An ultrasonic vibration and light-controlled electrolysis combined machining method and device based on a repairable conductive ice tool

Abstract

The application discloses a kind of based on repairable conductive ice tool ultrasonic vibration and light-controlled electrolysis composite processing method and device, belong to the field of special processing.The method uses the conductive ice tool embedded with internal light path element, and the non-focusing laser beam is split and irradiated to the specified position of workpiece to be processed through micro ice column array, so as to enhance the conductive performance of workpiece to be processed locally;Conductive ice column is cathode, and workpiece to be processed is anode, and light-controlled localized electrolysis is realized at the position of conductive ice column corresponding to workpiece to be processed;Conductive ice tool ultrasonic vibration, and the surrounding abrasive is impacted on workpiece to be processed by the end of micro ice column, and passivation layer is removed, so that electrolytic reaction can continue, and ultrasonic vibration and light-controlled electrolysis are cooperated to realize punching;Conductive ice column contains micro abrasive inside, and can post-process the inner wall of through-hole;Different molds are prepared, and the rapid repair of conductive ice tool micro ice column array can be realized.The application can realize efficient and high-quality processing of array holes on semiconductor.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of composite machining in special processing technology, in particular to a kind of ultrasonic vibration and light-controlled electrolysis composite machining method and device based on repairable conductive ice tool. BACKGROUND

[0002] High-end industries represented by advanced integrated circuits and micro-electro-mechanical systems (MEMS) have become the main battlefield of China's scientific and technological research. Silicon materials still dominate in the field of integrated circuits and micro-electro-mechanical systems. Silicon through microstructures represented by through holes and through slots also have wide applications. For example, three-dimensional stacking of chips can be achieved using through silicon via technology, which can reduce metal wire length, increase transistor density, and thus reduce chip power consumption, shorten signal delay, and improve chip performance.

[0003] Silicon and other semiconductors have good structural and functional properties, but are subject to high brittleness and low fracture toughness of the material, poor machinability, and high difficulty in micro-machining. Traditional mechanical cutting methods cannot complete the machining of microstructures.

[0004] Laser machining can flexibly achieve the machining of semiconductor material through structures, but due to the loss of incident energy, the resulting microstructure often has obvious taper, and the inner wall often has obvious thermal damage. Electrochemical machining has low efficiency and is prone to stray corrosion. Silicon material electrolytic machining often generates a dense passivation layer, which needs to be removed by hydrofluoric acid. The combination of the two methods can improve machining precision and efficiency. The erosion of abrasive particles can polish and polish the surface and inner wall of the semiconductor material, further improving machining precision and surface quality.

[0005] Chinese patent CN114346339A discloses a method for ultrasonic-assisted laser and electrochemical composite multi-energy field collaborative machining. Laser beams are reflected by the tool electrode to form multiple laser beams acting on the workpiece surface simultaneously. At the same time, the electrolyte flows out of the tool electrode and acts on the workpiece machining area to produce an electrochemical reaction, which can achieve deep and small hole machining with large depth and low damage. However, the electrolytic jet machining system in this method is difficult to build, requires high speed and stability of the jet, and does not involve array hole content. SUMMARY

[0006] To overcome the shortcomings of the prior art, the present application provides a method and device for ultrasonic vibration and light-controlled electrolysis composite machining based on a repairable conductive ice tool. The method uses ultrasonic vibration to drive abrasive particles to remove the passivation layer and uses laser irradiation to achieve efficient and high-quality localized electrolysis, which can produce high-quality hole structures.

[0007] The present application achieves the above technical purpose through the following technical means.

[0008] The application discloses a method for ultrasonic vibration and light-controlled electrolysis composite machining based on a repairable conductive ice tool.

[0009] In the above scheme, the conductive ice tool is fed downward, and the ultrasonic vibrator drives the conductive ice tool to vibrate; the electrolyte contains micro abrasive particles; the end face of the conductive ice column drives the surrounding abrasive particles to impact the workpiece to be machined to remove the passivation layer, so that the electrolysis reaction can be continuously carried out, and the composite and synergistic machining of the ultrasonic vibration and the light-controlled electrolysis of the workpiece to be machined is realized.

