit board 301, the second flexible printed circuit board 302, and the third flexible printed circuit board 303 can be electrically connected by soldering, socketing, and clipping methods.

[0068] Figure 4 This is a cross-sectional view of a jelly roll structure of a battery included in an electronic device according to various embodiments of the present disclosure.

[0069] Electronic devices according to various embodiments of the present disclosure (e.g., Figure 1 The electronic device 101 in the middle may include various electronic components (e.g., processors, etc.). Figure 1 The processor 120 in the middle is powered by a battery (e.g., Figure 1 Battery 189), memory (e.g., Figure 1 The memory 130 in the memory and the display (e.g., Figure 1 (Display module 160 in the middle). The battery can be, for example, a Li-ion battery.

[0070] Lithium-ion batteries are batteries that can be charged using an external power source. They are widely used in mobile electronic devices due to their high energy density, good storage properties, and long cycle life. Furthermore, in the case of lithium-ion polymer batteries, because they use solid or gel-type electrolytes, the possibility of electrolyte material leakage is very low, unlike other batteries that use liquid electrolytes.

[0071] According to various embodiments, the battery may include a jelly roll 400. The jelly roll 400 may include a structure in which a cathode plate 410 and an anode plate 420 are overlapped and wound together. The cathode plate 410 and the anode plate 420 may be wound together with a separator 430 therebetween. According to another embodiment, the battery may include a stacked electrode assembly including a structure in which cathode plates and anode plates are stacked. The cathode plate 410 may refer to an electrode from which electrons flow. Because a chemical reaction of electron loss occurs in the cathode plate 410, it can be understood as an electrode in which an oxidation reaction takes place. A cathode active material for cathode activation may be coated on at least one surface of the cathode plate 410. The anode plate 420 may refer to an electrode in which electrons flow. Because a chemical reaction of electron gain occurs in the anode plate 420, it can be understood as an electrode in which a reduction reaction takes place. An anode active material for anode activation may be coated on at least one surface of the anode plate 420. In this way, an electric current can be generated through the oxidation-reduction reaction between the cathode plate 410 and the anode plate 420, which are interposed with a partition plate 430.

[0072] According to various embodiments, a separator 430 disposed between a cathode plate 410 and an anode plate 420 can serve as an electrolyte in the battery. The separator 430 can be made of a porous polymer material. For example, the separator 430 may include a porous polyolefin membrane, polyvinylidene fluoride-hexafluoropropylene, polyvinylidene fluoride-trichloroethylene, polymethyl methacrylate, polyacrylonitrile, polyvinylpyrrolidone, polyvinyl acetate, ethylene vinyl acetate copolymer, polyethylene oxide, cellulose acetate, cellulose acetate butyrate, cellulose acetate propionate, cyanoethyl pullulanose, cyanoethyl polyvinyl alcohol, cyanoethyl cellulose, cyanoethyl sucrose, pullulanose, carboxymethyl cellulose, acrylonitrile-styrene-butadiene copolymer, polyimide, polyethylene terephthalate, polybutylene terephthalate, polyester, polyacetal, polyamide, polyetheretherketone, polyethersulfone, polyphenylene ether, polyphenylene sulfide, polyvinyl naphthalene, nonwoven membrane, membrane having a porous network structure, or combinations thereof. The partition 430 may include inorganic particles bonded to either of its two surfaces.

[0073] Figure 5a This is a plan view of a frame and a display module connected to the frame according to various embodiments of the present disclosure. Figure 5b This is a plan view of a display module according to various embodiments of the present disclosure. Figure 6aThis is a cross-sectional side view of an electronic device according to various embodiments of the present disclosure. Figure 6b yes Figure 6a An enlarged view of part S shown. Figure 6c yes Figure 6b A schematic diagram of some components is shown. In the following description, the same reference numerals will be used to describe the components. Figure 3a and Figure 3b The same or similar components.

[0074] According to various embodiments, electronic devices (e.g., Figure 1 The electronic device 101 may include a frame 501 supporting various components included in the electronic device. The frame 501 may be formed of various materials. For example, the frame 501 may be formed of a metallic material or a synthetic resin material.

