Connection structure for circuit board

Abstract

This disclosure relates to a connection structure for a circuit board, including a first network, a second network, a first pad, and a second pad. Both the first network and the second network are disposed on the circuit board body. The first pad is disposed on the first network and electrically connected to it. The second pad is disposed on the second network and electrically connected to it. The first pad and the second pad are disposed opposite each other along a first direction and have a gap between them. The first pad and the second pad are electrically connected through a solder paste layer. The solder paste layer includes a first portion, the two ends of which respectively cover at least a portion of the upper surface of the first pad and at least a portion of the upper surface of the second pad. The size of the portion of the first portion covering the first pad in a second direction is positively correlated with the maximum current that the solder paste layer can pass through, and the size of the portion of the first portion covering the second pad in a second direction is also positively correlated with the maximum current that the solder paste layer can pass through.

Description

Technical Field

[0001] This disclosure relates to the field of circuit board technology, and more specifically, to a connection structure for circuit boards. Background Technology

[0002] In circuit board design, components are often used to connect networks that need to be shorted.

[0003] When connecting networks that need to be shorted, appropriate components must be selected based on the magnitude of the current after shorting. For example, if a relatively large current needs to be passed, components with very low on-resistance are required. Furthermore, after selecting components with suitable current capacity, the two ends of the components must be manually shorted using a soldering iron. The selection and soldering of components are time-consuming and labor-intensive, increasing not only the soldering cycle of the circuit board connection structure but also labor costs. Summary of the Invention

[0004] The purpose of this disclosure is to provide a connection structure for circuit boards that eliminates the need for component selection and soldering, making network connections more time-saving and labor-saving.

[0005] To achieve the above objectives, this disclosure provides a connection structure for a circuit board, including a first network, a second network, a first pad, and a second pad. The first network and the second network are both disposed on the circuit board body. The first pad is disposed on the first network and electrically connected to the first network. The second pad is disposed on the second network and electrically connected to the second network. The first pad and the second pad are disposed opposite to each other along a first direction and there is a gap between the first pad and the second pad.

[0006] The first pad and the second pad are electrically connected by a solder paste layer to short-circuit the first network and the second network. The solder paste layer includes a first portion, the two ends of which respectively cover at least a portion of the upper surface of the first pad and the upper surface of the at least a portion of the second pad.

[0007] The size of the portion of the first part covering the first pad in the second direction is positively correlated with the maximum current that the solder paste layer can pass through, and the size of the portion of the first part covering the second pad in the second direction is positively correlated with the maximum current that the solder paste layer can pass through, wherein the second direction is perpendicular to the first direction, and both the first direction and the second direction are parallel to the circuit board body.

[0008] Optionally, the maximum current that the solder paste layer can pass through is positively correlated with the thickness of the solder paste layer itself.

[0009] Optionally, the solder paste layer may further include a second portion located below the first portion, the second portion filling the gap.

[0010] Optionally, the connection structure for the circuit board further includes a solder mask layer that covers at least a portion of the upper surface of the circuit board body and covers a portion of the first pad and a portion of the second pad.

[0011] Optionally, the solder mask layer covers the portions of the first pad and the second pad away from the gap along the first direction.

[0012] Optionally, the solder paste layer further includes a third portion located above the first portion, the two ends of the third portion respectively covering the upper surface of at least a portion of the solder resist layer on the first pad and the upper surface of at least a portion of the solder resist layer on the second pad.

[0013] Optionally, the ratio of the area of ​​the projection of the third portion onto the first pad to the area of ​​the portion of the first pad not covered by the solder mask layer is 1.1-1.2.

[0014] The ratio of the area of ​​the projection of the third portion onto the second pad to the area of ​​the portion of the second pad not covered by the solder mask is 1.1-1.2.

[0015] Optionally, the thickness of the solder resist layer is 0.01 mm to 0.04 mm.

[0016] Optionally, the portion of the first part covering the first pad has a dimension in the second direction equal to or greater than 0.6 mm;

[0017] The portion of the first part covering the second pad has a dimension in the second direction equal to or greater than 0.6 mm.

[0018] Optionally, the area of ​​the first pad is equal to or greater than 0.6 mm². 2 The area of ​​the second pad is equal to or greater than 0.6 mm². 2 .

[0019] Optionally, the thickness of the first portion is equal to or greater than 0.1 mm.