[0010] In the above scheme, the conductive ice column contains transparent micro abrasive particles, and the side wall of the blind hole / hole formed can be continuously polished; the conductive ice disc and the conductive ice column contain carbon nanotubes.

[0011] In the above scheme, the workpiece to be machined is a semiconductor or a metal.

[0012] In the above scheme, the semiconductor is monocrystalline silicon, monocrystalline germanium or silicon carbide.

[0013] In the above scheme, the conductive ice column is in the shape of a cylinder or a special-shaped column; the conductive ice disc and the conductive ice column are respectively prepared through a smooth and flat bottom surface mold and a conductive ice column array mold, wherein the surface of the smooth and flat bottom surface mold and the conductive ice column array mold is a super-hydrophobic surface.

[0014] In the above scheme, the wavelength of the laser is 532 nm, the laser is a pulse laser, the pulse width ranges from 10 ps to 50 ns, and the frequency ranges from 0.1 to 2 MHz.

[0015] In the above scheme, the light path element comprises a laser diffraction beam splitter.

[0016] In the above scheme, the external power supply is a direct current pulse power supply, the output voltage is 0-50 V, the frequency is 0-2 MHz, and the duty cycle is 0-80%; the electrolyte is a sodium nitrate aqueous solution with a mass fraction of 10%-30% and does not contain hydrofluoric acid.

[0017] The application discloses a kind of based on repairable conductive ice tool ultrasonic vibration and light control electrolytic composite processing device, including laser irradiation system, electrolytic processing system and ultrasonic vibration system;Wherein, laser irradiation system is used to provide the laser thermal energy field of workpiece to be processed, electrolytic processing system provides electrolytic energy field, to realize the electrolytic processing of workpiece to be processed, ultrasonic vibration system is used to provide ultrasonic energy field, to generate ultrasonic wave, drive surrounding abrasive impact workpiece to be processed, remove passivation layer;The laser irradiation system includes laser, beam expander, mirror and galvanometer;The laser beam emitted by the laser passes through the beam expander, is reflected by the mirror, and then emits high-power density laser through the galvanometer, the parameters of the laser beam emitted by the laser can be controlled by computer, the non-focusing laser beam is split, reflected and irradiated to the specified position of workpiece to be processed through the conductive ice column embedded in the light path element;The electrolytic processing system includes electrolyte tank, electrolyte, oscilloscope, current probe, direct current pulse power supply;Workpiece to be processed is placed in electrolyte tank, electrolyte tank is provided with electrolyte, the positive electrode of direct current pulse power supply is communicated with workpiece to be processed, and the negative electrode of direct current pulse power supply is communicated with conductive ice tool;The current probe is used to detect current signal, and the oscilloscope is used to observe current condition;The ultrasonic vibration system includes ultrasonic vibration instrument, and the ultrasonic vibration instrument drives the conductive ice tool to vibrate rapidly;During composite processing, relative vertical motion exists between workpiece to be processed and conductive ice column, and the conductive ice column arranged at the lower end of the conductive ice tray drives the surrounding abrasive to impact workpiece to be processed, so as to remove the passivation layer.

[0018] Advantages:

[0019] 1. The application uses ultrasonic vibration instrument to drive conductive ice tool to vibrate rapidly, and the end surface of the array of conductive ice columns drives the surrounding abrasive to impact the workpiece to be processed, so as to remove the passivation layer, thereby avoiding the use of corrosive components such as hydrofluoric acid and not causing environmental pollution.

[0020] 2. The application splits, reflects and irradiates the non-focusing laser beam to the specified position of workpiece to be processed through the micro ice column array, so as to locally enhance the conductivity of the workpiece, realize light control local electrolysis at the corresponding position of the conductive ice column array, improve the locality of precision electrolytic processing, and solve the problem of slow array through / hole processing efficiency.

[0021] 3. In the application, the conductive ice column contains transparent micro abrasive inside, which can continuously polish the sidewall of the formed blind hole / through hole, and further improve the inner wall quality of the through hole.

