Flexible wire body without screwing for insulating ceramic tile

Abstract

The application discloses a non-locking screw type flexible line body for placing insulating particle ceramic sheets, which comprises a bearing part for bearing a heat dissipation sheet, the heat dissipation sheet being provided with a first limiting hole facing away from the bearing part; a heat dissipation sheet placing module capable of placing the bearing part, the heat dissipation sheet placing module being used for placing the heat dissipation sheet on the bearing part; a connecting piece placing module arranged downstream of the heat dissipation sheet placing module and capable of placing the bearing part, the connecting piece placing module being used for arranging a connecting piece on the heat dissipation sheet, a first end of the connecting piece being inserted into the first limiting hole in an interference fit; and a ceramic sheet placing module arranged downstream of the connecting piece placing module and capable of placing the bearing part, the ceramic sheet placing module being used for arranging a ceramic sheet on the connecting piece, the ceramic sheet being provided with a second limiting hole, a second end of the connecting piece being inserted into the second limiting hole in an interference fit. The non-locking screw type flexible line body for placing insulating particle ceramic sheets provided by the technical scheme can simplify the connection processing procedure steps of the heat dissipation sheet and the ceramic sheet.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation device processing, in particular to a flexible line body without locking screws for placing an insulating particle ceramic sheet. BACKGROUND

[0002] The crystal may generate high temperature during operation, and a heat dissipation fin needs to be arranged to cool the crystal. However, when the heat dissipation fin is in electrical contact with the crystal, the crystal may be short-circuited. Related technologies arrange an insulating piece between the heat dissipation fin and the crystal to insulate the heat dissipation fin from the crystal. In the related technologies, the heat dissipation fin, the ceramic sheet and the crystal and other components need to be fixed through an additional locking module, and the steps are complicated. SUMMARY

[0003] The present application provides a flexible line body without locking screws for placing an insulating particle ceramic sheet, aiming to simplify the connection processing steps of the heat dissipation fin and the ceramic sheet.

[0004] The flexible line body without locking screws for placing an insulating particle ceramic sheet in the present application includes a bearing piece for bearing a heat dissipation fin, the heat dissipation fin is provided with a first limiting hole facing away from the bearing piece; a heat dissipation fin placing module capable of placing the bearing piece, the heat dissipation fin placing module is used for placing the heat dissipation fin on the bearing piece; a connecting piece placing module arranged downstream of the heat dissipation fin placing module and capable of placing the bearing piece, the connecting piece placing module is used for arranging a connecting piece on the heat dissipation fin, a first end of the connecting piece is inserted into the first limiting hole in an interference fit; and a ceramic sheet placing module arranged downstream of the connecting piece placing module and capable of placing the bearing piece, the ceramic sheet placing module is used for arranging a ceramic sheet on the connecting piece, the ceramic sheet is provided with a second limiting hole, and a second end of the connecting piece is inserted into the second limiting hole in an interference fit.

[0005] The flexible line body without locking screws for placing an insulating particle ceramic sheet in the above-mentioned embodiment is provided with the first limiting hole in the heat dissipation fin and the second limiting hole in the ceramic sheet, and the first end and the second end of the connecting piece are respectively inserted into the first limiting hole and the second limiting hole in an interference fit, so as to achieve the purpose of fixing and connecting the heat dissipation fin and the ceramic sheet, and the steps are simple; in addition, the fixed and connected heat dissipation fin and ceramic sheet can be used to connect the crystal, and the crystal can be cooled.

[0006] In some embodiments, the flexible line body further includes a first heat dissipation paste printing module arranged between the heat dissipation fin placing module and the connecting piece placing module and capable of placing the bearing piece, and the first heat dissipation paste printing module is used for printing heat dissipation paste on the heat dissipation fin.

[0007] In some embodiments, the flexible line further comprises a second heat paste printing module, which is arranged downstream of the ceramic sheet placing module and is capable of placing the carrier, and is used for printing heat paste on the ceramic sheet.

[0008] In some embodiments, the flexible line further comprises: a forward conveying assembly, which comprises a plurality of forward conveying mechanisms capable of being connected in sequence and capable of placing and forward conveying the carrier, and the plurality of forward conveying mechanisms are arranged in the heat sink placing module, the connector placing module, the ceramic sheet placing module and the optional module; a reverse conveying assembly, which comprises a plurality of reverse conveying mechanisms capable of being connected in sequence and capable of reverse conveying the carrier, and the plurality of reverse conveying mechanisms are arranged in the heat sink placing module, the connector placing module, the ceramic sheet placing module, the first heat paste printing module and the second heat paste printing module; and a front lifting module arranged at the front end of the flexible line and a rear lifting module arranged at the rear end of the flexible line, and the front lifting module and the rear lifting module are both provided with lifting mechanisms, the upper end of the lifting mechanisms is connected to the forward conveying assembly, and the lower end of the lifting mechanisms is connected to the reverse conveying assembly, so as to transfer the carrier between the forward conveying assembly and the reverse conveying assembly.

[0009] In some embodiments, the connector placing module comprises a connector vibrating disc and a push rod assembly connected to the connector vibrating disc, the push rod assembly comprises a connector accommodating groove and a push rod mechanism slidably connected to the connector accommodating groove, the connector accommodating groove is provided with a connector accommodating cavity for accommodating the connector, and the push rod mechanism is used for pushing the connector to the end of the connector accommodating cavity.

[0010] In some embodiments, the connector placing module further comprises a pneumatic finger, which is slidably connected to the rack of the connector placing module, so as to transfer the connector from the connector accommodating groove to the carrier.

[0011] In some embodiments, the ceramic sheet placing module comprises a ceramic sheet discharging mechanism, a ceramic sheet taking mechanism and a ceramic sheet placing platform for storing ceramic sheets, and the ceramic sheet taking mechanism is used for transferring ceramic sheets between the ceramic sheet discharging mechanism, the ceramic sheet placing platform and the carrier.

[0012] In some embodiments, the ceramic sheet taking mechanism comprises a first taking mechanism and a second taking mechanism, the first taking mechanism is slidably connected to the rack of the ceramic sheet placing module and is used for transferring ceramic sheets from the ceramic sheet discharging mechanism to the ceramic sheet placing platform, and the second taking mechanism is slidably connected to the rack of the ceramic sheet placing module and is used for transferring ceramic sheets from the ceramic sheet placing platform to the carrier.