[0020] Optionally, the gap in the first direction is 0.1 mm to 0.2 mm.

[0021] With the above technical solution, when it is necessary to short-circuit the first network and the second network, a solder paste layer can be directly applied between the first pad electrically connected to the first network and the second pad electrically connected to the second network. The two ends of the first part of the solder paste layer cover at least part of the upper surface of the first pad and at least part of the upper surface of the second pad, respectively. In this way, it is not necessary to select components with corresponding impedances to quickly achieve short-circuiting of the first network and the second network.

[0022] Furthermore, to ensure that the current-carrying capacity of the solder paste layer meets the short-circuiting requirements between the first and second networks, the ratios between the size of the portion of the first part covering the first pad in the second direction and the maximum current that the solder paste layer can carry, as well as the ratios between the size of the portion of the first part covering the second pad in the second direction and the maximum current that the solder paste layer can carry, are positively correlated. In other words, the operator can calculate the size of the solder paste layer in the second direction based on the pre-calculated current after the network short-circuit. Thus, during the process of applying the solder paste layer, the operator only needs to control the size of the solder paste layer in the second direction to be equal to or greater than the calculated size. During the entire short-circuiting process, there is no need to select components with conduction impedances corresponding to the conduction currents of the first and second networks, nor is it necessary to perform soldering operations on both ends of the components. Therefore, it can save labor costs and shorten the soldering cycle of the connection structure of the circuit board, facilitating the rapid short-circuiting of the first and second networks.

[0023] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0024] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0025] Figure 1 This is a top view schematic diagram of a first network and a second network shorted according to an exemplary embodiment of this disclosure;

[0026] Figure 2 This is a cross-sectional schematic diagram of a circuit board body and a connection structure for the circuit board provided in an exemplary embodiment of the present disclosure, wherein the first pad and the second pad are shorted by a solder paste layer.

[0027] Figure 3 This is a cross-sectional schematic diagram of a circuit board body and a connection structure for the circuit board provided in an exemplary embodiment of the present disclosure, wherein the first pad and the second pad are not filled with solder paste layer.

[0028] Explanation of reference numerals in the attached figures

[0029] 1-Circuit board body; 2-Gap; 10-First network; 20-Second network; 30-First pad; 40-Second pad; 50-Solder paste layer; 51-First part; 52-Second part; 53-Third part; 60-Solder resist layer. Detailed Implementation

[0030] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0031] In this disclosure, unless otherwise stated, "first direction" and "second direction" are generally defined with reference to the circuit board body; see reference for details. Figure 1 As shown, "inner" and "outer" refer to the inner and outer contours of the corresponding structures, while "far" and "near" refer to the distance from the corresponding structures. The aforementioned directional terms are used merely for the convenience of describing this disclosure and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this disclosure. Furthermore, it should be noted that the terms used, such as "first" and "second," are used to distinguish one element from another and do not possess sequential or importance.

[0032] In circuit design on a circuit board (e.g., a PCB), to connect two networks, operators typically place pads on the network and select appropriate components based on the current required to short-circuit the two networks. Then, they manually solder the components with a soldering iron to short-circuit the two ends, thus achieving the short-circuit between the two networks. In this process, the selection of the current-carrying capacity of the components and the soldering operation between the components and the two networks are time-consuming and laborious, increasing the soldering cycle of the circuit board connection structure.

[0033] Based on this, refer to Figures 1 to 3As shown, this disclosure provides a connection structure for a circuit board, including a first network 10, a second network 20, a first pad 30, and a second pad 40. Both the first network 10 and the second network 20 are disposed on the circuit board body 1. The first pad 30 is disposed on and electrically connected to the first network 10, and the second pad 40 is disposed on and electrically connected to the second network 20. The first pad 30 and the second pad 40 are disposed opposite each other along a first direction, and a gap 2 exists between them. The first pad 30 and the second pad 40 are electrically connected through a solder paste layer 50. The first network 10 and the second network 20 are short-circuited. The solder paste layer 50 includes a first portion 51. The two ends of the first portion 51 cover at least a portion of the upper surface of the first pad 30 and at least a portion of the upper surface of the second pad 40, respectively. The size of the portion of the first portion 51 covering the first pad 30 in the second direction is positively correlated with the maximum current that the solder paste layer 50 can pass through, and the size of the portion of the first portion 51 covering the second pad 40 in the second direction is positively correlated with the maximum current that the solder paste layer 50 can pass through. The second direction is perpendicular to the first direction, and both the first direction and the second direction are parallel to the circuit board body 1.