[0022] 4. In the application, different shape conductive ice tool molds can be prepared by existing technology, the mold surface is super-hydrophobic surface, and the smooth and flat bottom surface of the conductive ice tool and the rapid preparation of the ice column array can be realized through the steps of mold liquid injection, conductive ice tool tooling, bottom heating, cooling and the like, which is convenient for rapid repair and recovery of the conductive ice column, and greatly improves the efficiency of array hole processing.

[0023] 5. In the present application, if the mold design is changed, other shape tool arrays can also be obtained below the conductive ice tool, thereby realizing the processing of other through microstructures, such as stepped through holes, special-shaped holes, through grooves, blind holes, blind grooves, etc.

[0024] 6. In the present application, transparent micro abrasive particles are contained in the conductive ice column, which can continuously polish the side wall of the formed blind hole / through hole while the conductive ice column is melted and endothermic, thereby preventing thermal damage to the processing area. The conductive ice column can be melted and endothermic, thereby preventing thermal damage to the processing area.

[0025] 7. In the present application, carbon nanotubes are contained in the solution for making the conductive ice disc and the conductive ice column, and after freezing, the carbon nanotubes can form a conductive network, thereby endowing the conductive ice disc and the conductive ice column with electrical conductivity, thereby realizing photo-controlled localized electrolysis on the workpiece to be processed. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The present application relates to a schematic diagram of a hole structure processed by ultrasonic vibration and photo-controlled electrolysis combined with a repairable conductive ice tool.

[0027] Figure 2 The present application relates to a schematic diagram of a hole structure processed by ultrasonic vibration and photo-controlled electrolysis combined with a repairable conductive ice tool. Figure 1 The present application relates to a schematic diagram of a hole structure processed by ultrasonic vibration and photo-controlled electrolysis combined with a repairable conductive ice tool.

[0028] REFERENCE NUMERALS:

[0029] 1 - laser; 2 - laser beam; 3 - beam expander; 4 - mirror; 5 - galvanometer; 6 - optical element; 7 - ultrasonic vibrator; 8 - conductive ice disc; 9 - conductive ice column; 10 - electrolyte tank; 11 - electrolyte; 12 - workpiece to be processed; 13 - insulating clamp; 14 - XYZ linear motion platform; 15 - motion control card; 16 - oscilloscope; 17 - current probe; 18 - direct current pulse power supply; 19 - computer; 20 - smooth flat bottom mold; 21 - conductive ice column array mold. DETAILED DESCRIPTION

[0030] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0031] In the description of the present application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "axial", "radial", "vertical", "horizontal", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can be explicitly or implicitly included one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0032] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] Embodiment

[0034] The present embodiment is a method for ultrasonic vibration and light-controlled electrolysis composite processing of through silicon via based on repairable conductive ice tool, comprising the following steps:

[0035] The conductive ice tool is prepared, including a conductive ice disc 8 and a conductive ice column 9. The light path element 6 is embedded in the conductive ice disc 8 to split and reflect the non-focusing laser beam, and the split and reflected laser beam is irradiated to the designated position of the silicon material through the conductive ice column 9, so as to locally enhance the conductive performance of the silicon material. The conductive ice column 9 is used as a cathode, and the workpiece 12 to be processed is used as an anode. The workpiece 12 to be processed is placed in the neutral electrolyte 11, and under the action of the external power source, the light-controlled local electrolysis is realized at the corresponding position of the conductive ice column 9. While the conductive ice tool is fed downward, the ultrasonic vibrator 7 drives the conductive ice tool to vibrate rapidly. The neutral electrolyte 11 contains micro abrasive particles, and the end face of the conductive ice column 9 drives the abrasive particles around to impact the workpiece 12 to be processed, so as to remove the silicon dioxide passivation layer, so that the electrolytic reaction can continue, thereby realizing the composite and synergistic processing of ultrasonic vibration and light-controlled electrolysis, without using corrosive solvents such as hydrofluoric acid. The conductive ice column 9 contains transparent micro abrasive particles, which can continuously polish the sidewall of the formed silicon blind hole / through hole. During the processing, the micro ice column can melt and absorb heat to prevent thermal damage to the processing area. Through the fixed mold, the conductive ice tool can be quickly repaired.