[0013] In some embodiments, the ceramic sheet placing platform is configured as a rotatable disc, an upper side of the rotatable disc is provided with a plurality of groups of ceramic sheet placing grooves; the first material taking mechanism and the second material taking mechanism each include a vacuum suction disc for sucking the ceramic sheet and a motor assembly for adjusting the position of the vacuum suction disc; the first material taking mechanism and the second material taking mechanism each further include a sensor for identifying the position of the ceramic sheet, and the motor assembly adjusts the position of the ceramic sheet according to the sensor.

[0014] In some embodiments, the ceramic sheet discharging mechanism includes a ceramic sheet vibrating disc and a ceramic sheet conveying groove connected with the ceramic sheet vibrating disc, the ceramic sheet conveying groove is provided with a ceramic sheet conveying cavity for accommodating the ceramic sheet output by the ceramic sheet vibrating disc.

[0015] Additional aspects and advantages of the application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained according to the structures shown in the drawings without creative labor for those skilled in the art.

[0017] Figure 1 A module schematic diagram (partially not shown) of the non-screw locking type flexible line body for placing insulating particle ceramic sheets according to the embodiment of the present application;

[0018] Figure 2 A structure schematic diagram of a heat dissipation fin module of the non-screw locking type flexible line body for placing insulating particle ceramic sheets according to the embodiment of the present application;

[0019] Figure 3 A structure schematic diagram of a connecting piece module of the non-screw locking type flexible line body for placing insulating particle ceramic sheets according to the embodiment of the present application;

[0020] Figure 4 A structure schematic diagram of the connecting piece module from another perspective of Figure 3 ;

[0021] Figure 5 A structure schematic diagram of a part of the connecting piece module of Figure 3 ;

[0022] Figure 6 A structure schematic diagram of a part of the connecting piece module of Figure 3 ;

[0023] Figure 7 This is a schematic diagram of the ceramic sheet placement module of the screwless flexible wire body for placing insulating ceramic sheets according to an embodiment of the present invention.

[0024] Figure 8 middle Figure 7 A schematic diagram of the ceramic plate placement module from another perspective;

[0025] Figure 9 for Figure 8 A partial structural schematic diagram of the intermediate frequency ceramic chip module;

[0026] Figure 10 for Figure 8 A partial structural schematic diagram of the intermediate frequency ceramic chip module;

[0027] Figure 11 This is a schematic diagram of the front lifting module of the non-screw-locking flexible line body for placing insulating ceramic sheets according to an embodiment of the present invention.

[0028] Figure 12 for Figure 11 A partial structural diagram of the front-to-mid-section lifting module;

[0029] Figure 13 This is a schematic diagram of the rear lifting module of the non-screw-locking flexible line body for placing insulating ceramic sheets according to an embodiment of the present invention.

[0030] Figure 14 This is a partial structural diagram of the rear lifting module of the screwless flexible line body for placing insulating ceramic sheets according to an embodiment of the present invention.

[0031] Figure 15 This is a schematic diagram of the structure of the heat sink, connector, and ceramic sheet processed by the screwless flexible line for placing insulating ceramic sheets according to an embodiment of the present invention.

[0032] Explanation of icon numbers:

[0033]

[0034]

[0035] The realization of the objective, functional characteristics and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0037] It should be noted that all directional indications, such as up, down, left, right, front, back, etc., in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0038] In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the technical features indicated, or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" throughout the text includes three solutions, for example, A and / or B includes A technical solution, B technical solution, and A and B simultaneously meet the technical solution; in addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of a person of ordinary skill in the art, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor is it within the scope of protection required by the present application.

[0039] With reference to Figure 1 The present application provides a non-locking screw type flexible line body 10 for placing insulating particle ceramic sheets.

[0040] With reference to Figures 1 to 4 and Figure 15 In some embodiments of the present application, the non-locking screw type flexible line body 10 for placing insulating particle ceramic sheets includes a carrier 12 for carrying a heat sink 17, the heat sink 17 is provided with a first limiting hole 14 facing away from the carrier 12; a heat sink placing module 16 capable of placing the carrier 12, the heat sink placing module 16 is used to place the heat sink 17 on the carrier 12; a connecting piece placing module 18 arranged downstream of the heat sink placing module 16 and capable of placing the carrier 12, the connecting piece placing module 18 is used to arrange a connecting piece 20 on the heat sink 17, the first end of the connecting piece 20 is inserted into the first limiting hole 14 in an interference fit; and a ceramic sheet placing module 22 arranged downstream of the connecting piece placing module 18 and capable of placing the carrier 12, the ceramic sheet placing module 22 is used to arrange a ceramic sheet 24 on the connecting piece 20, the ceramic sheet 24 is provided with a second limiting hole 26, and the second end of the connecting piece 20 is inserted into the second limiting hole 26 in an interference fit.

[0041] The screwless flexible line body 10 of the insulating particle ceramic sheet according to the above embodiment, the heat dissipation sheet 17 is provided with the first limiting hole 14, the ceramic sheet 24 is provided with the second limiting hole 26, the first end and the second end of the connecting piece 20 are respectively inserted into the first limiting hole 14 and the second limiting hole 26 in an interference fit, so that the heat dissipation sheet 17 and the ceramic sheet 24 can be fixedly connected, and the purpose of fixing and connecting the heat dissipation sheet 17 and the ceramic sheet 24 can be achieved, and the steps are simple; in addition, the heat dissipation sheet 17 and the ceramic sheet 24 after being fixedly connected can be used for connecting a crystal, and the crystal can be cooled.

[0042] The screwless flexible line body 10 of the insulating particle ceramic sheet according to the above embodiment has at least the above beneficial effects.

[0043] Specifically, the carrier 12 can provide a processing carrier for the heat dissipation sheet 17, the heat dissipation sheet 17 can be placed on the carrier 12, and the carrier 12 is placed in a certain processing module, so that the heat dissipation sheet 17 can be processed by the processing module. In the embodiment of the application, the carrier 12 is configured to be adapted to multiple processing modules, so that the same carrier 12 can be placed in multiple processing modules. Alternatively, the carrier 12 is configured as a jig, and the jig is provided with a placing groove adapted to the heat dissipation sheet 17, and when the heat dissipation sheet 17 is placed in the placing groove, the heat dissipation sheet 17 can be processed by the processing module. Further alternatively, according to different processing needs, a jig with different shapes and / or sizes of placing grooves can be selected to adapt to different heat dissipation sheets 17, so that different heat dissipation sheets 17 can be processed. It should be noted that the jigs with different shapes and / or sizes of placing grooves can be placed in the processing module and processed.