[0034] With the above technical solution, when it is necessary to short-circuit the first network 10 and the second network 20, solder paste layer 50 can be directly applied between the first pad 30 electrically connected to the first network 10 and the second pad 40 electrically connected to the second network 20. The two ends of the first part 51 of the solder paste layer 50 respectively cover at least part of the upper surface of the first pad 30 and at least part of the upper surface of the second pad 40. In this way, it is not necessary to select components with corresponding impedances to quickly achieve short-circuiting of the first network 10 and the second network 20.

[0035] Furthermore, to ensure that the current-carrying capacity of the solder paste layer 50 meets the short-circuiting requirements between the first network 10 and the second network 20, the size of the portion of the first part 51 covering the first pad 30 in the second direction is positively correlated with the maximum current that the solder paste layer 50 can carry, and the size of the portion of the first part 51 covering the second pad 40 in the second direction is also positively correlated with the maximum current that the solder paste layer 50 can carry. In other words, the operator can calculate the size of the solder paste layer 50 in the second direction based on the pre-calculated current after the network short-circuit. Thus, during the process of applying the solder paste layer 50, the operator only needs to control the size of the solder paste layer 50 in the second direction to be equal to or greater than the calculated size. During the entire short-circuiting process, there is no need to select components with conduction impedance corresponding to the conduction current of the first network 10 and the second network 20, and there is no need to perform soldering operations on both ends of the components. Therefore, it can save labor costs and shorten the soldering cycle of the connection structure of the circuit board, and facilitate the rapid short-circuiting of the first network 10 and the second network 20.

[0036] For example, in one exemplary embodiment provided in this disclosure, the ratio between the size of the portion of the first part 51 covering the first pad 30 in the second direction and the maximum current that the solder paste layer 50 can pass through, and the ratio between the size of the portion of the first part 51 covering the second pad 40 in the second direction and the maximum current that the solder paste layer 50 can pass through, are both greater than or equal to 0.3. Thus, during the design of the connection structure for the circuit board, the operator can calculate the minimum size of the solder paste layer 50 in the second direction (i.e., when the ratio is 0.3) based on the above ratio relationship and the magnitude of the current after the network is shorted. In this way, when the operator applies the solder paste layer 50, the size of the solder paste layer 50 in the second direction should be at least greater than the calculated minimum size to meet the current carrying capacity requirements when the network is shorted.

[0037] It should be noted that this disclosure does not limit the types of the first network 10 and the second network 20. For example, the first network 10 mentioned above can be one of a power supply network, a power output terminal, or various signal networks. Similarly, the second network 20 can also be one of a power supply network, a power output terminal, or various signal networks.

[0038] Furthermore, this disclosure does not limit the shape of the first pad 30 and the second pad 40. The first pad 30 and the second pad 40 can be any shape that can meet the conductivity requirements, such as rectangular, circular, trapezoidal, or elliptical.

[0039] In this disclosure, the current-carrying capacity of the solder paste layer 50 is affected not only by its dimensions in the second direction but also by its thickness; that is, the maximum current that the solder paste layer 50 can carry is positively correlated with the thickness of the solder paste layer 50. Thus, the current-carrying capacity of the solder paste layer 50 can be further improved by increasing its thickness to withstand a larger short-circuit current.

[0040] In embodiments where the solder paste layer 50 includes a first portion 51, the maximum current that the first portion 51 can pass through is positively correlated with the thickness of the first portion 51 itself.

[0041] like Figure 2As shown, to improve the stability of the first portion 51 of the solder paste layer 50, the solder paste layer 50 may optionally include a second portion 52 located below the first portion 51, the second portion 52 filling the gap 2. During the application of the solder paste layer 50, the second portion 52 of the solder paste layer 50 fills the gap 2 between the first pad 30 and the second pad 40. The two ends of the first portion 51 of the solder paste layer 50 cover at least part of the upper surface of the first pad 30 and at least part of the upper surface of the second pad 40. In this way, the second portion 52 of the solder paste layer 50 filled in the gap 2 can support and strengthen the first portion 51 located above the second portion 52, thereby preventing the first portion 51 from deforming or breaking towards the inside of the gap 2 under its own weight or when squeezed by external force, thus affecting the short-circuiting effect between the first network 10 and the second network 20.