[0075] According to various embodiments, frame 501 can be divided into a first region 501A, a second region 501B, and a third region 501C by a first partition wall 510 and a second partition wall 520. Here, for the purpose of illustrating this disclosure, the regions are arbitrarily divided, and each region may not be visually distinguishable. Furthermore, in some segments, the regions may be connected to each other.

[0076] According to various embodiments, the first partition wall 510 and the second partition wall 520 can be in a first direction (e.g., Figure 6a The first partition wall 510 and the second partition wall 520 protrude from the frame 501 in the -Y direction. In one embodiment, the first partition wall 510 and the second partition wall 520 may be integrally formed with the frame 501 using the same material as the frame 501. In another embodiment, the first partition wall 510 and the second partition wall 520 may be separately formed from the frame 501 and disposed on the frame 501.

[0077] According to various embodiments, the second region 501B may be a region divided by the first partition wall 510 and the second partition wall 520. The battery 630 of the electronic device may be disposed in the second region 501B. The battery 630 disposed in the second region 501B can be secured to the second region 501B by the first partition wall 510 and the second partition wall 520. For example, even when an impact is applied to the electronic device due to various factors, the first partition wall 510 and the second partition wall 520 stably support the battery 630 to prevent the battery 630 from separating from the second region 501B.

[0078] According to various embodiments, such as Figure 6aAs shown, a first printed circuit board 610 of the electronic device can be disposed in a first region 501A. A second printed circuit board 620 of the electronic device can be disposed in a third region 501C. An interface IC can be disposed on the first printed circuit board 610 disposed in the first region 501A, which can be electrically connected to an interface port (e.g., a charging port, a USB connection port, a headphone port) for connecting to an external electronic device. The processor, memory, power management circuitry, etc., of the electronic device can be disposed on the second printed circuit board 620 disposed in the second region 501B. Furthermore, electronic components providing various functions that can be performed by the electronic device can be disposed on the first printed circuit board 610 and the second printed circuit board 620. The first printed circuit board 610 and the second printed circuit board 620 can be connected by connecting members (e.g., Figure 7 Electrical connection of the connecting component 710 in the middle.

[0079] Reference Figure 6a The display module 550 of the electronic device can be in a second direction opposite to the first direction (e.g., Figure 6a The +Y direction is set in frame 501. (Refer to...) Figure 5a and Figure 5b The overlapping area 310 of the multiple flexible printed circuit boards 301, 302, and 303 of the display module 550 can be disposed on a second area 501B, spaced apart from the first partition wall 510 on which the battery 630 is disposed. With a DDI (e.g., Figure 2 The size of the second printed circuit board 302 (DDI 221) is increased to drive the display module 550 at high speed. The position of the overlapping area 310, which includes multiple printed circuit boards 301, 302, and 303 in the display module 550, can be moved to the central portion of the frame 501. With the first partition wall 510 protruding from the frame 501 and the overlapping area 310 positioned where they overlap, the thickness of the electronic device increases, and the multiple flexible printed circuit boards 301, 302, and 303 may be damaged due to interference between the first partition wall 510 and the overlapping area 310. To avoid this, in the case where a groove is formed in the first partition wall 510 to compensate for the thickness of the overlapping area 310, the groove becomes a support including a jelly roll (e.g., Figure 4 The first partition wall 510 of the battery 630 in the jelly roll 400 is a weak point, and the battery 630 may be damaged by external impact. In electronic devices according to various embodiments of the present disclosure, the above-mentioned problem can be solved by setting the overlapping area 310 of the overlapping of the plurality of printed circuit boards 301, 302 and 303 to be spaced apart from the first partition wall 510.

[0080] According to various embodiments, refer to Figure 5a , Figure 6b and Figure 6c In frame 501, an opening 530 may be formed on a portion of frame 501 facing the overlapping region 310 of the plurality of flexible printed circuit boards 301, 302, and 303. The opening 530 formed in frame 501 can compensate for any increase in thickness that may result from the overlapping region 310. Furthermore, the opening 530 provides space through which the overlapping regions 310 communicate with each other, thereby preventing damage to the overlapping regions 310 from external impacts. The size of the opening 530 may be greater than or equal to the size of the overlapping region 310. For example, as... Figure 5a , Figure 6b and Figure 6c As shown, the size of the opening 530 can be larger than the size of the overlapping region 310. In another embodiment, the portion of the frame 501 facing the overlapping region 310 can be formed thinner than other portions. Because the portion facing the overlapping region is thinner, the increased thickness of the electronic device due to the overlapping region can be compensated.