[0044] The first limiting hole 14 of the heat dissipation sheet 17 has an opening, and when the heat dissipation sheet 17 is placed on the carrier 12, the opening of the first limiting hole 14 faces away from the side direction of the carrier 12, that is, the opening of the first limiting hole 14 is not blocked by the carrier 12. In this way, the processing module can be conveniently processed, for example, a component is inserted into the first limiting hole 14.

[0045] The heat dissipation sheet 17 can play a role in heat dissipation, and specifically, when the heat dissipation sheet 17 is connected to other components, the heat of the components can be conducted to the heat dissipation sheet 17 and dissipated to the surrounding space by the heat dissipation sheet 17, thereby playing a role in heat dissipation and cooling.

[0046] The heat dissipation fin placing module 16 has a rack, and the rack is provided with a structure for placing the carrier 12. In the embodiment, if the carrier 12 is not processed by the heat dissipation fin placing module 16, the carrier 12 is empty (that is, the heat dissipation fin 17 is not placed). When the carrier 12 is placed into the heat dissipation fin placing module 16, the heat dissipation fin 17 can be placed into the placing groove of the carrier 12 by manual or mechanical hand. It should be noted that there is a detachable connection between the heat dissipation fin 17 and the carrier 12. When the heat dissipation fin 17 needs to be processed subsequently, the heat dissipation fin 17 and the carrier 12 can maintain a stable connection state (will not be separated from the placing groove); when the heat dissipation fin 17 does not need to be processed subsequently, it can be separated from the carrier 12. The empty carrier 12 can be reserved to carry other heat dissipation fins 17.

[0047] The connection piece placing module 18 is arranged downstream of the heat dissipation fin placing module 16, and the connection piece placing module 18 has a rack, and the rack is provided with a structure for placing the carrier 12. The carrier 12 processed by the heat dissipation fin placing module 16 can be placed into the connection piece placing module 18, and the connection piece placing module 18 can set the connection piece 20 on the heat dissipation fin 17 of the carrier 12 according to a preset program. Specifically, the connection piece 20 includes a first end and a second end, and in the embodiment, the first end and the second end are respectively located at two opposite ends of the connection piece 20. The connection piece placing module 18 can move the connection piece 20, so that the first end of the connection piece 20 is located at a position corresponding to the first limiting hole 14 of the heat dissipation fin 17, and then the connection piece placing module 18 can continue to move the connection piece 20, and finally the first end of the connection piece 20 is inserted into the first limiting hole 14.

[0048] When the first end of the connection piece 20 is inserted into the first limiting hole 14, the outer wall surface of the first end and the hole wall surface of the first limiting hole 14 are in interference fit with each other, so that the connection piece 20 and the heat dissipation fin 17 are fixedly connected. Alternatively, different heat dissipation fins 17 can be provided with different first limiting holes 14, and the shapes and sizes of the connection pieces 20 for different heat dissipation fins 17 are also different, so that the connection pieces 20 can be inserted into these heat dissipation fins 17 in interference fit.

[0049] In the embodiment, the shape of the first end and the shape of the first limiting hole 14 can both be circular, and the cross-sectional outer diameter of the first end is greater than the hole diameter of the first limiting hole 14. However, the design is not limited to this, and in other embodiments, the shape of the first end and the shape of the first limiting hole 14 can also be other shapes, as long as the first end can be inserted into the first limiting hole 14 in interference fit.

[0050] The ceramic sheet placing module 22 is arranged downstream of the connector placing module 18, and has a rack on which structures are arranged to place the carrier 12. The carrier 12 passing through the connector placing module 18 can be placed to the ceramic sheet placing module 22, at this time, the heat dissipation sheet 17 on the carrier 12 has been provided with the connector 20 (i.e. the heat dissipation sheet 17 and the connector 20 are in a connected state, in which state, the first end of the connector 20 is inserted into the first limiting hole 14, and the second end protrudes out of the external space of the heat dissipation sheet 17), and the ceramic sheet placing module 22 can place the ceramic sheet 24 on the connector 20.

[0051] The second limiting hole 26 of the ceramic sheet has an opening, and the ceramic sheet placing module 22 can move the ceramic sheet 24 according to a preset program, so that the second limiting hole 26 of the ceramic sheet 24 corresponds to the second end of the connector 20. Then, the ceramic sheet placing module 22 can continue to move the ceramic sheet 24, so that the second limiting hole 26 of the ceramic sheet 24 finally sleeves the second end of the connector 20 (i.e. the second end is in the state of being inserted into the second limiting hole 26). When the second end is inserted into the second limiting hole 26, the outer wall surface of the second end of the connector 20 and the hole wall surface of the second limiting hole 26 are in interference fit with each other, so that the ceramic sheet 24 and the connector 20 can be fixedly connected. Alternatively, different ceramic sheets 24 can be provided with different second limiting holes 26, and the shapes and sizes of the connectors 20 for different ceramic sheets 24 can also be different, so that the connector 20 can be in interference fit with these different ceramic sheets 24.

[0052] In the embodiment, the shape of the second end and the shape of the second limiting hole 26 can both be circular, and the cross-sectional outer diameter of the second end is greater than the hole diameter of the second limiting hole 26. However, the design is not limited thereto, and in other embodiments, the shape of the second end and the shape of the second limiting hole 26 can also be other shapes, as long as the second end can be in interference fit with the second limiting hole 26.

[0053] In the embodiment, the carrier 12 can be provided with the heat dissipation fins 17 by passing through the heat dissipation fin module 16, and then can be provided with the connecting pieces 20 by passing through the connecting piece module 18, and then the heat dissipation fins 17 and the connecting pieces 20 are in a connected state; and then the connecting pieces 20 can be provided with the ceramic pieces 24 by passing through the ceramic piece module 22, and then the ceramic pieces 24 and the connecting pieces 20 are in a connected state, that is, the heat dissipation fins 17, the connecting pieces 20 and the ceramic pieces 24 are in a connected state. It can be understood that by passing through the heat dissipation fin module 16, the connecting piece module 18 and the connecting piece module 18, a heat dissipation assembly including the heat dissipation fins 17, the connecting pieces 20 and the ceramic pieces 24 connected in sequence by interference fit can be output, which can be used to connect the crystal and other components, so as to dissipate the heat of the crystal and the like, and the ceramic pieces 24 can insulate the heat dissipation fins 17 and the crystal to avoid the leakage of the crystal to the heat dissipation fins 17 when the crystal works. It can be understood that the heat dissipation fins 17, the connecting pieces 20 and the ceramic pieces 24 are connected by interference fit, without the need for additional locking modules for locking operation, thereby simplifying the processing steps. Moreover, the heat dissipation fins 17, the connecting pieces 20 and the ceramic pieces 24 connected as a whole heat dissipation assembly can be connected to other components (such as the crystal), so as to dissipate heat for these components.