[0042] Optionally, such as Figures 1 to 3 As shown, the connection structure for the circuit board may further include a solder mask layer 60, which covers at least a portion of the upper surface of the circuit board body 1 and covers a portion of the first pad 30 and a portion of the second pad 40. On the one hand, the solder mask layer 60 can prevent conductive solder bridging between various electronic components located on the circuit board body 1, thereby preventing solder short circuits and physical breaks in the conductor circuit. On the other hand, operators can also control the area of ​​the first pad 30 and the second pad 40 in contact with the solder paste layer 50 by adjusting the solder mask layer 60.

[0043] Furthermore, in one exemplary embodiment provided in this disclosure, the solder mask layer 60 covers the portion of the first pad 30 and the second pad 40 away from the gap 2 along the first direction. Thus, the solder mask layer 60 covering the first pad 30 and the second pad 40 will not interfere with or obstruct the normal connection between the solder paste layer 50 and the first pad 30 and the second pad 40, and will not affect the current-carrying capacity of the solder paste layer 50.

[0044] In one exemplary embodiment provided in this disclosure, the solder resist layer 60 may be formed by applying green oil to the circuit board body 1.

[0045] Optionally, the area of ​​the first pad 30 covered by the solder resist layer 60 is larger than the area of ​​the first pad 30 not covered by the solder resist layer 60; similarly, the area of ​​the second pad 40 covered by the solder resist layer 60 is larger than the area of ​​the second pad 40 not covered by the solder resist layer 60. In other words, most of the area of ​​the first pad 30 and most of the area of ​​the second pad 40 are covered by the solder resist layer 60. This provides two advantages: firstly, the solder resist layer 60 has better insulation properties, preventing physical breaks in the conductor circuit and preventing short circuits caused by bridging during the soldering process; secondly, the solder resist layer 60 also reduces the area of ​​the first pad 30 and the second pad 40 exposed to air, meaning that only the portions of the first pad 30 and the second pad 40 that need to be short-circuited are exposed, thus avoiding impedance changes due to oxidation of the first pad 30 and the second pad 40 by external air.

[0046] In one exemplary embodiment provided in this disclosure, optionally, the ratio of the area of ​​the portion of the first pad 30 covered by the solder mask 60 to the area of ​​the portion of the first pad 30 not covered by the solder mask 60 is equal to or greater than 1.2; the ratio of the area of ​​the portion of the second pad 40 covered by the solder mask 60 to the area of ​​the portion of the second pad 40 not covered by the solder mask 60 is equal to or greater than 1.2. Within this range, a good impedance requirement can be achieved without excessively exposing the first pad 30 and the second pad 40 to air.

[0047] During the process of applying solder paste layer 50 to the first pad 30 and the second pad 40, if the area of ​​solder paste layer 50 is too small, it may be unable to completely cover the portion of the first pad 30 not covered by solder resist layer 60 and the portion of the second pad 40 not covered by solder resist layer 60, resulting in increased impedance of solder paste layer 50 and failure to meet the current flow requirements after shorting the first network 10 and the second network 20. If the area of ​​solder paste layer 50 is too large, it will lead to solder paste waste and conductive bridging between solder paste layer 50 and other electronic components on the circuit board 1. Based on this, in one embodiment provided in this disclosure, such as Figure 2As shown, optionally, the solder paste layer 50 may also include a third portion 53 located above the first portion 51, the two ends of the third portion 53 respectively covering at least a portion of the upper surface of the solder resist layer 60 on the first pad 30 and at least a portion of the upper surface of the solder resist layer 60 on the second pad 40. In this way, when the solder paste layer 50 is applied, the two ends of the third part 53 respectively cover at least part of the upper surface of the solder resist layer 60 on the first pad 30 and at least part of the upper surface of the solder resist layer 60 on the second pad 40. That is to say, the third part 53 of the solder paste layer 50 covers both part of the upper surface of the solder resist layer 60 and the outer surface of the first pad 30 and the second pad 40 exposed to the outside between the solder resist layers 60. This ensures that the solder paste layer 50 can completely cover the part of the first pad 30 not covered by the solder resist layer 60 and the part of the second pad 40 not covered by the solder resist layer 60. On the one hand, it can avoid the problem that the parts of the first pad 30 and the second pad 40 exposed to the air will be oxidized or conductively bridged with other electronic components on the circuit board 1 due to the solder paste layer not completely covering the upper surface of the first pad 30 and the second pad 40. On the other hand, it also avoids the problem of solder paste being wasted due to the large area of ​​solder paste layer 50.