[0081] Figure 7 This is a view used to illustrate the arrangement relationship of a first printed circuit board, a second printed circuit board, and a battery in an electronic device according to various embodiments of the present disclosure. In the following description, [the description refers to...] Figures 6a to 6c Components that are identical or similar to each other use the same reference numerals.

[0082] According to various embodiments, a first printed circuit board 610 may be disposed in a first region 501A of the frame 501, and a second printed circuit board 620 may be disposed in a third region 501C. A battery 630 may be disposed in a second region 501B between the first region 501A and the third region 501C. A connecting member 710 may electrically connect the first printed circuit board 610 and the second printed circuit board 620. For example, the connecting member 710 may be a flexible printed circuit board.

[0083] According to various embodiments, one end of the connecting member 710 is connected to the first printed circuit board 610 and extends through a second region 501B in which the battery 630 is disposed, and the other end can be electrically connected to the second printed circuit board 620.

[0084] According to various embodiments, the portion of the connecting member 710 that passes through the second region 501B may pass through the first surface of the battery 630 or may pass through the second surface opposite to the first surface.

[0085] In the above text, although the display module (e.g., Figure 2 The display module 220 includes multiple flexible printed circuit boards (e.g., Figure 3aThe flexible printed circuit boards (301, 302 and 303) in the display module have been described as three, but the structure disclosed herein can be applied even if the number of flexible printed circuit boards included in the display module is two or four or more.

[0086] An electronic device according to various embodiments of the present disclosure may include: a frame; a first partition wall formed to protrude from the frame in a first direction and divide the frame into a first region and a second region; a second partition wall portion formed to protrude from the frame in the first direction and divide the frame into a second region and a third region; a first printed circuit board disposed in the first region of the frame; a battery disposed in the second region of the frame; a second printed circuit board disposed in the third region of the frame; and a display module including at least two flexible printed circuit boards disposed on the frame in a second direction opposite to the first direction. The flexible printed circuit boards of the display module may include overlapping regions therein, the overlapping regions may be disposed in the second region and spaced apart from the first partition wall portion, and in the frame, an opening may be formed in the portion of the overlapping region facing the flexible printed circuit boards of the display module.

[0087] Furthermore, the thickness of the portion of the flexible printed circuit board facing the display module that overlaps with the frame can be thinner than other parts of the frame.

[0088] Furthermore, the opening formed in the frame can be formed in the second region at a location spaced apart from the first partition wall.

[0089] In addition, the flexible printed circuit board of the display module may include a first flexible printed circuit board electrically connected to the touch screen, a second flexible printed circuit board electrically connected to a panel on which light-emitting elements are disposed, and a third flexible printed circuit board connecting the second flexible printed circuit board and the first flexible printed circuit board. The first flexible printed circuit board, the second flexible printed circuit board and the third flexible printed circuit board may be electrically connected to each other.

[0090] Furthermore, the overlapping area of ​​the flexible printed circuit board of the display module can be the area where the first flexible printed circuit board, the second flexible printed circuit board, and the third flexible printed circuit board all overlap.

[0091] In addition, the display driver IC (DDI) can be mounted on the second flexible printed circuit board of the display module.

[0092] In addition, the battery may include a jelly roll formed by winding an anode plate, a cathode plate, and a separator disposed between the anode plate and the cathode plate.

[0093] Furthermore, the electronic device may further include a connecting member in which at least a portion is electrically connected to the first and second printed circuit boards via a battery.

[0094] An electronic device according to various embodiments of the present disclosure may include: a frame; a first partition wall formed to project from the frame in a first direction and divide the frame into a first region and a second region; a first printed circuit board disposed on the first region of the frame; a battery disposed on the second region of the frame; and a display module including at least two flexible printed circuit boards disposed on the frame in a second direction opposite to the first direction. The flexible printed circuit boards of the display module may include overlapping regions therein, the overlapping regions may be disposed in the second region and spaced apart from the first partition wall portion, and in the frame, an opening may be formed in the portion of the overlapping region facing the flexible printed circuit boards of the display module.