[0054] In Figure 15 In the embodiment shown, the outer diameter of the first end of the connecting piece 20 is greater than the outer diameter of the second end, the outer wall surface of the first end includes a first wall surface abutting against the wall surface of the first limiting hole 14 and a second wall surface connected to the second end, and when the first end is inserted into the first limiting hole 14, the second wall surface is flush with or lower than the outer wall surface of the adjacent heat dissipation fin 17.

[0055] In this way, unnecessary gaps between the ceramic piece 24 and the heat dissipation fin 17 can be avoided.

[0056] Specifically, the outer diameter of the first end is greater than the outer diameter of the second end, that is, the hole diameter of the first limiting hole 14 is greater than the hole diameter of the second end. It can be understood that the heat dissipation fin 17 has a larger surface area and can contact the ceramic piece 24 more and can better dissipate heat to the air in the surrounding space. That is, as a preferred embodiment, the surface area of the heat dissipation fin 17 is greater than the surface area of the ceramic piece 24, that is, the heat dissipation fin 17 can have more positions to set the first limiting hole 14, and therefore the first limiting hole 14 can be set to be larger, and the first end inserted into the first limiting hole 14 can be set to be larger, that is, the outer diameter of the first end can be greater than the outer diameter of the second end.

[0057] When the first end of the connecting piece 20 is inserted into the first limiting hole 14, the first wall surface abuts against the hole wall surface of the first limiting hole 14, and the first wall surface is in interference fit with the hole wall surface of the first limiting hole 14, so that the connecting piece 20 is fixedly connected to the heat dissipation fin 17. One end of the second wall surface is connected to the first wall surface, and the other end is connected to the side wall surface of the second end. When the first end is inserted into the first limiting hole 14, the heat dissipation fin 17 has an outer wall surface adjacent to the second wall surface, and the second wall surface is flush with or lower than the outer wall surface of the heat dissipation fin 17. In this way, when the heat dissipation fin 17 and the ceramic sheet 24 are both connected to the connecting piece 20, the ceramic sheet 24 can not be blocked by the second wall surface, and can maintain good contact with the heat dissipation fin 17, so that the two can better transfer heat.

[0058] Referring to Figure 1 In some embodiments, the flexible line body 10 further comprises a first thermal paste printing module 28 arranged between the heat dissipation fin placing module 16 and the connecting piece placing module 18 and capable of placing the carrier 12. The first thermal paste printing module 28 is used for printing thermal paste on the heat dissipation fin 17.

[0059] In this way, the thermal paste can be printed on the heat dissipation fin 17, and the heat dissipation efficiency of the heat dissipation fin 17 can be increased.

[0060] Specifically, the flexible line body 10 can include a plurality of selectable modules, and different selectable modules can have different functions. According to the processing needs, a selectable module with a certain function can be selected and inserted into the processing and production flow of the flexible line body 10. For example, a thermal paste printing module with a thermal paste printing function can be selected and arranged downstream of the heat dissipation fin placing module 16, specifically between the heat dissipation fin placing module 16 and the connecting piece placing module 18, so that thermal paste can be printed on the heat dissipation fin 17.

[0061] In the present embodiment, the first thermal paste printing module 28 can be arranged downstream of the heat dissipation fin placing module 16, specifically between the heat dissipation fin placing module 16 and the connecting piece placing module 18, and the first thermal paste printing module 28 has a rack on which structures are arranged to place the carrier 12. The carrier 12 passing through the heat dissipation fin placing module 16 can be placed into the first thermal paste printing module 28, and the first thermal paste printing module 28 can print thermal paste on the heat dissipation fin 17 on the carrier 12 according to a predetermined program. For example, the thermal paste printing storage mechanism of the first thermal paste printing module 28 circulates the thermal paste, and the thickness of the thermal paste printed on the heat dissipation fin 17 can be adjusted. The printing head of the first thermal paste printing module 28 can move from the thermal paste storage mechanism to be close to the heat dissipation fin 17, and finally print thermal paste on the heat dissipation fin 17. Optionally, the printing head can be quickly replaced according to different types of printing objects. Further, the first thermal paste printing module 28 can use a pneumatic cylinder to fix the heat dissipation fin 17, so as to ensure that the heat dissipation fin 17 is not lifted or displaced after printing.

[0062] Referring to Figure 1 In some embodiments, the flexible line body 10 further comprises a second heat sink paste printing module 30, which is arranged downstream of the ceramic sheet placing module 22 and is capable of placing the carrier 12, and the second heat sink paste printing module 30 comprises a mechanism for printing heat sink paste on the ceramic sheet 24.

[0063] In this way, the heat sink paste can be printed on the ceramic sheet 24, and the heat dissipation efficiency of the ceramic sheet 24 can be increased.

[0064] In the present embodiment, the second heat sink paste printing module 30 can be arranged downstream of the ceramic sheet placing module 22, and the second heat sink paste printing module 30 has a rack on which a structure is arranged to place the carrier 12. The carrier 12 passing through the ceramic sheet placing module 22 can be placed into the second heat sink paste printing module 30, and the second heat sink paste printing module 30 can print heat sink paste on the ceramic sheet 24 on the carrier 12 according to a predetermined program. For example, the heat sink paste printing storage mechanism of the second heat sink paste printing module 30 circulates the heat sink paste, and the thickness of the heat sink paste printed on the ceramic sheet 24 can be adjusted. The glue printing head of the second heat sink paste printing module 30 can move close to the ceramic sheet 24 from the heat sink paste storage mechanism, and finally print the heat sink paste on the ceramic sheet 24. Optionally, the glue printing head of the second heat sink paste printing module 30 can be quickly replaced according to different types of printing objects. Further, the second heat sink paste printing module 30 can use a pneumatic cylinder to fix the ceramic sheet 24, to ensure that the heat sink sheet 17 is not lifted or displaced after printing.