[0048] In one embodiment provided in this disclosure, the thickness of the solder mask layer 60 may optionally be 0.01 mm to 0.04 mm. Within this thickness range, the solder mask layer 60 can have better solder mask performance, while avoiding the solder paste layer 50 being lifted up due to excessive thickness of the solder mask layer 60, which would lead to poor soldering.

[0049] Optionally, in one embodiment provided in this disclosure, the portion of the first part 51 covering the first pad 30 has a dimension in the second direction equal to or greater than 0.6 mm; the portion of the first part 51 covering the second pad 40 has a dimension in the second direction equal to or greater than 0.6 mm. That is, the dimensions of the portions of the first part 51 covering the first pad 30 and the portions of the first part 51 covering the second pad 40 in the second direction should meet the movement requirements, i.e., be greater than or equal to 0.6 mm. This allows the first part 51 to have a smaller impedance (when the thickness of the first part 51 is constant, the dimension of the first part 51 in the second direction is negatively correlated with its resistance). This impedance can satisfy the requirement that most networks are shorted to allow current to flow, thereby making it more beneficial for the shorting of the first network 10 and the second network 20.

[0050] Optionally, based on the conductivity requirements and the design of the conduction position (assuming the dimensions of the first part 51 in the second direction are fixed, the thickness of the first part 51 is negatively correlated with the resistance), in the embodiments provided in this disclosure, the thickness of the first part 51 is equal to or greater than 0.1 mm. That is, the conductivity of the first part 51 can be changed by adjusting the thickness of the first part 51. Specifically, when it is necessary to carry a large short-circuit current, the thickness of the first part 51 can be adaptively increased during the application of the solder paste layer 50.

[0051] In summary, when the first part 51 cannot carry the short-circuit current when the first network 10 and the second network 20 are short-circuited (i.e., when the impedance of the first part 51 is too large), its impedance can be reduced by increasing the size of the first part 51 in the second direction, or by increasing the thickness of the first part 51, or by simultaneously increasing both the size of the first part 51 in the second direction and the size of the first part 51 in its thickness direction. In short, any method that can satisfy the current-carrying requirements of the first network 10 and the second network 20 can be used to adaptively adjust the size of the first part 51 in the second direction and the thickness of the first part 51. This disclosure does not impose any limitations on this.

[0052] It should be noted that in the embodiment where the thickness of the first part 51 is 0.1 mm, the dimension of the portion of the first part 51 covering the first pad 30 in the second direction is 0.6 mm, and the dimension of the portion of the first part 51 covering the second pad 40 in the second direction is 0.6 mm, the current that the solder paste layer 50 can withstand can be calculated to be 2 A according to the current load capacity calculation formula. Similarly, for every 0.6 mm increase in the dimension of the portion of the first part 51 covering the first pad 30 in the second direction, the current that the solder paste layer 50 can withstand increases by 2 A. Thus, before applying the solder paste layer 50, the operator can calculate the dimension of the first part 51 of the solder paste layer 50 in the second direction based on the current flowing when the first network 10 and the second network 20 are shorted, and then calculate the dimensions of the first pad 30 and the second pad 40 in the second direction that match this dimension.

[0053] Optionally, the area of ​​the first pad 30 is equal to or greater than 0.6 mm². 2 The area of ​​the second pad 40 is equal to or greater than 0.6 mm². 2 The area of ​​both the first pad 30 and the second pad 40 is greater than or equal to 0.6 mm². 2On the one hand, it facilitates the soldering operation between the first pad 30 and the first network 10, and the soldering operation between the second pad 40 and the second network 20. On the other hand, it also facilitates a larger contact area between the solder paste layer 50 and the first pad 30 and the second pad 40 when the solder paste layer 50 is applied, thereby facilitating a larger short-circuit current to flow through the solder paste layer 50.