[0036] The present application utilizes the characteristic that the conductivity of semiconductor material increases with temperature, and utilizes the irradiation of each laser beam after light splitting on the desired processing position to form a conductive channel through which current preferentially passes, and electrolytic processing is carried out at the position where the conductivity of silicon material is locally enhanced.

[0037] The solution used to make the conductive ice disc 8 and the conductive ice column 9 in the present application is a special solution containing carbon nanotubes inside, and after freezing, the carbon nanotubes can form a conductive network, giving the ice disc and ice column conductive properties.

[0038] The workpiece to be processed is a semiconductor such as monocrystalline silicon, monocrystalline germanium, silicon carbide, etc., and can also be extended to metal materials.

[0039] Different shaped molds are prepared by existing technologies, the mold surface is a super-hydrophobic surface, and through the steps of mold injection, conductive ice tooling, bottom heating, cooling, etc. The smooth and flat bottom surface of the conductive ice tool and the rapid preparation of the conductive ice column array can be realized, which is convenient for the rapid repair and recovery of the conductive ice column.

[0040] By changing the mold design, other shaped tool arrays can also be obtained below the conductive ice disc 8, and further processing of other through microstructures such as stepped through holes, special-shaped holes, through grooves, blind holes, blind grooves, etc. can be realized.

[0041] Combined with the attached Figure 1 and the attached Figure 2 , the present example is an apparatus for ultrasonic vibration and light-controlled electrolysis composite processing of silicon vias based on a repairable conductive ice tool, which includes a laser irradiation system, an electrolytic processing system and an ultrasonic vibration system; wherein the laser irradiation system is used to provide a laser thermal energy field for the workpiece, the electrolytic processing system provides an electrolytic energy field to realize precise electrolytic processing of the workpiece, and the ultrasonic vibration system provides an ultrasonic energy field to generate ultrasonic waves to drive surrounding abrasive particles to impact silicon material and remove the silicon dioxide passivation layer.

[0042] The laser irradiation system comprises a laser 1, a beam expander 3, a mirror 4 and a galvanometer 5; the laser beam 2 emitted by the laser 1 is reflected by the mirror 4 after passing through the beam expander 3, and then passes through the galvanometer 5 to emit high-power density laser; the parameters of the laser beam 2 emitted by the laser 1 can be controlled by a computer 19; a light path element 6 is embedded in the conductive ice tray 8 to split, reflect and irradiate the unfocused laser beam to the workpiece 12 to be processed through the conductive ice column 9 at the lower end of the array of the conductive ice tray 8, so as to locally enhance the conductive performance of the workpiece to be processed; the light path element 6 comprises a laser diffraction beam splitter; the laser diffraction beam splitter is a kind of diffractive optical element, so it is also called laser beam splitter DOE, which is used to split a single laser beam into several beams, each beam has the characteristics of the original beam (except power and propagation angle). The diffraction beam splitter can generate a one-dimensional beam array (1xN) or a two-dimensional beam matrix (MxN), depending on the diffraction pattern on the laser beam splitter.

[0043] In the application, the laser wavelength emitted by the laser can be selected as 532nm, the pulse laser, and the pulse width range is 10ps-50ns. The frequency range is 0.1-2MHz, and the output beam energy can be flexibly adjusted according to the number of light splitting n, so as to ensure that the single beam power is between 0.1-1W.

[0044] The electrolytic machining system comprises an electrolyte tank 10, an electrolyte 11, an oscilloscope 16, a current probe 17 and a direct current pulse electrolysis power supply 18; the workpiece to be processed is placed in the electrolyte tank 10, the electrolyte tank 10 is filled with the electrolyte 11, the positive electrode of the direct current pulse electrolysis power supply 18 is connected with the workpiece to be processed 12, and the negative electrode of the direct current pulse power supply 18 is connected with the conductive ice tool; the current probe 17 is used to detect the current signal, and the oscilloscope 16 is used to observe the current condition.

[0045] In the application, the output voltage of the direct current pulse power supply can be adjusted to 0-50V, the frequency is 0-2MHz, and the duty cycle is 0-80%.