[0065] Referring to Figure 1 and Figures 11 to 14 In some embodiments, the flexible line body 10 further comprises a forward conveying assembly comprising a plurality of forward conveying mechanisms 32 capable of being connected in sequence and capable of placing and conveying the carrier 12 forward, the plurality of forward conveying mechanisms 32 being arranged in the heat sink sheet placing module 16, the connecting piece placing module 18, the ceramic sheet placing module 22, the first heat sink paste printing module 28, and the second heat sink paste printing module 30; a reverse conveying assembly comprising a plurality of reverse conveying mechanisms 34 capable of being connected in sequence and capable of conveying the carrier 12 reversely, the plurality of reverse conveying mechanisms 34 being arranged in the heat sink sheet placing module 16, the connecting piece placing module 18, the ceramic sheet placing module 22, the first heat sink paste printing module 28, and the second heat sink paste printing module 30; and a front lifting module 36 arranged at the front end of the flexible line body 10 and a rear lifting module 38 arranged at the rear end of the flexible line body 10, the front lifting module 36 and the rear lifting module 38 each being provided with a lifting mechanism 40, the upper end of the lifting mechanism 40 being connected to the forward conveying assembly, and the lower end being connected to the reverse conveying assembly, so that the carrier 12 is transferred between the forward conveying assembly and the reverse conveying assembly.

[0066] In this way, the carrier 12 can be used to transport the heat dissipation fin module 16, the connecting piece module 18, the ceramic piece module 22, the first heat dissipation paste printing module 28 and the second heat dissipation paste printing module 30, and a pipeline operation can be realized, and the carrier 12 can be repeatedly used. In particular, the heat dissipation fin module 16, the connecting piece module 18, the ceramic piece module 22, the first heat dissipation paste printing module 28, the second heat dissipation paste printing module 30, and the front lifting module 36 and the rear lifting module 38 can be assembled according to the processing needs to form different flexible line bodies 10.

[0067] Specifically, in the embodiment, all the modules included in the non-lock screw type flexible line body 10 for placing insulating particle ceramic pieces can be connected two by two, and the connection is a detachable connection. That is, when two or more modules are connected into one, the processing function of the modules can be processed. When the position of the modules needs to be adjusted, or some modules are removed or added, the modules can be separated, and the above-mentioned related operations can be performed. For example, the heat dissipation fin module 16, the connecting piece module 18 and the ceramic piece module 22 are connected in sequence to form a processing pipeline, and the objects passing through the three modules can be processed to place the heat dissipation fin 17, the connecting piece 20 and the ceramic piece 24. When it is necessary to print heat dissipation paste on the heat dissipation fin 17, the heat dissipation fin module 16 and the connecting piece module 18 can be separated, and the first heat dissipation paste printing module 28 can be added therebetween. The processing object can first pass through the heat dissipation fin module 16, and then be input into the first heat dissipation paste printing module 28. The first heat dissipation paste printing module 28 can print heat dissipation paste on the heat dissipation fin 17. Thereafter, the processing object is output from the first heat dissipation paste printing module 28 and enters the subsequent module for processing.

[0068] The detachable connection of the plurality of modules included in the non-lock screw type flexible line body 10 for placing insulating particle ceramic pieces can be realized by the plurality of positive conveying mechanisms 32 included in the positive conveying assembly. The heat dissipation fin module 16, the connecting piece module 18, the ceramic piece module 22, the first heat dissipation paste printing module 28 and the second heat dissipation paste printing module 30 each are provided with a positive conveying mechanism 32. It should be noted that when the above-mentioned selectable modules include a plurality of modules, each of the plurality of modules is provided with a positive conveying mechanism 32. The positive conveying mechanisms 32 arranged in different modules can be connected two by two in sequence. Specifically, the positive conveying mechanisms 32 of different modules can be located on the same horizontal line, and the positive conveying mechanism 32 of a certain module outputs the processing object, which can be input into the positive conveying mechanism 32 of the connected module.

[0069] For example, the positive conveying mechanism 32 on the heat dissipation fin placing module 16 can be connected with the positive conveying mechanism 32 on the connecting piece placing module 18, when the carrier 12 is placed on the positive conveying mechanism 32 of the heat dissipation fin placing module 16, the heat dissipation fin placing module 16 places the heat dissipation fins 17 on the carrier 12, then the positive conveying mechanism 32 can run, and the carrier 12 can be output from the positive conveying mechanism 32 of the heat dissipation fin placing module 16, transferred to the positive conveying mechanism 32 on the connecting piece placing module 18, and then the connecting pieces 20 can be placed on the heat dissipation fins 17 by the connecting piece placing module 18, then the positive conveying mechanism 32 on the connecting piece placing module 18 can continue to run, and the carrier 12 can be output to the positive conveying mechanism 32 of the next module for subsequent processing.

[0070] In addition, when the heat dissipation fin placing module 16 and the connecting piece placing module 18 are separated, the positive conveying mechanisms of the two can be separated, and the first heat dissipation paste printing module 28 can be inserted, the input end of the positive conveying mechanism 32 of the first heat dissipation paste printing module 28 can be connected with the output end of the positive conveying mechanism 32 of the heat dissipation fin placing module 16, and the output end of the positive conveying mechanism 32 of the first heat dissipation paste printing module 28 can be connected with the input end of the positive conveying mechanism 32 of the heat dissipation fin placing module 16, when the carrier 12 is output by the positive conveying mechanism 32 of the heat dissipation fin placing module 16, it can be transferred to the positive conveying mechanism 32 on the first heat dissipation paste printing module 28, the first heat dissipation paste printing module 28 can print the heat dissipation paste on the heat dissipation fins 17, then the positive conveying mechanism 32 on the first heat dissipation paste printing module 28 can continue to run, and the carrier 12 can be output to the positive conveying mechanism 32 on the connecting piece placing module 18, and the connecting piece placing module 18 can place the connecting pieces 20 on the heat dissipation fins 17.

[0071] Similarly, the plurality of modules included in the flexible line body 10 of the embodiment can realize separable connection and positive conveying of the processing object such as the carrier 12 through the positive conveying assembly.

[0072] It can be understood that in the embodiment, the heat dissipation fin placing module 16, the connecting piece placing module 18, the ceramic piece placing module 22, the first heat dissipation paste printing module 28 and the second heat dissipation paste printing module 30 can place the carrier 12, which is realized through the positive conveying mechanisms 32 of the positive conveying assembly arranged in each module.