[0054] Optionally, the gap 2 has a dimension of 0.1mm to 0.2mm in the first direction. Setting the distance to 0.1mm to 0.2mm allows the distance between the first pad 30 and the second pad 40 to be sufficiently small. This facilitates the application of the solder paste layer 50 between the first pad 30 and the second pad 40. Furthermore, the sufficiently small distance between the first pad 30 and the second pad reduces the length of the solder paste layer 50 between the first pad 30 and the second pad 40, thereby reducing the impedance of the solder paste layer 50 when shorting the first network 10 and the second network 20, and making it easier to effectively short-circuit the first network 10 and the second network 20.

[0055] It should be noted that the above-mentioned solution provided in this disclosure can be used for both shorting between two networks and for circuit debugging of the circuit board, and this disclosure does not impose any limitations on it. In addition, when using solder paste layer 50 to short-circuit and debug between the first network 10 and the second network 20, it is also easier for operators to manually disconnect the solder paste layer 50 between the first pad 30 and the second pad 40 with a soldering iron after debugging.

[0056] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0057] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0058] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A connection structure for a circuit board, characterized in that, It includes a first network, a second network, a first pad, and a second pad. The first network and the second network are both used to be disposed on the circuit board body. The first pad is disposed on the first network and electrically connected to the first network. The second pad is disposed on the second network and electrically connected to the second network. The first pad and the second pad are disposed opposite to each other along a first direction and there is a gap between the first pad and the second pad. The first pad and the second pad are electrically connected by a layer of solder paste to short-circuit the first network and the second network. The solder paste layer includes a first portion, the two ends of which respectively cover at least a portion of the upper surface of the first pad and the upper surface of the at least a portion of the second pad. The size of the portion of the first part covering the first pad in the second direction is positively correlated with the maximum current that the solder paste layer can pass through, and the size of the portion of the first part covering the second pad in the second direction is positively correlated with the maximum current that the solder paste layer can pass through, wherein the second direction is perpendicular to the first direction, and both the first direction and the second direction are parallel to the circuit board body.

2. The connection structure for a circuit board according to claim 1, characterized in that, The maximum current that the solder paste layer can pass through is positively correlated with the thickness of the solder paste layer itself.

3. The connection structure for a circuit board according to claim 1, characterized in that, The solder paste layer also includes a second portion located below the first portion, the second portion filling the gap.

4. The connection structure for a circuit board according to claim 1, characterized in that, The connection structure for the circuit board further includes a solder resist layer that covers at least a portion of the upper surface of the circuit board body and covers a portion of the first pad and a portion of the second pad.

5. The connection structure for a circuit board according to claim 4, characterized in that, The solder mask layer covers the portion of the first pad and the second pad away from the gap along the first direction.

6. The connection structure for a circuit board according to claim 4, characterized in that, The solder paste layer also includes a third portion located above the first portion, the two ends of the third portion respectively covering the upper surface of at least a portion of the solder resist layer on the first pad and the upper surface of at least a portion of the solder resist layer on the second pad.

7. The connection structure for a circuit board according to claim 6, characterized in that, The ratio of the area of ​​the projection of the third portion onto the first pad to the area of ​​the portion of the first pad not covered by the solder mask layer is 1.1-1.

2. The ratio of the area of ​​the projection of the third portion onto the second pad to the area of ​​the portion of the second pad not covered by the solder mask is 1.1-1.

2.

8. The connection structure for a circuit board according to any one of claims 4-7, characterized in that, The thickness of the solder resist layer is 0.01 mm to 0.04 mm.

9. The connection structure for a circuit board according to any one of claims 1-7, characterized in that, The portion of the first part covering the first pad has a dimension in the second direction equal to or greater than 0.6 mm; The portion of the first part covering the second pad has a dimension in the second direction equal to or greater than 0.6 mm.

10. The connection structure for a circuit board according to any one of claims 1-7, characterized in that, The area of ​​the first pad is equal to or greater than 0.6 mm². 2 The area of ​​the second pad is equal to or greater than 0.6 mm². 2 .

11. The connection structure for a circuit board according to any one of claims 1-7, characterized in that, The thickness of the first part is equal to or greater than 0.1 mm.

12. The connection structure for a circuit board according to any one of claims 1-7, characterized in that, The gap has a size of 0.1 mm to 0.2 mm in the first direction.

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