[0046] The ultrasonic vibration system comprises an ultrasonic vibrator 7, the ultrasonic vibrator 7 drives the conductive ice tool to vibrate rapidly, the micro ice column array end face drives the surrounding abrasive particles to impact the workpiece 12, removes the silicon dioxide passivation layer, and enables the electrolytic reaction to continue.

[0047] The electrolyte is a low-temperature sodium nitrate solution with a mass fraction of 10-30%, and does not contain corrosive components such as hydrofluoric acid; the electrolyte contains salt to reduce the melting point; the small abrasive particles suspended in the electrolyte are nanoscale diamond micro abrasive particles.

[0048] Working process:

[0049] According to the size and position of the machining through hole, a corresponding mold is made; the conductive ice tray 8 is prepared, and the light path element is embedded in the conductive ice tray 8; and the conductive ice column 9 is prepared below.

[0050] The workpiece 12 to be processed is first deoiled and ultrasonically cleaned, the insulating clamp is installed in the electrolyte tank 10, the workpiece 12 to be processed is installed on the insulating clamp 13, and the electrolyte tank 10 is installed on the XYZ linear motion platform; the conductive ice tool 8 is connected to the negative pole of the direct current pulse power supply 18, and the workpiece 12 to be processed is connected to the positive pole of the direct current pulse power supply 18; the neutral electrolyte 11 containing micro abrasive particles is poured into the electrolyte tank 10;

[0051] The conductive ice tool is placed above the workpiece 12 to be processed, and the XYZ linear motion platform is adjusted by the computer 19 to control the motion control card 15, so that the conductive ice tool and the workpiece 12 to be processed are in the appropriate position;

[0052] The direct current pulse power supply 18 is turned on, and the conductive ice column 9 and the workpiece 12 to be processed form an electrochemical loop in the neutral electrolyte 11, the current probe 17 is used to detect the current signal, and the oscilloscope 16 is used to observe the current condition;

[0053] The laser 1 is turned on, and after passing through the beam expander 3, the high-power density laser is reflected by the mirror 4, and then passes through the galvanometer 5, and then passes through the optical element 6 and the reflecting mirror, and then is irradiated to the specified position of the workpiece 12 to be processed through the micro ice column array, and a conductive channel through which current preferentially passes is formed on the workpiece 12 to be processed;

[0054] The ultrasonic vibrator 7 is turned on, the ultrasonic vibrator 7 drives the conductive ice tool to vibrate quickly, the micro ice column array end face drives the surrounding abrasive particles to impact the workpiece 12 to be processed, and the silicon dioxide passivation layer is removed, so that the electrolytic reaction can continue.

[0055] The ultrasonic vibration and light-controlled electrolytic machining begin to cooperate in processing; there are also micro abrasive particles in the conductive ice column 9, which have a polishing effect on the sidewall of the through hole during processing;

[0056] After processing is completed, the conductive ice tool is taken out, the lower end conductive ice column 9 is worn due to friction and electrolysis, liquid is injected into the smooth and flat bottom mold 20, the conductive ice tool is aligned, and then the bottom of the mold is heated and then cooled, so that the bottom surface of the conductive ice tool becomes smooth and flat; similarly, the ice column array mold 21 can be used to change the bottom surface of the conductive tool into an array of conductive ice columns, and the rapid repair and recovery is completed;

[0057] The workpiece after punching is replaced, and the above process is repeated for continuous processing;

[0058] After processing is completed, the laser 1, the ultrasonic vibrator 7 and the direct current pulse power supply 18 are turned off; the workpiece with holes is taken out, and the workpiece with holes is cleaned and dried.

[0059] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0060] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary, and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application without departing from the principles and spirit of the present application.

Claims

1. A method for ultrasonic vibration and photo-controlled electrolytic combined machining based on a repairable conductive ice tool, characterized in that, The light path element is embedded in the conductive ice tray to split, reflect and irradiate the non-focusing laser beam to the workpiece to be processed through the conductive ice column array at the lower end of the conductive ice tray, thereby enhancing the conductive performance of the workpiece to be processed; the conductive ice column serves as a cathode, and the workpiece to be processed serves as an anode, and under the action of an external power source, the conductive ice column realizes photo-controlled local electrolysis at the position of the workpiece to be processed; the conductive ice column contains transparent micro abrasive particles and carbon nanotubes, and can continuously polish the sidewall of the blind hole / hole formed.