[0073] In the embodiment, the positive conveying mechanisms 32 of the positive conveying assembly are arranged on the upper part of each module, and the reverse conveying mechanisms 34 of the reverse conveying assembly are arranged on the lower part of each module, so that the processing object on the positive conveying mechanism 32 can be processed.

[0074] When the plurality of modules are connected in sequence, the positive motion mechanism of each module can be connected in sequence, and the reverse conveying mechanism 34 of the reverse conveying assembly located at each module can also be connected in sequence, so that the carrier 12 can be conveyed in reverse on the reverse conveying mechanism 34 of each module. It can be understood that the running direction of the positive conveying assembly is opposite to the running direction of the reverse conveying assembly. When the carrier 12 is empty, the carrier 12 can be transferred downward by the rear lifting module 38 to the reverse conveying assembly, and the reverse conveying assembly can convey the carrier 12 in reverse to the front lifting module 36, and the front lifting module 36 transfers the carrier 12 to the positive conveying mechanism 32 connected thereto, so that the carrier 12 can be conveyed on the positive conveying mechanism 32 of each module again, that is, the relevant processing can be performed again. In this way, the cycle is repeated.

[0075] The front lifting module 36 includes a lifting mechanism 40 connected to the positive conveying mechanism 32 of the module (such as the heat dissipation fin module 16) at the front end of the flexible wire body 10 at the upper end and connected to the reverse conveying mechanism 34 of the module at the lower end. The lifting mechanism 40 of the front lifting module 36 can ascend, and the carrier 12 can be transferred from the reverse conveying assembly to the positive conveying assembly. The rear lifting module 38 includes a lifting mechanism 40 connected to the positive conveying mechanism 32 of the module (such as the second heat dissipation paste dispensing module 30) at the tail end of the flexible wire body 10 at the upper end and connected to the reverse conveying mechanism 34 of the module at the lower end. The lifting mechanism 40 of the rear lifting module 38 can descend, and the carrier 12 can be transferred from the positive conveying assembly to the reverse conveying assembly.

[0076] Referring to Figures 3 to 6 In some embodiments, the connection piece dispensing module 18 includes a connection piece vibration disc 42 and a push rod assembly 43 connected to the connection piece vibration disc 42. The push rod assembly 43 includes a connection piece accommodating groove 44 and a push rod mechanism 46 slidably connected to the connection piece accommodating groove 44. The connection piece accommodating groove 44 is provided with a connection piece 20 accommodating cavity for accommodating the connection piece. The push rod mechanism 46 is used to push the connection piece 20 to the end of the connection piece accommodating cavity.

[0077] In this way, the connection piece 20 dispensing function of the connection piece dispensing module 18 can be realized.

[0078] Specifically, the connection piece vibration disc 42 can output the connection pieces 20 in an orderly and neat manner through vibration. In addition, the connection piece vibration disc 42 can also adjust the posture of the connection pieces 20, so that the output connection pieces 20 can enter the push rod assembly 43 according to the expected posture, thereby facilitating the dispensing of the connection pieces 20. However, the design is not limited thereto. In other embodiments, the connection piece dispensing module 18 can also realize the dispensing of the connection pieces 20 through other devices.

[0079] A conveying slope is arranged between the connecting piece vibration disc 42 and the push rod assembly 43, and the connecting piece 20 enters the connecting piece accommodating groove 44 through the conveying slope. Specifically, the connecting piece accommodating groove 44 is connected to the conveying slope, and the connecting piece 20 can enter the connecting piece accommodating groove 44 from the conveying slope. When the connecting piece 20 is located in the connecting piece accommodating cavity of the connecting piece accommodating groove 44, the push rod mechanism 46 can be operated to push the connecting piece 20 to move to the end, so that the subsequent connecting piece 20 taking operation can be facilitated.

[0080] In some embodiments, the connecting piece module 18 further comprises a pneumatic finger 48 (as shown in Figure 6 The pneumatic finger 48 is slidably connected to the rack of the connecting piece module 18 to transfer the connecting piece 20 from the connecting piece accommodating groove 44 to the carrier 12.

[0081] In this way, the connecting piece module 18 can take and place the connecting piece 20.

[0082] Specifically, the connecting piece module 18 has a rack, which can provide a mounting carrier for the installation of other components. The pneumatic finger 48 is connected to the rack, and the pneumatic finger 48 can move relative to the rack, which can be sliding within the position range of the carrier 12 and the connecting piece accommodating groove 44 to realize the pneumatic finger 48 approaching or moving away from the carrier 12 and approaching or moving away from the connecting piece accommodating groove 44. When the pneumatic finger 48 approaches the connecting piece 20 until the connecting piece 20 can be taken, the pneumatic finger 48 can be driven by the air cylinder to operate and can clamp the connecting piece 20. When the pneumatic finger 48 clamps the connecting piece 20, it can move to approach the carrier 12. When the connecting piece 20 clamped by the pneumatic finger 48 is located at the position of the first limiting hole 14 of the adaptive heat dissipation fin 17, the pneumatic finger 48 can insert the first end of the connecting piece 20 into the first limiting hole 14 to complete the connection of the connecting piece 20 and the heat dissipation fin 17.

[0083] In Figure 6 In the embodiment shown in the figure, the pneumatic finger 48 can be driven by the air cylinder 49. When the air cylinder 49 operates, the pneumatic finger 48 can take or release the connecting piece 20 and the like.

[0084] In some embodiments, the connecting piece 20 is configured as an insulating particle.

[0085] In this way, the connecting piece 20 can have the performance of insulation.

[0086] Specifically, in the present embodiment, the insulating particle can play the role of connecting the heat dissipation fin 17 and the ceramic sheet 24, and the insulating particle can also insulate other components connected by the heat dissipation fin 17 and the ceramic sheet 24. In addition, the insulating particle is a cheap and easily available product that exists in large quantities in the market, which is very convenient to obtain.

[0087] Referring to Figures 7 to 10 In some embodiments, the ceramic sheet placing module 22 comprises a ceramic sheet discharging mechanism 50, a ceramic sheet taking assembly 52, and a ceramic sheet placing platform 54 for storing the ceramic sheet 24, and the ceramic sheet taking assembly 52 is used to transfer the ceramic sheet 24 between the ceramic sheet discharging mechanism 50, the ceramic sheet placing platform 54, and the heat dissipation sheet 17 of the carrier 12.