[0095] Furthermore, the thickness of the portion of the flexible printed circuit board facing the display module that overlaps with the frame can be thinner than other parts of the frame.

[0096] Furthermore, the opening formed in the frame can be formed in the second region at a location spaced apart from the first partition wall.

[0097] In addition, the flexible printed circuit board of the display module may include a first flexible printed circuit board electrically connected to the touch screen, a second flexible printed circuit board electrically connected to a panel on which light-emitting elements are disposed, and a third flexible printed circuit board connecting the second flexible printed circuit board and the first flexible printed circuit board. The first flexible printed circuit board, the second flexible printed circuit board and the third flexible printed circuit board may be electrically connected to each other.

[0098] Furthermore, the overlapping area of ​​the flexible printed circuit board of the display module can be the area where the first flexible printed circuit board, the second flexible printed circuit board, and the third flexible printed circuit board all overlap.

[0099] In addition, the display driver IC (DDI) can be mounted on the second flexible printed circuit board of the display module.

[0100] In addition, the battery may include a jelly roll formed by winding an anode plate, a cathode plate, and a separator disposed between the anode plate and the cathode plate.

[0101] The embodiments of this disclosure disclosed in this specification and accompanying drawings are merely specific examples to readily describe the technical content of embodiments according to this disclosure and to aid in understanding the embodiments of this disclosure, and are not intended to limit the scope of the embodiments of this disclosure. Therefore, all changes or modifications derived from the technical ideas of certain embodiments of this disclosure, other than those described herein, should be interpreted as including within the scope of those embodiments without departing from the scope of this disclosure.

Claims

1.An electronic device comprising: a frame configured to support at least one component of the electronic device, the frame being divided into at least a first area and a second area; a battery disposed on a first surface of the second area of the frame; an opening formed in the second area where the battery is located; and a display module including at least two flexible printed circuit boards (FPCBs) and disposed at a second surface of the frame opposite the first surface; wherein the FPCBs are at least partially disposed between the display module and the frame, wherein a first FPCB of the FPCBs and a second FPCB of the FPCBs at least partially overlap between the display module and the frame, and wherein an overlapping portion of the first FPCB and the second FPCB is at least partially disposed at a position corresponding to the opening, the electronic device further comprising: a first partition wall portion protruding from the first surface of the frame and dividing the frame into the first area and the second area, wherein the overlapping portion is spaced apart from the first partition wall portion. In the frame, a portion facing the overlapping portion of the first FPCB and the second FPCB is thinner than other portions of the frame. 2.The electronic device of claim 1, wherein, The opening formed in the frame is formed in the second area at a position spaced apart from the first partition wall. 3.The electronic device of claim 1, wherein 4.The electronic device of claim 1, the first FPCB is electrically connected to a touch screen, and wherein wherein the second FPCB is electrically connected to a panel on which a light emitting element is disposed. 5.The electronic device of claim 4, the FPCBs include a third FPCB connecting the second FPCB and the first FPCB, and wherein wherein the first FPCB, the second FPCB, and the third FPCB are electrically connected to each other. The overlapping portion of the FPCBs includes an area in which the first FPCB, the second FPCB, and the third FPCB all overlap. 6.The electronic device of claim 5, wherein, A display driver IC (DDI) is disposed on the second FPCB of the display module. 7.The electronic device of claim 4, wherein The battery includes a jelly-roll formed by winding an anode plate, a cathode plate, and a separator disposed between the anode plate and the cathode plate. 8.The electronic device of claim 1, wherein 9.The electronic device of claim 1, further comprising: a second partition wall protruding from the first surface of the frame and dividing the frame into the second area and a third area. 10.The electronic device of claim 9, further comprising: a first printed circuit board disposed in the first area of the frame; and a second printed circuit board disposed in the third area of the frame. 11.The electronic device of claim 10, further comprising a connection member in which at least a portion electrically connects the first printed circuit board and the second printed circuit board through the battery. A size of the opening is greater than or equal to a size of the overlapping portion. ​ 12.The electronic device of claim 1, wherein, ​

Images