2. The method of claim 1, wherein the tool is a repairable conductive ice tool. When the conductive ice tool feeds downward, the ultrasonic vibrator drives the conductive ice tool to vibrate, the electrolyte contains micro abrasive particles, and the end face of the conductive ice column drives the surrounding abrasive particles to impact the workpiece to be processed to remove the passivation layer, so that the electrolysis reaction can continue, and the workpiece to be processed is processed by ultrasonic vibration and photo-controlled electrolysis in a combined and synergistic manner to obtain a blind hole / hole.

3. The method of claim 1, wherein the tool is a repairable conductive ice tool. The conductive ice tray contains carbon nanotubes.

4. The method of claim 1, wherein the method is a method of ultrasonic vibration and photo-controlled electrolytic combined machining based on a repairable conductive ice tool. The material of the workpiece to be processed is a semiconductor or a metal.

5. The method according to claim 4, wherein the tool is a repairable conductive ice tool. The semiconductor is monocrystalline silicon, monocrystalline germanium or silicon carbide.

6. The method of claim 1, wherein the method is a method of ultrasonic vibration and photo-controlled electrolytic combined machining based on a repairable conductive ice tool. The conductive ice column is in the shape of a cylinder or a special-shaped column; the conductive ice tray and the conductive ice column are respectively prepared by a smooth flat bottom mold and a conductive ice column array mold, wherein the surface of the smooth flat bottom mold and the conductive ice column array mold is a super-hydrophobic surface.

7. The method of claim 1, wherein the tool is a repairable conductive ice tool. The laser wavelength is 532 nm, the pulse laser has a pulse width range of 10 ps to 50 ns and a frequency range of 0.1 to 2 MHz.

8. The method of claim 1, wherein the tool is a repairable conductive ice tool. The light path element includes a laser diffraction beam splitter.

9. The method of claim 1, wherein the tool is a repairable conductive ice tool. The external power source is a direct current pulse power source, the output voltage is 0 to 50 V, the frequency is 0 to 2 MHz, and the duty cycle is 0 to 80%; the electrolyte is a sodium nitrate aqueous solution with a mass fraction of 10% to 30% and does not contain hydrofluoric acid.

10. The machining device of the ultrasonic vibration and photo-controlled electrolytic combined machining method based on the repairable conductive ice tool according to claim 1, characterized in that, It comprises a laser irradiation system, an electrolytic processing system and an ultrasonic vibration system; wherein the laser irradiation system is used to provide a laser thermal energy field of the workpiece to be processed, the electrolytic processing system provides an electrolytic energy field to realize electrolytic processing of the workpiece to be processed, and the ultrasonic vibration system is used to provide an ultrasonic energy field to generate ultrasonic waves to drive surrounding abrasive particles to impact the workpiece to be processed to remove the passivation layer; the laser irradiation system comprises a laser, a beam expander, a mirror and a galvanometer; the laser beam emitted by the laser passes through the beam expander, is reflected by the mirror and then passes through the galvanometer to emit high-power density laser, the parameters of the laser beam emitted by the laser can be controlled by a computer, the non-focusing laser beam is split, reflected and irradiated to a specified position of the workpiece to be processed through the conductive ice column embedded with the light path element in the conductive ice disc; the electrolytic processing system comprises an electrolyte tank, an electrolyte, an oscilloscope, a current probe and a direct current pulse power supply; the workpiece to be processed is placed in the electrolyte tank, the electrolyte tank is filled with the electrolyte, the positive electrode of the direct current pulse power supply is connected with the workpiece to be processed, and the negative electrode of the direct current pulse power supply is connected with the conductive ice tool; the current probe is used to detect the current signal, and the oscilloscope is used to observe the current condition; the ultrasonic vibration system comprises an ultrasonic vibrator, and the ultrasonic vibrator drives the conductive ice tool to vibrate rapidly; during the composite processing, the workpiece to be processed and the conductive ice column move vertically relative to each other, the conductive ice column arranged at the lower end of the conductive ice disc drives the surrounding abrasive particles to impact the workpiece to be processed to remove the passivation layer.

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