[0088] In this way, the ceramic sheet 24 can be taken as needed.

[0089] Specifically, the ceramic sheet discharging mechanism 50 is used to output the stored ceramic sheet 24, and the ceramic sheet 24 can be transferred from the ceramic sheet discharging mechanism 50 to the ceramic sheet placing platform 54 by the ceramic sheet taking assembly 52, and temporarily stored by the ceramic sheet placing platform 54, so as to ensure that the ceramic sheet 24 can be taken as needed. When the processing object (in this embodiment, the processing object can be the heat dissipation sheet 17 on the carrier 12) placed on the ceramic sheet placing module 22 needs to be provided with the ceramic sheet 24, the ceramic sheet taking assembly 52 can start to operate and move within the position range of the carrier 12, the ceramic sheet placing platform 54, and the ceramic sheet discharging mechanism 50, so as to realize that the ceramic sheet taking assembly 52 is close to or away from the carrier 12, close to or away from the ceramic sheet placing platform 54, and close to or away from the ceramic sheet discharging mechanism 50.

[0090] The ceramic sheet taking assembly 52 can be close to the ceramic sheet 24 on the ceramic sheet discharging mechanism 50 until the ceramic sheet 24 is taken. When the ceramic sheet taking assembly 52 takes the ceramic sheet 24, it can move and be close to the ceramic sheet placing platform 54, and when the ceramic sheet 24 is located at a position suitable for the ceramic sheet placing platform 54, the ceramic sheet taking assembly 52 can place the ceramic sheet 24 on the ceramic sheet placing platform 54.

[0091] The ceramic sheet taking assembly 52 can be close to the ceramic sheet 24 on the ceramic sheet placing platform 54 until the ceramic sheet 24 is taken. When the ceramic sheet taking assembly 52 takes the ceramic sheet 24, it can move and be close to the heat dissipation sheet 17 on the carrier 12, and when the second limiting hole 26 of the ceramic sheet 24 is located at a position suitable for the second end of the connecting piece 20, the ceramic sheet taking assembly 52 can set the ceramic sheet 24 on the second end, and the connecting piece 20 can be connected to the ceramic sheet 24, that is, the ceramic sheet 24, the connecting piece 20, and the heat dissipation sheet 17 are connected.

[0092] In some embodiments, the ceramic sheet picking assembly 52 includes a first picking mechanism 56 and a second picking mechanism 58. The first picking mechanism 56 is slidably connected to the frame of the ceramic sheet placing module 22 for transferring the ceramic sheet 24 from the ceramic sheet discharging mechanism 50 to the ceramic sheet placing platform 54. The second picking mechanism 58 is slidably connected to the frame of the ceramic sheet placing module 22 for transferring the ceramic sheet 24 from the ceramic sheet placing platform 54 to the carrier 12.

[0093] In this way, the ceramic sheet picking assembly 52 can transfer the ceramic sheet 24.

[0094] In particular, the ceramic sheet placing module 22 has a frame, which can provide a mounting carrier for mounting other components. The first picking mechanism 56 is connected to the frame, and the first picking mechanism 56 can move relative to the frame, which can be a sliding movement within the range of positions of the ceramic sheet placing platform 54 and the ceramic sheet discharging mechanism 50, so as to move the first picking mechanism 56 closer to or farther away from the ceramic sheet discharging mechanism 50, and closer to or farther away from the ceramic sheet placing platform 54. The first picking mechanism 56 can move close to the ceramic sheet 24 on the ceramic sheet discharging mechanism 50 until picking up the ceramic sheet 24. When the first picking mechanism 56 picks up the ceramic sheet 24, it can move to be close to the ceramic sheet placing platform 54, and when the ceramic sheet 24 is positioned at a position suitable for the ceramic sheet placing platform 54, the first picking mechanism 56 can place the ceramic sheet 24 on the ceramic sheet placing platform 54.

[0095] The second picking mechanism 58 is connected to the frame, and the second picking mechanism 58 can move relative to the frame, which can be a sliding movement within the range of positions of the ceramic sheet placing platform 54 and the carrier 12, so as to move the second picking mechanism 58 closer to or farther away from the carrier 12, and closer to or farther away from the ceramic sheet placing platform 54. When the processed object (in this embodiment, the processed object can be the heat dissipation sheet 17 on the carrier 12) placed on the ceramic sheet placing module 22 needs to be provided with the ceramic sheet 24, the second picking mechanism 58 can move close to the ceramic sheet 24 on the ceramic sheet placing platform 54 until picking up the ceramic sheet 24. When the second picking mechanism 58 picks up the ceramic sheet 24, it can move to be close to the heat dissipation sheet 17 on the carrier 12, and when the second limiting hole 26 of the ceramic sheet 24 is positioned at a position suitable for the second end of the connecting piece 20, the second picking mechanism 58 can set the ceramic sheet 24 on the second end, and the connecting piece 20 can be connected to the ceramic sheet 24, that is, the ceramic sheet 24, the connecting piece 20, and the heat dissipation sheet 17 are connected.

[0096] In some embodiments, the ceramic sheet placement platform 54 is configured as a rotatable disc, and a plurality of groups of ceramic sheet placement slots are spaced apart on the upper side of the rotatable disc. The first material taking mechanism 56 and the second material taking mechanism 58 each include a vacuum suction disc 59 for suctioning the ceramic sheet 24, and a motor assembly for adjusting the position of the vacuum suction disc 59. The first material taking mechanism 56 and the second material taking mechanism 58 each further include a sensor for identifying the position of the ceramic sheet 24, and the motor assembly adjusts the position of the ceramic sheet 24 according to the sensor.

[0097] In this way, the ceramic sheet 24 can be taken as needed.

[0098] Specifically, the rotatable disc can be rotated relative to the rack of the ceramic sheet placement module 22. It can be understood that when a certain position region of the rotatable disc is full of ceramic sheets 24 or has a vacancy, the rotatable disc can be rotated to adjust the angular position, so that the certain position region of the rotatable disc can be moved to a position facilitating the first material taking mechanism 56 or the second material taking mechanism 58 to take or place the ceramic sheet 24.

[0099] The plurality of groups of ceramic sheet placement slots spaced apart on the upper side of the rotatable disc can include ceramic sheet placement slots of different shapes and / or sizes, and can respectively accommodate ceramic sheets 24 of different shapes and / or sizes. When the processing object (in this embodiment, the processing object can be the heat dissipation fin 17 on the carrier 12) placed on the ceramic sheet placement module 22 needs to be provided with a ceramic sheet 24, the second material taking mechanism 58 can select a certain ceramic sheet 24 as needed from the ceramic sheets 24. Alternatively, in other embodiments, the plurality of groups of ceramic sheet placement slots spaced apart on the upper side of the rotatable disc can include a plurality of identical ceramic sheet placement slots, and can accommodate a plurality of identical ceramic sheets 24.

[0100] The first material taking mechanism 56 and the second material taking mechanism 58 each include a vacuum suction disc 59, which can suction the ceramic sheet 24 to realize the first material taking mechanism 56 and the second material taking mechanism 58 to take the ceramic sheet 24. The motor assembly for adjusting the position of the vacuum suction disc 59 can adjust the position of the vacuum suction disc 59, so that the vacuum suction disc 59 can be located at a position suitable for the ceramic sheet 24 to facilitate suction of the ceramic sheet 24, or the position of the ceramic sheet 24 suctioned by the vacuum suction disc 59 can be adjusted to facilitate the ceramic sheet 24 to be placed at a desired position.

[0101] The first and second material taking mechanisms 56 and 58 each include a sensor that can identify the position of the ceramic sheet 24 and generate position information, so that the first or second material taking mechanism 56 or 58 can adjust the angular position of the vacuum chuck 59 according to the position information, so that the vacuum chuck 59 is positioned at a position suitable for the ceramic sheet 24 to facilitate the taking of the ceramic sheet 24, or the position of the ceramic sheet 24 taken by the vacuum chuck 59 can be adjusted so that the ceramic sheet 24 can be placed at a desired position. In some alternative embodiments, the sensor can identify ceramic sheets 24 of different shapes and / or sizes and generate ceramic sheet 24 information, so that the first or second material taking mechanism 56 or 58 can adjust the angular position of the vacuum chuck 59 according to the ceramic sheet 24 information, so that the vacuum chuck 59 is positioned at a position suitable for the ceramic sheet 24 to facilitate the taking of the desired ceramic sheet 24, or the position of the ceramic sheet 24 taken by the vacuum chuck 59 can be adjusted so that the ceramic sheet 24 can be placed at a desired position.

[0102] In some embodiments, the ceramic sheet discharging mechanism 50 includes a ceramic sheet vibrating disc 60 and a ceramic sheet conveying groove 62 connected to the ceramic sheet vibrating disc 60, and the ceramic sheet conveying groove 62 is provided with a ceramic sheet conveying cavity to accommodate the ceramic sheets 24 output by the ceramic sheet vibrating disc 60.

[0103] In this way, the ceramic sheets 24 can be discharged.

[0104] Specifically, the ceramic sheet vibrating disc 60 can output the ceramic sheets 24 in an orderly and neat manner by vibrating, and in addition, the ceramic sheet vibrating disc 60 can also adjust the posture of the connecting member 20, so that the output ceramic sheets 24 can enter the ceramic sheet conveying groove 62 in a desired posture, thereby facilitating the taking of the ceramic sheets 24 by the material taking assembly. However, the design is not limited thereto, and in other embodiments, the ceramic sheet placing module 22 can also discharge the ceramic sheets 24 by other means.

[0105] When the ceramic sheets 24 are output to the ceramic sheet conveying groove 62, the ceramic sheets 24 can enter the ceramic sheet conveying cavity in a sequential order, and the ceramic sheet conveying groove 62 is located within the movement range of the first material taking mechanism 56, so that the ceramic sheets 24 located in the ceramic sheet conveying cavity can be taken by the first material taking mechanism 56.

[0106] The above description is only an alternative embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made according to the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A screwless flexible wire with an insulating ceramic sheet, characterized in that, The flexible line body further comprises a first printing heat dissipation paste module, which is arranged between the heat dissipation fin placing module and the connecting piece placing module and can place the carrier, and is used for printing heat dissipation paste on the heat dissipation fin. The flexible line body further comprises a second printing heat dissipation paste module, which is arranged downstream of the ceramic piece placing module and can place the carrier, and is used for printing heat dissipation paste on the ceramic piece. The flexible line body further comprises: a positive conveying assembly, which comprises a plurality of positive conveying mechanisms capable of being connected in sequence and capable of placing and positively conveying the carrier, and the plurality of positive conveying mechanisms are arranged in the heat dissipation fin placing module, the connecting piece placing module, the ceramic piece placing module, the first printing heat dissipation paste module and the second printing heat dissipation paste module; ​ ​ ​ ​ ​ ​ ​ 2. The non-locking screw type flexible wire body for the insulating ceramic tile of claim 1, wherein, ​ 3. The non-locking screw type flexible wire body for the insulating ceramic tile of claim 2, wherein, ​ 4. The non-locking screw type flexible wire body for the insulating ceramic tile of claim 3, wherein, ​ ​ The reverse conveying assembly comprises a plurality of reverse conveying mechanisms capable of being connected in sequence in two phases to reversely convey the carrier, and the plurality of reverse conveying mechanisms are arranged at the heat dissipation fin module, the connector module, the ceramic piece module, the first heat dissipation paste printing module and the second heat dissipation paste printing module. The front lifting module is arranged at the front end of the flexible wire body, and the rear lifting module is arranged at the rear end of the flexible wire body. The front lifting module and the rear lifting module are both provided with lifting mechanisms, the upper end of the lifting mechanism is connected with the forward conveying assembly, and the lower end of the lifting mechanism is connected with the reverse conveying assembly, so that the carrier is transferred between the forward conveying assembly and the reverse conveying assembly.

5. The non-threaded flexible pin of claim 1 wherein, The connector module comprises a connector vibrating disc and a push rod assembly connected with the connector vibrating disc. The push rod assembly comprises a connector accommodating groove and a push rod mechanism slidably connected with the connector accommodating groove. The connector accommodating groove is provided with a connector accommodating cavity for accommodating the connector. The push rod mechanism is used for pushing the connector to the end of the connector accommodating cavity.

6. The non-locking screw type flexible cable of claim 5, wherein the insulating particles are alumina particles. The connector module further comprises a pneumatic finger slidably connected with the rack of the connector module, so as to transfer the connector from the connector accommodating groove to the carrier.

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